WO2021164606A1 - 注塑模具及注塑方法 - Google Patents

注塑模具及注塑方法 Download PDF

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Publication number
WO2021164606A1
WO2021164606A1 PCT/CN2021/075943 CN2021075943W WO2021164606A1 WO 2021164606 A1 WO2021164606 A1 WO 2021164606A1 CN 2021075943 W CN2021075943 W CN 2021075943W WO 2021164606 A1 WO2021164606 A1 WO 2021164606A1
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WO
WIPO (PCT)
Prior art keywords
injection
substrate
chip
chassis
cavity
Prior art date
Application number
PCT/CN2021/075943
Other languages
English (en)
French (fr)
Inventor
何军
刘杰
全昌镐
应战
Original Assignee
长鑫存储技术有限公司
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Filing date
Publication date
Application filed by 长鑫存储技术有限公司 filed Critical 长鑫存储技术有限公司
Publication of WO2021164606A1 publication Critical patent/WO2021164606A1/zh
Priority to US17/472,814 priority Critical patent/US20210402660A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/27—Sprue channels ; Runner channels or runner nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/561—Batch processing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0025—Preventing defects on the moulded article, e.g. weld lines, shrinkage marks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14311—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles using means for bonding the coating to the articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/2602—Mould construction elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14311—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles using means for bonding the coating to the articles
    • B29C2045/14327—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles using means for bonding the coating to the articles anchoring by forcing the material to pass through a hole in the article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof

Definitions

  • the invention relates to the field of chip packaging, in particular to an injection mold and an injection method.
  • the packaged chip needs to be wrapped by injection molding to protect the chip.
  • the chip and the substrate are connected to the circuit on the substrate through solder balls.
  • the plastic packaging process it is necessary to wrap the entire chip with a plastic molding compound to fill the gap between the chip and the substrate. Since the chip and the substrate are directly connected by solder balls, the gap is small and the distance between the solder balls is also small. Therefore, the air is not easily discharged when the plastic compound is filled, and the problem of unreliable packaging structure is prone to occur.
  • the technical problem to be solved by the present invention is to provide an injection mold and an injection method to improve the reliability of the packaged chip after injection.
  • the present invention provides an injection mold including a chassis for placing a packaged chip to be injected, the packaged chip including a substrate and at least one chip fixed on the surface of the substrate through a flip-chip process, so The substrate has a through hole; a glue injection channel is formed in the chassis for injecting plastic molding compound, and the glue injection channel communicates with the through hole on the substrate.
  • the glue injection channel includes a plurality of discrete glue holes or grooves penetrating through the chassis.
  • one end of the glue injection channel has a first opening on the side of the chassis that contacts the packaged chip and has a through hole connected to the substrate, and the other end has a second opening on the side of the chassis that is away from the packaged chip. Opening for injecting molding compound.
  • the second opening is located at the bottom or side wall of the chassis.
  • the area of the second opening of the glue injection channel is greater than or equal to the area of the first opening.
  • the area of the first opening of the glue injection channel is greater than or equal to the area of the through hole on the substrate.
  • a cover for covering on the chassis to form a cavity with the chassis, and the cavity is used for accommodating the packaged chip to be injection molded.
  • the cover has at least two openings, and the openings communicate with the cavity and the outside, and are used to inject plastic molding material into the cavity from the outside or to discharge the cavity to the outside. air.
  • the technical solution of the present invention also provides an injection molding method, including: providing the above-mentioned injection mold and a packaged chip to be plasticized.
  • the packaged chip includes a substrate and at least one chip fixed on the surface of the substrate through a flip-chip process.
  • the substrate has a through hole; the packaged chip is placed on the chassis of the injection mold and the cover is covered on the chassis to form a cavity, the packaged chip is located in the cavity, and the substrate
  • the back surface is attached to the surface of the chassis, and the through hole on the substrate of the packaged chip communicates with the glue injection channel in the chassis; performing a first injection, and the first injection includes: passing the injection in the chassis The glue channel injects the liquid molding compound into the cavity through the through hole on the substrate or discharges the gas in the cavity.
  • the method further includes: performing a second injection, and the second injection includes: injecting a liquid molding compound into the cavity from an opening on a cover of the injection mold.
  • the first injection is stopped and the second injection is performed until the The cavity is filled.
  • a plastic molding compound is injected into the cavity through more than two openings.
  • At least one through hole is formed in the area of the substrate where each chip of the packaged chip is located.
  • the molding compound is injected into each through hole through the injection channel at the same time or sequentially.
  • the method further includes: after the liquid molding compound fills the cavity, heat treatment is performed to solidify the liquid molding compound.
  • the injection mold of the present invention can inject plastic molding compound into the cavity formed by the mold through the base plate, and the plastic molding compound fills the cavity from the surface of the base plate upward.
  • the substrate of the packaged chip is located on the surface of the chassis, and the plastic molding compound can enter the cavity through the through hole on the substrate.
  • the plastic molding compound first fills the gap between the substrate and the chip, so that During the injection molding process, the gas between the substrate and the chip cannot be discharged and the hole is formed to affect the connection performance between the substrate and the chip, and the injection molding effect is improved.
  • the injection molding method of the present invention first injects the plastic molding compound into the cavity through the plastic injection channel on the injection mold chassis and the through hole on the package chip substrate.
  • the plastic molding compound is filled from the surface of the substrate toward the chip direction.
  • the space above the chip is fully filled; and then the plastic molding compound is injected into the cavity above the chip, so as to avoid the problem of holes between the chip and the substrate that the gas cannot be discharged.
