WO2014125826A1 - 硬化性帯電防止オルガノポリシロキサン組成物および帯電防止シリコーン皮膜 - Google Patents
硬化性帯電防止オルガノポリシロキサン組成物および帯電防止シリコーン皮膜 Download PDFInfo
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- 0 CN(*)C(C(*)=C)=O Chemical compound CN(*)C(C(*)=C)=O 0.000 description 1
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- C08G2261/322—Monomer units or repeat units incorporating structural elements in the main chain incorporating heteroaromatic structural elements in the main chain non-condensed
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Definitions
- the present invention relates to a curable antistatic organopolysiloxane composition that can be cured by condensation reaction, electron beam curing reaction, hydrosilylation reaction, etc. to form a siloxane film having excellent antistatic performance, and by curing the composition.
- a curable antistatic organopolysiloxane composition that can be cured by condensation reaction, electron beam curing reaction, hydrosilylation reaction, etc. to form a siloxane film having excellent antistatic performance, and by curing the composition.
- an antistatic silicone coating To an antistatic silicone coating.
- a ⁇ -conjugated conductive polymer whose main chain is composed of a conjugated system containing ⁇ electrons is synthesized by an electrolytic polymerization method or a chemical oxidative polymerization method.
- electropolymerization method a mixed solution of an electrolyte serving as a dopant and a precursor monomer for forming a ⁇ -conjugated conductive polymer is prepared, an electrode is placed in the solution, and a previously formed electrode material or the like is prepared.
- a ⁇ -conjugated conductive polymer is formed on the surface of the support in the form of a film.
- the electrolytic polymerization method is inferior in mass productivity because it requires an apparatus for electrolytic polymerization and batch production.
- the chemical oxidative polymerization method there is no restriction as described above, and an oxidant and an oxidation polymerization catalyst are added to the precursor monomer that forms the ⁇ -conjugated conductive polymer, and a large amount of ⁇ -conjugated conductive in solution. Can be produced.
- the solubility in a solvent becomes poor with the growth of the conjugated system of the main chain constituting the ⁇ -conjugated conductive polymer, so the ⁇ -conjugated conductive polymer is insoluble in the solvent. Obtained as a solid powder. For this reason, it is difficult to form a ⁇ -conjugated conductive polymer film with a uniform thickness on various substrates such as plastics by a technique such as coating.
- an oxidizing agent is used in the presence of polystyrene sulfonic acid as an anion group-containing polymer acid having a molecular weight of 2,000 to 500,000.
- a method for producing a poly (3,4-dialkoxythiophene) aqueous solution by chemical oxidative polymerization of 3,4-dialkoxythiophene is known (see, for example, Patent Document 1).
- an organic solvent solution of polyaniline and a method for producing the same are known (for example, see Patent Document 3).
- a solvent replacement method by phase inversion from an aqueous solution containing a polyanion and an intrinsic conductive polymer to an organic solvent is also known (see, for example, Patent Document 4, Patent Document 5, Patent Document 6, and Patent Document 7).
- a method of dissolving an intrinsic conductive polymer after lyophilization in an organic solvent is also known (see, for example, Patent Document 8).
- JP-A-7-090060 Japanese Patent Laid-Open No. 7-165892 International Publication WO2005 / 052058 JP 2006-249303 A JP 2007-254730 A JP 2008-050661 A JP 2008-045116 A JP2011-032382A JP 2002-241613 A JP 2003-251756 A
- the conventional conductive solution described above cannot overcome the above-mentioned drawbacks derived from amine compounds when an amine compound is used and the conductive polymer is phase-inverted from an aqueous phase to an organic phase.
- the form of the water dispersion has the disadvantages that it has low practicality and is easily corroded by water.
- An object of the present invention is to provide a curable antistatic organopolysiloxane composition capable of reducing problems derived from amine compounds and water, and an antistatic silicone film formed by curing the composition.
- a curable antistatic organopolysiloxane composition for achieving the above object comprises (a) a ⁇ -conjugated conductive polymer, (b) a polyanion doped in the (a) ⁇ -conjugated conductive polymer, (C) (b) A dispersion product containing a reaction product of an anion other than that required for doping in the polyanion and an organic compound containing an oxirane group and / or an oxetane group, and being soluble in a solvent mainly composed of an organic solvent.
- the curable organopolysiloxane composition (II) is an addition-curable composition.
- the curable organopolysiloxane composition (II) is a condensation-curable composition.
- the curable organopolysiloxane composition (II) is an electron beam curable composition.
- the curable antistatic organopolysiloxane composition according to another embodiment is such that (a) the ⁇ -conjugated conductive polymer is polypyrrole, polythiophene, polyacetylene, polyphenylene, polyphenylene vinylene, polyaniline, polyacene. , Polythiophene vinylenes, and at least one repeating unit selected from the group consisting of two or more copolymers thereof.
- the ⁇ -conjugated conductive polymer is poly (3,4-ethylenedioxythiophene) or polypyrrole.
- the curable antistatic organopolysiloxane composition according to another embodiment is (b) one or a mixture of polyanions selected from a sulfonic acid group, a phosphoric acid group and a carboxyl group.
- the curable antistatic organopolysiloxane composition according to another embodiment is such that (b) the polyanion is polystyrene sulfonic acid, polyvinyl sulfonic acid, polyacrylic acid alkylene sulfonic acid, poly (2-acrylamido-2-methyl-1). -Propanesulfonic acid) or one or more of them as a copolymerization constituent.
- the curable antistatic organopolysiloxane composition according to another embodiment further contains an organic solvent.
- the antistatic silicone film according to the embodiment of the present invention is a layer obtained by supplying and curing any of the above-described curable antistatic organopolysiloxane compositions onto a substrate.
- a curable antistatic organopolysiloxane composition capable of reducing problems derived from amine compounds and water, and an antistatic silicone film formed by curing the composition.
- Embodiment of curable antistatic organopolysiloxane composition > 1.
- Conductive polymer composition The conductive polymer composition (I) contained in the curable antistatic organopolysiloxane composition according to the embodiment of the present invention comprises (a) a ⁇ -conjugated conductive polymer, b) a polyanion doped in the (a) ⁇ -conjugated conductive polymer; (c) an anion other than that required for doping in the (b) polyanion; and an oxirane group and / or oxetane group-containing organic compound. And a reaction product, and a dispersion-soluble composition in a solvent mainly composed of an organic solvent.
- the intrinsic conductive polymer having a polyanion as a dopant used in the present application is formed from fine particles having a particle size of approximately several tens of nanometers. Such fine particles are transparent in the visible light region due to the presence of a polyanion that also acts as a surfactant, and the fine particles appear to be dissolved in the solvent. Actually, the fine particles are dispersed in a solvent. In the present application, this state is referred to as a “dispersion-soluble” state.
- the solvent in this case is a solvent mainly composed of an organic solvent.
- “mainly organic solvent” means that the organic solvent in the solvent exceeds 50%.
- the conductive polymer composition can be manufactured by the following method as an example.
- the conductive polymer / polyanion complex aqueous dispersion is an aqueous solution or aqueous dispersion in which a monomer for a conductive polymer and a dopant coexist. Polymerization is carried out in the presence of an oxidizing agent. However, not only polymerization from such a monomer but also a commercially available conductive polymer / dopant aqueous dispersion may be used.
- Examples of commercially available conductive polymer / dopant aqueous dispersions include Heraeus PEDOT / PSS aqueous dispersion (trade name: Clevios), Agfa PEDOT / PSS aqueous dispersion (trade name: Orgacon), and the like. be able to.
- the conductive polymer composition is prepared by adding an oxirane group or oxetane group-containing compound together with a solvent to the aqueous dispersion, reacting the anion with an oxirane group or oxetane group, and then concentrating, filtering, or separating the reaction solution. Obtained by drying. Thereafter, the obtained concentrate or solid is preferably dissolved or dispersed in a solvent mainly composed of an organic solvent and used in the form of a paint.
- an organic solvent insoluble in water is added during or after the reaction between the anion and the oxirane group or oxetane group.
- the conductive polymer composition is phase-inverted to an insoluble solvent phase, and if necessary, after steps such as dehydration, the conductive polymer composition is dissolved or dispersed in a solvent mainly composed of an organic solvent. May be.
- the conductive polymer composition is phase-inverted into a water-insoluble solvent phase.
- the conductive polymer composition may be dissolved or dispersed in a solvent mainly composed of an organic solvent.
- ⁇ conjugated conductive polymer can be used as long as the main chain is an organic polymer composed of ⁇ conjugated system.
- Any ⁇ conjugated conductive polymer can be used without any limitation.
- polypyrroles, polythiophenes, polyacetylenes, polyphenylenes, polyphenylene vinylenes, polyanilines, polyacenes, polythiophene vinylenes, and copolymers of two or more thereof can be preferably exemplified.
- polypyrroles, polythiophenes or polyanilines can be particularly preferably used.
- the ⁇ -conjugated conductive polymer exhibits sufficiently high conductivity and compatibility with the binder even if it is not substituted, but in order to further improve conductivity, dispersibility or solubility in the binder.
- a functional group such as an alkyl group, an alkenyl group, a carboxyl group, a sulfo group, an alkoxyl group, a hydroxyl group, or a cyano group may be introduced.
- Preferred examples of the ⁇ -conjugated conductive polymer include polypyrrole, poly (N-methylpyrrole), poly (3-methylpyrrole), poly (3-ethylpyrrole), and poly (3-n-propylpyrrole). ), Poly (3-butylpyrrole), poly (3-octylpyrrole), poly (3-decylpyrrole), poly (3-dodecylpyrrole), poly (3,4-dimethylpyrrole), poly (3,4 Dibutylpyrrole), poly (3-carboxypyrrole), poly (3-methyl-4-carboxypyrrole), poly (3-methyl-4-carboxyethylpyrrole), poly (3-methyl-4-carboxybutylpyrrole), Poly (3-hydroxypyrrole), poly (3-methoxypyrrole), poly (3-ethoxypyrrole), poly (3-butoxypyrrole), poly 3-hexyloxypyrrole), poly (3-methyl-4-hexyloxypyrrole),
- polypyrrole, polythiophene, poly (N-methylpyrrole), poly (3-methoxythiophene), poly (3,4-ethylenediene) A copolymer composed of one or more selected from oxythiophene) can be used particularly preferably.
