WO2014046387A1 - 솔더 페이스트 공급장치 - Google Patents

솔더 페이스트 공급장치 Download PDF

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Publication number
WO2014046387A1
WO2014046387A1 PCT/KR2013/007448 KR2013007448W WO2014046387A1 WO 2014046387 A1 WO2014046387 A1 WO 2014046387A1 KR 2013007448 W KR2013007448 W KR 2013007448W WO 2014046387 A1 WO2014046387 A1 WO 2014046387A1
Authority
WO
WIPO (PCT)
Prior art keywords
solder paste
chamber
unit
bottleneck
accommodating
Prior art date
Application number
PCT/KR2013/007448
Other languages
English (en)
French (fr)
Korean (ko)
Inventor
이동주
Original Assignee
Lee Dong Joo
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lee Dong Joo filed Critical Lee Dong Joo
Priority to JP2015531000A priority Critical patent/JP2015529397A/ja
Priority to CN201380048605.1A priority patent/CN104641733A/zh
Publication of WO2014046387A1 publication Critical patent/WO2014046387A1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0638—Solder feeding devices for viscous material feeding, e.g. solder paste feeding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Definitions

  • the present invention relates to a solder paste supply apparatus, and more particularly, to a solder paste supply apparatus mounted on a screen printer and supplying solder paste on a mask for mounting various chips on a printed circuit board.
  • a printed solder board which is embedded as a main component of electronic devices such as computers and home appliances, may be soldered in a molten state to mount various types of small electronic components such as semiconductor chips or resistor chips.
  • the paste is applied in a regular pattern.
  • the application process of the solder paste is performed by a solder paste coating apparatus called a screen printer.
  • the screen printer presses a solder paste supplied on a metal mask having an opening of a specific pattern with a squeegee to print a printed circuit board. It is applied to the parts mounting part of the.
  • a solder paste supply device is for supplying solder paste onto a mask mounted on a screen printer, and includes a chamber 11 in which the solder paste 1 is accommodated and the solder paste 1 to the outside.
  • the nozzle part 13 to be injected and the cylinder 12 which apply pressure to the solder paste 1 accommodated in the chamber 11 are provided.
  • solder paste supplying device a problem arises in that the solder particles constituting the solder paste 1 and the flux of the liquid phase are separated after a predetermined time in the chamber 11.
  • a large amount of flux is injected through the nozzle part 13 to spray a thinner solder paste 1, and the mounting state of the electronic component on the printed circuit board is caused by the poor solder paste 1.
  • a quality problem occurs that becomes poor.
  • the insufficient amount of the solder paste 1 is continuously supplied to inject the solder paste 1 to the outside, so that the inside of the chamber 11 is always filled with the solder paste 1. To be in a state. Therefore, after the process is completed, the solder paste 1 filled in the chamber 11 in its entirety is discarded, causing a problem of waste of the solder paste.
  • an object of the present invention is to solve such a conventional problem, by alternately pressurizing the solder paste contained in two different chambers and thereby spraying the solder paste onto the mask using the elevated internal pressure,
  • the present invention provides a solder paste supplying apparatus capable of supplying solder paste of the same quality at all times until the process is completed and minimizing the remaining amount of the solder paste which is discarded even after the process is completed.
  • the solder paste supplying apparatus of the present invention includes: a first chamber accommodating solder paste therein and having a first cross section intersecting a moving direction of the solder paste; A second chamber accommodating solder paste therein and having a second cross section crossing the moving direction of the solder paste; A bottleneck connection portion intersecting a moving direction of the solder paste and having a third end surface smaller than the first end surface and the second end surface, and connecting the first chamber and the second chamber; A first pressurizing part configured to apply pressure to the solder paste received in the first chamber to move the solder paste to the second chamber via the bottleneck connection part; A second pressurizing part configured to apply pressure to the solder paste received in the second chamber to move the solder paste to the first chamber via the bottleneck connection part; And a nozzle part formed at the bottleneck connector and configured to spray solder paste through the bottleneck connector to the outside.
  • the solder paste supplying apparatus of the present invention in order to achieve the above object, the first chamber for receiving the solder paste therein; A second chamber accommodating solder paste therein and connected to the first chamber; A first pressurizing unit configured to move the solder paste toward the second chamber by applying pressure to the solder paste accommodated in the first chamber; A second pressurizing part configured to move the solder paste toward the first chamber by applying pressure to the solder paste received in the second chamber; A nozzle unit formed between the first chamber and the second chamber and having a solder paste sprayed to the other chamber from one chamber of the first chamber and the second chamber to the outside; And a controller configured to differently adjust a moving speed of the first pressing unit and a moving speed of the second pressing unit.