  • FIGS. 1A to 1B are structural schematic diagrams of a chassis of an injection mold according to a specific embodiment of the present invention.
  • FIG. 2 is a schematic diagram of the structure of an injection mold according to a specific embodiment of the present invention.
  • FIGS. 3A to 3B are structural schematic diagrams of a chassis according to a specific embodiment of the present invention.
  • 4 to 6 are schematic structural diagrams of an injection molding process in a specific embodiment of the present invention.
  • the inventor proposes a new injection mold and injection method to improve the above problems.
  • FIGS. 1A to 1B are schematic structural diagrams of an injection mold according to a specific embodiment of the present invention.
  • FIG. 1A is a schematic top view of the chassis 100 of the injection mold;
  • the injection mold includes a chassis 100, the chassis 100 is used to place the packaged chips to be injection molded, and a plastic injection hole 101 is formed in the chassis 100, and the plastic injection hole 101 is used to inject plastic into the injection mold from the outside. material.
  • the outside refers to the outside of the injection mold.
  • a plurality of discrete injection holes 101 penetrate through the chassis 100 and serve as injection channels in the chassis 100.
  • the cross section of the glue injection hole 101 in a direction parallel to the surface of the chassis 101, is circular.
  • the cross section of the glue hole 101 may be polygonal. , Ellipse, rectangle and other shapes.
  • the glue injection channel may also be in the shape of a long groove, which is used to connect multiple through holes on the package chip substrate at the same time, so as to inject molding compound into the multiple through holes at the same time.
  • the packaged chip to be injection molded includes a substrate and at least one chip fixed on the surface of the substrate through a flip-chip process, and the substrate has a through hole.
  • the plastic injection holes 101 are distributed in an array, corresponding to the through holes on the packaged chip to be injection molded.
  • the plastic injection holes 101 and The through holes on the substrate communicate with each other.
  • the number of the injection holes 101 may be greater than the number of the through holes, so as to adapt to more types of packaged chips. Those skilled in the art can reasonably set the distribution of the glue injection holes 101 according to actual needs.
  • the injection mold further includes a cover 200, the cover 200 is used to cover the chassis 100, and a cavity 201 is formed between the cover 200 and the chassis 100.
  • the cavity 201 is used for Hold the packaged chip to be injection molded.
  • a plastic molding compound can be injected into the cavity 201 through the injection hole 100 in the chassis 100 to plastic-encapsulate the packaged chip placed in the cavity 201.
  • the area of the injection port 101 in the chassis 100 along the molding compound injection direction is larger than Or equal to the area of the outflow port, so as to appropriately slow down the flow rate of the molding compound into the mold, and avoid the large impact force on the packaged chip due to the excessive flow rate of the molding compound during the injection molding process, resulting in separation between the chip and the substrate.
  • the glue injection hole 101 includes two parts with different diameters, the part with a larger diameter is located at the injection end, and the part with a smaller diameter is located at the outflow end.
  • the glue injection hole 101 may also be a conical hole with inclined side walls; or the cross-sectional area of each position of the glue injection hole 101 is the same.
  • the cover 200 has an opening as an injection hole 202 for injecting a plastic molding compound into the cavity 201.
  • the cover 200 may have more than two injection holes 202, and the molding compound can be injected into the cavity through the two or more injection holes 202, which can improve efficiency.
  • At least two openings are formed on the cover 200, which are used to inject plastic molding compound into the cavity or discharge gas in the cavity, which can be set according to specific conditions.
  • the cover 200 may also be formed with a specific opening as an air outlet (not shown in the figure) for connecting the cavity 201 with the outside of the injection mold, and for injecting a plastic molding compound into the cavity 201 During the process, the gas in the cavity 201 is discharged to the outside.
  • a specific opening as an air outlet (not shown in the figure) for connecting the cavity 201 with the outside of the injection mold, and for injecting a plastic molding compound into the cavity 201 During the process, the gas in the cavity 201 is discharged to the outside.
  • the cover 200 is formed with at least two openings, which are used to inject plastic molding compound into the cavity or discharge the gas in the cavity. Function to be set.
  • one end of the glue injection channel has a first opening on the side of the chassis that contacts the packaged chip, and the other end is on the side of the chassis that is away from the packaged chip.
  • FIGS. 3A to 3B are schematic structural diagrams of a chassis 300 according to another specific embodiment of the present invention.
  • a plurality of groups of injection channels 310 are formed in the chassis 300, and each group of injection channels 310 is used to communicate with the through holes in the same row on the packaged chip substrate.
  • the chassis 300 includes a front surface and a back surface opposite to each other.
  • the front surface is the surface contacting the packaged chip
  • the back surface is the surface away from the packaged chip.
  • the glue injection channel 310 includes a first opening on the back of the chassis 300 as a glue injection port 303, a glue pipe 302 connected to the glue port 303 in the chassis 300, and a glue injection pipe 302 located on the front of the chassis 300
  • a number of second openings, namely the glue outlet 301, one end of the glue outlet 301 is connected to the glue injection pipeline 302, and the other end is connected to the through hole on the substrate of the packaged chip.
  • the glue outlet 301 serves as the outflow end of the plastic compound
  • the glue injection port 303 serves as the inflow end of the plastic compound.
  • One glue injection port 303 can be used to inject molding compound into the glue outlet 301 at multiple locations, so that the molding compound injection efficiency can be improved.
  • the glue injection channel in the chassis 300 can also be connected to all glue outlets through a glue injection pipeline, so that the plastic can be injected into the glue outlets at all positions in the chassis 300 at the same time. It includes one or more glue injection ports to communicate with the glue injection pipeline.