- polypyrrole and poly (3,4-ethylenedioxythiophene) can be preferably used.
- alkyl-substituted compounds such as poly (N-methylpyrrole) and poly (3-methylthiophene) are soluble in organic solvents, and are compatible and dispersible when a hydrophobic resin is added. In order to improve this, it can use more suitably.
- alkyl groups a methyl group is more preferable because it hardly affects the conductivity.
- the polyanion can be used without particular limitation as long as it is an anionic compound.
- An anionic compound is a compound having in the molecule an anionic group capable of causing chemical oxidation doping to the (a) ⁇ -conjugated conductive polymer.
- a sulfate ester group, a phosphate ester group, a phosphate group, a carboxyl group, a sulfone group, and the like are preferable from the viewpoint of ease of production and high stability.
- anionic groups (a) a sulfone group, a sulfate ester group, and a carboxyl group are more preferable because of its excellent doping effect on the ⁇ -conjugated conductive polymer.
- the polyanion examples include a polymer obtained by polymerizing an anion group-containing polymerizable monomer in addition to a polymer in which an anion group is introduced into a polymer by sulfonating a polymer having no anion group with a sulfonating agent. Can do.
- the polyanion is preferably obtained by polymerizing an anion group-containing polymerizable monomer from the viewpoint of ease of production.
- Examples of the production method include a method obtained by subjecting an anionic group-containing polymerizable monomer to oxidative polymerization or radical polymerization in a solvent in the presence of an oxidizing agent and / or a polymerization catalyst.
- a predetermined amount of the anionic group-containing polymerizable monomer is dissolved in a solvent and maintained at a constant temperature, and a predetermined amount of an oxidizing agent and / or a polymerization catalyst is previously dissolved in the solvent.
- the solution was added and allowed to react for a predetermined time.
- the polymer obtained by the reaction is adjusted to a certain concentration by a catalyst.
- a polymerizable monomer having no anionic group can be copolymerized with the anionic group-containing polymerizable monomer.
- the oxidizing agent and / or oxidation catalyst and solvent used in the polymerization of the anionic group-containing polymerizable monomer are the same as those used in the polymerization of the precursor monomer (a) forming the ⁇ -conjugated conductive polymer. .
- the anionic group-containing polymerizable monomer is a monomer having a functional group capable of polymerizing with an anionic group in the molecule.
- polymerizable monomers having no anionic group examples include ethylene, propene, 1-butene, 2-butene, 1-pentene, 2-pentene, 1-hexene, 2-hexene, styrene, p-methylstyrene, p -Ethylstyrene, p-butylstyrene, 2,4,6-trimethylstyrene, p-methoxystyrene, ⁇ -methylstyrene, 2-vinylnaphthalene, 6-methyl-2-vinylnaphthalene, 1-vinylimidazole, vinylpyridine, Vinyl acetate, acrylaldehyde, acrylonitrile, N-vinyl-2-pyrrolidone, N-vinylacetamide, N-vinylformamide, N-vinylimidazole, acrylamide, N, N-dimethylacrylamide, acrylic acid, methyl acrylate, Ethyl acrylate,
- the degree of polymerization of the polyanion thus obtained is not particularly limited, but is usually about 10 to 100,000 monomer units. From the viewpoint of improving solvent solubilization, dispersibility and conductivity, 50 More preferably, it is about 10,000.
- polyanions include polyvinyl sulfonic acid, polystyrene sulfonic acid, polyisoprene sulfonic acid, polyacrylic acid ethyl sulfonic acid, polyacrylic acid butyl sulfonic acid, poly (2-acrylamido-2-methyl-1-propanesulfonic acid) Can be preferably mentioned.
- the obtained anionic compound is an anionic salt
- it is preferably transformed into an anionic acid.
- the method for converting to an anionic acid include an ion exchange method using an ion exchange resin, a dialysis method, and an ultrafiltration method.
- the ultrafiltration method is preferable from the viewpoint of workability.
- an ion exchange method is used.
- ⁇ -conjugated conductive polymer and (b) polyanion those selected from each group of (a) and (b) can be used, but chemical stability, conductivity, storage From the viewpoint of stability, availability, etc., (a) poly (3,4-ethylenedioxythiophene) which is an example of a ⁇ -conjugated conductive polymer, and (b) polystyrene sulfonic acid which is an example of a polyanion, The combination of is preferable.
- poly (3,4-ethylenedioxythiophene) and polystyrenesulfonic acid are in the presence of an oxidizing agent in the form of an aqueous solution or aqueous dispersion in which a monomer for a conductive polymer and a dopant coexist.
- Polymerization may be performed for synthesis.
- a commercially available conductive polymer / dopant aqueous dispersion may be used.
- the content of the polyanion is preferably in the range of 0.1 to 10 mol, more preferably in the range of 1 to 7 mol, with respect to 1 mol of the ⁇ -conjugated conductive polymer.
- the polyanion content is preferably in the range of 0.1 to 10 mol, more preferably in the range of 1 to 7 mol, with respect to 1 mol of the ⁇ -conjugated conductive polymer.
- the solubility in a solvent becomes high, and it becomes easy to obtain a solution of a conductive polymer in a uniformly dispersed form.
- the polyanion content is 10 mol or less, the content ratio of the ⁇ -conjugated conductive polymer can be relatively increased, and higher conductivity can be exhibited.
- reaction product of an anion other than that required for doping in the polyanion and an oxirane group and / or oxetane group-containing organic compound Anion other than that required for doping in the polyanion, and an oxirane group and / or oxetane group
- a reaction product with an organic compound can be obtained by adding an oxirane group and / or oxetane group-containing organic compound to the aforementioned (a) ⁇ -conjugated conductive polymer and (b) polyanion for reaction.
- the organic compound containing an oxirane group and / or oxetane group is not particularly limited as long as it is coordinated or bonded to the anion group or electron withdrawing group of the polyanion. It is more preferable to use a compound containing one or less oxirane group or oxetane group in one molecule because aggregation and gelation can be reduced.
- the molecular weight of the oxirane group and / or oxetane group-containing organic compound is preferably in the range of 50 to 2,000 in view of easy solubility in an organic solvent.
- the amount of the oxirane group and / or oxetane group-containing organic compound is preferably 0.1 to 50 by weight with respect to the anion group or electron withdrawing group in the polyanion of the ⁇ -conjugated conductive polymer, and more 1.0 to 30.0 is preferred.
- the amount of the oxirane group and / or oxetane group-containing organic compound is 0.1 or more in the above weight ratio, the oxirane group and / or oxetane group-containing organic compound is modified so that the anion group of the polyanion dissolves in the solvent. I can do it.
- the amount of the oxirane group and / or oxetane group-containing organic compound is 50 or less in the above weight ratio, the excess oxirane group and / or oxetane group-containing organic compound is difficult to precipitate in the conductive polymer solution. It is easy to prevent a decrease in the electrical conductivity and mechanical properties of the resulting conductive coating film.
- the oxirane group and / or oxetane group-containing organic compound may be a compound having any molecular structure as long as it has an oxirane group or oxetane group in the molecule.
- a compound having a large number of carbons is effective for solubilization in an organic solvent having a low polarity.
- those having 10 or more carbon atoms are preferable for solubilization in organic solvents having low polarity.
- water is frequently used during the production process, it is preferable to avoid using a compound containing an alkoxysilyl group having a functional group that reacts with hydrolysis or water as much as possible.
- an alkoxysilyl group-containing compound may also be used because it is dispersed or soluble in a solvent while maintaining its characteristics.
- organic compounds containing an oxirane group and / or an oxetane group will be exemplified.
- Monofunctional oxirane group-containing compounds include propylene oxide, 2,3-butylene oxide, isobutylene oxide, 1,2-butylene oxide, 1,2-epoxyhexane, 1,2-epoxyheptane, 1,2-epoxypentane, 1,2-epoxyoctane, 1,2-epoxydecane, 1,3-butadiene monooxide, 1,2-epoxytetradecane, glycidyl methyl ether, 1,2-epoxy octadecane, 1,2-epoxy hexadecane, ethyl glycidyl ether Glycidyl isopropyl ether, tert-butyl glycidyl ether, 1,2-epoxyeicosane, 2- (chloromethyl) -1,2-epoxypropane, glycidol, epichlorohydrin, epibromohydrin, butyl
- Polyfunctional oxirane group-containing compounds include 1,7-octadiene diepoxide, neopentyl glycol diglycidyl ether, 4-butanediol diglycidyl ether, 1,2: 3,4-diepoxybutane, 1,2-cyclohexane Diglycidyl dicarboxylate, triglycidyl isocyanurate triglycidyl neopentyl glycol diglycidyl ether, 1,2: 3,4-diepoxybutane, polyethylene glycol # 200 diglycidyl ether, ethylene glycol diglycidyl ether, diethylene glycol diglycidyl ether, propylene glycol diglycidyl ether Ether, tripropylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, neopentyl glycol diglycidyl ether, 1,6- Hexanediol diglycidyl
- Examples of the compound containing a polyfunctional oxetane group include xylylene bisoxetane, 3-ethyl-3 ⁇ [(3-ethyloxetane-3-yl) methoxy] methyl ⁇ oxetane, 1,4-benzenedicarboxylic acid, bis ⁇ [3- And ethyl-3-oxetanyl] methyl ⁇ ester.
- this conductive polymer composition can be solubilized or dispersed in an organic solvent at a high concentration.
