ATE292843T1 - Fluorometrieverfahren zur spüleffizienzerhöhung und wasserrückgewinnungsprozess in der halbleiterchipsherstellung - Google Patents

Fluorometrieverfahren zur spüleffizienzerhöhung und wasserrückgewinnungsprozess in der halbleiterchipsherstellung

Info

Publication number
ATE292843T1
ATE292843T1 AT98946942T AT98946942T ATE292843T1 AT E292843 T1 ATE292843 T1 AT E292843T1 AT 98946942 T AT98946942 T AT 98946942T AT 98946942 T AT98946942 T AT 98946942T AT E292843 T1 ATE292843 T1 AT E292843T1
Authority
AT
Austria
Prior art keywords
semiconductor chip
recovery process
water recovery
chip production
flushing efficiency
Prior art date
Application number
AT98946942T
Other languages
English (en)
Inventor
Brian V Jenkins
John E Hoots
Original Assignee
Nalco Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nalco Chemical Co filed Critical Nalco Chemical Co
Application granted granted Critical
Publication of ATE292843T1 publication Critical patent/ATE292843T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/906—Cleaning of wafer as interim step
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T436/00—Chemistry: analytical and immunological testing
    • Y10T436/12—Condition responsive control
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T436/00—Chemistry: analytical and immunological testing
    • Y10T436/13—Tracers or tags

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
AT98946942T 1997-09-16 1998-09-10 Fluorometrieverfahren zur spüleffizienzerhöhung und wasserrückgewinnungsprozess in der halbleiterchipsherstellung ATE292843T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/931,556 US5922606A (en) 1997-09-16 1997-09-16 Fluorometric method for increasing the efficiency of the rinsing and water recovery process in the manufacture of semiconductor chips
PCT/US1998/018925 WO1999014798A1 (en) 1997-09-16 1998-09-10 A fluorometric method for increasing the efficiency of the rinsing and water recovery process in the manufacture of semiconductor chips

Publications (1)

Publication Number Publication Date
ATE292843T1 true ATE292843T1 (de) 2005-04-15

Family

ID=25460968

Family Applications (1)

Application Number Title Priority Date Filing Date
AT98946942T ATE292843T1 (de) 1997-09-16 1998-09-10 Fluorometrieverfahren zur spüleffizienzerhöhung und wasserrückgewinnungsprozess in der halbleiterchipsherstellung

Country Status (15)

Country Link
US (2) US5922606A (de)
EP (1) EP1016127B1 (de)
JP (1) JP4160254B2 (de)
KR (1) KR100644257B1 (de)
CN (1) CN1270701A (de)
AT (1) ATE292843T1 (de)
AU (1) AU736380B2 (de)
DE (1) DE69829675T8 (de)
ES (1) ES2238769T3 (de)
ID (1) ID24157A (de)
MY (1) MY121693A (de)
PT (1) PT1016127E (de)
TW (1) TW386912B (de)
WO (1) WO1999014798A1 (de)
ZA (1) ZA988342B (de)

