JPS5692011A - Production of epoxy resin molding material - Google Patents
Production of epoxy resin molding materialInfo
- Publication number
- JPS5692011A JPS5692011A JP17372679A JP17372679A JPS5692011A JP S5692011 A JPS5692011 A JP S5692011A JP 17372679 A JP17372679 A JP 17372679A JP 17372679 A JP17372679 A JP 17372679A JP S5692011 A JPS5692011 A JP S5692011A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- epoxy resin
- lubricant
- powder
- molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
PURPOSE: To prevent resin from attaching to a cold working equipment by a method wherein only part of the mold lubricant is mixed with the resin at the step of powder adjustment and the residue of the mold lubricant is dry-blended with this powder.
CONSTITUTION: At the 1st process where epoxy resin and other compound components are fused, mixed, cooled and pulverized, the whole quantity of the molding lubricant is not mixed but part of it only is used as one of the compound components other than the epoxy resin, the residual lubricant is dry-blended with the powder obtained at the 1st process is the form of fine powder. This blended powder is supplied to the 2nd process so as to be changed into tablets in cold working, the molding lubricant in more quantity and in more uniformity than before is attached to the surface of the resin to prevent effectively the resin from attaching to the cold working equipment. Thus, the tabletized epoxy resin molding material is produced that is applied to compression molding such as transfer molding used for sealing a semiconductor.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17372679A JPS5692011A (en) | 1979-12-26 | 1979-12-26 | Production of epoxy resin molding material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17372679A JPS5692011A (en) | 1979-12-26 | 1979-12-26 | Production of epoxy resin molding material |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5692011A true JPS5692011A (en) | 1981-07-25 |
Family
ID=15965997
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17372679A Pending JPS5692011A (en) | 1979-12-26 | 1979-12-26 | Production of epoxy resin molding material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5692011A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6047032A (en) * | 1983-08-24 | 1985-03-14 | Oki Electric Ind Co Ltd | Production of tablet |
WO1997002596A1 (en) * | 1995-06-30 | 1997-01-23 | Kabushiki Kaisha Toshiba | Electronic component and method of production thereof |
WO2003072339A1 (en) * | 2002-02-28 | 2003-09-04 | Bakelite Ag | Method for producing and treating epoxide resin moulding materials |
-
1979
- 1979-12-26 JP JP17372679A patent/JPS5692011A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6047032A (en) * | 1983-08-24 | 1985-03-14 | Oki Electric Ind Co Ltd | Production of tablet |
WO1997002596A1 (en) * | 1995-06-30 | 1997-01-23 | Kabushiki Kaisha Toshiba | Electronic component and method of production thereof |
US6262513B1 (en) | 1995-06-30 | 2001-07-17 | Kabushiki Kaisha Toshiba | Electronic component and method of production thereof |
US6628043B2 (en) | 1995-06-30 | 2003-09-30 | Kabushiki Kaisha Toshiba | Electronic component and method of production thereof |
US6754950B2 (en) | 1995-06-30 | 2004-06-29 | Kabushiki Kaisha Toshiba | Electronic component and method of production thereof |
WO2003072339A1 (en) * | 2002-02-28 | 2003-09-04 | Bakelite Ag | Method for producing and treating epoxide resin moulding materials |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5265111A (en) | Production process of wear-resisting material | |
JPS5692011A (en) | Production of epoxy resin molding material | |
JPS5638386A (en) | Method of adjusting mixing proportion of coals for coke production | |
JPS5670880A (en) | Preparation of composite layered slide material made of synthetic resin | |
JPS5437005A (en) | Release agent | |
JPS55145770A (en) | Manufacture of epoxy resin powder coating composition | |
CH680251GA3 (en) | ||
JPS56114589A (en) | Manufacture of metallic product with hole | |
ES8500302A1 (en) | Mouldable composition and shaped product produced therefrom. | |
JPS5542204A (en) | Production of lead titanate powder | |
JPS5443807A (en) | Preparation of sintered gear of high precision | |
GB960008A (en) | Intermetallic compound-compositions and bodies composed thereof and method of making the same | |
JPS5635701A (en) | Production of high accuracy iron-base sintered parts | |
JPS563603A (en) | Production of superhard alloy case | |
JPS57147484A (en) | Method for applying lining | |
JPS52113400A (en) | Wafer-shaped doping material based on aluminum metaphosphate and produ ction thereof | |
JPS57188628A (en) | Manufacture of sintered material | |
JPS5374295A (en) | Production method of magnet associated with tempetature compensation chip | |
JPS5423604A (en) | Production of molded coal | |
JPS5625902A (en) | Tungsten material | |
JPS5263248A (en) | Preparation of ferrite compositions | |
JPS569207A (en) | Manufacture of carbon product | |
JPS5714013A (en) | Preparation of epoxy resin molding powder | |
JPS52142389A (en) | Cubic crystalline boron nitride grinding member and process for preparing the same | |
JPS5693831A (en) | Production of sintered iron ore |