WO2014034411A1 - 電力用半導体装置 - Google Patents

電力用半導体装置 Download PDF

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Publication number
WO2014034411A1
WO2014034411A1 PCT/JP2013/071622 JP2013071622W WO2014034411A1 WO 2014034411 A1 WO2014034411 A1 WO 2014034411A1 JP 2013071622 W JP2013071622 W JP 2013071622W WO 2014034411 A1 WO2014034411 A1 WO 2014034411A1
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WIPO (PCT)
Prior art keywords
power semiconductor
electrode
semiconductor device
bonding
semiconductor element
Prior art date
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PCT/JP2013/071622
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English (en)
French (fr)
Inventor
藤野　純司
米田　裕
良孝 大西
菅原　済文
Original Assignee
三菱電機株式会社
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Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to KR1020157004946A priority Critical patent/KR101614669B1/ko
Priority to CN201380044807.9A priority patent/CN104603934B/zh
Priority to US14/417,370 priority patent/US9433075B2/en
Priority to JP2014532910A priority patent/JPWO2014034411A1/ja
Priority to EP13832786.1A priority patent/EP2889902B1/en
Publication of WO2014034411A1 publication Critical patent/WO2014034411A1/ja

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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
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    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2924/15717—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400 C and less than 950 C
    • H01L2924/15724—Aluminium [Al] as principal constituent
    • H—ELECTRICITY
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    • H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
    • H01L2924/15747—Copper [Cu] as principal constituent
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    • H01L2924/156—Material
    • H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
    • H01L2924/1576—Iron [Fe] as principal constituent
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    • H01L2924/161—Cap
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    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
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    • H01L2924/161—Cap
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    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/162—Disposition
    • H01L2924/16251—Connecting to an item not being a semiconductor or solid-state body, e.g. cap-to-substrate
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Definitions

  • the present invention relates to a semiconductor device, and more particularly to a power semiconductor device that requires heat dissipation.
  • Power semiconductor devices are becoming widespread in every product from industrial equipment to home appliances and information terminals. Especially for home appliances, downsizing and high reliability are required. Moreover, since the power semiconductor device handles a high voltage and a large current, it generates a large amount of heat, and it is necessary to efficiently dissipate heat to the outside. Furthermore, it is simultaneously required to be compatible with a wide band gap semiconductor material such as SiC which is likely to become the mainstream in the future because of its high operating temperature and excellent efficiency.
  • a power semiconductor element is often disposed on a substrate on which an electronic circuit is formed.
  • heat generated in the power semiconductor element is radiated to the outside through the substrate.
  • the thermal conductivity of the substrate itself greatly affects the heat dissipation.
  • an AlN substrate that is considered to have excellent thermal conductivity is poorly available.
  • readily available alumina substrates and glass epoxy (Garaepo) substrates have a thermal conductivity of only about 1/20 to 1 / 1,000 of that of metals with excellent thermal conductivity such as copper. Therefore, high heat dissipation cannot be expected.
  • Japanese Patent Laid-Open No. 10-12812 paragraphs 0012 to 0020, FIGS. 4 and 5) Japanese Unexamined Patent Publication No. 7-7033 (paragraphs 0009 to 0012, FIGS. 1 and 2) JP 2004-214522 A (paragraphs 0022 to 0027, FIG. 3)
  • the present invention has been made to solve the above-described problems, and an object thereof is to easily obtain a power semiconductor device that is small in size and excellent in heat dissipation.
  • the power semiconductor device has a predetermined interval with respect to a heat transfer plate to which a heat dissipation member is bonded via an insulating layer on a surface opposite to the mounting surface, and the mounting surface of the heat transfer plate.
  • a printed circuit board that is disposed so as to be opposed to each other, an electrode pattern is formed on a surface opposite to the surface facing the heat transfer plate, and an opening is provided in the vicinity of the electrode pattern; and the heat transfer
  • a power semiconductor element disposed between a board and the printed circuit board and having a back surface bonded to the mounting surface of the heat transfer plate, and a first junction of an element electrode formed on the surface of the power semiconductor element
  • a wiring member having one end bonded to the second electrode and the other end bonded to the second bonding portion of the electrode pattern, and in a space extending in the vertical direction of the mounting surface from the element electrode toward the printed circuit board, When at least a part of the second joining portion enters
  • the electrode pattern and the opening are arranged in a space extending in the
  • the electrode pattern of the printed circuit board can be brought close to the region of the electrode surface of the power semiconductor element, a power semiconductor device having a small size and excellent heat dissipation can be easily obtained.
  • FIG. 1 is a partial plan view of a power semiconductor device, a partial plan view through which some members are transmitted, and a partial cross-sectional view for explaining the configuration of the power semiconductor device according to the first embodiment of the present invention; It is a fragmentary sectional view for demonstrating the structure of the power semiconductor device concerning Embodiment 2 of this invention. It is a fragmentary sectional view for demonstrating the structure of the power semiconductor device concerning Embodiment 3 of this invention. It is a fragmentary sectional view for demonstrating the structure of the power semiconductor device concerning Embodiment 4 of this invention.
  • FIG. 1A and 1B are diagrams for explaining the configuration of a power semiconductor device according to a first embodiment of the present invention.
  • FIG. 1A is a partial plan view of the power semiconductor device, and FIG. Although it is a top view which shows the same part as (a), it is a top view at the time of permeate
  • FIG. 2 is a cross-sectional view including different cutting positions along line C1-C2 (parallel lines) in FIG.
  • the back electrode of the power semiconductor element is bonded to the opposite surface of the heat spreader on which the heat dissipating member is mounted, and the main surface of the power semiconductor element is further removed.
  • the surface electrode through which power flows is electrically connected by wire bonding to the portion of the electrode pattern formed on the interposer substrate that overlaps with a portion of the surface electrode when viewed from the direction perpendicular to the surface electrode surface. It is what I did. Details will be described below.
  • the copper heat spreader 4 (15 mm ⁇ 20 mm ⁇ thickness 1 mm) has an aluminum chassis that functions as a heat dissipation member 9 through an insulating layer 8 on the back side.
  • a back electrode 21E of a 10 mm ⁇ 10 mm IGBT (Insulated Gate Bipolar Transistor), which is a power semiconductor element 2 is solder 6 (Sn—Ag—Cu: melting point 217 ° C.).
  • the interposer substrate 3 is disposed on the surface side of the heat spreader 4 where the power semiconductor elements 2 are bonded, with the potting resin 71 interposed so as to face the heat spreader 4 with a predetermined gap. That is, the power semiconductor element 2 is disposed in the gap between the heat spreader 4 and the interposer substrate 3 so that the back surface is bonded to the heat spreader 4 and the front surface is opposed to the back surface of the interposer substrate 3.
  • the interposer substrate 3 is formed by forming a copper electrode pattern 32 on a base 31 made of glass epoxy (commonly called glass epoxy) formed by impregnating glass fiber with an epoxy resin, and has an opening 3a (width 2 mm ⁇ length). 15 mm), at least a part of the main power electrode 21 ⁇ / b> C and the control electrode 21 ⁇ / b> G, which are electrodes on the surface side of the power semiconductor element 2, is exposed.
  • a bonding electrode 32 p (wire bond pad) for connecting at least the main power electrode 21 C (for example, collector electrode) on the front side of the power semiconductor element 2 in the electrode pattern 32 is perpendicular to the surface of the interposer substrate 3. When viewed from the right direction (z), it is arranged at a position overlapping with at least a part of the main power electrode 21C.
  • the portion exposed from the opening 3a of the main power electrode 21C includes a bonding position for electrical connection with the bonding electrode 32p and a space necessary for bonding.
  • the main power electrode 21C and the bonding electrode 32p on the front surface can be bonded by the aluminum bonding wire 5 having a thickness of 0.5 mm from above the interposer substrate.
  • the stroke length in the extending direction of the surface (xy) of the bonding wire 5 is shorter than the distance (5 mm) from the center to the end of the main power electrode 21C.
  • the bonding electrode 32p for connecting to the control electrode 21G is also at least of the main power electrode 21C when viewed from a direction perpendicular to the surface of the interposer substrate 3. It is arranged in a position that overlaps part.
