JP4701942B2 - 半導体ic内蔵モジュール - Google Patents
半導体ic内蔵モジュール Download PDFInfo
- Publication number
- JP4701942B2 JP4701942B2 JP2005266345A JP2005266345A JP4701942B2 JP 4701942 B2 JP4701942 B2 JP 4701942B2 JP 2005266345 A JP2005266345 A JP 2005266345A JP 2005266345 A JP2005266345 A JP 2005266345A JP 4701942 B2 JP4701942 B2 JP 4701942B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- semiconductor
- bus line
- built
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5386—Geometry or layout of the interconnection structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L24/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L24/25—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of a plurality of high density interconnect connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
- H01L2224/241—Disposition
- H01L2224/24135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/24137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01012—Magnesium [Mg]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01025—Manganese [Mn]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01027—Cobalt [Co]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0103—Zinc [Zn]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30105—Capacitance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0231—Capacitors or dielectric substances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0233—Filters, inductors or a magnetic substance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/08—Magnetic details
- H05K2201/083—Magnetic materials
- H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09245—Crossing layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09618—Via fence, i.e. one-dimensional array of vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10022—Non-printed resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/1003—Non-printed inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Geometry (AREA)
- Semiconductor Integrated Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Semiconductor Memories (AREA)
- Dram (AREA)
Description
101 多層基板
101a 第1の絶縁層
101b 第2の絶縁層
101c 第3の絶縁層
102 コントローラIC
103 メモリIC
104 配線層
104a 第1の配線層
104b 第2の配線層
104X バスライン
105a グランド層
105b グランド層
106 バスラインを構成する信号ラインの一部
107 ビアホール電極
200 半導体IC内蔵モジュール
300 半導体IC内蔵モジュール
301 磁性層
302 ダンピング抵抗
303 ビーズ
400 半導体IC内蔵モジュール
401 チップ部品
401a チップ部品の電極
401b チップ部品の電極
402 ランドパターン
403 ビアホール電極
500 半導体IC内蔵モジュール
501 電源層
502 バイパスコンデンサ
503 ビアホール電極
600 半導体IC内蔵モジュール
601 アナログ回路
602 アナログ信号ライン
603 ビアホール電極
700 半導体IC内蔵モジュール
701a 第3のグランド層
701b 第4のグランド層
Claims (13)
- 複数の絶縁層が積層された多層基板と、互いに横並びに配置されるように前記多層基板内に埋め込まれた第1及び第2の半導体ICチップと、前記第1及び第2の半導体チップ間を接続するバスラインと、前記バスラインの上方及び下方を覆う第1及び第2の導電層と、前記第1および第2の導電層のいずれか一方に搭載される受動素子と、を備え、
前記一方の導電層の表面には、グランド層およびランドパターンが形成され、
前記受動素子の一端は前記グランド層、他端は前記ランドパターンに接続され、
更に、前記ランドパターンはビアホール電極を介して前記バスラインと接続されることを特徴とする半導体IC内蔵モジュール。 - 複数の絶縁層が積層された多層基板と、互いに横並びに配置されるように前記多層基板内に埋め込まれた第1及び第2の半導体ICチップと、前記第1及び第2の半導体チップ間を接続するバスラインと、前記バスラインの上方及び下方を覆う第1及び第2の導電層と、前記第1及び第2の導電層間を接続するビアホール電極と、アナログ回路と、を備え、
前記アナログ回路の信号ラインと前記バスラインは一部において並行し、その並行領域において前記信号ラインと前記バスラインの間に複数の前記ビアホール電極が配列されていることを特徴とする半導体ICモジュール。 - 前記多層基板は、第1及び第2の絶縁層と、前記第1及び第2の絶縁層間に設けられた第1の配線層とを含み、前記バスラインは前記第1の配線層に設けられている請求項1または2に記載の半導体IC内蔵モジュール。
- 前記第1及び第2の半導体ICチップはともに前記第1又は第2の絶縁層いずれか一方に埋め込まれている請求項3に記載の半導体IC内蔵モジュール。
- 前記第1の導電層は、前記第1の絶縁層の前記第2の絶縁層とは反対側の表面に設けられており、前記第2の導電層は、前記第2の絶縁層の前記第1の絶縁層とは反対側の表面に設けられている請求項3又は4に記載の半導体IC内蔵モジュール。
- 前記第1及び第2の導電層がともにグランド層を有する請求項1乃至5のいずれか1項に記載の記載の半導体IC内蔵モジュール。
- 前記第1及び第2の導電層のいずれか一方が電源層を有し、他方がグランド層を有し、前記電源層とグランド層との間にバイパスコンデンサが設けられている請求項1乃至5のいずれか1項に記載の半導体IC内蔵モジュール。
- 前記第1及び第2の半導体ICチップのいずれか一方がコントローラICであり、他方がメモリICである請求項1乃至7のいずれか1項に記載の半導体IC内蔵モジュール。
- 前記第1又は第2の絶縁層の少なくとも一方が強磁性材料を含んで構成されている請求項1乃至8のいずれか1項に記載の半導体IC内蔵モジュール。