- organic solvent used as a solvent for solubilizing or dispersing the conductive polymer composition examples include N-methyl-2-pyrrolidone, N, N-dimethylformamide, N, N-dimethylacetamide, dimethyl sulfoxide, hexamethylenephosphonium tri Polar solvents represented by amide, acetonitrile, benzonitrile, etc .; phenols represented by cresol, phenol, xylenol, etc .; alcohols represented by methanol, ethanol, propanol, butanol, etc .; acetone, methyl ethyl ketone, methyl isobutyl ketone, etc.
- Ketones typified by; esters represented by ethyl acetate, propyl acetate, butyl acetate, etc .; hydrocarbons typified by hexane, heptane, benzene, toluene, xylene, etc .; typified by formic acid, acetic acid, etc.
- Carboxylic acids carbonate compounds represented by ethylene carbonate, propylene carbonate, etc .
- Preferred chain ethers represented by: heterocyclic compounds represented by 3-methyl-2-oxazolidinone, etc .; nitrile compounds represented by acetonitrile, glutarodinitrile, methoxyacetonitrile, propionitrile, benzonitrile, etc. It can be illustrated.
- These organic solvents may be used alone or in combination of two or more.
- alcohols, ketones, ethers, esters, and hydrocarbons can be more suitably used from the viewpoint of easy mixing with various organic substances.
- Examples of the additive to the solvent in which the conductive polymer composition is soluble or dispersed include those that improve conductivity.
- conductivity improvers include glycidyl compounds, polar solvents, polyhydric aliphatic alcohols, nitrogen-containing aromatic cyclic compounds, compounds having two or more hydroxy groups, compounds having two or more carboxy groups, one Examples thereof include compounds having the above hydroxy group and one or more carboxy groups, and lactam compounds. Among these, those that hardly inhibit the curing of the peelable component are preferable.
- the release agent is possible to prevent the release agent from being transferred to the pressure-sensitive adhesive layer after the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet is superimposed on the release agent layer obtained from the antistatic release agent.
- the conductivity improver that does not easily inhibit the peelable component include a glycidyl compound, a polar solvent, and a polyhydric aliphatic alcohol.
- the conductivity improver is preferably in a liquid state at 25 ° C. If it is liquid, the transparency of the release agent layer formed from the antistatic release agent can be improved, and transfer of foreign matter to the pressure-sensitive adhesive layer bonded to the release agent layer can be prevented.
- glycidyl compounds include ethyl glycidyl ether, n-butyl glycidyl ether, t-butyl glycidyl ether, allyl glycidyl ether, benzyl glycidyl ether, glycidyl phenyl ether, bisphenol A diglycidyl ether, glycidyl acrylate, glycidyl methacrylate Examples include ether.
- polar solvents include N-methylformamide, N-methylacrylamide, N-methylmethacrylamide, N-ethylacrylamide, N-ethylmethacrylamide, N, N-dimethylacrylamide, N, N-dimethylmethacrylamide, N, N-diethylacrylamide, N, N-diethylmethacrylamide, 2-hydroxyethylacrylamide, 2-hydroxyethylmethacrylamide, N-methylolacrylamide, N-methylolmethacrylamide, N-methyl-2-pyrrolidone, N-methyl Acetamide, N, N-dimethylformamide, N, N-dimethylacetamide, dimethyl sulfoxide, hexamethylene phosphortriamide, N-vinylpyrrolidone, N-vinylformamide, N-vinylacetamide, milk Methyl, ethyl lactate, propyl and the like.
- polyhydric aliphatic alcohol examples include ethylene glycol, diethylene glycol, propylene glycol, 1,3-butylene glycol, 1,4-butylene glycol, glycerin, diglycerin, isoprene glycol, butanediol, 1,5-pentanediol, 1, Examples include 6-hexanediol, 1,9-nonanediol, neopentyl glycol, trimethylol ethane, trimethylol propane, thiodiethanol, and dipropylene glycol.
- the content of the conductivity improver is preferably 10 to 10,000 parts by mass, more preferably 30 to 5000 parts by mass with respect to 100 parts by mass of the conductive component.
- the content of the conductivity improver is at least the lower limit, the antistatic property can be further improved. On the other hand, if it is below the said upper limit, peelability can be improved more.
- Curable organopolysiloxane composition The conductive polymer composition described above is mixed with a curable organopolysiloxane composition to obtain a silicone having antistatic properties.
- a curable organopolysiloxane composition those exemplified below can be used.
- the addition-curable organopolysiloxane composition is mainly composed of the following compounds. a) Organopolysiloxane having at least 2 alkenyl groups in the molecule b) Organopolysiloxane having at least 3 hydrosilyl groups in the molecule c) From platinum group metal modifications or complexes, mainly platinum, palladium, rhodium, etc. Hydrosilylation catalyst
- Condensation-curable organopolysiloxane composition is mainly composed of any of the compounds described in Examples 1 to 3 below.
- ⁇ Example 1> a) Organopolysiloxane having at least two silanol groups in the molecule b) Organosilane or organopolysiloxane having at least three hydrolyzable groups in the molecule c) Condensation catalyst
- ⁇ Example 3> a) Organopolysiloxane having at least 3 hydrolyzable groups in the molecule b) Condensation catalyst
- Ionizing radiation curable organopolysiloxane composition contains any of the compounds described in Examples 1 to 6 below, and is cured by ultraviolet rays using a photoinitiator, or Cured by electron beam.
- ⁇ Example 1> Acrylamide group-containing organopolysiloxane This organopolysiloxane is an organopolysiloxane containing an acrylamide functional group represented by the following general formula (i) in the molecule.
- R 1 is a hydrogen atom or a methyl group
- R 2 is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms
- R 3 is a divalent hydrocarbon group.
- Organopolysiloxane having at least two mercaptoalkyl groups in one molecule This organopolysiloxane is an organopolysiloxane having at least two mercaptoalkyl functional groups represented by the following general formula (ii) in one molecule. is there.
- R 1 is a hydrogen atom or a methyl group
- R 2 is a divalent hydrocarbon group
- a composition comprising an organopolysiloxane having at least two alkenyl groups in one molecule.
- This organopolysiloxane has at least two alkenyl groups (—C n H 2n ⁇ 1 (n is 2 or more) in one molecule.
- a composition comprising an organopolysiloxane.
- Alkenyl group-containing organopolysiloxane This organopolysiloxane is an organopolysiloxane containing an alkenyl group (—C n H 2n-1 (n is a number of 2 or more)) in the molecule.
- Organopolysiloxane is an organopolysiloxane containing an acrylic group (CH 2 CHCO—) or a methacryl group (CH 2 C (CH 3 ) CO—) in the molecule.
- a) Organopolysiloxane having at least two alkenyl groups in one molecule
- b) Organopolysiloxane having at least two silicon-bonded hydrogen atoms in one molecule
- these curable organopolysiloxane compositions can be used by directly mixing a conductive polymer composition in which a silicone composition is solubilized and dispersed in a solvent mainly composed of an organic solvent. . Moreover, you may dilute and use it for a solvent.
- the antistatic silicone film preferably has a thickness of 100 nm to 1 ⁇ m in view of performance and cost. Therefore, the curable organopolysiloxane composition is usually used after diluted in a solvent.
- the antistatic silicone film according to the embodiment of the present invention is a film obtained by supplying the above curable antistatic organopolysiloxane composition onto a substrate and curing it.
- a paint is prepared from a solution obtained by dissolving or dispersing it in a solvent mainly composed of an organic solvent.
- a coating material is prepared as it is or further diluted with an organic solvent.
- the paint is supplied on a substrate represented by paper, plastic, iron, ceramics, and glass.
- a substrate represented by paper, plastic, iron, ceramics, and glass.
- the supply method include various methods such as a coating method using a brush or a bar coater, a dipping method in which the substrate is immersed in the paint, and a spin coating method in which the paint is dropped on the substrate to rotate the substrate to spread the paint. it can.
- the method for curing the paint on the substrate include a method for removing the organic solvent by heating, a method for curing by irradiating light such as ultraviolet rays and an electron beam, and the like.
- the conductive polymer composition constituting the curable antistatic organopolysiloxane composition according to this embodiment includes an anion other than that required for doping in the polyanion, an oxirane group and / or an oxetane group. Since it contains a reaction product with the contained organic compound, it is dispersible and soluble in various organic solvents. In addition, the conductive polymer composition is soluble in various organic resins or organic resin composition solutions.
- the conductive polymer composition Compared to the method of solvent substitution by reaction with a polyanion residue in a conductive polymer aqueous dispersion using a conventionally known amine compound and a phase transfer catalyst, the conductive polymer composition has storage stability, It is excellent in stability of electric resistance value, and can be applied to fields where amines are obstructed.
- a curable antistatic organopolysiloxane composition stably dispersed and / or solubilized in a solvent mainly composed of an organic solvent by mixing such a conductive polymer composition with a curable organopolysiloxane composition. You can get things. When the curable antistatic organopolysiloxane composition is supplied as a paint on a substrate and cured, a silicone film that is difficult to peel off, excellent in transparency, and also excellent in antistatic properties can be formed.
- Production Example 2 Production of PEDOT-PSS aqueous solution 14.2 g of 3,4-ethylenedioxythiophene and 36.7 g of polystyrene sulfonic acid obtained in Production Example 1 were dissolved in 2000 ml of ion-exchanged water. The solution was mixed at 20 ° C. While stirring the mixed solution obtained at 20 ° C., 29.64 g of ammonium persulfate dissolved in 200 ml of ion exchange water and 8.0 g of ferric sulfate oxidation catalyst solution were slowly added. The reaction was stirred for 3 hours. 2000 ml of ion-exchanged water was added to the resulting reaction solution, and about 2000 ml of solution was removed using an ultrafiltration method.
- peeling force The force required for peeling (hereinafter referred to as “peeling force” or “peel strength”), the residual adhesion rate, and the surface resistivity were evaluated or measured by the following methods.