  • the glue injection port 303 is located on the back of the chassis 300; in other specific embodiments, the glue injection port 303 may also be formed at the side wall of the chassis 300, and the glue injection
  • the position of the port 303 and the specific communication form of the glue injection pipeline 302 are not limited here.
  • the area of the plastic material outflow port of the glue injection channel in the chassis is greater than or equal to the area of the through hole on the substrate, even if the position of the through hole and the plastic material flow There is a certain offset between the outlets, but due to the large area of the plastic material outlet, there will still be an overlap with the through hole, which can ensure that the plastic material can be injected into the cover and the through hole through the through hole. In the cavity between the chassis.
  • the injection mold of the above specific embodiment can inject the plastic molding compound into the cavity formed by the mold through the base plate, and the plastic molding compound fills the cavity from the surface of the base plate upward.
  • the substrate of the packaged chip is located on the surface of the chassis, and the plastic molding compound can enter the cavity through the through hole on the substrate.
  • the plastic molding compound first fills the gap between the substrate and the chip, so that During the injection molding process, the gas between the substrate and the chip cannot be discharged and the hole is formed to affect the connection performance between the substrate and the chip, and the injection molding effect is improved.
  • the specific embodiment of the present invention also provides an injection molding method using the above injection mold.
  • FIG. 4 to FIG. 6, are schematic diagrams of the injection molding process of the present invention.
  • FIG. 4 Please refer to FIG. 4 to provide an injection mold 400 and a packaged chip 430 to be plasticized.
  • the injection mold 400 includes a base plate 410 and a cover 420.
  • a glue injection channel 411 is formed in the base plate 410, and the cover 420 has an injection port 421.
  • the specific structure of the injection mold 400 please refer to the description in the foregoing specific embodiments, which will not be repeated here.
  • the packaged chip 430 includes a substrate 431 and at least one chip 432 fixed on the surface of the substrate 431 through a flip-chip process.
  • the substrate 431 has a through hole 433;
  • the cover 420 is covered on the surface of the chassis 410 to form a cavity 440, the packaged chip 430 is located in the cavity 440, the back surface of the substrate 431 is attached to the surface of the chassis 410, and the packaged chip At least part of the through holes 433 on the base plate 431 of the 430 communicate with the glue injection channel 411 in the chassis 410.
  • the substrate 431 of the packaged chip 430 is a circuit board, which is formed with electrical connection structures such as circuits and solder pads.
  • a number of chips 432 are packaged on the surface through flip-chip technology. The chips 432 are placed upside down on the surface of the substrate 431 through solder balls. An electrical connection is formed with the electrical connection structure on the surface of the substrate 431.
  • At least one through hole 433 is formed in the area of the substrate where each chip 432 of the packaged chip 430 is located. At least a part of the through hole 433 and the glue injection channel 411 in the chassis 410 pass through the glue injection channel 411. And the through hole 433 injects plastic molding compound into the cavity 440. Preferably, all the air holes 433 in the base plate 431 are communicated with the glue injection channel 411 in the bottom plate 410, which is convenient to improve the injection efficiency of the plastic molding compound.
  • the through hole 433 is a round hole, and the size is slightly smaller than the plastic material outflow port of the glue injection channel 411 in the chassis 410.
  • the first injection includes: injecting the liquid molding compound 500 into the cavity 440 through the injection channel 411 in the bottom plate 410 and the through hole 433 on the substrate 431 .
  • the molding compound 500 may be injected into each through hole 433 through the injection channel 411 at the same time or sequentially.
  • the molding compound 500 can be injected sequentially, and the gap between the chip 432 and the substrate 431 above the through hole 433 connected with the current glue injection channel 411 is filled. After that, the glue injection channel 411 is injected again. In other specific embodiments, the molding compound 500 may also be injected into each injection channel 411 at the same time.
  • the flow direction of the molding compound is toward the chip 432, when the molding compound 500 is filled between the chip 432 and the substrate 431 As the molding compound 500 continues to be filled, a force is applied to the chip 432 to make the chip 431 move away from the substrate 431. Therefore, if the injection flow rate of the plastic compound is too large, the reliability of the connection between the chip 432 and the substrate 431 will be reduced, which may damage the solder balls between the chip 432 and the substrate 431, and cause the chip 432 to fall off. The electrical connection with the substrate 431 fails.
  • the injection flow rate needs to be controlled. Specifically, during the first injection process, the injection pressure of the molding compound 500 flowing into the cavity 440 from each through hole 433 can be controlled to be in the range of 7E6Pa to 1E7Pa.
  • the second injection includes: injecting the liquid molding compound 500 into the cavity 440 from the injection hole 421 on the cover 420 of the injection mold 400.
  • the cover 420 has more than two injection holes 421, the plastic molding compound can be injected into the cavity through the two or more injection holes 421 to improve the injection efficiency.
  • the injection hole 421 is located on the side wall of the cover 400; in other specific embodiments, the injection hole 421 may also be located on the top of the cover 400.
  • the plastic compound is injected from the top of the chip 432, and the plastic compound applies pressure to the chip 432 toward the substrate 431, which will not cause the chip 432 to separate from the substrate 431. Therefore, the second injection can be appropriately increased.
  • the flow rate of the molding compound in the second injection is greater than the flow rate of the molding compound injected in the first, which improves the injection efficiency.
  • the gas in the upper part of the cavity 440 can be discharged through the air outlet on the cover 420.
  • the second injection may be performed while the first injection is being performed, and the flow rate of the second injection may be controlled so that the molding material fringe injected by the second injection is less than the molding material flow rate of the first injection, so that The gap between the chip 432 and the substrate 431 can be filled with the molding compound injected by the first injection process before the upper part of the cavity 440 is filled with the second injection, so that the gap between the chip 432 and the substrate 431 The gas in the gap enters the upper part of the cavity 440 and is discharged through the air hole on the cover 420.
