JP7115853B2 - 均一な誘電特性を有するプレプレグ及びラミネート - Google Patents
均一な誘電特性を有するプレプレグ及びラミネート Download PDFInfo
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- JP7115853B2 JP7115853B2 JP2017537886A JP2017537886A JP7115853B2 JP 7115853 B2 JP7115853 B2 JP 7115853B2 JP 2017537886 A JP2017537886 A JP 2017537886A JP 2017537886 A JP2017537886 A JP 2017537886A JP 7115853 B2 JP7115853 B2 JP 7115853B2
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- resin
- prepreg
- dielectric constant
- titanate
- materials
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- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 claims description 7
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims description 6
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- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
- C08J5/0405—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres
- C08J5/043—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres with glass fibres
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08J5/245—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using natural fibres
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- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
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- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
- H01B3/10—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances metallic oxides
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- C—CHEMISTRY; METALLURGY
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- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
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- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0248—Skew reduction or using delay lines
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Description
(1)発明の分野
本発明は、ベース樹脂と一緒に1種もしくはそれより多い高Dk材料を含む樹脂組成物に関し、ここで高Dk材料は硬化したベース樹脂の誘電率より高い誘電率を有する。本発明は、本発明の樹脂組成物を用いて作られる、プレプレグ又はラミネート断面を横切って均一な誘電率を有するプレプレグ及びラミネートにも関する。
プレプレグ及び銅張りラミネートは、プリント基板の製造において日常的に用いられる平面状材料である。プレプレグ及びラミネートは、典型的にはガラス繊維織物、不織ガラス(non-woven glass)、紙又は他の繊維もしくは非繊維材料のような強化材料及びマトリックス材料-強化材料に含浸させるために適用されるか又は用いられる材料-として用いられるポリマー樹脂を含む複合構造である。
本発明は一般的に、樹脂又はマトリックス成分及び強化成分を含むエレクトロニクス産業で用いられる強化されたプレプレグ及びラミネートを目的とする。本発明のプレプレグ及びラミネート中で用いられる出発成分は、15%より大きく異なる誘電率を有する。特に、樹脂成分はDKWを有し、強化成分はDKRを有し、DKWとDKRは15%より大きく異なる。事実、DKR及び高Dk材料なしの樹脂材料のDK(本明細書でDK0と言及される)は容易に30%より大きく異なるのが普通である。
材料を樹脂(マトリックス材料とも言及される)中に導入することにより、誘電率を一致させる。
ド樹脂、不飽和ポリエステル樹脂、ジアリルフタレート樹脂、トリアリルシアヌレート樹脂、トリアジン樹脂、ポリウレタン樹脂、シリコーン樹脂及びそれらの組み合わせ又は混合物が含まれる。
されると蛍光を発するようにすることができる。プリント基板ラミネートの製造に用いられる樹脂中で有用であることが当該技術分野における熟練者により既知の他の場合による成分も、本発明の樹脂組成物中に含まれることができる。
particular material)を用いる場合、高DK材料は、典型的には約1nm~40ミクロンの範囲の粒度を有するであろう。
明の熱硬化性樹脂系、溶媒及び他の成分を含有するタンクを通過し、そこでガラスウェブは樹脂で飽和した状態になる。飽和ガラスウェブは、次いで一対の計量ロールを通過し、それは飽和ガラスウェブから過剰の樹脂を除去し、その後、樹脂がコーティングされたウェブは、溶媒がウェブから蒸発するまで、選ばれる時間に及んで乾燥塔の区間を移動する。プレプレグの製造が完了するまでこれらの段階を繰り返すことにより、第2の及び続く樹脂のコーティングをウェブに適用することができ、そうしたら、プレプレグをロール上に巻く。ガラス繊維織物ウェブを編織布材料、紙、プラスチックシート、フェルト及び/又は粒子状材料、例えばガラス繊維粒子もしくは粒子状材料と置き換えることができる。
