ATE280996T1 - Elektronische bauteile und verfahren zu ihrer herstellung - Google Patents
Elektronische bauteile und verfahren zu ihrer herstellungInfo
- Publication number
- ATE280996T1 ATE280996T1 AT02004036T AT02004036T ATE280996T1 AT E280996 T1 ATE280996 T1 AT E280996T1 AT 02004036 T AT02004036 T AT 02004036T AT 02004036 T AT02004036 T AT 02004036T AT E280996 T1 ATE280996 T1 AT E280996T1
- Authority
- AT
- Austria
- Prior art keywords
- resin
- core substrates
- prepregs
- forming
- compound material
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 6
- 239000011347 resin Substances 0.000 abstract 4
- 229920005989 resin Polymers 0.000 abstract 4
- 239000000758 substrate Substances 0.000 abstract 3
- 150000001875 compounds Chemical class 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 2
- 239000008204 material by function Substances 0.000 abstract 2
- 239000004020 conductor Substances 0.000 abstract 1
- 230000008020 evaporation Effects 0.000 abstract 1
- 238000001704 evaporation Methods 0.000 abstract 1
- 238000007731 hot pressing Methods 0.000 abstract 1
- 238000007733 ion plating Methods 0.000 abstract 1
- 238000010884 ion-beam technique Methods 0.000 abstract 1
- 238000000059 patterning Methods 0.000 abstract 1
- 238000004544 sputter deposition Methods 0.000 abstract 1
- 238000005019 vapor deposition process Methods 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/08—Magnetic details
- H05K2201/083—Magnetic materials
- H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
- H05K3/146—By vapour deposition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
- H05K3/16—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation by cathodic sputtering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
- Y10T428/2495—Thickness [relative or absolute]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
- Y10T428/2495—Thickness [relative or absolute]
- Y10T428/24967—Absolute thicknesses specified
- Y10T428/24975—No layer or component greater than 5 mils thick
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/256—Heavy metal or aluminum or compound thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/256—Heavy metal or aluminum or compound thereof
- Y10T428/257—Iron oxide or aluminum oxide
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/258—Alkali metal or alkaline earth metal or compound thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/259—Silicic material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
- Y10T428/31522—Next to metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31529—Next to metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31692—Next to addition polymer from unsaturated monomers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31721—Of polyimide
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31786—Of polyester [e.g., alkyd, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Coils Or Transformers For Communication (AREA)
- Inorganic Insulating Materials (AREA)
- Ceramic Capacitors (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001047376 | 2001-02-22 | ||
JP2002033075A JP2002324729A (ja) | 2001-02-22 | 2002-02-08 | 電子部品とその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE280996T1 true ATE280996T1 (de) | 2004-11-15 |
Family
ID=26609934
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT02004036T ATE280996T1 (de) | 2001-02-22 | 2002-02-22 | Elektronische bauteile und verfahren zu ihrer herstellung |
Country Status (8)
