BR0303325A - Processo para produção e processamento de massas de modelar de resina de epóxido - Google Patents

Processo para produção e processamento de massas de modelar de resina de epóxido

Info

Publication number
BR0303325A
BR0303325A BR0303325A BR0303325A BR0303325A BR 0303325 A BR0303325 A BR 0303325A BR 0303325 A BR0303325 A BR 0303325A BR 0303325 A BR0303325 A BR 0303325A BR 0303325 A BR0303325 A BR 0303325A
Authority
BR
Brazil
Prior art keywords
processing
epoxide resin
production
resin molds
epoxide
Prior art date
Application number
BR0303325A
Other languages
English (en)
Inventor
Heinz-Gunter Reichwein
Michael Schwab
Jens Steinmann
Thomas Dressen
Gunda Panik
Frank Bayerl
Original Assignee
Bakelite Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bakelite Ag filed Critical Bakelite Ag
Publication of BR0303325A publication Critical patent/BR0303325A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/20—Compounding polymers with additives, e.g. colouring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C67/00—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
    • B29C67/24—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00 characterised by the choice of material
    • B29C67/246—Moulding high reactive monomers or prepolymers, e.g. by reaction injection moulding [RIM], liquid injection moulding [LIM]
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/12—Powdering or granulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2063/00—Use of EP, i.e. epoxy resins or derivatives thereof, as moulding material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Abstract

"PROCESSO PARA PRODUçãO E PROCESSAMENTO DE MASSAS DE MODELAR DE RESINA DE EPóXIDO". A invenção refere-se a um processo para produção e processamento de massas de moldar de resina de epóxido, sendo que as referidas massas de moldar contêm resinas de epóxido, endurecedores, materiais de enchimento e aditivos. De acordo com o processo de acordo com a invenção, as resinas de epóxido são misturadas e granuladas com os outros ingredientes da massa de moldar em um misturador que compreende ferramentas de mistura de alta velocidade e o material granulado aspergível obtido é homogeneizado sob pressão pouco antes de ser moldado e endurecido.
BR0303325A 2002-02-28 2003-02-19 Processo para produção e processamento de massas de modelar de resina de epóxido BR0303325A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2002108644 DE10208644A1 (de) 2002-02-28 2002-02-28 Verfahren zur Herstellung und Verarbeitung von Epoxidharz-Formmassen
PCT/EP2003/001639 WO2003072339A1 (de) 2002-02-28 2003-02-19 Verfahren zur herstellung und verarbeitung von epoxidharz-formmassen

Publications (1)

Publication Number Publication Date
BR0303325A true BR0303325A (pt) 2004-03-30

Family

ID=27740504

Family Applications (1)

Application Number Title Priority Date Filing Date
BR0303325A BR0303325A (pt) 2002-02-28 2003-02-19 Processo para produção e processamento de massas de modelar de resina de epóxido

Country Status (13)