  • the bonding electrode 5p for gate electrode is electrically connected by the bonding wire 5 having a short process length.
  • the opening 3a is opened longer than the length of the power semiconductor element 2 in the y direction.
  • a predetermined position of the heat spreader 4 exposed from the opening 3 a and another bonding electrode 32 p are electrically connected by the bonding wire 5.
  • a predetermined region between the heat spreader 4 and the interposer substrate 3 and on the upper surface side of the interposer substrate 3 is sealed with a sealing body 7 made of resin so as to enclose the power semiconductor element 2 and the bonding wire 5.
  • the power semiconductor device 1 having an appearance (part) as shown in FIG. 1A can be formed.
  • the electrode pattern 32 continues from the bonding electrode 32p portion to the external terminal portion 32e (the portion exposed in FIG. 1A) via the portion 32b covered with the solder resist 35.
  • the electrodes 21C, 21G, and 21E formed on the power semiconductor element 2 are electrically connected to the outside by the external terminal portions 32e exposed from the sealing body 7.
  • the bonding electrode 32p for connecting the opening 3a provided in the interposer substrate 3 to the main power electrode 21C on the front side is over at least a part of the main power electrode 21C. Arranged to wrap. Thereby, the electrode pattern 32 can be formed so as to bite into the region of the power semiconductor element 2 in the surface extending direction (xy), and the mounting area can be suppressed. Further, since the insulating layer 8 for joining the heat spreader 4 and the heat radiating member 9 does not require rigidity like a circuit board, it is possible to easily ensure thermal conductivity.
  • the power semiconductor device 1 When the power semiconductor device 1 configured as described above is operated, a current flows through the power semiconductor element 2 and the power semiconductor element 2 generates heat. Heat generated in the power semiconductor element 2 is transmitted to the heat radiating member 9 through the heat spreader 4. At this time, since the power semiconductor element 2 and the heat radiating member 9 are connected by a material having excellent thermal conductivity, the generated heat can be efficiently radiated from the heat radiating member 9. In other words, by providing the opening 3a in which the positional relationship with the power semiconductor element 2 is adjusted, processing corresponding to solder bonding is not performed, and operation from a predetermined direction like ultrasonic bonding such as wire bonding can be performed. Even when a power semiconductor element that requires necessary wiring is used, a power semiconductor device that is small in size, has high heat dissipation, and high reliability can be obtained.
  • the width of the opening 3a (direction parallel to the wire bonding direction: x direction in the drawing) needs to be larger than the bonding length of the wire bond, but considering the insertion space of the wire bond tool. It is considered that 200% or more of the wire diameter is necessary.
  • the sealing body 7 in order to prevent deformation of the bonding wire 5 and ensure high insulation, a material with high flexibility is often used for the sealing body 7.
  • the potting resin 71 serving as a spacer is necessary for forming a desired interval between the heat spreader 4 and the interposer substrate 3, and the surface of the power semiconductor element 2 having a complicated shape such as a trench structure is formed on the interposer substrate 3. There is an effect of preventing direct contact. Further, in order to ensure heat dissipation, the interposer substrate 3 is often screwed to the heat dissipation member 9 for the purpose of pressing the heat spreader 4 against the heat dissipation member 9.
  • the stress at this time is received by the potting resin 71 serving as a spacer and transmitted to the heat spreader 4, so that the flexible sealing body is deformed so that the stress is not transmitted to the power semiconductor element 2 and the bonding wire 5. .
  • the potting resin 71 is harder (has a higher elastic modulus) than the sealing body 7 and is more effective.
  • the interposer board 3 which is one of the printed boards has been described as an example.
  • the present invention is not limited to the interposer board 3 and is applicable to various printed boards including a mother board, for example. Is possible. That is, in the power semiconductor device according to the present embodiment and each of the following embodiments, the interposer substrate 3 can be read as a printed circuit board and applied.
  • the power semiconductor device 1 is a heat transfer plate in which the heat dissipation member 9 is joined to the surface opposite to the mounting surface via the insulating layer 8.
  • the heat spreader 4 and the mounting surface of the heat transfer plate (heat spreader 4) are arranged so as to face each other with a predetermined interval, and the surface opposite the inner surface facing the heat transfer plate (heat spreader 4)
  • a printed circuit board (interposer substrate 3) having an electrode pattern 32 formed on the outer side and an opening 3a provided in the vicinity of the electrode pattern 32, a heat transfer plate (heat spreader 4), and a printed circuit board (interposer substrate 3)
  • a power semiconductor element 2 having a back surface bonded to a mounting surface of a heat transfer plate (heat spreader 4), and an element electrode formed on the surface of the power semiconductor element 2, for example, main power A bonding wire 5 that is a wiring member having one end bonded to the first bonding portion of the electrode 21 ⁇ / b> C and the other end
  • At least a part of the second bonding portion enters the space extending in the vertical direction (z) of the mounting surface from the main power electrode 21C) toward the printed circuit board (interposer substrate 3), and an opening portion.
  • the electrode pattern 32 and the opening 3a are arranged so that the first junction is included in the space extending in the vertical direction (z) from the element 3a toward the element electrode (main power electrode 21C). Configured. As a result, heat dissipation can be ensured, and the electrode pattern 32 can be applied to the surface even when wiring is performed by ultrasonic bonding that requires an operation from the surface side without using a power semiconductor element in which the surface electrode is adjusted for solder bonding.
  • the mounting area can be reduced by biting into the electrode region. That is, a power semiconductor device that is small and excellent in heat dissipation can be easily obtained.
  • the upper surface of the power semiconductor element 2 is a wire bonding electrode, and in order to expose this electrode entirely, a slit larger than the power semiconductor element 2 (corresponding to the opening 3a of the present embodiment). ) Has to be formed, and there is a problem that the mounting area is increased as compared with the normal bare chip mounting.
  • the electrode pattern 32 on the printed circuit board (interposer substrate 3) to be connected to the upper surface electrode of the power semiconductor element 2 They were placed so as to overlap when viewed from (a position away from the mounting surface in a direction perpendicular to the mounting surface). Therefore, it is possible to reduce the mounting area and the occupied area of the printed circuit board (interposer substrate 3) by reducing the slit (opening 3a).
  • the wiring member is a bonding wire 5 which is a bonding wire
  • the opening 3a is a region necessary for bonding the bonding wire 5 to the first bonding portion of the element electrode (main power electrode 21C). Therefore, it can be bonded through the opening 3a and can be manufactured efficiently. Furthermore, since the bonding process is shortened, the electrical resistance can be reduced.
  • the power semiconductor element 2 is a vertical semiconductor element such as an IGBT having an electrode 21E formed on the back surface.
  • FIG. 2 is a partial cross-sectional view for explaining the configuration of the power semiconductor device according to the second embodiment, which corresponds to FIG. 1C in the first embodiment, but the cutting position is shown in FIG. Corresponds to the portion of line b) extended from line C2.
  • components similar to those described in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.
  • both ends of the heat spreader 4 are raised from the mounting surface to form a tray, and the interposer substrate 3 is supported by support portions 4s formed at both ends.
  • a back electrode pattern 33 is formed at a position corresponding to the support portion 4s, and the position of the interposer substrate 3 with respect to the heat spreader 4 is obtained by soldering the back electrode pattern 33 and the support portion 4s. Is fixed. Therefore, the potting resin 71 shown in the first embodiment is not used.
  • a part of the back side electrode pattern 33 of the interposer substrate 3 extends to the outside of the sealing body 7 and can be electrically connected to the outside at that part.
  • the connection with the back surface electrode 21E of the power semiconductor element 2 does not require wire bonding through the opening 3a as shown in the first embodiment, and the length of the opening 3a is reduced to the surface side. It can be made smaller than the length of the main power electrode 21C.
  • restrictions on the arrangement of the electrode patterns 32 on the front surface side are reduced, and the mounting area can be further reduced.
  • the facing end of the heat transfer plate (heat spreader 4) is directed from the mounting surface to the printed circuit board (interposer substrate 3). Since the support portion 4s that supports the printed circuit board (interposer substrate 3) is formed, a gap with the printed circuit board (interposer substrate 3) is secured, productivity is increased, and airtightness by the sealing body 7 is increased. It becomes possible.
