CN105705558A - 具有均匀介电性能的预浸料和层压板 - Google Patents
具有均匀介电性能的预浸料和层压板 Download PDFInfo
- Publication number
- CN105705558A CN105705558A CN201480004624.9A CN201480004624A CN105705558A CN 105705558 A CN105705558 A CN 105705558A CN 201480004624 A CN201480004624 A CN 201480004624A CN 105705558 A CN105705558 A CN 105705558A
- Authority
- CN
- China
- Prior art keywords
- resin
- prepreg
- dielectric constant
- prepreg described
- laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims abstract description 164
- 229920005989 resin Polymers 0.000 claims abstract description 163
- 239000000463 material Substances 0.000 claims abstract description 115
- 239000004744 fabric Substances 0.000 claims description 28
- 239000011521 glass Substances 0.000 claims description 27
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 18
- 238000007598 dipping method Methods 0.000 claims description 14
- 239000010949 copper Substances 0.000 claims description 13
- 229910052802 copper Inorganic materials 0.000 claims description 11
- 239000000203 mixture Substances 0.000 claims description 6
- VKJLWXGJGDEGSO-UHFFFAOYSA-N barium(2+);oxygen(2-);titanium(4+) Chemical compound [O-2].[O-2].[O-2].[Ti+4].[Ba+2] VKJLWXGJGDEGSO-UHFFFAOYSA-N 0.000 claims description 5
- 239000013590 bulk material Substances 0.000 claims description 5
- 229910052712 strontium Inorganic materials 0.000 claims description 5
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 claims description 5
- -1 felt Substances 0.000 claims description 4
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 claims description 4
- 229910052451 lead zirconate titanate Inorganic materials 0.000 claims description 4
- 239000008187 granular material Substances 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- 239000003365 glass fiber Substances 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims description 2
- 239000002985 plastic film Substances 0.000 claims description 2
- 229920005992 thermoplastic resin Polymers 0.000 claims description 2
- 239000011342 resin composition Substances 0.000 abstract description 6
- 239000012779 reinforcing material Substances 0.000 abstract 2
- 238000004519 manufacturing process Methods 0.000 description 16
- 238000000034 method Methods 0.000 description 10
- 239000002904 solvent Substances 0.000 description 10
- 239000000835 fiber Substances 0.000 description 8
