ZA200406199B - Method for producing and treating epoxide resin moulding materials. - Google Patents
Method for producing and treating epoxide resin moulding materials. Download PDFInfo
- Publication number
- ZA200406199B ZA200406199B ZA200406199A ZA200406199A ZA200406199B ZA 200406199 B ZA200406199 B ZA 200406199B ZA 200406199 A ZA200406199 A ZA 200406199A ZA 200406199 A ZA200406199 A ZA 200406199A ZA 200406199 B ZA200406199 B ZA 200406199B
- Authority
- ZA
- South Africa
- Prior art keywords
- mixer
- moulding compositions
- moulding
- granules
- hardeners
- Prior art date
Links
- 238000000465 moulding Methods 0.000 title claims description 46
- 239000003822 epoxy resin Substances 0.000 title claims description 28
- 229920000647 polyepoxide Polymers 0.000 title claims description 28
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000000463 material Substances 0.000 title description 5
- 239000000203 mixture Substances 0.000 claims description 47
- 238000000034 method Methods 0.000 claims description 24
- 239000008187 granular material Substances 0.000 claims description 18
- 239000000945 filler Substances 0.000 claims description 15
- 239000004848 polyfunctional curative Substances 0.000 claims description 14
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 11
- 238000002156 mixing Methods 0.000 claims description 9
- 239000000654 additive Substances 0.000 claims description 7
- 238000000265 homogenisation Methods 0.000 claims description 7
- 238000011144 upstream manufacturing Methods 0.000 claims description 7
- 239000000470 constituent Substances 0.000 claims description 6
- 238000002360 preparation method Methods 0.000 claims description 4
- 238000007493 shaping process Methods 0.000 claims description 4
- 230000003068 static effect Effects 0.000 claims description 4
- 238000005538 encapsulation Methods 0.000 claims description 3
- 238000010107 reaction injection moulding Methods 0.000 claims description 3
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 238000009736 wetting Methods 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 150000004982 aromatic amines Chemical class 0.000 description 2
- 239000002775 capsule Substances 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000000977 initiatory effect Effects 0.000 description 2
- 239000004849 latent hardener Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- -1 metal complex compounds Chemical class 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 241000531908 Aramides Species 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920003043 Cellulose fiber Polymers 0.000 description 1
- 241001484259 Lacuna Species 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 150000001925 cycloalkenes Chemical class 0.000 description 1
- WMWXXXSCZVGQAR-UHFFFAOYSA-N dialuminum;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3] WMWXXXSCZVGQAR-UHFFFAOYSA-N 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 239000010459 dolomite Substances 0.000 description 1
- 229910000514 dolomite Inorganic materials 0.000 description 1
- 238000007580 dry-mixing Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002193 fatty amides Chemical class 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229940079865 intestinal antiinfectives imidazole derivative Drugs 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000000049 pigment Chemical class 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 238000009747 press moulding Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/20—Compounding polymers with additives, e.g. colouring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C67/00—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
- B29C67/24—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00 characterised by the choice of material
- B29C67/246—Moulding high reactive monomers or prepolymers, e.g. by reaction injection moulding [RIM], liquid injection moulding [LIM]
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/12—Powdering or granulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2063/00—Use of EP, i.e. epoxy resins or derivatives thereof, as moulding material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2002108644 DE10208644A1 (de) | 2002-02-28 | 2002-02-28 | Verfahren zur Herstellung und Verarbeitung von Epoxidharz-Formmassen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ZA200406199B true ZA200406199B (en) | 2005-09-09 |
Family
ID=27740504
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ZA200406199A ZA200406199B (en) | 2002-02-28 | 2004-08-03 | Method for producing and treating epoxide resin moulding materials. |
Country Status (13)
| Country | Link |
|---|---|
| US (1) | US20060286385A1 (fr) |
| EP (1) | EP1480813A1 (fr) |