  • the power semiconductor element 2 is a vertical semiconductor element such as an IGBT having an electrode 21E formed on the back surface, and an electrode portion (back side electrode pattern 33) and a support portion formed on a printed circuit board (interposer substrate 3). Since the configuration is such that 4s is electrically connected, for example, the length of the opening 3a can be made smaller than the element size, and the mounting area can be further reduced.
  • FIG. 3 is a partial cross-sectional view for explaining the configuration of the power semiconductor device according to the third embodiment, and corresponds to the partial cross-sectional view in the second embodiment.
  • components similar to those described in the second embodiment are denoted by the same reference numerals, and description thereof is omitted.
  • the main power electrode 21C on the surface of the power semiconductor element 2 and the bonding electrode 32j of the interposer substrate 3 (the bonding electrode 32p described in the first and second embodiments).
  • the electrode member 51 was used instead of the bonding wire.
  • the electrode member 51 is made of copper and has a so-called canned cap shape in which a flat bottom portion 51f is formed at one end of a cylindrical shape, and a collar-shaped terminal portion 51t extending to the outer edge side is formed at the other end.
  • the bottom 51f side is inserted from the opening 3a, the bottom 51f is ultrasonically connected to the main power electrode 21C, and the terminal 51t is soldered to the bonding electrode 32j.
  • both ends of the heat spreader 4 are formed with support portions 4s similar to those in the second embodiment, but the other end is extended in the surface extending direction (xy) in the same manner as the support portions 4s.
  • a protruding portion 4p protruding in the vertical direction (z) is formed.
  • a through hole covered with copper is formed at a position corresponding to the protruding portion 4p of the interposer substrate 3, and the protruding portion 4p passing through the through hole is joined to the electrode 34 in the through hole by solder.
  • the interval between the interposer substrate 3 and the heat spreader 4 can be fixed without using the potting resin 71, and positioning in the surface extending direction (xy) is also possible.
  • the opening 3a is reduced to reduce restrictions on the arrangement of the electrode patterns 32 on the front surface side, and the mounting area can be further reduced.
  • the wiring member to be bonded to the main power electrode 21C is a bottom portion that is a flat portion for ultrasonic bonding to the first bonding portion. Since the electrode member 51 is provided with 51f and the joining electrode 32j which is the second joining portion and the terminal portion 51t for solder joining, for example, compared with the case where solder bumps and through holes are used. A circuit with a small electrical resistance can be formed.
  • At least one of the support portions 4s formed at the opposite ends of the heat transfer plate (heat spreader 4) passes through a through hole provided in the printed circuit board (interposer substrate 3). Since the protruding portion 4p exposed on the second surface (outside) side is provided, positioning in the extending direction (xy) of the surface of the printed circuit board (interposer substrate 3) can be easily performed.
  • the power semiconductor element 2 is a vertical semiconductor element such as an IGBT having an electrode 21E formed on the back surface.
  • the through-hole electrode 34 and the support part 4s which are electrode parts of the printed circuit board (interposer substrate 3). Since the projecting portion 4p is configured to be electrically connected, wiring can be performed only on one surface (outside) of the printed circuit board (interposer substrate 3), so that wiring can be performed efficiently.
  • FIG. 4 is a partial cross-sectional view for explaining the configuration of the power semiconductor device according to the fourth embodiment, and corresponds to the partial cross-sectional view in the second embodiment.
  • the same components as those described in the first to third embodiments are denoted by the same reference numerals, and the description thereof is omitted.
  • the heat spreader 4 is divided into independent plates 4a and 4b and an independent plate in the depth direction (not shown) by a separating portion 4i made of insulating resin.
  • the back electrode 21Ea of the power semiconductor element 2a is joined to the independent plate 4a by the solder 6
  • the back electrode 21Eb of the power semiconductor element 2b is joined to the independent plate 4b by the solder 6.
  • one end side of the independent plate 4b (right side in the figure) penetrates the through hole formed in the interposer substrate 3, and is joined to the electrode 34 in the through hole by solder.
  • a protruding portion 4p is formed.
  • a support portion 4s that protrudes toward the interposer substrate 3 but does not reach the interposer substrate 3 is formed on one end side (left in the drawing) of the independent plate 4a.
  • potting resin 71 serving as spacers.
  • the potting resin 71r is formed between the independent plate 4b and the interposer substrate 3 as in the first embodiment. It is formed so as to be interposed therebetween.
  • one end of the potting resin 71 s faces the interposer substrate 3, but the other end is formed so that the support portion 4 s bites.
  • the main power electrode 21Ca which is an electrode on the surface side of the power semiconductor element 2a bonded to the independent plate 4a, and a control electrode 21Ga (not shown) are exposed. It is installed to do.
  • the bonding electrode 32p portion for connecting at least the main power electrode 21Ca on the front side of the power semiconductor element 2a in the electrode pattern 32 is viewed from the direction (z) perpendicular to the surface of the interposer substrate 3.
  • the main power electrode 21Ca is disposed at a position overlapping with at least a part of the main power electrode 21Ca.
  • the main power electrode 21Ca on the surface and the bonding electrode 32p are electrically connected by wire bonding from above the interposer substrate 3 by an aluminum bonding wire 5a having a thickness of 0.5 mm.
  • the bonding electrode 32p for connecting to the control electrode 21Ga also overlaps at least a part of the main power electrode 21Ca when viewed from the direction perpendicular to the surface of the interposer substrate 3. It is arranged at the position to do.
  • the gate electrode bonding electrode 32p is electrically connected by a bonding wire having a short process length.
  • the gate electrode 21Gb (not shown) of the power semiconductor element 2b is electrically connected to the independent plate 4c (not shown) (positioned behind the independent plate 4b) by the bonding wire 5 and further insulated from the protruding portion 4p in the drawing. It is configured so that it can be connected from the front side of the interposer substrate 3 through another projecting portion (not shown).
  • the heat spreader 4 is divided into a plurality of independent plates that are electrically insulated, and an opening is provided in the power semiconductor element at a position that is electrically an end. At that time, it is possible to provide an opening for each power semiconductor element at both ends, but for the power semiconductor element at the other end as in the present embodiment.
  • the protruding portion 4p may be used.
  • each protrusion when a plurality of protrusions are insulated from each other, each protrusion can be used as an external electrode for electrical connection. Further, by covering the support 4s of the heat spreader 4 with an insulating resin (potting resin 71s), the support 4s can be reinforced while being electrically insulated. Furthermore, since the independent plates 4a, 4b,... Insulated from each other are mechanically connected by the separating portion 4i, the electricity between the power semiconductor elements (between one power semiconductor element and the adjacent independent plate) Connection (wire bonding) can also be performed on a single heat spreader 4.
  • an insulating resin potting resin 71s
  • the heat transfer plate (heat spreader 4) is composed of a plurality of electrically insulated independent plates 4a, 4b,.
  • a plurality of power semiconductor elements (2a, 2b) including a power semiconductor element 2a to which a wiring member (bonding wire 5a) is bonded are separately mounted on the plurality of independent plates 4a, 4b,.
  • other power semiconductor elements mounted on different independent plates are arranged between the heat transfer plate (heat spreader 4) and the printed circuit board (interposer substrate 3). Since the wiring members (bonding wires 5b) are electrically connected to each other, the space can be effectively used to further reduce the size.
  • the potting resin 71 can reduce the stress of the board screwing applied to the solder joint of the protrusion 4p. . Therefore, also in the power semiconductor device 1 according to the second or third embodiment, as in the first embodiment, by forming the insulating potting resin 71 as a spacer, the solder of the support portion 4s and the protruding portion 4p is formed. The stress of board screwing applied to the joint can be reduced.
  • the same effect can be obtained not only with copper but also with a metal such as aluminum, iron, or copper-tungsten as the material of the heat spreader 4.
  • a metal such as aluminum, iron, or copper-tungsten
  • the example of aluminum was shown here as a raw material of a wire bond, the same effect is acquired also with a copper or a gold wire.
  • Sn—Ag—Cu system is shown for the solder joint, the same effect can be obtained with SnSb or SnBi.