- 239000010410 layer Substances 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 230000002787 reinforcement Effects 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 239000000123 paper Substances 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 229910052736 halogen Inorganic materials 0.000 description 4
- 150000002367 halogens Chemical class 0.000 description 4
- 239000004753 textile Substances 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000003063 flame retardant Substances 0.000 description 3
- 239000003999 initiator Substances 0.000 description 3
- 229920006395 saturated elastomer Polymers 0.000 description 3
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- 229920000742 Cotton Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 229940106691 bisphenol a Drugs 0.000 description 2
- 239000011162 core material Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000002657 fibrous material Substances 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 239000002952 polymeric resin Substances 0.000 description 2
- 239000003505 polymerization initiator Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- KGSFMPRFQVLGTJ-UHFFFAOYSA-N 1,1,2-triphenylethylbenzene Chemical compound C=1C=CC=CC=1C(C=1C=CC=CC=1)(C=1C=CC=CC=1)CC1=CC=CC=C1 KGSFMPRFQVLGTJ-UHFFFAOYSA-N 0.000 description 1
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- ZRYCRPNCXLQHPN-UHFFFAOYSA-N 3-hydroxy-2-methylbenzaldehyde Chemical compound CC1=C(O)C=CC=C1C=O ZRYCRPNCXLQHPN-UHFFFAOYSA-N 0.000 description 1
- OXQXGKNECHBVMO-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptane-4-carboxylic acid Chemical compound C1C(C(=O)O)CCC2OC21 OXQXGKNECHBVMO-UHFFFAOYSA-N 0.000 description 1
- 229920002972 Acrylic fiber Polymers 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N Furan Chemical compound C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- FHBGVWKGAUKZSG-UHFFFAOYSA-N benzene-1,4-diol;methane Chemical compound C.OC1=CC=C(O)C=C1 FHBGVWKGAUKZSG-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000011437 continuous method Methods 0.000 description 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 1
- 239000004643 cyanate ester Substances 0.000 description 1
- 239000013530 defoamer Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000004079 fireproofing Methods 0.000 description 1
- 239000007850 fluorescent dye Substances 0.000 description 1
- OIAUFEASXQPCFE-UHFFFAOYSA-N formaldehyde;1,3-xylene Chemical compound O=C.CC1=CC=CC(C)=C1 OIAUFEASXQPCFE-UHFFFAOYSA-N 0.000 description 1