  • the solder paste supplying apparatus of the present invention comprises: a chamber accommodating solder paste therein and partitioned into a first accommodating part and a second accommodating part by a partition wall; A bottleneck connecting portion formed between the partition wall and the inner wall of the chamber and connecting the first accommodation part and the second accommodation part; Pressure is applied to the solder paste contained in the first accommodating part to move the solder paste to the second accommodating part via the bottleneck connection part, or to apply pressure to the solder paste accommodated in the second accommodating part.
  • solder paste supply apparatus of the present invention it is possible to always supply the same quality solder paste until the process is completed, and to minimize the defective rate of the printed circuit board due to the non-uniform viscosity of the solder paste.
  • the pressure applied to the solder paste passing through the bottleneck connection portion can be adjusted.
  • solder paste supplying apparatus of the present invention it is possible to supplement the reduction amount of the solder paste without interruption of the spraying process.
  • 1 is a view showing an example of a conventional solder paste supply device
  • FIG. 2 is a view showing a solder paste supplying apparatus according to a first embodiment of the present invention
  • FIG. 3 is a view for explaining the operation principle of the solder paste supply apparatus of FIG.
  • FIG. 4 is a view for explaining the operating state of the blade of the solder paste supply apparatus of FIG.
  • FIG. 5 is a view showing a solder paste supplying apparatus according to a second embodiment of the present invention.
  • FIG. 6 is a view showing a solder paste supply apparatus according to a third embodiment of the present invention.
  • FIG. 7 is a view for explaining the operation principle of the solder paste supply apparatus of FIG.
  • FIG. 2 is a view showing a solder paste supplying apparatus according to a first embodiment of the present invention
  • Figure 3 is a view for explaining the operation principle of the solder paste supplying device of Figure 2
  • Figure 4 is a solder paste of Figure 2 It is a figure for demonstrating the operation state of the blade of a supply apparatus.
  • the solder paste supplying apparatus 100 of the present embodiment is mounted on a screen printer, and supplies solder paste on a mask in order to mount various chips on a printed circuit board.
  • the first chamber 110 accommodates the solder paste 1 therein and has a first end surface 111 crossing the moving direction of the solder paste.
  • the first chamber 110 is preferably formed in a cylindrical shape.
  • the second chamber 120 accommodates the solder paste 1 therein and has a second end surface 121 that crosses the moving direction of the solder paste.
  • the second end surface 121 of the second chamber is formed in the same area as the first end surface 111 of the first chamber, but may be formed in different areas.
  • the second chamber 120 is also preferably formed in a cylindrical shape.
  • the bottleneck connector 130 is formed between the first chamber 110 and the second chamber 120 to connect the first chamber 110 and the second chamber 120.
  • the bottleneck connector 130 has a third end surface 131 that crosses the moving direction of the solder paste, and the third end surface 131 has a smaller area than the first end surface 111 and the second end surface 121.
  • the first chamber 110 and the second chamber 120 may be coupled in a V-shape as a whole with the bottleneck connector 130 therebetween.
  • the first pressing unit 140 is for applying pressure to the solder paste 1 accommodated in the first chamber 110, and includes a first pressing plate 141 and a first pressing driving unit 142.
  • the first pressing plate 141 contacts the solder paste 1 accommodated in the first chamber 110, and reciprocates in the first chamber 110.
  • the first pressure driver 142 is coupled to the first pressure plate 141 to provide a driving force for reciprocating the first pressure plate 141.
  • the first pressure driving unit 142 may be implemented by a pneumatic cylinder or a combination of a motor and a ball screw operating by pneumatic, such a configuration will be apparent to those skilled in the art, detailed description thereof will be omitted.
  • the solder paste 1 moves to the second chamber 120 via the bottleneck connector 130.
  • the second pressing unit 150 is for applying pressure to the solder paste 1 accommodated in the second chamber 120, and includes a second pressing plate 151 and a second pressure driving unit 152.
  • the second pressing plate 151 contacts the solder paste 1 accommodated in the second chamber 120, and reciprocates in the second chamber 120.
  • the second pressure driver 152 is coupled to the second pressure plate 151 to provide a driving force for reciprocating the second pressure plate 151.
  • the second pressure driving unit 152 may also be implemented by a pneumatic cylinder or a combination of a motor and a ball screw operating by pneumatic.
  • the solder paste 1 moves to the first chamber 110 via the bottleneck connector 130.