- peel strength The obtained paint (also referred to as a release agent) was applied to a PET film with a thickness of 38 ⁇ m by a bar coater (No. 4) and heated in a hot air dryer at 120 ° C. for 1 minute to form a release agent layer.
- a 2.5 cm ⁇ 15 cm polyester adhesive tape (trade name: Nitto No.
- polyester adhesive tape was bonded to the release agent layer, and then left to stand at room temperature for 20 hours or heat-treated at 85 ° C. for 20 hours to prepare a test piece.
- the polyester adhesive tape was peeled off from the release agent layer at an angle of 180 ° (peeling speed 0.3 m / min), and the peel strength was measured.
- the dressing sheet can be easily peeled (that is, light peeling). (Residual adhesion rate) Similarly to the measurement of the peel strength, a polyester adhesive tape was bonded to the release agent layer.
- the polyester adhesive tape was peeled from the release agent layer. Furthermore, the polyester adhesive tape was pressure-bonded to an untreated PET film (trade name: Lumirror, manufactured by Toray Industries, Inc.) using a 2 kg roller. Subsequently, the polyester adhesive tape was peeled from the PET film (peeling speed 0.3 m / min) in the same manner as the peel test using a tensile tester, and the peel strength X was measured.
- an untreated PET film trade name: Lumirror, manufactured by Toray Industries, Inc.
- a polyester adhesive tape not bonded to the release agent layer is pressure-bonded to an untreated PET film using a 2 kg roller, the polyester adhesive tape is peeled from the PET film using a tensile tester, and the peel strength Y is measured. did. After the measurement, the residual adhesion rate was determined from the formula of peel strength X / peel strength Y) ⁇ 100 (%). The higher the residual adhesive rate, the less the silicone of the release agent layer moves to the pressure-sensitive adhesive tape, indicating that the decrease in the adhesive strength of the polyester pressure-sensitive adhesive tape due to bonding to the release agent layer is suppressed. (Surface resistivity) Using a Hiresta MCP-HT450 manufactured by Mitsubishi Chemical Corporation, measurement was performed with a probe MCP-HTP12 and an applied voltage of 10V.
- Example 1 ⁇ Manufacture of antistatic silicone film> (Example 1) To 60 g of the PEDOT-PSS solution obtained in Production Example 3, 10 g of KS-3703 (N.V 30% manufactured by Shin-Etsu Chemical Co., Ltd.) and 30 g of methyl ethyl ketone were added, and CAT-PL-50T (manufactured by Shin-Etsu Chemical Co., Ltd.) 0 .3 g was added to make a paint. The paint was applied onto a PET film using a # 4 bar coater and dried at 120 ° C. for 1 minute to form a film. Table 3 shows the film characteristics.
- Example 2 A film was formed under the same conditions as in Example 1 except that the PEDOT-PSS solution used in Example 1 was changed to that obtained in Production Example 4.
- Table 3 shows the film characteristics.
- Example 3 A film was formed under the same conditions as in Example 1 except that the PEDOT-PSS solution used in Example 1 was changed to that obtained in Production Example 5.
- Table 3 shows the film characteristics.
- Example 4 A film was formed under the same conditions as in Example 1 except that the PEDOT-PSS solution used in Example 1 was changed to that obtained in Production Example 6.
- Table 3 shows the film characteristics.
- Example 5 A film was formed under the same conditions as in Example 1 except that the PEDOT-PSS solution used in Example 1 was changed to that obtained in Production Example 7. Table 3 shows the film characteristics.
- Example 6 A film was formed under the same conditions as in Example 1 except that the PEDOT-PSS solution used in Example 1 was changed to that obtained in Production Example 8.
- Table 3 shows the film characteristics.
- Example 7 To 60 g of the PEDOT-PSS solution obtained in Production Example 3, 10 g of KS-847H (N.V 30% manufactured by Shin-Etsu Chemical Co., Ltd.) and 30 g of methyl ethyl ketone were added, and CAT-PL-50T (manufactured by Shin-Etsu Chemical Co., Ltd.) 0 .2 g was added to make a paint. The paint was applied onto a PET film using a # 4 bar coater and dried at 120 ° C. for 1 minute to form a film. Table 3 shows the film characteristics.
- Example 1 In Example 1, except that the PEDOT-PSS solution obtained in Production Example 3 was changed to the PEDOT-PSS solution obtained in Production Example 2, a paint was prepared in the same manner as in Example 1, but PEDOT- PSS aggregation and separation occurred and could not be dispersed in silicone.
- Example 8 To 60 g of the PEDOT-PSS solution obtained in Production Example 3, 3 g of X-62-7205 (N.V 100% manufactured by Shin-Etsu Chemical Co., Ltd.), 30 g of methyl ethyl ketone and 7 g of diacetone alcohol were added, and Darocur 1173 (N.V 5% 0.15 g (manufactured by Ciba Specialty Chemicals) was added to prepare a paint. The paint was applied onto a PET film using a # 4 bar coater and irradiated with an 800 mJ mercury lamp in a nitrogen atmosphere to form a film. Table 4 shows the film characteristics.
- Example 2 (Comparative Example 2) In Example 8, except that the PEDOT-PSS solution obtained in Production Example 3 was changed to the PEDOT-PSS solution obtained in Production Example 2, a paint was prepared in the same manner as in Example 8, but PEDOT-PSS was prepared. Aggregation and separation occurred and could not be dispersed in silicone.
- Example 9 To 60 g of the PEDOT-PSS solution obtained in Production Example 3, 10 g of KS-723B (N.V 30% manufactured by Shin-Etsu Chemical Co., Ltd.) and 30 g of methyl ethyl ketone were added, and CAT-PS-8S (manufactured by Shin-Etsu Chemical Co., Ltd.) 0 .04 g was added to make a paint. The paint was applied onto a PET film using a # 4 bar coater and dried at 120 ° C. for 1 minute to form a film. Table 5 shows the film characteristics.
- Example 3 (Comparative Example 3) In Example 9, except that the PEDOT-PSS solution obtained in Production Example 3 was changed to the PEDOT-PSS solution obtained in Production Example 2, a paint was prepared in the same manner as in Example 9, but PEDOT-PSS was prepared. Aggregation and separation occurred and could not be dispersed in silicone.
- Example 10 To 60 g of the PEDOT-PSS solution obtained in Production Example 9, 10 g of KS-3703 (N.V 30% manufactured by Shin-Etsu Chemical Co., Ltd.) and 30 g of methyl ethyl ketone were added, and CAT-PL-50T (manufactured by Shin-Etsu Chemical Co., Ltd.) 0 .3 g was added to make a paint. The paint was applied onto a PET film using a # 4 bar coater and dried at 120 ° C. for 1 minute to form a film. Table 6 shows the film characteristics.
- Example 11 To 60 g of the PEDOT-PSS solution obtained in Production Example 10, 10 g of KS-3703 (N.V 30% manufactured by Shin-Etsu Chemical Co., Ltd.) and 30 g of methyl ethyl ketone were added, and CAT-PL-50T (manufactured by Shin-Etsu Chemical Co., Ltd.) 0 .3 g was added to make a paint. The paint was applied onto a PET film using a # 4 bar coater and dried at 120 ° C. for 1 minute to form a film. Table 6 shows the film characteristics.
- Example 12 To 60 g of the PEDOT-PSS solution obtained in Production Example 11, 10 g of KS-3703 (N.V 30% manufactured by Shin-Etsu Chemical Co., Ltd.) and 30 g of methyl ethyl ketone were added, and CAT-PL-50T (manufactured by Shin-Etsu Chemical Co., Ltd.) 0 .3 g was added to make a paint. The paint was applied onto a PET film using a # 4 bar coater and dried at 120 ° C. for 1 minute to form a film. Table 6 shows the film characteristics.
- Example 13 to 106 To 60 g of each PEDOT-PSS solution corresponding to the material of Table 1 obtained in Production Example 12, 10 g of KS-3703 (N.V 30% manufactured by Shin-Etsu Chemical Co., Ltd.) and 30 g of methyl ethyl ketone were added, and CAT-PL-50T 0.3 g (manufactured by Shin-Etsu Chemical Co., Ltd.) was added to prepare a paint. The paint was applied onto a PET film using a # 4 bar coater and dried at 120 ° C. for 1 minute to form a film. The film properties are shown in Tables 6 and 7.
- the precipitates obtained in Production Examples 4 to 12 were found to be products derived from the reaction between an anion and an organic compound containing an oxirane group and / or oxetane group.
- the films obtained in Examples 1 to 106 exhibited high electrical conductivity, and were excellent in peel strength and residual adhesion after 20 hours at room temperature or 85 ° C.
- Comparative Examples 1 to 3 PEDOT-PSS aggregated and separated, and could not be dispersed in the silicone resin, and could not be evaluated.
- the present invention can be effectively used for, for example, release paper, antistatic film, conductive paint, touch screen, organic EL, conductive polymer fiber, and the like.