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 239000005337 ground glass Substances 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000002803 maceration Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000002685 polymerization catalyst Substances 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000012745 toughening agent Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/245—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using natural fibres
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
- C08J5/0405—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres
- C08J5/043—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres with glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/246—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using polymer based synthetic fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
- H01B3/10—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances metallic oxides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2300/00—Characterised by the use of unspecified polymers
- C08J2300/22—Thermoplastic resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2300/00—Characterised by the use of unspecified polymers
- C08J2300/24—Thermosetting resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0248—Skew reduction or using delay lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Abstract
由树脂组合物制成的预浸料和层压板,所述树脂组合物具有游离树脂部分和树脂浸渍的补强材料部分,其中所述树脂包括一种或多种基础树脂和一种或多种高Dk材料,其中所述一种或多种高Dk材料以足够使所述树脂组合物具有固化DkW的量存在于所述树脂组合物中,所述固化DkW与待施加所述树脂组合物的树脂浸渍的补强材料的DkWR在正或负(±)15%的范围内相匹配。
Description
发明背景
(1)发明领域
本发明涉及树脂组合物,其包含一种或多种高Dk材料和基础树脂,其中所述高Dk材料的介电常数高于固化的基础树脂的介电常数。本发明还涉及由本发明的树脂组合物制成的预浸料(prepregs)和层压板(laminates),所述预浸料和层压板具有跨预浸料或层压板横截面的均匀介电常数。
(2)现有技术描述
预浸料和覆铜层压板是在制造印刷电路板中常规使用的平面材料。预浸料和层压板通常是复合结构,其包括诸如玻璃织物、玻璃非织物、纸、或其他纤维和非纤维材料的补强材料,以及聚合树脂,所述聚合树脂被用作基质材料---施加于或用于浸渍补强材料的材料。
随着电子器件操作频率的不断增加,小心控制预浸料和层压板的介电性能变得更为重要。现有预浸料和层压板的一个问题是,补强材料和基质材料的介电性能迥然不同。当通过使用这样的覆金属层压板构建的结构如印刷电路板传输非常高速的信号时,随着信号传播经过各向异性区域,信号经历偏斜(skew)和速度的不同。当运行不同的信号时,这个问题更加复杂,并且在最坏的情况下,长线上传播速度的不同导致主要的信号完整问题以及在某些情况下导致总体信号消失。这个问题已经成为电子器件设计者的主要顾虑,尤其是随着板载(onboard)频率移动至14GHz及以上以在四通道以超过大于100千兆比特/秒传输,在此过程中预计偏斜为主要的设计挑战。
发明概述
本发明涉及预浸料和层压板,其通过消除基质的介电常数和补强材料的介电常数之间的差距来解决偏斜问题。因此,本发明的一个方面为树脂组合物,其含有一种或多种基础树脂以及一种或多种高Dk材料,其中所述一种或多种高Dk材料以足够使所述树脂组合物具有固化Dk的量存在于所述树脂组合物中,所述固化Dk与待施加所述树脂组合物的补强材料的Dk在正或负(±)15%的范围内相匹配。
本发明的另一个方面是树脂组合物,其含有至少一种基础树脂和约5至约60wt%或更多的高Dk材料颗粒,所述高Dk材料选自钛酸锶、钛酸钡、钛酸铅、锆钛酸铅、钛酸锆酸镧铅、及其组合,其中所述树脂组合物的Dk与待施加所述树脂组合物的织造玻璃织物补强材料的Dk在正或负(±)15%的范围内相匹配。