  • the nozzle unit 160 is formed in the bottleneck connector 130, and the solder paste 1 passing through the bottleneck connector 130 is injected to the outside.
  • the nozzle unit 160 is formed to face the mask M downwardly.
  • the operation principle of the solder paste supply apparatus 100 of the present embodiment is as follows.
  • the second pressing unit 150 installed in the second chamber 120 is a bottleneck connection unit. It does not need to be moved away from 130. However, if the volume reduction amount of the first chamber 110 is greater than the injection amount of the solder paste 1 sprayed to the outside through the nozzle unit 160, the second pressing unit 150 moves away from the bottleneck connector 130. The solder paste 1, which is not moved through the nozzle unit 160, moves to the second chamber 120 side via the bottleneck connector 130.
  • the first pressing unit 140 installed in the first chamber 110 is connected to the bottleneck connection unit 130. It is not necessary to move away, but if the volume reduction amount of the second chamber 120 is greater than the injection amount of the solder paste sprayed to the outside through the nozzle unit 160, the first pressing unit 140 is the bottleneck connector 130 The solder paste, which is moved away from the nozzle and is not injected through the nozzle unit 160, moves to the first chamber 110 via the bottleneck connector 130.
  • the solder paste 1 when the solder paste 1 reciprocates between the first chamber 110 and the second chamber 120, the solder particles constituting the solder paste 1 and the flux are uniformly mixed to form the whole solder paste 1. It may have a uniform viscosity.
  • the nozzle part 160 is closed for a predetermined time and the solder paste 1 is reciprocated between the first chamber 110 and the second chamber 120 to increase the viscosity of the solder paste 1.
  • the nozzle unit 160 is opened to start the spraying process, and the solder paste 1 having a uniform viscosity can be always supplied until the spraying process is completed.
  • the blocking plate 171 is mounted on the bottleneck connector 130 to block a portion of the bottleneck connector 130.
  • the blocking driver 172 moves the blocking plate 171 to adjust the area where the bottleneck connector 130 is blocked by the blocking plate 171.
  • the pressure applied to the solder paste 1 passing through the bottleneck connector 130 may be adjusted. For example, when the blocking plate 171 is moved upward by the blocking driver 172 and the bottleneck connector 130 is relatively opened, the solder paste 1 passing through the bottleneck connector 130 is relatively low. Pressure is applied. On the contrary, when the blocking plate 172 is moved downward by the blocking driving unit 172 and the bottleneck connector 130 is opened relatively little, a relatively high pressure is applied to the solder paste 1 passing through the bottleneck connector 130. Works.
  • the blocking drive unit 172 may be implemented by a pneumatic cylinder or a combination of a motor and a ball screw operating by pneumatic, such a configuration will be apparent to those skilled in the art, detailed description thereof will be omitted.
  • the sensor unit 180 detects an amount of the solder paste 1 accommodated in the first chamber 110 or the second chamber 120, and detects the amount of the solder paste 1 in the first chamber 110 or the second chamber 120. Is installed.
  • the sensor unit 180 may be disposed in the first chamber 110 or the second chamber 120 when the amount of the solder paste 1 accommodated in the first chamber 110 or the second chamber 120 is less than or equal to a predetermined reference capacity.
  • a supply signal for additionally supplying the solder paste 1 is transmitted to the tank unit 190 to be described later.
  • the tank unit 190 receives the supply signal from the sensor unit 180 and supplies the solder paste 1 to the first chamber 110 or the second chamber 120. Therefore, the amount of reduction of the solder paste 1 inside the first chamber 110 or the second chamber 120 can be compensated for without interruption of the spraying process.
  • the blades 101 are respectively installed on both sides of the nozzle unit 160 in a state protruding toward the lower side of the nozzle unit 160 and are formed of an elastic material.
  • the end of the blade 101 is bent toward the nozzle portion 160 side, and when the blade 101 is spaced apart from the mask M, the end of the blade 101 is It is restored to its original state.
  • the lifting drive unit (not shown) raises and lowers the blade 101 in the vertical direction.
  • the lifting driving unit includes a blade 101, and includes a first chamber 110, a second chamber 120, a first pressing unit 140, a second pressing unit 150, a bottleneck connecting unit 130, and a nozzle unit ( It is preferable that all of the 160 are installed to move up and down.
  • Figure 5 is a view showing a solder paste supply apparatus according to a second embodiment of the present invention.
  • members referred to by the same reference numerals as the members shown in FIGS. 2 to 4 have the same configuration and function, and detailed descriptions thereof will be omitted.