  • the molding compound 600 enters the first air passage 411 from the through hole on the substrate 511, and when the package core 430 is taken out of the mold, the molding compound formed in the through hole 433 is attached to it. Take it out together, so that the back surface of the substrate 431 has a molding compound protrusion, and the molding compound protrusion closes the through hole 433.
  • the packaged chip 430 After the packaged chip 430 is taken out, it further includes forming a solder ball on the other side surface of the substrate 431 of the packaged chip 430.
  • the solder ball is connected to the chip 432 on the front of the substrate 431 through the electrical connection structure in the substrate 431. An electrical connection is formed between them; then, the substrate 431 is cut to form a packaged chip including a single chip 432 after injection.
  • the plastic compound is injected into the cavity through the injection channel on the injection mold chassis and the through hole on the package chip substrate.
  • the plastic compound is filled from the surface of the substrate toward the chip.
  • the space between the chip and the substrate can be filled first.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

本发明涉及一种注塑模具及一种注塑方法，所述注塑模具包括：底盘，用于放置待注塑的封装芯片，所述封装芯片包括基板及通过倒装工艺固定于所述基板表面的至少一个芯片，所述基板上具有通孔；所述底盘内形成有注胶通道，用于注入塑封料，所述注胶通道与所述基板上的通孔连通。上述注塑模具能够提高注塑后封装芯片的可靠性。

Description

注塑模具及注塑方法
相关申请引用说明
本申请要求于2020年02月19日递交的中国专利申请号202010102448.X，申请名为“注塑模具及注塑方法”的优先权，其全部内容以引用的形式附录于此。
技术领域
本发明涉及芯片封装领域，尤其涉及一种注塑模具及注塑方法。
背景技术
芯片在封装完成后，需要通过注塑将封装完成后的芯片进行包裹，从而对芯片进行保护。
对于通过倒装工艺(Flip chip)封装的芯片，芯片与基板之间通过焊球与基板上的电路连接。塑封过程，需要将塑封料包裹整个芯片，填充满芯片与基板之间的间隙。由于芯片与基板之间直接通过焊球连接，间隙较小，焊球之间间隔距离也较小，因此，塑封料在填充时空气不易排出，容易出现封装结构不可靠的问题。
现有技术中，为了便于在注塑过程中有利于气体的排出，会在封装基板上设置气孔，从而在注塑过程中，随着塑封料的填充，气体自基板上的气孔排出。但是注塑过程中，所述基板与封装模具的底盘表面贴合，气孔容易被堵住，依旧会存在气体无法排除的问题。
因此，如何在注塑过程中，避免封装体内气体残留，是目前亟待解决的问题。
发明内容
本发明所要解决的技术问题是，提供一种注塑模具及注塑方法，提高注塑后封装芯片的可靠性。
为了解决上述问题，本发明提供了一种注塑模具，包括：底盘，用于放置待注塑的封装芯片，所述封装芯片包括基板及通过倒装工艺固定于所述基板表面的至少一个芯片，所述基板上具有通孔；所述底盘内形成有注胶通道，用于注入塑封料，所述注胶通道与所述基板上的通孔连通。
可选的，所述注胶通道包括若干分立的贯穿所述底盘的注胶孔或注胶槽。
可选的，所述注胶通道的一端在所述底盘接触所述封装芯片的一面具有第一开口连通至所述基板上的通孔，另一端在所述底盘远离封装芯片的一面具有第二开口，用于注入塑封料。
可选的，所述第二开口位于所述底盘的底部或者侧壁。
可选的，所述注胶通道的第二开口的面积大于或等于所述第一开口的面积。
可选的，所述注胶通道的第一开口的面积大于或等于所述基板上通孔的面积。
可选的，包括：封盖，用于盖合于所述底盘上，与所述底盘之间形成空腔，所述空腔用于容纳待注塑的封装芯片。
可选的，所述封盖上具有至少两个开孔，所述开孔连通所述空腔与外界，用于由外界向所述空腔内注入塑封料或者向外界排出所述空腔内的空气。
本发明的技术方案还提供一种注塑方法，包括：提供上述的注塑模具以及待塑封的封装芯片，所述封装芯片包括基板及通过倒装工艺固定于所述基板表面的至少一个芯片，所述基板上具有通孔；将所述封装芯片置于所述注塑模具的底盘上并将封盖盖合于所述底盘上形成空腔，所述封装芯片位于所述空腔内，所述基板的背面与所述底盘表面贴合，且所述封装芯片的基板上的通孔与所述底盘内的注胶通道连通；进行第一注入，所述第一注入包括：通过所述底盘内的注胶通道经过所述基板上的通孔向所述空腔内注入液态塑封料或者排出空腔内的气体。
可选的，还包括：进行第二注入，所述第二注入包括：从所述注塑模具的封盖上的开孔向所述空腔内注入液态塑封料。