Country Link
US (1) US20060286385A1 (pt)
EP (1) EP1480813A1 (pt)
JP (1) JP2005518957A (pt)
KR (1) KR20040088488A (pt)
CN (1) CN1638947A (pt)
AU (1) AU2003212250B8 (pt)
BR (1) BR0303325A (pt)
DE (1) DE10208644A1 (pt)
MX (1) MXPA04006905A (pt)
PL (1) PL370424A1 (pt)
RU (1) RU2308374C2 (pt)
WO (1) WO2003072339A1 (pt)
ZA (1) ZA200406199B (pt)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2372725B1 (en) * 2010-03-26 2013-09-11 ABB Research Ltd. Production of electrical insulation and insulated products
RU2460641C1 (ru) * 2011-03-15 2012-09-10 Государственное образовательное учреждение высшего профессионального образования "Тихоокеанский государственный университет" Способ формования изделий из эпоксидной смолы
CN102785326A (zh) * 2011-05-19 2012-11-21 深圳市安托山特种机电有限公司 一种新型封装材料注射机
CN104924593B (zh) * 2015-07-17 2018-02-23 威海两岸环保新材料科技有限公司 一步法制备聚乳酸薄膜的方法
CN106477969B (zh) * 2016-09-14 2019-03-01 九牧厨卫股份有限公司 一种制备砂浆的组合物、由其制备的砂浆、包含该砂浆的树脂浆组合物及其制备方法
JP6546623B2 (ja) * 2017-06-26 2019-07-17 矢崎総業株式会社 端子付き電線の製造方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT350248B (de) * 1970-06-11 1979-05-25 Rother Dr Franz Verfahren zur herstellung von formkoerpern aus einer mischung aus anorganischen pulvern und epoxidharz
JPS5137152A (ja) * 1974-09-25 1976-03-29 Tokyo Nippon Yoki Kogyo Kk Ehokishijushifuntaisoseibutsu
JPS5692011A (en) * 1979-12-26 1981-07-25 Nitto Electric Ind Co Ltd Production of epoxy resin molding material
EP0038292B2 (de) * 1980-02-21 1993-07-28 Ciba-Geigy Ag Verwendung von synthetischem kristallinem Calciumsilikat
JPS5924762A (ja) * 1982-07-31 1984-02-08 Toto Kasei Kk 速硬化性粉体塗料組成物
JPS6155123A (ja) * 1984-08-27 1986-03-19 Nitto Electric Ind Co Ltd 粉末状エポキシ樹脂組成物の製造方法
JPH01129035A (ja) * 1987-11-12 1989-05-22 Nitto Denko Corp 粉末状エポキシ樹脂組成物の製造方法
EP0376884A3 (de) * 1988-12-21 1991-06-05 Ciba-Geigy Ag Rieselfähiges Granulat
GB9224854D0 (en) * 1992-11-27 1993-01-13 Ciba Geigy Ag Moulding process
DE69722106T2 (de) * 1996-08-29 2004-04-01 Mitsubishi Denki K.K. Epoxidharzzusammensetzung und damit eingekapselte Halbleiteranordnungen
JP4020274B2 (ja) * 1996-10-07 2007-12-12 ソマール株式会社 シリカ含有液状エポキシ樹脂組成物及び半導体チップ封止剤
JPH10204262A (ja) * 1996-11-25 1998-08-04 Somar Corp 低溶融粘度性エポキシ樹脂粉体組成物の製造方法及びその方法により得られるエポキシ樹脂粉体組成物
US6054222A (en) * 1997-02-20 2000-04-25 Kabushiki Kaisha Toshiba Epoxy resin composition, resin-encapsulated semiconductor device using the same, epoxy resin molding material and epoxy resin composite tablet
US6093493A (en) * 1997-07-03 2000-07-25 Ciba Specialty Chemicals Corp. Method for the coating or encapsulation of fluidizable substrates
JP3135926B2 (ja) * 1997-08-07 2001-02-19 松下電工株式会社 半導体チップをモールドするためのエポキシ樹脂封止材料及びその製造方法
JP4126575B2 (ja) * 1998-08-24 2008-07-30 Ｄｉｃ株式会社 電子部品封止材料の製造方法
JP4229499B2 (ja) * 1998-11-02 2009-02-25 富士通マイクロエレクトロニクス株式会社 半導体封止用樹脂組成物、その製造方法及び製造装置ならびにそれを使用した半導体装置

Also Published As

Publication number Publication date
CN1638947A (zh) 2005-07-13
RU2308374C2 (ru) 2007-10-20
AU2003212250B2 (en) 2008-09-11
KR20040088488A (ko) 2004-10-16
AU2003212250A1 (en) 2003-09-09
PL370424A1 (en) 2005-05-30
MXPA04006905A (es) 2004-12-06
EP1480813A1 (de) 2004-12-01
RU2004129283A (ru) 2005-08-10
US20060286385A1 (en) 2006-12-21
ZA200406199B (en) 2005-09-09
AU2003212250B8 (en) 2009-03-26
WO2003072339A1 (de) 2003-09-04
DE10208644A1 (de) 2003-09-11
JP2005518957A (ja) 2005-06-30

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Legal Events

Date Code Title Description
B08F Application fees: application dismissed [chapter 8.6 patent gazette]

Free format text: REFERENTE 8A. ANUIDADE(S).

B25D Requested change of name of applicant approved

Owner name: HEXION SPECIALTY CHEMICALS GMBH (DE)

Free format text: NOME ALTERADO DE: BAKELITE AG

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: NAO APRESENTADA A GUIA DE CUMPRIMENTO DE EXIGENCIA. REFERENTE A 8A ANUIDADE.