Country | Link |
---|---|
US (2) | US6749928B2 (de) |
EP (1) | EP1235235B1 (de) |
JP (1) | JP2002324729A (de) |
KR (1) | KR100631232B1 (de) |
CN (1) | CN1208792C (de) |
AT (1) | ATE280996T1 (de) |
CA (1) | CA2372757A1 (de) |
DE (1) | DE60201696T2 (de) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6908960B2 (en) * | 1999-12-28 | 2005-06-21 | Tdk Corporation | Composite dielectric material, composite dielectric substrate, prepreg, coated metal foil, molded sheet, composite magnetic substrate, substrate, double side metal foil-clad substrate, flame retardant substrate, polyvinylbenzyl ether resin composition, thermosettin |
US6900708B2 (en) | 2002-06-26 | 2005-05-31 | Georgia Tech Research Corporation | Integrated passive devices fabricated utilizing multi-layer, organic laminates |
US7260890B2 (en) * | 2002-06-26 | 2007-08-28 | Georgia Tech Research Corporation | Methods for fabricating three-dimensional all organic interconnect structures |
US6987307B2 (en) | 2002-06-26 | 2006-01-17 | Georgia Tech Research Corporation | Stand-alone organic-based passive devices |
JP3827314B2 (ja) * | 2003-03-17 | 2006-09-27 | Tdk株式会社 | インダクティブデバイスの製造方法 |
US7489914B2 (en) | 2003-03-28 | 2009-02-10 | Georgia Tech Research Corporation | Multi-band RF transceiver with passive reuse in organic substrates |
JP2007519219A (ja) * | 2003-07-03 | 2007-07-12 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | プリント回路基板製造用の軟磁性材料 |
US7012419B2 (en) * | 2004-03-26 | 2006-03-14 | Ut-Battelle, Llc | Fast Faraday cup with high bandwidth |
US8345433B2 (en) | 2004-07-08 | 2013-01-01 | Avx Corporation | Heterogeneous organic laminate stack ups for high frequency applications |
US9572258B2 (en) * | 2004-12-30 | 2017-02-14 | Intel Corporation | Method of forming a substrate core with embedded capacitor and structures formed thereby |
US7372126B2 (en) * | 2005-03-31 | 2008-05-13 | Intel Corporation | Organic substrates with embedded thin-film capacitors, methods of making same, and systems containing same |
US7288459B2 (en) * | 2005-03-31 | 2007-10-30 | Intel Corporation | Organic substrates with integral thin-film capacitors, methods of making same, and systems containing same |
US8350657B2 (en) * | 2005-06-30 | 2013-01-08 | Derochemont L Pierre | Power management module and method of manufacture |
JP4701942B2 (ja) * | 2005-09-14 | 2011-06-15 | Tdk株式会社 | 半導体ic内蔵モジュール |
JP2007123524A (ja) * | 2005-10-27 | 2007-05-17 | Shinko Electric Ind Co Ltd | 電子部品内蔵基板 |
KR100687557B1 (ko) * | 2005-12-07 | 2007-02-27 | 삼성전기주식회사 | 뒤틀림이 개선된 기판 및 기판형성방법 |
US7439840B2 (en) | 2006-06-27 | 2008-10-21 | Jacket Micro Devices, Inc. | Methods and apparatuses for high-performing multi-layer inductors |
US7808434B2 (en) | 2006-08-09 | 2010-10-05 | Avx Corporation | Systems and methods for integrated antennae structures in multilayer organic-based printed circuit devices |
US7989895B2 (en) | 2006-11-15 | 2011-08-02 | Avx Corporation | Integration using package stacking with multi-layer organic substrates |
KR100777097B1 (ko) * | 2006-12-05 | 2007-11-28 | 제일모직주식회사 | 유전체 세라믹과 폴리페닐렌설파이드 수지의 복합체 |
JP4846025B2 (ja) * | 2007-06-27 | 2011-12-28 | 新電元工業株式会社 | 磁性体の製造方法 |
CN101515500B (zh) * | 2008-02-19 | 2012-05-02 | 佳邦科技股份有限公司 | 微小型抗流线圈及其制造方法 |
GB201110233D0 (en) * | 2011-06-16 | 2011-08-03 | Williams Hybrid Power Ltd | Magnetically loaded composite rotors and tapes used in the production thereof |
CN103508731B (zh) * | 2012-06-14 | 2015-08-26 | Tdk株式会社 | 电介质陶瓷组合物以及电子部件 |