本发明的又一个方面为预浸料,其含有具有DkR的补强材料,以及树脂组合物,所述树脂组合物包含一种或多种具有DkW的基础树脂,其中DkR高出DkW超过15%,所述树脂组合物还包含一种或多种高Dk材料,所述一种或多种高Dk材料以足够使所述树脂组合物具有固化DkW的量存在于所述树脂组合物中,所述固化DkW与待施加所述树脂组合物的补强材料的DkR在正或负(±)15%的范围内相匹配。
本发明的另一个实施方式为预浸料,其含有:至少部分固化的树脂浸渍的补强材料部分;以及游离树脂部分,其中所述树脂含有至少一种高介电常数材料,所述游离树脂部分具有介电常数DKW,并且所述树脂浸渍的补强材料部分具有介电常数DKWR,其中所述高介电常数材料以足够使DKWR与DKW相匹配的量掺入所述树脂中,从而使得DKWR与DKW相差不大于(±)15%。
附图说明
图1是本发明的预浸料或层压板实施方式的横截面,所述预浸料或层压板实施方式具有跨其横截面的均匀介电常数。
现有实施方式的描述
本发明总体上涉及用于电子工业的经补强的预浸料和层压板,其含有树脂或基质组分以及补强组分。用于本发明的预浸料和层压板的起始组分的介电常数相差大于15%。具体地说,树脂组分具有DKW,补强组分具有DKR,并且DKW与DKR相差大于15%。的确,对于DKR和不含有高Dk材料的树脂材料的DK(本文中称为Dk0)相差容易超过30%是常见的。
术语“起始组分的介电常数”是指在起始材料被合并以形成树脂浸渍的补强材料之前和/或在它们被掺入到经补强的预浸料和/或层压板中之前每种起始材料的介电常数。
在本发明的一个实施方式中,树脂组分用高介电常数材料改性以形成预浸料或层压板,其中基质组分的介电常数和补强材料的介电常数是“均匀的”或“相匹配”。术语“均匀的”或“相匹配”在本文中类似地用于指彼此相差不大于正或负(±)15%以及更优选地不大于正或负(±)5%的两个介电常数。
本发明的另一个实施方式是具有跨其横截面的相匹配或均匀的介电常数的预浸料或层压板。对于预浸料或层压板,这是指预浸料或层压板的树脂浸渍的补强材料部分的介电常数(DKWR)与预浸料或层压板的游离树脂部分的介电常数(DKW)相匹配。在该实施方式中,树脂的介电常数与树脂浸渍的补强材料的介电常数相匹配,以形成具有跨其横截面的相匹配的介电常数的层压板。
在上述实施方式中,补强材料的介电常数(DkR)通常是固定的。而且,不含有高介电常数材料的树脂或基质材料的介电常数(Dk0)通常显著不同于补强材料的介电常数(DkR),即差值大于±15%。因此,本发明通过在使基质材料与补强材料结合(associating)之前将一种或多种高介电常数(Dk)材料掺入到树脂(也称为基质材料)中来使介电常数相匹配。
现参照图1,其示出了具有横截面“Y”的本发明的预浸料(10)。所述预浸料包括游离树脂部分(12)和树脂浸渍的补强材料部分(14)。游离树脂部分具有DkW。树脂浸渍的补强材料部分具有DkWR。预浸料或层压板的游离树脂部分包括具有能够独立于DkWR测定的DkW的任何树脂。术语“游离树脂”指为预浸料或层压板的一部分但是在树脂掺入到树脂浸渍的补强材料部分之后距任意补强表面---顶部(16)底部(18)或侧面(20)和(22)至少1微米的树脂。游离树脂通常为b-阶或c-阶树脂。这包括例如在将树脂涂布的铜片以树脂向下的方式施加至芯树脂浸渍的补强材料以形成铜涂布的预浸料或层压板之后仍保留的游离树脂。
本文讨论的“介电常数”以及本文所提及的介电常数范围和数值通过Bereskin测试方法或可替代地通过后分离方法(splitpostmethod)测定。其中讨论了介电常数的比较,然后通过相同的测试方法测定经过比较的介电常数。树脂的介电常数使用完全固化的树脂样品来测定。树脂浸渍的补强材料部分的介电常数DkWR使用完全固化的树脂浸渍的补强材料的样品来测定。
补强材料可以是已知可用于制造基板(substrate)片材的任意片材或地面材料,所述基板片材用于制造用于生产印刷电路板的预浸料或层压板。然而,如上所述,可以使用地面材料例如地面玻璃纤维材料,优选的是补强材料为片材。例如,补强片材可以是无机纤维布,包括各种玻璃布(例如纱束布、布、短切毡和表面毡)、金属纤维布等;由液晶纤维制成的织造布或无纺布(例如,全芳族聚酰胺纤维、全芳族聚酯纤维以及聚吲哚纤维);由合成纤维制成的织造布或无纺布(例如聚乙烯醇纤维、聚酯纤维以及丙烯酸纤维);天然纤维布(例如棉布、麻布以及毛毡);碳纤维布;以及天然纤维素布(例如牛皮纸、棉纸、以及纸-玻璃组合的纤维纸)。
在本发明的一个方面,补强材料为织造玻璃织物材料。这样的织造玻璃织物材料将具有约3.5至7.0或更大的DkR。这样的织造玻璃织物材料的例子包括,例如具有约3.5至约4.5的DkR的低Dk玻璃,E-玻璃;R-玻璃、ECR-玻璃、S-玻璃、C-玻璃、Q-玻璃以及这类已知可用于制备玻璃织物补强的预浸料和层压板的任何其他织造玻璃织物。
本发明的树脂组合物包括本领域中已知的可用于制造预浸料和层压板材料的一种或多种基础树脂。基础树脂通常是热固性或热塑性树脂。可用的基础树脂的例子包括环氧树脂、基于聚苯醚的树脂、氰脲酸酯树脂、双马来酰亚胺树脂、聚酰亚胺树脂、酚醛树脂、呋喃树脂、二甲苯甲醛树脂、酮甲醛树脂、脲醛树脂、三聚氰胺树脂、苯胺树脂、醇酸树脂、不饱和聚酯树脂、邻苯二甲酸二烯丙酯树脂、氰脲酸三烯丙酯树脂、三嗪树脂、聚氨酯树脂、硅酮树脂、及其任意组合或混合物。
在本发明的一个方面,基础树脂是环氧树脂或包括环氧树脂。可用的环氧树脂的一些例子包括酚型,如基于双酚A的二缩水甘油醚、基于苯酚-甲醛酚醛清漆或甲酚-甲醛酚醛清漆的多缩水甘油醚、基于三(对-羟基苯酚)甲烷的三缩水甘油醚、或基于四苯乙烷的四缩水甘油醚的那些;胺型,如基于四缩水甘油基-亚甲基双苯胺或基于对氨基二醇的三缩水甘油醚的那些;脂环族型,如基于3,4-环氧基环己基甲基-3,4-环氧基环己烷羧酸酯的那些。术语“环氧树脂”还指含有过量环氧基的化合物(例如,上述类型)和芳族二羟基化合物的反应产物。这些化合物可以是卤素取代的。优选的是衍生自双酚A的环氧树脂,特别是FR-4。FR-4是通过用过量的双酚A二缩水甘油醚和四溴双酚A的增长反应(advancingreaction)制得的。也可以应用环氧树脂与双马来酰亚胺树脂、氰酸酯树脂和/或双马来酰亚胺三嗪树脂的混合物。
