WO2021153213A1 - Corps moulé, précurseur associé, procédés de production associés et utilisations associées - Google Patents

Corps moulé, précurseur associé, procédés de production associés et utilisations associées Download PDF

Info

Publication number
WO2021153213A1
WO2021153213A1 PCT/JP2021/000663 JP2021000663W WO2021153213A1 WO 2021153213 A1 WO2021153213 A1 WO 2021153213A1 JP 2021000663 W JP2021000663 W JP 2021000663W WO 2021153213 A1 WO2021153213 A1 WO 2021153213A1
Authority
WO
WIPO (PCT)
Prior art keywords
molded product
region
resin
group
dielectric filler
Prior art date
Application number
PCT/JP2021/000663
Other languages
English (en)
Japanese (ja)
Inventor
豊 磯部
慎介 石川
Original Assignee
株式会社ダイセル
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社ダイセル filed Critical 株式会社ダイセル
Priority to CN202180007079.9A priority Critical patent/CN114829505B/zh
Priority to JP2021574595A priority patent/JPWO2021153213A1/ja
Priority to KR1020227029418A priority patent/KR20220134586A/ko
Publication of WO2021153213A1 publication Critical patent/WO2021153213A1/fr

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/32—Wound capacitors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
    • C08K2003/2241—Titanium dioxide

