ATE290578T1 - Wärmeabziehbare druckempfindliche klebefolie - Google Patents

Wärmeabziehbare druckempfindliche klebefolie

Info

Publication number
ATE290578T1
ATE290578T1 AT00124168T AT00124168T ATE290578T1 AT E290578 T1 ATE290578 T1 AT E290578T1 AT 00124168 T AT00124168 T AT 00124168T AT 00124168 T AT00124168 T AT 00124168T AT E290578 T1 ATE290578 T1 AT E290578T1
Authority
AT
Austria
Prior art keywords
sensitive adhesive
heat
pressure sensitive
adhesive film
heat release
Prior art date
Application number
AT00124168T
Other languages
English (en)
Inventor
Akihisa Murata
Toshiyuki Oshima
Yuko Arimitsu
Kazuyuki Kiuchi
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Application granted granted Critical
Publication of ATE290578T1 publication Critical patent/ATE290578T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/412—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of microspheres
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1082—Partial cutting bonded sandwich [e.g., grooving or incising]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1142—Changing dimension during delaminating [e.g., crushing, expanding, warping, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2839—Web or sheet containing structurally defined element or component and having an adhesive outermost layer with release or antistick coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2848—Three or more layers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
AT00124168T 1999-11-08 2000-11-07 Wärmeabziehbare druckempfindliche klebefolie ATE290578T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31682099A JP3594853B2 (ja) 1999-11-08 1999-11-08 加熱剥離型粘着シート

Publications (1)

Publication Number Publication Date
ATE290578T1 true ATE290578T1 (de) 2005-03-15

Family

ID=18081289

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00124168T ATE290578T1 (de) 1999-11-08 2000-11-07 Wärmeabziehbare druckempfindliche klebefolie

Country Status (10)

Country Link
US (1) US7163597B2 (de)
EP (1) EP1097977B1 (de)
JP (1) JP3594853B2 (de)
KR (2) KR100537255B1 (de)
CN (1) CN1227313C (de)
AT (1) ATE290578T1 (de)
DE (1) DE60018525T2 (de)
MY (1) MY123708A (de)
SG (1) SG93903A1 (de)
TW (1) TWI222991B (de)