树脂组合物除了包括基础树脂外通常还包括引发剂或催化剂、一种或多种任选的阻燃剂和溶剂。阻燃剂可以是已知可用在用于制造预浸料和层压板的树脂组合物中的任何阻燃材料,所述预浸料和层压板用于制造印刷电路板。阻燃剂可以含有卤素或者它们可以不含卤素。可替代地或另外地,树脂可含有卤素如溴,以使固化树脂具有阻燃性能。
树脂组合物还可以包括聚合引发剂或催化剂。一些可用的引发剂或催化剂的例子包括但不限于过氧化物或偶氮型聚合引发剂(催化剂)。一般情况下,所选择的引发剂/催化剂可以是已知的可用于树脂合成或固化的任何化合物,无论其是否执行这些功能中的一个。
树脂组合物包含一种或多种溶剂,其通常用于溶解适当的树脂组合物成分和/或控制树脂粘度和/或为了使树脂成分保持在悬浮的分散体中。可以使用本领域技术人员已知的可用于与热固性树脂体系联合的任何溶剂。特别可用的溶剂包括甲基乙基酮(MEK)、甲苯、二甲基甲酰胺(DMF)、或其混合物。如下面指出的,树脂组合物用于制造预浸料和层压板。在制造过程中,将补强材料用树脂组合物浸渍或以其他方式与树脂组合物结合,并且在一些情况下,从树脂组合物去除大部分溶剂,以形成预浸料和层压板。因此,当列出树脂组合物的重量百分比时,它们是以干的无溶剂的基准进行报告,除非另有说明。
树脂组合物可以包含各种其它任选的成分,包括填料、增韧剂、粘合促进剂、消泡剂、流平剂、染料以及颜料。例如,可以以痕量将荧光染料添加到树脂组合物中,以使得由其制备的层压板在板商店的光学检测设备中暴露于UV光时发出荧光。本领域技术人员已知的可在用于制造印刷电路板层压板的树脂中使用的其它任选成分也可以被包含在本发明的树脂组合物中。
本发明的树脂组合物还包含一种或多种高Dk材料。高Dk材料可以是可掺入到液体树脂中从而使得包含所述高Dk材料的固化或部分固化的树脂组合物的Dk不同于或优选高于所述树脂组合物的树脂成分的Dk的任何材料。在一个实施方式中,高Dk材料具有大于约200和更优选大于约500的Dk。
一类可用的高Dk材料是铁电材料。一些可用的铁电材料的例子包括钛酸锶、钛酸钡、钛酸铅、锆钛酸铅、钛酸锆酸镧铅、及其组合。特别可用的高DK材料是钛酸锶和钛酸钡。
高DK材料可以作为粒状材料掺入到树脂组合物中。如果使用粒状材料,则高DK材料通常具有在约1纳米至40微米范围内的粒径。
高DK材料以足够形成均匀的预浸料或层压板的量被包含在树脂组合物中。在一个实施方式中,均匀的预浸料或层压板具有树脂组合物或基质DkW,其为补强材料DkR±15%以内,优选±5%以内。在可替代的实施方式中,均匀的预浸料或层压板具有游离树脂部分,所述游离树脂部分具有DkW,其为树脂浸渍的补强材料部分的DkWR±15%以内,优选±5%以内。
掺入到树脂组合物中的高DK材料的量随着基础树脂的DK0和补强材料的DkR变化。通常,DK0和DkR之间的差值越大,被包含在树脂组合物中的高Dk材料的量越大。通常,按干基准计,高Dk材料的量大于树脂组合物的约2wt%对于引起基础树脂Dk发生变化是必要的。按干的无溶剂的基准计,可掺入到树脂组合物中而不显著影响树脂组合物特性的高Dk材料的最大量为约70wt%。在可替代实施方式中,高Dk材料以按干基准计约5至约60wt%的量存在于树脂组合物中。我们已发现,向具有约4的Dk0的基础树脂加入约5至约60wt%的粒状钛酸钡使树脂组合物的DkW提高,从5wt%加载量时的仅4多一点到60wt%加载量时的大于7.5。
上述树脂组合物尤其可用于制备在制造印刷电路板中使用的预浸料和/或层压板。为了可用于制造印刷电路板,层压板可以被部分固化或是b-阶的以形成工业中被称为预浸料的物质,在这种状态下它们可以与另外的材料片材铺叠(laidup),以形成c-阶或完全固化的层压板片材。可替代地,树脂可被制造成c-阶或完全固化的材料片材。
在一个可用的加工系统中,上述的树脂组合物/补强材料组合可用于在分批或连续方法中制备预浸料。通常使用芯材料如玻璃织物幅材(织物)卷来制造预浸料,其中将所述玻璃织物幅材(织物)卷解绕(unwound)到一系列驱动辊中。所述幅材然后进入涂布区域,在该区域幅材通过其中包含本发明的热固性树脂体系、溶剂和其它组分的槽,在该槽中玻璃幅材变为树脂饱和的。饱和的玻璃幅材然后通过一对计量辊,其从饱和的玻璃幅材除去过量的树脂,此后,树脂涂布的幅材经过干燥塔的长度持续选定的时间段,直至溶剂从幅材蒸发。通过重复这些步骤可以将第二树脂涂层和随后的树脂涂层施加至幅材,直到预浸料的制备完成,届时预浸料被卷绕到辊上。玻璃织物幅材可以用织造的织物材料、纸、塑料片、毛毡、和/或粒状材料如玻璃纤维颗粒或粒状材料替换。
在制造预浸料或层压板材料的另一种方法中,将本发明的热固性树脂在环境温度和压力下在混合容器中预混合。预混料的粘度为~600–1000cps并且可以通过添加溶剂或从树脂中除去溶剂来调节。织物基板---如E玻璃---被拉动通过包含预混合树脂的浸渍槽,经过烘干塔,其中过量的溶剂被去除,并且根据玻璃织造风格、树脂含量&厚度要求,将预浸料制成具有一定尺寸的卷或片,在各种结构中被铺叠在Cu箔之间。
还可以使用狭缝模具(slot-die)或其它相关的涂布技术将树脂组合物以薄层施加到Cu箔基板(RCC---树脂涂布的Cu)。
