JPS5692011A - Production of epoxy resin molding material - Google Patents

Production of epoxy resin molding material

Info

Publication number
JPS5692011A
JPS5692011A JP17372679A JP17372679A JPS5692011A JP S5692011 A JPS5692011 A JP S5692011A JP 17372679 A JP17372679 A JP 17372679A JP 17372679 A JP17372679 A JP 17372679A JP S5692011 A JPS5692011 A JP S5692011A
Authority
JP
Japan
Prior art keywords
resin
epoxy resin
lubricant
powder
molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17372679A
Other languages
Japanese (ja)
Inventor
Katsumi Shimada
Mikio Aizawa
Takashi Ogawa
Kazuo Iko
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP17372679A priority Critical patent/JPS5692011A/en
Publication of JPS5692011A publication Critical patent/JPS5692011A/en
Pending legal-status Critical Current

Links

Landscapes

  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE: To prevent resin from attaching to a cold working equipment by a method wherein only part of the mold lubricant is mixed with the resin at the step of powder adjustment and the residue of the mold lubricant is dry-blended with this powder.
CONSTITUTION: At the 1st process where epoxy resin and other compound components are fused, mixed, cooled and pulverized, the whole quantity of the molding lubricant is not mixed but part of it only is used as one of the compound components other than the epoxy resin, the residual lubricant is dry-blended with the powder obtained at the 1st process is the form of fine powder. This blended powder is supplied to the 2nd process so as to be changed into tablets in cold working, the molding lubricant in more quantity and in more uniformity than before is attached to the surface of the resin to prevent effectively the resin from attaching to the cold working equipment. Thus, the tabletized epoxy resin molding material is produced that is applied to compression molding such as transfer molding used for sealing a semiconductor.
COPYRIGHT: (C)1981,JPO&Japio
JP17372679A 1979-12-26 1979-12-26 Production of epoxy resin molding material Pending JPS5692011A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17372679A JPS5692011A (en) 1979-12-26 1979-12-26 Production of epoxy resin molding material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17372679A JPS5692011A (en) 1979-12-26 1979-12-26 Production of epoxy resin molding material

Publications (1)

Publication Number Publication Date
JPS5692011A true JPS5692011A (en) 1981-07-25

Family

ID=15965997

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17372679A Pending JPS5692011A (en) 1979-12-26 1979-12-26 Production of epoxy resin molding material

Country Status (1)

Country Link
JP (1) JPS5692011A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6047032A (en) * 1983-08-24 1985-03-14 Oki Electric Ind Co Ltd Production of tablet
WO1997002596A1 (en) * 1995-06-30 1997-01-23 Kabushiki Kaisha Toshiba Electronic component and method of production thereof
WO2003072339A1 (en) * 2002-02-28 2003-09-04 Bakelite Ag Method for producing and treating epoxide resin moulding materials

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6047032A (en) * 1983-08-24 1985-03-14 Oki Electric Ind Co Ltd Production of tablet
WO1997002596A1 (en) * 1995-06-30 1997-01-23 Kabushiki Kaisha Toshiba Electronic component and method of production thereof
US6262513B1 (en) 1995-06-30 2001-07-17 Kabushiki Kaisha Toshiba Electronic component and method of production thereof
US6628043B2 (en) 1995-06-30 2003-09-30 Kabushiki Kaisha Toshiba Electronic component and method of production thereof
US6754950B2 (en) 1995-06-30 2004-06-29 Kabushiki Kaisha Toshiba Electronic component and method of production thereof
WO2003072339A1 (en) * 2002-02-28 2003-09-04 Bakelite Ag Method for producing and treating epoxide resin moulding materials

Similar Documents

Publication Publication Date Title
JPS5265111A (en) Production process of wear-resisting material
JPS5692011A (en) Production of epoxy resin molding material
JPS5638386A (en) Method of adjusting mixing proportion of coals for coke production
JPS5670880A (en) Preparation of composite layered slide material made of synthetic resin
JPS5437005A (en) Release agent
JPS55145770A (en) Manufacture of epoxy resin powder coating composition
CH680251GA3 (en)
JPS56114589A (en) Manufacture of metallic product with hole
ES8500302A1 (en) Mouldable composition and shaped product produced therefrom.
JPS5542204A (en) Production of lead titanate powder
JPS5443807A (en) Preparation of sintered gear of high precision
GB960008A (en) Intermetallic compound-compositions and bodies composed thereof and method of making the same
JPS5635701A (en) Production of high accuracy iron-base sintered parts
JPS563603A (en) Production of superhard alloy case
JPS57147484A (en) Method for applying lining
JPS52113400A (en) Wafer-shaped doping material based on aluminum metaphosphate and produ ction thereof
JPS57188628A (en) Manufacture of sintered material
JPS5374295A (en) Production method of magnet associated with tempetature compensation chip
JPS5423604A (en) Production of molded coal
JPS5625902A (en) Tungsten material
JPS5263248A (en) Preparation of ferrite compositions
JPS569207A (en) Manufacture of carbon product
JPS5714013A (en) Preparation of epoxy resin molding powder
JPS52142389A (en) Cubic crystalline boron nitride grinding member and process for preparing the same
JPS5693831A (en) Production of sintered iron ore