  • the same effect can be obtained by using a conductive adhesive instead of solder.
  • the insulating layer 8 may be made of heat conductive grease instead of a so-called insulating sheet.
  • the resin constituting the sealing body 7 can be replaced with silicon gel, and may be omitted if there is no problem of weather resistance.
  • a glass epoxy substrate is taken as an example of a material that can be easily obtained without considering thermal conductivity, but a paper phenol substrate, a polyimide substrate, an alumina substrate, The same effect can be obtained with an aluminum base metal substrate.
  • the position of the opening 3a is defined at least with respect to the main power electrode among the surface electrodes. This is because when the control electrode (21G) and the main power electrode (21C) are formed on the same surface, the main power electrode (collector electrode 21C) occupies most of the surface, and thus occupies that surface. This is because the effect of reducing the mounting area is higher when overlapping with the electrodes. However, there is an effect even if the electrodes occupy a small area. Therefore, it is not always necessary to overlap the main power supply. Needless to say, the constituent elements of the first to third embodiments described above can be appropriately increased or decreased or combined.
  • the configuration shown in the above description as the power semiconductor device 1 is a simplified diagram showing only main members, and it goes without saying that various configurations are made in an actual power semiconductor device.
  • the power semiconductor element 2 that is a main heat source in the power semiconductor device 1 is not limited to the IGBT, but other switching elements such as MOSFET (Metal Oxide Semiconductor Field Effect Transistor), or rectification.
  • MOSFET Metal Oxide Semiconductor Field Effect Transistor
  • rectification As an element, it is an element which controls electric power.
  • heat dissipation and miniaturization can be achieved even if an element whose surface electrode is not compatible with solder bonding is used. It does not exclude an element having a surface electrode on which a gold layer is formed.
  • a so-called wide band gap semiconductor based on silicon carbide SiC
  • silicon carbide gallium nitride-based materials, diamond, and the like are used as the wide band gap semiconductor material.
  • the power loss is lower than an element formed of silicon that has been conventionally used.
  • the efficiency of the power semiconductor device can be increased.
  • the withstand voltage is high and the allowable current density is also high, the power semiconductor device can be downsized.
  • the wide band gap semiconductor element has high heat resistance, it can operate at high temperature, and the heat radiating member 9 and the water cooling part can be air cooled. It becomes possible.
  • the SiC element can withstand a higher temperature than the conventional Si element, the operating temperature environment of the power semiconductor device on which such a power semiconductor element 2 is mounted is higher than the conventional temperature.
  • the temperature range may be reached. Therefore, the importance of heat dissipation increases more and the heat dissipation by this invention is high, and the effect which can be reduced in size appears more notably.

Abstract

　絶縁層(8)を介して放熱部材(9)が接合される伝熱板(4)と、伝熱板(4)に対して、所定の間隔をあけて配置され、外側面に形成された電極パターン(32)の近傍に開口部(3a)が設けられたプリント基板(3)と、伝熱板(4)とプリント基板(3)との間に配置され、裏面が伝熱板(4)に接合された電力用半導体素子(2)と、電力用半導体素子(2)の表面に形成された主電力用電極(21C)の第１の接合部に一端が接合され、他端が第２の接合部(32p)に接合された配線部材(5)と、を備え、主電力用電極(21C)からプリント基板(3)に向かって垂直方向に延びる空間に、第２の接合部(32p)の少なくとも一部が入るとともに、開口部(3a)から垂直方向に延びる空間に、第１の接合部が包含されるように構成した。

Description

電力用半導体装置
　本発明は、半導体装置に関するもので、とくに、放熱性を必要とする電力用半導体装置に関するものである。