Definitions

  • the present disclosure relates to a molded product having a region in which a dielectric filler is aggregated in a resin, a precursor thereof, a manufacturing method, and an application thereof.
  • Dielectric materials are widely used as passive element components such as capacitors, resistors, and inductors in electrical and electronic equipment because they have the property of storing electricity due to electric polarization when a voltage is applied. ing.
  • the dielectric material used in these applications is usually in the form of a sheet, which requires mechanical strength and durability, and is often wound in a roll shape, and is also flexible. Required. Therefore, as a dielectric material, a composite dielectric material in which a dielectric filler is contained in a resin has also been developed, but in the composite dielectric material, there is a trade-off relationship between electrical properties and mechanical properties, and a dielectric material is used. Increasing the proportion of filler to increase the relative permittivity reduces the mechanical properties of the dielectric material.
  • Patent Document 1 a dielectric composite material in which a film made of a dielectric filler is formed around matrix particles made of a resin, and the dielectric filler forms a three-dimensional network. Is disclosed.
  • Patent Document 2 a coating material obtained by mixing a resin melt and a dispersion of an inorganic filler dispersed in a dispersion medium and dispersing the inorganic filler in the resin by ultrasonic vibration is provided.
  • a high dielectric constant film in which an inorganic filler is dispersed in a resin in a non-uniform state by coating is disclosed.
  • Patent Document 1 the dielectric composite materials and high dielectric constant films of Patent Documents 1 and 2 are not easy to control the structure, are low in convenience and productivity, and are not sufficiently high in dielectric constant.
  • Patent Document 1 the parallel model represented by the schematic cross-sectional view of FIG. 1 is described as an impractical model because it is not easy to manufacture using a small amount of dielectric filler.
  • an object of the present disclosure is to provide a method capable of easily producing a molded product having a region in which a dielectric filler is aggregated in a resin.
  • Another object of the present disclosure is to provide a molded product in which the agglutinating region of the dielectric filler is formed in various shapes or patterns, a precursor thereof, a manufacturing method, and an application thereof.
  • Yet another object of the present disclosure is to provide a film-like molded article having a filler agglomerated region in a form that traverses or penetrates in the thickness direction, a precursor thereof, a manufacturing method, and an application.
  • Another object of the present disclosure is to provide a film-like molded product capable of achieving both mechanical properties such as flexibility (or toughness) and high dielectric constant properties, a precursor thereof, a manufacturing method, and an application thereof.
  • Yet another object of the present disclosure is to provide a film-like molded product capable of improving high dielectric constant characteristics, low dielectric loss and heat resistance, and a precursor thereof, a manufacturing method and an application thereof.
  • the present inventors apply active energy to a part of the region of the liquid precursor containing the resin precursor and the dielectric filler, and the dielectric filler is applied to a specific region.
  • the present invention has been completed by finding that a molded product having a region in which the dielectric filler is aggregated in the resin can be easily produced.
  • the molded product of the present disclosure contains a resin and a dielectric filler (or dielectric particles), and has an agglomerated portion which is a region where the dielectric filler is agglomerated and a non-aggregated portion which is a region other than the agglomerated portion.
  • the abundance ratio of the dielectric filler in the agglomerated portion is gradually reduced toward the interface at least in the vicinity of the interface with the non-aggregated portion.
  • the resin may be a cured product of a photocurable resin.
  • the photocurable resin may be a cationically polymerizable compound.
  • the dielectric filler may be an inorganic filler formed of a titanium-containing composite metal oxide.
  • the ratio of the dielectric filler may be 0.1 to 100 parts by mass with respect to 100 parts by mass of the resin.
  • the molded product may be in the form of a film.
  • the film-shaped molded product may be formed in such a form that a plurality of agglomerated portions form a pattern shape and at least one agglomerated portion of the plurality of agglomerated portions extends in the thickness direction and penetrates.
  • the molded product may be a dielectric film.
  • the present disclosure comprises an aggregation step of applying active energy to a part of a region of a liquid precursor containing a resin precursor and a dielectric filler to aggregate the dielectric filler to obtain a precursor molded article.
  • the manufacturing method is also included.
  • This production method may include a polymerization completion step of applying active energy to the uncured region of the precursor molded product that has undergone the aggregation step to complete the polymerization.
  • the liquid precursor may contain a photoacid generator, and the active energy may be active light rays.
  • the present disclosure also includes a molded product obtained by the above-mentioned production method.
  • a molded product containing a photocurable resin and a dielectric filler and having an agglomerated portion which is a region where the dielectric filler is agglomerated and a non-aggregated portion which is a region other than the agglomerated portion is formed.
  • a liquid precursor for this purpose which also includes a liquid precursor containing a photocurable resin and a dielectric filler.
  • the present disclosure also includes a bonded body in which a base material formed of resin, ceramics or metal and the molded product are bonded to each other.
  • This junction may be a capacitor.
  • a molded product having a region in which the dielectric filler is aggregated in the resin can be easily (efficiently) used. Can be manufactured. Further, by using a desired mold, a patterned mask, or the like, a molded product in which the agglutinating region of the dielectric filler is formed in various shapes or patterns can be easily or accurately manufactured. Further, a filler agglomeration region in a form that is transverse or continuous in the thickness direction (a high dielectric constant structure in which the dielectric is continuous in the thickness direction, which is called a parallel connection model: for example, the structure shown in FIG.
  • a film-like (or sheet-like) molded body having (etc.) can be easily manufactured. Therefore, the dielectric property can be effectively exhibited in the thickness direction of the film-shaped molded product. Further, since the dielectric property can be efficiently imparted even if the amount of the dielectric filler added is small, it is possible to achieve both mechanical properties such as flexibility (or toughness) of the film-shaped molded product and high dielectric constant characteristics. Further, a molded product having high dielectric constant characteristics, low dielectric loss and excellent heat resistance can be obtained.
  • FIG. 1 is a schematic cross-sectional view of a composite material described in Patent Document 1 as not easy to manufacture.
  • FIG. 2 is a schematic partial longitudinal sectional view of the sheet-shaped molded product of the present invention shown to explain the non-uniformity of the dielectric filler concentration in the agglomerated portion.
  • FIG. 3 is a diagram showing a pattern shape of the photomask used in the examples.
  • FIG. 4 is a diagram showing other pattern shapes of the photomask used in the examples.
  • FIG. 5 is a CCD (charge-coupled device) photograph of the surface of the film obtained in Comparative Example 1 ((a) 100 times, (b) 400 times).
  • FIG. 6 is a CCD photograph of the surface of the film obtained in Comparative Example 2 ((a) 100 times, (b) 400 times).
  • FIG. 7 is a CCD photograph of the surface of the film obtained in Example 1 ((a) 100 times, (b) 400 times).
  • FIG. 8 is a CCD photograph of the surface of the film obtained in Example 2 ((a) 100 times, (b) 400 times).
  • FIG. 9 is a CCD photograph of the surface of the film obtained in Example 3 ((a) 100 times, (b) 400 times).
  • FIG. 10 is a CCD photograph of the surface of the film obtained in Example 4 ((a) 100 times, (b) 400 times).
  • FIG. 11 is a CCD photograph of the surface of the film obtained in Example 5 ((a) 100 times, (b) 400 times).
  • FIG. 12 is a CCD photograph of the surface of the film obtained in Example 6 ((a) 100 times, (b) 400 times).
  • FIG. 13 is a CCD photograph of the surface of the film obtained in Example 7 ((a) 100 times, (b) 400 times).
  • FIG. 14 is a CCD photograph of the surface of the film obtained in Example 8 ((a) 100 times, (b) 400 times).
  • FIG. 15 is a CCD photograph of the surface of the film obtained in Example 9 ((a) 100 times, (b) 400 times).
  • FIG. 16 is a CCD photograph of the surface of the film obtained in Example 10 ((a) 100 times, (b) 400 times).
  • FIG. 17 is a CCD photograph of the surface of the film obtained in Example 11 ((a) 100 times, (b) 400 times).
  • FIG. 18 is a CCD photograph of the surface of the film obtained in Example 12 ((a) 100 times, (b) 400 times).
  • FIG. 19 is a CCD photograph of the surface of the film obtained in Example 13 ((a) 100 times, (b) 400 times).
  • FIG. 20 is a CCD photograph of the surface of the film obtained in Example 14 ((a) 100 times, (b) 400 times).
  • FIG. 21 is a CCD photograph of the surface of the film obtained in Example 15 ((a) 100 times, (b) 400 times).
  • FIG. 22 is a CCD photograph of the surface of the film obtained in Example 16 ((a) 100 times, (b) 400 times).
  • FIG. 23 is a CCD photograph of the surface of the film obtained in Example 17 ((a) 100 times, (b) 400 times).
  • FIG. 24 is a CCD photograph of the surface of the film obtained in Example 18 ((a) 100 times, (b) 400 times).
  • FIG. 25 is a CCD photograph of the surface (100 times) of the film obtained in Comparative Example 4.
  • FIG. 26 is a CCD photograph of the surface (100 times) of the film obtained in Example 19.
  • FIG. 27 is a CCD photograph of the surface (100 times) of the film obtained in Example 20.
  • FIG. 28 is a CCD photograph of the surface (100 times) of the film obtained in Example 21.
  • FIG. 29 is a CCD photograph of the surface (100 times) of the film obtained in Comparative Example 5.
  • FIG. 30 is a CCD photograph of the surface (100 times) of the film obtained in Example 22.
  • FIG. 31 is a CCD photograph of the surface (100 times) of the film obtained in Example 23.
  • FIG. 32 is a CCD photograph of the surface (100 times) of the film obtained in Example 24.
  • FIG. 33 is a CCD photograph of the surface (100 times) of the film obtained in Comparative Example 6.
  • FIG. 34 is a CCD photograph of the surface (100 times) of the film obtained in Example 25.
  • FIG. 35 is a CCD photograph of the surface (100 times) of the film obtained in Example 26.
  • FIG. 36 is a CCD photograph of the surface (100 times) of the film obtained in Example 27.
  • FIG. 37 is a CCD photograph of the surface (100 times) of the film obtained in Comparative Example 7.
  • FIG. 38 is a CCD photograph of the surface (100 times) of the film obtained in Example 28.
  • FIG. 39 is a CCD photograph of the surface (100 times) of the film obtained in Example 29.
  • the molded product of the present disclosure contains a resin and a dielectric filler, and is formed by an agglomerated portion which is a region where the dielectric filler is agglomerated and a non-aggregated portion (or a matrix portion) which is a region other than the agglomerated portion.
  • a molded product having such a structure is a molded product obtained by imparting active energy to a part of a region of a liquid precursor containing a resin precursor and a dielectric filler. It is obtained by going through a coagulation step of coagulating the filler.
  • the resin precursor in the agglomeration step, is polymerized in the region to which the active energy is applied, and the dielectric filler moves with the polymerization to form an agglomerated portion.
  • the dielectric filler can be moved to a region where active energy is not applied, or can be moved to a region where active energy is applied, depending on the combination of formulations and the selection of production conditions.
  • the resin may be any resin that can be polymerized by active energy, and the resin obtained by polymerization may be a thermoplastic resin. However, since it is easy to aggregate the dielectric filler, it can be cured by active energy. A cured product of a sex resin is preferable.
  • the curable resin examples include cationically polymerizable compounds and / or radically polymerizable resins.
  • cationically polymerizable compounds are preferable from the viewpoint of productivity and the like.
  • the cationically polymerizable compound can easily or accurately prepare a desired molded product, probably because the reaction rate is suitable for the movement (aggregation) of the dielectric filler.
  • the cationic polymerization can be reacted in the presence of oxygen such as in the air, and further, the curability can be easily controlled by using a dark reaction (or post-polymerization), so that the productivity is excellent. There is.
  • the cationically polymerizable compound is not particularly limited as long as it has at least one cationically polymerizable group, and may be a monofunctional cationically polymerizable compound having one cationically polymerizable group, or two or more identical or different cationically polymerizable groups. It may be a polyfunctional cationically polymerizable compound having. From the viewpoint of curability and resin strength (or molded product strength such as hardness), a polyfunctional cationically polymerizable compound is usually often used.