- 前記第1及び第2の半導体ICチップと前記バスラインとが導電性突起物を介して実質的に直接接続されていることを特徴とする請求項1乃至9のいずれか1項に記載の半導体IC内蔵モジュール。
- 前記バスラインを構成するすべての信号ラインが前記第1の配線層に設けられていることを特徴とする請求項1乃至10のいずれか1項に記載の半導体IC内蔵モジュール。
- 前記バスラインを構成する信号ラインの一部であって、少なくとも他の信号ラインと交差する部分が、前記第1の配線層とは異なる第2の配線層に設けられていることを特徴とする請求項1乃至11のいずれか1項に記載の半導体IC内蔵モジュール。
- 前記多層基板内に設けられたアナログ領域と、前記第1の導電層と同一層内に設けられ、前記アナログ領域の上方を覆う第3の導電層と、前記第2の導電層と同一層内に設けられ、前記アナログ領域の下方を覆う第4の導電層とをさらに備え、前記第1及び第2の導電層と前記第3及び第4の導電層とが分離して形成されていることを特徴とする請求項1乃至12に記載の半導体IC内蔵モジュール。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005266345A JP4701942B2 (ja) | 2005-09-14 | 2005-09-14 | 半導体ic内蔵モジュール |
TW095133995A TW200746384A (en) | 2005-09-14 | 2006-09-14 | Semiconductor IC-embedded module |
CNB2006101538661A CN100561734C (zh) | 2005-09-14 | 2006-09-14 | 半导体ic内设模块 |
KR1020060089277A KR101227750B1 (ko) | 2005-09-14 | 2006-09-14 | 반도체 ic 내장 모듈 |
US11/521,156 US7812444B2 (en) | 2005-09-14 | 2006-09-14 | Semiconductor IC-embedded module with multilayer substrates with multiple chips embedded therein |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005266345A JP4701942B2 (ja) | 2005-09-14 | 2005-09-14 | 半導体ic内蔵モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007081079A JP2007081079A (ja) | 2007-03-29 |
JP4701942B2 true JP4701942B2 (ja) | 2011-06-15 |
Family
ID=37854254
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005266345A Active JP4701942B2 (ja) | 2005-09-14 | 2005-09-14 | 半導体ic内蔵モジュール |
Country Status (5)
Country | Link |
---|---|
US (1) | US7812444B2 (ja) |
JP (1) | JP4701942B2 (ja) |
KR (1) | KR101227750B1 (ja) |
CN (1) | CN100561734C (ja) |
TW (1) | TW200746384A (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012011210A1 (ja) * | 2010-07-22 | 2012-01-26 | パナソニック株式会社 | 半導体装置及びその製造方法 |
DE102011089415A1 (de) * | 2011-12-21 | 2013-06-27 | Siemens Aktiengesellschaft | Schaltungsträger mit einem Leitpfad und einer elektrischen Schirmung und Verfahren zu dessen Herstellung |
CN103327726A (zh) * | 2012-03-19 | 2013-09-25 | 鸿富锦精密工业(深圳)有限公司 | 电子装置及其印刷电路板的布局结构 |
WO2014202282A1 (de) * | 2013-06-20 | 2014-12-24 | Conti Temic Microelectronic Gmbh | Leiterplatte |
JP6665759B2 (ja) * | 2016-11-10 | 2020-03-13 | 三菱電機株式会社 | 高周波回路 |
US11277917B2 (en) | 2019-03-12 | 2022-03-15 | Advanced Semiconductor Engineering, Inc. | Embedded component package structure, embedded type panel substrate and manufacturing method thereof |
US11296030B2 (en) | 2019-04-29 | 2022-04-05 | Advanced Semiconductor Engineering, Inc. | Embedded component package structure and manufacturing method thereof |
US10950551B2 (en) | 2019-04-29 | 2021-03-16 | Advanced Semiconductor Engineering, Inc. | Embedded component package structure and manufacturing method thereof |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01175297A (ja) * | 1987-12-28 | 1989-07-11 | Toshiba Corp | 多層印刷配線板装置 |
JPH04294567A (ja) * | 1991-03-25 | 1992-10-19 | Mitsubishi Materials Corp | 混成集積回路 |
JPH07240584A (ja) * | 1994-02-25 | 1995-09-12 | Ricoh Co Ltd | 多層配線基板 |
JPH11289047A (ja) * | 1998-04-02 | 1999-10-19 | Hitachi Ltd | マルチチップモジュールおよびその製造方法 |
JP2000183536A (ja) * | 1998-12-17 | 2000-06-30 | Sony Corp | 機能モジュール及びその製造方法 |
JP2001144451A (ja) * | 1999-11-12 | 2001-05-25 | Ibi Tech Co Ltd | 積層配線板 |
JP2003198146A (ja) * | 2001-12-26 | 2003-07-11 | Kyocera Corp | 多層配線基板およびこれを用いた電子装置 |
JP2004343021A (ja) * | 2003-03-17 | 2004-12-02 | Matsushita Electric Ind Co Ltd | 部品内蔵モジュールの製造方法及び製造装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000031207A (ja) | 1998-07-10 | 2000-01-28 | Japan Radio Co Ltd | フリップチップ実装基板およびフリップチップの実装方法 |
JP2000183540A (ja) | 1998-12-17 | 2000-06-30 | Nec Corp | プリント配線基板 |
JP2001102517A (ja) | 1999-09-30 | 2001-04-13 | Sony Corp | 回路装置 |
