DE69829675D1 - Fluorometrieverfahren zur spüleffizienzerhöhung und wasserrückgewinnungsprozess in der halbleiterchipsherstellung - Google Patents

Fluorometrieverfahren zur spüleffizienzerhöhung und wasserrückgewinnungsprozess in der halbleiterchipsherstellung

Info

Publication number
DE69829675D1
DE69829675D1 DE69829675T DE69829675T DE69829675D1 DE 69829675 D1 DE69829675 D1 DE 69829675D1 DE 69829675 T DE69829675 T DE 69829675T DE 69829675 T DE69829675 T DE 69829675T DE 69829675 D1 DE69829675 D1 DE 69829675D1
Authority
DE
Germany
Prior art keywords
semiconductor chip
fluorometry
water recovery
chip production
efficiency increase
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69829675T
Other languages
English (en)
Other versions
DE69829675T8 (de
DE69829675T2 (de
Inventor
V Jenkins
E Hoots
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ChampionX LLC
Original Assignee
Nalco Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nalco Chemical Co filed Critical Nalco Chemical Co
Publication of DE69829675D1 publication Critical patent/DE69829675D1/de
Application granted granted Critical
Publication of DE69829675T2 publication Critical patent/DE69829675T2/de
Publication of DE69829675T8 publication Critical patent/DE69829675T8/de
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/906—Cleaning of wafer as interim step
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T436/00—Chemistry: analytical and immunological testing
    • Y10T436/12—Condition responsive control
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T436/00—Chemistry: analytical and immunological testing
    • Y10T436/13—Tracers or tags
DE69829675T 1997-09-16 1998-09-10 Fluorometrieverfahren zur spüleffizienzerhöhung und wasserrückgewinnungsprozess in der halbleiterchipsherstellung Expired - Fee Related DE69829675T8 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US931556 1997-09-16
US08/931,556 US5922606A (en) 1997-09-16 1997-09-16 Fluorometric method for increasing the efficiency of the rinsing and water recovery process in the manufacture of semiconductor chips
PCT/US1998/018925 WO1999014798A1 (en) 1997-09-16 1998-09-10 A fluorometric method for increasing the efficiency of the rinsing and water recovery process in the manufacture of semiconductor chips

Publications (3)

Publication Number Publication Date
DE69829675D1 true DE69829675D1 (de) 2005-05-12
DE69829675T2 DE69829675T2 (de) 2006-03-30
DE69829675T8 DE69829675T8 (de) 2006-06-08

Family

ID=25460968

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69829675T Expired - Fee Related DE69829675T8 (de) 1997-09-16 1998-09-10 Fluorometrieverfahren zur spüleffizienzerhöhung und wasserrückgewinnungsprozess in der halbleiterchipsherstellung

Country Status (15)