可选的，当进行所述第一注入过程中，液态塑封料填充满所述芯片与所述基板之间的空隙时，停止所述第一注入，进行所述第二注入，直至将所述空腔填满。
可选的，通过两个以上所述开孔向所述空腔内注入塑封料。
可选的，所述封装芯片的每个芯片所在的基板区域内形成有至少一个通孔。
可选的，所述第一注入过程中，同时或依次通过所述注胶通道向每个通孔 注入塑封料。
可选的，还包括：当所述液态塑封料填满所述空腔后，进行热处理，使所述液态塑封料固化。
本发明的注塑模具能够通过底盘向模具形成的空腔内注入塑封料，塑封料自底盘表面向上填充所述空腔。封装芯片置于所述空腔内时，封装芯片的基板位于所述底盘表面，塑封料能够通过基板上的通孔进入空腔内，塑封料首先填充满基板与芯片之间的空隙，从而可以避免注塑过程中，基板与芯片之间气体无法排出而形成孔洞影响基板与芯片之间的连接性能，提高注塑效果。
本发明的注塑方法，首先通过注塑模具底盘上的注胶通道以及封装芯片基板上的通孔向空腔内注入塑封料，塑封料自基板表面向芯片方向填充，可以首先将芯片与基板之间的空间充分填满；而后再向芯片上方的空腔注入塑封料，从而可以避免芯片与基板之间气体无法排出，出现孔洞的问题。
附图说明
图1A至图1B为本发明一具体实施方式的注塑模具的底盘的结构示意图；
图2为本发明一具体实施方式的注塑模具的结构示意图；
图3A至图3B为本发明一具体实施方式的底盘的结构示意图；
图4至图6为本发明一具体实施方式的注塑过程的结构示意图。
具体实施方式
如背景技术中所述，现有技术中，在对倒装工艺的封装芯片进行注塑时，容易存在气体无法排出的问题。
为了解决上述问题，发明人提出一种新的注塑模具及注塑方法，以改善上述问题。
下面结合附图对本发明提供的新的注塑模具及注塑方法的具体实施方式做详细说明。
请参考图1A至图1B，为本发明一具体实施方式的注塑模具的结构示意图，其中图1A为注塑模具的底盘100的俯视示意图；图1B为沿图1B中割线AA’的剖面示意图。
所述注塑模具包括底盘100，所述底盘100用于放置待注塑的封装芯片，所述底盘100内形成注胶孔101，所述注胶孔101用于从外界向所述注塑模具 内注入塑封料。所述外界指的是注塑模具的外部。
该具体实施方式中，若干分立的所述注胶孔101，贯穿所述底盘100，作为所述底盘100内的注胶通道。该具体实施方式中，在平行于所述底盘101表面的方向上，所述注胶孔101的横截面为圆形，在其他具体实施方式中，所述注胶孔101的横截面可以为多边形、椭圆形、矩形等其他形状。在其他具体实施方式中，所述注胶通道还可以为长条槽状，用于同时连通封装芯片基板上的多个通孔，以便同时向多个通孔内注入塑封料。
待注塑的封装芯片包括基板及通过倒装工艺固定于所述基板表面的至少一个芯片，所述基板上具有通孔。该具体实施方式中，所述注胶孔101呈阵列分布，与待注塑处理的封装芯片上的通孔一一对应，当封装芯片放置于所述底盘100上时，所述注胶孔101与所述基板上的通孔连通。
在其他具体实施方式中，所述注胶孔101的数量可以大于所述通孔的数量，以适应更多类型的封装芯片。本领域技术人员可以根据实际需求，合理设置所述注胶孔101的分布。
请参考图2，所述注塑模具还包括封盖200，所述封盖200用于盖合于所述底盘100上，与所述底盘100之间形成空腔201，所述空腔201用于容纳待注塑的封装芯片。
可以通过所述底盘100内的注胶孔100，向所述空腔201内注入塑封料，以将置于所述空腔201内的封装芯片进行塑封。
为了便于控制注塑过程中，向所述空腔201内注入的塑封料的流速，该具体实施方式中，所述底盘100内的注胶孔101在沿塑封料注入方向上，注入端口的面积大于或等于流出端口的面积，从而适当减缓塑封料流入模具内部的流速，避免在注塑过程中，由于塑封料流速过大而对封装芯片造成较大的冲击力，导致芯片与基板之间脱离。该具体实施方式中，所述注胶孔101包括两段直径不同的部分，直径较大的部分位于注入端，直径较小的部分位于流出端。
在其他具体实施方式中，所述注胶孔101也可以为圆锥形孔，侧壁倾斜；或者所述注胶孔101各位置处横截面面积相同。
该具体实施方式中，所述封盖200上具有一个开孔，作为注入孔202，用于向所述空腔201内注入塑封料。在其他具体实施方式中，所述封盖200上可 以具有两个以上的注入孔202，通过两个以上注入孔202向空腔内注入塑封料，可以提高效率。所述封盖200上形成有至少两个开孔，用于向所述空腔内注入塑封料或者排出空腔内的气体，可以根据具体情况进行设置。
所述封盖200上还可以形成有特定的开孔，作为出气孔(图中未示出)，用于连通所述空腔201和注塑模具外部，用于在向空腔201内注入塑封料的过程中，向外界排出所述空腔201内的气体。
在其他具体实施方式中，所述封盖200上形成有至少两个开孔，用于向所述空腔内注入塑封料或者排出空腔内的气体，可以根据具体情况对每个开孔的功能进行设置。
在其他具体实施方式中，所述注胶通道的一端在所述底盘接触所述封装芯片的一面具有第一开口连通至所述基板上的通孔，另一端在所述底盘远离封装芯片的一面具有第二开口，用于从外界向所述注塑模具内注入塑封料。所述外界即为注塑模具的外部。
请参考图3A至图3B，为本发明另一具体实施方式的底盘300的结构示意图。
该具体实施方式中，所述底盘300内形成有若干组注胶通道310，每一组注胶通道310用于连通封装芯片基板上位于同一行的通孔。
所述底盘300包括相对的正面与背面，所述正面为与封装芯片接触的表面，所述背面为远离封装芯片的表面。所述注胶通道310包括位于所述底盘300背面的第一开口为注胶口303，位于所述底盘300内连通至所述注胶口303的注胶管路302，以及位于所述底盘300正面的若干第二开口，即出胶口301，所述出胶口301一端连通至所述注胶管路302，另一端用与连通至所述封装芯片的基板上的通孔。所述出胶口301作为塑封料流出端，所述注胶口303作为塑封料流入端。
通过一个注胶口303即可以实现向多个位置处的出胶口301处注入塑封料，从而可以提高塑封料注入效率。
在其他具体实施方式中，所述底盘300内的注胶通道也可以通过一路注胶管路连接至所有的出胶口，从而可以同时向底盘300内所有位置处的出胶口注入塑封料，可以包括一个或多个注胶口与所述注胶管路连通。
该具体实施方式中，所述注胶口303位于所述底盘300的背面；在其他具体实施方式中，所述注胶口303还可以形成于所述底盘300的侧壁处，所述注胶口303的位置，以及所述注胶管路302的具体连通形式在此不作限定。