  • the number of cationically polymerizable groups can be selected from the range of, for example, about 2 to 10, for example, 2 to 8 (for example, 2 to 6), preferably 2 to 4, and more preferably. It may be 2 to 3, especially 2.
  • Examples of the cationically polymerizable group include an epoxy (oxylan ring) -containing group, an oxetane ring-containing group, and a vinyl ether group.
  • the epoxy-containing group may be a group having at least an oxylan ring skeleton, and is, for example, an epoxy group (or an oxylan-2-yl group), a 2-methyloxylan-2-yl group, or a glycidyl-containing group (for example, a glycidyl group). , 2-Methylglycidyl group, etc.), alicyclic epoxy group (eg, epoxycycloalkyl group such as 3,4-epoxidecyclohexyl group, alkyl-epoxidecycloalkyl group such as 3,4-epoxy-6-methylcyclohexyl group) Etc.) and so on.
  • epoxycycloalkyl group such as 3,4-epoxidecyclohexyl group
  • alkyl-epoxidecycloalkyl group such as 3,4-epoxy-6-methylcyclohexyl group
  • the oxetane ring-containing group may be a group having at least an oxetane ring skeleton.
  • C 1-4 alkyl oxetaneyl groups such as 3-oxetanyl groups) and the like.
  • cationically polymerizable groups may be present alone or in combination of two or more.
  • epoxy-containing groups such as glycidyl-containing groups and alicyclic epoxy groups are often used from the viewpoint of curability and productivity suitable for aggregation of dielectric fillers.
  • a typical cationically polymerizable compound 2 selected from an epoxy compound having an epoxy-containing group, an oxetane compound having an oxetane ring-containing group, a vinyl ether compound having a vinyl ether group, an epoxy-containing group, an oxetane ring-containing group, and a vinyl ether group.
  • examples thereof include polyfunctional compounds having more than one species of cationically polymerizable groups.
  • These cationically polymerizable compounds can be used alone or in combination of two or more.
  • compounds having at least one cationically polymerizable group selected from the epoxy-containing group such as an epoxy compound and an oxetane compound and an oxetane ring-containing group are often used, and among them, at least epoxy.
  • a compound having a group is preferable, and an epoxy compound is more preferable from the viewpoint of curability and productivity suitable for agglomeration of the dielectric filler.
  • Examples of the epoxy compound include a monofunctional epoxy compound having one epoxy-containing group and a polyfunctional epoxy compound having two or more epoxy-containing groups as cationically polymerizable groups. These epoxy compounds can also be used alone or in combination of two or more.
  • Examples of the monofunctional epoxy compound include a monofunctional glycidyl type epoxy compound having a glycidyl group (or 2-methylglycidyl group), a monofunctional alicyclic epoxy compound having an alicyclic epoxy group, and the like.
  • Examples of the monofunctional glycidyl type epoxy compound include alkyl glycidyl ethers such as butyl glycidyl ether, 2-ethylhexyl glycidyl ether, dodecyl glycidyl ether and tridecyl glycidyl ether; phenyl glycidyl ether and alkylphenyl glycidyl ether (tril glycidyl ether, t- Aryl glycidyl ethers such as butylphenyl glycidyl ethers; (poly) alkylene glycol monoglycidyl ethers such as ethylene glycol monoglycidyl ethers, 1,4-butanediol monoglycidyl ethers, diethylene glycol monoglycidyl ethers; 2,3-epoxy-1 -Propanol (or glycidole); glycidyl
  • Examples of the monofunctional alicyclic epoxy compound include 1,2-epoxycyclohexane and substituted epoxycyclohexane (eg, 1,2-epoxy-4-hydroxymethylcyclohexane, 1,2-epoxy-4-vinylcyclohexane, 3, 4-Epoxy-cyclohexylmethyl (meth) acrylate, allyl-3,4-epoxycyclohexanecarboxylate, etc.) and the like.
  • 1,2-epoxycyclohexane and substituted epoxycyclohexane eg, 1,2-epoxy-4-hydroxymethylcyclohexane, 1,2-epoxy-4-vinylcyclohexane, 3, 4-Epoxy-cyclohexylmethyl (meth) acrylate, allyl-3,4-epoxycyclohexanecarboxylate, etc.
  • polyfunctional epoxy compound examples include a polyfunctional glycidyl type epoxy compound having a glycidyl group (and / or a 2-methylglycidyl group), a polyfunctional alicyclic epoxy compound having at least one alicyclic epoxy group, and the like. Be done.
  • an epoxy compound having both a glycidyl group and an alicyclic epoxy group is classified as an alicyclic epoxy compound.
  • polyfunctional glycidyl type epoxy compound examples include a glycidyl ether type epoxy compound (or glycidyl ether type epoxy resin), a glycidyl ester type epoxy compound (or glycidyl ester type epoxy resin), and a glycidyl amine type epoxy compound (or glycidyl amine type epoxy resin). Resin), heterocyclic glycidyl type epoxy compound and the like.
  • Examples of the glycidyl ester type epoxy compound include diglycidyl phthalates such as diglycidyl phthalate, diglycidyl tetrahydrophthalate, and diglycidyl hexahydrophthalate; glycidyl (meth) acrylate alone or copolymer; glycidyl group in these compounds. Examples thereof include a compound having a 2-methylglycidyl group.
  • Examples of the glycidylamine type epoxy compound include tetraglycidyldiamines such as tetraglycidyldiaminodiphenylmethane, tetraglycidylmethoxylylylene diamine, and tetraglycidylbisaminomethylcyclohexane; diglycidylaniline, diglycidyltoluidine, N, N-diglycidyl-2.
  • tetraglycidyldiamines such as tetraglycidyldiaminodiphenylmethane, tetraglycidylmethoxylylylene diamine, and tetraglycidylbisaminomethylcyclohexane
  • diglycidylaniline diglycidyltoluidine
  • N N-diglycidyl-2.
  • heterocyclic glycidyl-type epoxy compound examples include isocyanurate-type epoxy compounds such as triglycidyl isocyanurate; hydantoin-type epoxy compounds such as diglycidyl hydantoin; and compounds in which the glycidyl group in these compounds is a 2-methylglycidyl group. Can be mentioned.
  • polyfunctional glycidyl type epoxy compounds can be used alone or in combination of two or more.
  • the glycidyl ether type epoxy compound is preferable from the viewpoint of curability and productivity suitable for agglutination of the dielectric filler.
  • glycidyl ether type epoxy compound examples include an aromatic glycidyl ether type epoxy compound, an alicyclic glycidyl ether type epoxy compound, and an aliphatic glycidyl ether type epoxy compound.
  • aromatic glycidyl ether type epoxy compound examples include polyglycidyl ether of an aromatic polyol or an alkylene oxide adduct thereof, and examples thereof include bi or bisphenol type epoxy compounds (for example, bisphenol A type epoxy compound and bisphenol F type epoxy compound).
  • Examples of the alicyclic glycidyl ether type epoxy compound include polyglycidyl ether of an alicyclic polyol or an alkylene oxide adduct thereof, and for example, a hydrogenated product of the aromatic glycidyl ether compound [for example, hydrogenated bi or bisphenol].
  • Type epoxy compounds such as diglycidyl ether, which is a hydrogenated product of conventional bisphenols such as hydrogenated bisphenol A type epoxy compounds); hydrogenated novolak type epoxy resins, etc.]; (Glysidyloxy) C 5-10 cycloalkane; bis (glycidyloxy C 1-4 alkyl) C 5-10 cycloalcan such as diglycidyl ether of 1,4-cyclohexanedimethanol; alicyclic type corresponding to these compounds Polyglycidyl ether of C 2-4 alkylene oxide adduct of polyol; compounds in which the glycidyl group in these compounds is 2-methylglycidyl group and the like can be mentioned.
  • diglycidyl ether which is a hydrogenated product of conventional bisphenols such as hydrogenated bisphenol A type epoxy compounds); hydrogenated novolak type epoxy resins, etc.
  • (Glysidyloxy) C 5-10 cycloalkane bis (glycidyloxy
  • glycidyl ether type epoxy compounds can be used alone or in combination of two or more.
  • an aliphatic glycidyl ether type epoxy compound is preferable because it has a low viscosity and easily promotes aggregation of the dielectric filler.
  • Examples of the aliphatic glycidyl ether type epoxy compound include polyglycidyl ether of an aliphatic polyhydric alcohol (aliphatic polyol) or a condensate (or a multimer) thereof.
  • Examples of the aliphatic polyhydric alcohol for forming the aliphatic glycidyl ether type epoxy compound include aliphatic diols [for example, ethylene glycol, propylene glycol, 1,3-propanediol, 1,2-butanediol, 1, Linear or branched C 2-12 alkanes such as 4-butanediol, 1,5-pentanediol, neopentyl glycol, 1,6-hexanediol, 1,8-octanediol, 1,10-decanediol Diols and the like]; Aliphatic polyols having a trivalent or higher valence [for example, polymethylol al
  • aliphatic glycidyl ether type epoxy compound examples include a divalent glycidyl ether type compound and a trivalent or higher glycidyl ether type compound.
  • divalent glycidyl ether type compound examples include the (poly) alkylene glycol diglycidyl ether represented by the following formula (1); trimethylolpropane diglycidyl ether, glycerin diglycidyl ether, pentaerythritol diglycidyl ether and the like.
  • diglycidyl ether which is a trivalent or higher aliphatic polyol or a condensate containing the polyol.
  • a 1 is a linear or branched alkylene group, m is an integer of 1 or more, and R 1 is an independent hydrogen atom or methyl group).
  • Examples of the linear or branched alkylene group represented by A for example, ethylene group, propylene group, trimethylene group, 1,2-butanediyl group, tetramethylene group, 2,2 -Dimethylpropan-1,3-diyl group (neopentylene group), pentamethylene group, hexamethylene group, octamethylene group, decamethylene group and other linear or branched C 2-12 alkylene groups (eg, linear)
  • a branched C 2-10 alkylene group preferably a linear or branched C 2-8 alkylene group (eg, a linear or branched C 3-7 alkylene group), more preferably an ethylene group.
  • a linear or branched C 2-7 alkylene group such as a propylene group, a trimethylene group, a tetramethylene group, or a hexamethylene group (for example, a linear or branched C 2-6 alkylene group such as a tetramethylene group).
  • a linear or branched C 3-6 alkylene group particularly a linear or branched C 4-6 alkylene group).
  • the repetition number m may be an integer of 1 or more, and can be selected from an integer of, for example, about 1 to 30 (for example, 1 to 15), for example, 1 to 10 (for example, 1 to 8), preferably 1 to 6 (for example, 1 to 1 to 1). 4), more preferably 1 to 3 (eg 1 or 2), especially 1. If m is too large, the viscosity of the liquid precursor may increase and the controllability of the dielectric filler may decrease. Further, when m is 2 or more, kinds of a plurality of alkylene groups A 1 may be the same or different from each other.
  • R 1 may be either a hydrogen atom or a methyl group, and is usually a hydrogen atom in many cases.
  • the types of R 1 may be different from each other, but are usually the same.
  • the (poly) alkylene glycol diglycidyl ether represented by the formula (1) include ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, 1,3-propanediol diglycidyl ether, and 1, 2-butanediol diglycidyl ether, 1,4-butanediol diglycidyl ether, neopentyl glycol diglycidyl ether, 1,5-pentanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, 1,8-octane Linear or branched C 2-12 alkylene glycol-diglycidyl ethers such as diol diglycidyl ethers and 1,10-decanediol diglycidyl ethers; diethylene glycol diglycidyl ethers, dipropylene glycol diglycidyl ethers, triethylene glycol
  • the (poly) alkylene glycol diglycidyl ether represented by the formula (1) can be used alone or in combination of two or more.
  • alkylene glycol diglycidyl ether having m of 1 is preferable, and among them, ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, 1,4-butanediol diglycidyl ether, neopentyl glycol diglycidyl ether, 1 , 6-Hexanediol Diglycidyl ether, etc.
  • Linear or branched C 2-8 alkylene glycol-diglycidyl ether eg, linear or branched C 3-7 alkylene glycol-diglycidyl ether
  • Linear or branched C 2-6 alkylene glycol-diglycidyl ether eg, linear or branched C 4-6 alkylene glycol such as neopentyl glycol, 1,6-hexanediol diglycidyl ether- Diglycidyl ether, preferably branched chain C 4-6 alkylene glycol-diglycidyl ether such as neopentyl glycol
  • linear or branched C 2-8 alkylene glycol-diglycidyl ether eg, linear or branched C 3-7 alkylene glycol-diglycidyl ether
  • Linear or branched C 2-6 alkylene glycol-diglycidyl ether eg, linear or branched C 4-6 alkylene glycol such as ne
  • examples of the trivalent or higher glycidyl ether type compound include (poly) trimethylolpropane tri to pentaglycidyl ether [for example, trimethylolpropane triglycidyl ether, ditrimethylolpropane triglycidyl ether, ditrimethylolpropane tetraglycidyl ether and the like.
  • (Poly) glycerin polyglycidyl ether for example, mono-tri (glycerin) such as glycerin triglycidyl ether, diglycerin triglycidyl ether, diglycerin tetraglycidyl ether, etc.
  • Pentaerythritol polyglycidyl ether for example, mono to tri, such as pentaerythritol triglycidyl ether, pentaerythritol tetraglycidyl ether, dipentaerythritol pentaglycidyl ether, dipentaerythritol hexaglycidyl ether, etc.
  • aliphatic glycidyl ether type epoxy compounds can be used alone or in combination of two or more.
  • the divalent glycidyl ether type compound is represented by the above formula (1) because it is easy to improve the controllability of the dielectric filler and it is easy to procure it.
  • (Poly) alkylene glycol diglycidyl ether (particularly, alkylene glycol diglycidyl ether) is often used.
  • the polyfunctional alicyclic epoxy compound may be a compound having two or more epoxy-containing groups and at least one of which is an alicyclic epoxy group.
  • a compound having one alicyclic epoxy group and one or more non-alicyclic epoxy groups eg, 1,2: 8,9-diepoxide limonene (or 1-methyl-4- (2)).
  • -Methyloxylanyl) -7-oxabicyclo eg. 1,2: 8,9-diepoxide limonene (or 1-methyl-4- (2)).
  • -Methyloxylanyl) -7-oxabicyclo [4.1.0] heptane, ARKEMA's "LIMONENE DIOXIDE" and other compounds having one alicyclic epoxy group and one ethylene oxide group, etc.];
  • 2 Compounds having one alicyclic epoxy group; compounds having three or more alicyclic epoxy groups and the like can be mentioned.
  • Examples of the compound having two alicyclic epoxy groups include a compound represented by the following formula (2).
  • X represents a single bond or a linking group, and each cyclohexene oxide group may have a substituent).
