TW201037321A - Probe unit for testing panel - Google Patents

Abstract

There is provided a probe unit for testing a panel. The probe unit includes a body block and a flexible printed circuit board (FPCB). The body block with a bottom on which a taped-automated-bonded (TAB) integrated circuit (IC) used in the panel is mounted, the TAB IC in contact with leads of the panel. On a side opposite to a contact portion between the TAB IC and the panel, there is formed a buffer block maintaining flatness of the contact portion and providing elasticity there to. The FPCB is electrically connected to a rear of the TAB IC and transmits a test signal to the panel via the TAB IC.

Description

201037321 VI. Description of the Invention: [Technical Field] The present invention relates to a probe for improving the structure, and is particularly related to a plate or plasma display panel 70, such as a liquid crystal from a detection panel. Display surface [Prior Art] In the first figure, please refer to the voltage on the automatic bonding integrated body that has many dynamic voltage generators to rotate a control signal, and close the voltage. % shows a top view of the display of a general film package. ©

The 1 'display' includes a printed circuit board 100, a tape and reel circuit 120, and a panel no. The printed circuit board 1 〇〇 different components, such as a controller (not shown) and a drive (not shown). On the printed circuit board, the controller says that when the driving voltage generator output drives a display, for example, the power supply voltage, the gate turn-on voltage, and the gate turn-off body circuit 125 are disposed on the tape-type automatic bonding integrated body. Above the 120, the mouthpiece 121 is saved. And the upper connection pad 121 is electrically connected to the printed circuit board 1 〇〇 > t _ abutting connection pad (not shown). And the connection pad 123 is electrically connected to the panel under the "automatic bee-integrated circuit". The tape-and-tape white meshing integrated circuit 120 is contacted by the non-isotropic conductive film $~ or more of the Hd^ middle-brush circuit board 100 and the panel 110. The drive integrated circuit 125 of the tape and tape type self-contained 4-field bonded integrated circuit 12 is movable and detects the panel 110. Fig. 2 is a magnified plan view of the circled portion 130 in Fig. 1. ^ ^ is a cold view of the front view of the portion 130 in Figure 2. 「月同同^ Refer to Fig. 2 and Fig. 3, tape and tape type automatic joint integrated electricity 3 201037321 1 wouuurn '- The film of road 120 includes a first layer LI, a second layer L2, and is formed on the first layer And the wire PLD between the second layers. Typically, the first layer L1 is composed of polyimide and the second layer L2 is composed of solder resistors. Referring to FIG. 3, the tape automated bonding integrated circuit 120 The wire PLD is in one-to-one contact with the wire LD formed on the panel 110, and transmits a test signal to the panel 110. Fig. 4 is a schematic view showing the structure of the general probe unit 400 for detecting the panel 110 in Fig. 1. 5 is a diagram showing an example configuration of the probe unit 400 as shown in Fig. 4. As the performance of the panel 110 is improved, the pitch of the wires LD of the panel 110 is also shortened. That is, the transmission control block TCP is connected to the slot S of the module of the probe unit 400 by the flexible printed circuit board FPCB, and the main block B includes a TCP set in the transmission control block. A probe NDL is disposed between the panel 110 and a control chip TCON. The tape and tape type automatic bonding integrated circuit disposed at the bottom of the transmission control block TCP is the same as the tape and tape type automatic bonding integrated circuit 120 provided on the panel 110. The leading end of the tape and tape type automatic bonding integrated circuit 120 is provided with a guiding film GF. And the probe NDL is directly in contact with the front end of the tape-and-loop automatic bonding integrated circuit 120. The main block B includes a probe NDL whose one end is in direct contact with the wire LD of the panel 110, and the other end thereof is in direct contact with the volume. The tape automatically engages the wire LD of the integrated circuit 120, and the other end is controlled by transmission

Figure 5 is a diagram illustrating the actual surname of a probe unit 4 and a probe unit 4

Electrical connection. The flexible printed circuit board FPCB is assembled in a p〇G〇 block and electrically connected to a module M. A. However, as shown in FIGS. 4 and 5, since one end of the probe NDL disposed in the main body block B is directly in contact with the wire of the panel 11A, the panel 110 wire LD is easily used by the probe> The tip of 1〇1^ is scratched. The wire LD scratch may cause a problem to itself, and since the debris particles generated when the wire LD is scratched may contact the adjacent wire ld, the wires adjacent to each other are electrically connected to each other to cause a defect. In addition, since the pitch of the panel wires LD is made smaller, the manufacturing technique of the probe for panel inspection is also more difficult. ❹ • This setting must be the same as the panel lead LD spacing on the main block B. However, when detecting different panels, the body block β containing the probe NDL must be remanufactured and replaced, resulting in poor detection efficiency and cost. & f SUMMARY OF THE INVENTION The present invention mainly provides a probe unit having a roll T-type automatic joint fTAB for a panel, which is provided by Lei Zhengor, αλ丨,