可以使用上述的树脂片、预浸料片和树脂涂布的铜箔片在分批或连续方法中制备层压板,例如用于制造印刷电路板的那些层压板。在用于制造本发明的层压板的示例性连续方法中,铜、树脂预浸料和薄织物片中的每一种以连续片材的形式被连续解绕到一系列驱动辊中,以形成邻近于树脂预浸料片的分层的织物幅材,所述树脂预浸料片邻近于铜箔片,从而使得所述预浸料片位于所述铜箔片和所述织物片之间。然后使幅材经受热和压力条件一段时间,该时间足以使得树脂迁移到织物材料中并完全固化树脂。在所得的层压板中,树脂材料迁移到织物中引起树脂层的厚度(铜箔材料和织物片材之间的距离)变小并接近零,因为上述的组合层由三层幅材转变为单层压板片。在这种方法的可替换方法中,可以把单预浸料树脂片施加于织物材料层的一侧,并且使该组合夹在两个铜层之间,之后对所述叠层施加热和/或压力,以使得树脂材料流动并充分浸渍织物层并使得两个铜箔层都粘附至中心的层压板。
在又一个实施方式中,可以通过将薄的树脂涂层施加到两个不同的连续移动的铜片,从铜片中除去任何过量的树脂以控制树脂厚度,然后在热和/或压力条件下部分固化树脂以形成b-阶树脂涂布的铜片,在制备层压板的同时制备树脂组合物涂布的铜片。然后b-阶树脂涂布的铜片可直接用于层压板的制造过程中。
在又一个实施方式中,可将经过或未经过在先预处理的织物材料连续进料至树脂组合物浴中,从而使得织物材料变成浸渍有树脂组合物。树脂组合物在该方法的这个阶段可以任选地被部分固化。接着,一个或两个铜箔层可以与树脂组合物浸渍的织物片的第一和/或第二平面表面结合,以形成幅材,之后向所述幅材施加热和/或压力以完全固化树脂组合物。
以示例的方式描述了本发明。应该理解,本文使用的术语意在具有文字描述的性质而不是用于限定。根据上述教导,本发明的许多改变和变化是可能的。因此,在所附权利要求的范围内,可以以具体描述之外的其他方式实施本发明。
Claims (18)
1.一种预浸料,其包含:
至少部分固化的树脂浸渍的补强材料部分;和
游离树脂部分,其中所述树脂包含至少一种高介电常数材料,所述游离树脂部分具有介电常数DKW并且所述树脂浸渍的补强材料部分具有介电常数DKWR,其中所述高介电常数材料以足够使DKWR与DKW相匹配的量掺入到所述树脂中,从而使得DKWR与DKW相差不大于(±)15%。
2.权利要求1所述的预浸料,其中所述一种或多种高Dk材料中的每一种具有至少约500的Dk。
3.权利要求1所述的预浸料,其中所述一种或多种高Dk材料为粒状材料。
4.权利要求3所述的预浸料,其中所述一种或多种高Dk材料的粒径在约1纳米至约40微米的范围内。
5.权利要求1所述的预浸料,其中所述一种或多种高Dk材料为铁电材料。
6.权利要求5所述的预浸料,其中所述铁电材料选自钛酸锶、钛酸钡、钛酸铅、锆钛酸铅、钛酸锆酸镧铅,及其组合。
7.权利要求1所述的预浸料,其中基础树脂为热固性或热塑性树脂。
8.权利要求1所述的预浸料,其中一种或多种高Dk材料以约2至约70wt%的量存在于所述组合物中。
9.权利要求1所述的预浸料,其中所述补强材料选自织造玻璃布、纸、毛毡、玻璃纤维以及塑料片。
10.权利要求9所述的预浸料,其中所述补强材料为低Dk玻璃织物片。
11.权利要求10所述的预浸料,其中所述低Dk玻璃织物片具有约3.5至约7.0的Dk。
12.权利要求1所述的预浸料,其中所述游离树脂为距任意补强表面至少1微米的任何树脂。
13.权利要求1所述的预浸料,其中所述树脂组合物含有至少一种基础树脂和约5至约60wt%或更多的高Dk材料颗粒,所述高Dk材料选自钛酸锶、钛酸钡、钛酸铅、锆钛酸铅、钛酸锆酸镧铅,及组合。
14.权利要求1所述的预浸料,其中DKWR与DKW相差不大于(±)5%。
15.权利要求1所述的预浸料,其中DkR与不含所述高介电常数材料的树脂的介电常数相差大于30%。
16.一种层压板,其包含完全固化的权利要求1所述的预浸料。
17.权利要求16的层压板,其包括至少一个铜层。
18.一种印刷电路板,其包括至少一层完全固化的权利要求1所述的预浸料。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202310616084.0A CN116854970A (zh) | 2014-10-02 | 2014-10-02 | 具有均匀介电性能的预浸料和层压板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US2014/058824 WO2016053341A1 (en) | 2014-10-02 | 2014-10-02 | Prepregs and laminates having homogeneous dielectric properties |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202310616084.0A Division CN116854970A (zh) | 2014-10-02 | 2014-10-02 | 具有均匀介电性能的预浸料和层压板 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN105705558A true CN105705558A (zh) | 2016-06-22 |
Family
ID=51830611
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201480004624.9A Pending CN105705558A (zh) | 2014-10-02 | 2014-10-02 | 具有均匀介电性能的预浸料和层压板 |
CN202310616084.0A Pending CN116854970A (zh) | 2014-10-02 | 2014-10-02 | 具有均匀介电性能的预浸料和层压板 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202310616084.0A Pending CN116854970A (zh) | 2014-10-02 | 2014-10-02 | 具有均匀介电性能的预浸料和层压板 |