  • examples of the linking group represented by X include a divalent hydrocarbon group, an alkenylene group in which part or all of the carbon-carbon double bond is epoxidized, and a carbonyl group (-CO-). ), Ether bond (-O-), ester bond (-COO-), carbonate group (-O-CO-O-), amide group (-CONH-), and a group in which a plurality of these are linked. ..
  • Examples of the divalent hydrocarbon group include a linear or branched C 1-18 alkylene group and a divalent C 3-18 alicyclic hydrocarbon group.
  • Examples of the linear or branched C 1-18 alkylene group include a methylene group, a methylmethylene group, a dimethylmethylene group, an ethylene group, a propylene group, a trimethylene group and the like.
  • Examples of the divalent C 3-18 alicyclic hydrocarbon group include 1,2-cyclopentylene group, 1,3-cyclopentylene group, cyclopentylidene group, 1,2-cyclohexylene group and 1 , 3-Cyclohexylene group, 1,4-cyclohexylene group, cycloalkylene group such as cyclohexylidene group (including cycloalkylidene group) and the like.
  • alkenylene group in the alkenylene group in which a part or all of the carbon-carbon double bond is epoxidized include a vinylene group, a propenylene group, and a 1-butenylene group.
  • an alkenylene group in which the entire carbon-carbon double bond is epoxidized is preferable, and a C 2-4 alkenylene group in which the entire carbon-carbon double bond is epoxidized is more preferable.
  • X a carbonyloxymethylene group or the like is preferable.
  • a substituent may be independently bonded to each of the two cyclohexene oxide groups, and the substituents include, for example, a halogen atom, a C 1-10 alkyl group, and a C 1-.
  • Typical examples of the compound represented by the above formula (2) are (3,4,3', 4'-diepoxy) bicyclohexyl, bis (3,4-epoxycyclohexylmethyl) ether, 1,2-.
  • Examples thereof include epoxycyclohexane-1-yl) ethane and compounds represented by the following formulas (2-1) to (2-8).
  • L represents a C 1-8 alkylene group (for example, a linear or branched C 1-3 alkylene group such as a methylene group, an ethylene group, a propylene group, an isopropylene group), and n1 and n2 are. Each indicates an integer from 1 to 30).
  • Examples of the compound having three or more alicyclic epoxy groups include compounds represented by the following formulas (2-9) and (2-10).
  • n3 to n8 independently represent integers of 1 to 30).
  • polyfunctional alicyclic epoxy compounds can be used alone or in combination of two or more.
  • compounds having two alicyclic epoxy groups such as the compound represented by the above formula (2) are preferable, and among them, X is a carbonyloxymethylene group 3, 4-Epoxide cyclohexylmethyl (3,4-epoxide) cyclohexanecarboxylate (compound represented by the above formula (2-1)) is preferable.
  • polyfunctional epoxy compounds different from the polyfunctional glycidyl type epoxy compound and the polyfunctional alicyclic epoxy compound include, for example, 1,2-epoxy-4- (2-oxylanyl) of a polyol (such as trimethylolpropane).
  • examples thereof include a cyclohexane adduct (for example, “EHPE3150” manufactured by Daicel Co., Ltd.).
  • polyfunctional epoxy compounds can be used alone or in combination of two or more.
  • polyfunctional epoxy compounds are usually often used from the viewpoint of curability and productivity.
  • a polyfunctional glycidyl type epoxy compound and a polyfunctional alicyclic epoxy compound are preferable, and more preferably a glycidyl ether type epoxy, from the viewpoint of curability and productivity which are particularly suitable for agglomeration of a dielectric filler.
  • the combination of the polyfunctional alicyclic epoxy compound and the polyfunctional glycidyl type epoxy compound is preferable from the viewpoint that the controllability of the dielectric filler is excellent and the flexibility of the molded product can be improved.
  • a combination of the compound having two alicyclic epoxy groups and the (poly) alkylene glycol diglycidyl ether represented by the above formula (1) is particularly preferable.
  • the viscosity of the cationically polymerizable compound at 25 ° C. can be selected from the range of, for example, about 500 mPa ⁇ s or less (for example, 1 to 400 mPa ⁇ s), for example, 2 to 350 mPa ⁇ s, from the viewpoint of promoting the aggregation of the dielectric filler in the agglomeration step.
  • s for example, 3 to 300 mPa ⁇ s
  • 4 to 250 mPa ⁇ s for example, 5 to 200 mPa ⁇ s
  • more preferably 5 to 150 mPa ⁇ s for example, 5 to 100 mPa ⁇ s
  • s for example, 5.5 to 50 mPa ⁇ s
  • 6 to 30 mPa ⁇ s for example, 6.5 to 20 mPa ⁇ s
  • more preferably 7 to 15 mPa ⁇ s for example, 7.5 mPa ⁇ s
  • the viscosity can be measured using a conventional viscometer (for example, a single cylindrical rotational viscometer).
  • the ratio of the cationically polymerizable compound can be selected from the range of, for example, about 10 to 100% by mass (for example, 30 to 99% by mass) with respect to the entire resin contained in the liquid precursor, and for example, 50 to 100% by mass (for example, 50 to 100% by mass). 60 to 98% by mass), preferably 70 to 100% by mass (for example, 80 to 97% by mass), more preferably 80 to 100% by mass (for example, 90 to 95% by mass), particularly 95 to 100% by mass (particularly substantial substance). It may be about 100% by mass). If the proportion of the cationically polymerizable compound is too small, there is a risk that the agglomerated portion cannot be easily or sufficiently (or accurately) formed in the agglutination step.
  • a photocurable resin is preferable, and a photocationic polymerizable compound is particularly preferable, from the viewpoint of easily forming an agglomerated portion.
  • the molded product may further contain a polymerization initiator for polymerizing the resin.
  • the polymerization initiator can be appropriately selected depending on the type of resin, and when the resin is a curable resin, it may be a radical polymerization initiator, a cationic polymerization initiator, or an anionic polymerization initiator.
  • a preferred polymerization initiator is a cationic polymerization initiator (acid generator).
  • Cationic polymerization initiators include photoacid generators and thermoacid generators.
  • Examples of the photoacid generator include sulfonium salt (salt of sulfonium ion and anion), diazonium salt (salt of diazonium ion and anion), iodonium salt (salt of iodonium ion and anion), and selenium salt (selenium ion). And anion salt), ammonium salt (ammonium ion and anion salt), phosphonium salt (phosphonium ion and anion salt), oxonium salt (oxonium ion and anion salt), transition metal complex ion and anion Examples include salts with and bromine compounds. These photoacid generators can be used alone or in combination of two or more. Among these photoacid generators, an acid generator having high acidity, for example, a sulfonium salt is preferable from the viewpoint of improving reactivity.
  • sulfonium salt examples include triphenylsulfonium salt, tri-p-tolylsulfonium salt, tri-o-tolylsulfonium salt, tris (4-methoxyphenyl) sulfonium salt, 1-naphthyldiphenylsulfonium salt, and 2-naphthyldiphenylsulfonium.
  • Tris (4-fluorophenyl) sulfonium salt Tri-1-naphthyl sulfonium salt, tri-2-naphthyl sulfonium salt, tris (4-hydroxyphenyl) sulfonium salt, diphenyl [4- (phenylthio) phenyl] sulfonium salt, Triarylsulfonium salts such as [4- (4-biphenylthio) phenyl] -4-biphenylphenylsulfonium salt, 4- (p-tolylthio) phenyldi- (p-phenyl) sulfonium salt; diphenylphenacil sulfonium salt, diphenyl 4 -Diarylsulfonium salts such as nitrophenacylsulfonium salt, diphenylbenzylsulfonium salt, diphenylmethylsulfonium salt; monoaryl
  • Examples of anions (counterions) for forming salts with cations include SbF 6- , PF 6- , BF 4- , fluorinated alkylfluorophosphate ion [(CF 3 CF 2 ) 3 PF 3- , ( CF 3 CF 2 CF 2) 3 PF 3- etc.], (C 6 F 5) 4 B -, (C 6 F 5) 4 Ga -, a sulfonate anion (trifluoromethanesulfonic acid anion, pentafluoroethane sulfonate anion , nonafluorobutanesulfonic acid anion, methanesulfonic acid anion, benzenesulfonic acid anion, p- toluenesulfonate anion, etc.), (CF 3 SO 2) 3 C -, (CF 3 SO 2) 2 N -, perhalogenated acid Examples thereof include ions, halogenated sulfonic acid ions, sulfate
  • anions can also be used alone or in combination of two or more.
  • SbF 6- , PF 6- , fluorinated alkylfluorophosphate ion and the like are widely used, and fluorinated alkyl fluorophosphate ion and the like are preferable from the viewpoint of solubility and the like, and usually PF 6- and the like are used. Often.
  • a commercially available photoacid generator can be used as the photoacid generator.
  • Examples of commercially available photoacid generators include “CPI-101A”, “CPI-110A”, “CPI-100P”, “CPI-110P”, “CPI-210S”, and “CPI-200K” manufactured by San-Apro Co., Ltd.
  • UVACURE1590 manufactured by Daicel Ornex Co., Ltd .
  • CD-1010 "CD-1011” and “CD-” manufactured by Sartmer of the United States.
  • thermoacid generator examples include aryl sulfonium salts, aryl iodonium salts, allen-ion complexes, quaternary ammonium salts, aluminum chelates, boron trifluoride amine complexes and the like. These thermoacid generators can be used alone or in combination of two or more. Among these thermoacid generators, an acid generator having high acidity, for example, an arylsulfonium salt is preferable from the viewpoint of improving reactivity.
  • the anionic such as the same anion as the photoacid generator and the like, or may be a fluoride ion antimony such as SbF 6-.
  • thermoacid generator A commercially available thermoacid generator can be used as the thermoacid generator.
  • examples of commercially available thermoacid generators include "Sun Aid SI-60L”, “Sun Aid SI-60S”, “Sun Aid SI-80L”, “Sun Aid SI-100L” manufactured by Sanshin Chemical Industry Co., Ltd., and Co., Ltd. ) ADEKA's "SP-66", “SP-77”, etc. can be used.
  • thermoacid generators may be able to generate acid by either the action of light or heat, respectively.
  • cationic polymerization initiators can be used alone or in combination of two or more.
  • a photoacid generator is preferable because an aggregated portion can be easily formed in a pattern by using a photomask or the like.
  • the ratio of the polymerization initiator may be appropriately selected according to the type of the resin and the like to adjust the curability of the liquid precursor.
  • the resin particularly, the cationically polymerizable compound. It can be selected from the range of about 0.01 to 100 parts by mass with respect to 100 parts by mass of the total amount of the above, for example, 0.1 to 50 parts by mass, preferably 1 to 30 parts by mass, more preferably 3 to 20 parts by mass, and more preferably. Is 5 to 15 parts by mass, most preferably 8 to 12 parts by mass. If the proportion of the polymerization initiator is too small, the curing reaction is difficult to proceed, and the dielectric filler may be difficult to aggregate in the aggregating step. There is a risk of hardening in a state of insufficient aggregation, and it is costly and disadvantageous in terms of productivity.
  • Dielectric filler As the dielectric filler, a conventional dielectric filler (dielectric particle or granular dielectric) can be used. Conventional dielectric fillers can be roughly classified into inorganic fillers (or particles) and organic fillers (or particles).
  • the material of the inorganic filler includes a metal oxide, a metal composite oxide, and the like.
  • the metal oxide include titanium oxide, zirconium oxide, lanthanum oxide and the like.
  • the composite metal oxide include titanium metals such as magnesium titanate, calcium titanate, strontium titanate, barium titanate (BaTIO 3 ), zinc titanate, and bismuth titanate; and metal zirconate such as barium zirconate; Metal succinate such as barium titanate; metal hafnium acid such as barium titanate; metal niobate such as lithium niobate; metal tantrate such as lithium titanate; barium titanate titanate, lead zirconate titanate (PZT) Examples include metal zirconate titanate.
  • the composite metal oxide such as barium titanate may further contain an alkaline earth metal such as calcium and strontium, and a rare earth metal such as yttrium, neodymium, samarium and dysprosium as trace components.
  • alkaline earth metal such as calcium and strontium
  • rare earth metal such as yttrium, neodymium, samarium and dysprosium as trace components.
  • Examples of the material of the organic filler include polyvinylidene fluoride, vinylidene fluoride-ethylene trifluoride copolymer, vinylidene fluoride-ethylene tetrafluoride copolymer, vinylidene fluoride-vinylidene hexafluoride copolymer, and the like.
  • Vinylidene fluoride-based polymer such as polyamide 5, polyamide 7, polyamide 11; cyano resin such as cyanoethyl pullulan, cyanoethyl polyvinyl alcohol, cyanoethyl hydroxyethyl cellulose, cyanoethyl cellulose; polyurea; polythiourea; trisulfate Examples include glycine.
  • Dielectric fillers made of these materials can be used alone or in combination of two or more.
  • an inorganic filler is preferable from the viewpoint of easily forming an agglomerated portion, an inorganic filler formed of a composite metal oxide (composite metal oxide filler) is more preferable, and an inorganic filler formed of a titanium-containing composite metal oxide is more preferable. Fillers are more preferred, and inorganic fillers made of alkaline earth metal titanate are most preferred.
  • the dielectric filler may be an inorganic filler having a perovskite structure (particularly, an inorganic filler formed of a composite metal oxide having a perovskite structure) from the viewpoint of easily forming an agglomerated portion.
  • a ferroelectric filler may be used because the relative permittivity of the molded product can be improved.
  • the relative permittivity ( ⁇ r ) of the dielectric filler may be 100 or more, for example, 500 or more, preferably 1000 or more, and more preferably 3000 or more (for example, 3000 to 10000).
  • the shape of the dielectric filler (the shape of the primary particles) is not particularly limited as long as it is granular, and for example, a spherical shape such as a true sphere or a substantially spherical shape; an ellipsoidal (elliptical sphere) shape; a conical shape, a polygonal pyramid shape, or the like.