5 201037321 ννϋυυυτ/λ 1 ' 4 The panel can be easily inspected, the fine disc is aligned with the panel, and a fire is prevented. According to one aspect of the invention, a probe unit for a test panel is provided. The probe unit includes a body block and a flexible printed circuit board (FPCB). The tape-and-tape automatic bonding integrated circuit (TAB 1C) used in the panel is disposed at the bottom of the main body block, and the tape-type automatic bonding integrated circuit is in contact with the panel wires at the bottom of the main body block. The buffer block is formed in the body block, and the buffer block is formed on the other side of the tape-type automatic joint integrated circuit and the panel contact portion for providing the elastic force and pressure of the contact portion. The flexible printed circuit board is electrically connected to the rear end of the tape and tape type automatic bonding integrated circuit, and the flexible printed circuit board transmits a test signal to the panel through the tape and tape automatic bonding integrated circuit. The bottom of the main body block is inclined toward the contact panel to contact the panel, and the buffer block is inserted into one of the one end of the main body block in the direction of the contact panel, and the end of the buffer block inserted into the embedding groove protrudes toward the outside of the embedding groove. The buffer block is ground to the bottom of the body block to the bottom of the body block, and the buffer block is made of a non-metallic material that can be processed. The tape-and-reel automatic bonding integrated circuit is arranged to protrude from the protruding end of the buffer block, so that the tape-and-reel automatic bonding integrated circuit can be easily aligned to the corresponding panel wire. The tape-type automatic bonding integrated circuit disposed at the bottom of the main body block is formed with probe wires, and the probe wires are spaced apart from each other, and the pitch is adjusted to be the same as the distance between the panel wires. At the bottom of the main body block, an elastic groove is formed toward the end of the insertion groove, and is provided with a tape-and-belt type self-elasticity. Compression when the sigma circuit is in contact with the panel

• Tape and Reel Automatic Bonding I The bottom of the main body block, this ice system is attached to the roll by the adhesive 'tightly attached to u 5 — Auxiliary 151 6 J, the integrated integrated circuit The belt is automatically applied to the bottom of the main body block to prevent damage caused by the large x = dynamic joint integrated circuit being tightly fixed. The tape-type automatic bonding integrated circuit is exposed. The flexible printed circuit board includes a flexible tape-type automatic bonding integrated circuit back, and the flexible wire directly contacts the probe wire of the movable bonding integrated circuit, and is electrically connected. To the tape-type self-wire, to prevent the circuit breaker from being formed on the soft guide to fire the panel to the flexible printed circuit board when detecting the panel. The diode of the current interruption. The formula 'formed on the flexible wire is placed at the bottom of the main body block = there is a probe turn, the probe wire directly drives the wafer in a circuit shape, and the probe wire is passed through, and the contact wire is not directly connected to the panel wire. Contact and 2 plates are formed. The probe wire that provides the signal to the gate of the panel is set to the probe wire at the bottom of the read block. An end portion of the probe wire is formed, the end portion thereof; the upper portion of the integrated circuit is subjected to a high-conducting plate stabilized by heat and the end of the probe wire is in contact with the panel wire. Work to prevent blackening. ...'The resulting high voltage is caused by the line (4), the bottom (4) type is automatically bonded to the integrated circuit > is formed with a probe wire which is subjected to high conductivity 7 which is stabilized by thermal oxidation. 201037321 w υυυυτ/Λ Material For surface processing, (10) when the probe wire _... is used, the resulting high voltage is caused by the blackening of the old 'panel wire one of gold and nickel. The electrically conductive material is a tape-type self-deformed probe wire disposed at the bottom of the main body block, and the probe wire is directly contacted with the drive wire through the tape-type automatic bonding integrated circuit. It exists in the form of a tip. The day and day of the probe wire according to the present invention - the probe unit body block, the probe, and the tape set on the panel to be tested == the main circuit 'easy and accurate detection panel without the need for a bow丨i: Bonded body In addition, the tape-type automatic joint assembly is directly in contact with the panel wire, and the damage of the panel wire caused by the debris particles generated by the probe wire can be avoided. And: This $ is scratched and the panel's tape and reel type automatically engages the integrated circuit; in the case of 吏 = set: the panel or the different panel wires (4). ❹ in any formula