Country Status (8)
Country | Link |
---|---|
EP (2) | EP3031055B1 (zh) |
JP (1) | JP7115853B2 (zh) |
KR (1) | KR102305618B1 (zh) |
CN (2) | CN105705558A (zh) |
CA (1) | CA2892989A1 (zh) |
SG (1) | SG11201506844YA (zh) |
TW (1) | TWI628211B (zh) |
WO (1) | WO2016053341A1 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107057098A (zh) * | 2016-12-30 | 2017-08-18 | 广东生益科技股份有限公司 | 用于电路基板的预浸渍料、层压板、制备方法及包含其的印制电路板 |
CN109575516A (zh) * | 2017-09-29 | 2019-04-05 | 联茂电子股份有限公司 | 高分子基质复合物及应用其的预浸物、印刷电路板 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3064151B1 (fr) * | 2017-03-17 | 2021-10-15 | Linxens Holding | Procede de fabrication de circuits electriques, circuit electrique et composant electronique |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020009577A1 (en) * | 2000-05-31 | 2002-01-24 | Tdk Corporation | Electronic parts |
CN101152772A (zh) * | 2002-12-27 | 2008-04-02 | Tdk株式会社 | 树脂组合物、固化树脂、薄片状固化树脂、层压体、半固化片、电子器件以及多层基板 |
US20140220844A1 (en) * | 2013-02-06 | 2014-08-07 | Isola Usa Corp. | Prepregs and Laminates Having Homogeneous Dielectric Properties |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6048807A (en) * | 1998-08-12 | 2000-04-11 | World Properties, Inc. | Polybutadiene and polyisoprene based thermosetting compositions and method of manufacture |
JP2005015729A (ja) * | 2003-06-30 | 2005-01-20 | Nitto Boseki Co Ltd | 誘電率のばらつきが小さいプリント配線板用プリプレグ及び積層板 |
JP4747608B2 (ja) * | 2005-02-23 | 2011-08-17 | パナソニック電工株式会社 | ポリフェニレン樹脂組成物を含有するプリプレグ及び積層体 |
JP2007294563A (ja) * | 2006-04-24 | 2007-11-08 | Cmk Corp | プリント配線板 |
-
2014
- 2014-10-02 CN CN201480004624.9A patent/CN105705558A/zh active Pending
- 2014-10-02 WO PCT/US2014/058824 patent/WO2016053341A1/en active Application Filing
- 2014-10-02 JP JP2017537886A patent/JP7115853B2/ja active Active
- 2014-10-02 CN CN202310616084.0A patent/CN116854970A/zh active Pending
- 2014-10-02 KR KR1020157019593A patent/KR102305618B1/ko active IP Right Grant
- 2014-10-02 SG SG11201506844YA patent/SG11201506844YA/en unknown
- 2014-10-02 EP EP14790413.0A patent/EP3031055B1/en active Active
- 2014-10-02 EP EP21162972.0A patent/EP3920193A1/en active Pending
- 2014-10-02 CA CA2892989A patent/CA2892989A1/en not_active Abandoned
-
2015
- 2015-05-07 TW TW104114604A patent/TWI628211B/zh active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020009577A1 (en) * | 2000-05-31 | 2002-01-24 | Tdk Corporation | Electronic parts |
CN101152772A (zh) * | 2002-12-27 | 2008-04-02 | Tdk株式会社 | 树脂组合物、固化树脂、薄片状固化树脂、层压体、半固化片、电子器件以及多层基板 |