Abstract
Description
1.導電性高分子組成物
本発明の実施の形態に係る硬化性帯電防止オルガノポリシロキサン組成物に含まれる導電性高分子組成物(I)は、(a)π共役系導電性高分子と、(b)上記(a)π共役系導電性高分子にドープしたポリアニオンと、(c)上記(b)ポリアニオン中のドープに要した以外のアニオンと、オキシラン基および/またはオキセタン基含有有機化合物との反応生成物とを含み、有機溶剤を主とする溶媒中に分散可溶な組成物である。本願で用いられるポリアニオンをドーパントとしている真性導電性高分子は、おおよそ数十ナノメータの粒子径を持つ微粒子から形成される。かかる微粒子は、界面活性剤の作用をも持つポリアニオンの存在によって可視光領域において透明であって、溶媒中に微粒子が溶解しているように見える。実際には、当該微粒子は溶媒中に分散しているが、本願では、この状態を「分散可溶」の状態と称している。この場合の溶媒は、有機溶剤を主とする溶媒である。ここで、「有機溶剤を主とする」とは、溶媒中に占める有機溶剤が50%を超えることを意味する。特に、溶媒は、重量比にて有機溶剤:水=90:10~100:0の範囲であるのが好ましい。
当該導電性高分子組成物は、一例として、以下の方法によって製造することができる。
(1)導電性高分子/ポリアニオン錯体水分散体の溶液からの製造方法
導電性高分子/ポリアニオン錯体水分散体は、導電性高分子用のモノマーとドーパントとが共存した水溶液または水分散体の状態に、酸化剤の存在下で重合を行う。ただし、このようなモノマーからの重合のみならず、市販の導電性高分子/ドーパント水分散体を用いても良い。市販の導電性高分子/ドーパント水分散体としては、例えば、Heraeus社のPEDOT/PSS水分散体(商品名: Clevios)、アグファ社のPEDOT/PSS水分散体(商品名: Orgacon)などを挙げることができる。
既に固体となっているπ共役系導電性高分子にドープしたポリアニオンの状態の導電性組成物に、水および/またはオキシラン基若しくはオキセタン基含有化合物が溶解する溶剤を適量添加後、アニオンとオキシラン基若しくはオキセタン基とを反応させる。その後、反応液を濃縮、濾別あるいは乾固して、導電性高分子組成物を得る。その後、好適には、得られた濃縮物あるいは固体を、有機溶剤を主とする溶媒中に可溶若しくは分散させて、塗料の形態で使用する。また、上記製造において、アニオンとオキシラン基若しくはオキセタン基とを反応させた後、水に不溶の有機溶剤を加えて、水不溶の溶剤相に導電性高分子組成物を転相させ、必要に応じて脱水などの工程を経た後に、導電性高分子組成物を、有機溶剤を主とする溶媒中に可溶若しくは分散させても良い。このように、(2)の方法では、凍結乾燥された導電性組成物を原料として用いているので、特に、濃縮する工程の時間を短縮できる。
(a)π共役系導電性高分子
π共役系導電性高分子は、主鎖がπ共役系で構成されている有機高分子であれば、何らの限定もなく用いることができる。例えば、ポリピロール類、ポリチオフェン類、ポリアセチレン類、ポリフェニレン類、ポリフェニレンビニレン類、ポリアニリン類、ポリアセン類、ポリチオフェンビニレン類、およびこれらの内の2以上の共重合体を好適に挙げることができる。重合の容易性、空気中における安定性の観点では、特に、ポリピロール類、ポリチオフェン類あるいはポリアニリン類を好適に用いることができる。π共役系導電性高分子は、本発明においては、無置換のままでも、十分に高い導電性およびバインダへの相溶性を示すが、導電性、バインダへの分散性若しくは溶解性をより高めるためには、アルキル基、アルケニル基、カルボキシル基、スルホ基、アルコキシル基、ヒドロキシル基、シアノ基などの官能基が導入されても良い。
ポリアニオンは、アニオン性化合物であれば、特に制約無く用いることができる。アニオン性化合物とは、分子中に、(a)π共役系導電性高分子への化学酸化ドーピングが起こりうるアニオン基を有する化合物である。アニオン基としては、製造の容易さおよび高い安定性の観点から、硫酸エステル基、リン酸エステル基、リン酸基、カルボキシル基、スルホン基、などが好ましい。これらのアニオン基の内、(a)π共役系導電性高分子へのドープ効果に優れる理由から、スルホン基、硫酸エステル基、カルボキシル基がより好ましい。
ポリアニオン中のドープに要した以外のアニオンと、オキシラン基および/またはオキセタン基含有有機化合物との反応生成物は、前述の(a)π共役系導電性高分子、(b)ポリアニオンに、オキシラン基および/またはオキセタン基含有有機化合物を添加して反応させることにより得られる。
単官能オキシラン基含有化合物としては、プロピレンオキサイド、2,3-ブチレンオキサイド、イソブチレンオキサイド、1,2-ブチレンオキサイド、1,2-エポキシヘキサン、1,2-エポキシヘプタン、1,2-エポキシペンタン、1,2-エポキシオクタン、1,2-エポキシデカン、1,3-ブタジエンモノオキサイド、1,2-エポキシテトラデカン、グリシジルメチルエーテル、1,2-エポキシオクタデカン、1,2-エポキシヘキサデカン、エチルグリシジルエーテル、グリシジルイソプロピルエーテル、tert-ブチルグリシジルエーテル、1,2-エポキシエイコサン、2-(クロロメチル)-1,2-エポキシプロパン、グリシドール、エピクロルヒドリン、エピブロモヒドリン、ブチルグリシジルエーテル、1,2-エポキシヘキサン、1,2-エポキシ-9-デカン、2-(クロロメチル)-1,2-エポキシブタン、2-エチルヘキシルグリシジルエーテル、1,2-エポキシ-1H,1H,2H,2H,3H,3H-トリフルオロブタン、アリルグリシジルエーテル、テトラシアノエチレンオキサイド、グリシジルブチレート、1,2-エポキシシクロオクタン、グリシジルメタクリレート、1,2-エポキシシクロドデカン、1-メチル-1,2-エポキシシクロヘキサン、1,2-エポキシシクロペンタデカン、1,2-エポキシシクロペンタン、1,2-エポキシシクロヘキサン、1,2-エポキシ-1H,1H,2H,2H,3H,3H-ヘプタデカフルオロブタン、3,4-エポキシテトラヒドロフラン、グリシジルステアレート、3-グリシジルオキシプロピルトリメトキシシラン、エポキシ琥珀酸、グリシジルフェニルエーテル、イソホロンオキサイド、α-ピネンオキサイド、2,3-エポキシノルボルネン、ベンジルグリシジルエーテル、ジエトキシ(3-グリシジルオキシプロピル)メチルシラン、3-[2-(パーフルオロヘキシル)エトキシ]-1,2-エポキシプロパン、1,1,1,3,5,5,5-ヘプタメチル-3-(3-グリシジルオキシプロピル)トリシロキサン、9,10-エポキシ-1,5-シクロドデカジエン、4-tert-ブチル安息香酸グリシジル、2,2-ビス(4-グリシジルオキシフェニル)プロパン、2-tert-ブチル-2-[2-(4-クロロフェニル)]エチルオキシラン、スチレンオキサイド、グリシジルトリチルエーテル、2-(3,4-エポキシシクロヘキシル)エチルトリメトキシシラン、2-フェニルプリピレンオキサイド、コレステロール-5α,6α-エポキシド、スチルベンオキサイド、p-トルエンスルホン酸グリシジル、3-メチル-3-フェニルグリシド酸エチル、N-プロピル-N-(2,3-エポキシプロピル)ペルフルオロ-n-オクチルスルホンアミド、(2S,3S)-1,2-エポキシ-3-(tert-ブトキシカルボニルアミノ)-4-フェニルブタン、3-ニトロベンゼンスルホン酸(R)-グリシジル、3-ニトロベンゼンスルホン酸-グリシジル、パルテノリド、N-グリシジルフタルイミド、エンドリン、デイルドリン、4-グリシジルオキシカルバゾール、7,7-ジメチルオクタン酸[オキシラニルメチル]などを例示できる。
単官能オキセタン基含有化合物としては、3-エチル-3-ヒドロキシメチルオキセタン(=オキセタンアルコール)、2-エチルヘキシルオキセタン、(3-エチル-3-オキセタニル)メチルアクリレート、(3-エチル-3-オキセタニル)メタアクリレートなどを例示できる。
導電性高分子組成物を可溶あるいは分散させた溶媒への添加剤として、例えば、導電性を向上させるものを挙げることができる。
(導電性向上剤)
導電性向上剤としては、グリシジル化合物、極性溶媒、多価脂肪族アルコール、窒素含有芳香族性環式化合物、2個以上のヒドロキシ基を有する化合物、2個以上のカルボキシ基を有する化合物、1個以上のヒドロキシ基と1個以上のカルボキシ基を有する化合物、ラクタム化合物等が挙げられる。これらのなかでも、剥離性成分の硬化を阻害しにくいものが好ましい。剥離性成分の硬化を阻害しにくければ、該帯電防止性剥離剤から得た剥離剤層に、粘着シートの粘着剤層を重ねた後、粘着剤層に剥離剤が転写することを防ぐことができる。剥離性成分の硬化を阻害しにくい導電性向上剤としては、グリシジル化合物、極性溶媒、多価脂肪族アルコールが挙げられる。また、導電性向上剤は、25℃で液状であることが好ましい。液状であれば、該帯電防止性剥離剤から形成した剥離剤層の透明性を向上させることができ、剥離剤層に貼り合わされる粘着剤層への異物の転写を防ぐことができる。
上述の導電性高分子組成物は、帯電防止性能を有するシリコーンを得るため、硬化性オルガノポリシロキサン組成物と混合される。この実施の形態で使用される硬化性オルガノポリシロキサン組成物としては、以下に例示するものを使用できる。
付加硬化型オルガノポリシロキサン組成物は、以下の化合物から主に構成される。
a)分子中に少なくとも2個のアルケニル基を有するオルガノポリシロキサン
b)分子中に少なくとも3個のヒドロシリル基を有するオルガノポリシロキサン
c)主として白金、パラジウム、ロジウム等の白金族金属変性体若しくは錯体からなるヒドロシリル化触媒
縮合硬化型オルガノポリシロキサン組成物は、以下 例1~例3記載のいずれかの化合物から主に構成される。
<例1>
a)分子中に少なくとも2個のシラノール基を有するオルガノポリシロキサン
b)分子中に少なくとも3個の加水分解性基を有するオルガノシラン若しくはオルガノポリシロキサン
c)縮合触媒
<例2>
a)分子中に少なくとも2個のシラノール基を有するオルガノポリシロキサン
b)分子中に少なくとも3個のヒドロシリル基を有するオルガノポリシロキサン
c)縮合触媒
<例3>
a)分子中に少なくとも3個の加水分解性基を有するオルガノポリシロキサン
b)縮合触媒
電離放射線硬化型オルガノポリシロキサン組成物は、以下例1~例6記載のいずれかの化合物を含み、光開始剤を用いて紫外線によって硬化され、あるいは電子線によって硬化される。
<例1>
アクリルアミド基含有オルガノポリシロキサン
このオルガノポリシロキサンは、分子中に、下記一般式(i)で表されるアクリルアミド官能基を含むオルガノポリシロキサンである。