In addition, the cost of the I unit is not required because of the probe unit. * For the main red block, the probe can be lowered to make the above content of the present invention more clear. (IV) The embodiment 'and the accompanying drawings are described in detail as follows: g [Embodiment] In order to thoroughly understand the operation of the present invention and For the purpose of the embodiments of the present invention, reference should be made to the contents of the formula and the drawings in accordance with the embodiments of the present invention. The following preferred embodiments are referred to as the same elements throughout the claims. However, the contents of the embodiment = 201037321 are for illustrative purposes only, and the drawings are for the purpose of illustration and are not intended to limit the scope of the invention. FIG. 6 is a schematic structural diagram of a probe unit $ according to an embodiment of the invention. Fig. 7 is a view showing the actual structure of the probe unit 5 (8) of Fig. 6. Referring to Figures 6 and 7, the probe unit 500 for panel 110 detection includes a transmission control block (Tcp) and a flexible printed circuit board (FPCB). The transmission control block TCP is disposed at the bottom of the robot arm Mp, and the robot arm is disposed at the end of the probe base PB. Among them, a probe wire pRLD having the same pitch as the wire LD of the panel U0 is formed, and the probe wire PRLD is in contact with the wire LD of the panel 110 for detecting the panel 110. One side of the flexible printed circuit board FPCB is electrically connected to the rear end of the transmission control block TCP, and the other side of the flexible printed circuit board FPCB is connected to the POGO block POGO' to transmit a test signal through the transmission control block TCP ( Not shown) to the panel. In detail, unlike the general probe unit 4', there is no body block B containing the probe nd1 as shown in Fig. 4 in the probe unit 5'. Moreover, the transmission control block TCp of the probe unit 500 also has no guidance as shown in Fig. 4. The film GF 〇 means that the main body block B and the guiding layer GF are removed, and a film for the panel 110 is removed. The packaged tape and tape type automatic bonding integrated circuit is attached to the bottom of the transmission control block. In the tape and tape type automatic bonding integrated circuit, the probe wire PRLD is directly in contact with the wire LD of the panel i1〇, and is the same as the distance between the probe wire PRLD and the panel wire by 9 201037321 i wouuur/\** Therefore, the probe lead PRLD can be correspondingly contacted to the panel lead. The transmission control block TCP of FIG. 6 is composed of a main body block BB and a tape and tape type automatic bonding integrated circuit TIC. Therefore, the shape of the transmission control block TCP depends on the main body block BB and the tape and tape type automatic bonding integrated circuit TIC. The main body block BB is disposed at the bottom of the robot arm MP, and the tape automatic bonding integrated circuit TIC is directed toward the panel 110 and surrounds the edge of the main body block. The probe wire PRLD formed at the bottom of the main body block is directly connected to the panel 110. The wire LD is in contact for testing the panel 110. A tape automatic bonding integrated circuit is disposed on the panel 110 to be tested. That is, the tape automated bonding integrated circuit TIC for the panel 110 is in contact with the body block BB of the probe unit. As shown in FIG. 1 , since the tape-type automatic bonding integrated circuit TIC is disposed on the panel 110 and directly contacts the wire LD of the panel 110, the tape-type automatic bonding integrated circuit TIC includes a wire LD with the panel 110. Wires with the same spacing, these are the probe wires PRLD. Therefore, similarly to the wire LD of the panel 110, the probe wires PRLD are elongated and each have a specific surface area. The probe lead PRLD surface is in contact with the lead LD of the panel 110 to be tested. The surface contact prevents the wire LD of the panel 110 from being scratched and particles generated by scratches. In the above case, one of the specific surface areas of the probe wire RPLD, indirectly, indicates that the wire LD of the corresponding panel 110 has the same surface area. Figure 8 is a diagram showing a panel of a general probe unit 400 for detecting a panel. 201037321 Detecting a probe unit according to the present invention - an embodiment of the probe unit 5°°, please refer to Fig. 8, in the general probe unit 4〇〇, The main == raw, high ratio, and for example, the detection of the TM V line LD to produce debris particles causes problems. Ο 别 Do not make 盥斟: Each probe NDL must be aligned with each other to accommodate different panels to be tested. — The distance between the creations is narrower and narrower, and the probes that match the wires ld- are also Γ = ^ probe units 5 〇〇, the main block B, the probe fox, and, for example, the guidance of the block TCP The layers are removed. The circuit TIC is attached to the bottom of the body of the panel 110 and the bottom side of the main block, and the tape is from the panel of the FLG. The wire LD exposed to directly contact the interlayer 110 is exposed. In the case of block B and the probe ancestor, the probe wire lead p=the wire (7) has the same pitch, and the probe/, the panel's wire contact is still feasible. In the block BB, the non-conductive buffer 51G is attached to the edge between the bottom and the side of the main body and faces the panel 110, and the tape-and-loop automatic bonding integrated circuit TIC G and the integrated circuit TIC When the ramp is automatically joined, the non-guided linearity D is in contact with the panel 110. The material line LD body ^^ 510 can provide elastic force to the tape type automatic joint product 11 201037321 Non-conductive buffer 510 is made of rubber Or consisting of silicone. Further, a non-conductive product such as a plastic resin can also be used as the buffer 510. In the absence of a buffer, the tape and tape automatic bonding integrated circuit TIC can perfectly contact the edge of the body block BB. Fig. 10 is a schematic view showing the structure of the transmission control block TCP of Fig. 9. The tape and tape type automatic bonding integrated circuit TIC includes a first layer L1, a second layer, and a plurality of probe leads PRLD formed between the first layer L1 and the second layer. At a portion of the wire LD contacting the panel 110, the first layer L1 is disposed and in contact with the body block BB. The second layer is removed to expose the probe lead PRLD. Generally, the first layer L1 consists of polyimide and the second layer consists of solder resistors. Fig. 11 is a view showing another example of the structure of the transmission control block in accordance with an embodiment of the present invention. The transmission control block TCP includes a tape-type automatic bonding integrated circuit TIC, the tape-type automatic bonding integrated circuit TIC is in contact with the main body block BB, and the main body block BB is disposed at the bottom of the robot arm MP along the bottom thereof. In the tape-and-loop automatic bonding integrated circuit TIC, one end of the probe wire PRLD is rounded to provide an elastic force when the probe wire PRLD contacts the wire LD of the panel 110. One end of the tape and tape type automatic joining integrated circuit TIC protrudes toward the outer edge of the main body block BB toward the panel 110. By the protruding end of the tape and tape automatic bonding integrated circuit, when the probe wire PRLD of the tape automatic bonding integrated circuit TIC is in contact with the panel 110, the user can align the tape and tape type automatic bonding integrated circuit. TIC. In the tape and tape automatic bonding integrated circuit TIC, a non-conductive buffer 12 201037321 object 510 is inserted into one end of the inner region of the tape and tape automatic bonding integrated circuit, so that the inner end is arc-shaped, non-conductive buffer The object 510 may be composed of one of rubber and silicone. One side of the tape and tape type automatic bonding integrated circuit T1C is in contact with the main body block BB, and one end of the tape and tape type automatic bonding integrated circuit TIC is wound into an arc shape, thereby forming a transmission control block as shown in FIG. TCP. As shown in FIG. 11, the tape automated bonding integrated circuit TIC includes a non-conductive layer L1, a second layer L2, and a probe formed between the first layer L1 and the second layer L2. Wire PRLD. At the portion in contact with the wire LD of the panel 110, the second layer L2 is removed and only the probe wire PRLD is exposed. At the contact portion with the wire LD of the panel 110, both the first layer and the second layer L2 may be removed and only the probe wire PRLD may be exposed. Figure 12 is a block diagram showing the structure of a transmission control block TCP in accordance with another embodiment of the present invention. Figure 13 is a side elevational view of the transmission control block TCP as shown in Figure 12.同时 Referring to FIG. 12 and FIG. 13 simultaneously, according to another embodiment of the present invention, a probe unit for detecting a panel includes a transmission control block TCP and a flexible printed circuit board FPCB. The transmission control block TCP, as shown in Figures 12 and 13, is disposed on a robot arm (not shown). In Fig. 12 and Fig. 13, the entire configurations of the probe unit 500 of Fig. 7 are separately shown. The tape and tape type automatic bonding integrated circuit TIC corresponding to the panel 110 is disposed in the transmission control block TCP and is in contact with the wire LD of the panel 11 to detect the panel 110. The flexible printed circuit board FPCB is electrically connected to the tape-type automatic bonding integrated circuit TIC of the transmission control block TCP, and transmits a test signal to the transmission control block TCP to Panel 110. The flexible printed circuit board FPCB is in direct contact with the tape-type automatic bonding integrated circuit TIC, and the wires formed on the flexible printed circuit board FPCB (not shown) are one-to-one contact formed on the tape-type automatic bonding product. The probe wire of the body circuit DC (not shown). That is, according to another embodiment of the present invention, a probe unit disposed on a probe substrate (not shown) has a body block, a needle probe disposed in the body block, and removed. The main body block disposed on the robot arm (not shown) is directly connected to the bottom of the main body block and is the same as the tape-type automatic joint integrated circuit TIC used for the panel to be tested. Contact the wire LD of the panel 110. In this case, the take-up type automatic joining integrated circuit UC is attached to the bottom BBM of the main body block BB by means of adhesion, and a single main body can be formed with the main body block BB without using other configurations. The transmission control block TCP includes a tape and tape type automatic bonding integrated circuit TIC disposed in the main body block BB, and the main body block BB is disposed at the bottom of the robot arm. The probe leads formed in the tape-and-tape automatic bonding integrated circuit HC are one-to-one in direct contact with the wires LD of the panel 110. Although the probe wires of the tape-type automatic bonding integrated circuit TIC are not shown in Figs. 12 and 13, these probe wires are the same as the probe wires shown in Fig. 9. In the tape and tape type automatic bonding integrated circuit TIC, in addition to the probe wires, the driving wafer 830 is formed in the center of the tape and tape type automatic bonding integrated circuit TTIC. As shown in Figures 12 and 13, the robot arm can be assembled by the screw hole 850 at the top of the main body block BB, and the assembly of the mechanical arm can be enhanced by the auxiliary element by the hole 14 201037321 840 at the rear end of the main body block BB. . In addition, the body block BB is inclined downward to the direction in which the bottom BBM contacts the panel 110. This allows the probe wire of the take-up type automatic bonding integrated circuit T1C to contact the bottom BBM of the body block BB, ensuring that the probe wire contacts the wire LD of the panel 110. As shown in Figures 12 and 13, the bottom BBM of the body block BB is flat, and the tape automated bonding integrated circuit TIC is directly attached to the bottom BBM of the flat body block, and forms a single body with the body block BB. . 0 The drive wafer 830 and the probe lead are formed on the other side of the main body block to which the tape automatic bonding integrated circuit HC is attached. Further, the embedding groove 820 into which the buffer block 810 is inserted is formed at one end of the main body block BB in the direction of the contact panel 110. The buffer block 810 is compressed and inserted into the embedding slot 820 with one end 825 projecting outwardly of the embedding slot 820. Buffer block 810 can be compressed and inserted into embedding slot 820. However, as shown in Fig. 13, by inserting the insertion hole 910 formed in the main body block BB by a connecting member (not shown) such as a screw, the buffer block 810 can be screwed with the connecting member. In this case, a hole through which the connecting member can pass must be formed on the buffer block 810. Further, as shown in Fig. 14, the insertion member 910 for screwing the inserted buffer block 810 may be formed at the bottom of the main body block BB. The protruding portion 825 of the buffer block 810 protruding outwardly from the insertion groove 820 is ground to the bottom of the main body block BB, and the buffer block is composed of a non-metallic material which can be processed. Further, a material which is not easily molded into a specific angle and has elasticity, such as rubber, urethane, 矽 15 201037321 , > 胶 rubber and resin, is used. The buffer block 810 supports the other side of the contact portion of the take-up type automatic bonding integrated circuit TIC contact panel to maintain the flatness of the tape-type automatic bonding integrated circuit TIC and to provide cushioning when the touch panel 110 is maintained. As shown in Fig. 12, the buffer block 810 is in the shape of a square, and its length is equal to or greater than the lateral length of the tape automated bonding integrated circuit UC, and the lateral direction refers to the direction in which the probe wires are arranged, and the smoothing buffer The block highlights 825. Thus, the bottom body BBB of the inclined body block BB can be horizontal to the protruding end 825 of the buffer block 810, making it easier to contact the tape automated bonding integrated circuit TIC with the bottom BBM of the body block BB. The angle formed by the inlay groove 820 may be different. The provision of the tape and tape type automatic bonding integrated circuit T1C is more prominent than the one end 825 of the buffer block 810, so that the tape and tape type automatic bonding integrated circuit TIC can more easily align the wire LD of the panel 110. The tape and tape automatic bonding integrated circuit TIC protrudes from the length of one end 825 of the buffer block 810, which is approximately 0.01 to 0.5 mm. The top of the body block is curved as shown in Figure 13, to ensure that the user can see the buffer block 810 - end 825 from above. Since the tape-and-loop automatic bonding integrated circuit TIC protrudes from the end 825 of the buffer block 810, the probe wire of the tape-type automatic bonding integrated circuit TIC can be more easily aligned and surface-contacted to the panel wire LD one-to-one. .

