JP6665759B2 - 高周波回路 - Google Patents
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- JP6665759B2 JP6665759B2 JP2016219868A JP2016219868A JP6665759B2 JP 6665759 B2 JP6665759 B2 JP 6665759B2 JP 2016219868 A JP2016219868 A JP 2016219868A JP 2016219868 A JP2016219868 A JP 2016219868A JP 6665759 B2 JP6665759 B2 JP 6665759B2
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Description
図1は、本発明の実施の形態1に係る高周波回路を示す斜視図である。第1の基板1の上面及び側面に伝送線路2が形成されている。伝送線路2は、入力部3から分岐した第1及び第2の出力部4,5を持つ。第2の基板6の上面に第1及び第2のパッド7,8が形成されている。第1のワイヤ9が第1の出力部4を第1のパッド7に接続する。第2のワイヤ10が第2の出力部5を第2のパッド8に接続する。入力部3から第2の出力部5の先端までの電気長は、入力部3から第1の出力部4の先端までの電気長より長い。第2のワイヤ10と第2の出力部5の接合部から第2の出力部5の先端までの長さは、第1のワイヤ9と第1の出力部4の接合部から第1の出力部4の先端までの長さよりも長い。
図10は、本発明の実施の形態2に係る高周波回路を示す斜視図である。実施の形態1に比べて第2のワイヤ10が第2の出力部5の奥の方に接続されている。これにより第2のワイヤ10が長くなるが、オープンスタブも長くなるため、不要成分である第2のワイヤ10による寄生インダクタンスを抑制することができる。よって、実施の形態1と同様に、電気長の違いを補正し、動作特性を向上させることができる。
図11は、本発明の実施の形態3に係る高周波回路を示す斜視図である。実施の形態1と同様に、第1のワイヤ9が第1の基板1の側面において第1の出力部4に接合され、第2のワイヤ10は第1の基板1の上面において第2の出力部5に接合されている。第3のワイヤ20が第3の出力部21を第3のパッド22に接続する。第3のワイヤ20は、第2のワイヤ10に比べて第3の出力部21の奥の方に接続されている。この場合でも、実施の形態1と同様に、電気長の違いを補正し、動作特性を向上させることができる。
図12は、本発明の実施の形態4に係る高周波回路を示す斜視図である。第1及び第2の出力部4,5が第1の基板1の側面まで延びていない。第1及び第2のワイヤ9,10は第1の基板1の上面において第1及び第2の出力部4,5に接合されている。第2のワイヤ10は、第1のワイヤ9に比べて第2の出力部5の奥の方に接続されている。この場合でも、実施の形態1と同様に、電気長の違いを補正し、動作特性を向上させることができる。
図13は、本発明の実施の形態5に係る高周波回路の伝送線路の出力部を示す斜視図である。第1の基板1の側面において第1の出力部4は扇状に広がり、第2の出力部5は実施の形態1と同様である。従って、第1の基板1の側面における第1及び第2の出力部4,5の面積は互いに異なる。このように第1の基板1の側面における第1の出力部4の面積を変化させることにより、第1の出力部4とグランド電極11との間の並列容量を調整することができる。これにより、寄生インダクタンスの影響をより効果的に抑制することができる。
図14は、本発明の実施の形態1,6に係る第1及び第2の基板の接続部を示す上面図である。実施の形態1では第1のワイヤ9を接続するために基板間の距離をある程度、確保する必要がある。一方、本実施の形態では第1のワイヤ9の代わりにバンプ23を用いている。このため、基板同士を極めて近くに配置することができる。さらに、寄生インダクタンスを低減することができる。
図15は、本発明の実施の形態7に係る第1の基板を示す斜視図である。第1の基板1の側面をテーパ状にすることにより、第1のワイヤ9の接続が容易になる。組立工程の安定化により、不良発生リスクを低減することができる。その他の構成及び効果は実施の形態1と同様である。なお、基板の厚みが同等である場合に、基板を配置するベース部分に段差を付けることなく、本構造を実現することができる。
Claims (9)
- 第1の基板と、
前記第1の基板に形成され、入力部から分岐した第1及び第2の出力部を持つ伝送線路と、
第2の基板と、
前記第2の基板に形成された第1及び第2のパッドと、
前記第1の出力部を前記第1のパッドに接続する第1のワイヤと、
前記第2の出力部を前記第2のパッドに接続する第2のワイヤとを備え、
前記入力部から前記第2の出力部の先端までの電気長は、前記入力部から前記第1の出力部の先端までの電気長より長く、
前記第2のワイヤと前記第2の出力部の接合部から前記第2の出力部の前記先端までの長さは、前記第1のワイヤと前記第1の出力部の接合部から前記第1の出力部の前記先端までの長さよりも長いことを特徴とする高周波回路。 - 前記第1及び第2の出力部は、前記第2の基板の側面に対向する前記第1の基板の側面まで延びていることを特徴とする請求項1に記載の高周波回路。
- 前記第1の基板の前記側面において前記第1のワイヤが前記第1の出力部に接合されていることを特徴とする請求項2に記載の高周波回路。
- 前記第1の基板の下面に形成されたグランド電極を更に備えることを特徴とする請求項3に記載の高周波回路。
- 前記第1の基板の前記側面における前記第1及び第2の出力部の面積は互いに異なることを特徴とする請求項4に記載の高周波回路。
- 前記第1のワイヤはバンプであることを特徴とする請求項3〜5の何れか1項に記載の高周波回路。
- 前記第1の基板の前記側面はテーパ状であることを特徴とする請求項3〜5の何れか1項に記載の高周波回路。
- 前記第1の基板は伝送線路基板であり、前記第2の基板にトランジスタが形成されており、前記第1及び第2のパッドは前記トランジスタのゲートに接続されていることを特徴とする請求項1〜7の何れか1項に記載の高周波回路。
- 前記第1及び第2の基板は伝送線路基板であることを特徴とする請求項1〜7の何れか1項に記載の高周波回路。
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