US6653573B2 (en) * | 2000-04-04 | 2003-11-25 | Nec Tokin Corporation | Wiring board comprising granular magnetic film |
TW511405B (en) * | 2000-12-27 | 2002-11-21 | Matsushita Electric Ind Co Ltd | Device built-in module and manufacturing method thereof |
CN1284082C (zh) * | 2001-01-19 | 2006-11-08 | 株式会社日立制作所 | 电子电路装置 |
JP2002324729A (ja) * | 2001-02-22 | 2002-11-08 | Tdk Corp | 電子部品とその製造方法 |
US6937480B2 (en) * | 2001-05-14 | 2005-08-30 | Fuji Xerox Co., Ltd. | Printed wiring board |
TW550997B (en) | 2001-10-18 | 2003-09-01 | Matsushita Electric Ind Co Ltd | Module with built-in components and the manufacturing method thereof |
TWI229433B (en) * | 2004-07-02 | 2005-03-11 | Phoenix Prec Technology Corp | Direct connection multi-chip semiconductor element structure |
-
2005
- 2005-09-14 JP JP2005266345A patent/JP4701942B2/ja active Active
-
2006
- 2006-09-14 US US11/521,156 patent/US7812444B2/en active Active
- 2006-09-14 TW TW095133995A patent/TW200746384A/zh unknown
- 2006-09-14 CN CNB2006101538661A patent/CN100561734C/zh active Active
- 2006-09-14 KR KR1020060089277A patent/KR101227750B1/ko active IP Right Grant
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01175297A (ja) * | 1987-12-28 | 1989-07-11 | Toshiba Corp | 多層印刷配線板装置 |
JPH04294567A (ja) * | 1991-03-25 | 1992-10-19 | Mitsubishi Materials Corp | 混成集積回路 |
JPH07240584A (ja) * | 1994-02-25 | 1995-09-12 | Ricoh Co Ltd | 多層配線基板 |
JPH11289047A (ja) * | 1998-04-02 | 1999-10-19 | Hitachi Ltd | マルチチップモジュールおよびその製造方法 |
JP2000183536A (ja) * | 1998-12-17 | 2000-06-30 | Sony Corp | 機能モジュール及びその製造方法 |
JP2001144451A (ja) * | 1999-11-12 | 2001-05-25 | Ibi Tech Co Ltd | 積層配線板 |
JP2003198146A (ja) * | 2001-12-26 | 2003-07-11 | Kyocera Corp | 多層配線基板およびこれを用いた電子装置 |
JP2004343021A (ja) * | 2003-03-17 | 2004-12-02 | Matsushita Electric Ind Co Ltd | 部品内蔵モジュールの製造方法及び製造装置 |
Also Published As
Publication number | Publication date |
---|---|
US7812444B2 (en) | 2010-10-12 |
JP2007081079A (ja) | 2007-03-29 |
CN1933150A (zh) | 2007-03-21 |
KR20070031257A (ko) | 2007-03-19 |
CN100561734C (zh) | 2009-11-18 |
US20070057366A1 (en) | 2007-03-15 |
KR101227750B1 (ko) | 2013-01-29 |
TW200746384A (en) | 2007-12-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4701942B2 (ja) | 半導体ic内蔵モジュール | |
US11328858B2 (en) | Inductor component and inductor-component incorporating substrate | |
US9220165B2 (en) | Printed circuit board | |
JP5041897B2 (ja) | シールド機能を有するインダクタ形成型配線基板 | |
JP2002083925A (ja) | 集積回路装置 | |
JP6766740B2 (ja) | プリント配線基板およびスイッチングレギュレータ | |
US20190267301A1 (en) | Electronic component | |
KR102279978B1 (ko) | 모듈 | |
JP6504960B2 (ja) | プリント基板 | |
JP5172311B2 (ja) | 半導体モジュールおよび携帯機器 | |
JP5716391B2 (ja) | コイル内蔵基板 | |
US10512163B2 (en) | Electronic component mounting board | |
JP2009016732A (ja) | 半導体デバイス及びその製造方法 | |
JP2020025075A (ja) | モジュール | |
JP6425632B2 (ja) | プリント基板 | |
JP5207587B2 (ja) | 回路装置 | |
US20210204456A1 (en) | Module | |
JP5105106B2 (ja) | 電子部品内蔵モジュール | |
JPH05327271A (ja) | 多層配線基板 | |
JPS61294850A (ja) | 半導体集積回路装置 | |
JP2005259969A (ja) | 半導体装置およびその製造方法 | |
KR100593959B1 (ko) | 복합 구조의 인덕터 | |
JP5332663B2 (ja) | センサ信号処理回路基板 | |
JP2005228977A (ja) | 半導体装置 | |
JP2010003799A (ja) | 半導体装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20080523 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20100326 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100406 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100602 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20110208 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20110221 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4701942 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |