WO2010104289A2 - Probe unit for testing panel - Google Patents

Probe unit for testing panel Download PDF

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Publication number
WO2010104289A2
WO2010104289A2 PCT/KR2010/001399 KR2010001399W WO2010104289A2 WO 2010104289 A2 WO2010104289 A2 WO 2010104289A2 KR 2010001399 W KR2010001399 W KR 2010001399W WO 2010104289 A2 WO2010104289 A2 WO 2010104289A2
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WO
WIPO (PCT)
Prior art keywords
panel
leads
tab
probe
block
Prior art date
Application number
PCT/KR2010/001399
Other languages
English (en)
French (fr)
Other versions
WO2010104289A3 (en
Inventor
Yi Bin Ihm
Nam Jung Her
Jun Soo Cho
Original Assignee
Pro-2000 Co. Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=42645952&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO2010104289(A2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Pro-2000 Co. Ltd. filed Critical Pro-2000 Co. Ltd.
Priority to CN2010800114318A priority Critical patent/CN102348990A/zh
Priority to JP2011553939A priority patent/JP2012519867A/ja
Publication of WO2010104289A2 publication Critical patent/WO2010104289A2/en
Publication of WO2010104289A3 publication Critical patent/WO2010104289A3/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes

Definitions

  • the present invention relates to a probe unit, and more particularly, to a probe unit having an improved structure to test panels such as liquid crystal displays and plasma display panels.
  • FIG. 1 is a top view illustrating a display with a general film package.
  • the display includes a printed circuit board (PCB) 100, a tape- automated-bonded (TAB) integrated circuit (IC) 120, and a panel 110.
  • PCB 100 On the PCB 100, there are mounted various kinds of elements such as a controller (not shown), a driving voltage generator (not shown).
  • a controller On the PCB 100, a controller outputs a control signal and a driving voltage generator outputs voltages required in driving a display, such as a power supply voltage, a gate on voltage, and a gate off voltage.
  • a top connection pad 121 of the TAB IC 120 where a driving IC 125 is mounted is electrically connected to a connection pad (not shown) of the PCBlOO. Also, a bottom connection pad 123 of the TAB IC 120 is electrically connected to the panel 110.
  • the TAB IC 120 is in contact with one or more of the PCB 100 and the panel 110 by an anisotropic conductive film disposed therebetween.
  • the driving IC 125 of the TAB IC 120 may drive and test the panel 110.
  • FIG. 2 is an enlarged top view illustrating a part 130 shown in FIG. 1.
  • FIG. 3 is a front view illustrating the part 130 shown in FIG. 2.
  • a film of the TAB IC 120 includes a first layer Ll, a second layer L2, and leads PLD formed between the first layer Ll and the second layer L2.
  • the first layer Ll is formed of polyimide and the second layer L2 is formed of solder resister.
  • leads PLD of the TAB IC 120 are in contact with leads
  • LD formed on the panel 110 one by one and transmit an electric signal to the panel 110.
  • FIG. 4 is a concept view illustrating a configuration of a general probe unit 400 for testing the panel 110 of FIG. 1.
  • FIG. 5 is a configuration view illustrating a real example of the probe unit 400 shown in FIG. 4.
  • the probe unit 400 uses a structure shown in FIG. 4.
  • a transmission control protocol (TCP) block TCP is connected to a socket S of a module M of the probe unit 400 by a flexible PCB (FPCB) and a body block B including a probe NDL is located between the TCP block TCP and the panel 110.
  • a control chip TCON is mounted on the module M.
  • a TAB IC is mounted, identical to the TAB IC
  • a guide film GF is mounted on a front end of the TAB IC 120, and the probe NDL is in direct contact with the front end of the TAB IC 120.
  • the body block B includes the probe NDL, whose one end is in direct contact with the leads LD of the panel 110 and another end is in direct contact with leads LD of the TAB IC 120 via a long hole of the guide film GF of the TCP block TCP to fix a position.
  • FIG. 5 illustrates a real configuration of an example of the probe unit 400 in which a
  • TCP block TCP and a body block B are mounted on a bottom of a manipulator MP mounted on an edge of a probe base PB of the probe unit 400.
  • An FPCB is electrically connected to a TAB IC 120 mounted on a bottom of the TCP block TCP.
  • the FPCB is assembled with a POGO block and electrically connected to a module M.
  • the present invention provides a probe unit having a structure in which a tape- automated-bonded (TAB) integrated circuit (IC) used in the panel is mounted on a bottom of a body block, the probe unit capable of easily testing a panel, accurately aligning with the panel, and preventing a burnt.
  • TAB tape- automated-bonded
  • IC integrated circuit
  • a probe unit for testing a panel including a transmission control protocol (TCP) block and a flexible printed circuit board (FPCB).
  • TCP transmission control protocol
  • FPCB flexible printed circuit board
  • the TCP block is mounted on a bottom of a manipulator mounted on an end of a probe base, the TCP block in which probe leads with the same pitch as that of corresponding leads of the panel are formed in contact with the leads of the panel and test the panel.
  • the FPCB is electrically connected to a rear end of the TCP block and transmits a test signal to the panel via the TCP block.
  • the TCP block includes a body block mounted on the bottom of the manipulator and a tape- automated-bonded (TAB) integrated circuit (IC) in which there are formed the probe leads surrounding an edge of the body block toward the panel and a bottom of the body block and test the panel while in contact with the leads of the panel.
  • TAB tape- automated-bonded
  • the TAB IC is identical to that mounted on the tested panel.
  • a nonconductive buffer is attached to the edge of the body block toward the panel and the TAB IC surrounds an outside thereof in such a way that elasticity is provided to the TAB IC when the probe leads of the TAB IC are in contact with the leads of the panel, in which the buffer is formed of one of rubber and silicone.
  • the TCP block includes a body block mounted on the bottom of the manipulator and a TAB IC in contact with a bottom of the body block, in which the probe leads are formed, whose end is formed to be rounded to provide elasticity to the probe leads when in contact with the leads of the panel. The end is protruded toward the outside of an edge of the body block toward the panel.
  • a nonconductive buffer is inserted into an inner space of the end formed to be rounded.
  • the probe leads are in the shape of a line having a certain surface area, have the same shape and pitch as those of the leads of the panel, and are in direct surface contact with corresponding leads.
  • a probe unit for testing a panel including a TCP block and an FPCB.
  • the TCP block is mounted on a bottom of a manipulator, the TCP block on which a
  • TAB IC used in the panel is mounted, in contact with leads of the panel and testing the panel.
  • the FPCB is electrically connected to the TAB IC of the TCP block and transmits a test signal to the panel via the TCP block.
  • the TCP block includes a body block mounted on the bottom of the manipulator and the TAB IC mounted on a bottom of the body block, the TAB IC in which there are formed probe leads in direct contact with leads of the panel one by one.
  • the bottom thereof is tilted in a direction to be in contact with the panel, an insertion groove into which a buffer block is inserted is formed on an end of the body block in a direction to be in contact with the panel, and the buffer block is inserted into the insertion groove and an end thereof is protruded toward the outside of the insertion groove.
  • the buffer block in which the end protruded toward the outside of the insertion groove is sharpened to be horizontal to the bottom of the body block, is formed of a nonmetal material capable of being processed.
  • the TAB IC is mounted to be more protruded outward than the end of the buffer block to be easily aligned with corresponding leads of the panel.
  • an elastic groove is formed in a direction of an inner end of the insertion groove and provides compression elasticity while the TAB
  • the TAB IC is in contact with the panel.
  • the TAB IC is adhered and fastened to the bottom of the body block by an adhesive, and an auxiliary fastener preventing a damage generated by an exposure of the TAB IC and fastening the TAB IC to the bottom of the body block is further mounted on the outside of the TAB IC.
  • the probe leads formed on the TAB IC mounted on the bottom of the body block have a pitch therebetween, adjusted to be identical to that between the leads of the panel.
  • the FPCB includes flexible leads in direct contact with a rear surface of the TAB IC and electrically connected to the probe leads of the TAB IC, and a current breaker for preventing a burnt that may occur while testing the panel is formed on the flexible leads.
  • the current breaker is a diode and formed on the flexible leads in such a way that the panel is forwarded in the FPCB.
  • a probe unit may easily and accurately test panels by using a body block, a probe, and a taped-automated-bonded (TAB) integrated circuit (IC) mounted on a panel to be tested, as it is, without a guide film.
  • TAB taped-automated-bonded
  • probe leads formed on the TAB IC are in direct contact with leads of the panel, there is no damage on the leads of the panel in such a way that the occurrence of scrub marks and particles is prevented.
  • a TAB IC mounted on the panel it is possible to correspond to any panel pattern or pitch.
  • FIG. 1 is a top view illustrating a display with a general film package
  • FIG. 2 is an enlarged top view illustrating a part 130 shown in FIG. 1;
  • FIG. 3 is a front view illustrating the part 130 shown in FIG. 2;
  • FIG. 4 is a concept view illustrating a configuration of a general probe unit testing a panel shown in FIG. 1 ;
  • FIG. 5 is a configuration view illustrating an example of the probe unit shown in
  • FIG. 4; [53] FIG. 6 is a concept view illustrating a configuration of a probe unit according to an embodiment of the present invention.
  • FIG. 7 is a view illustrating a real configuration of the probe unit shown in FIG. 6;
  • FIG. 8 is a view illustrating a method of testing panels in a general probe unit
  • FIG. 9 is a view illustrating a method of testing panels in the probe unit according to an embodiment of the present invention
  • FIG. 10 is a concept view illustrating a configuration of a transmission control protocol (TCP) block shown in FIG. 9;
  • FIG. 11 is a configuration view illustrating another example of the TCP block according to an embodiment of the present invention
  • FIG. 12 is an exploded perspective view illustrating a TCP block according to another embodiment of the present invention.
  • TCP transmission control protocol
  • FIG. 13 is a side view illustrating the TCP block shown in FIG. 12;
  • FIG. 14 is a side view illustrating another example of an insertion hole shown in FIG.
  • FIG. 15 is an enlarged view illustrating leads of a panel to be tested
  • FIG. 16 is a concept view illustrating a case in which probe leads are connected to leads of a panel;
  • FIG. 17 is a view illustrating a case in which voltages whose level is different from one another are applied to between leads connected by a fine particle as shown in FIG.
  • FIG. 18 is a view illustrating a taped- automated-bonded (TAB) integrated circuit (IC) connected to a flexible printed circuit board (FPCB);
  • FIG. 19 is a concept view illustrating a probe unit according to an embodiment of the present invention, connected to a panel;
  • TAB taped- automated-bonded
  • FIG. 20 is a concept view illustrating functions of a current breaker
  • FIG. 21 is a view illustrating a TAB IC
  • FIG. 22 is a view illustrating a TAB IC whose part is replaced by a metal panel material
  • FIG. 23 is a view illustrating a TAB IC with probe leads whose end part has a modified surface
  • FIG. 24 is a photograph illustrating a real product of the TAB IC of FIG. 23.
  • FIG. 6 is a concept view illustrating a configuration of a probe unit 500 according to an embodiment of the present invention.
  • FIG. 7 is a view illustrating a real configuration of the probe unit 500 of FIG. 6.
  • the probe unit 500 for testing a panel 110 includes a transmission control protocol (TCP) block TCP and a flexible printed circuit board (PCB) FPCB.
  • TCP transmission control protocol
  • PCB flexible printed circuit board
  • the TCP block TCP is mounted on a bottom of a manipulator MP mounted on an end of a probe base PB, in which probe leads PRLD with the same pitch as that of corresponding leads LD of the panel 110 are formed and in contact with the leads LD of the panel 110 to test the panel 110.
  • One side of the flexible PCB FPCB is electrically connected to a rear end of the TCP block TCP, and another side thereof is connected to POGO block POGO to transmit a test signal (not shown) to the panel via the TCP block TCP.
  • the probe unit 500 there is no body block B including a probe NDL shown in FIG. 4. Also, there is no guide film GF of a transmission control protocol (TCP) block TCP shown in FIG. 4.
  • TCP transmission control protocol
  • a taped- automated-bonded (TAB) integrated circuit which is a film package and used in the panel 110, is attached to a bottom of the TCP block, probe leads PRLD in he TAB IC are used to be in direct contact with leads LD of the panel 110. Accordingly, it is possible to be in contact with the leads LD with a pitch between the leads LD of the panel as it is.
  • TAB taped- automated-bonded
  • the TCP block TCP of FIG. 6 is formed of a body block BB and TAB IC TIC.
  • the shape of the TCP block TCP is determined by the body block BB and the TAB IC TIC.
  • the body block BB is mounted on the bottom of the manipulator MP.
  • the TAB IC TIC surrounds an edge of the body block toward the panel 110 and a bottom of the body block BB, in which there are formed probe leads PRLD in direct contact with the leads LD of the panel 110 to test the panel 110.
  • the TAB IC is one mounted on the panel 110 to be tested. That is, the TAB IC used in the panel 110 is in contact with the body block BB of the probe unit to be used as it is.
  • the TAB IC TIC since the TAB IC TIC is mounted on the panel 110 and in direct contact with the leads LD of the panel 110, the TAB IC TIC includes leads with the same pitch as that of the leads LD of the panel 110, which are referred to as probe leads PRLD. Accordingly, similar to the leads LD of the panel 110, the probe leads PRLD are in a long thin line having a certain surface area.
  • the probe leads PRLD are to be in surface contact with the leads LD of the panel 110 to be tested. Due to the surface contact, there is prevented the occurrence of scrub marks and particles on the leads LD of the panel 110.
  • the certain surface area of the probe leads PRLD indicate the same surface area as that of corresponding leads LD of the panel 110.
  • FIG. 8 is a view illustrating a method of testing a panel in the general probe unit 400.
  • FIG. 9 is a view illustrating a method of testing a panel in the probe unit 500 according to an embodiment of the present invention.
  • the body block B and the probe NDL are removed, and additionally, the guide film GF used in a TCP block is removed. Also, as shown in FIG. 9, the TAB IC TIC used in the panel 110 is attached to the bottom and a side of the body block BB, and probe leads PRLD of the TAB IC TIC are exposed to be in direct contact with the leads LD of the panel 110.
  • a nonconductive buffer 510 is attached to an edge between the bottom and a side toward the panel 110 and the TAB IC TIC surrounds the outside thereof in such a way that elasticity is provided to the TAB IC TIC when the probe leads PRLD of the TAB ICC TIC are in contact with the leads LD of the panel 110.
  • the buffer 510 is formed of one of rubber and silicone. In addition, a nonconductive product such as plastic resin may be used as the buffer 510. Without a buffer, the TAB IC TIC may be in perfect contact with the edge of the body block BB.
  • FIG. 10 is a concept view illustrating a configuration of the TCP block of FIG. 9.
  • the TAB IC TIC includes a first layer Ll, a second layer, and probe leads PRLD formed between the first layer Ll and the second layer.
  • the first layer Ll is in contact with the body block BB and mounted, the second layer is removed to expose the probe leads PRLD.
  • the first layer Ll is formed of polyimide and the second layer is formed of solder resister.
  • FIG. 11 is a configuration view illustrating another example of the TCP block according to an embodiment of the present invention.
  • the TCP block TCP includes a TAB IC TIC in contact with the body block BB mounted on the bottom of the manipulator MP along the bottom of the body block BB.
  • probe leads PRLD whose end is rounded are formed in such a way that elasticity is provided to the probe leads PRLD while in contact with the leads LD of the panel 110.
  • the end of the TAB IC TIC is protruded toward to the outside of an edge of the body block BB, toward the panel 110. Since the end is protruded outward, a user may align the TAB IC TIC when the probe leads PRLD of the TAB IC TIC are in contact with the panel 110.
  • a nonconductive buffer 510 is inserted into an inner space of the end formed to be rounded and may be one of rubber and silicone.
  • the TAB IC TIC includes a nonconductive layer Ll, a second layer L2, and probe leads PRLD formed between the first layer Ll and the second layer L2. In a part in contact with the leads LD of the panel 110, the second layer L2 is removed and only probe leads PRLD are exposed.
  • both of the first layer Ll and the second layer L2 may be removed and only probe leads PRLD may be exposed.
  • FIG. 12 is an exploded perspective view illustrating a configuration of a TCP block
  • TCP according to another embodiment of the present invention.
  • FIG. 13 is a side view illustrating the TCP block TCP shown in FIG. 12.
  • a probe unit for testing a panel includes the TCP block TCP and a flexible PCB FPCB.
  • the TCP block TCP of FIGS. 12 and 13 is mounted on a bottom of a manipulator (not shown).
  • FIGS. 12 and 13 illustrate TCP block TCP of the entire configuration of the probe unit 500 of FIG. 7 separately.
  • the TAB IC used in the corresponding panel 110 is mounted on the TCP block TCP and in contact with the leads LD of the panel 11, thereby testing the panel 110.
  • the flexible PCB FPCB is electrically connected to the TAB IC TIC of the TCP block TCP and transmits a test signal to the panel 110 via the TCP block TCP.
  • the flexible PCB is in direct contact with the TAB IC TIC, and leads (not shown) formed on the flexible PCB FPCB are in contact with probe leads (not shown) formed on the TAB IC TIC one by one.
  • the probe unit according to another embodiment of the present invention which is mounted on a probe base (not shown), has a structure in which an existing body block where a probe in a pin shape is mounted, the body block mounted on a manipulator (not shown), is removed and a TAB IC identical to that used in the panel to be tested is mounted on a bottom of a body block to perform as a probe to be in direct contact with the leads LD of the panel 110 one by one.
  • the TAB IC TIC is mounted on a bottom BBM of the body block BB by adhesion and forms a single body with the body block BB without using another structure.
  • TCP block TCP includes the TAB IC TIC mounted on the body block BB mounted on a bottom of the manipulator and the bottom of the body block BB, the TAB IC TIC in which the probe leads in direct contact with the leads LD of the panel 110 one by one are formed.
  • the probe leads of the TAB IC TIC in FIGS. 12 and 13, the probe leads are identical to those shown in FIG. 9.
  • a driver IC 830 is formed in the center thereof.
  • screw holes 850 capable of being assembled with the manipulator are formed on a top and a hole 840 into which an auxiliary element to strengthen the assembly with the manipulator may be formed on a rear of the body block.
  • the body block BB is tilted downward in a direction in which the bottom BBM of the body block BB is in contact with the panel 110. This is to allow the probe leads of the TAB IC TIC, in contact with the bottom BBM of the body block BB, to be in definite contact with the leads LD of the panel 110.
  • the bottom BBM of the body block BB is flat and the TAB IC TIC is directly adhered to the flat bottom BBM to form a single body with the body block BB.
  • the driver IC 830 and the probe leads are formed on an opposite side of that adhered to the body block.
  • an insertion groove 820 into which a buffer block 810 is inserted is formed on an end in a direction of being in contact with the panel 110.
  • the buffer block 810 is compressed and inserted into the insertion groove 820 and an end 825 thereof is protruded toward the outside of the insertion groove 820.
  • the buffer block 810 may be compressed and inserted into the insertion groove 820.
  • the buffer block 810 may be screw-coupled by a coupling element (not shown) such as a screw, inserted through an insertion hole 910 formed on the top of the body block BB. In this case, a hole allowing the coupling element to pass therethrough should be formed on the buffer block 810.
  • the insertion hole 910 where the coupling element for screw-coupling the buffer block 810 is inserted into may be formed on the bottom of the body block BB.
  • the end 825 protruded toward the outside of the insertion groove 820 is sharpened in such a way that the buffer block 810 is horizontal to the bottom of the body block BB.
  • the buffer block 810 is formed of a nonmetal material capable of being processed, and more preferably, of a material, which is hard to a certain degree capable of being molded and also has elasticity, such as rubber, urethane, silicone, and resin products.
  • the buffer block 810 supports a side of the TAB IC TIC, opposite to a contact part of the TAB IC TIC in contact with the panel to maintain the flatness of the TAB IC TIC and buffers the TAB IC TIC when in contact with the panel 110.
  • the buffer block 810 is in the shape of a square block having a length as same as or longer than that of a lateral direction of the TAB IC TIC, which is a direction where the probe leads are arranged, and the end 825 thereof is sharpened. Then, the tilt of the bottom BBM of the body block BB may be horizontal to the end 825 of the buffer block 810, thereby allowing a contact between the TAB IC TIC and the bottom BBM to be easy.
  • the degree of formed by the insertion groove 820 may be various.
  • the TAB IC TIC is mounted being protruded outward more than the end 825 of the buffer block 810 to easily aligned with corresponding leads LD of the panel 110.
  • a length of a protruded part of the TAB IC, which is protruded more than the end 825 of the buffer block 810, may be about 0.01 to 0.5 mm.
  • the top of the body block BB is bent to be tilted as shown in FIG. 13, which allows the end 825 of the buffer block 810 to be definitely shown to the user seeing from above. Since an end of the TAB IC TIC is more protruded than the end 825 of the buffer block 810, the probe leads of the TAB IC TIC may be easily aligned with the leads LD of the panel for a surface contact one by one therebetween.
  • the TAB IC TIC is adhered and fastened to the bottom BBM of the body block BB by an adhesive.
  • a screw hole may be formed on the TAB IC TIC to be fastened to the body block by a screw.
  • an auxiliary fastener (not shown) for fastening the TAB IC TIC to the bottom BBM of the body block BB may be mounted on the outside of the TAB IC TIC.
  • the auxiliary fastener capable of more compressing the TAB IC to the bottom BBM of the body block BB and preventing a damage caused by the exposure of the probe leads of the TAB IC TIC and the driver IC 830 is additionally mounted on the outside of the TAB IC TIC and the flexible PCB FPCB, thereby more strengthening the TCP block.
  • an elastic groove 920 is formed toward an inner end of the insertion groove 820.