　産業機器から家電・情報端末まであらゆる製品に電力用半導体装置が普及しつつあり、とくに家電用途では、小型化と高い信頼性が求められる。また、電力用半導体装置は高電圧・大電流を扱うため発熱が大きく、外部に効率的に放熱する必要がある。さらに、動作温度が高く、効率に優れている点で、今後の主流となる可能性の高いＳｉＣのようなワイドバンドギャップ半導体材料にも対応できることも同時に求められている。
　一般的に、小型の電力用半導体装置は、電子回路が形成された基板上に電力用半導体素子が配置される場合が多いが、電力用半導体素子で発生した熱を基板を介して外部に放熱する場合、基板自体の熱伝導率が放熱性に大きく影響することになる。しかしながら、熱伝導性に優れるとされるＡｌＮ基板は入手性に乏しい。一方、入手の容易なアルミナ基板やガラスエポキシ（ガラエポ）基板は、銅などの熱伝導性に優れた金属に比べて、２０分の１～千分の１程度の熱伝導率しか有しておらず、高い放熱性を望めない。
　そこで、電力用半導体素子の裏面側を、熱伝導性に優れた絶縁層を介して直接放熱部材に接続することで、放熱性を確保することが考えられる。その場合、表面側は、インタポーザ基板にはんだ接合することで配線することが考えられる（例えば、特許文献１参照。）。しかし、ワイヤボンディングを前提として形成された一般的な電力用半導体素子の表面の電極は、はんだ接合に対応しておらず、はんだ接合するためには、特殊な加工が必要となる。そこで、電力用半導体素子をインタポーザ基板の開口内にはめ込み、一般的な電力用半導体素子とワイヤボンディングで配線できる技術（例えば、特許文献２または３参照。）を取り入れることも考えられる。
特開平１０－１２８１２号公報（段落００１２～００２０、図４、図５） 特開平７－７０３３号公報（段落０００９～００１２、図１、図２） 特開２００４－２１４５２２号公報（段落００２２～００２７、図３）
　しかしながら、上記のような構成では、電力用半導体素子とインタポーザ基板との間に面の延在方向において隙間を設ける必要があり、基板上に電力用半導体素子や電極パターンを配置する通常のベアチップ実装に比較すると実装面積が拡大してしまうという問題があった。
　この発明は、上記のような問題点を解決するためになされたものであり、小型で放熱性に優れた電力用半導体装置を容易に得ることを目的とする。
　本発明にかかる電力用半導体装置は、実装面の反対側の面に、絶縁層を介して放熱部材が接合される伝熱板と、前記伝熱板の実装面に対して、所定の間隔をあけて対向するように配置され、前記伝熱板への対向面の反対側の面に電極パターンが形成されるとともに、前記電極パターンの近傍に開口部が設けられたプリント基板と、前記伝熱板と前記プリント基板との間に配置され、裏面が前記伝熱板の実装面に接合された電力用半導体素子と、前記電力用半導体素子の表面に形成された素子電極の第１の接合部に一端が接合され、他端が前記電極パターンの第２の接合部に接合された配線部材と、を備え、前記素子電極から前記プリント基板に向かって前記実装面の垂直方向に延びる空間に、前記第２の接合部の少なくとも一部が入るとともに、前記開口部から前記素子電極に向かって前記垂直方向に延びる空間に、前記第１の接合部が包含されるように、前記電極パターンと前記開口部が配置されていることを特徴とする。
　この発明によれば、プリント基板の電極パターンを電力用半導体素子の電極面の領域内にまで近接させることができるので、小型で放熱性に優れた電力用半導体装置を容易に得ることができる。
本発明の実施の形態１にかかる電力用半導体装置の構成を説明するための電力用半導体装置の部分平面図と、一部部材を透過させた部分平面図、および部分断面図である。 本発明の実施の形態２にかかる電力用半導体装置の構成を説明するための部分断面図である。 本発明の実施の形態３にかかる電力用半導体装置の構成を説明するための部分断面図である。 本発明の実施の形態４にかかる電力用半導体装置の構成を説明するための部分断面図である。
実施の形態１．
　図１は、本発明の実施の形態１にかかる電力用半導体装置の構成を説明するためのもので、図１（ａ）は電力用半導体装置の部分平面図、図１（ｂ）は図１（ａ）と同じ部分を示す平面図であるが、封止樹脂およびインタポーザ基板の基材部分を透過させた場合の平面図、図１（ｃ）は封止樹脂部分を除いた状態での、図１（ｂ）のＣ１－Ｃ２線（平行線）による異なる切断位置を含む断面図である。
　本実施の形態１にかかる電力用半導体装置１では、放熱部材が装着されたヒートスプレッダの反対側の面に、電力用半導体素子の裏面電極が接合されており、さらに電力用半導体素子の表面の主電力を流す表面電極が、インタポーザ基板上に形成された電極パターンのうち、表面電極の面に垂直な方向から見たときに、表面電極の一部とオーバーラップする部分とワイヤボンディングで電気接続するようにしたものである。以下、詳細に説明する。
　図１（ｂ）、（ｃ）に示すように、銅製のヒートスプレッダ４（１５ｍｍ×２０ｍｍ×厚さ１ｍｍ）には、裏面側に絶縁層８を介して放熱部材９として機能するアルミニウム製のシャーシが装着されており、表面（実装面）側には、電力用半導体素子２である１０ｍｍ×１０ｍｍのＩＧＢＴ（Insulated　Gate　Bipolar　Transistor）の裏面電極２１Ｅが、はんだ６（Ｓｎ－Ａｇ－Ｃｕ：融点２１７℃）によって接合されている。そして、ヒートスプレッダ４の電力用半導体素子２を接合した面側には、ヒートスプレッダ４と所定の間隔を開けて対向するように、ポッティング樹脂７１を介してインタポーザ基板３が配置されている。つまり、電力用半導体素子２は、裏面がヒートスプレッダ４に接合され、表面がインタポーザ基板３の裏面に対向するように、ヒートスプレッダ４とインタポーザ基板３間の間隙内に配置されることになる。
　インタポーザ基板３は、ガラス繊維にエポキシ樹脂を含浸させて形成したガラスエポキシ（通称ガラエポ）製の基材３１に、銅の電極パターン３２が形成されたもので、開口部３ａ（幅２ｍｍ×長さ１５ｍｍ）から、電力用半導体素子２の表面側の電極である主電力用電極２１Ｃ、制御用電極２１Ｇの少なくとも一部が露出するように設置されている。そして、電極パターン３２のうち、少なくとも電力用半導体素子２の表側の主電力用電極２１Ｃ（例えば、コレクタ電極）と接続するためのボンディング電極３２ｐ（ワイヤボンドパッド）が、インタポーザ基板３の面に垂直な方向（ｚ）から見たときに、主電力用電極２１Ｃの少なくとも一部にオーバーラップする位置に配置されている。
　そして、主電力用電極２１Ｃの開口部３ａから露出している部分には、ボンディング電極３２ｐと電気接続するためのボンディング位置及びボンディングに必要なスペースが含まれている。これにより、表面の主電力用電極２１Ｃとボンディング電極３２ｐは、インタポーザ基板の上方から太さ０．５ｍｍのアルミニウムのボンディングワイヤ５によってワイヤボンディングが可能となる。このとき、ボンディングワイヤ５の面（ｘｙ）の延在方向での行程長は、主電力用電極２１Ｃの中心から端までの距離（５ｍｍ）よりも短くなる。なお、本実施の形態では、制御用電極２１Ｇ（例えば、ゲート電極）と接続するためのボンディング電極３２ｐも、インタポーザ基板３の面に垂直な方向から見たときに、主電力用電極２１Ｃの少なくとも一部にオーバーラップする位置に配置されている。そして、主電力用電極２１Ｃと同様に、工程長の短いボンディングワイヤ５によって、ゲート電極用のボンディング電極３２ｐと電気接続されている。
　また、開口部３ａは、電力用半導体素子２のｙ方向長さよりも長く開口している。そして、開口部３ａから露出するヒートスプレッダ４の所定位置と別のボンディング電極３２ｐとがボンディングワイヤ５により電気接続されている。
　そして、電力用半導体素子２およびボンディングワイヤ５を包むように、ヒートスプレッダ４とインタポーザ基板３との間およびインタポーザ基板３の上面側の所定領域を樹脂で形成した封止体７で封止する。これにより図１（ａ）に示すような外観（一部）の電力用半導体装置１が形成できる。なお、電極パターン３２は、ボンディング電極３２ｐ部分からソルダレジスト３５で被覆される部分３２ｂを経由して外部端子部３２ｅ（図１（ａ）で露出している部分）に連なっている。これにより、電力用半導体素子２に形成された各電極２１Ｃ、２１Ｇ、２１Ｅは、封止体７から露出した外部端子部３２ｅによって外部と電気接続される。
　このように構成した電力用半導体装置１は、インタポーザ基板３に設けた開口部３ａを、表側の主電力用電極２１Ｃと接続するためのボンディング電極３２ｐを主電力用電極２１Ｃの少なくとも一部にオーバーラップする位置に配置した。これにより、電極パターン３２を面の延在方向（ｘｙ）において電力用半導体素子２の領域内に食いこむように形成でき、実装面積を抑制することができる。また、ヒートスプレッダ４と放熱部材９とを接合するための絶縁層８には、回路基板のような剛性が求められないので、熱伝導性を容易に確保することができる。