| JP (1) | JP2005518957A (fr) |
| KR (1) | KR20040088488A (fr) |
| CN (1) | CN1638947A (fr) |
| AU (1) | AU2003212250B8 (fr) |
| BR (1) | BR0303325A (fr) |
| DE (1) | DE10208644A1 (fr) |
| MX (1) | MXPA04006905A (fr) |
| PL (1) | PL370424A1 (fr) |
| RU (1) | RU2308374C2 (fr) |
| WO (1) | WO2003072339A1 (fr) |
| ZA (1) | ZA200406199B (fr) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2372725B1 (fr) * | 2010-03-26 | 2013-09-11 | ABB Research Ltd. | Production d'une isolation électrique et produits isolés |
| RU2460641C1 (ru) * | 2011-03-15 | 2012-09-10 | Государственное образовательное учреждение высшего профессионального образования "Тихоокеанский государственный университет" | Способ формования изделий из эпоксидной смолы |
| CN102785326A (zh) * | 2011-05-19 | 2012-11-21 | 深圳市安托山特种机电有限公司 | 一种新型封装材料注射机 |
| CN104924593B (zh) * | 2015-07-17 | 2018-02-23 | 威海两岸环保新材料科技有限公司 | 一步法制备聚乳酸薄膜的方法 |
| CN106477969B (zh) * | 2016-09-14 | 2019-03-01 | 九牧厨卫股份有限公司 | 一种制备砂浆的组合物、由其制备的砂浆、包含该砂浆的树脂浆组合物及其制备方法 |
| JP6546623B2 (ja) * | 2017-06-26 | 2019-07-17 | 矢崎総業株式会社 | 端子付き電線の製造方法 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AT350248B (de) * | 1970-06-11 | 1979-05-25 | Rother Dr Franz | Verfahren zur herstellung von formkoerpern aus einer mischung aus anorganischen pulvern und epoxidharz |
| JPS5137152A (ja) * | 1974-09-25 | 1976-03-29 | Tokyo Nippon Yoki Kogyo Kk | Ehokishijushifuntaisoseibutsu |
| JPS5692011A (en) * | 1979-12-26 | 1981-07-25 | Nitto Electric Ind Co Ltd | Production of epoxy resin molding material |
| EP0038292B2 (fr) * | 1980-02-21 | 1993-07-28 | Ciba-Geigy Ag | Utilisation de silicate de calcium synthétique cristallin |
| JPS5924762A (ja) * | 1982-07-31 | 1984-02-08 | Toto Kasei Kk | 速硬化性粉体塗料組成物 |
| JPS6155123A (ja) * | 1984-08-27 | 1986-03-19 | Nitto Electric Ind Co Ltd | 粉末状エポキシ樹脂組成物の製造方法 |
| JPH01129035A (ja) * | 1987-11-12 | 1989-05-22 | Nitto Denko Corp | 粉末状エポキシ樹脂組成物の製造方法 |
| EP0376884A3 (fr) * | 1988-12-21 | 1991-06-05 | Ciba-Geigy Ag | Granulat coulant |
| GB9224854D0 (en) * | 1992-11-27 | 1993-01-13 | Ciba Geigy Ag | Moulding process |
| DE69722106T2 (de) * | 1996-08-29 | 2004-04-01 | Mitsubishi Denki K.K. | Epoxidharzzusammensetzung und damit eingekapselte Halbleiteranordnungen |
| JP4020274B2 (ja) * | 1996-10-07 | 2007-12-12 | ソマール株式会社 | シリカ含有液状エポキシ樹脂組成物及び半導体チップ封止剤 |
| JPH10204262A (ja) * | 1996-11-25 | 1998-08-04 | Somar Corp | 低溶融粘度性エポキシ樹脂粉体組成物の製造方法及びその方法により得られるエポキシ樹脂粉体組成物 |
| US6054222A (en) * | 1997-02-20 | 2000-04-25 | Kabushiki Kaisha Toshiba | Epoxy resin composition, resin-encapsulated semiconductor device using the same, epoxy resin molding material and epoxy resin composite tablet |
| US6093493A (en) * | 1997-07-03 | 2000-07-25 | Ciba Specialty Chemicals Corp. | Method for the coating or encapsulation of fluidizable substrates |
| JP3135926B2 (ja) * | 1997-08-07 | 2001-02-19 | 松下電工株式会社 | 半導体チップをモールドするためのエポキシ樹脂封止材料及びその製造方法 |
| JP4126575B2 (ja) * | 1998-08-24 | 2008-07-30 | Ｄｉｃ株式会社 | 電子部品封止材料の製造方法 |
| JP4229499B2 (ja) * | 1998-11-02 | 2009-02-25 | 富士通マイクロエレクトロニクス株式会社 | 半導体封止用樹脂組成物、その製造方法及び製造装置ならびにそれを使用した半導体装置 |
-
2002
- 2002-02-28 DE DE2002108644 patent/DE10208644A1/de not_active Withdrawn
-
2003
- 2003-02-19 CN CNA03804806XA patent/CN1638947A/zh active Pending
- 2003-02-19 AU AU2003212250A patent/AU2003212250B8/en not_active Ceased
- 2003-02-19 US US10/506,115 patent/US20060286385A1/en not_active Abandoned
- 2003-02-19 EP EP03708109A patent/EP1480813A1/fr not_active Ceased
- 2003-02-19 MX MXPA04006905A patent/MXPA04006905A/es active IP Right Grant
- 2003-02-19 KR KR10-2004-7011715A patent/KR20040088488A/ko not_active Application Discontinuation
- 2003-02-19 WO PCT/EP2003/001639 patent/WO2003072339A1/fr not_active Application Discontinuation
- 2003-02-19 BR BR0303325A patent/BR0303325A/pt not_active IP Right Cessation
- 2003-02-19 PL PL37042403A patent/PL370424A1/xx not_active Application Discontinuation
- 2003-02-19 JP JP2003571069A patent/JP2005518957A/ja active Pending
- 2003-02-19 RU RU2004129283A patent/RU2308374C2/ru active
-
2004
- 2004-08-03 ZA ZA200406199A patent/ZA200406199B/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CN1638947A (zh) | 2005-07-13 |
| RU2308374C2 (ru) | 2007-10-20 |
| AU2003212250B2 (en) | 2008-09-11 |
| KR20040088488A (ko) | 2004-10-16 |
| AU2003212250A1 (en) | 2003-09-09 |
| PL370424A1 (en) | 2005-05-30 |
| MXPA04006905A (es) | 2004-12-06 |
| EP1480813A1 (fr) | 2004-12-01 |
| RU2004129283A (ru) | 2005-08-10 |
| US20060286385A1 (en) | 2006-12-21 |
| AU2003212250B8 (en) | 2009-03-26 |
| WO2003072339A1 (fr) | 2003-09-04 |
| DE10208644A1 (de) | 2003-09-11 |
| BR0303325A (pt) | 2004-03-30 |
| JP2005518957A (ja) | 2005-06-30 |
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