  • the elastic groove 920 is formed on the bottom BBM of the body block BB, which forms compression elasticity as a plate spring when the TAB ICTIC is in contact with the panel 110, thereby allowing a pressing force of the bottom BBM to be well transferred the TAB IC TIC. That is, when the end of the TAB IC TIC is pressed while in contact with the leads LD of the panel 110, the bottom BBM of the body block BB is pushed by an empty space of the elastic groove 920 due to the pressing force, thereby well transferring the pressing force to the TAB IC TIC.
  • the panel 110 may be definitely and easily tested by using the TCP block on which the TAB IC of the panel 110 is mounted.
  • the TAB IC used in the panel 110 to be tested is used as it is.
  • a pitch between leads formed on a TAB IC mounted on the panel 110 is narrower than a pitch between the leads LD of the panel 110, though a difference therebetwen is very small.
  • a pitch between the probe leads formed on the TAB IC TIC should be adjusted. That is, in the present embodiment, the pitch between the probe leads of the TAB IC TIC mounted on the bottom BBM of the body block BB is increased a little to be identical to that of the leads LD of the panel 110.
  • a burnt occurring while testing a display panel is a phenomenon in which, when an abnormal electric connection is performed between the leads of the panel 110, to which mutually different voltages are applied, at the moment that the probe unit is in contact with the panel 110 to provide an electric signal and power to the panel 110, an overcurrent flows through the leads whose electric potential is different from one another, thereby generating heat causing a damage of melting a contact portion between the probe unit and the leads LD of the panel 110.
  • the occurrence of the burnt has a bad influence on not only the probe unit but also the panel 110, thereby causing a great production loss.
  • FIG. 15 is an enlarged view illustrating the leads LD of the panel 110
  • FIG. 16 is a concept view illustrating a case in which the probe leads PRLD mounted on the bottom of the body block BB are connected to the leads LD of the panel 110. In this case, some of the leads LD of the panel 110 are connected by a fine particle R.
  • FIG. 17 is a view illustrating an electrical path formed when voltages with different voltage levels from one another are applied to between the leads LDl and LD2 connected by a fine particle R as shown in FIG. 16 via corresponding probe leads PRLDl and PRLD2.
  • a current more than several hundreds rnA flows.
  • a current more than about 250 mA flows, there is generated a deformation on a film supporting the probe leads PRLD of the TAB IC due to a heat.
  • a greater current flows, there is generated a burnt in which a contact portion between the probe leads PRLD and the leads LD of the panel 110 is instantly melted.
  • the flexible PCB FPCB is in direct contact with a rear of the TAB IC TIC and includes flexible leads FLD electrically connected to the probe leads PRLD of the TAB IC TIC.
  • FIG. 18 is a view illustrating the TAB IC is in contact with the flexible PCB FPCB.
  • a current breaker 1000 is formed on the flexible leads FLD to prevent a burnt that may occur while testing the panel 110. It may be prevented by the current breaker 1000 that an overcurrent generated due to a burnt phenomenon flows.
  • FIG. 19 is a concept view illustrating the probe unit is connected to the panel 110.
  • the current breaker 1000 may be formed of a diode and is formed on the flexible leads FLD in such a way that the panel 110 is forwarded in the flexible PCB FPCB.
  • FIG. 20 is a concept view illustrating a function of the current breaker 1000.
  • the current breaker 1000 that is a diode, is formed on a path in which a voltage is applied to the leads LD of the panel 110.
  • the current breaker 1000 that is a diode.
  • diodes are formed in series on the flexible leads FLD of the flexible PCB FPCB.
  • the current breaker 1000 may be formed on a driving module M. In this case, it is not the driving module M used in the panel 110, it is required to manufacture an additional driving module.
  • the position of attaching the current breaker 1000 may vary with easiness in production.
  • the probe unit according to another embodiment of the present invention includes the body block BB and the flexible PCB FPCB.
  • the body block is in contact with the leads LD of the panel 110 while the TAB IC used in the panel 110 is mounted thereon.
  • the buffer block 810 maintaining the flatness of the contact portion and providing elasticity to the contact portion.
  • the flexible PCB FPCB is electrically connected to the rear of the TAB IC TIC and transmits a test signal to the panel 110 via the TAB IC TIC.
  • FIGS. 12 to 20 the configuration of the body block BB and the flexible PCB FPCB is shown in FIGS. 12 to 20.
  • the TAB IC TIC capable of testing the panel 110 while in direct surface contact with the leads LD of the panel 110 is in direct contact with the bottom BBM of the body block BB, and the buffer block 810 allowing the probe leads PRLD of the TAB IC TIC to be in definite contact with the leads LD of the panel 110 one by one by maintaining the flatness of the contact portion when the TAB IC TIC is in contact with the panel 110 is inserted into the body block BB.