一分子中に少なくとも2個のメルカプトアルキル基を有するオルガノポリシロキサン
このオルガノポリシロキサンは、一分子中に、下記一般式(ii)で表されるメルカプトアルキル官能基を少なくとも2個含むオルガノポリシロキサンである。
一分子中に少なくとも2個のアルケニル基を有するオルガノポリシロキサンからなる組成物
このオルガノポリシロキサンは、一分子中に、少なくとも2個のアルケニル基(-CnH2n-1(nは、2以上の数。))を含むオルガノポリシロキサンからなる組成物である。
<例4>
アルケニル基含有オルガノポリシロキサン
このオルガノポリシロキサンは、分子中にアルケニル基(-CnH2n-1(nは、2以上の数。))を含むオルガノポリシロキサンである。
<例5>
アクリル基またはメタクリル基含有オルガノポリシロキサン
このオルガノポリシロキサンは、分子中にアクリル基(CH2CHCO-)またはメタクリル基(CH2C(CH3)CO-)を含むオルガノポリシロキサンである。
<例6>
a)一分子中に少なくとも2個のアルケニル基を有するオルガノポリシロキサン
b)一分子中に少なくとも2個のケイ素原子結合水素原子を有するオルガノポリシロキサン
本発明の実施の形態に係る帯電防止シリコーン皮膜は、前記の硬化性帯電防止オルガノポリシロキサン組成物を基体上に供給して硬化させてなる膜である。硬化性帯電防止オルガノポリシロキサン組成物が固形の場合には、それを、有機溶剤を主とする溶媒中に可溶若しくは分散させた溶液から塗料を用意する。また、硬化性帯電防止オルガノポリシロキサン組成物が既に有機溶剤を主とする溶媒中に可溶若しくは分散した状態の溶液である場合にはそのまま若しくは有機溶剤でさらに希釈して塗料を用意する。塗料は、紙、プラスチック、鉄、セラミックス、ガラスに代表される基体上に供給される。供給方法としては、刷毛やバーコーターを使う塗布法、塗料中に基体を浸漬するディップ法、塗料を基体上に滴下して基体を回転させて塗料を拡げるスピンコート法などの種々の手法を例示できる。基体上の塗料の硬化法は、加熱により有機溶剤を除去する方法、紫外線などの光や電子線を照射して硬化する方法などを例示できる。
(製造例1)・・・ポリスチレンスルホン酸の製造
1000mlのイオン交換水に206gのスチレンスルホン酸ナトリウムを溶解し、80℃にて攪拌しながら、予め10mlの水に溶解した1.14gの過硫酸アンモニウム酸化剤溶液を20分間滴下し、その溶液を12時間攪拌した。得られたスチレンスルホン酸ナトリウム含有溶液に、10質量%に希釈した硫酸を1000ml添加し、限外ろ過法を用いてポリスチレンスルホン酸含有溶液の1000ml溶液を除去し、残液に2000mlのイオン交換水を加え、限外ろ過法を用いて約2000mlの溶液を除去した。上記の限外ろ過操作を3回繰り返した。さらに、得られたろ液に約2000mlのイオン交換水を添加し、限外ろ過法を用いて約2000mlの溶液を除去した。この限外ろ過操作を3回繰り返した。得られた溶液中の水を減圧除去して、無色の固形物を得た。得られたポリスチレンスルホン酸についてGPC(ゲル濾過クロマトグラフィー)カラムを用いたHPLC(高速液体クロマトグラフィー)システムを用いて、昭和電工製プルランを標準物質として重量平均分子量を測定した結果、分子量は30万であった。
14.2gの3,4-エチレンジオキシチオフェンと、製造例1で得た36.7gのポリスチレンスルホン酸を2000mlのイオン交換水に溶かした溶液とを20℃で混合した。これにより得られた混合溶液を20℃に保ち攪拌を行いながら、200mlのイオン交換水に溶かした29.64gの過硫酸アンモニウムと8.0gの硫酸第二鉄の酸化触媒溶液とをゆっくりと添加し、3時間攪拌して反応させた。得られた反応液に2000mlのイオン交換水を添加し、限外ろ過法を用いて約2000ml溶液を除去した。この操作を3回繰り返した。次に、得られた溶液に、200mlの10質量%に希釈した硫酸と2000mlのイオン交換水とを加え、限外ろ過法を用いて約2000mlの溶液を除去し、これに2000mlのイオン交換水を加え、限外ろ過法を用いて約2000mlの溶液を除去した。この操作を3回繰り返した。さらに、得られた溶液に2000mlのイオン交換水を加え、限外ろ過法を用いて約2000mlの溶液を除去した。この操作を5回繰り返し、約1.2質量%の青色のPEDOT-PSSの水溶液を得た。
150gのメタノールと、7.06gのC10、C12混合高級アルコールグリシジルエーテル(共栄社化学株式会社製、エポライトM-1230)とを混合した。次に、製造例2で得られた50gのPEDOT-PSS水溶液を室温で混合攪拌して、紺色の析出物を得た。この析出物をろ過回収し、メチルエチルケトンに分散させ、メチルエチルケトンに分散したPEDOT-PSSの分散液(約0.5質量%濃度)を得た。
(製造例4)・・・PEDOT-PSSの分散した有機溶剤の製造
製造例3のC10、C12混合高級アルコールグリシジルエーテルを12.5gに変えた以外、製造例3と同条件にて、メチルエチルケトンに分散したPEDOT-PSSの分散液(約0.5質量%濃度)を得た。
(製造例5)・・・PEDOT-PSSの分散した有機溶剤の製造
製造例3のC10、C12混合高級アルコールグリシジルエーテルをC12、C13混合高級アルコールグリシジルエーテルに変えた以外、製造例3と同条件にて、メチルエチルケトンに分散したPEDOT-PSSの分散液(約0.5質量%濃度)を得た。
(製造例6)・・・PEDOT-PSSの分散した有機溶剤の製造
製造例5のC12、C13混合高級アルコールグリシジルエーテルを12.5gに変えた以外、製造例5と同条件にて、メチルエチルケトンに分散したPEDOT-PSSの分散液(約0.5質量%濃度)を得た。
(製造例7)・・・PEDOT-PSSの分散した有機溶剤の製造
製造例3のC10、C12混合高級アルコールグリシジルエーテルをC12、C14混合高級アルコールグリシジルエーテルに変えた以外、製造例3と同条件にて、メチルエチルケトンに分散したPEDOT-PSSの分散液(約0.5質量%濃度)を得た。
(製造例8)・・・PEDOT-PSSの分散した有機溶剤の製造
製造例7のC12、C14混合高級アルコールグリシジルエーテルを12.5gに変えた以外、製造例7と同条件にて、メチルエチルケトンに分散したPEDOT-PSSの分散液(約0.5質量%濃度)を得た。
(製造例9)・・・PEDOT-PSSの分散した有機溶剤の製造
製造例2で得られた100gのPEDOT-PSSの水溶液に2gのアリルグリシジルエーテルを添加し室温で4時間攪拌した。次いで200gのメタノールを添加し50℃に温め、予め100gのメタノールに5gのC12、C13混合高級アルコールグリシジルエーテルを混合した溶液を4時間滴下して、紺色の析出物を得た。この析出物を濾過回収し、メチルエチルケトンに分散させ、約1質量%のPEDOT-PSS分散のメチルエチルケトン溶液を得た。
(製造例10)・・・PEDOT-PSSの分散した有機溶剤の製造
製造例9のアリルグリシジルエーテルを3-グリシジルオキシプロピルトリメトキシシランに変えた以外、製造例9と同じ条件にて、約1質量%のPEDOT-PSS分散のメチルエチルケトン溶液を得た。
(製造例11)・・・PEDOT-PSSの分散した有機溶剤の製造
製造例2で得られた100gのPEDOT-PSSの水溶液に100gのメタノールを添加し50℃に温め、予め50gのメタノールに2gのプロピレンオキサイドを混合した溶液を4時間滴下した。その後、予め50gのメタノールに5gのC12、C13混合高級アルコールグリシジルエーテルを混合した溶液を4時間滴下して、紺色の析出物を得た。この析出物を濾過回収し、メチルエチルケトンに分散させ、約1質量%のPEDOT-PSS分散のメチルエチルケトン溶液を得た。
(製造例12)
製造例11のプロピレンオキサイドを下記表1及び表2の品に変えた以外、製造例9と同じ条件にて、それぞれ約1質量%のPEDOT-PSS分散のメチルエチルケトン溶液を得た。
剥離に要する力(以下、「剥離力」または「剥離強度」という。)、残留接着率、表面抵抗率を、以下の方法により評価または測定した。
(剥離強度)
厚さ38μmのPETフィルムに、得られた塗料(剥離剤とも称する)を、バーコーター(No.4によって塗布し、120℃の熱風式乾燥機中で1分間加熱して剥離剤層を形成した。次に、剥離剤層の表面に2.5cm×15cmのポリエステル粘着テープ(商品名:ニットーNo.31B、日東電工(株)製)を載せ、次いで、その粘着テープ上で2kgのローラーを用いて圧着し、剥離剤層にポリエステル粘着テープを貼り合せた。その後、室温で20時間放置し、又は85℃で20時間加熱処理して試験片を作成した。そして、引張試験機を用いて、剥離剤層からポリエステル粘着テープを180度の角度で剥離(剥離速度0.3m/分)し、剥離強度を測定した。剥離強度が小さい程、剥離剤層に粘着シートを貼り合わせた後に、粘着シートを容易に剥離できる(すなわち、軽剥離となる)。
(残留接着率)
上記剥離強度の測定と同様に、剥離剤層にポリエステル粘着テープを貼り合わせた。室温で20時間放置し、または85℃で20時間加熱処理した後、剥離剤層からポリエステル粘着テープを剥がした。さらに、そのポリエステル粘着テープを未処理のPETフィルム(商品名:ルミラー、東レ(株)製)に2kgのローラーを用いて圧着した。次いで、引張試験機を用いて、剥離試験と同様にPETフィルムからポリエステル粘着テープを剥離(剥離速度0.3m/分)し、剥離強度Xを測定した。また、剥離剤層に貼り合せていないポリエステル粘着テープを未処理のPETフィルムに2kgのローラーを用いて圧着し、引張試験機を用いてPETフィルムからポリエステル粘着テープを剥離し、剥離強度Yを測定した。測定後、剥離強度X/剥離強度Y)×100(%)の式より、残留接着率を求めた。残留接着率が高い程、剥離剤層のシリコーンが粘着テープへ移行することが少なく、剥離剤層に貼り合せることによるポリエステル粘着テープの接着力低下が抑制されていることを示す。
(表面抵抗率)
三菱化学社製ハイレスタMCP-HT450を用い、プローブMCP-HTP12、印加電圧10Vで測定した。
(実施例1)
製造例3で得られたPEDOT-PSS溶液60gに、KS-3703(N.V30%信越化学工業株式会社製)10g、メチルエチルケトン30gを加え、CAT-PL-50T(信越化学工業株式会社製)0.3gを添加して、塗料を作製した。その塗料をPETフィルム上に#4のバーコーターを用いて塗布し、120℃で1分間乾燥して皮膜を形成した。膜特性を表3に示す。
(実施例2)
実施例1で用いたPEDOT-PSS溶液を、製造例4で得たものに変えた以外、実施例1と同条件で皮膜を形成した。膜特性を表3に示す。
(実施例3)