The tape and tape type automatic bonding integrated circuit TIC is adhered to the BBM at the bottom of the main block BB by means of an adhesive. However, in addition to the adhesive, a spiral hole may be formed on the tape-type automatic bonding integrated circuit TIC, and the tape-type automatic bonding integrated circuit TIC is fixed to the main block BB 16 201037321 * I i wouuuka by means of a screw . In addition, an auxiliary fixing device (not shown) is disposed outside the tape automatic bonding integrated circuit TIC, and the auxiliary fixing device can tightly fix the tape-type self-joining integrated circuit TIC to the main block BB. BBM at the bottom. That is to say, although the 12th and 13th drawings are not shown, the auxiliary fixing device can more closely fit the tape-type automatic bonding integrated circuit TIC to the bottom portion of the body block BBM to prevent the automatic tape-bonding product. The probe wire PBLD of the body circuit TIC is exposed to the outside, and the driver chip 830 is additionally attached to the tape-type automatic bonding integrated circuit UC and the flexible printed circuit board FPCB, thereby consolidating the transmission control block TCP. At the bottom BBM of the main block BB, an elastic groove 920 is formed toward one end of the inner portion of the insertion groove 820. As shown in Fig. 13, an elastic groove 920 is formed at the bottom of the body block BB BBM, when the tape-type automatic joint product When the body circuit TIC contacts the panel 110, the elastic groove 920 can provide an elastic compressive force like a leaf spring, so that the pressing force of the BBM at the bottom of the main body block can be well transmitted to the tape-type automatic joint integrated circuit TIC. That is, when one end of the tape-and-tape automatic bonding integrated circuit TIC is pressed by the wire LD contacting the panel Ο 110, the pressing force causes the BBM at the bottom of the body block BB to be pushed by the cavity space of the elastic groove 920. Extrusion, therefore, the pressing force is well transmitted to the tape-type automatic bonding integrated circuit TIC. In the above description, the transmission control block. TCP test panel 110 can be utilized explicitly and easily. The tape and tape type automatic bonding integrated circuit DIC of the panel 110 is disposed on the transmission control block TCP. The tape-and-reel automatic integrated circuit TIC attached to the bottom portion of the main block BBM as described above is the same as the tape-and-reel automatic bonding integrated circuit for the panel 110 to be tested. However, in actuality, in the roll 17 201037321, 1 wouuur/\ ^ ' 4 tape automatic bonding integrated circuit provided in the panel 110, the wire pitch formed on the tape automated bonding integrated circuit is higher than that of the panel 110 The wire LD spacing is narrow, even if the difference between the two pitches is small. Therefore, when the tape-and-reel automatic bonding integrated circuit provided on the panel 110 is regarded as the tape-type automatic bonding integrated circuit TIC provided at the bottom of the main block BBM, the tape-type automatic bonding integrated circuit T1C is formed. The probe lead spacing must be adjusted. That is, in the present embodiment, the tape-and-tape automatic bonding integrated circuit T1C disposed at the bottom BBM of the main body block BB has a spacing between the probe wires formed on the tape-type automatic bonding integrated circuit TIC. A slight adjustment is made to match the spacing between the panel 110 wires LD. The method of increasing the pitch of the probe wires of the tape and tape type automatic bonding integrated circuit TIC is to fix one end of the tape and tape type automatic bonding integrated circuit TIC, and pull the other end to increase the pitch of the probe wires. Since this method of increasing the probe lead pitch of the tape and tape type automatic bonding integrated circuit T1C is well known to those skilled in the art, the detailed implementation method for increasing the pitch of the probe wires is not much here. Narration. The condition of the fire caused by the detection of the display panel is caused by an abnormal electrical connection between the wires of the panel 110. When different voltages are applied between different wires, at this time, the probe unit is in contact with the panel 110 to provide a telecommunication 7 and the power supply to the panel 110. The overload current is generated by the wires having different potentials, and the generated heat is melted. Damage occurs in the contact portion of the probe unit with the wire LD of the panel 110. The occurrence of a fire has a bad influence on the probe unit and the panel 110, resulting in a significant loss of output. 18 201037321 • I i wouuur/\ Fig. 15 is an enlarged view of the lead LD of the panel 110, and Fig. 16 shows the probe lead PRLD disposed at the bottom of the main block BB. Contact with the lead LD of the panel 110 A schematic diagram of the situation at the time. In this case, a part of the wires LD of the panel 110 is connected by a minute particle R. Figure 17 is a diagram showing that when different voltage values are applied between the wires LD1 and LD2 by the probe wires PRLD1 and PRLD2, a current path is formed on the wires LD1 and LD2 to which the particles R are connected, and the particles R are connected to the wires. A schematic diagram of LD1 and LD2 is shown in Fig. 16. More than a few hundred milliamps will pass this electrical path. Generally, a current of 250 mA or more flows, and the heat generated causes damage to the film of the probe lead PRLD supporting the tape-and-reel automatic bonding integrated circuit TIC. In addition, when a larger current is generated, the contact portion of the probe lead PRLD and the lead LD of the panel 110 is caused to ignite and melt immediately. Therefore, it is necessary to prevent the generation of an overload current. In this embodiment, the flexible printed circuit board FPCB is directly in contact with the tape-type automatic bonding integrated circuit TIC, and the flexible printed circuit board 〇FPCB includes a flexible wire FLD, and the flexible wire FLD is electrically connected to the tape. The type automatically connects the probe lead PRLD on the integrated circuit TIC. Fig. 18 is a view showing the tape-type automatic bonding integrated circuit TIC which is in contact with the flexible printed circuit board FPCB. In the present embodiment, at this time, a current interrupter 1000 is disposed on the flexible wire to prevent a fire from being generated when the panel 110 is detected. The current interrupter 1000 prevents fires caused by excessive current. FIG. 19 is a schematic diagram of a probe unit connected to the panel 110. 19 201037321 t< 1 wouuur/\ K * It can be seen from Fig. 19 that the flexible printed circuit board FPCB with the current breaker 1000 is connected to the tape-type automatic bonding integrated circuit TTIC, and the tape-and-reel automatic bonding integrated circuit The TIC is attached to the BBM at the bottom of the main block BB. In particular, the current interrupter 1000 can be a diode, and the current interrupter 1000 is formed on the flexible conductor FLD in the direction of the flexible printed circuit board FPCB. Figure 20 is a schematic diagram showing the function of the current interrupter 1000. In Fig. 20, a voltage is applied to the path formed by the wire LD of the panel 110, and a current interrupter 1000 composed of a diode is formed. More specifically, as described earlier, the two-pole system is formed in series on the flexible conductor FLD of the flexible printed circuit board FPCB. Although the particle R causes the formation of a current path between adjacent wires, the diode prevents the current from flowing from a high potential (30 volts) to a low potential (3 volts). Therefore, although a high voltage is applied to the wires to which the particles R are connected, since the low voltage is broken, no excessive current flows into the panel 110, and the current increased by the panel 110 is not large, so that the excessive current can be prevented. The resulting fire. According to an embodiment of the present invention, by preventing the fire phenomenon caused by the detection panel 110 by non-specific means, the yield of the panel 110 can be greatly improved. In the present embodiment, the current breaker 1000 is disposed as described above. On the flexible printed circuit board FPCB, the current interrupter 1000 can also be disposed on the drive module Μ. At this time, the drive module is not used for the drive module of the panel 110, but another drive module needs to be manufactured. Current cutoff 20 201037321

• The attachment position of the 1 i wouuurA 1000 will vary depending on the ease of manufacture. According to another embodiment of the invention, the probe unit comprises a body block • BB and a flexible printed circuit board FPCB. When the tape and tape type automatic bonding integrated circuit device for the panel 110 is on the main body block, the main body block is in contact with the wires of the panel 110. The other side of the contact portion of the tape-and-tape automatic bonding integrated circuit TIC and the face plate 110 is formed with a buffer block 810 for maintaining the flatness of the contact portion and providing elasticity of the contact portion. 〇 The flexible printed circuit board FPCB is electrically connected to the tape-type automatic integrated circuit lie, and a test signal is transmitted to the panel 110 by the tape-type automatic bonding integrated circuit TIC. A structure diagram of a probe unit, a body block BB and a flexible printed circuit board FPCB according to another embodiment of the present invention is shown in Figs. 12 to 20. When the panel 110 is tested, the tape-type automatic bonding integrated circuit TIC directly contacting the bottom BBM of the main block BB is directly in contact with the wire LD of the panel 110, and the buffer block 810 is used to ensure the tape-and-reel type. The probe lead PRLD of the joint integrated circuit TIC is swayed and the wire LD contacting the panel 110 is determined. And when the tape and tape type automatic bonding integrated circuit TIC contacts the panel 110, the buffer block 810 of the body block BB is inserted to maintain the flatness of the contact portion. The buffer block 810 protrudes toward the main end of the body block, maintaining the flatness of the tape-and-loop automatic bonding integrated circuit TIC while providing flexibility. One end of the tape and tape type automatic bonding integrated circuit TIC protrudes more from the protruding end of the buffer block 810, so that the tape and tape type automatic bonding integrated circuit TIC can more easily contact and align with the wire LD of the panel 110. 21 201037321

wouuurA As described above, the material characteristics of the buffer block 810, the pitch adjustment of the probe wire pRLD formed in the tape automatic bonding integrated circuit TIC, and the structure for preventing fire are not described in detail herein. . When the panel 110 is inspected, the blackening phenomenon may occur in the contact portion of the lead wire LD of the panel 11 and the probe lead PRLD of the roll-type automatic bonding integrated circuit tic, and the contact portion, that is, the tape-type automatic joint integrated circuit price The end of the needle lead PRLDD. The tip end of the probe wire pRLD increases its contact resistance due to blackening, and cannot be transmitted stably; it is pressed to the panel 110, thus causing a non-positive peak of the detection result.

The blackening of the contact portion often occurs when a high voltage is applied to one of the probe leads PRLD of the tape automatic bonding integrated circuit Tic. When the 导线 pin wire PRLD contacts the wire LD of the panel ,, an instantaneous high current is passed, and the metal characteristic of the contact portion of the probe wire is changed.

Generally, the probe lead PRLD of the tape and tape type automatic bonding integrated circuit TIC is made of copper and is processed by tin on the surface. Tin processing of the surface: copper corrosion can be prevented, and the driving wafer 830 can be adhered to the film of the tape-type automatic bonding integrated circuit TIC by the characteristics of tin soldering at a lower temperature. However, based on the above-mentioned reason for using tin, the blackening phenomenon does not occur when the current of the appropriate I flows into the probe wire, but the blackening phenomenon occurs when an excessive amount of current flows into the probe wire in an instant. Figure 21 is a diagram showing the tape and tape type automatic bonding integrated circuit TIC. The probe wires PRLD are divided into two groups, and one set of probe wires pRLDa does not need to pass through the driving chip 830 to directly contact the wires of the panel no. [o, another group of PRLDbs is connected to the wires 11 201037321 LD of the panel 11 through the driving wafer 830.熘4f遥媸_

Since the voltage applied to the gate integrated circuit will be t:h you.

