CA2253242A1 - Photopolymerizable thermosetting resin composition - Google Patents

Photopolymerizable thermosetting resin composition

Info

Publication number
CA2253242A1
CA2253242A1 CA002253242A CA2253242A CA2253242A1 CA 2253242 A1 CA2253242 A1 CA 2253242A1 CA 002253242 A CA002253242 A CA 002253242A CA 2253242 A CA2253242 A CA 2253242A CA 2253242 A1 CA2253242 A1 CA 2253242A1
Authority
CA
Canada
Prior art keywords
reacting
unsaturated
resin composition
thermosetting resin
compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA002253242A
Other languages
French (fr)
Other versions
CA2253242C (en
Inventor
Yasuharu Nojima
Toyoyuki Ido
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huntsman Advanced Materials Switzerland GmbH
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP16923696A external-priority patent/JP3254572B2/en
Application filed by Individual filed Critical Individual
Publication of CA2253242A1 publication Critical patent/CA2253242A1/en
Application granted granted Critical
Publication of CA2253242C publication Critical patent/CA2253242C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Abstract

A photopolymerizable thermosetting resin composition comprising a mixture consisting of (a) an active energy ray-setting resin and obtained by reacting an unsaturated monobasic acid copolymer resin with a cycloaliphatic epoxy group-containing unsaturated compound or reacting a cycloaliphatic epoxy group-containing copolymer resin with an acid group-containing unsaturated compound and (b) a photosensitive prepolymer obtained by esterifying a novolak type epoxy compound with an .alpha.-.beta.-unsaturated carboxylic acid and then further reacting with polybasic acid anhydride (and in one embodiment further reacting with an unsaturated isocyanate).
CA002253242A 1996-06-28 1997-06-17 Photopolymerizable thermosetting resin composition Expired - Fee Related CA2253242C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP8/169236 1996-06-28
JP16923696A JP3254572B2 (en) 1996-06-28 1996-06-28 Photopolymerizable thermosetting resin composition
PCT/EP1997/003141 WO1998000759A1 (en) 1996-06-28 1997-06-17 Photopolymerizable thermosetting resin composition

Publications (2)

Publication Number Publication Date
CA2253242A1 true CA2253242A1 (en) 1998-01-08
CA2253242C CA2253242C (en) 2007-06-05

Family

ID=38137614

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002253242A Expired - Fee Related CA2253242C (en) 1996-06-28 1997-06-17 Photopolymerizable thermosetting resin composition

Country Status (1)

Country Link
CA (1) CA2253242C (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111116833A (en) * 2019-12-30 2020-05-08 先临三维科技股份有限公司 Resin composition for 3D printing, anti-oxygen polymerization-resistant resin, 3D printing product and preparation method
CN114525500A (en) * 2021-12-28 2022-05-24 南通威斯派尔半导体技术有限公司 Local silver plating method for copper-clad ceramic substrate
CN116328739A (en) * 2023-02-22 2023-06-27 东洋和光净化材料(江苏)有限公司 Hydrophobic VOC adsorbent and production method thereof
CN116954022A (en) * 2023-07-31 2023-10-27 广东诚展科技股份有限公司 Chip carrier plate photosensitive solder resist dry film and forming method thereof

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111116833A (en) * 2019-12-30 2020-05-08 先临三维科技股份有限公司 Resin composition for 3D printing, anti-oxygen polymerization-resistant resin, 3D printing product and preparation method
CN114525500A (en) * 2021-12-28 2022-05-24 南通威斯派尔半导体技术有限公司 Local silver plating method for copper-clad ceramic substrate
CN114525500B (en) * 2021-12-28 2023-05-05 南通威斯派尔半导体技术有限公司 Local silver plating method for copper-clad ceramic substrate
CN116328739A (en) * 2023-02-22 2023-06-27 东洋和光净化材料(江苏)有限公司 Hydrophobic VOC adsorbent and production method thereof
CN116954022A (en) * 2023-07-31 2023-10-27 广东诚展科技股份有限公司 Chip carrier plate photosensitive solder resist dry film and forming method thereof
CN116954022B (en) * 2023-07-31 2024-02-06 广东诚展科技股份有限公司 Chip carrier plate photosensitive solder resist dry film and forming method thereof

Also Published As

Publication number Publication date
CA2253242C (en) 2007-06-05

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Legal Events

Date Code Title Description
EEER Examination request
MKLA Lapsed

Effective date: 20140617