  • the solder paste supplying apparatus 200 does not include a bottleneck connector and includes a controller for differently adjusting the moving speed of the first pressing part and the moving speed of the second pressing part.
  • the solder paste 1 is accommodated in the first chamber 110 and the second chamber 120 ′, and the second chamber 120 ′ is connected to the first chamber 110.
  • the first pressing unit 140 ′ applies pressure to the solder paste 1 contained in the first chamber 110 to move the solder paste 1 to the second chamber 120 ′, and the second pressing unit 150. ') Moves the solder paste 1 to the first chamber 110 by applying pressure to the solder paste 1 contained in the second chamber 120'.
  • the nozzle unit 160 ′ is formed between the first chamber 110 and the second chamber 120 ′, and the other chamber is formed from one chamber of the first chamber 110 and the second chamber 120 ′.
  • the solder paste 1 moved to the outside is sprayed to the outside.
  • the nozzle unit 160 ′ is formed downward to face the mask M.
  • the controller 230 adjusts the moving speed of the first pressing unit 140 ′ differently from the moving speed of the second pressing unit 150 ′.
  • the controller 230 adjusts the forward movement speed and the backward movement speed of the first pressing part 140 ′ or the second pressing part 150 ′ differently so that the first chamber 110 and the second chamber 120 ′ may be adjusted. Pressure is applied to the solder paste 1 accommodated in between.
  • the forward movement speed of the second pressing unit 150 ' is adjusted to be faster than the retreat moving speed of the first pressing unit 140', and the second pressing unit 150 'is closer to the first chamber 110.
  • the pressure is applied to the solder paste 1 accommodated in the second chamber 120 'and the solder paste 1 moves to the first chamber 110.
  • the pressure applied to the solder paste 1 accommodated between the first chamber 110 and the second chamber 120 ' is increased, and due to this pressure increase, the solder paste (through the nozzle 160') is applied. 1) is injected into the mask M.
  • solder paste 1 when the solder paste 1 reciprocates the first chamber 110 and the second chamber 120 ′, the solder particles and the flux constituting the solder paste 1 are uniformly mixed to form the first chamber 110.
  • the whole solder paste 1 accommodated in the second chamber 120 ′ may have a uniform viscosity.
  • the blocking plate 171 ′ is mounted between the first chamber 110 and the second chamber 120 ′ to block a partial cross section through which the solder paste 1 passes.
  • the blocking driver 172 ′ moves the blocking plate 171 ′ to adjust a cross section through which the solder paste 1 passes by the blocking plate 171 ′.
  • FIG. 6 is a view showing a solder paste supply apparatus according to a third embodiment of the present invention
  • Figure 7 is a view for explaining the operation principle of the solder paste supply apparatus of FIG. 6 and 7, members referred to by the same reference numerals as the members shown in Figures 2 to 4 have the same configuration and function, detailed description of each of them will be omitted.
  • the solder paste supplying apparatus 300 of the present embodiment is characterized in that one chamber is divided into two receiving portions by partition walls, and the chamber 310 and the bottleneck connecting portion 330 are provided. And a pressurizing part 340 and a nozzle part 360.
  • the chamber 310 accommodates the solder paste 1 therein, and is partitioned into a first accommodating part 312 and a second accommodating part 313 by the partition 311. As shown in FIG. 6, the chamber 310 is preferably formed in a cylindrical shape.
  • the bottleneck connector 330 is formed between the partition 311 and the inner wall of the chamber 310 and connects the first accommodating part 312 and the second accommodating part 313.
  • the bottleneck connector 330 has a relatively narrow cross section in a direction crossing the moving direction of the solder paste as compared with the first accommodating part 312 and the second accommodating part 313.
  • the pressing unit 340 is for applying pressure to the solder paste 1 accommodated in the first accommodating part 312 or the second accommodating part 313, and includes a rotating plate 341 and a rotation driving part.
  • the rotating plate 341 rotates inside the chamber 310 while contacting the solder paste 1 accommodated in the first accommodating part 312 and the second accommodating part 313.
  • the rotation driving unit (not shown) rotates the rotating plate 341 using the rotation axis C disposed between the first accommodation part 312 and the second accommodation part 313 as the center of rotation.
  • the solder paste 1 is injected into the mask M through the nozzle part 360 due to an increase in pressure at the bottleneck connector 330 due to friction.
  • the rotary drive may be implemented by a pneumatic cylinder or an electric motor operated by pneumatic, such a configuration will be apparent to those skilled in the art, detailed description thereof will be omitted.