Families Citing this family (67)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9912694D0 (en) * 1999-06-02 1999-08-04 Bain Peter S Adhesive
JP3641217B2 (ja) * 2000-03-31 2005-04-20 Ｔｄｋ株式会社 チップ状電子部品における端部電極形成方法及び装置
JP4651805B2 (ja) * 2000-11-08 2011-03-16 日東電工株式会社 加熱剥離型粘着シート
JP3668439B2 (ja) * 2001-06-14 2005-07-06 ソニーケミカル株式会社 接着フィルム
JP4005001B2 (ja) * 2002-07-24 2007-11-07 Ｔｄｋ株式会社 機能性層を有する転写用機能性フィルム、その機能性層が付与された物体及びその製造方法
EP1535731A4 (de) 2002-07-24 2005-11-02 Tdk Corp Funktioneller film für transfer mit funktioneller schicht, mit einer funktionellen schicht versehenes objekt und verfahren zur herstellung desselben
JP2004083633A (ja) * 2002-08-23 2004-03-18 Nihon Micro Coating Co Ltd 研磨パッド及び研磨テープ用接着テープ
EP2267218B1 (de) * 2002-12-02 2016-08-24 Avery Dennison Corporation Thermotransferetikett
DE602004026564D1 (de) † 2003-04-01 2010-05-27 Bonding Ltd De Verfahren und vorrichtung zum verbinden und trennen von verklebungen
US8088480B2 (en) 2003-09-29 2012-01-03 Shieldmark, Inc. Adhesive tape
JP2005194371A (ja) * 2004-01-07 2005-07-21 Denki Kagaku Kogyo Kk 自己粘着性シート
CN101451053A (zh) * 2004-05-18 2009-06-10 日立化成工业株式会社 粘接接合片与使用该粘接接合片的半导体装置以及其制造方法
JP2006030294A (ja) * 2004-07-12 2006-02-02 Nitto Denko Corp フレキシブル光導波路の製法
JP2006160954A (ja) * 2004-12-09 2006-06-22 Sekisui Chem Co Ltd 粘着シート
JP4671815B2 (ja) * 2005-09-05 2011-04-20 日東電工株式会社 加熱剥離型粘着シート用セパレータ及びセパレータ付き加熱剥離型粘着シート
JP4711783B2 (ja) * 2005-09-08 2011-06-29 日東電工株式会社 紫外線硬化型加熱剥離性粘着シート及び切断片の分別回収方法
JP5020496B2 (ja) * 2005-10-28 2012-09-05 東京応化工業株式会社 接着剤組成物および接着フィルム
JP5036270B2 (ja) * 2005-12-02 2012-09-26 日東電工株式会社 加熱剥離型粘着シートおよびこの加熱剥離型粘着シートを用いた半導体チップの製造方法
JP5063016B2 (ja) * 2006-03-23 2012-10-31 リンテック株式会社 粘着シート及び剥離シート
JP4891659B2 (ja) * 2006-06-02 2012-03-07 日東電工株式会社 ダイシング用粘着シート
JP4849993B2 (ja) * 2006-08-14 2012-01-11 日東電工株式会社 粘着シート、その製造方法および積層セラミックシートの切断方法
JP5283838B2 (ja) * 2006-11-04 2013-09-04 日東電工株式会社 熱剥離性粘着シート及び被着体回収方法
JP2008144116A (ja) * 2006-12-13 2008-06-26 Nitto Denko Corp 両面粘着シートおよび液晶表示装置
JP5068578B2 (ja) * 2007-05-02 2012-11-07 日東電工株式会社 両面粘着シートおよび液晶表示装置
JP5190222B2 (ja) * 2007-06-01 2013-04-24 日東電工株式会社 両面発泡粘着シートおよび液晶表示装置
JP5047724B2 (ja) * 2007-07-31 2012-10-10 日東電工株式会社 熱剥離型粘着シートを使用する被着体の加工方法。
DE102008004388A1 (de) * 2008-01-14 2009-07-16 Tesa Ag Geschäumte, insbesondere druckempfindliche Klebemasse, Verfahren zur Herstellung sowie die Verwendung derselben
ATE518927T1 (de) * 2008-01-28 2011-08-15 Upm Raflatac Oy Etikett und verfahren zur anbringung dieses etiketts an einem element
JP5351432B2 (ja) * 2008-04-10 2013-11-27 リンテック株式会社 両面粘着シートおよびその製造方法
JP5744434B2 (ja) 2010-07-29 2015-07-08 日東電工株式会社 加熱剥離シート一体型半導体裏面用フィルム、半導体素子の回収方法、及び半導体装置の製造方法
CN102676074A (zh) * 2012-01-08 2012-09-19 荆门市维益电子包装材料有限公司 感温剥离膜片生产工艺
JP2013147541A (ja) * 2012-01-17 2013-08-01 Nitto Denko Corp 粘着剤用ポリマー、粘着剤組成物及び熱剥離性粘着シート
WO2013114956A1 (ja) * 2012-01-30 2013-08-08 日東電工株式会社 伸長性加熱剥離型粘着シート
JP2013177549A (ja) * 2012-01-30 2013-09-09 Nitto Denko Corp 加熱剥離型摺動用保護テープ
JP6000595B2 (ja) * 2012-03-27 2016-09-28 日東電工株式会社 電子部品切断用加熱剥離型粘着シート及び電子部品加工方法
JP5921927B2 (ja) * 2012-03-27 2016-05-24 日東電工株式会社 加熱剥離型粘着シート
CN102703018B (zh) * 2012-05-30 2014-06-25 朱立超 一种粘合剂及其制备方法
JP2014040595A (ja) * 2013-09-26 2014-03-06 Nitto Denko Corp 熱剥離性感圧接着テープ又はシート
JP6407536B2 (ja) * 2014-02-28 2018-10-17 ソマール株式会社 粘着シート及び被着体積層物の製造方法
JP6407535B2 (ja) * 2014-02-28 2018-10-17 ソマール株式会社 粘着シート及び被着体積層物の製造方法
US9722134B1 (en) 2016-08-16 2017-08-01 Mikro Mesa Technology Co., Ltd. Method for transferring semiconductor structure
US9997399B2 (en) 2016-08-16 2018-06-12 Mikro Mesa Technology Co., Ltd. Method for transferring semiconductor structure
US20190300755A1 (en) * 2016-12-12 2019-10-03 3M Innovative Properties Company Thin foam tapes
JP6908395B2 (ja) 2017-02-28 2021-07-28 日東電工株式会社 粘着テープ
WO2019031533A1 (ja) * 2017-08-09 2019-02-14 リンテック株式会社 加工検査対象物の加熱剥離方法
TWI785161B (zh) * 2017-12-07 2022-12-01 日商琳得科股份有限公司 黏著性層積體、黏著性層積體之使用方法及半導體裝置之製造方法
US10236195B1 (en) 2017-12-20 2019-03-19 Mikro Mesa Technology Co., Ltd. Method for transferring device
WO2019187247A1 (ja) 2018-03-30 2019-10-03 リンテック株式会社 硬化封止体の反り防止用積層体、及び、硬化封止体の製造方法
JP7240378B2 (ja) 2018-03-30 2023-03-15 リンテック株式会社 硬化封止体の反り防止用積層体、及び、硬化封止体の製造方法
CN108900960A (zh) * 2018-06-15 2018-11-27 歌尔股份有限公司 丙烯酸类压敏胶及其制备方法、复合膜结构、振膜、及发声装置
KR20210141929A (ko) 2019-03-15 2021-11-23 린텍 가부시키가이샤 점착 시트 및 반도체 장치의 제조 방법
JPWO2020196756A1 (de) 2019-03-28 2020-10-01
JPWO2020196755A1 (de) 2019-03-28 2020-10-01
JPWO2020196757A1 (de) 2019-03-28 2020-10-01
CN110446143B (zh) * 2019-07-05 2021-03-09 歌尔股份有限公司 发声装置的振膜以及发声装置
WO2021024850A1 (ja) 2019-08-06 2021-02-11 日東電工株式会社 粘着テープ
KR20220025077A (ko) 2019-08-06 2022-03-03 닛토덴코 가부시키가이샤 점착 테이프
JPWO2021124854A1 (de) 2019-12-20 2021-06-24
JP6890216B1 (ja) 2019-12-20 2021-06-18 日東電工株式会社 粘着シート
CN114846098A (zh) 2019-12-20 2022-08-02 日东电工株式会社 粘合片
JP6873354B1 (ja) 2019-12-27 2021-05-19 日東電工株式会社 粘着シート
JPWO2021131517A1 (de) 2019-12-27 2021-07-01
KR20220131915A (ko) 2020-01-27 2022-09-29 린텍 가부시키가이샤 보호막 부착 반도체 칩의 박리 방법
CN114981928A (zh) 2020-01-27 2022-08-30 琳得科株式会社 被粘附物的剥离方法
CN111748313B (zh) * 2020-07-29 2022-04-01 上海仁速新材料有限公司 一种紫外光固化胶黏剂及其制备方法和应用
JP7155210B2 (ja) * 2020-09-18 2022-10-18 日東電工株式会社 粘着シート
JP2022155610A (ja) 2021-03-31 2022-10-14 日東電工株式会社 粘着シート

