CN102348990A - Probe unit for testing panel - Google Patents

Probe unit for testing panel Download PDF

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Publication number
CN102348990A
CN102348990A CN2010800114318A CN201080011431A CN102348990A CN 102348990 A CN102348990 A CN 102348990A CN 2010800114318 A CN2010800114318 A CN 2010800114318A CN 201080011431 A CN201080011431 A CN 201080011431A CN 102348990 A CN102348990 A CN 102348990A
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CN
China
Prior art keywords
panel
tab
lead
main body
wire
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Pending
Application number
CN2010800114318A
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Chinese (zh)
Inventor
任利彬
许南重
赵濬秀
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PRO 2000 CO Ltd
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PRO 2000 CO Ltd
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Application filed by PRO 2000 CO Ltd filed Critical PRO 2000 CO Ltd
Publication of CN102348990A publication Critical patent/CN102348990A/en
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2879—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to electrical aspects, e.g. to voltage or current supply or stimuli or to electrical loads
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/006—Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

There is provided a probe unit for testing panels. The probe unit includes a transmission control protocol (TCP) block and a flexible printed circuit board (FPCB). The TCP block is mounted on a bottom of a manipulator mounted on an end of a probe base, the TCP block in which probe leads with the same pitch as that of corresponding leads of the panel are formed in contact with the leads of the panel and test the panel. The FPCB is electrically connected to a rear end of the TCP block and transmits a test signal to the panel via the TCP block.

Description

The sniffer that is used for test panel
Technical field
The present invention relates to a kind of sniffer, more specifically, relate to a kind of sniffer that improves structure that has, said improvement structure is used to test the panel such as LCD and plasma display.
Background technology
Fig. 1 shows the top view of the display with common film encapsulation.
With reference to Fig. 1, display comprises that printed circuit board (PCB) (PCB) 100, winding engage (TAB) integrated circuit (IC) 120 and panel 110 automatically.Various elements such as controller (not shown), driving voltage generator (not shown) are installed on PCB100.On PCB100, controller output control signal, and the output of driving voltage generator is in order to the required voltage of driving display, such as supply voltage, gate-on voltage (gate on voltage) and gate off voltage (gate off voltage).
The top connection pads 121 that the TAB IC120 of drive IC 125 is installed is electrically connected to the connection pads (not shown) of PCB100.In addition, the bottom connection pads 123 of TAB IC120 is electrically connected to panel 110.TAB IC120 contacts through placing anisotropic conductive film therebetween with PCB100 and/or panel 110.
The drive IC 125 of TAB IC120 can drive and test panel 110.
Fig. 2 shows the amplification vertical view of part shown in Figure 1 130.
Fig. 3 shows the front elevation of part shown in Figure 2 130.
With reference to Fig. 2 and Fig. 3, the film of TAB IC120 comprise ground floor L1, second layer L2 and be formed on ground floor L1 and second layer L2 between lead-in wire PLD.Usually, ground floor L1 is formed by polyimide, and second layer L2 is formed by welding resistor.
Can know that from Fig. 3 the lead-in wire PLD of TAB IC120 contacts with lead-in wire LD on being formed on panel 110 one to one, and to panel 110 transmission of electric signals.
Fig. 4 shows the conceptual view of the structure of common sniffer 400, and wherein sniffer 400 is used for the panel 110 of test pattern 1.
Fig. 5 shows the structure view of the instance of sniffer 400 shown in Figure 4.
Along with panel 100 has high-performance, the pitch between the lead-in wire LD of panel 110 becomes very fine.When test panel 110, sniffer 400 uses structure shown in Figure 4.
That is to say that transmission control protocol (TCP) piece TCP is connected to the socket S of the module M of sniffer 400 through flexible PCB (FPCB), and the main body block B that comprises probe NDL is between TCP piece TCP and panel 110.Control chip TCON is installed on the module M.
On the bottom of TCP piece TCP, install and the identical TAB IC of TAB IC120 that on panel 110, installs.
Front end at TAB IC120 is installed oriented film GF, and probe NDL directly contacts with the front end of TAB IC120.
Main body block B comprises probe NDL, and the end of its middle probe NDL directly contacts with the lead-in wire LD of panel 110, and the other end directly contacts with the lead-in wire LD of TAB IC120 through the slotted hole of the oriented film GF of TCP piece TCP, so that the fixed position.
Fig. 5 shows the instance constructs of sniffer 400, and wherein TCP piece TCP and main body block B are installed on the bottom of executor MP, and executor MP is installed on the edge of probe base PB of sniffer 400.FPCB is electrically connected to the TAB IC120 that on the bottom of TCP piece TCP, installs.FPCB and POGO piece fit together, and are electrically connected to module M.
But, can know that from Fig. 4 and Fig. 5 directly contact with the lead-in wire LD of panel 110 owing to be installed in the end of the probe NDL on the main body block B, the tip of probe NDL may produce scraping on the lead-in wire LD of panel 110.Because scraping, lead-in wire LD self possibly go wrong.In addition, the lead-in wire particle that is produced by scraping is connected to adjacent lead-in wire LD, makes lead-in wire LD be electrically connected to each other thus, thereby causes defective.
In addition, because the pitch between the lead-in wire LD of panel becomes more and more meticulousr, therefore more and more be difficult to make the probe block that is used for test panel.
In addition, need be on main body block B probe NDL to be installed with the identical pitch of pitch of the lead-in wire LD of panel.Yet,, therefore increased the cost that is used to test owing to when changing panel, must make and change the main body block B that comprises this probe NDL again.
Summary of the invention
Technical matters
The present invention provides a kind of sniffer with following structure: in this structure, the winding that is used for panel engages the bottom that (TAB) integrated circuit (IC) is installed in main body block automatically.Said sniffer is test panel easily, accurately aims at panel, and can prevent calcination.
Issue-resolution
According to an aspect of the present invention, a kind of sniffer that is used for test panel is provided, said sniffer comprises transmission control protocol (TCP) piece and flexible printed circuit board (FPCB).
Said TCP piece is installed on the bottom of executor; Said executor is installed in the end of probe base; In said TCP piece, be formed with the probe lead that has same pitch with the corresponding lead-in wire of said panel, said probe lead contacts and tests said panel with the lead-in wire of said panel.
Said FPCB be electrically connected to the rear end of said TCP piece and via said TCP piece to said panel transmitted test signal.
Said TCP piece comprises: be installed in the main body block on the bottom of said executor; And winding engages (TAB) integrated circuit (IC) automatically; Automatically engage in (TAB) integrated circuit (IC) in said winding; Form said probe lead; Said probe lead around said main body block, towards the edge of said panel and the bottom of said main body block, and with test said panel when the lead-in wire of said panel contacts.
Said TAB IC is identical with TAB IC on being installed in institute's test panel.
Non-conductive bolster be attached to said main body block, towards the edge of said panel; And said TABIC is as follows around its outside: when the probe lead of said TAB IC contacts with the lead-in wire LD of said panel; To said TAB IC elastic force is provided, wherein said bolster is formed by one of them of rubber and silicone.
Said TCP piece comprises: be installed in the main body block on the bottom of said executor; And the TAB IC that contacts with the bottom of said main body block, in said TAB IC, being formed with said probe lead, the end of said probe lead forms circle, when contacting with the lead-in wire of said panel, to said probe lead elastic force to be provided.The end of said probe lead is towards said main body block, outstanding towards the outside at the edge of said panel.In said TAB IC, non-conductive bolster is inserted in the inner space that forms circular end.
Said probe lead be have definite surface area, with the lead-in wire of said panel have identical shaped and pitch and contact with corresponding lead-in wire direct surface linear.
According to another embodiment of the present invention, a kind of sniffer that is used for test panel is provided, said sniffer comprises TCP piece and FPCB.
Said TCP piece is installed on the bottom of executor, and the TAB IC that is used for said panel is installed on said TCP piece, and said TAB IC contacts and test said panel with the lead-in wire of said panel.Said FPCB be electrically connected to the TAB IC of said TCP piece and via said TCP piece to said panel transmitted test signal.
Said TCP piece comprises: be installed in the main body block on the bottom of said executor; And be installed in the said TAB IC on the bottom of said main body block, in said TAB IC, be formed with the probe lead that directly contacts one to one with the lead-in wire of said panel.
In said main body block; Its bottom tilts in the direction that contacts with said panel; Wherein said main body block, form insertion groove with end on the direction that said panel contacts; Buffer stopper is inserted in the said insertion groove; And said buffer stopper is inserted in the said insertion groove, and its end is outstanding towards the outside of said insertion groove.
Said buffer stopper is by processed nonmetallic materials forming, and end said buffer stopper, that give prominence to towards the outside of said insertion groove is sharpened with the bottom transverse to said main body block.
Said TAB IC is installed to be more outstanding than the end of said buffer stopper, to be easy to the corresponding lead-in wire aligning with said panel.
On the bottom of said main body block, on the interior extreme direction of said insertion groove, form elastic groove, and said elastic groove said TAB IC with compression elasticity is provided when said panel contacts.
Said TAB IC adheres to and is fastened to the bottom of said main body block through bonding agent; And at the outside assisted fasteners of further installing of said TAB IC, said assisted fasteners is used to avoid damage that the exposure owing to said TAB IC produces and the bottom that is used for said TAB IC is fastened to said main body block.
The pitch that is adjusted between the lead-in wire with said panel in the pitch between the probe lead that forms on the TAB IC that is installed on the bottom of said main body block is identical.
Said FPCB comprises flexible lead wire; Said flexible lead wire and the rear surface of said TAB IC directly contact and are electrically connected to the probe lead of said TAB IC; And on said flexible lead wire, form isolating switch, said isolating switch is used to avoid contingent calcination when the said panel of test.Said isolating switch is a diode, and said isolating switch is formed on the said flexible lead wire with the mode that in said FPCB, makes said panel be in forward.
The invention beneficial effect
Can be easily and test panel accurately according to the sniffer of the embodiment of the invention through utilizing main body block, probe and winding to engage (TAB) integrated circuit (IC) automatically, wherein winding engages (TAB) integrated circuit (IC) automatically and is installed in same as before on the panel to be tested and need not oriented film.
In addition, because the probe lead that is formed on the TAB IC directly contacts with the lead-in wire of panel, so avoided the appearance of scratch and friction particles, lead-in wire that can counter plate causes any damage thus.Be installed in the TAB IC on the panel through utilization, making becomes possibility corresponding to any panel pattern or pitch.
In addition, owing in sniffer, do not need main body block, therefore can reduce the cost of sniffer.
Brief Description Of Drawings
Fig. 1 shows the top view of the display with common film encapsulation;
Fig. 2 shows the amplification vertical view of part shown in Figure 1 130;
Fig. 3 shows the front elevation of part shown in Figure 2 130;
Fig. 4 shows the conceptual view of the structure of common sniffer, and wherein sniffer is used to test panel shown in Figure 1;
Fig. 5 shows the instance constructs view of sniffer shown in Figure 4;
Fig. 6 shows the conceptual view of sniffer structure according to an embodiment of the invention;
Fig. 7 shows the actual configuration view of sniffer shown in Figure 6;
Fig. 8 shows the view of the method for test panel in common sniffer;
Fig. 9 shows the view of the method for test panel in sniffer according to an embodiment of the invention;
Figure 10 shows the conceptual view of the structure of transmission control protocol shown in Figure 9 (TCP) piece;
Figure 11 shows another instance constructs view of TCP piece according to an embodiment of the invention;
Figure 12 shows the exploded perspective view of TCP piece according to another embodiment of the present invention;
Figure 13 shows the side view of TCP piece shown in Figure 12;
Figure 14 shows another instance side view of jack shown in Figure 13;
Figure 15 shows the enlarged drawing of the lead-in wire of panel to be tested;
Figure 16 shows the conceptual view that probe lead is connected to the situation of panel lead-in wire;
Figure 17 shows the view that the voltage that will have varying level each other is applied to the situation between the lead-in wire that is connected by particulate shown in Figure 16;
Figure 18 shows the view that the winding that is connected to flexible printed circuit board (FPCB) engages (TAB) integrated circuit (IC) automatically;
Figure 19 shows the conceptual view of the sniffer that is connected to panel according to an embodiment of the invention;
Figure 20 shows the conceptual view of the function of isolating switch;
Figure 21 shows the view of TAB IC;
Figure 22 shows the view of TAB IC, and wherein the part of TAB IC is replaced by the metal decking material;
Figure 23 shows the view of the TAB IC with probe lead, and wherein the end of probe lead has the remodeling surface; And
Figure 24 shows the actual product photo of the TAB IC of Figure 23.
