FR3064151B1 - Procede de fabrication de circuits electriques, circuit electrique et composant electronique - Google Patents

Procede de fabrication de circuits electriques, circuit electrique et composant electronique Download PDF

Info

Publication number
FR3064151B1
FR3064151B1 FR1752216A FR1752216A FR3064151B1 FR 3064151 B1 FR3064151 B1 FR 3064151B1 FR 1752216 A FR1752216 A FR 1752216A FR 1752216 A FR1752216 A FR 1752216A FR 3064151 B1 FR3064151 B1 FR 3064151B1
Authority
FR
France
Prior art keywords
electrical circuits
electronic component
manufacturing process
circuits
component manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR1752216A
Other languages
English (en)
Other versions
FR3064151A1 (fr
Inventor
Fabien Marcq
Jean-Fabien Capsal
Pierre-Jean Cottinet
Minh Quyen Le
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Institut National des Sciences Appliquees de Lyon
Linxens Holding SAS
Original Assignee
Institut National des Sciences Appliquees de Lyon
Linxens Holding SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Institut National des Sciences Appliquees de Lyon , Linxens Holding SAS filed Critical Institut National des Sciences Appliquees de Lyon
Priority to FR1752216A priority Critical patent/FR3064151B1/fr
Priority to PCT/FR2018/050640 priority patent/WO2018167441A1/fr
Publication of FR3064151A1 publication Critical patent/FR3064151A1/fr
Application granted granted Critical
Publication of FR3064151B1 publication Critical patent/FR3064151B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N15/00—Thermoelectric devices without a junction of dissimilar materials; Thermomagnetic devices, e.g. using the Nernst-Ettingshausen effect
    • H10N15/10—Thermoelectric devices using thermal change of the dielectric constant, e.g. working above and below the Curie point
    • H10N15/15—Thermoelectric active materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/09—Forming piezoelectric or electrostrictive materials
    • H10N30/092—Forming composite materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/852—Composite materials, e.g. having 1-3 or 2-2 type connectivity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10083—Electromechanical or electro-acoustic component, e.g. microphone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Insulating Materials (AREA)
  • Laminated Bodies (AREA)

Abstract

L'invention concerne un procédé de la fabrication de circuits électrique, dans lequel on utilise une matrice diélectrique de résine polymère chargée de particules (1) ayant au moins l'une des propriétés choisies parmi des propriétés piézoélectriques, ferroélectriques, pyroélectriques et diélectriques. L'invention concerne également des circuits électriques fabriqués selon ce procédé ou des composants électroniques comportant un circuit électrique fabriqué selon ce procédé. Les circuits électriques ou composants électroniques ainsi fabriqués peuvent être utilisés pour réaliser des capteurs, des détecteurs, des sources de tension, des circuits intégrés, des antennes, etc.
FR1752216A 2017-03-17 2017-03-17 Procede de fabrication de circuits electriques, circuit electrique et composant electronique Expired - Fee Related FR3064151B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR1752216A FR3064151B1 (fr) 2017-03-17 2017-03-17 Procede de fabrication de circuits electriques, circuit electrique et composant electronique
PCT/FR2018/050640 WO2018167441A1 (fr) 2017-03-17 2018-03-16 Procédé de fabrication de complexes pour circuits électriques, circuit électrique et composant électronique

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1752216 2017-03-17
FR1752216A FR3064151B1 (fr) 2017-03-17 2017-03-17 Procede de fabrication de circuits electriques, circuit electrique et composant electronique

Publications (2)

Publication Number Publication Date
FR3064151A1 FR3064151A1 (fr) 2018-09-21
FR3064151B1 true FR3064151B1 (fr) 2021-10-15

Family

ID=60302153

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1752216A Expired - Fee Related FR3064151B1 (fr) 2017-03-17 2017-03-17 Procede de fabrication de circuits electriques, circuit electrique et composant electronique

Country Status (2)

