CA2253242A1 - Photopolymerizable thermosetting resin composition - Google Patents
Photopolymerizable thermosetting resin compositionInfo
- Publication number
- CA2253242A1 CA2253242A1 CA002253242A CA2253242A CA2253242A1 CA 2253242 A1 CA2253242 A1 CA 2253242A1 CA 002253242 A CA002253242 A CA 002253242A CA 2253242 A CA2253242 A CA 2253242A CA 2253242 A1 CA2253242 A1 CA 2253242A1
- Authority
- CA
- Canada
- Prior art keywords
- reacting
- unsaturated
- resin composition
- thermosetting resin
- compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Epoxy Resins (AREA)
Abstract
A photopolymerizable thermosetting resin composition comprising a mixture consisting of (a) an active energy ray-setting resin and obtained by reacting an unsaturated monobasic acid copolymer resin with a cycloaliphatic epoxy group-containing unsaturated compound or reacting a cycloaliphatic epoxy group-containing copolymer resin with an acid group-containing unsaturated compound and (b) a photosensitive prepolymer obtained by esterifying a novolak type epoxy compound with an .alpha.-.beta.-unsaturated carboxylic acid and then further reacting with polybasic acid anhydride (and in one embodiment further reacting with an unsaturated isocyanate).
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16923696A JP3254572B2 (en) | 1996-06-28 | 1996-06-28 | Photopolymerizable thermosetting resin composition |
JP8/169236 | 1996-06-28 | ||
PCT/EP1997/003141 WO1998000759A1 (en) | 1996-06-28 | 1997-06-17 | Photopolymerizable thermosetting resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
CA2253242A1 true CA2253242A1 (en) | 1998-01-08 |
CA2253242C CA2253242C (en) | 2007-06-05 |
Family
ID=38137614
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002253242A Expired - Fee Related CA2253242C (en) | 1996-06-28 | 1997-06-17 | Photopolymerizable thermosetting resin composition |
Country Status (1)
Country | Link |
---|---|
CA (1) | CA2253242C (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111116833A (en) * | 2019-12-30 | 2020-05-08 | 先临三维科技股份有限公司 | Resin composition for 3D printing, anti-oxygen polymerization-resistant resin, 3D printing product and preparation method |
CN114525500A (en) * | 2021-12-28 | 2022-05-24 | 南通威斯派尔半导体技术有限公司 | Local silver plating method for copper-clad ceramic substrate |
CN116328739A (en) * | 2023-02-22 | 2023-06-27 | 东洋和光净化材料(江苏)有限公司 | Hydrophobic VOC adsorbent and production method thereof |
CN116954022A (en) * | 2023-07-31 | 2023-10-27 | 广东诚展科技股份有限公司 | Chip carrier plate photosensitive solder resist dry film and forming method thereof |
-
1997
- 1997-06-17 CA CA002253242A patent/CA2253242C/en not_active Expired - Fee Related
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111116833A (en) * | 2019-12-30 | 2020-05-08 | 先临三维科技股份有限公司 | Resin composition for 3D printing, anti-oxygen polymerization-resistant resin, 3D printing product and preparation method |
CN114525500A (en) * | 2021-12-28 | 2022-05-24 | 南通威斯派尔半导体技术有限公司 | Local silver plating method for copper-clad ceramic substrate |
CN114525500B (en) * | 2021-12-28 | 2023-05-05 | 南通威斯派尔半导体技术有限公司 | Local silver plating method for copper-clad ceramic substrate |
CN116328739A (en) * | 2023-02-22 | 2023-06-27 | 东洋和光净化材料(江苏)有限公司 | Hydrophobic VOC adsorbent and production method thereof |
CN116954022A (en) * | 2023-07-31 | 2023-10-27 | 广东诚展科技股份有限公司 | Chip carrier plate photosensitive solder resist dry film and forming method thereof |
CN116954022B (en) * | 2023-07-31 | 2024-02-06 | 广东诚展科技股份有限公司 | Chip carrier plate photosensitive solder resist dry film and forming method thereof |
Also Published As
Publication number | Publication date |
---|---|
CA2253242C (en) | 2007-06-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EEER | Examination request | ||
MKLA | Lapsed |
Effective date: 20140617 |