  • the central particle size (D 50 ) of the dielectric filler may be 1 ⁇ m or more, but is preferably 1 ⁇ m or less, and more preferably 0.01 to 1 ⁇ m. If the central particle size is too small, the viscosity of the liquid precursor tends to increase, and it may be difficult for the dielectric filler to aggregate in the aggregation step, or it may be difficult to effectively impart dielectric property due to the influence of interfacial resistance (contact resistance). There is. On the other hand, if it is too large, the dielectric filler may not move easily in the agglutination step, making it difficult to agglomerate, and depending on the dielectric filler, the photocurability may decrease due to the influence of the shadow of the dielectric filler itself. Further, particles having different sizes may be intentionally mixed in a predetermined ratio in order to efficiently increase the concentration of the dielectric filler in the agglomerated portion.
  • the central particle size of the dielectric filler means the central particle size of the primary particles, and is a nanoparticle size distribution measuring device (“SALD-7500 nano” manufactured by Shimadzu Corporation). Can be measured on a volume basis using. It is also obtained by an image analysis method. That is, for example, a scanning electron microscope (SEM) is used to take electron microscope images of a sufficient number (for example, 10 or more) of particulate matter, and the maximum diameter, cross diameter, and thickness of these particulate matter are determined. It is obtained by measuring and arithmetically averaging this.
  • SEM scanning electron microscope
  • the ratio of the dielectric filler can be selected from the range of about 0.01 to 300 parts by mass (for example, 0.1 to 100 parts by mass) with respect to 100 parts by mass of the resin (or resin precursor), for example, 0.1 to 80 parts. It is by mass, preferably 0.2 to 70 parts by mass. Even if the proportion of the derivative filler is large, the aggregation of the derivative filler can be controlled, and the proportion of the derivative filler is, for example, 1 to 300 parts by mass, preferably 10 to 200 parts by mass, and more preferably 20 parts by mass with respect to 100 parts by mass of the resin. It may be up to 100 parts by mass, more preferably 30 to 80 parts by mass.
  • the relative permittivity of the molded product may not be improved.
  • the relative permittivity is formed by forming an agglomerated portion. Can be improved.
  • the amount is too large, the viscosity of the liquid precursor tends to increase and the dielectric filler may not easily aggregate in the aggregation step, and depending on the dielectric filler, the photocurability may decrease due to the influence of the shadow of the dielectric filler itself. There is a risk. Further, the flexibility (or toughness) of the obtained molded product tends to decrease, and the molded product may become brittle.
  • the molded product (or liquid precursor for forming the molded product) may further contain, if necessary, other components such as conventional additives, in addition to the resin and the dielectric filler.
  • additives include, for example, stabilizers (heat stabilizers, ultraviolet absorbers, photostabilizers, antioxidants, etc.), dispersants, antioxidants, colorants, lubricants, sensitizers (acridines, etc.). Benzoflavins, perylenes, anthracenes, thioxanthones, laser pigments, etc.), sensitizers, hardening accelerators (imidazoles, alkali metals or alkaline earth metal alkoxides, phosphins, amide compounds, Lewis acid complex compounds) , Sulfur compounds, boron compounds, condensable organic metal compounds, etc.), defoaming agents, flame retardants, etc.
  • the ratio of the conventional additive is, for example, 30 parts by mass or less (for example, 0.01 to 30 parts by mass), preferably 20 parts by mass or less, and more preferably 10 parts by mass with respect to 100 parts by mass of the resin (or resin precursor). It may be less than or equal to a part.
  • the agglomerated portion of the molded body is a region formed by aggregating the dielectric filler without being uniformly dispersed inside the molded body by applying active energy, but the non-aggregated portion (or matrix). It has a structure in which the abundance ratio of the dielectric filler gradually decreases toward the interface at least in the vicinity of the interface with the part). That is, the agglomerated portion is not a homogeneous structure in which the dielectric filler is present at a constant ratio in the entire region of the agglomerated portion, and the concentration is gradually (linearly or linearly or) in the vicinity of at least the interface between the agglomerated portion and the non-aggregated portion.
  • the structure near the interface has a concentration gradient, it is not typical, so it is impossible or extremely difficult to specify the microstructure, which is not practical.
  • the property derived from the present disclosure such as the improvement of the interfacial strength due to the anchor effect.
  • Such a structure can be easily observed with a digital microscope (CCD observation image) or the like. For example, in a CCD photograph of the cross section or surface of the agglomerated portion taken at a magnification of about 200 to 1000 times, the dielectric material at the agglomerated portion. It can be easily confirmed that the abundance ratio (concentration) of the filler is non-uniform.
  • the non-uniformity of the abundance ratio (concentration) of the dielectric filler in the agglomerated portion can be determined by elemental analysis (or surface analysis) of a predetermined region in the agglomerated portion or analysis of a chemical species to determine the element (dielectric) constituting the dielectric filler. It can also be confirmed by detecting (also called a body filler constituent element) or a chemical species.
  • the element analysis method (or apparatus) may be appropriately selected depending on the form of the molded body (type of dielectric filler, etc.), and may be, for example, energy dispersive X-ray spectroscopy (EDX or EDS), wavelength dispersion.
  • Type X-ray spectroscopy (WDX, WDS or EPMA), X-ray photoelectron spectroscopy (XPS or ESCA), Auger electron spectroscopy (AES), secondary ion mass analysis (SIMS) [time-of-flight secondary ion mass analysis
  • TOF-SIMS time-of-flight secondary ion mass analysis
  • conventional methods such as Raman spectroscopy and infrared spectroscopy (IR) can be mentioned as methods for detecting chemical species.
  • SEM- Energy dispersive X-ray spectroscopy such as EDX (SEM-EDS) is often used.
  • the dielectric filler concentration decreases or gradually decreases toward the interface (or the interface direction) at least in the peripheral region near the interface of the agglomerated portion. It can be confirmed that the abundance ratio of the dielectric filler constituent elements is low at least near the interface (or the peripheral region) of the agglomerated portion.
  • the central portion of the agglomerated portion (the portion inside the agglomerated portion, which is the farthest from the interface with the non-aggregated portion that separately partitions the agglomerated portion) and the portion adjacent to the agglomerated portion.
  • the aggregated portion is divided into three equal parts (distance from the central portion to the interface) from the central portion toward the interface (or the interface direction). Is divided into 3 parts so that they are evenly spaced).
  • the central region central region, near the central region or the first region
  • the intermediate region intermediate region, the intermediate region or the second region
  • the peripheral region peripheral region in the order from the central portion to the interface of each divided region. Part, near the interface or a third region).
  • the abundance ratio in the peripheral region is at least the intermediate region. It can be confirmed that it is lower than the abundance ratio.
  • the abundance ratio may be a ratio based on the number of atoms (frequency or intensity), but is usually a ratio based on the mass of atoms.
  • FIG. 2 is a schematic partial longitudinal sectional view of the molded product of the present disclosure, that is, a film (or sheet) -shaped molded product having an agglomerated portion 1 in a form in which a dielectric filler penetrates in the thickness direction. That is, FIG. 2 shows a central portion 4 of an arbitrary agglomerated portion 1 in a molded body (a central axis extending in the thickness direction at the center in the plane direction of the agglomerated portion) and a non-aggregated portion 2 adjacent to the agglomerated portion 1. It shows a cross section (or a longitudinal cross section) that passes through (or crosses) the interface 3 and is substantially parallel to the thickness direction of the molded body.
  • the distance from the central portion 4 to the interface 3 in the agglomerated portion is the region from the central portion 4 to at least one interface (the interface on the left side of the central portion 4 in the figure) 3 (the shortest). Is divided into three in the width direction (horizontal direction) of the agglomerated portion so that the agglomerates are evenly spaced.
  • the divided regions are defined as a central region 1a, an intermediate region 1b, and a peripheral region (or near the interface) 1c in the order from the region on the central portion 4 side toward the interface 3.
  • each region 1a to 1c elemental analysis is performed at a plurality of randomly selected measurement points (preferably 3 or more), and the abundance ratio of at least one element among the dielectric filler constituent elements is determined for each measurement point.
  • the average value of the obtained abundance ratio is calculated and adopted as the abundance ratio of each of the regions to which the measurement point belongs.
  • the distribution state of the dielectric filler in the agglomerated portion of the molded body cross section is such that the horizontal axis is the horizontal direction (the direction perpendicular to the thickness direction) in the molded body cross section.
  • the width direction of the agglomerated portion may be visualized by a graph in which the abundance ratio (dielectric filler concentration) of one element selected from the dielectric filler constituent elements is used.
  • the abundance ratio (concentration) in the peripheral region is at least lower than the abundance ratio (concentration) in the intermediate region, probably because the aggregated portion is formed by the movement of the dielectric filler. Therefore, as the shape (concentration distribution of aggregates in the vertical cross section) shown by the graph (a graph in which the horizontal axis is a section from one peripheral region to the central region (or the central region) to the other peripheral region).
  • the graph shape may be satisfied for at least one element of the dielectric filler constituent elements, preferably for a plurality of dielectric filler constituent elements, and more preferably for all the dielectric filler constituent elements. (The same applies to the abundance ratios described below).
  • the abundance ratio may be the abundance ratio of one element selected from the dielectric filler constituent elements, and constitutes all the elements and resins constituting the dielectric filler. It may be the ratio of the abundance ratio of one element selected from the dielectric filler constituent elements to the total abundance ratio of carbon.
  • the method for preparing the analysis sample to be subjected to the element analysis is not particularly limited as long as it does not affect the measurement result of the abundance ratio, and is a conventional method, for example, cutting the molded product and observing the cross section (or observation).
  • the surface After cutting out the surface), it may be embedded in a predetermined resin and prepared by precision polishing or the like, and further, depending on the analysis method or the like, further observe the elements not contained in the resin and the dielectric filler. It may be vapor-deposited on the surface.
  • the method of confirming the non-uniformity of the abundance ratio (concentration) of the dielectric filler by elemental analysis has been described, but instead of the elemental analysis, the concentration of the filler such as the method of analyzing the chemical species.
  • a method capable of detecting (or confirming) may be used.
  • the region in the cross section has been described with reference to FIG. 2, if the molded product has an agglomerated portion in a form in which the dielectric filler penetrates or is exposed on the surface, the region is similarly formed on the surface of the molded product instead of the cross section. It may be set and the abundance ratio of the dielectric filler constituent elements may be compared. Usually, the region is often set by a cross section, and the cross section may be an arbitrary cross section, but a cross section substantially parallel to the thickness direction (longitudinal cross section) is preferable.
  • the central portion of the agglomerated portion can be appropriately determined according to the form of the agglomerated portion.
  • the agglomerated portion is usually formed so as to extend in a thickness direction or a direction forming a predetermined angle in the thickness direction (preferably in the thickness direction). Therefore, the central portion is the center of the agglomerated portion (or agglomerated portion element) in the cross section (cross section perpendicular to the thickness direction) of the molded body [the center of gravity of the cross-sectional shape of the agglomerated portion or (when linear)). It may be a central axis (or a central surface) that passes through the center in the width direction and extends along the direction (or thickness direction) in which the agglomerated portion extends.
  • the cross-sectional shape of the agglomerated portion (or agglomerated portion element) in the cross section is not particularly limited, and may be a shape corresponding to the shape of the agglomerated portion described later, for example, a substantially circular shape, a substantially elliptical shape, or a polygonal shape ( Examples include triangular shape, square shape, rectangular shape, etc.), linear shape (straight line or curved shape), spiral shape, irregular shape, and the like.