Claims (16)
- 少なくとも部分的に硬化した樹脂含浸強化材料部分;ならびに
遊離の樹脂部分
を含んでなるプレプレグであって、ここで樹脂は少なくとも1種の高誘電率粒子状材料を含み、遊離の樹脂部分は誘電率DKwを有し、樹脂含浸強化材料部分は誘電率DKWRを有し、ここで高誘電率材料は、DKWRとDKWが(±)15%より大きく異ならないようにDKWRをDKWと一致させるのに十分な量で樹脂中に導入され、強化材料の誘電率(DKWR)がDKWと同じではなく、全ての誘電率はスプリットポスト法により決定され、遊離の樹脂がいずれかの強化表面から少なくとも1ミクロンにある樹脂である、上記プレプレグ。 - 1種もしくはそれより多い高Dk材料がそれぞれ少なくとも500のDkを有する請求項1のプレプレグ。
- 1種もしくはそれより多い高Dk材料の粒度が1nm~40ミクロンの範囲である請求項1のプレプレグ。
- 1種もしくはそれより多い高Dk材料が強誘電性材料である請求項1のプレプレグ。
- 強誘電性材料がチタン酸ストロンチウム、チタン酸バリウム、チタン酸鉛、チタン酸ジルコン酸鉛、チタン酸ジルコン酸鉛ランタン及びそれらの組み合わせを含む群から選ばれる請求項4のプレプレグ。
- ベース樹脂が熱硬化性もしくは熱可塑性樹脂である請求項1のプレプレグ。
- 1種もしくはそれより多い高Dk材料が2~70重量%の範囲の量で組成物中に存在する請求項1のプレプレグ。
- 強化材料がガラス繊維織布、紙、フェルト、ガラス繊維及びプラスチックシートから選ばれる請求項1のプレプレグ。
- 強化材料が低Dkガラス繊維編織布シートである請求項8のプレプレグ。
- 低Dkガラス繊維編織布シートが3.5~7.0の範囲のDkを有する請求項9のプレプレグ。
- 樹脂組成物が少なくとも1種のベース樹脂ならびにチタン酸ストロンチウム、チタン酸バリウム、チタン酸鉛、チタン酸ジルコン酸鉛、チタン酸ジルコン酸鉛ランタン及びそれらの組み合わせより成る群から選ばれる5~60重量%のあるいはより高Dk材料の粒子を含む請求項1のプレプレグ。
- DKWRとDKWが(±)5%より大きく異ならない請求項1のプレプレグ。
- DkRと高誘電率材料なしの樹脂の誘電率が30%より大きく異なる請求項1のプレプレグ。
- 完全に硬化した請求項1のプレプレグを含むラミネート。
- 少なくとも1つの銅層を含む請求項14のラミネート。
- 少なくとも1つの層として完全に硬化した請求項1のプレプレグを含むプリント基板。
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PCT/US2014/058824 WO2016053341A1 (en) | 2014-10-02 | 2014-10-02 | Prepregs and laminates having homogeneous dielectric properties |
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FR3064151B1 (fr) * | 2017-03-17 | 2021-10-15 | Linxens Holding | Procede de fabrication de circuits electriques, circuit electrique et composant electronique |
US20190104612A1 (en) * | 2017-09-29 | 2019-04-04 | Iteq Corporation | Polymer matrix composite for eliminating skew and fiber weave effect |
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JP2006232952A (ja) | 2005-02-23 | 2006-09-07 | Matsushita Electric Works Ltd | ポリフェニレン樹脂組成物を含有するプリプレグ及び積層体 |
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JP2001345212A (ja) * | 2000-05-31 | 2001-12-14 | Tdk Corp | 積層電子部品 |
JP2004210936A (ja) * | 2002-12-27 | 2004-07-29 | Tdk Corp | プリプレグ、シート状樹脂硬化物及び積層体 |
JP2005015729A (ja) * | 2003-06-30 | 2005-01-20 | Nitto Boseki Co Ltd | 誘電率のばらつきが小さいプリント配線板用プリプレグ及び積層板 |
JP2007294563A (ja) * | 2006-04-24 | 2007-11-08 | Cmk Corp | プリント配線板 |
US20140220844A1 (en) * | 2013-02-06 | 2014-08-07 | Isola Usa Corp. | Prepregs and Laminates Having Homogeneous Dielectric Properties |
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WO2016053341A1 (en) | 2016-04-07 |
CA2892989A1 (en) | 2015-07-29 |
CN105705558A (zh) | 2016-06-22 |
KR102305618B1 (ko) | 2021-09-29 |
JP2017531731A (ja) | 2017-10-26 |
EP3920193A1 (en) | 2021-12-08 |
SG11201506844YA (en) | 2017-06-29 |
EP3031055B1 (en) | 2021-03-17 |
TW201613993A (en) | 2016-04-16 |
EP3031055A1 (en) | 2016-06-15 |
KR20170063315A (ko) | 2017-06-08 |
CN116854970A (zh) | 2023-10-10 |
TWI628211B (zh) | 2018-07-01 |
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