在本发明的具体实施方式中，较佳的，底盘内的注胶通道的塑封料流出端口的面积大于或等于所述基板上通孔的面积，即便所述通孔位置与所述塑封料流出口之间有一定偏移，但是由于所述塑封料流出口的面积较大，依旧会与所述通孔之间有重叠部分，从而可以确保塑封料能够通过所述通孔被注入封盖与底盘之间的空腔内。
上述具体实施方式的注塑模具，能够通过底盘向模具形成的空腔内注入塑封料，塑封料自底盘表面向上填充所述空腔。封装芯片置于所述空腔内时，封装芯片的基板位于所述底盘表面，塑封料能够通过基板上的通孔进入空腔内，塑封料首先填充满基板与芯片之间的空隙，从而可以避免注塑过程中，基板与芯片之间气体无法排出而形成孔洞影响基板与芯片之间的连接性能，提高注塑效果。
本发明的具体实施方式，还提供一种采用上述注塑模的注塑方法。
请参考图4至图6，为本发明的注塑过程的结构示意图。
请参考图4，提供注塑模具400及待塑封的封装芯片430。
所述注塑模具400包括底盘410和封盖420，所述底盘410内形成有注胶通道411，所述封盖420具有注入口421。所述注塑模具400的具体结构请参考前述具体实施方式中的描述，在此不再赘述。
将待注塑的封装芯片430置于底盘410上，所述封装芯片430包括基板431及通过倒装工艺固定于所述基板431表面的至少一个芯片432，所述基板431上具有通孔433；将封盖420盖合于所述底盘410表面，形成空腔440，所述封装芯片430位于所述空腔440内，所述基板431的背面与所述底盘410表面贴合，且所述封装芯片430的基板431上的至少部分通孔433与所述底盘410内的注胶通道411连通。
所述封装芯片430的基板431为电路板，形成有电路、焊垫等电连接结构，表面通过倒装工艺，封装有若干芯片432，所述芯片432倒置于所述基板431 表面，通过焊球与所述基板431表面的电连接结构形成电性连接。
所述封装芯片430的每个芯片432所在的基板区域内形成有至少一个通孔433，至少其中部分的通孔433与所述底盘410内的注胶通道411，以通过所述注胶通道411以及所述通孔433向所述空腔440内注入塑封料。较佳的，所述基板431内的所有气孔433均与所述底盘410内的注胶通道411连通，便于提高塑封料注入效率。该具体实施方式中，所述通孔433为圆孔，尺寸略小于所述底盘410内的注胶通道411的塑封料流出口。
请参考图5，进行第一注入，所述第一注入包括：通过所述底盘410内的注胶通道411以及所述基板431上的通孔433向所述空腔440内注入液态塑封料500。
所述第一注入过程中，可以同时或依次通过所述注胶通道411向每个所述通孔433注入塑封料500。
该具体实施方式中，由于所述注胶通道411相互独立，可以依次进行塑封料500的注入，在当前注胶通道411连通的通孔433上方的芯片432与基板431之间的间隙被填充满后，再进行注胶通道411的注入。在其他具体实施方式中，也可以同时向各个注胶通道411注入塑封料500。
由于通过底盘310内的注胶通道411向所述空腔440注入塑封料时，塑封料的流动方向朝向所述芯片432，在所述塑封料500填充于所述芯片432与基板431之间时，随着塑封料500的持续填充，会对所述芯片432施加一个使得芯片431背离基板431方向的作用力。因此，若所述塑封料的注入流速过大，会使得芯片432与基板431之间的连接处可靠性降低，有可能会损坏所述芯片432与基板431之间的焊球脱落，导致芯片432与基板431之间的电连接失效。
因此，在注入塑封料500的过程中，需要控制注入的流速。具体的，可以在所述第一注入过程中，控制从每个通孔433流入所述腔体440内的塑封料500的注塑压强范围为7E6Pa～1E7Pa。
请参考图6，当进行所述第一注入过程中，液态塑封料填充满所述芯片432与所述基板431之间的空隙时，停止所述第一注入；进行第二注入，直至塑封料500将所述空腔440(请参考图5)填满。
所述第二注入包括：从所述注塑模具400的封盖420上的注入孔421向所 述空腔440内注入液态塑封料500。当所述封盖420上具有两个以上注入孔421时，可以通过两个以上所述注入孔421向所述空腔内注入塑封料，以提高注入效率。
该具体实施方式中，所述注入孔421位于所述封盖400的侧壁；在其他具体实施方式中，所述注入孔421还可以位于所述封盖400的顶部。
由于第二注入过程中，塑封料自芯片432的顶部注入，塑封料对芯片432施加朝向基板431的压力，不会导致芯片432与所述基板431脱离，因此，可以适当提高所述第二注入的塑封料流速，第二注入的塑封料流速大于第一注入的塑封料流速，提高注塑效率。
在第二注入过程中，空腔440上部分的气体，可以通过封盖420上的出气孔排出。
在其他具体实施方式中，也可以在进行第一注入的同时，进行第二注入，控制所述第二注入的流速，使得第二注入的塑封料流苏小于第一注入的塑封料流速，使得所述芯片432与所述基板431之间的间隙能够在空腔440上部分被第二注入填充满之前，被第一注入过程注入的塑封料填充满，使得芯片432与所述基板431之间的间隙内的气体均进入空腔440上部，通过封盖420上的气孔排出。
当液态塑封料填满所述空腔后，进行热处理，使所述液态塑封料500固化；将被固化的所述塑封料包裹的封装芯片510自所述封装模具内取出。
该具体实施方式中，塑封过程中，塑封料600从基板511上通孔进入第一气道411内，将封装芯430自模具中取出时，会连带形成于所述通孔433内的塑封料一起取出，使得所述基板431背面具有塑封料凸起，所述塑封料凸起将所述通孔433封闭。
封装芯片430取出后，还包括在所述封装芯片430的基板431的另一侧表面形成焊球，所述焊球通过所述基板431内的电连接结构与所述基板431正面的芯片432之间形成电连接；然后，将所述基板431进行切割，形成包括单颗芯片432的注塑后封装芯片。
上述注塑方法，首先通过注塑模具底盘上的注胶通道以及封装芯片基板上的通孔向空腔内注入塑封料，塑封料自基板表面向芯片方向填充，可以首先将 芯片与基板之间的空间充分填满；而后再向芯片上方的空腔注入塑封料，从而可以避免芯片与基板之间气体无法排出，出现孔洞的问题。