  • the agglomerates are formed of a plurality of agglomerate elements having the same or different shapes and / or directions [for example, complex (or irregular) with a plurality of agglomerate elements.
  • the central portion of the agglomerate portion having a complicated shape is a central portion in at least one agglomerate element selected from the agglomerate element [aggregate portion]. It can be the center of gravity of the cross-sectional shape of the element or the center in the width direction (if linear).
  • the agglomerate element often has a relatively simple cross-sectional shape (for example, the above-exemplified cross-sectional shape), and the specific shape of the agglomerate element is, for example, a dot shape [cylindrical shape, It may be a polygonal columnar shape such as a square columnar shape (or a rectangular parallelepiped shape)], a linear shape (a wall shape extending linearly or curvedly), and the like.
  • Typical examples of the complex-shaped agglomerate include a U-shaped agglomerate [for example, a pair of rectangular parallelepiped elements (or linear elements having a predetermined length) facing each other, and one end thereof. Agglomerates formed by a rectangular parallelepiped element extending in the opposite direction of the pair of rectangular parallelepiped elements]; Aggregates formed by a pair of columnar elements); Frame-shaped aggregates (for example, aggregates in which predetermined regions such as triangular frame-shaped aggregates and square frame-shaped aggregates are partitioned by wall-shaped aggregate elements).
  • U-shaped agglomerate for example, a pair of rectangular parallelepiped elements (or linear elements having a predetermined length) facing each other, and one end thereof. Agglomerates formed by a rectangular parallelepiped element extending in the opposite direction of the pair of rectangular parallelepiped elements]; Aggregates formed by a pair of columnar elements); Frame-shaped aggregates (for example, aggregates in which predetermined regions such as triangular
  • Lattice agglomerates for example, a plurality of first linear elements extending in parallel with each other at a predetermined interval, intersecting the plurality of first linear elements at a predetermined angle, and having a predetermined interval. It may be an agglomerate formed by a plurality of second linear elements extending in parallel with each other; a honeycomb-like or mesh-like agglomerate, etc.).
  • the agglomerated portion functions as a region for expressing the function of the dielectric filler in the molded product. Therefore, in the molded body, the agglomerated portion is formed into various shapes and structures depending on the application and purpose, but in the present disclosure, it is a simple method of applying active energy to a part of a region and has a complicated shape. And even the structure can be easily formed.
  • the shape of the agglomerated portion is not particularly limited, and examples thereof include a linear shape, a columnar shape (or a rod shape), a spherical shape, an ellipsoidal shape, an indefinite shape, and a planar shape. Further, the shape of the agglomerated portion may be a shape in which the above shapes are combined (for example, a grid shape or the like), or may be a shape corresponding to the cross-sectional shape. Of these shapes, linear, columnar (cylindrical, prismatic, etc.), planar, grid-like, or a combination of these shapes is often used.
  • the shape of the agglomerated portion can be selected from the above-mentioned shapes, but even if it is formed in a pattern (pattern or pattern shape), it is highly productive and the mechanical properties of the molded product can be improved by symmetry and homogeneity. good.
  • the pattern shape may be formed by one agglomerate (a continuous single agglutination), and usually, a plurality of agglomerates separated from each other are often formed.
  • the pattern may be, for example, a pattern (geometric pattern, etc.), a pattern, a symbol (or mark), a character, a picture, a combination of two or more of these, and the molded product due to such a pattern shape. May be given a design.
  • a typical pattern may be a pattern on a plane of a film-like molded body, for example, dots in a regularly or irregularly arranged manner, parallel or non-parallel at predetermined intervals (for example, for example). Examples include straight lines or curves (line-like), grid-like, grid-like, frame-like, spiral-shaped, and combinations of two or more of these arranged at equal intervals (distances different from each other, etc.).
  • the shapes of the dot-shaped aggregates (or the shape of the cross section perpendicular to the thickness direction) arranged regularly or irregularly include polygonal shapes such as squares, circular shapes, star shapes, and indefinite shapes. The above combinations and the like can be mentioned.
  • the molded product of the present disclosure may have a single continuous agglomerate (for example, an agglomerate forming a grid pattern), or may have a plurality of agglomerates separated from each other. Of these, it is preferable to have a plurality of agglomerates from the viewpoint of easily imparting anisotropy to the function of the agglomerates and reducing the proportion of the dielectric filler to improve the mechanical properties of the molded product.
  • the shape of each agglomerated portion may be the same shape or may be a different shape.
  • a mask having various shapes corresponding to an active energy imparting region (polymerization region or curing region) and a three-dimensional mold for molding a resin into a predetermined shape are combined, various shapes can be obtained.
  • the agglomerated portion can be easily formed, and a molded body having a different shape of each agglomerated portion can be easily formed. From the viewpoint of productivity and the like, a molded product having substantially the same shape of the agglomerated portion is preferable.
  • a film-like molded body (particularly) formed in a form in which a plurality of agglomerated portions form a pattern shape and at least one agglomerated portion of the plurality of agglomerated portions extends in the thickness direction and crosses (or penetrates). It may be a dielectric film or a sheet). Further, the agglomerated portions (both ends in the thickness direction) may be exposed on the front surface (particularly, both the front surface and the back surface) of the sheet-shaped molded product.
  • the size such as the width and diameter of the agglomerated portion is not particularly limited and may be, for example, 1 mm or more, but in the present disclosure, a relatively small size (or a relatively small size (or the minimum width in the shape of the agglomerated portion) may be 1 mm or more.
  • a relatively small size or a relatively small size (or the minimum width in the shape of the agglomerated portion) may be 1 mm or more.
  • an agglomerated portion (about 1 mm or less) can be formed. Therefore, the size of the agglomerated portion can be selected from the range of about 0.01 to 500 ⁇ m (for example, 0.1 to 300 ⁇ m), and may be, for example, 1 to 200 ⁇ m or less, preferably about 10 to 150 ⁇ m.
  • the molded product of the present disclosure may be in any shape of one-dimensional shape (for example, fibrous shape), two-dimensional shape (for example, plate shape, sheet shape, film shape, etc.), and three-dimensional shape shape. Of these, the two-dimensional shape is often used.
  • the thickness (average thickness) of the two-dimensional molded product can be selected from the range of, for example, about 0.1 ⁇ m to 1 mm, for example, 0.5 to 500 ⁇ m (for example, 1 to 100 ⁇ m), preferably 3 to 80 ⁇ m (for example, 5 to 50 ⁇ m). More preferably, it may be about 8 to 45 ⁇ m (for example, 10 to 40 ⁇ m), and in particular, when forming a self-supporting film, for example, 5 ⁇ m or more (for example, 10 to 100 ⁇ m), preferably 20 ⁇ m or more (for example, 25 to 25 to 70 ⁇ m), more preferably about 30 to 50 ⁇ m.
  • the method for producing a molded product of the present disclosure includes an agglomeration step of applying active energy to a part of a region of a liquid precursor containing a resin precursor and a dielectric filler to agglomerate the dielectric filler.
  • active energy is applied to a part of the region to polymerize the resin precursor, and the dielectric filler uniformly dispersed inside the molded product moves to part of the inside of the liquid precursor. Aggregates in the area of.
  • the partial region where the dielectric filler aggregates is either a region to which active energy is not applied (unpolymerized region or unexposed region) or a region to which active energy is applied (polymerized region or exposed region). It is an area.
  • the combination of blending and the production conditions particularly, the type of resin and dielectric filler to be combined
  • the active energy is applied to a region other than the region corresponding to the target aggregated form, and conversely, when moving to the polymerization region, the target pattern is simply applied by applying the active energy to the region corresponding to the target aggregated form. Can be formed.
  • the detailed mechanism by which the dielectric filler exhibits such behavior is unknown, but as the resin precursor polymerizes to form a resin in the region to which the active energy is applied, the resin component [resin precursor] It can be presumed that this is because the relationship of affinity between the body and its polymer (cured product) resin] and the dielectric filler changes.
  • the aggregated portion is formed in this way, it is possible to suppress the generation of voids (voids generated at the resin / filler interface, etc.) that are often seen in resin molded products containing fillers. Further, when the dielectric filler is agglomerated in the polymerization region, the thickness of the agglomerated portion may be larger than the thickness of the non-aggregated portion.
  • the resin precursor can be selected according to the type of resin, and when the resin is a thermoplastic resin, the resin precursor contains a monomer (monofunctional polymerizable compound) for forming the thermoplastic resin as the polymerizable compound.
  • the resin is a cured product of a curable resin (such as a cured product having a three-dimensional network structure), it may contain a thermoplastic polymerizable compound.
  • the liquid precursor does not have to contain a solvent (or dispersion medium) and, if necessary, in addition to the cationically polymerizable compound and filler (and other additives if necessary), the liquid precursor.
  • the solvent may be further included to reduce the viscosity of the.
  • solvent examples include ketones (acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, etc.), ethers (dioxane, tetrahydrofuran, etc.), aliphatic hydrocarbons (hexane, etc.), and alicyclic hydrocarbons.
  • Classes (cyclohexane, etc.), aromatic hydrocarbons (toluene, xylene, etc.), carbon halides (dichloromethane, dichloroethane, etc.), esters (acetic acid esters such as methyl acetate, ethyl acetate, n-butyl acetate, etc.), Water, alcohols (ethanol, isopropanol, butanol, cyclohexanol, etc.), cellosolves [methyl cellosolve, ethyl cellosolve, propylene glycol monomethyl ether (1-methoxy-2-propanol), etc.], cellosolve acetates, sulfoxides (dimethyl sulfoxide, etc.) Etc.), amides (dimethylformamide, dimethylacetamide, etc.), carbonates [eg, chain carbonates such as dimethyl carbonate, diethyl carbonate, cyclic carbonates such as ethylene carbonate, prop
  • the solvent may be a mixed solvent.
  • these solvents alcohols such as 2-propanol, carbonates such as propylene carbonate, and esters such as n-butyl acetate are often used.
  • the viscosity of the solvent at 20 ° C. is, for example, 0.5 to 100 mPa ⁇ s (for example, 0.6 to 50 mPa ⁇ s), preferably 0.5 to 20 mPa ⁇ s (for example, 0.7 to 10 mPa ⁇ s), and more preferably. It may be about 0.5 to 5 mPa ⁇ s (for example, 1 to 3 mPa ⁇ s).
  • the viscosity can be measured using a conventional viscometer (such as a single cylindrical rotational viscometer). If the viscosity of the solvent is too high, the viscosity of the liquid precursor may not be sufficiently reduced.
  • the ratio thereof is, for example, 300 parts by mass or less (for example, 1 to 200 parts by mass), preferably 180 parts by mass or less (for example, 50 to 150 parts by mass), preferably 50 parts by mass, based on 100 parts by mass of the liquid precursor. It is about 130 parts by mass or less (for example, 80 to 120 parts by mass). If the amount of the solvent is too small, the viscosity of the liquid precursor may not be sufficiently reduced, and if it is too large, it may be difficult to prepare a molded product having a large thickness.
  • the liquid precursor for imparting active energy may be filled in a mold depending on the desired shape, or may be applied in the case of a sheet-shaped or film-shaped molded product.
  • Conventional methods include roll coaters, air knife coaters, blade coaters, rod coaters, reverse coaters, bar coaters, comma coaters, dip squeeze coaters, die coaters, gravure coaters, micro gravure coaters, and silk screen coaters. Examples include the method, dip method, spray method, and spinner method.
  • the active energy examples include thermal energy from a laser and the like, and active light rays such as ultraviolet rays and electron beams.
  • active rays such as ultraviolet rays and electron beams are preferable, and ultraviolet rays are particularly preferable from the viewpoint of handleability and the like.
  • an energy source (heat source or light source) can be selected according to the type of active energy.
  • the active energy is ultraviolet rays
  • the light source for example, in the case of ultraviolet rays, Deep UV lamp, low pressure mercury lamp, high pressure mercury lamp, ultrahigh pressure mercury lamp, halogen lamp, laser light source (helium-cadmium laser, excima laser, etc.) Light source) etc. can be used.
  • the illuminance may be appropriately selected according to the type and concentration of the polymerizable compound, and the illuminance at a wavelength of 365 nm, for example, 0.1 to 20 mW / cm 2 ( For example 1 ⁇ 18mW / cm 2), preferably 0.3 ⁇ 15mW / cm 2 (e.g., 5 ⁇ 12mW / cm 2), more preferably 0.6 ⁇ 10mW / cm 2 (e.g., 6 ⁇ 9.5mW / cm 2 ) May be the case.
  • the irradiation time may be selected according to the illuminance, and may be, for example, 1 to 60 minutes, preferably 3 to 25 minutes, and more preferably about 5 to 15 minutes.
  • the polymerization of the resin precursor in the applied region can be started, and a dielectric material is applied to the portion to which the active energy is not applied or to the portion to which the active energy is applied.
  • a dielectric material is applied to the portion to which the active energy is not applied or to the portion to which the active energy is applied.
  • an aggregated portion and a non-aggregated portion can be formed.
  • the polymerization of the resin precursor may be completed, or in the polymerization step described later, the polymerization may be completed.
  • the method of imparting active energy to a part of the liquid precursor (or A-stage precursor) can be appropriately selected according to the type of the active energy.
  • a laser is applied to a part of the region. It may be irradiated with light or the like, and in the case of active light such as ultraviolet rays or electron beams, a part of the area is used by using a photomask having a region capable of blocking the active light to the uncured region (or unpolymerized region). (Curing region or polymerization region) may be irradiated with active light.
  • active energy may be applied (or irradiated) diagonally at a predetermined angle to a flat liquid precursor such as a coating film in the aggregation step, but it is usually flat. It is preferable to irradiate the liquid precursor in a direction substantially perpendicular to the liquid precursor.
  • the dielectric filler is aggregated or oriented (regularly or randomly oriented) in the thickness direction of the sheet-shaped molded product, and is formed so as to extend in the thickness direction (irradiation direction). Can easily form agglomerates in a form that traverses or penetrates (or a form in which the dielectric filler is exposed on the surface).
  • the active energy of the precursor molded product (semi-solid precursor molded article, solid precursor molded article, or B-stage precursor molded article) that has undergone the aggregation step is applied. It is preferable to further include a polymerization completion step of imparting active energy to a region (uncured region or unpolymerized region) that has not been imparted to complete the polymerization. By going through the polymerization completion step, the resin precursor in the region to which the active energy has not been applied can also be polymerized to form a resin.
  • the region to which the activation energy is applied may be a region including the region to which the activation energy is not applied in the aggregation step, but it can be easily operated, is excellent in productivity, and further advances the polymerization.
  • a method of imparting active energy to the entire region is preferable from the viewpoint that the mechanical properties of the molded product can be improved.
  • the same active energy as in the aggregation step may be used, and usually, the conditions for imparting the active energy may be changed in a direction of increasing strength. Further, the illuminance may be increased stepwise to irradiate. When using active light (light energy), if the irradiation time is too long, productivity may decrease.
  • thermal energy is applied (or annealed) in the polymerization completion step to complete the polymerization by utilizing the dark reaction (post-polymerization) of the cationically polymerizable compound.
  • the annealing temperature may be, for example, 50 to 200 ° C. (for example, 70 to 180 ° C.), preferably 80 to 150 ° C. (for example, 90 to 130 ° C.), and more preferably about 100 to 120 ° C.
  • the heating time may be, for example, 10 to 120 minutes, preferably about 30 to 60 minutes.
  • a bonded body in which the base material and the molded body are joined by molding the molded body in a state where the liquid precursor is brought into contact with a predetermined base material by a method such as coating.
  • the body may be formed.
  • the material of the base material is not particularly limited and may be either an organic material or an inorganic material.
  • organic material examples include resins [for example, olefin resins such as polyethylene and polypropylene, styrene resins such as ABS resin, vinyl resins such as vinyl chloride resin, (meth) acrylic resins such as polymethylmethacrylate, and polyethylene.
  • resins for example, olefin resins such as polyethylene and polypropylene, styrene resins such as ABS resin, vinyl resins such as vinyl chloride resin, (meth) acrylic resins such as polymethylmethacrylate, and polyethylene.
  • Polyester resin such as terephthalate (PET), polycarbonate resin, polyamide resin, polyimide resin, cellulose ester, cellulose derivative such as cellulose ether, thermoplastic elastomer, etc.]; Synthetic rubber material (isoprene rubber, butyl rubber, etc.); Resin Alternatively, rubber foams (eg, polyurethane foam, foamed polychloroprene rubber, etc.); plant or animal-derived materials (wood, pulp, natural rubber, leather, yarn, etc.) and the like can be mentioned.
  • PET terephthalate
  • polycarbonate resin polycarbonate resin
  • polyamide resin polyamide resin
  • polyimide resin cellulose ester
  • cellulose derivative such as cellulose ether
  • thermoplastic elastomer thermoplastic elastomer, etc.
  • Synthetic rubber material isoprene rubber, butyl rubber, etc.
  • Inorganic materials include, for example, ceramics (glass, silicon, cement, etc.); metals [for example, simple metals (aluminum, iron, nickel, copper, zinc, chromium, titanium, etc.), alloys containing these metals (aluminum alloys, etc.) Steel (stainless steel, etc.), etc.)] and the like.
  • resins for example, polyester resin, polyimide resin, etc., preferably polyimide resin, etc.
  • ceramics glass, etc.
  • metals copper, etc.
  • the form (shape) of the base material is not particularly limited, and for example, a one-dimensional shape such as a fibrous shape (thread shape, rope shape, wire shape, etc.), a plate shape, a sheet shape, a film shape, a foil shape, a cloth or a cloth.
  • Two-dimensional shapes such as shapes (woven cloth, knitted cloth, non-woven fabric, etc.), paper-like (high-quality paper, glassine paper, kraft paper, Japanese paper, etc.), lumps, blocks, rods (cylindrical, polygonal columns, etc.), tubular, etc.
  • the three-dimensional shape of the above can be mentioned.
  • a two-dimensional shape such as a plate shape, a sheet shape, a film shape, or a foil shape.
  • NPG Neopentyl glycol diglycidyl ether, "Epogosee (registered trademark) NPG (D)” manufactured by Yokkaichi Chemical Co., Ltd., viscosity 8 mPa ⁇ s (25 ° C, catalog value)
  • EP1 CEL2021P: 3,4-epoxycyclohexylmethyl (3,4-epoxy) cyclohexanecarboxylate, "Celoxide 2021P” manufactured by Daicel Corporation, viscosity 240 mPa ⁇ s (25 ° C)
  • EP2 (3,4,3', 4'-diepoxy) bicyclohexyl, viscosity 60 mPa ⁇ s (25 ° C) (Dielectric filler)
  • BaTIO 3 Barium titanate fine particles, manufactured by Kanto Chemical Co., Inc., particle size approx. 100 nm (Initiator) C
  • No. 7 A photomask (5-inch glass mask manufactured by Tokyo Process Service Co., Ltd.) in which square or square dots, 100 ⁇ m ⁇ 100 ⁇ m size square shading parts are regularly arranged in a checkered pattern.
  • dielectric constant As a pretreatment step, platinum was deposited on a film whose dielectric constant was measured by an ion sputtering apparatus (“MC1000” manufactured by Hitachi High-Tech Co., Ltd.) on both sides in a circular shape having a diameter of 40 mm so that the centers were the same.
  • the dielectric constant (relative permittivity) of the pretreated film was measured under the following conditions, and the relative value with respect to the corresponding comparative example was taken as the degree of increase.
  • Each component was mixed and stirred at the ratios shown in Table 1 to prepare a liquid precursor containing a cationically polymerizable compound, a dielectric filler and an initiator.
  • the prepared liquid precursor was applied onto a glass substrate using a bar coater to form a coating film.
  • the obtained coating film is irradiated with ultraviolet light (wavelength 365 nm) under the conditions (illuminance, irradiation time) shown in Table 1 using a spot UV device without using a mask, and then the illuminance is further increased.
  • a film having a coating layer having the thickness shown in Table 1 was prepared by irradiating with ultraviolet light without passing through a mask.
  • Examples 1 to 4 Each component was mixed and stirred at the ratios shown in Table 1 to prepare a liquid precursor containing a cationically polymerizable compound, a dielectric filler and an initiator.
  • the prepared liquid precursor was applied onto a glass substrate using a bar coater to form a coating film.
  • the obtained coating film was irradiated with ultraviolet light (wavelength 365 nm) through a mask under the conditions (illuminance, irradiation time) shown in Table 1 using a spot UV device (first stage), and then A film having a coating layer having the film thickness shown in Table 1 was prepared by rapidly irradiating ultraviolet light without passing through a mask (second stage).
  • Examples 5 to 18 Each component was mixed and stirred at the ratios shown in Table 1 to prepare a liquid precursor containing a cationically polymerizable compound, a dielectric filler and an initiator.
  • the prepared liquid precursor was applied onto a glass substrate using a bar coater to form a coating film.
  • the obtained coating film was irradiated with ultraviolet light (wavelength 365 nm) through a mask under the conditions (illumination, irradiation time) shown in Table 1 using a spot UV device (first stage), and then Immediately irradiate ultraviolet light without passing through a mask (second stage), further increase the illuminance and irradiate ultraviolet light without passing through a mask (third stage), and apply the coating layer having the film thickness shown in Table 1.
  • the film to have was prepared.
  • Table 1 shows the evaluation results of the films obtained in Comparative Examples 1 and 2 and Examples 1 to 18.
  • FIGS. 5 to 24 the CCD photographs of the obtained film are shown in FIGS. 5 to 24.
  • the filler agglomerated portion is shown in black (dark color) for observation by transmitted light.
  • the film of the example was excellent in curability, and the dielectric filler was also sufficiently controlled.
  • Each component was mixed and stirred at the ratios shown in Table 2 to prepare a liquid precursor containing a cationically polymerizable compound and an initiator.
  • the prepared liquid precursor was applied onto a glass substrate using a bar coater to form a coating film.
  • the obtained coating film was irradiated with ultraviolet light (wavelength 365 nm) under the conditions (illuminance, irradiation time) shown in Table 2 using a spot UV device without using a mask, and is shown in Table 2.
  • a film having a coating layer having a film thickness was prepared.
  • Each component was mixed and stirred at the ratios shown in Table 2 to prepare a liquid precursor containing a cationically polymerizable compound, a dielectric filler and an initiator.
  • the prepared liquid precursor was applied onto a glass substrate using a bar coater to form a coating film.
  • the obtained coating film is irradiated with ultraviolet light (wavelength 365 nm) under the conditions (illuminance, irradiation time) shown in Table 2 using a spot UV device without using a mask, and then the illuminance is further increased.
  • a film having a coating layer having the thickness shown in Table 2 was prepared by irradiating with ultraviolet light without passing through a mask.
  • Example 19 to 29 Each component was mixed and stirred at the ratios shown in Table 2 to prepare a liquid precursor containing a cationically polymerizable compound, a dielectric filler and an initiator.
  • the prepared liquid precursor was applied onto a glass substrate using a bar coater to form a coating film.
  • the obtained coating film was irradiated with ultraviolet light (wavelength 365 nm) through a mask under the conditions (illumination, irradiation time) shown in Table 2 using a spot UV device (first stage), and then Immediately irradiate ultraviolet light without passing through a mask (second stage), further increase the illuminance and irradiate ultraviolet light without passing through a mask (third stage), and apply the coating layer having the film thickness shown in Table 2.
  • the film to have was prepared.
  • Table 2 shows the evaluation results of the films obtained in Comparative Examples 3 to 7 and Examples 19 to 29. Moreover, the CCD photograph of the obtained film is shown in FIGS. 25-39.
  • the film of the example was excellent in curability, the dielectric filler was sufficiently controlled, and the dielectric constant was also improved.
  • the relative permittivity is shown as a relative value with respect to the comparative example, but in the example, the relative permittivity increased by 20% or more as compared with the comparative example. Further, the dielectric film obtained in the examples did not break even when wound around a glass rod having a diameter of 5 mm, and was excellent in flexibility.
  • the molded body of the present disclosure can be used as a dielectric used in various electric / electronic devices, transportation devices, etc., and is particularly suitable as a dielectric used as a passive element component such as a capacitor, a register, and an inductor.
  • the film-shaped molded body is suitable as a dielectric film (high dielectric constant insulating film) because it has excellent flexibility, and is used as a film capacitor for home appliances, in-vehicle electronic devices, industrial devices, power electronics devices, etc. Especially suitable.
  • Aggregation part 1a Central area (central part, near the central part or the first area) 1b ... Intermediate region (intermediate region, intermediate region or second region) 1c ... Peripheral area (peripheral part, near interface or third area) 2 ... Non-aggregated part 3 ... Interface 4 ... Central part of aggregated part

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

Ce corps moulé comprenant une résine et une charge diélectrique qui est produit grâce à une étape d'agrégation dans laquelle de l'énergie active est appliquée à une région partielle d'un précurseur liquide comprenant un précurseur de résine et des charges diélectriques, et les charges diélectriques sont agrégées pour obtenir ainsi un corps moulé de précurseur. Le corps moulé selon l'invention comprend : une partie agrégée qui est une région dans laquelle les charges diélectriques sont agrégées ; et une partie non agrégée qui est une région autre que la partie agrégée. De plus, le rapport d'abondance des charges diélectriques dans la partie agrégée diminue progressivement en direction d'une interface entre la partie agrégée et la partie non agrégée, au moins au voisinage de l'interface. La résine peut être un produit durci d'une résine photodurcissable. La résine photodurcissable peut être un composé polymérisable par voie cationique. La proportion des charges diélectriques peut aller de 0,1 à 100 parties en masse par rapport à 100 parties en masse de la résine. Le corps moulé peut avoir une forme de film.
PCT/JP2021/000663 2020-01-30 2021-01-12 Corps moulé, précurseur associé, procédés de production associés et utilisations associées WO2021153213A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN202180007079.9A CN114829505B (zh) 2020-01-30 2021-01-12 成型体及其前体、制造方法以及用途
JP2021574595A JPWO2021153213A1 (fr) 2020-01-30 2021-01-12
KR1020227029418A KR20220134586A (ko) 2020-01-30 2021-01-12 성형체 및 그 전구체, 제조 방법 및 용도

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020014057 2020-01-30
JP2020-014057 2020-01-30

Publications (1)

Publication Number Publication Date
WO2021153213A1 true WO2021153213A1 (fr) 2021-08-05

Family

ID=77078800

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2021/000663 WO2021153213A1 (fr) 2020-01-30 2021-01-12 Corps moulé, précurseur associé, procédés de production associés et utilisations associées

Country Status (4)

Country Link
JP (1) JPWO2021153213A1 (fr)
KR (1) KR20220134586A (fr)
CN (1) CN114829505B (fr)
WO (1) WO2021153213A1 (fr)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006104302A (ja) * 2004-10-04 2006-04-20 Sumitomo Bakelite Co Ltd 樹脂組成物とその用途
JP2016222750A (ja) * 2015-05-27 2016-12-28 上海磐樹新材料科技有限公司 樹脂組成物、成形体、及び樹脂組成物製造方法
JP2017014406A (ja) * 2015-07-01 2017-01-19 味の素株式会社 樹脂組成物
WO2017098996A1 (fr) * 2015-12-09 2017-06-15 株式会社Adeka Composition de résine thermodurcissable
JP2018006052A (ja) * 2016-06-29 2018-01-11 株式会社豊田中央研究所 誘電体複合材料及びその製造方法
JP6264897B2 (ja) * 2014-01-23 2018-01-24 トヨタ自動車株式会社 高誘電率フィルム及びフィルムコンデンサ
JP2018048276A (ja) * 2016-09-23 2018-03-29 日立化成株式会社 アンダーフィル材及びそれを用いた電子部品装置
WO2019117156A1 (fr) * 2017-12-13 2019-06-20 Jnc株式会社 Procédé de fabrication d'une feuille de dissipation de chaleur, feuille de dissipation de chaleur, substrat et module semi-conducteur de puissance
WO2020195656A1 (fr) * 2019-03-28 2020-10-01 株式会社ダイセル Corps formé et son procédé de production

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3785012B2 (ja) * 1999-03-24 2006-06-14 富士通株式会社 感光性高誘電体組成物、その組成物からなる感光性高誘電体膜のパターン形成方法、及びその組成物を用いて製造したコンデンサ内蔵型多層回路基板
JP3974336B2 (ja) * 2001-03-01 2007-09-12 ナブテスコ株式会社 光学的立体造形用の活性エネルギー線硬化性樹脂組成物
US7015256B2 (en) * 2002-01-28 2006-03-21 Jsr Corporation Composition for forming photosensitive dielectric material, and transfer film, dielectric material and electronic parts using the same
JP2004172531A (ja) * 2002-11-22 2004-06-17 Nippon Paint Co Ltd 誘電体ペースト
JP2004111400A (ja) * 2003-10-07 2004-04-08 Hitachi Ltd 薄膜誘電体とそれを用いた多層配線板とその製造方法
JP2006004854A (ja) * 2004-06-21 2006-01-05 Toray Ind Inc パターン化された誘電体組成物及びその製造方法
CN101025567B (zh) * 2005-10-07 2011-12-14 Jsr株式会社 固化性树脂组合物、固化膜的形成方法以及固化膜
JP5129935B2 (ja) * 2006-06-13 2013-01-30 日東電工株式会社 シート状複合材料及びその製造方法
JP2011500948A (ja) * 2007-10-26 2011-01-06 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 非対称誘電体膜
CN102822247B (zh) * 2010-04-14 2016-06-08 3M创新有限公司 图案化梯度聚合物膜和方法
CN104102091B (zh) * 2013-04-10 2020-04-21 东京应化工业株式会社 透明绝缘膜形成用组合物
CN103762078B (zh) * 2014-01-20 2017-02-01 中国科学院物理研究所 基于组合薄膜的宽温区可调谐微波器件
JP6274039B2 (ja) * 2014-06-12 2018-02-07 Jsr株式会社 感放射線性樹脂組成物、絶縁膜および表示素子
EP2960280A1 (fr) * 2014-06-26 2015-12-30 E.T.C. S.r.l. Compositions photo-réticulables, des couches minces diélectriques structurées ayant un valeur k élevé et des appareils contentants celles-ci.
JP6441657B2 (ja) * 2014-12-11 2018-12-19 京セラ株式会社 誘電体フィルムと、これを用いたフィルムコンデンサおよび連結型コンデンサ、ならびにインバータ、電動車輌
JP6742785B2 (ja) * 2015-08-13 2020-08-19 太陽インキ製造株式会社 感光性樹脂組成物、ドライフィルムおよびプリント配線板
CN105542399A (zh) * 2016-01-18 2016-05-04 西安交通大学 介电功能梯度绝缘子的离心制造方法
JP6409106B1 (ja) * 2017-08-30 2018-10-17 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP7029267B2 (ja) * 2017-10-06 2022-03-03 日鉄ケミカル＆マテリアル株式会社 感光性樹脂組成物及び樹脂膜付き基板の製造方法
CN110183825B (zh) * 2019-06-14 2022-02-25 清华大学深圳研究生院 介电梯度材料及其应用
CN110265176B (zh) * 2019-06-14 2021-01-12 清华大学深圳研究生院 介电梯度材料及其应用
CN110256813B (zh) * 2019-06-14 2022-02-25 清华大学深圳研究生院 介电梯度材料的制备方法及电子元器件的灌封方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006104302A (ja) * 2004-10-04 2006-04-20 Sumitomo Bakelite Co Ltd 樹脂組成物とその用途
JP6264897B2 (ja) * 2014-01-23 2018-01-24 トヨタ自動車株式会社 高誘電率フィルム及びフィルムコンデンサ
JP2016222750A (ja) * 2015-05-27 2016-12-28 上海磐樹新材料科技有限公司 樹脂組成物、成形体、及び樹脂組成物製造方法
JP2017014406A (ja) * 2015-07-01 2017-01-19 味の素株式会社 樹脂組成物
WO2017098996A1 (fr) * 2015-12-09 2017-06-15 株式会社Adeka Composition de résine thermodurcissable
JP2018006052A (ja) * 2016-06-29 2018-01-11 株式会社豊田中央研究所 誘電体複合材料及びその製造方法
JP2018048276A (ja) * 2016-09-23 2018-03-29 日立化成株式会社 アンダーフィル材及びそれを用いた電子部品装置
WO2019117156A1 (fr) * 2017-12-13 2019-06-20 Jnc株式会社 Procédé de fabrication d'une feuille de dissipation de chaleur, feuille de dissipation de chaleur, substrat et module semi-conducteur de puissance
WO2020195656A1 (fr) * 2019-03-28 2020-10-01 株式会社ダイセル Corps formé et son procédé de production

Also Published As

Publication number Publication date
KR20220134586A (ko) 2022-10-05
JPWO2021153213A1 (fr) 2021-08-05
CN114829505B (zh) 2024-05-03
CN114829505A (zh) 2022-07-29

Similar Documents

Publication Publication Date Title
KR101641480B1 (ko) 밀봉용 조성물
TWI439475B (zh) 硬化性共聚物及硬化性樹脂組成物
JP5926458B2 (ja) 光半導体封止用硬化性組成物
JP2012119470A (ja) 配線基板
JP6336002B2 (ja) 封止材
WO2020195656A1 (fr) Corps formé et son procédé de production
JP2014210412A (ja) ハードコートフィルム及びその製造方法
JPWO2018168862A1 (ja) 樹脂組成物、成形体、積層体、コーティング材及び接着剤
KR102624114B1 (ko) 밀봉용 조성물
WO2021153213A1 (fr) Corps moulé, précurseur associé, procédés de production associés et utilisations associées
JP2015137338A (ja) 導電性繊維被覆粒子を含む硬化性組成物
JP2009235359A (ja) フルオレン系樹脂組成物
WO2011136084A1 (fr) Composition de résine durcissable pour la sérigraphie et carte imprimée
JP2015196783A (ja) シート状組成物
CN113785016A (zh) 潜在性固化催化剂及包含其的树脂组合物
TWI840531B (zh) 成形體及其製造方法
KR102225809B1 (ko) 반도체 소자 삼차원 실장용 충전재
JP2005010770A (ja) 光導波路形成用組成物及び光導波路
JP2015137337A (ja) 導電性繊維被覆粒子を含む硬化性組成物
JPWO2019193961A1 (ja) 樹脂組成物、およびこれを用いた立体造形物の製造方法、ならびに立体造形物
JP6435226B2 (ja) フルオレン骨格を有するエポキシ樹脂及びその製造方法
JP2021120435A (ja) 成形体およびその製造方法
JP2015137339A (ja) 導電性繊維被覆粒子を含む硬化性組成物
KR102385096B1 (ko) 수지 성형품의 제조 방법 및 광학 부품의 제조 방법
JP2017088775A (ja) 硬化性組成物並びに硬化物及びその製造方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21747899

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2021574595

Country of ref document: JP

Kind code of ref document: A

ENP Entry into the national phase

Ref document number: 20227029418

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 21747899

Country of ref document: EP

Kind code of ref document: A1