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5124534A (en) 1974-08-23 1976-02-27 Seiko Instr & Electronics Tokeiyogaisobuhinno hyomenshorihoho
JPS5661467A (en) 1979-10-23 1981-05-26 Matsumoto Yushi Seiyaku Kk Thermally expansible adhesive
JPS5661469A (en) 1979-10-23 1981-05-26 Matsumoto Yushi Seiyaku Kk Hot-bonding adhesive
JPS5661468A (en) 1979-10-23 1981-05-26 Matsumoto Yushi Seiyaku Kk Releasable adhesive
JPS60252681A (ja) 1984-05-30 1985-12-13 F S K Kk 熱剥離性粘着シ−ト
JPS6178887A (ja) * 1984-09-27 1986-04-22 Shinko Kagaku Kogyo Kk 熱剥離性を有する粘着シ−ト
JP2613389B2 (ja) 1987-04-17 1997-05-28 日東電工株式会社 発泡型粘着シート
US5114789A (en) 1987-11-03 1992-05-19 Eastman Kodak Company Protective and decorative sheet material having a transparent topcoat
JPH01299884A (ja) * 1988-05-28 1989-12-04 Tomoegawa Paper Co Ltd ダイボンディング接着テープ
JP2698881B2 (ja) 1989-05-19 1998-01-19 日東電工株式会社 膨脹型粘着部材
JP2970963B2 (ja) 1991-08-14 1999-11-02 日東電工株式会社 剥離性感圧接着剤及びその粘着部材
SG52223A1 (en) * 1992-01-08 1998-09-28 Murata Manufacturing Co Component supply method
JP3308672B2 (ja) * 1993-02-26 2002-07-29 日東電工株式会社 接着シート
JPH10168401A (ja) * 1996-12-13 1998-06-23 Nitto Denko Corp 印刷用シート
JP3810911B2 (ja) * 1997-12-01 2006-08-16 日東電工株式会社 加熱剥離型粘着シート
JP4010643B2 (ja) 1998-04-23 2007-11-21 日東電工株式会社 加熱剥離型粘着シート
US7214424B2 (en) 1999-03-01 2007-05-08 Nitto Denko Corporation Heat-peelable pressure-sensitive adhesive sheet