実施例1で用いたPEDOT-PSS溶液を、製造例5で得たものに変えた以外、実施例1と同条件で皮膜を形成した。膜特性を表3に示す。
(実施例4)
実施例1で用いたPEDOT-PSS溶液を、製造例6で得たものに変えた以外、実施例1と同条件で皮膜を形成した。膜特性を表3に示す。
(実施例5)
実施例1で用いたPEDOT-PSS溶液を、製造例7で得たものに変えた以外、実施例1と同条件で皮膜を形成した。膜特性を表3に示す。
(実施例6)
実施例1で用いたPEDOT-PSS溶液を、製造例8で得たものに変えた以外、実施例1と同条件で皮膜を形成した。膜特性を表3に示す。
(実施例7)
製造例3で得られたPEDOT-PSS溶液60gに、KS-847H(N.V30%信越化学工業株式会社製)10g、メチルエチルケトン30gを加え、CAT-PL-50T(信越化学工業株式会社製)0.2gを添加して、塗料を作製した。その塗料をPETフィルム上に#4のバーコーターを用いて塗布し、120℃で1分間乾燥して皮膜を形成した。膜特性を表3に示す。
実施例1において、製造例3で得られたPEDOT-PSS溶液を、製造例2で得られたPEDOT-PSS溶液に変えた以外、実施例1と同じようにして塗料を作製したが、PEDOT-PSSの凝集や分離が起こり、シリコーンに分散出来無かった。
製造例3で得られたPEDOT-PSS溶液60gに、X-62-7205(N.V100%信越化学工業株式会社製)3g、メチルエチルケトン30g、ジアセトンアルコール7gを加え、ダロキュア1173(N.V5%チバスペシャリティーケミカルズ製)0.15gを添加して、塗料を作製した。その塗料をPETフィルム上に#4のバーコーターを用いて塗布し、窒素雰囲気下で800mJの水銀灯照射を行い、皮膜を形成した。膜特性を表4に示す。
実施例8において、製造例3で得られたPEDOT-PSS溶液を、製造例2で得られたPEDOT-PSS溶液に変えた以外、実施例8と同じようにして塗料を作製するもPEDOT-PSSの凝集や分離が起こりシリコーンに分散出来無かった。
製造例3で得られたPEDOT-PSS溶液60gに、KS-723B(N.V30%信越化学工業株式会社製)10g、メチルエチルケトン30gを加え、CAT-PS-8S(信越化学工業株式会社製)0.04gを添加して、塗料を作製した。その塗料をPETフィルム上に#4のバーコーターを用いて塗布し、120℃で1分間乾燥して皮膜を形成した。膜特性を表5に示す。
実施例9において、製造例3で得られたPEDOT-PSS溶液を、製造例2で得られたPEDOT-PSS溶液に変えた以外、実施例9と同じようにして塗料を作製するもPEDOT-PSSの凝集や分離が起こりシリコーンに分散出来無かった。
製造例9で得られたPEDOT-PSS溶液60gに、KS-3703(N.V30%信越化学工業株式会社製)10g、メチルエチルケトン30gを加え、CAT-PL-50T(信越化学工業株式会社製)0.3gを添加して、塗料を作製した。その塗料をPETフィルム上に#4のバーコーターを用いて塗布し、120℃で1分間乾燥して皮膜を形成した。膜特性を表6に示す。
(実施例11)
製造例10で得られたPEDOT-PSS溶液60gに、KS-3703(N.V30%信越化学工業株式会社製)10g、メチルエチルケトン30gを加え、CAT-PL-50T(信越化学工業株式会社製)0.3gを添加して、塗料を作製した。その塗料をPETフィルム上に#4のバーコーターを用いて塗布し、120℃で1分間乾燥して皮膜を形成した。膜特性を表6に示す。
(実施例12)
製造例11で得られたPEDOT-PSS溶液60gに、KS-3703(N.V30%信越化学工業株式会社製)10g、メチルエチルケトン30gを加え、CAT-PL-50T(信越化学工業株式会社製)0.3gを添加して、塗料を作製した。その塗料をPETフィルム上に#4のバーコーターを用いて塗布し、120℃で1分間乾燥して皮膜を形成した。膜特性を表6に示す。
(実施例13~106)
製造例12で得られた表1の材料に対応する各々のPEDOT-PSS溶液60gに、KS-3703(N.V30%信越化学工業株式会社製)10g、メチルエチルケトン30gを加え、CAT-PL-50T(信越化学工業株式会社製)0.3gを添加して、塗料を作製した。その塗料をPETフィルム上に#4のバーコーターを用いて塗布し、120℃で1分間乾燥して皮膜を形成した。膜特性を表6及び表7に示す。
製造例3で得られた水不溶の反応物(沈降物)は、メチルエチルケトンに溶解した。また、この沈降物をMEKに溶解させた約1質量%のPEDOT-PSS分散液を、倍量の蒸留水にて希釈し、簡易PHメーターAS212(堀場製作所社製)にて測定したところ、PHは6.8であった。一方、製造例2で得られた1.2質量%のPEDOT-PSS分散液に3倍量の蒸留水を加え同様に測定したところ、PHは2.1であった。このことから、上記沈降物は、少なくともポリアニオンとエポキシ化合物が反応して得られたものと考えられる。製造例4~12で得られた沈降物も同様の測定から、アニオンと、オキシラン基および/またはオキセタン基含有有機化合物との反応に由来する生成物であることがわかった。実施例1~106にて得られた膜は、高い導電性を示し、室温若しくは85℃で20時間経過後の剥離力および残留接着率に優れていた。これに対し、比較例1~3では、PEDOT-PSSの凝集や分離が生じ、シリコーン樹脂への分散すら出来ず、評価に供し得なかった。
Claims (10)
- (a)π共役系導電性高分子と、
(b)上記(a)π共役系導電性高分子にドープしたポリアニオンと、
(c)上記(b)ポリアニオン中のドープに要した以外のアニオンと、オキシラン基および/またはオキセタン基含有有機化合物との反応生成物と、
を含み、有機溶剤を主とする溶媒中に分散可溶な導電性高分子組成物(I)と、
硬化性オルガノポリシロキサン組成物(II)と、
を含む硬化性帯電防止オルガノポリシロキサン組成物。 - 前記(II)の硬化性オルガノポリシロキサン組成物を付加硬化型の組成物とすることを特徴とする請求項1に記載の硬化性帯電防止オルガノポリシロキサン組成物。
- 前記(II)の硬化性オルガノポリシロキサン組成物を縮合硬化型の組成物とすることを特徴とする請求項1に記載の硬化性帯電防止オルガノポリシロキサン組成物。
- 前記(II)の硬化性オルガノポリシロキサン組成物を電子線硬化型の組成物とすることを特徴とする請求項1に記載の硬化性帯電防止オルガノポリシロキサン組成物。
- 前記(a)π共役系導電性高分子が、ポリピロール類、ポリチオフェン類、ポリアセチレン類、ポリフェニレン類、ポリフェニレンビニレン類、ポリアニリン類、ポリアセン類、ポリチオフェンビニレン類、およびこれらの内の2以上の共重合体からなる群から選択される少なくとも1種以上の繰り返し単位を有することを特徴とする請求項1から請求項4のいずれか1項に記載の硬化性帯電防止オルガノポリシロキサン組成物。
- 前記(a)π共役系導電性高分子が、ポリ(3,4-エチレンジオキシチオフェン)またはポリピロールであることを特徴とする請求項5に記載の硬化性帯電防止オルガノポリシロキサン組成物。
- 前記(b)ポリアニオンが、スルホン酸基、リン酸基およびカルボキシル基から選択される1種若しくはそれ以上の混合物であることを特徴とする請求項1から請求項6のいずれか1項に記載の硬化性帯電防止オルガノポリシロキサン組成物。
- 前記(b)ポリアニオンが、ポリスチレンスルホン酸、ポリビニルスルホン酸、ポリアクリル酸アルキレンスルホン酸、ポリ(2-アクリルアミド-2-メチル-1-プロパンスルホン酸)またはそれらの1種以上を共重合構成体として含むものであることを特徴とする請求項1から請求項7のいずれか1項に記載の硬化性帯電防止オルガノポリシロキサン組成物。
- さらに有機溶剤を含むことを特徴とする請求項1から請求項8のいずれか1項に記載の硬化性帯電防止オルガノポリシロキサン組成物。
- 請求項1から請求項9のいずれか1項に記載の硬化性帯電防止オルガノポリシロキサン組成物を基体上に供給して硬化させてなる帯電防止シリコーン皮膜。
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DE102021133248B4 (de) | 2021-12-15 | 2023-06-29 | Karl Storz Se & Co. Kg | Endoskopie-Vorrichtung und Endoskopie-System |
Families Citing this family (8)
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Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0790060A (ja) | 1990-02-08 | 1995-04-04 | Bayer Ag | 新規ポリチオフエン分散体及びその製造方法 |
JPH07165892A (ja) | 1993-12-10 | 1995-06-27 | Marubishi Yuka Kogyo Kk | 導電性高分子コロイド水溶液の製造方法 |
JP2002241613A (ja) | 2001-02-20 | 2002-08-28 | Sony Chem Corp | 帯電防止能を有する剥離剤組成物 |
JP2003251756A (ja) | 2002-02-28 | 2003-09-09 | Sony Chem Corp | 帯電防止能を有する剥離フィルム |
WO2005052058A1 (ja) | 2003-11-28 | 2005-06-09 | Idemitsu Kosan Co., Ltd. | 導電性ポリアニリン組成物、その製造方法及びそれからなる成形体 |
WO2006033388A1 (ja) * | 2004-09-22 | 2006-03-30 | Shin-Etsu Polymer Co., Ltd. | 導電性組成物及びその製造方法、帯電防止塗料、帯電防止膜、帯電防止フィルム、光学フィルタ、及び光情報記録媒体、並びにコンデンサ及びその製造方法 |
JP2006249303A (ja) | 2005-03-11 | 2006-09-21 | Shin Etsu Polymer Co Ltd | 導電性高分子溶液およびその製造方法 |
JP2007254730A (ja) | 2006-02-24 | 2007-10-04 | Toyo Ink Mfg Co Ltd | 導電性組成物 |
JP2008045116A (ja) | 2006-07-18 | 2008-02-28 | Arakawa Chem Ind Co Ltd | 導電性高分子/ドーパント錯体有機溶媒分散体、その製造方法および当該導電性高分子/ドーパント錯体有機溶媒分散体を含有する組成物 |