以上所述仅是本发明的优选实施方式，应当指出，对于本技术领域的普通技术人员，在不脱离本发明原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本发明的保护范围。

Claims (15)

  1. 一种注塑模具，其中，包括：
    底盘，用于放置待注塑的封装芯片，所述封装芯片包括基板及通过倒装工艺固定于所述基板表面的至少一个芯片，所述基板上具有通孔；
    所述底盘内形成有注胶通道，用于注入塑封料，所述注胶通道与所述基板上的通孔连通。
  2. 根据权利要求1所述的注塑模具，其中，所述注胶通道包括若干分立的贯穿所述底盘的注胶孔或注胶槽。
  3. 根据权利要求1所述的注塑模具，其中，所述注胶通道的一端在所述底盘接触所述封装芯片的一面具有第一开口连通至所述基板上的通孔，另一端在所述底盘远离所述封装芯片的一面具有第二开口，用于从外界向所述注塑模具内注入塑封料。
  4. 根据权利要求3所述的注塑模具，其中，所述第二开口位于所述底盘的底部或者侧壁。
  5. 根据权利要求1所述的注塑模具，其中，所述注胶通道的第二开口的面积大于或等于第一开口的面积。
  6. 根据权利要求5所述的注塑模具，其中，所述注胶通道的第一开口的面积大于或等于所述基板上通孔的面积。
  7. 根据权利要求1所述的注塑模具，其中，还包括：封盖，用于盖合于所述底盘上，与所述底盘之间形成空腔，所述空腔用于容纳待注塑的封装芯片。
  8. 根据权利要求7中所述的注塑模具，其中，所述封盖上具有至少两个开孔，所述开孔连通所述空腔与外界，用于由外界向所述空腔内注入塑封料或者向外界排出所述空腔内的气体。
  9. 一种注塑方法，其中，包括：
    提供如权利要求1所述的注塑模具以及待塑封的封装芯片，所述封装芯片包括基板及通过倒装工艺固定于所述基板表面的至少一个芯片，所述基板上具有通孔；
    将所述封装芯片置于所述注塑模具的底盘上并将封盖盖合于所述底盘上形成空腔，所述封装芯片位于所述空腔内，所述基板的背面与所述底盘表面 贴合，且所述封装芯片的基板上的通孔与所述底盘内的注胶通道连通；
    进行第一注入，所述第一注入包括：通过所述底盘内的注胶通道经过所述基板上的通孔向所述空腔内注入液态塑封料。
  10. 根据权利要求9所述的注塑方法，其中，还包括：进行第二注入，所述第二注入包括：从所述注塑模具的封盖上的开孔向所述空腔内注入液态塑封料。
  11. 根据权利要求10所述的注塑方法，其中，当进行所述第一注入过程中，液态塑封料填充满所述芯片与所述基板之间的空隙时，停止所述第一注入，进行所述第二注入，直至将所述空腔填满。
  12. 根据权利要求10所述的注塑方法，其中，通过两个以上所述开孔向所述空腔内注入塑封料。
  13. 根据权利要求12所述的注塑方法，其中，所述封装芯片的每个芯片所在的基板区域内形成有至少一个通孔。
  14. 根据权利要求13所述的注塑方法，其中，所述第一注入过程中，同时或依次通过所述注胶通道向每个通孔注入塑封料。
  15. 根据权利要求9所述的注塑方法，其中，还包括：当所述液态塑封料填满所述空腔后，进行热处理，使所述液态塑封料固化。
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112382618A (zh) * 2020-11-09 2021-02-19 成都海光集成电路设计有限公司 一种封装结构及封装方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113394118B (zh) * 2020-03-13 2022-03-18 长鑫存储技术有限公司 封装结构及其形成方法
CN116093039A (zh) * 2023-03-01 2023-05-09 上海韬润半导体有限公司 一种芯片封装结构及封装方法
CN116110924B (zh) * 2023-04-13 2023-08-29 荣耀终端有限公司 芯片封装结构、方法及模具、摄像头模组及电子设备
CN116564857B (zh) * 2023-05-25 2024-02-02 深圳市伟方成科技有限公司 一种led灯珠封装结构

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7005101B2 (en) * 2000-09-29 2006-02-28 Texas Instruments Incorporated Virtual gate design for thin packages
CN1747143A (zh) * 2004-09-07 2006-03-15 日月光半导体制造股份有限公司 适用于透明封装的基板条
CN108962771A (zh) * 2018-07-13 2018-12-07 江苏长电科技股份有限公司 单体双金属板封装结构及其封装方法

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4961893A (en) * 1988-04-28 1990-10-09 Schlumberger Industries Method for manufacturing memory cards
JP2748592B2 (ja) * 1989-09-18 1998-05-06 セイコーエプソン株式会社 半導体装置の製造方法および半導体封止用成形金型
US5866442A (en) * 1997-01-28 1999-02-02 Micron Technology, Inc. Method and apparatus for filling a gap between spaced layers of a semiconductor
US5981312A (en) * 1997-06-27 1999-11-09 International Business Machines Corporation Method for injection molded flip chip encapsulation
US6081997A (en) * 1997-08-14 2000-07-04 Lsi Logic Corporation System and method for packaging an integrated circuit using encapsulant injection