　このように構成した電力用半導体装置１を動作させると、電力用半導体素子２に電流が流れ、電力用半導体素子２が発熱する。電力用半導体素子２で発生した熱は、ヒートスプレッダ４を介して、放熱部材９に伝わる。このとき、電力用半導体素子２から放熱部材９にかけては、熱伝導性に優れた材料で連なっているので、発生した熱を効率よく放熱部材９から放熱することができる。つまり、電力用半導体素子２との位置関係を調整した開口部３ａを設けることにより、はんだ接合対応の処理をしておらず、ワイヤボンディングのような超音波接合のように所定方向からの操作が必要な配線を行う必要がある電力用半導体素子を用いても、小型で放熱性の高く、信頼性の高い電力用半導体装置を得ることができる。
　なお、開口部３ａの幅（ワイヤボンディングの方向に平行な方向：図ではｘ方向）幅としては、ワイヤボンドの接合長さよりは大きくする必要があるが、ワイヤボンドのツールの挿入スペースも考慮すると、ワイヤ径の２００％以上は必要と考えられる。
　なお、ボンディングワイヤ５の変形防止や高い絶縁性の確保のために、封止体７には、柔軟性に富む材料が用いられることが多い。スペーサとなるポッティング樹脂７１は、ヒートスプレッダ４とインタポーザ基板３との間に、所望の間隔を形成するために必要で、トレンチ構造など複雑な形状を有する電力用半導体素子２の表面がインタポーザ基板３に直接接触するのを防止する効果がある。また、放熱性を確保するために、ヒートスプレッダ４を放熱部材９に押し付ける目的で、インタポーザ基板３を放熱部材９に対してネジ止めする場合が多い。このときの応力をスペーサとなるポッティング樹脂７１が受けてヒートスプレッダ４に伝えることにより、柔軟な封止体が変形して電力用半導体素子２やボンディングワイヤ５に応力を伝えないようにする効果がある。そのため、ポッティング樹脂７１が、封止体７に比較して硬い（弾性率が高い）方が、効果が大きいと考えられる。
　また、本実施の形態および以降の実施の形態では、プリント基板のひとつであるインタポーザ基板３を例に説明しているが、インタポーザ基板３に限らず、例えばマザー基板を含めた各種プリント基板に適用可能である。つまり、本実施の形態および以降の各実施の形態にかかる電力用半導体装置においては、インタポーザ基板３をプリント基板と読み替えて適用することができる。
　以上のように、本発明の実施の形態１にかかる電力用半導体装置１によれば、実装面の反対側の面に、絶縁層８を介して放熱部材９が接合される伝熱板であるヒートスプレッダ４と、伝熱板（ヒートスプレッダ４）の実装面に対して、所定の間隔をあけて対向するように配置され、伝熱板（ヒートスプレッダ４）への対向面（内側）の反対側の面（外側）に電極パターン３２が形成されるとともに、電極パターン３２の近傍に開口部３ａが設けられたプリント基板（インタポーザ基板３）と、伝熱板（ヒートスプレッダ４）とプリント基板（インタポーザ基板３）との間に配置され、裏面が伝熱板（ヒートスプレッダ４）の実装面に接合された電力用半導体素子２と、電力用半導体素子２の表面に形成された素子電極である例えば、主電力用電極２１Ｃの第１の接合部に一端が接合され、他端が電極パターン３２の第２の接合部であるボンディング電極３２ｐに接合された配線部材であるボンディングワイヤ５と、を備え、素子電極（主電力用電極２１Ｃ）からプリント基板（インタポーザ基板３）に向かって実装面の垂直方向（ｚ）に延びる空間に、第２の接合部（ボンディング電極３２ｐ）の少なくとも一部が入るとともに、開口部３ａから素子電極（主電力用電極２１Ｃ）に向かって垂直方向（ｚ）に延びる空間に、第１の接合部が包含されるように、電極パターン３２と開口部３ａが配置されているように構成した。これにより、放熱性が確保でき、しかも、はんだ接合用に表面の電極を調整した電力用半導体素子を用いず表面側からの操作が必要な超音波接合で配線しても、電極パターン３２を表面の電極の領域に食い込ませて実装面積を縮小することができる。つまり、小型で放熱性に優れた電力用半導体装置を容易に得ることができる。
　また、電力用半導体素子２の上面は、ほとんどすべてがワイヤボンディング用電極であり、この電極を全面露出させるには、電力用半導体素子２よりも大きなスリット（本実施の形態の開口部３ａに対応）を形成する必要があり、通常のベアチップ実装に比較すると実装面積が拡大してしまうという問題があった。しかし、本実施の形態１にかかる電力用半導体装置１では、電力用半導体素子２の上面電極に対して、接続するべきプリント基板（インタポーザ基板３）上の電極パターン３２の少なくとも一部が、上方（実装面に垂直な方向に離れた位置）から見たときに重なるように配置した。そのため、スリット（開口部３ａ）の縮小による、実装面積とプリント基板（インタポーザ基板３）の占有面積の小型化を実現することが可能となる。
　とくに、配線部材は、ボンディング用のワイヤであるボンディングワイヤ５であり、開口部３ａは、ボンディングワイヤ５を素子電極（主電力用電極２１Ｃ）の第１の接合部にボンディングするために必要な領域を包含しているように構成したので、開口部３ａごしにボンディングでき、効率よく製造できる。さらに、ボンディングの行程が短くなるので電気抵抗も低減できる。
　また、電力用半導体素子２は、裏面にも電極２１Ｅが形成されたＩＧＢＴ等の縦型半導体素子であり、電極２１Ｅが接合された伝熱板（ヒートスプレッダ４）と電極パターン３２の他の接合部（別のボンディング電極３２ｐ）とが、開口部３ａを介して配線部材であるボンディングワイヤ５によって電気接続されているので、小型で放熱性に優れた電力用半導体装置１を容易に製造することができる。
実施の形態２．
　本実施の形態２では、実施の形態１と較べてインタポーザ基板の支持構造を変え、さらに支持構造を利用して電気接続経路も変更したものである。図２は本実施の形態２にかかる電力用半導体装置の構成を説明するための部分断面図で、実施の形態１における図１（ｃ）に対応するものであるが、切断位置は図１（ｂ）のＣ２線延長した部分に対応する。図中、実施の形態１で説明したものと同様のものには同様の符号を付して説明を省略する。
　図２に示すように、本実施の形態２においては、ヒートスプレッダ４の両端を実装面から立ち上げてトレイ形状とし、両端に形成した支持部４ｓでインタポーザ基板３を支えるようにしたものである。インタポーザ基板３の裏面には、支持部４ｓに対応した位置に裏側電極パターン３３が形成されており、裏側電極パターン３３と支持部４ｓとをはんだ接合することで、インタポーザ基板３のヒートスプレッダ４に対する位置を固定している。そのため、実施の形態１で示したポッティング樹脂７１を使用していない。
　さらに、インタポーザ基板３の裏側電極パターン３３の一部は、封止体７の外側に延伸しており、その部分で外部と電気接続できるようになっている。これにより、電力用半導体素子２の裏面電極２１Ｅとの接続には、実施の形態１で示したように開口部３ａを介したワイヤボンディングを必要とせず、開口部３ａの長さを表面側の主電力用電極２１Ｃの長さより小さくすることができる。これにより、表面側の電極パターン３２の配置の制約も少なくなり、より実装面積を縮小することが可能になる。
　以上のように、本発明の実施の形態２にかかる電力用半導体装置１によれば、伝熱板（ヒートスプレッダ４）の対向する端部に、それぞれ実装面からプリント基板（インタポーザ基板３）に向かって立ち上がり、プリント基板（インタポーザ基板３）を支える支持部４ｓが形成されているので、プリント基板（インタポーザ基板３）とのギャップを確保し、生産性を高め、封止体７による気密性を高めることが可能となる。
　また、電力用半導体素子２は、裏面にも電極２１Ｅが形成されたＩＧＢＴ等の縦型半導体素子であり、プリント基板（インタポーザ基板３）に形成された電極部（裏側電極パターン３３）と支持部４ｓとが電気接続されているように構成したので、例えば、開口部３ａの長さを素子寸法よりも小さくでき、より一層、実装面積を縮小できる。
実施の形態３．
　本実施の形態３では、上記実施の形態１および２と較べて、電力用半導体素子の表面電極とインタポーザ基板との電気接続部材を変更したものである。さらに、実施の形態２と較べてインタポーザ基板とヒートスプレッダの電気接続する部分の構造を変更したものである。図３は本実施の形態３にかかる電力用半導体装置の構成を説明するための部分断面図で、実施の形態２における部分断面図に対応する部分である。図中、実施の形態２で説明したものと同様のものには同様の符号を付して説明を省略する。
　図３に示すように、本実施の形態３においては、電力用半導体素子２の表面の主電力用電極２１Ｃとインタポーザ基板３の接合電極３２ｊ（実施の形態１、２で説明したボンディング電極３２ｐに相当）との接続に、ボンディングワイヤではなく、電極部材５１を用いた。電極部材５１は、銅製で、円筒形の一端に平坦な底部５１ｆが形成され、他端に外縁側に延伸するつば状の端子部５１ｔが形成された、いわゆるかんかん帽のような形状をなす。そして、底部５１ｆ側を開口部３ａから挿入し、底部５１ｆを主電力用電極２１Ｃと超音波接続し、端子部５１ｔを接合電極３２ｊとはんだ接合している。これにより、電力用半導体素子２の表面の主電力用電極２１Ｃの外部への電気接続経路が形成される。この場合、電気接合経路の断面積を容易に増加させることができ、電気抵抗の小さな信頼性の高い電気接続が可能になる。
