ATE195378T1 - Photopolymerisierbare, wärmehärtbare harzzusammensetzung - Google Patents

Photopolymerisierbare, wärmehärtbare harzzusammensetzung

Info

Publication number
ATE195378T1
ATE195378T1 AT97928219T AT97928219T ATE195378T1 AT E195378 T1 ATE195378 T1 AT E195378T1 AT 97928219 T AT97928219 T AT 97928219T AT 97928219 T AT97928219 T AT 97928219T AT E195378 T1 ATE195378 T1 AT E195378T1
Authority
AT
Austria
Prior art keywords
reacting
unsaturated
resin composition
photopolymerizable
compound
Prior art date
Application number
AT97928219T
Other languages
English (en)
Inventor
Yasuharu Nojima
Toyoyuki Ido
Original Assignee
Ciba Sc Holding Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ciba Sc Holding Ag filed Critical Ciba Sc Holding Ag
Application granted granted Critical
Publication of ATE195378T1 publication Critical patent/ATE195378T1/de

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Epoxy Resins (AREA)
AT97928219T 1996-06-28 1997-06-17 Photopolymerisierbare, wärmehärtbare harzzusammensetzung ATE195378T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP16923696A JP3254572B2 (ja) 1996-06-28 1996-06-28 光重合性熱硬化性樹脂組成物
PCT/EP1997/003141 WO1998000759A1 (en) 1996-06-28 1997-06-17 Photopolymerizable thermosetting resin composition

Publications (1)

Publication Number Publication Date
ATE195378T1 true ATE195378T1 (de) 2000-08-15

Family

ID=15882768

Family Applications (1)

Application Number Title Priority Date Filing Date
AT97928219T ATE195378T1 (de) 1996-06-28 1997-06-17 Photopolymerisierbare, wärmehärtbare harzzusammensetzung

Country Status (9)

Country Link
US (1) US6399277B1 (de)
EP (1) EP0909407B1 (de)
JP (1) JP3254572B2 (de)
CN (1) CN1179244C (de)
AT (1) ATE195378T1 (de)
AU (1) AU3259797A (de)
DE (1) DE69702767T2 (de)
TW (1) TW448191B (de)
WO (1) WO1998000759A1 (de)

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JP4267974B2 (ja) * 2003-07-10 2009-05-27 日本メクトロン株式会社 回路基板及びその製造法
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JP4683182B2 (ja) * 2004-09-28 2011-05-11 山栄化学株式会社 感光性熱硬化性樹脂組成物、並びにレジスト被覆プリント配線板及びその製造法
TW200630447A (en) * 2004-11-19 2006-09-01 Showa Denko Kk Resin cured film for flexible printed wiring board and production process thereof
JP5330633B2 (ja) * 2005-04-28 2013-10-30 日立化成株式会社 樹脂組成物、及びそれを用いた光学部材とその製造方法
KR100845697B1 (ko) 2005-05-04 2008-07-11 주식회사 엘지화학 유기 전계발광 소자의 절연막용 감방사선성 수지 조성물
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US20140072800A1 (en) * 2012-09-07 2014-03-13 E I Du Pont De Nemours And Company Coated article comprising a curable composition comprising bis-benzoxazine and an amino-functionalized triazine
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JP5797680B2 (ja) * 2013-03-04 2015-10-21 株式会社タムラ製作所 活性エネルギー線硬化性樹脂組成物
JP6332458B2 (ja) * 2014-07-31 2018-05-30 東亞合成株式会社 接着剤層付き積層体、並びに、これを用いたフレキシブル銅張積層板及びフレキシブルフラットケーブル
JP6631536B2 (ja) * 2014-12-02 2020-01-15 Jsr株式会社 フォトレジスト組成物及びその製造方法並びにレジストパターン形成方法
JP6055028B2 (ja) * 2015-05-29 2016-12-27 互応化学工業株式会社 感光性樹脂組成物、ソルダーレジスト用組成物及びプリント配線板
JP6541460B2 (ja) * 2015-06-24 2019-07-10 東京応化工業株式会社 パターン形成方法
CN106318019B (zh) * 2015-07-06 2020-03-17 南亚塑胶工业股份有限公司 印刷电路板用低介电抗焊光阻油墨组合物
KR20180048637A (ko) * 2015-08-26 2018-05-10 나가세케무텍쿠스가부시키가이샤 패터닝 재료, 패터닝 방법, 및 패터닝 장치
JP6331117B2 (ja) * 2016-06-16 2018-05-30 Dic株式会社 エポキシ（メタ）アクリレート樹脂及びレジスト部材
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Also Published As

Publication number Publication date
CN1179244C (zh) 2004-12-08
US6399277B1 (en) 2002-06-04
JP3254572B2 (ja) 2002-02-12
CN1223727A (zh) 1999-07-21
DE69702767T2 (de) 2001-04-12
EP0909407A1 (de) 1999-04-21
JPH1020493A (ja) 1998-01-23
AU3259797A (en) 1998-01-21
DE69702767D1 (de) 2000-09-14
EP0909407B1 (de) 2000-08-09
TW448191B (en) 2001-08-01
WO1998000759A1 (en) 1998-01-08

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