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US6177279B1 (en) * 1998-11-12 2001-01-23 Memc Electronic Materials, Inc. Ion extraction process for single side wafers
US6255123B1 (en) * 1998-11-17 2001-07-03 Kenneth P. Reis Methods of monitoring and maintaining concentrations of selected species in solutions during semiconductor processing
JP3434750B2 (ja) * 1999-09-30 2003-08-11 Ｎｅｃエレクトロニクス株式会社 洗浄装置のライン構成及びその設計方法
US6267641B1 (en) 2000-05-19 2001-07-31 Motorola, Inc. Method of manufacturing a semiconductor component and chemical-mechanical polishing system therefor
US6367679B1 (en) 2000-06-28 2002-04-09 Advanced Micro Devices, Inc. Detection of flux residue
US6409070B1 (en) * 2000-06-28 2002-06-25 Advanced Micro Devices, Inc. Minimizing flux residue by controlling amount of moisture during reflow
US6597444B1 (en) 2000-06-28 2003-07-22 Advanced Micro Devices, Inc. Determination of flux coverage
US6258612B1 (en) 2000-06-28 2001-07-10 Advanced Micro Devices, Inc. Determination of flux prior to package assembly
US6448097B1 (en) 2001-07-23 2002-09-10 Advanced Micro Devices Inc. Measure fluorescence from chemical released during trim etch
EP1283546A1 (de) * 2001-08-08 2003-02-12 Infineon Technologies AG Verfahren zur Feststellung der Entfernung von organischem Material von einer Halbleitervorrichtung während des Herstellungsverfahrens
US6857434B2 (en) * 2002-01-24 2005-02-22 International Business Machines Corporation CMP slurry additive for foreign matter detection
US7464134B2 (en) * 2002-01-24 2008-12-09 Hewlett-Packard Development Company, L.P. Mechanism and method for sharing imaging information from an enterprise resource planning computing environment
GB0216620D0 (en) * 2002-07-17 2002-08-28 Aoti Operating Co Inc Detection method and apparatus
US20050008532A1 (en) * 2003-07-11 2005-01-13 Jenkins Brian V. Method of inhibiting corrosion of copper plated or metallized surfaces and circuitry during semiconductor manufacturing processes
KR100585139B1 (ko) * 2004-04-12 2006-05-30 삼성전자주식회사 웨이퍼 세정액의 금속 측정 시약과 웨이퍼 세정액의 금속오염 모니터링 장치 및 방법
US20060286676A1 (en) * 2005-06-17 2006-12-21 Van Camp James R Fluorometric method for monitoring a clean-in-place system
KR100700280B1 (ko) * 2005-11-17 2007-03-26 동부일렉트로닉스 주식회사 반도체 박막의 성분 농도 측정 방법
US8753896B2 (en) * 2007-04-05 2014-06-17 Nalco Company Method of monitoring a surfactant in a microelectronic process by fluorescence
WO2009126147A1 (en) * 2008-04-08 2009-10-15 Nalco Company A method of monitoring a surfactant in a microelectronic process by fluorescence
US8716028B2 (en) * 2007-04-05 2014-05-06 Nalco Company Control over hydrogen fluoride levels in oxide etchant
US8372651B2 (en) * 2007-04-05 2013-02-12 Nalco Company Method of monitoring a surfactant in a microelectronic process by absorbance
KR100860269B1 (ko) 2008-02-29 2008-09-25 주식회사 위드텍 단일 웨이퍼 공정에서의 웨이퍼 세정액 온라인 모니터링방법, 웨이퍼 세정액 온라인 모니터링 장치 및 상기 장치에사용되는 시약 용기
EP2939263B1 (de) * 2012-12-31 2022-06-01 Nalco Company Bestimmung des gehalts an freiem fluorwasserstoff in einem gepufferten oxidätzmittel
US9937535B2 (en) * 2013-03-14 2018-04-10 Ecolab Usa Inc. Method and system for operating a CIP pre-flush step using fluorometric measurements of soil content
US10157801B2 (en) * 2016-01-04 2018-12-18 Taiwan Semiconductor Manufacturing Company, Ltd. Detecting the cleanness of wafer after post-CMP cleaning
US10875059B2 (en) 2017-11-21 2020-12-29 Automatic Spring Products Corp. Method and apparatus for automated particulate extraction from solid parts
CN112368078B (zh) * 2018-04-26 2023-07-14 迪瓦西公司 智能容器系统
US20220252548A1 (en) * 2019-05-23 2022-08-11 Lam Research Corporation Chamber component cleanliness measurement system
US11712778B2 (en) 2019-08-23 2023-08-01 Taiwan Semiconductor Manufacturing Company, Ltd. Chemical mechanical planarization tool
TWI707144B (zh) * 2019-12-13 2020-10-11 新唐科技股份有限公司 積體電路測試裝置的清潔方法

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US5820697A (en) * 1997-04-18 1998-10-13 International Business Machines Corporation Fluorescent water soluble solder flux
US5922606A (en) * 1997-09-16 1999-07-13 Nalco Chemical Company Fluorometric method for increasing the efficiency of the rinsing and water recovery process in the manufacture of semiconductor chips

Also Published As

Publication number Publication date
TW386912B (en) 2000-04-11
WO1999014798A1 (en) 1999-03-25
US5922606A (en) 1999-07-13
PT1016127E (pt) 2005-07-29
DE69829675D1 (de) 2005-05-12
US6238487B1 (en) 2001-05-29
KR100644257B1 (ko) 2006-11-10
CN1270701A (zh) 2000-10-18
EP1016127B1 (de) 2005-04-06
ID24157A (id) 2000-07-13
DE69829675T2 (de) 2006-03-30
ES2238769T3 (es) 2005-09-01
KR20010023959A (ko) 2001-03-26
JP4160254B2 (ja) 2008-10-01
DE69829675T8 (de) 2006-06-08
EP1016127A1 (de) 2000-07-05
AU736380B2 (en) 2001-07-26
MY121693A (en) 2006-02-28
JP2001516968A (ja) 2001-10-02
ZA988342B (en) 1999-03-23
AU9384898A (en) 1999-04-05

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