  • the buffer block 810 is protruded toward the outside of the end of the body block BB, maintains the flatness of the TAB IC TIC and provides elasticity thereto.
  • An end of the TAB IC TIC is more protruded outward than the end of the buffer block to allow alignment while in contact with the leads LD of the panel 110 to be easy.
  • a blackening phenomenon may occur on the contact portions where the leads LD of the panel 110 are in contact with the probe leads PRLD of the TAB IC TIC, that is, ends of the probe leads PRLDD of the TAB IC TIC.
  • a contact resistance of the end of the probe leads PRLD is increased due to the blackening phenomenon and a stable voltage is not transferred to the panel 110, thereby causing an indefinite test.
  • the probe leads PRLD of the TAB IC TIC has a structure with copper patterns, which is surface processed with tin.
  • the surface processing with tin prevents corrosion of copper and uses welding characteristics of tin at a relative low temperature while adhering the driver IC 830 to the film of the TAB IC.
  • tin used for such reasons, a blackening phenomenon does not occur on probe leads, a current passing through which is not high, but a high current instantly flows into probe leads, a current passing through which is high, thereby generating a blackening phenomenon.
  • FIG. 21 is a view illustrating the TAB IC TIC.
  • the probe leads PRLD are divided into two groups. One group includes probe leads PRLDa in direct contact with the leads LD of the panel 110 not via the driver IC 830, and another group includes probe leads PRLDb connected to the leads LD of the panel 110 via the driver IC 830.
  • the probe leads PRLDa generally provide an electric signal and power required in gate ICs (not shown) of the panel 110.
  • the gate ICs of the panel 110 are formed both sides of the panel 110.
  • the probe leads PRLDa of the TAB IC TIC provide electric signals and power to the gate ICs not via the driver IC 830.
  • probe leads PRLD formed on the TAB IC TIC mounted on the bottom of the body block BB As a method of preventing the blackening phenomenon, among the probe leads PRLD formed on the TAB IC TIC mounted on the bottom of the body block BB, as the probe leads PRLDa in direct contact with the leads LD of the panel 110 not via the driver IC 830 of the TAB IC TIC, probe leads PTN formed by etching a metallic board 1200 having a length as same as that of the TAB IC TIC are used (refer to FIG. 22).
  • the probe leads PRLDa in direct contact with the leads LD of the panel 110 not via the driver IC 830 of the TAB IC TIC are probe leads for providing an electric signal to the gate ICs of the panel 110.
  • the probe leads PTN formed by etching the metallic board 1200, which is thin and fungible.
  • the metallic board 1200 where probe leads PTN formed by etching are patterned is in contact with the film of the TAB IC TIC.
  • the metallic board 1200 is a thin board capable of being etched, such as beryllium nickel and beryllium copper, which is bonded to the film of the TAB IC TIC by adhesion.
  • the probe leads PTN are formed by etching, which provide an electric signal to the gate ICs of the panel 110.
  • an end portion 1210 of the probe leads PRLD formed on the TAB IC TIC mounted on the bottom of the body block BB, which is for being in contact with the panel 110, may be surface processed with high- conductivity material stable in heat oxidation to prevent a blackening phenomenon caused by a high voltage generated while in contact with the leads LD of the panel 110.
  • a stable metallic layer is formed.
  • a material having high electric conductivity and not oxidized such as gold and nickel, may be used. Though there are shown, as for an example, gold and nickel, those skilled in the art may well know that other materials stable in heat oxidation and having high conductivity may be used.
  • tin in the end portion 1210 of the probe leads PRLD is removed and a layer is formed on a surface by using a metal such as gold and nickel, thereby preventing a blackening phenomenon generated on the contact portion of the probe leads PRLD.
  • the whole probe leads PRLD formed on the TAB IC TIC mounted on the bottom of the body block BB may be surface processed using a stable metallic material such as gold and nickel.
  • FIG. 24 is a photograph of a real product of the TAB IC TIC using the metallic board 1200 of FIG. 22.
  • the photograph of FIG. 24 is taken below the body block BB of the probe unit, in which the metallic board 1200 assembled with the film of the TAB IC TIC is located right of the film and the probe leads PTN are formed on the metallic board 1200 by etching.
  • a flexible PCB FPCB is connected to the rear of the TAB IC TIC.