　さらに、ヒートスプレッダ４の両端は、一端は実施の形態２と同様の支持部４ｓが形成されているが、他端は、支持部４ｓと同様に、面の延在方向（ｘｙ）に延伸したのち、垂直方向（ｚ）に突出する突出部４ｐが形成されている。インタポーザ基板３の突出部４ｐに対応する位置には銅で被覆された貫通孔が形成されており、貫通孔を貫通した突出部４ｐが、貫通孔内の電極３４とはんだにより接合されている。これにより、インタポーザ基板３のヒートスプレッダ４に対する位置を固定するとともに、インタポーザ基板３の表面側に裏面電極２１Ｅとの電気接続経路が形成される。
　これにより、ポッティング樹脂７１を用いなくとも、インタポーザ基板３とヒートスプレッダ４との間隔を固定できるとともに、面の延在方向（ｘｙ）での位置決めも可能になる。また、実施の形態２と同様に、開口部３ａを縮小して、表面側の電極パターン３２の配置の制約も少なくなり、より実装面積を縮小することが可能になる。
　以上のように、本実施の形態３にかかる電力用半導体装置１によれば、主電力用電極２１Ｃと接合する配線部材は、第１の接合部と超音波接合するための平坦部である底部５１ｆと、第２の接合部である接合電極３２ｊとはんだ接合するための端子部５１ｔとが設けられた電極部材５１にしたので、例えば、はんだバンプとスルーホールを用いた場合と比較しても電気抵抗の小さな回路形成が可能となる。
　また、伝熱板（ヒートスプレッダ４）の対向する端部に形成された支持部４ｓの内、少なくとも一方の支持部には、プリント基板（インタポーザ基板３）に設けられた貫通孔内を貫通して第２の面（外側）側に露出する突出部４ｐが設けられているようにしたので、プリント基板（インタポーザ基板３）の面の延在方向（ｘｙ）における位置決めも容易にできる。
　さらに、電力用半導体素子２は、裏面にも電極２１Ｅが形成されたＩＧＢＴ等の縦型半導体素子であり、プリント基板（インタポーザ基板３）の電極部である貫通孔の電極３４と支持部４ｓの突出部４ｐとが電気接続されているように構成したので、プリント基板（インタポーザ基板３）の片方の面（外側）だけで配線できるので、効率よく配線できる。
実施の形態４．
　本実施の形態４では、上記実施の形態１～３と較べて、ヒートスプレッダが絶縁体によって複数の独立板に分割されており、それぞれの独立板に搭載された電力用半導体素子間の接続を、インタポーザ基板の配線を介さずに、直接ワイヤボンドで行うように変更したものである。さらにヒートスプレッダの突出部を電気的に絶縁して複数に分割することで、それぞれを外部電極として活用できるように変更したものである。図４は本実施の形態４にかかる電力用半導体装置の構成を説明するための部分断面図で、実施の形態２における部分断面図に対応する部分である。図中、実施の形態１～３で説明したものと同様のものには同様の符号を付して説明を省略する。
　図４に示すように、ヒートスプレッダ４は、絶縁樹脂による分離部４ｉによって、独立板４ａ、４ｂおよび図示しない奥行き方向の独立板によって分けられている。独立板４ａには、電力用半導体素子２ａの裏面電極２１Ｅａが、はんだ６によって接合され、独立板４ｂには、電力用半導体素子２ｂの裏面電極２１Ｅｂが、はんだ６によって接合されている。独立板４ｂの一端側（図中右）には、実施の形態３で説明したのと同様に、インタポーザ基板３に形成された貫通孔を貫通し、貫通孔内の電極３４とはんだにより接合されている突出部４ｐが形成されている。一方、独立板４ａの一端側（図中左）には、インタポーザ基板３に向けて突出するが、インタポーザ基板３には達しない支持部４ｓが形成されている。
　インタポーザ基板３とヒートスプレッダ４との間には、スペーサとなるポッティング樹脂７１として、７１ｓと７１ｒが形成されており、ポッティング樹脂７１ｒは実施の形態１と同様に、独立板４ｂとインタポーザ基板３との間に介在するように形成されている。一方、ポッティング樹脂７１ｓの一端は、インタポーザ基板３に正対しているが、他端は、支持部４ｓが食い込むように形成されている。
　インタポーザ基板３に形成された開口部３ａからは、独立板４ａに接合された電力用半導体素子２ａの表面側の電極である主電力用電極２１Ｃａ、図示しない制御用電極２１Ｇａの少なくとも一部が露出するように設置されている。そして、電極パターン３２のうち、少なくとも電力用半導体素子２ａの表側の主電力用電極２１Ｃａと接続するためのボンディング電極３２ｐ部分が、インタポーザ基板３の面に垂直な方向（ｚ）から見たときに、主電力用電極２１Ｃａの少なくとも一部にオーバーラップする位置に配置されている。
　そして、表面の主電力用電極２１Ｃａとボンディング電極３２ｐは、インタポーザ基板３の上方から太さ０．５ｍｍのアルミニウムのボンディングワイヤ５ａによってワイヤボンディングにより電気接続されている。なお、本実施の形態４でも、制御用電極２１Ｇａと接続するためのボンディング電極３２ｐも、インタポーザ基板３の面に垂直な方向から見たときに、主電力用電極２１Ｃａの少なくとも一部にオーバーラップする位置に配置されている。そして、主電力用電極２１Ｃａと同様に、工程長の短いボンディングワイヤによって、ゲート電極用のボンディング電極３２ｐと電気接続されている。
　一方、インタポーザ基板３の独立板４ｂに接合された電力用半導体素子２ｂの直上には開口部は形成されておらず、電力用半導体素子２ｂの主電力用電極２１Ｃｂは、ボンディングワイヤ５ｂによって、独立板４ａに電気接続されている。電力用半導体素子２ｂの裏面電極２１Ｅｂが接合され独立板４ｂは、突出部４ｐにより、インタポーザ基板３の表側の電極３４に電気接続されている。つまり、２つの電力用半導体素子２ａ、２ｂが直列接続され、一端が開口部３ａを介して電極パターン３２に他端が突出部４ｐを経由して電極３４から接続できるように構成されている。
　なお、電力用半導体素子２ｂの図示しないゲート電極２１Ｇｂは、図示しない（図中、独立板４ｂの後方に位置）独立板４ｃにボンディングワイヤ５で電気接続され、さらに図中の突出部４ｐと絶縁された別の図示しない突出部を介して、インタポーザ基板３の表側から接続できるように構成している。
　電力用半導体装置において、複数の電力用半導体素子を用いる場合、複数の電力用半導体装置を相互に接続して用いる場合が多い。このとき、各電力用半導体素子のすべての電極をボンディングワイヤでインタポーザ基板に接続するよりも、直接素子間を接続することで外部に取り出すワイヤの本数を減らすことができる。このとき、ヒートスプレッダ４を電気的に絶縁した複数の独立板に分割しておき、電気的に端部となる位置の電力用半導体素子に対して開口部を設けるようにする。その際、両端の電力用半導体素子に対してそれぞれ開口部を設けるようにすることも可能であるが、本実施の形態のように、もう一方の端部となる電力用半導体素子に対しては、突出部４ｐを利用するようにしてもよい。
　その際、複数の突出部が互いに絶縁されている場合は、各突出部を電気接続のための外部電極として利用することができる。また、ヒートスプレッダ４の支持部４ｓを絶縁樹脂（ポッティング樹脂７１ｓ）によって被覆することで、支持部４ｓを電気的に絶縁しつつ、補強することが可能となる。さらに、互いに絶縁された独立板４ａ、４ｂ、・・・が分離部４ｉによって機械的に連結されているので、電力用半導体素子間（一方の電力用半導体素子と隣の独立板間）の電気接続（ワイヤボンディング）を単独のヒートスプレッダ４上でも行うことができる。
　以上のように、本実施の形態４にかかる電力用半導体装置１によれば、伝熱板（ヒートスプレッダ４）は、電気的に絶縁された複数の独立板４ａ、４ｂ、・・・からなり、複数の独立板４ａ、４ｂ、・・・には、それぞれ配線部材（ボンディングワイヤ５ａ）が接合された電力用半導体素子２ａを含めた複数の電力用半導体素子（２ａ、２ｂ）が分かれて実装されており、複数の電力用半導体素子のうち、異なる独立板に実装された電力用半導体素子同士が、当該伝熱板（ヒートスプレッダ４）とプリント基板（インタポーザ基板３）との間に配置された他の配線部材（ボンディングワイヤ５ｂ）で電気接続されているように構成したので、空間を有効利用してより小型化が可能になる。
　なお、本実施の形態４に示したように、ヒートスプレッダ４に突出部４ｐが形成されている場合でも、ポッティング樹脂７１によって、突出部４ｐのはんだ接合部にかかる、基板ネジ止めの応力を低減できる。したがって、実施の形態２あるいは３にかかる電力用半導体装置１においても、実施の形態１のように、スペーサとなる絶縁体のポッティング樹脂７１を形成することで、支持部４ｓや突出部４ｐのはんだ接合部にかかる、基板ネジ止めの応力を低減できる。