  • the nozzle unit 360 is formed at the bottleneck connector 330, and the solder paste 1 passing through the bottleneck connector 330 is sprayed to the outside.
  • the nozzle unit 360 is formed to face the mask M downwardly.
  • the solder paste supply apparatus 300 of this embodiment also includes a sensor portion, a tank portion, a blade, and a lift drive portion.
  • the sensor unit detects an amount of the solder paste 1 accommodated in the first accommodating part 312 or the second accommodating part 313 and is installed in the first accommodating part 312 or the second accommodating part 313. do.
  • the sensor unit may be connected to the first accommodation part 312 or the second accommodation part 313 when the amount of the solder paste 1 accommodated in the first accommodation part 312 or the second accommodation part 313 is less than or equal to a predetermined reference capacity.
  • a supply signal for additionally supplying the solder paste 1 is transmitted to the tank portion.
  • the tank part receives the supply signal and supplies the solder paste 1 to the first accommodating part 312 or the second accommodating part 313.
  • the operation principle of the solder paste supplying apparatus 300 of the present embodiment is also substantially the same as the solder paste supplying apparatus 100 of the embodiment shown in FIG.
  • the solder paste supply apparatus configured as described above alternately presses the solder paste contained in two different chambers or accommodating portions and thereby sprays the solder paste onto the mask using the elevated internal pressure.
  • the solder paste supplying apparatus configured as described above has an effect of adjusting the pressure applied to the solder paste passing through the bottleneck connection by adjusting the degree to which the bottleneck connection part is opened using a blocking plate. You can get it.
  • solder paste supply apparatus configured as described above has the effect of replenishing the reduction amount of the solder paste without interruption of the spraying process by sensing the capacity of the solder paste and supplying additional solder paste from the outside. You can get it.
  • the present invention can provide a solder paste supplying apparatus which can always supply the same quality solder paste until the process is completed and minimize the defect rate of the printed circuit board due to the non-uniform viscosity of the solder paste.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
PCT/KR2013/007448 2012-09-18 2013-08-20 솔더 페이스트 공급장치 WO2014046387A1 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2015531000A JP2015529397A (ja) 2012-09-18 2013-08-20 ソルダーペースト供給装置
CN201380048605.1A CN104641733A (zh) 2012-09-18 2013-08-20 焊膏供给装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020120103419A KR101196284B1 (ko) 2012-09-18 2012-09-18 솔더 페이스트 공급장치
KR10-2012-0103419 2012-09-18

Publications (1)

Publication Number Publication Date
WO2014046387A1 true WO2014046387A1 (ko) 2014-03-27

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JP (1) JP2015529397A (ja)
KR (1) KR101196284B1 (ja)
CN (1) CN104641733A (ja)
WO (1) WO2014046387A1 (ja)

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KR102104405B1 (ko) * 2013-10-25 2020-04-24 한화정밀기계 주식회사 솔더 페이스트 프린팅 방법
KR101699356B1 (ko) * 2014-07-16 2017-01-24 이동주 프린트용 용액 공급장치
KR101658406B1 (ko) 2015-06-02 2016-09-30 고형래 솔더 페이스트 균일밀도공급장치
CN105298948A (zh) * 2015-11-17 2016-02-03 侯如升 一种高频加热机气流加压器
EP3292935A1 (en) 2016-09-13 2018-03-14 Unimate Robotica, S.L. Device adapted to dosing pastry substances
KR101920818B1 (ko) 2017-02-28 2018-11-21 한화에어로스페이스 주식회사 솔더 용기의 자동 공급 장치 및 방법
CN109551073B (zh) * 2017-09-26 2020-10-23 天津梦祥原科技有限公司 一种led芯片锡焊装置
CN108608086B (zh) * 2018-04-24 2019-11-12 江西艾芬达暖通科技股份有限公司 一种自动点膏状焊料的设备和方法
KR102051499B1 (ko) 2018-05-10 2019-12-03 한화정밀기계 주식회사 솔더 용기의 자동 공급 장치 및 방법
KR102100515B1 (ko) 2019-03-20 2020-04-13 고혜영 세척성이 향상된 솔더 페이스트 균일밀도공급장치
KR20210055222A (ko) 2019-11-07 2021-05-17 고혜영 진공유닛이 형성된 솔더 페이스트 공급장치 및 이를 통한 솔더페이스트의 덤핑방법
KR102324270B1 (ko) 2020-08-04 2021-11-10 주식회사 삼우 퍼스트 점성유체 공급용 스퀴지모듈

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