JPH11121488A (ja) * 1997-10-15 1999-04-30 Toshiba Corp 半導体装置の製造方法及び樹脂封止装置
US6324069B1 (en) * 1997-10-29 2001-11-27 Hestia Technologies, Inc. Chip package with molded underfill
JPH11145168A (ja) * 1997-11-06 1999-05-28 Towa Corp フリップチップパッケージにおける樹脂の注入方法
US6232667B1 (en) * 1999-06-29 2001-05-15 International Business Machines Corporation Technique for underfilling stacked chips on a cavity MLC module
US6329220B1 (en) * 1999-11-23 2001-12-11 Micron Technology, Inc. Packages for semiconductor die
JP3581816B2 (ja) * 2000-02-14 2004-10-27 Ｔｏｗａ株式会社 フリップチップの樹脂注入方法
US6513236B2 (en) * 2000-02-18 2003-02-04 Matsushita Electric Industrial Co., Ltd. Method of manufacturing bump-component mounted body and device for manufacturing the same
GB0024070D0 (en) * 2000-10-02 2000-11-15 Innavisions Ltd Mpulding apparatus and method
US20020173074A1 (en) * 2001-05-16 2002-11-21 Walsin Advanced Electronics Ltd Method for underfilling bonding gap between flip-chip and circuit substrate
JP2004119816A (ja) * 2002-09-27 2004-04-15 Towa Corp 電子部品の樹脂封止成形方法及び装置
JP4039298B2 (ja) * 2003-04-08 2008-01-30 株式会社デンソー 樹脂封止型半導体装置およびその製造方法ならびに成形型
TWI228806B (en) * 2003-05-16 2005-03-01 Advanced Semiconductor Eng Flip chip package
JP2004363323A (ja) * 2003-06-04 2004-12-24 Kingpak Technology Inc 射出成形のイメージセンサ及びその製造方法
JP4243177B2 (ja) * 2003-12-22 2009-03-25 株式会社ルネサステクノロジ 半導体装置の製造方法
JP5054923B2 (ja) * 2006-01-23 2012-10-24 Ｔｏｗａ株式会社 電子部品の樹脂封止成形方法
CN101540289B (zh) * 2008-03-19 2012-12-19 飞思卡尔半导体公司 半导体集成电路封装及封装半导体集成电路的方法和模具
CN101577259B (zh) * 2008-05-05 2011-01-26 南茂科技股份有限公司 芯片封装结构
US9070679B2 (en) * 2009-11-24 2015-06-30 Marvell World Trade Ltd. Semiconductor package with a semiconductor die embedded within substrates
KR102003279B1 (ko) * 2012-07-17 2019-07-25 삼성전자 주식회사 반도체 몰딩 하부 금형, 반도체 패키지 및 반도체 패키지 제조 방법
CN106241723A (zh) * 2016-08-31 2016-12-21 歌尔股份有限公司 一种光学芯片的封装结构及其制造方法
CN106449945B (zh) * 2016-12-07 2019-03-26 湘能华磊光电股份有限公司 制作csp芯片的模注方法
CN107240554B (zh) * 2017-05-24 2019-07-26 华进半导体封装先导技术研发中心有限公司 一种集成无源器件及其封装方法
CN110660891A (zh) * 2018-06-29 2020-01-07 合肥彩虹蓝光科技有限公司 一种倒装器件封装方法及结构
CN113276348B (zh) * 2020-02-19 2023-01-24 长鑫存储技术有限公司 注塑模具及注塑方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7005101B2 (en) * 2000-09-29 2006-02-28 Texas Instruments Incorporated Virtual gate design for thin packages
CN1747143A (zh) * 2004-09-07 2006-03-15 日月光半导体制造股份有限公司 适用于透明封装的基板条
CN108962771A (zh) * 2018-07-13 2018-12-07 江苏长电科技股份有限公司 单体双金属板封装结构及其封装方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112382618A (zh) * 2020-11-09 2021-02-19 成都海光集成电路设计有限公司 一种封装结构及封装方法
CN112382618B (zh) * 2020-11-09 2023-10-27 成都海光集成电路设计有限公司 一种封装结构及封装方法

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