Country Link
US (2) US5922606A (de)
EP (1) EP1016127B1 (de)
JP (1) JP4160254B2 (de)
KR (1) KR100644257B1 (de)
CN (1) CN1270701A (de)
AT (1) ATE292843T1 (de)
AU (1) AU736380B2 (de)
DE (1) DE69829675T8 (de)
ES (1) ES2238769T3 (de)
ID (1) ID24157A (de)
MY (1) MY121693A (de)
PT (1) PT1016127E (de)
TW (1) TW386912B (de)
WO (1) WO1999014798A1 (de)
ZA (1) ZA988342B (de)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6179486B1 (en) 1997-05-13 2001-01-30 Micron Electronics, Inc. Method for hot add of a mass storage adapter on a system including a dynamically loaded adapter driver
US5922606A (en) * 1997-09-16 1999-07-13 Nalco Chemical Company Fluorometric method for increasing the efficiency of the rinsing and water recovery process in the manufacture of semiconductor chips
US6177279B1 (en) * 1998-11-12 2001-01-23 Memc Electronic Materials, Inc. Ion extraction process for single side wafers
US6255123B1 (en) * 1998-11-17 2001-07-03 Kenneth P. Reis Methods of monitoring and maintaining concentrations of selected species in solutions during semiconductor processing
JP3434750B2 (ja) * 1999-09-30 2003-08-11 Ｎｅｃエレクトロニクス株式会社 洗浄装置のライン構成及びその設計方法
US6267641B1 (en) 2000-05-19 2001-07-31 Motorola, Inc. Method of manufacturing a semiconductor component and chemical-mechanical polishing system therefor
US6367679B1 (en) 2000-06-28 2002-04-09 Advanced Micro Devices, Inc. Detection of flux residue
US6409070B1 (en) * 2000-06-28 2002-06-25 Advanced Micro Devices, Inc. Minimizing flux residue by controlling amount of moisture during reflow
US6258612B1 (en) 2000-06-28 2001-07-10 Advanced Micro Devices, Inc. Determination of flux prior to package assembly
US6597444B1 (en) 2000-06-28 2003-07-22 Advanced Micro Devices, Inc. Determination of flux coverage
US6448097B1 (en) 2001-07-23 2002-09-10 Advanced Micro Devices Inc. Measure fluorescence from chemical released during trim etch
EP1283546A1 (de) * 2001-08-08 2003-02-12 Infineon Technologies AG Verfahren zur Feststellung der Entfernung von organischem Material von einer Halbleitervorrichtung während des Herstellungsverfahrens
US7464134B2 (en) * 2002-01-24 2008-12-09 Hewlett-Packard Development Company, L.P. Mechanism and method for sharing imaging information from an enterprise resource planning computing environment
US6857434B2 (en) * 2002-01-24 2005-02-22 International Business Machines Corporation CMP slurry additive for foreign matter detection
GB0216620D0 (en) * 2002-07-17 2002-08-28 Aoti Operating Co Inc Detection method and apparatus
US20050008532A1 (en) * 2003-07-11 2005-01-13 Jenkins Brian V. Method of inhibiting corrosion of copper plated or metallized surfaces and circuitry during semiconductor manufacturing processes
KR100585139B1 (ko) * 2004-04-12 2006-05-30 삼성전자주식회사 웨이퍼 세정액의 금속 측정 시약과 웨이퍼 세정액의 금속오염 모니터링 장치 및 방법
US20060286676A1 (en) * 2005-06-17 2006-12-21 Van Camp James R Fluorometric method for monitoring a clean-in-place system
KR100700280B1 (ko) * 2005-11-17 2007-03-26 동부일렉트로닉스 주식회사 반도체 박막의 성분 농도 측정 방법
US8372651B2 (en) * 2007-04-05 2013-02-12 Nalco Company Method of monitoring a surfactant in a microelectronic process by absorbance
US8716028B2 (en) * 2007-04-05 2014-05-06 Nalco Company Control over hydrogen fluoride levels in oxide etchant
WO2009126147A1 (en) * 2008-04-08 2009-10-15 Nalco Company A method of monitoring a surfactant in a microelectronic process by fluorescence
US8753896B2 (en) * 2007-04-05 2014-06-17 Nalco Company Method of monitoring a surfactant in a microelectronic process by fluorescence
KR100860269B1 (ko) 2008-02-29 2008-09-25 주식회사 위드텍 단일 웨이퍼 공정에서의 웨이퍼 세정액 온라인 모니터링방법, 웨이퍼 세정액 온라인 모니터링 장치 및 상기 장치에사용되는 시약 용기
WO2014105765A1 (en) * 2012-12-31 2014-07-03 Nalco Company Improved control over hydrogen fluoride levels in oxide etchant
US9937535B2 (en) * 2013-03-14 2018-04-10 Ecolab Usa Inc. Method and system for operating a CIP pre-flush step using fluorometric measurements of soil content
US10157801B2 (en) 2016-01-04 2018-12-18 Taiwan Semiconductor Manufacturing Company, Ltd. Detecting the cleanness of wafer after post-CMP cleaning
US10875059B2 (en) 2017-11-21 2020-12-29 Automatic Spring Products Corp. Method and apparatus for automated particulate extraction from solid parts
EP3784396A4 (de) * 2018-04-26 2021-06-23 Diversey, Inc. Intelligentes behältersystem
KR20220000409A (ko) * 2019-05-23 2022-01-03 램 리써치 코포레이션 챔버 컴포넌트 청정도 측정 시스템
US11712778B2 (en) 2019-08-23 2023-08-01 Taiwan Semiconductor Manufacturing Company, Ltd. Chemical mechanical planarization tool
TWI707144B (zh) * 2019-12-13 2020-10-11 新唐科技股份有限公司 積體電路測試裝置的清潔方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4156619A (en) * 1975-06-11 1979-05-29 Wacker-Chemitronic Gesellschaft Fur Elektronik-Grundstoffe Mbh Process for cleaning semi-conductor discs
US4276186A (en) * 1979-06-26 1981-06-30 International Business Machines Corporation Cleaning composition and use thereof
US4637938A (en) * 1983-08-19 1987-01-20 Energy Conversion Devices, Inc. Methods of using selective optical excitation in deposition processes and the detection of new compositions
US4536322A (en) * 1983-10-28 1985-08-20 Union Carbide Corporation Fluorescent corrosive fluoride solution
JPS61186854A (ja) * 1985-02-14 1986-08-20 Fuji Photo Film Co Ltd 超純水中のバクテリア数測定装置
US4783314A (en) * 1987-02-26 1988-11-08 Nalco Chemical Company Fluorescent tracers - chemical treatment monitors
US4992380A (en) * 1988-10-14 1991-02-12 Nalco Chemical Company Continuous on-stream monitoring of cooling tower water
DE9012816U1 (de) * 1990-09-07 1990-11-08 Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung Ev, 8000 Muenchen, De
DE4204806A1 (de) * 1992-02-18 1993-08-19 Henkel Kgaa Waschverfahren fuer gewerbliche waeschereien
DE4234466A1 (de) * 1992-10-13 1994-04-14 Henkel Kgaa Verfahren zum Bestimmen der Konzentration eines einen Tracer enthaltenden Wirkstoffes in Wirkstofflösungen
US5328556A (en) * 1992-12-31 1994-07-12 Nace Technology, Inc. Wafer fabrication
JP3278513B2 (ja) * 1993-12-09 2002-04-30 株式会社東芝 半導体基板の不純物分析方法
JP3249316B2 (ja) * 1993-12-20 2002-01-21 株式会社東芝 全反射蛍光ｘ線分析が行われる被測定体の表面処理方法
US5411889A (en) * 1994-02-14 1995-05-02 Nalco Chemical Company Regulating water treatment agent dosage based on operational system stresses
US5435969A (en) * 1994-03-29 1995-07-25 Nalco Chemical Company Monitoring water treatment agent in-system concentration and regulating dosage
JPH07326599A (ja) * 1994-05-30 1995-12-12 Mitsubishi Electric Corp 半導体基板の洗浄方法および洗浄装置
US5614032A (en) * 1994-08-04 1997-03-25 At&T Corp. Terpene-based method for removing flux residues from electronic devices
US5665609A (en) * 1995-04-21 1997-09-09 Sony Corporation Prioritizing efforts to improve semiconductor production yield
US5820697A (en) * 1997-04-18 1998-10-13 International Business Machines Corporation Fluorescent water soluble solder flux
US5922606A (en) * 1997-09-16 1999-07-13 Nalco Chemical Company Fluorometric method for increasing the efficiency of the rinsing and water recovery process in the manufacture of semiconductor chips