US20140220844A1 (en) * | 2013-02-06 | 2014-08-07 | Isola Usa Corp. | Prepregs and Laminates Having Homogeneous Dielectric Properties |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107057098A (zh) * | 2016-12-30 | 2017-08-18 | 广东生益科技股份有限公司 | 用于电路基板的预浸渍料、层压板、制备方法及包含其的印制电路板 |
WO2018120488A1 (zh) * | 2016-12-30 | 2018-07-05 | 广东生益科技股份有限公司 | 用于电路基板的预浸渍料、层压板、制备方法及包含其的印制电路板 |
CN107057098B (zh) * | 2016-12-30 | 2020-07-28 | 广东生益科技股份有限公司 | 用于电路基板的预浸渍料、层压板、制备方法及包含其的印制电路板 |
CN109575516A (zh) * | 2017-09-29 | 2019-04-05 | 联茂电子股份有限公司 | 高分子基质复合物及应用其的预浸物、印刷电路板 |
Also Published As
Publication number | Publication date |
---|---|
EP3031055B1 (en) | 2021-03-17 |
TW201613993A (en) | 2016-04-16 |
KR20170063315A (ko) | 2017-06-08 |
KR102305618B1 (ko) | 2021-09-29 |
JP2017531731A (ja) | 2017-10-26 |
CN116854970A (zh) | 2023-10-10 |
SG11201506844YA (en) | 2017-06-29 |
WO2016053341A1 (en) | 2016-04-07 |
JP7115853B2 (ja) | 2022-08-09 |
TWI628211B (zh) | 2018-07-01 |
EP3031055A1 (en) | 2016-06-15 |
CA2892989A1 (en) | 2015-07-29 |
EP3920193A1 (en) | 2021-12-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10791626B2 (en) | Prepreg, metal foil-clad laminate, and printed wiring board | |
US6632511B2 (en) | Manufacture of prepregs and laminates with relatively low dielectric constant for printed circuit boards | |
JP2016509107A (ja) | 均一な誘電特性を有するプレプレグ及びラミネート | |
CN106633785A (zh) | 用于电路基板的预浸渍料、层压板、制备方法及包含其的印制电路板 | |
LU101218B1 (de) | Polymermatrix-verbundstoff zum beseitigen von übertragungsverzögerung und webeffekt | |
TW201427827A (zh) | 覆金屬箔疊層板之製造方法 | |
CN105705558A (zh) | 具有均匀介电性能的预浸料和层压板 | |
US11116078B2 (en) | Prepregs and laminates having homogeneous dielectric properties | |
US20200413536A1 (en) | Polymer matrix composite, prepreg and printed circuit board for eliminating skew and fiber weave effect | |
JP4276830B2 (ja) | プリプレグ用基材及びこれを用いた多層プリント配線板 | |
JP7235705B2 (ja) | 均一な誘電特性を有するプレプレグ及びラミネート | |
CN104404817A (zh) | 芳纶-玻璃纤维复合片材及其制备方法 | |
TWI836415B (zh) | 高分子基質複合物及印刷電路板 | |
US20220153945A1 (en) | Polymer matrix composite, prepreg and printed circuit board for eliminating skew and fiber weave effect | |
CN117004211A (zh) | 高分子基质复合物及印刷电路板 | |
GB2568995A (en) | Polymer matrix composite as well as prepreg and printed circuit board using same. | |
JP2023095793A (ja) | 低誘電損失不織布、その製造、およびその使用 | |
JPS63172641A (ja) | 銅張積層板 | |
JP2001269931A (ja) | プリプレグの製造方法、プリプレグ及び多層板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160622 |