JP2008045061A (ja) | 2006-08-18 | 2008-02-28 | Shin Etsu Polymer Co Ltd | 導電性固形物ならびにその製造方法、および導電性高分子溶液 |
JP2010095580A (ja) * | 2008-10-15 | 2010-04-30 | Nec Tokin Corp | 導電性高分子組成物およびそれを用いた固体電解コンデンサ |
JP2011001396A (ja) * | 2009-06-16 | 2011-01-06 | Shin Etsu Polymer Co Ltd | 導電性高分子溶液およびその製造方法、帯電防止性シート |
JP2011032382A (ja) | 2009-08-03 | 2011-02-17 | Shin Etsu Polymer Co Ltd | 導電性高分子溶液およびその製造方法 |
JP2012241130A (ja) * | 2011-05-20 | 2012-12-10 | Nagase Chemtex Corp | 帯電防止離型剤組成物及び離型フィルム |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0213A (ja) | 1987-10-13 | 1990-01-05 | Hitachi Chem Co Ltd | 液晶表示素子の透明電極保護被膜形成用組成物 |
JPH028163A (ja) | 1988-06-10 | 1990-01-11 | Sharp Corp | 循環式自動原稿供給装置 |
DE60130187T2 (de) * | 2000-12-13 | 2008-05-21 | Shin-Etsu Chemical Co., Ltd. | Strahlenhärtbare Siliconzusammensetzungen |
JP3714901B2 (ja) * | 2000-12-13 | 2005-11-09 | 信越化学工業株式会社 | 放射線硬化性シリコーン組成物 |
KR100978825B1 (ko) * | 2001-12-04 | 2010-08-30 | 아그파-게바에르트 엔.브이. | 3,4-디알콕시티오펜의 중합체 또는 공중합체 및 비수계용매를 포함하는 조성물 |
JP2005170996A (ja) * | 2003-12-09 | 2005-06-30 | Clariant Internatl Ltd | 放射線硬化型導電性組成物 |
US7442161B2 (en) * | 2004-07-08 | 2008-10-28 | Infocus Corporation | Position adjuster for a device |
TWI325007B (en) * | 2004-10-08 | 2010-05-21 | Shinetsu Polymer Co | Conductive composition and production method thereof, antistatic coating material, antistatic coating, antistatic film, optical filter, and optical information recording medium, and capacitors and production method thereof |
JP5031264B2 (ja) * | 2006-05-17 | 2012-09-19 | 信越ポリマー株式会社 | 帯電防止塗料、帯電防止膜及び帯電防止フィルム、光学フィルタ、光情報記録媒体 |
JP5972511B2 (ja) * | 2008-03-31 | 2016-08-17 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物およびその硬化物 |
JP2010159365A (ja) * | 2009-01-09 | 2010-07-22 | Shin Etsu Polymer Co Ltd | 導電性高分子溶液、導電性積層体および入力デバイス |
JP5501195B2 (ja) * | 2010-11-04 | 2014-05-21 | 信越ポリマー株式会社 | 導電性高分子溶液、導電性塗膜および入力デバイス |
-
2014
- 2014-02-14 WO PCT/JP2014/000751 patent/WO2014125826A1/ja active Application Filing
- 2014-02-14 JP JP2015500149A patent/JP6005832B2/ja active Active
- 2014-02-14 CN CN201480007499.7A patent/CN104995257B/zh active Active
- 2014-02-14 EP EP14751614.0A patent/EP2982712A4/en not_active Withdrawn
- 2014-02-14 KR KR1020157018409A patent/KR101767328B1/ko active IP Right Grant
- 2014-02-14 TW TW103104973A patent/TWI512046B/zh active
- 2014-02-14 DE DE202014011523.0U patent/DE202014011523U1/de not_active Expired - Lifetime
-
2015
- 2015-08-11 US US14/823,578 patent/US20150348670A1/en not_active Abandoned
Patent Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0790060A (ja) | 1990-02-08 | 1995-04-04 | Bayer Ag | 新規ポリチオフエン分散体及びその製造方法 |
JPH07165892A (ja) | 1993-12-10 | 1995-06-27 | Marubishi Yuka Kogyo Kk | 導電性高分子コロイド水溶液の製造方法 |
JP2002241613A (ja) | 2001-02-20 | 2002-08-28 | Sony Chem Corp | 帯電防止能を有する剥離剤組成物 |
JP2003251756A (ja) | 2002-02-28 | 2003-09-09 | Sony Chem Corp | 帯電防止能を有する剥離フィルム |
WO2005052058A1 (ja) | 2003-11-28 | 2005-06-09 | Idemitsu Kosan Co., Ltd. | 導電性ポリアニリン組成物、その製造方法及びそれからなる成形体 |
WO2006033388A1 (ja) * | 2004-09-22 | 2006-03-30 | Shin-Etsu Polymer Co., Ltd. | 導電性組成物及びその製造方法、帯電防止塗料、帯電防止膜、帯電防止フィルム、光学フィルタ、及び光情報記録媒体、並びにコンデンサ及びその製造方法 |
JP2006249303A (ja) | 2005-03-11 | 2006-09-21 | Shin Etsu Polymer Co Ltd | 導電性高分子溶液およびその製造方法 |
JP2007254730A (ja) | 2006-02-24 | 2007-10-04 | Toyo Ink Mfg Co Ltd | 導電性組成物 |
JP2008045116A (ja) | 2006-07-18 | 2008-02-28 | Arakawa Chem Ind Co Ltd | 導電性高分子/ドーパント錯体有機溶媒分散体、その製造方法および当該導電性高分子/ドーパント錯体有機溶媒分散体を含有する組成物 |
JP2008045061A (ja) | 2006-08-18 | 2008-02-28 | Shin Etsu Polymer Co Ltd | 導電性固形物ならびにその製造方法、および導電性高分子溶液 |
JP2010095580A (ja) * | 2008-10-15 | 2010-04-30 | Nec Tokin Corp | 導電性高分子組成物およびそれを用いた固体電解コンデンサ |
JP2011001396A (ja) * | 2009-06-16 | 2011-01-06 | Shin Etsu Polymer Co Ltd | 導電性高分子溶液およびその製造方法、帯電防止性シート |
JP2011032382A (ja) | 2009-08-03 | 2011-02-17 | Shin Etsu Polymer Co Ltd | 導電性高分子溶液およびその製造方法 |
JP2012241130A (ja) * | 2011-05-20 | 2012-12-10 | Nagase Chemtex Corp | 帯電防止離型剤組成物及び離型フィルム |
Non-Patent Citations (1)
Title |
---|
See also references of EP2982712A4 |
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Also Published As
Publication number | Publication date |
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TWI512046B (zh) | 2015-12-11 |
CN104995257A (zh) | 2015-10-21 |
JP6005832B2 (ja) | 2016-10-12 |
EP2982712A1 (en) | 2016-02-10 |
TW201439218A (zh) | 2014-10-16 |
EP2982712A4 (en) | 2016-09-28 |
DE202014011523U1 (de) | 2021-10-20 |
CN104995257B (zh) | 2017-11-24 |
US20150348670A1 (en) | 2015-12-03 |
KR101767328B1 (ko) | 2017-08-10 |
KR20150119842A (ko) | 2015-10-26 |
JPWO2014125826A1 (ja) | 2017-02-02 |
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