　なお、上記各実施の形態において、ヒートスプレッダ４の素材は銅のみならず、アルミニウムや鉄、銅―タングステンなどの金属でも同様の効果が得られる。また、ワイヤボンドの素材としてここではアルミニウムの例を示したが、銅や金ワイヤでも同様の効果が得られる。はんだ接合には、Ｓｎ―Ａｇ―Ｃｕ系の例を示したが、ＳｎＳｂやＳｎＢｉでも同様の効果が得られる。さらにはんだに替えて、導電性接着剤を用いても同様の効果が得られる。また、絶縁層８には、いわゆる絶縁シートに替えて、熱伝導グリスを用いることも可能である。封止体７を構成する樹脂については、シリコンゲルに置き換えることも可能であるし、耐候性の問題がなければ省略してもかまわない。
　また、上記各実施の形態では、インタポーザ基板の材料として、熱伝導性を考慮せずに容易に入手できる材料として、ガラスエポキシ基板を例に挙げたが、紙フェノール基板やポリイミド基板、アルミナ基板やアルミベース金属基板などにおいても同様の効果が得られる。
　また、上記各実施の形態においては、表面の電極の内、少なくとも主電力用電極に対して開口部３ａの位置を規定している。これは、制御用電極（２１Ｇ）と主電力用電極（２１Ｃ）が同じ面に形成されている場合、主電力用電極（コレクタ電極２１Ｃ）が面の大部分を占めるため、その面を占有する電極とオーバーラップさせる方が実装面積を減らす効果が高いからである。しかし、占有面積の小さな電極に対して合わせても、効果はあるので、必ずしも、主電力用電源に対してオーバーラップさせなければならないということはない。また、上述した各実施の形態１～３の構成要素は、適宜増減させたり組み合わせたりできることはいうまでもない。
　なお、電力用半導体装置１として、上記説明で用いた図に示す構成は、主要部材のみを示した簡略図であって、実際の電力用半導体装置では様々な構成がなされることは言うまでもない。また、図において、電力用半導体装置１内での主な発熱源となる電力用半導体素子２は、ＩＧＢＴに限ることなく、ＭＯＳＦＥＴ（Metal　Oxide　Semiconductor　Field　Effect　Transistor）などの他のスイッチング素子、あるいは整流素子として、電力を制御する素子である。なお、本発明の効果としては、表面の電極がはんだ接合に対応していない素子を用いても放熱性と小型化できることを示したが、これにより、はんだ接合に対応した例えば、表面に銅や金の層を形成させた表面電極を有する素子を排除するものではない。
　そして、本発明の電力用半導体装置の効果を顕著に発揮できるための好適な半導体材料としては、炭化ケイ素（ＳｉＣ）を基材とするいわゆるワイドバンドギャップ半導体が挙げられる。ワイドバンドギャップ半導体材料としては、炭化ケイ素以外にも、窒化ガリウム系材料、ダイヤモンドなどが用いられる。
　これは、たとえば、スイッチング素子や整流素子として機能する電力用半導体素子２に、ワイドバンドギャップ半導体素子を用いた場合、従来から用いられてきたケイ素で形成された素子よりも電力損失が低いため、電力用半導体装置の高効率化が可能となる。また、耐電圧性が高く、許容電流密度も高いため、電力用半導体装置の小型化が可能となる。さらにワイドバンドギャップ半導体素子は、耐熱性が高いので、高温動作が可能であり、放熱部材９の小型化や、水冷部の空冷化も可能となるので、電力用半導体装置の一層の小型化が可能になる。
　しかし、ＳｉＣ素子は従来のＳｉ素子よりも高温の温度に耐え得るという特徴があることから、このような電力用半導体素子２を実装した電力用半導体装置の使用温度環境は、従来よりも更に高温の温度領域に達する可能性がある。したがって、放熱性の重要度がますます増大し、本発明による放熱性が高く、小型化できる効果がより顕著に表れる。
　つまり、ワイドバンドギャップ半導体の特性を活かして、小型化や高効率化を進めても電力用半導体装置のヒートサイクル耐性、パワーサイクル耐性を向上させ、電力用半導体装置の長寿命化を実現することができる。つまり、本発明による効果を発揮することで、ワイドバンドギャップ半導体の特性を活かすことができるようになる。
　１：電力用半導体装置、　２：電力用半導体素子、　
２１Ｃ：主電力用電極（素子電極）、　２１Ｅ：裏面電極、　
３：インタポーザ基板（プリント基板）、　３ａ：開口部、　
３１：基材、　３２：電極パターン、　
３２ｐ：ボンディング電極（第２の接合部）、　
３２ｊ：接合電極（第２の接合部）、　
３３：裏側電極パターン（電極部）、　
３４：貫通孔の電極（電極部）、　３５：ソルダレジスト、　
４：ヒートスプレッダ（伝熱板）、　４ｓ：支持部、
４ｐ：突出部、　５：ボンディングワイヤ（配線部材）、　
８：絶縁層、　９：放熱部材、　５１：電極部材（配線部材）、　
５１ｆ：底部（平坦部）、　５１ｔ：端子部。

Claims (10)

  1. 　実装面の反対側の面に、絶縁層を介して放熱部材が接合される伝熱板と、
    　前記伝熱板の実装面に対して、所定の間隔をあけて対向するように配置され、前記伝熱板への対向面の反対側の面に電極パターンが形成されるとともに、前記電極パターンの近傍に開口部が設けられたプリント基板と、
    　前記伝熱板と前記プリント基板との間に配置され、裏面が前記伝熱板の実装面に接合された電力用半導体素子と、
    　前記電力用半導体素子の表面に形成された素子電極の第１の接合部に一端が接合され、他端が前記電極パターンの第２の接合部に接合された配線部材と、を備え、
    　前記素子電極から前記プリント基板に向かって前記実装面の垂直方向に延びる空間に、前記第２の接合部の少なくとも一部が入るとともに、前記開口部から前記素子電極に向かって前記垂直方向に延びる空間に、前記第１の接合部が包含されるように、前記電極パターンと前記開口部が配置されていることを特徴とする電力用半導体装置。
  2. 　前記配線部材は、ボンディング用のワイヤであり、
    　前記開口部は、前記ワイヤを前記第１の接合部にボンディングするために必要な領域を有していることを特徴とする請求項１に記載の電力用半導体装置。
  3. 　前記配線部材は、前記第１の接合部と超音波接合するための平坦部と、前記第２の領域とはんだ接合するための端子部とが設けられた電極部材であることを特徴とする請求項１に記載の電力用半導体装置。
  4. 　前記伝熱板の対向する端部に、それぞれ前記実装面から前記プリント基板に向かって立ち上がり、前記プリント基板を支える支持部が形成されていることを特徴とする請求項１ないし３のいずれか１項に記載の電力用半導体装置。
  5. 　前記対向する端部に形成された支持部の内、少なくとも一方の支持部には、前記プリント基板に設けられた貫通孔内を貫通して第２の面側に露出する突出部が設けられていることを特徴とする請求項４に記載の電力用半導体装置。
  6. 　前記電力用半導体素子は、裏面にも電極が形成された縦型半導体素子であり、
    　前記伝熱板と前記電極パターンの他の接合部とが、前記開口部を介して配線部材によって電気接続されていることを特徴とする請求項１ないし５のいずれか１項に記載の電力用半導体装置。
  7. 　前記電力用半導体素子は、裏面にも電極が形成された縦型半導体素子であり、
    　前記プリント基板に形成された電極部と前記支持部とが電気接続されていることを特徴とする請求項４または５に記載の電力用半導体装置。
  8. 　前記伝熱板は、電気的に絶縁された複数の独立板からなり、
    　前記複数の独立板には、それぞれ前記配線部材が接合された電力用半導体素子を含めた複数の電力用半導体素子が分かれて実装されており、
    　前記複数の電力用半導体素子のうち、異なる独立板に実装された電力用半導体素子同士が、当該伝熱板と前記プリント基板との間に配置された他の配線部材で電気接続されていることを特徴とする請求項１ないし７のいずれか１項に記載の電力用半導体装置
  9. 　前記電力用半導体素子がワイドバンドギャップ半導体材料により形成されていることを特徴とする請求項１ないし８のいずれか１項に記載の電力用半導体装置。
  10. 　前記ワイドバンドギャップ半導体材料は、炭化ケイ素、窒化ガリウム系材料、およびダイヤモンドのうちのいずれかであることを特徴とする請求項９に記載の電力用半導体装置。
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KR20150038364A (ko) 2015-04-08
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JP6218898B2 (ja) 2017-10-25
EP2889902B1 (en) 2021-09-22
EP2889902A1 (en) 2015-07-01
KR101614669B1 (ko) 2016-04-21
US20150223316A1 (en) 2015-08-06
US9433075B2 (en) 2016-08-30
JP2017005259A (ja) 2017-01-05
CN104603934A (zh) 2015-05-06

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