KR20150053424A (ko) * | 2013-11-08 | 2015-05-18 | 삼성전기주식회사 | 적층 세라믹 전자 부품 및 그 실장 기판 |
JP6402555B2 (ja) * | 2014-09-22 | 2018-10-10 | 株式会社豊田自動織機 | 電極の製造方法及び電極の製造装置 |
FR3064151B1 (fr) * | 2017-03-17 | 2021-10-15 | Linxens Holding | Procede de fabrication de circuits electriques, circuit electrique et composant electronique |
US11277917B2 (en) | 2019-03-12 | 2022-03-15 | Advanced Semiconductor Engineering, Inc. | Embedded component package structure, embedded type panel substrate and manufacturing method thereof |
US10950551B2 (en) | 2019-04-29 | 2021-03-16 | Advanced Semiconductor Engineering, Inc. | Embedded component package structure and manufacturing method thereof |
US11296030B2 (en) | 2019-04-29 | 2022-04-05 | Advanced Semiconductor Engineering, Inc. | Embedded component package structure and manufacturing method thereof |
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GB781470A (en) | 1954-05-28 | 1957-08-21 | Hunt Capacitors Ltd A | Improvements in or relating to dielectric materials |
JPH03147205A (ja) | 1989-10-31 | 1991-06-24 | Murata Mfg Co Ltd | 複合誘電体材料 |
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JPH0548271A (ja) | 1991-08-12 | 1993-02-26 | Murata Mfg Co Ltd | 機能性多層回路基板 |
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JP3210740B2 (ja) | 1992-08-28 | 2001-09-17 | 株式会社日立製作所 | 多層回路基板および電子モジュ−ルならびに電子装置 |
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US5652561A (en) * | 1993-06-29 | 1997-07-29 | Yokogawa Electric Corporation | Laminating type molded coil |
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JP3511110B2 (ja) | 1995-02-13 | 2004-03-29 | 日立化成工業株式会社 | 高誘電率・低誘電正接積層板 |
US6073339A (en) * | 1996-09-20 | 2000-06-13 | Tdk Corporation Of America | Method of making low profile pin-less planar magnetic devices |
JPH1167578A (ja) | 1997-08-22 | 1999-03-09 | Tdk Corp | セラミック積層電子部品の製造方法 |
JP4216917B2 (ja) | 1997-11-21 | 2009-01-28 | Tdk株式会社 | チップビーズ素子およびその製造方法 |
JP3553351B2 (ja) | 1997-12-27 | 2004-08-11 | Tdk株式会社 | プリプレグおよび基板 |
KR20010013831A (ko) * | 1998-04-16 | 2001-02-26 | 엔오에프 코퍼레이션 | 유전성 복합 재료 조성물, 및 이로부터 제조한 필름,기판, 전자 부품 및 성형 제품 |
JP2000340955A (ja) | 1999-05-26 | 2000-12-08 | Matsushita Electric Ind Co Ltd | 受動部品内蔵複合多層配線基板およびその製造方法 |
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2002
- 2002-02-08 JP JP2002033075A patent/JP2002324729A/ja active Pending
- 2002-02-22 KR KR1020020009443A patent/KR100631232B1/ko not_active IP Right Cessation
- 2002-02-22 CA CA 2372757 patent/CA2372757A1/en not_active Abandoned
- 2002-02-22 AT AT02004036T patent/ATE280996T1/de not_active IP Right Cessation
- 2002-02-22 EP EP20020004036 patent/EP1235235B1/de not_active Expired - Lifetime
- 2002-02-22 CN CNB021056293A patent/CN1208792C/zh not_active Expired - Fee Related
- 2002-02-22 DE DE2002601696 patent/DE60201696T2/de not_active Expired - Fee Related
- 2002-02-22 US US10/079,907 patent/US6749928B2/en not_active Expired - Lifetime
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US20020122934A1 (en) | 2002-09-05 |
DE60201696T2 (de) | 2005-03-10 |
EP1235235A1 (de) | 2002-08-28 |
CA2372757A1 (en) | 2002-08-22 |
KR20020069146A (ko) | 2002-08-29 |
CN1208792C (zh) | 2005-06-29 |
US6749928B2 (en) | 2004-06-15 |
DE60201696D1 (de) | 2004-12-02 |
EP1235235B1 (de) | 2004-10-27 |
KR100631232B1 (ko) | 2006-10-02 |
JP2002324729A (ja) | 2002-11-08 |
CN1375840A (zh) | 2002-10-23 |
US20040202848A1 (en) | 2004-10-14 |
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