And on the tin on the surface of the probe lead PRLDa, blackening occurs. It is important to prevent the occurrence of blackening. A method for preventing blackening phenomenon, as described below, the tape and tape type automatic bonding integrated circuit TIC is disposed at the bottom of the body block BBM, and is formed in the probe wire PRLD of the tape and tape type automatic bonding integrated circuit TIC, the probe wire The PRLDa is in direct contact with the wire LD of the panel 110 and does not pass through the drive wafer 830 of the tape-type automatic bonding integrated circuit TIC. The probe wire PTN is formed by the metal plate 1200, and please refer to FIG. 22 'metal plate The length of 1200 is the same as the length of the tape and tape type automatic bonding integrated circuit T1C. In this case, the probe lead PRLDa' which directly contacts the lead LD of the panel 11A without the drive-type wafer 830 of the tape-type automatic bonding integrated circuit TIC provides a signal-to-panel 110 gate integrated circuit. Needle wire. That is, the probe guide wire that provides the signal to the gate integrated circuit of the panel 110 is a power line through which the high voltage signal passes, wherein the blackening of the contact portion of the panel 11 〇 wire LD is due to the contact portion. Sparks made 23 201037321 ννουυυΓ/\ ' ^ · Cheng. In order to prevent the occurrence of blackening, the probe lead obtained by etching the metal plate 1200 is as thin and replaceable as the corresponding probe wire of the tape-type automatic bonding integrated circuit TIC.

Referring to Fig. 22, the probe lead PTN formed by the engraved metal plate 1200 replaces the film of the probe lead PRLDa' probe lead ρτΝ in contact with the tape-type automatic bonding integrated circuit TIC in Fig. 21. The metal plate 1200 is composed of a thin plate which can be surnamed, for example, a nickel-nickel alloy and a beryllium copper alloy, and the metal plate 1200 is attached to the film of the tape-type automatic bonding integrated circuit TIC by means of bonding. The probe lead ρτΝ formed on the metal plate 1200 by the residual is provided to the gate integrated circuit of the panel 11 。. Please refer to Fig. 23, the tape and tape type automatic bonding integrated circuit ΤΙ (set at the bottom of the body block BB BBM, the probe wire prlD is formed in! The band automatic bonding integrated circuit TIC ' is used to contact the panel 11G The end of the needle line PRL=121 (), different from the figure, can be used for surface processing using a gated conductive material stabilized in the cable to prevent the probe wire

When the PRLD is in contact with the panel 彳^πρ + ^ ^ a A 攸U〇 wire LD, the resulting black voltage is blackened. #,, after removing the tin of the probe wire PRLD end 33121G, a stable layer of « J, ^ ΛΛ * is formed. Rough surface finishes such as gold and nickel with high conductivity and less emulsification are available. Although it is a highly conductive material that is stable to thermal oxidation, the technique of the present invention = the examples of gold and nickel are as described above, but the other ones known to the general knowledge of thermal oxidation are known to be removed by removing the probe. i materials can be used. The tin of the end portion 1210 of the τ wire PRLD is formed on the surface layer by a metal such as 24 201037321 • t i ννυυυυτ/Λ. gold and nickel, thereby preventing blackening which occurs at the contact portion of the probe wire PRLD. As shown in FIG. 23, a surface layer is formed on the surface of the probe lead PRLD end portion 1210 by using a metal such as gold and nickel, and is formed on the tape-type automatic bonding integrated circuit TIC provided at the bottom of the main body block. The probe wire PRLD as a whole can also be surface-treated with a stable metal material such as gold and nickel. Fig. 24 is a photograph of a real product of the tape-and-tape automatic bonding integrated circuit TIC made of the metal plate 1200 as shown in Fig. 22. The photograph of Fig. 24 is taken downward by the main block BB of the probe unit, wherein the film assembly portion of the metal plate 1200 and the tape-type automatic bonding integrated circuit TIC is located on the right side of the film, and the probe wire PTN It is formed on the metal plate 1200 by the remaining moment. The flexible printed circuit board FPCB is connected to the tape-type automatic bonding integrated circuit TIC. In addition, in the probe lead PRLD formed on the tape-type automatic bonding integrated circuit UC of the BBM at the bottom of the main block BB, the probe guide line PRLDa directly contacts the lead LD of the panel 110 without passing through the roll. The tape type automatic bonding integrated circuit TIC drives the wafer 830, and the probe wire PRLDa exists in the form of a tip. When a high-voltage signal line is fabricated using a blade-like material, it is possible to reduce the ignition caused by foreign matter and prevent blackening by using a material characteristic of the blade. In the above, the present invention has been disclosed in the above preferred embodiments, but it is not intended to limit the present invention. Applicants with ordinary skill in the art to which the present invention pertains can be applied to various types of applications and refinements, without departing from the spirit and scope of the present invention. Therefore, the scope defined in the patent scope of the present invention shall prevail. [Simple description of the diagram] ^ The diagram shows the top view of the display of the film package. = A close-up of the circled portion 130 in the figure. The figure is not a front view of the portion 13G in the second figure. Figure 4 - shows the general probe unit of the panel of the second diagram. Fig. 5 is a view showing the configuration of an embodiment of the probe unit of Fig. 4. Figure 6 is a diagram showing the configuration of a probe unit in accordance with the present invention. Figure 7 shows the actual construction of the probe unit of Figure 6. Ϊ 8Q diagram 曰 曰 々 々 々 采 采 采 采 采 采 采 采 采 采 采 采 采 采 采 采 方 — — — — — — — — — — 实 实 实 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四The construction block J is made of 1L. The transmission control block of the present invention is another transmission control area J 13 according to the present invention. Fig. 13 is a side view of another embodiment of the insertion hole. Figure 15 is an enlarged view of the wires of the panel to be tested. 26 201037321 • « i wuuuur/\ Figure 16 shows the situation when the probe wires touch the panel wires. Fig. 17 is a view showing a state in which wires of different voltage values are connected by the microparticles in Fig. 16 are shown. Figure 18 is a schematic diagram showing the connection of a tape automated bonding (TAB) integrated circuit (1C) to a flexible printed circuit board (FPCB). Figure 19 is a schematic view showing the connection of a probe unit to a panel in accordance with an embodiment of the present invention. 〇 Figure 20 shows the function diagram of the current breaker. Figure 21 is a schematic view showing the tape and tape type automatic bonding integrated circuit. Figure 22 is a schematic view showing the use of a metal plate material in place of a partial tape-and-loop automatic. Fig. 23 is a schematic view showing the surface modification of the probe wire end of the tape and tape type automatic bonding integrated circuit. Fig. 24 is a photograph of the actual product of the tape and tape type automatic bonding integrated circuit in Fig. 23. 〇 [Main component symbol description] 110 : Panel 120 : Tape and reel automatic bonding integrated circuit 125 : Driving integrated circuit 400 , 500 : Probe unit 510 : Buffer 810 : Buffer block 820 : Embedding groove 27 201037321