Country Link
FR (1) FR3064151B1 (fr)
WO (1) WO2018167441A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112928199B (zh) * 2021-01-29 2022-09-06 上海交通大学 一种高灵敏柔性传感器及其制备方法和应用

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010012177A (ko) * 1997-05-02 2001-02-15 아이솔라 라미네이트 시스템스 코포레이션 회로판용의 압출된 코어 적층체
JP2002324729A (ja) * 2001-02-22 2002-11-08 Tdk Corp 電子部品とその製造方法
FR2953824B1 (fr) * 2009-12-11 2015-04-24 Univ Toulouse 3 Paul Sabatier Materiau solide composite piezoelectrique et/ou pyroelectrique, procede d'obtention et utilisation d'un tel materiau
CN105705558A (zh) * 2014-10-02 2016-06-22 伊索拉美国有限公司 具有均匀介电性能的预浸料和层压板

Also Published As

Publication number Publication date
FR3064151A1 (fr) 2018-09-21
WO2018167441A1 (fr) 2018-09-20

Similar Documents

Publication Publication Date Title
DE102005013762B3 (de) Elektronisches Gerät und Verfahren zur Bestimmung der Temperatur eines Leistungshalbleiters
SG11201806156VA (en) Alternating current motor controller, laminated busbar assembly and manufacturing method thereof
FR3064151B1 (fr) Procede de fabrication de circuits electriques, circuit electrique et composant electronique
US9997455B2 (en) Device architecture and method for precision enhancement of vertical semiconductor devices
US20160322342A1 (en) Semiconductor device
DE102014002628A1 (de) Getriebe mit Gehäuseteil, Modul und Antennenleitung
WO2013156162A3 (fr) Dispositif de chauffage électrique, composant et leur procédé de fabrication
EP3465748B1 (fr) Procédé de traitement d'un matériau électriquement isolant pour composants électriques, composant électrique fabriqué par ce procédé et dispositif de traitement d'un matériau électriquement isolant
EP3333983A8 (fr) Borne connectrice électrique
FR3090989B1 (fr) Câble électrique ayant une tenue au vieillissement en température améliorée
WO2021121744A1 (fr) Ensemble capteur, dispositif électrique doté d'un ensemble capteur et véhicule équipé d'un ensemble capteur
Lin et al. Molecular relaxation and glass transition properties of epoxy resin at high temperature
CN105529317A (zh) 嵌入式封装装置
DE102004050588A1 (de) Kontakteinrichtung für Leistungshalbleitermodule und Scheibenzellen
WO2015179593A8 (fr) Dispositifs de commutation à résistance non volatile
MX2017014684A (es) Dispositivo de conversion de energia.
DE102013113143B4 (de) Leistungshalbleitereinrichtung
EP1883108B1 (fr) Arangement doté d'un composant semi-conducteur de puissance et d'un dispositif de contact
DE102014201781A1 (de) Anordnung und verfahren zum messen der chiptemperatur in einem leistungshalbleitermodul
TW201608639A (zh) 積體ｍｏｓ型變容器及包含其之電壓控制振盪器、濾波器
Wang et al. Integration of ZnS: Mn2⁺ Microparticles into Electrospun PVDF‐Based Nanofibers for Enhanced Mechanoluminescence
RU2619362C1 (ru) Способ сборки кристаллов МФПУ
CN109565125A (zh) 开关设备功率触点和功率接触绝缘部
US20150194358A1 (en) Circuit and Method for Internally Assessing Dielectric Reliability of a Semiconductor Technology
DE102015112635B4 (de) Optoelektronische Baugruppe und Verfahren zum Betreiben einer optoelektronischen Baugruppe

Legal Events

Date Code Title Description
PLFP Fee payment

Year of fee payment: 2

PLSC Publication of the preliminary search report

Effective date: 20180921

PLFP Fee payment

Year of fee payment: 4

PLFP Fee payment

Year of fee payment: 5

ST Notification of lapse

Effective date: 20221105