Also Published As

Publication number Publication date
KR20010051480A (ko) 2001-06-25
DE60018525T2 (de) 2005-07-28
KR20050097908A (ko) 2005-10-10
JP3594853B2 (ja) 2004-12-02
KR100537255B1 (ko) 2005-12-19
EP1097977A2 (de) 2001-05-09
US20030203193A1 (en) 2003-10-30
CN1227313C (zh) 2005-11-16
KR100602298B1 (ko) 2006-07-19
JP2001131507A (ja) 2001-05-15
MY123708A (en) 2006-05-31
SG93903A1 (en) 2003-01-21
DE60018525D1 (de) 2005-04-14
EP1097977B1 (de) 2005-03-09
US7163597B2 (en) 2007-01-16
EP1097977A3 (de) 2001-08-08
CN1295103A (zh) 2001-05-16
TWI222991B (en) 2004-11-01

Similar Documents

Publication Publication Date Title
ATE290578T1 (de) Wärmeabziehbare druckempfindliche klebefolie
ATE263818T1 (de) Wärmeabziehbare druckempfindliche klebefolie
ATE287936T1 (de) Durch wärme abziehbare druckempfindliche klebefolie
ATE330797T1 (de) Thermoempfindliches übertragungsverbundblatt
ATE352832T1 (de) Etikettenbogen
KR960703997A (ko) 제거 가능한 폼 접착 테이프(removable foam adhesive tape)
CA2346686A1 (en) Flexible graphite with non-carrier pressure sensitive adhesive backing and release liner
ATE406425T1 (de) Druckempfindliches klebeband
NO20005395D0 (no) Tukle-indikerende gjenstand for gjenvinnbare substrater
MY119665A (en) Pressure sensitive adhesive sheet and method of use thereof
ES2143194T3 (es) Un trapo y metodo para poner y quitar el mismo en una placa de asiento de una pulidora.
ATE397052T1 (de) Beidseitiges druckempflindliches klebeband und klebeverfahren
EP0999583A3 (de) Stabilisierung eines Substrats mittels Trägerelement
EP0887393A3 (de) Schutzfolie für Anstrichfilm
EP1323657A3 (de) Musterübertragungsgerät, Musterübertragungsband und Herstellungsverfahren dafür
KR100542426B1 (ko) 점착제층이 적층된 라미네이트 적층시트
KR970022897A (ko) 라벨 부착부 형성용 점착 시이트
EP1310538A4 (de) Druckempfindliche klebefolie mit wiederholbarem haftklebe- und abzugsverhalten
WO2001032411A3 (en) Lamination and method for forming an information displaying label
EP1505136A3 (de) Druckempfindlicher Klebefilm und Verfahren zu dessen Herstellung
EP0905564A3 (de) Aufwickelbarer Trockenresistfilm
DE60205601D1 (de) Verklebbare dekorfolien
EP1213695A3 (de) Trennfolie mit gedrückter Schicht und Verfahren zu dessen Herstellung
TH46894A (th) แผ่นยึดติดไวความดันชนิดลอกออกได้ด้วยความร้อน
CA2376862A1 (en) Device and method for coating an optically readable data carrier

Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification

Ref document number: 1097977

Country of ref document: EP

REN Ceased due to non-payment of the annual fee