  • the probe leads PRLDa in direct contact with the leads LD of the panel 110 not via the driver IC 830 of the TAB IC TIC may be formed in a fashion of a blade tip.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Liquid Crystal (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
PCT/KR2010/001399 2009-03-10 2010-03-05 Probe unit for testing panel WO2010104289A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2010800114318A CN102348990A (zh) 2009-03-10 2010-03-05 用于测试面板的探测装置
JP2011553939A JP2012519867A (ja) 2009-03-10 2010-03-05 パネルテストのためのプローブユニット

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2009-0020494 2009-03-10
KR20090020494 2009-03-10
KR1020090097521A KR100972049B1 (ko) 2009-03-10 2009-10-14 패널 테스트를 위한 프로브 유닛
KR10-2009-0097521 2009-10-14

Publications (2)

Publication Number Publication Date
WO2010104289A2 true WO2010104289A2 (en) 2010-09-16
WO2010104289A3 WO2010104289A3 (en) 2011-01-06

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PCT/KR2010/001399 WO2010104289A2 (en) 2009-03-10 2010-03-05 Probe unit for testing panel
PCT/KR2010/001438 WO2010104303A2 (en) 2009-03-10 2010-03-08 Probe unit for testing panel

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PCT/KR2010/001438 WO2010104303A2 (en) 2009-03-10 2010-03-08 Probe unit for testing panel

Country Status (5)

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JP (2) JP2012519867A (zh)
KR (1) KR100972049B1 (zh)
CN (2) CN102348990A (zh)
TW (2) TW201100810A (zh)
WO (2) WO2010104289A2 (zh)

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KR100972049B1 (ko) * 2009-03-10 2010-07-22 주식회사 프로이천 패널 테스트를 위한 프로브 유닛
KR101039338B1 (ko) 2010-01-25 2011-06-08 주식회사 코디에스 극 미세피치 검사용 프로브유닛
KR101020624B1 (ko) 2010-07-20 2011-03-09 주식회사 코디에스 가압부재를 구비한 프로브 유닛의 제조방법
KR101043818B1 (ko) * 2010-08-18 2011-06-22 주식회사 프로이천 액정패널 테스트를 위한 프로브 유닛
KR101020625B1 (ko) 2010-10-07 2011-03-09 주식회사 코디에스 필름타입 프로브유닛 및 그의 제조방법
KR101039336B1 (ko) 2010-10-08 2011-06-08 주식회사 코디에스 필름타입 프로브유닛
KR101158762B1 (ko) 2010-10-19 2012-06-22 주식회사 코디에스 필름타입 프로브유닛 및 그의 제조방법
KR101063184B1 (ko) 2010-11-26 2011-09-07 주식회사 코디에스 Ｃｏｇ패널 검사용 프로브유닛
KR101057594B1 (ko) 2010-11-26 2011-08-18 주식회사 코디에스 Ｆｐｄ 검사용 프로브유닛
KR101177514B1 (ko) 2010-11-26 2012-08-27 주식회사 코디에스 Ｃｏｇ패널 검사용 프로브유닛
KR101242372B1 (ko) 2012-08-28 2013-03-25 (주)메리테크 패널 테스트용 글라스 범프 타입 프로브 블록
KR101970782B1 (ko) * 2018-07-13 2019-04-19 주식회사 케이피에스 유기 발광 다이오드 패널 검사용 프로브 장치
CN109283368A (zh) * 2018-10-29 2019-01-29 大族激光科技产业集团股份有限公司 柔性显示面板测试装置
KR102098653B1 (ko) * 2019-09-19 2020-04-10 주식회사 프로이천 프로브 블록
DE112020000048T5 (de) 2019-12-18 2022-06-02 Advantest Corporation Automatisierte prüfeinrichtung zum prüfen eines oder mehrerer prüfobjekte undverfahren zum betreiben einer automatisierten prüfeinrichtung
TWI797552B (zh) * 2020-02-06 2023-04-01 日商愛德萬測試股份有限公司 用於測試一或多個受測裝置之自動測試設備及用於操作自動測試設備的方法

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JP2012519868A (ja) 2012-08-30
WO2010104289A3 (en) 2011-01-06
TW201037321A (en) 2010-10-16
WO2010104303A3 (en) 2011-01-06
JP5746060B2 (ja) 2015-07-08
KR100972049B1 (ko) 2010-07-22
TW201100810A (en) 2011-01-01
CN102348990A (zh) 2012-02-08
JP2012519867A (ja) 2012-08-30
TWI482972B (zh) 2015-05-01
WO2010104303A2 (en) 2010-09-16
CN102348991B (zh) 2014-05-07
CN102348991A (zh) 2012-02-08

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