JPS5661467A - Thermally expansible adhesive - Google Patents
Thermally expansible adhesiveInfo
- Publication number
- JPS5661467A JPS5661467A JP13738579A JP13738579A JPS5661467A JP S5661467 A JPS5661467 A JP S5661467A JP 13738579 A JP13738579 A JP 13738579A JP 13738579 A JP13738579 A JP 13738579A JP S5661467 A JPS5661467 A JP S5661467A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- thermally expansible
- fine granule
- thermally
- expansible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
PURPOSE: To obtain a thermally expansible adhesive which is useful as adhesive sealant, adhesive for tarpaulin paper, etc., by a specofic amount of a thermally expansible fine granule to a thermosetting adhesive, etc.
CONSTITUTION: A thermally expansible fine granule is obtained by including a microcapsulated component capable of giving out a gas when heated, e.g., propane, butane, etc., in the shell ofa thermoplastic resin, e.g., a acrylonitrile-vinylidene chloride copolymer resin, etc., and then the thermally expansible fine granule in an amount as much as approx. 5 times or less (when being expanded) the volume of an adhesive not expanded in compounded in a moisture-sensitive, pressure-sensitive, or thermosetting adhesive, etc., to obtain a themally expansible adhesive. When the thermally expansible adhesive is injected in between gaps of parts to be bonded and thermally hardened at the expanding temperature of the fine granule, the adhesive components can well penetrate into the corners of the gaps of objects to be bonded by the expansion of the fine granule, ensuring complete bonding.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13738579A JPS5661467A (en) | 1979-10-23 | 1979-10-23 | Thermally expansible adhesive |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13738579A JPS5661467A (en) | 1979-10-23 | 1979-10-23 | Thermally expansible adhesive |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5661467A true JPS5661467A (en) | 1981-05-26 |
JPS631354B2 JPS631354B2 (en) | 1988-01-12 |
Family
ID=15197444
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13738579A Granted JPS5661467A (en) | 1979-10-23 | 1979-10-23 | Thermally expansible adhesive |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5661467A (en) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58125776A (en) * | 1982-01-15 | 1983-07-26 | ミネソタ・マイニング・アンド・マユフアクチユアリング・コンパニ− | Foamable pressure sensitive adhesive product |
JPS60252681A (en) * | 1984-05-30 | 1985-12-13 | F S K Kk | Heat peelable adhesive sheet |
EP0257984A2 (en) * | 1986-08-21 | 1988-03-02 | Minnesota Mining And Manufacturing Company | Pressure-Sensitive tape construction incorporating resilient polymeric microspheres |
US4855170A (en) * | 1986-08-21 | 1989-08-08 | Minnesota Mining And Manufacturing Company | Pressure-sensitive tape construction incorporating resilient polymeric microspheres |
EP0566367A2 (en) * | 1992-04-15 | 1993-10-20 | Matsumoto Yushi-Seiyaku Co., Ltd. | Thermoexpandable microcapsules, process for production thereof, and microballoons made therefrom |
JP2003171648A (en) * | 2001-09-28 | 2003-06-20 | Kaken Tec Kk | Thermally peelable adhesive composition |
US7067030B2 (en) * | 1998-09-30 | 2006-06-27 | Nitto Denko Corporation | Heat-peelable adhesive sheet |
US7163597B2 (en) | 1999-11-08 | 2007-01-16 | Nitto Denko Corporation | Heat-peelable pressure-sensitive adhesive sheet |
US7491434B2 (en) | 2000-02-02 | 2009-02-17 | 3M Innovative Properties Company | Adhesive for bonding to low surface energy surfaces |
US7718257B2 (en) | 2000-11-08 | 2010-05-18 | Nitto Denko Corporation | Heat-peelable pressure-sensitive adhesive sheet |
US7879441B2 (en) * | 1998-07-31 | 2011-02-01 | 3M Innovative Properties Company | Articles that include a polymer foam and method for preparing same |
JP2015074764A (en) * | 2013-10-11 | 2015-04-20 | アキレス株式会社 | Thermally detachable adhesive film |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09221614A (en) * | 1995-12-12 | 1997-08-26 | Sliontec:Kk | Tacky adhesive composition, tacky adhesive tape or sheet produced by using the composition and tacky adhesive tape for binding wire harness |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5053434A (en) * | 1973-05-17 | 1975-05-12 |
-
1979
- 1979-10-23 JP JP13738579A patent/JPS5661467A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5053434A (en) * | 1973-05-17 | 1975-05-12 |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58125776A (en) * | 1982-01-15 | 1983-07-26 | ミネソタ・マイニング・アンド・マユフアクチユアリング・コンパニ− | Foamable pressure sensitive adhesive product |
JPH0340752B2 (en) * | 1982-01-15 | 1991-06-19 | ||
JPS60252681A (en) * | 1984-05-30 | 1985-12-13 | F S K Kk | Heat peelable adhesive sheet |
JPH0153989B2 (en) * | 1984-05-30 | 1989-11-16 | Fsk Kk | |
EP0257984A2 (en) * | 1986-08-21 | 1988-03-02 | Minnesota Mining And Manufacturing Company | Pressure-Sensitive tape construction incorporating resilient polymeric microspheres |
US4855170A (en) * | 1986-08-21 | 1989-08-08 | Minnesota Mining And Manufacturing Company | Pressure-sensitive tape construction incorporating resilient polymeric microspheres |
EP0566367A2 (en) * | 1992-04-15 | 1993-10-20 | Matsumoto Yushi-Seiyaku Co., Ltd. | Thermoexpandable microcapsules, process for production thereof, and microballoons made therefrom |
US5536756A (en) * | 1992-04-15 | 1996-07-16 | Matsumoto Yushi-Seiyaku Co., Ltd. | Thermoexpandable microcapsule and production |
USRE45747E1 (en) * | 1998-07-31 | 2015-10-13 | 3M Innovative Properties Company | Articles that include a polymer foam and method for preparing same |
US7879441B2 (en) * | 1998-07-31 | 2011-02-01 | 3M Innovative Properties Company | Articles that include a polymer foam and method for preparing same |
US7067030B2 (en) * | 1998-09-30 | 2006-06-27 | Nitto Denko Corporation | Heat-peelable adhesive sheet |
US7175728B2 (en) | 1998-09-30 | 2007-02-13 | Nitto Denko Corporation | Heat-peelable adhesive sheet |
US7163597B2 (en) | 1999-11-08 | 2007-01-16 | Nitto Denko Corporation | Heat-peelable pressure-sensitive adhesive sheet |
US7491434B2 (en) | 2000-02-02 | 2009-02-17 | 3M Innovative Properties Company | Adhesive for bonding to low surface energy surfaces |
US7718257B2 (en) | 2000-11-08 | 2010-05-18 | Nitto Denko Corporation | Heat-peelable pressure-sensitive adhesive sheet |
JP2003171648A (en) * | 2001-09-28 | 2003-06-20 | Kaken Tec Kk | Thermally peelable adhesive composition |
JP2015074764A (en) * | 2013-10-11 | 2015-04-20 | アキレス株式会社 | Thermally detachable adhesive film |
Also Published As
Publication number | Publication date |
---|---|
JPS631354B2 (en) | 1988-01-12 |
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