Also Published As

Publication number Publication date
ID24157A (id) 2000-07-13
US6238487B1 (en) 2001-05-29
DE69829675T8 (de) 2006-06-08
ATE292843T1 (de) 2005-04-15
KR20010023959A (ko) 2001-03-26
MY121693A (en) 2006-02-28
ZA988342B (en) 1999-03-23
ES2238769T3 (es) 2005-09-01
EP1016127B1 (de) 2005-04-06
AU9384898A (en) 1999-04-05
PT1016127E (pt) 2005-07-29
KR100644257B1 (ko) 2006-11-10
WO1999014798A1 (en) 1999-03-25
AU736380B2 (en) 2001-07-26
EP1016127A1 (de) 2000-07-05
JP2001516968A (ja) 2001-10-02
TW386912B (en) 2000-04-11
JP4160254B2 (ja) 2008-10-01
CN1270701A (zh) 2000-10-18
DE69829675T2 (de) 2006-03-30
US5922606A (en) 1999-07-13

Similar Documents

Publication Publication Date Title
DE69829675T8 (de) Fluorometrieverfahren zur spüleffizienzerhöhung und wasserrückgewinnungsprozess in der halbleiterchipsherstellung
DE10196254T1 (de) Verfahren zum Polieren von Halbleiterwafern unter Verwendung eines beidseitigen Polierers
DE69906155D1 (de) Bearbeitungsflüssigkeit und verfahren zur modifikation von struturierten halbleiterscheiben zur herstellung von halbleitern
DE60332313D1 (de) Polierstück für ein verfahren zur bearbeitung von halbleiterwafern und polierstück für halbleiterwafer
FI94619B (fi) Menetelmä kattilakiven poistamiseksi jätelietteen käsittelyssä käytettävän putkireaktorin pinnoilta
EP1065708A3 (de) Verfahren zur Reinigung eines Silizium-Substrates durch Eintäuschen nach einem chemischen-mechanischen Polierverfahren
ATE464978T1 (de) Verfahren zur reinigung von ätzkammern mit schleif-suspension
DE59506147D1 (de) Verfahren zum Reinigen von Halbleiterscheiben
DE50213785D1 (de) Vorrichtung und verfahren zum spülen von spülgut in einer geschirrspülmaschine
DE69900914T2 (de) Verfahren zur überwachung der konzentration von metallischen verunreinigungen in einer reinigungslösung für wafer
ATE206752T1 (de) Verfahren und kit zum reinigen von geschirr
DE59805067D1 (de) Verfahren zum Ätzen von Halbleiterscheiben
KR20070086259A (ko) 여과막 세정 방법
CA2372289A1 (en) Fabric care treatment composition and a method of treating fabric
CN114242630A (zh) 一种用于硅片清洗的承载装置、设备及硅片
TW200735204A (en) Method for polishing semiconductor wafer
DE60305856D1 (de) Verfahren zum Schneiden von Halbleiterwafern
TW201825650A (zh) 透過處理溶液處理物體表面的方法及裝置
TH27698B (th) วิธีการทางฟลูออโรเมตริกสำหรับเพิ่มประสิทธิภาพของกระบวนการล้างและนำน้ำกลับคืนในการผลิตชิปกึ่งตัวนำ
ATE146662T1 (de) Verfahren zum reinigen von geschirr in mehrstufigen spülmaschinen
TH42042A (th) วิธีการทางฟลูออโรเมตริกสำหรับเพิ่มประสิทธิภาพของกระบวนการล้างและนำน้ำกลับคืนในการผลิตชิปกึ่งตัวนำ
KR200365733Y1 (ko) 초음파 불산 세정 장치
JPH0714643U (ja) シリコンウエハー洗浄装置
CN205528128U (zh) 移动式集装箱水处理系统
CN100355942C (zh) 用于洗衣机带隔膜式电解槽逆向电解的控制方法

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee