JPWO2021153213A1 - - Google Patents

Info

Publication number
JPWO2021153213A1
JPWO2021153213A1 JP2021574595A JP2021574595A JPWO2021153213A1 JP WO2021153213 A1 JPWO2021153213 A1 JP WO2021153213A1 JP 2021574595 A JP2021574595 A JP 2021574595A JP 2021574595 A JP2021574595 A JP 2021574595A JP WO2021153213 A1 JPWO2021153213 A1 JP WO2021153213A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021574595A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021153213A1 publication Critical patent/JPWO2021153213A1/ja
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/46Polymerisation initiated by wave energy or particle radiation
    • C08F2/48Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/01Use of inorganic substances as compounding ingredients characterized by their specific function
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00Compositions of unspecified macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00Compositions of unspecified macromolecular compounds
    • C08L101/12Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/32Wound capacitors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2237Oxides; Hydroxides of metals of titanium
    • C08K2003/2241Titanium dioxide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2021574595A 2020-01-30 2021-01-12 Pending JPWO2021153213A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020014057 2020-01-30
PCT/JP2021/000663 WO2021153213A1 (ja) 2020-01-30 2021-01-12 成形体ならびにその前駆体、製造方法および用途

Publications (1)

Publication Number Publication Date
JPWO2021153213A1 true JPWO2021153213A1 (ja) 2021-08-05

Family

ID=77078800

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021574595A Pending JPWO2021153213A1 (ja) 2020-01-30 2021-01-12

Country Status (4)

Country Link
JP (1) JPWO2021153213A1 (ja)
KR (1) KR20220134586A (ja)
CN (1) CN114829505B (ja)
WO (1) WO2021153213A1 (ja)

Family Cites Families (31)

* Cited by examiner, † Cited by third party
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JP3974336B2 (ja) * 2001-03-01 2007-09-12 ナブテスコ株式会社 光学的立体造形用の活性エネルギー線硬化性樹脂組成物
US7015256B2 (en) * 2002-01-28 2006-03-21 Jsr Corporation Composition for forming photosensitive dielectric material, and transfer film, dielectric material and electronic parts using the same
JP2004172531A (ja) * 2002-11-22 2004-06-17 Nippon Paint Co Ltd 誘電体ペースト
JP2004111400A (ja) * 2003-10-07 2004-04-08 Hitachi Ltd 薄膜誘電体とそれを用いた多層配線板とその製造方法
JP2006004854A (ja) * 2004-06-21 2006-01-05 Toray Ind Inc パターン化された誘電体組成物及びその製造方法
JP2006104302A (ja) * 2004-10-04 2006-04-20 Sumitomo Bakelite Co Ltd 樹脂組成物とその用途
CN101025567B (zh) * 2005-10-07 2011-12-14 Jsr株式会社 固化性树脂组合物、固化膜的形成方法以及固化膜
JP5129935B2 (ja) * 2006-06-13 2013-01-30 日東電工株式会社 シート状複合材料及びその製造方法
JP2011500948A (ja) * 2007-10-26 2011-01-06 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 非対称誘電体膜
CN102822247B (zh) * 2010-04-14 2016-06-08 3M创新有限公司 图案化梯度聚合物膜和方法
CN104102091B (zh) * 2013-04-10 2020-04-21 东京应化工业株式会社 透明绝缘膜形成用组合物
CN103762078B (zh) * 2014-01-20 2017-02-01 中国科学院物理研究所 基于组合薄膜的宽温区可调谐微波器件
JP6264897B2 (ja) 2014-01-23 2018-01-24 トヨタ自動車株式会社 高誘電率フィルム及びフィルムコンデンサ
JP6274039B2 (ja) * 2014-06-12 2018-02-07 Jsr株式会社 感放射線性樹脂組成物、絶縁膜および表示素子
EP2960280A1 (en) * 2014-06-26 2015-12-30 E.T.C. S.r.l. Photocrosslinkable compositions, patterned high k thin film dielectrics and related devices
JP6441657B2 (ja) * 2014-12-11 2018-12-19 京セラ株式会社 誘電体フィルムと、これを用いたフィルムコンデンサおよび連結型コンデンサ、ならびにインバータ、電動車輌
JP2016222750A (ja) * 2015-05-27 2016-12-28 上海磐樹新材料科技有限公司 樹脂組成物、成形体、及び樹脂組成物製造方法
JP6679849B2 (ja) * 2015-07-01 2020-04-15 味の素株式会社 樹脂組成物
JP6742785B2 (ja) * 2015-08-13 2020-08-19 太陽インキ製造株式会社 感光性樹脂組成物、ドライフィルムおよびプリント配線板
KR102679698B1 (ko) * 2015-12-09 2024-06-28 가부시키가이샤 아데카 열경화성 수지조성물
CN105542399A (zh) * 2016-01-18 2016-05-04 西安交通大学 介电功能梯度绝缘子的离心制造方法
JP7010580B2 (ja) * 2016-06-29 2022-01-26 株式会社豊田中央研究所 誘電体複合材料及びその製造方法
JP6816426B2 (ja) * 2016-09-23 2021-01-20 昭和電工マテリアルズ株式会社 アンダーフィル材及びそれを用いた電子部品装置
JP6409106B1 (ja) * 2017-08-30 2018-10-17 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP7029267B2 (ja) * 2017-10-06 2022-03-03 日鉄ケミカル&マテリアル株式会社 感光性樹脂組成物及び樹脂膜付き基板の製造方法
WO2019117156A1 (ja) * 2017-12-13 2019-06-20 Jnc株式会社 放熱シートの製造方法、放熱シート、基板、パワー半導体モジュール
JP6775053B2 (ja) * 2019-03-28 2020-10-28 株式会社ダイセル 成形体およびその製造方法
CN110183825B (zh) * 2019-06-14 2022-02-25 清华大学深圳研究生院 介电梯度材料及其应用
CN110265176B (zh) * 2019-06-14 2021-01-12 清华大学深圳研究生院 介电梯度材料及其应用
CN110256813B (zh) * 2019-06-14 2022-02-25 清华大学深圳研究生院 介电梯度材料的制备方法及电子元器件的灌封方法

Also Published As

Publication number Publication date
KR20220134586A (ko) 2022-10-05
CN114829505B (zh) 2024-05-03
WO2021153213A1 (ja) 2021-08-05
CN114829505A (zh) 2022-07-29

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