1 WOUUUKA 825: Buffer block protruding end 8 3 0. Driving wafer 840: Hole 850: Screw hole 910: Inserting hole 920: Elastic groove 1000: Current breaker 1200: Metal plate B: Main block BB: Main body area Block BBM: FPCB at the bottom of the main block: Flexible printed circuit board LD, PLD: Wire Μ: Module ΜΡ: Robot arm NDL: Probe ΡΒ: Probe substrate PRLD, PRLDa, PRLDb, ΡΤΝ: Probe wire R: Particle S : Slot TCON: Control Wafer TCP: Transmission Control Block TIC: Tape and Reel Automatic Bonding Integrated Circuit 28

Claims (1)

201037321 * * 1 WOUUU^A VII. Patent application scope: 1. A probe unit for detecting a panel, the probe unit comprising: _ a body block, one of which is provided at the bottom of the body block for the panel And a tape-type automatic bonding integrated circuit in contact with the plurality of wires of the panel, wherein the body block is formed with a buffer block, which provides elastic force and pressure to a contact portion, the contact portion is between the volume a tape type automatic bonding integrated circuit and the panel, the buffer block is formed on the other side of the contact portion; and Q a flexible printed circuit board electrically connected to the tape type automatic bonding integrated circuit The back end transmits a test signal to the panel through the tape automated bonding integrated circuit. 2. The probe unit of claim 1, wherein the bottom of the body block is inclined toward one of the faces of the panel, wherein an embedded groove is for inserting the buffer block, and the embedded groove is One direction of contacting the panel is formed at one end of the body block, wherein the buffer block is inserted into the embedding groove, and one end of the buffer block protrudes beyond the embedding groove. 3. The probe unit of claim 2, wherein the buffer block protrudes from the end of the embedded slot and is ground to the bottom of the body block, the buffer block being Processed non-metallic material composition. 4. The probe unit of claim 1, wherein the provision of the tape automated bonding integrated circuit protrudes from the end of the buffer block, making it easier to 'align" the corresponding panel wire. 5. The probe unit of claim 1, wherein the plurality of probe wires are formed on the tape automated bonding 29 201037321 , 't 1 WOUUUKA ' integrated circuit disposed at the bottom of the body block, The distance between the probe wires is adjusted to be the same as the distance between the panel wires. 6. The probe unit of claim 1, wherein at the bottom of the body block, an elastic groove is formed at one end of the inner direction of the groove and provides the tape-type automatic joint integrated circuit contact The compression elasticity of the panel. 7. The probe unit of claim 1, wherein the tape automated bonding integrated circuit is attached to the bottom of the body block by an adhesive, and an auxiliary fixing device is further disposed on In addition to the tape and tape automatic bonding integrated circuit, the tape automatic bonding integrated circuit is fixed to the bottom of the main body block to prevent the tape automatic bonding integrated circuit from being exposed to the outside. A damage. 8. The probe unit of claim 1, wherein the flexible printed circuit board comprises a plurality of flexible wires directly contacting one of the back sides of the tape automated bonding integrated circuit and electrically connected to the tape A plurality of probe wires are automatically joined to the integrated circuit, and a current interrupter is disposed on the flexible wires to prevent a fire that may occur on the flexible wires when testing the panel. 9. The probe unit of claim 8, wherein the current interrupter is a diode, and the panel is formed on the flexible wires in a direction toward the flexible printed circuit board. 10. The probe unit of claim 1, wherein the plurality of probe wires formed in the tape automated bonding integrated circuit directly contact the wires of the panel are not disposed on the body When one of the tape automated bonding integrated circuits at the bottom of the block drives the wafer, the probe leads 30 201037321 • » i WOUUUKA The wire is made by a metal plate. 11. The probe unit of claim 10, wherein the probe leads are in direct contact with the wires of the panel, and the drive wafer is not automatically bonded by the tape-type integrated circuit. The probe leads are used to provide an electrical signal to the plurality of gate integrated circuits of the panel. 12. The probe unit of claim 1, wherein one end of the plurality of probe wires is formed on the tape automated bonding integrated circuit, and the tape automated bonding integrated circuit is disposed in the body region At the bottom of the block, one of the ends of the probe wires is in contact with the panel, and the end is surface treated with a highly conductive material stabilized in a thermal oxidation step to prevent the end from contacting the panel. A high voltage occurs in the wire and a blackening occurs. 13. The probe unit of claim 1, wherein the plurality of probe wires are formed in the tape automated bonding integrated circuit disposed at the bottom of the body block, the probe wires being stabilized by heat One of the oxidation steps is a surface treatment of a highly conductive material to prevent a high voltage from occurring when the probe wires are in contact with the wires of the panel. 14. The probe unit of claim 12 or 13, wherein the highly conductive material is one of gold and nickel. 15. The probe unit of claim 1, wherein the plurality of probe wires formed on the volume of the tape automated bonding integrated circuit directly contact the wires of the panel are not provided by When one of the tape automated bonding integrated circuits of the bottom of the body block drives the wafer, the probe wires are individually present in the form of a tool tip. 16. The probe unit of claim 1, wherein the tape-and-loop automatic 31 201037321 1 ννουυυΓ/\ joint integrated circuit is the same as that disposed on the panel to be tested. 32