Realize the optimal mode of invention
In order to make much of service advantages of the present invention and the purpose that obtains through embodiments of the invention, need with reference to showing the accompanying drawing of the preferred embodiment of the present invention and the content shown in the accompanying drawing.Hereinafter will describe the preferred embodiments of the present invention in detail with reference to accompanying drawing.Same Reference numeral shown in each accompanying drawing is represented components identical.
Fig. 6 shows the conceptual view of the structure of sniffer 500 according to an embodiment of the invention.
Fig. 7 shows the actual configuration view of the sniffer 500 among Fig. 6.
With reference to Fig. 6 and Fig. 7, the sniffer 500 that is used for test panel 110 comprises transmission control protocol (TCP) piece TCP and flexible printed circuit board (PCB) FPCB.
TCP piece TCP is installed on the bottom of executor MP; Wherein executor MP is installed in the end of probe base PB; In TCP piece TCP; Form the probe lead PRLD that has same pitch with the corresponding lead-in wire LD of panel 110, and probe lead PRLD contacts in order to test panel 110 with the lead-in wire LD of panel 110.The side of flexible PCB FPCB is electrically connected to the rear end of TCP piece TCP, and its opposite side is connected to POGO piece POGO, in order to via TCP piece TCP to panel transmitted test signal (not shown).
Particularly, be different from common sniffer 400, in sniffer 500, do not have the main body block B that comprises probe NDL shown in Figure 4.In addition, the oriented film GF that does not also have transmission control protocol shown in Figure 4 (TCP) piece TCP.
That is to say; Main body block B and oriented film GF are removed; Encapsulate the winding that is used for panel 110 as film and engage the bottom that (TAB) integrated circuit (IC) is attached to the TCP piece automatically, and the probe lead PRLD among the TAB IC is used for directly contacting with the lead-in wire LD of panel 110.Feasible thus the contact with lead-in wire LD according to the original pitch between the lead-in wire LD of panel becomes possibility.
The TCP piece TCP of Fig. 6 is formed by main body block BB and TAB IC TIC.
Correspondingly, the shape of TCP piece TCP is confirmed by main body block BB and TAB IC TIC.Main body block BB is installed on the bottom of executor MP.TAB IC TIC around main body block towards the edge of panel 110 and the bottom of main body block BB, in TAB IC TIC, be formed with the lead-in wire LD of panel 110 and directly contact probe lead PRLD in order to test panel 110.
Above-mentioned TAB IC is the TAB IC that is installed on the panel 110 to be tested.That is to say that the TAB IC that is used for panel 110 contacts with the main body block BB of sniffer to be used same as before.As described with reference to Fig. 1, because TAB IC TIC is installed on the panel 110 and with the lead-in wire LD of panel 110 and directly contacts, so TAB IC TIC comprises the lead-in wire that has same pitch with the lead-in wire LD of panel 110, is called probe lead PRLD.Correspondingly, be similar to the lead-in wire LD of panel 110, probe lead PRLD is the long fine rule with definite surface area.The surface will take place with the lead-in wire LD of panel 110 to be tested and contact in probe lead PRLD.Because surface contact, scratch and the appearance of friction particles on the lead-in wire LD of panel 110 have been avoided.
In this case, definite surface area of probe lead PRLD is represented the identical surface area of surface area with the corresponding lead-in wire LD of panel 110.
Fig. 8 shows the view of the method for test panel in common sniffer 400.
Fig. 9 shows the view of the method for test panel in sniffer 500 according to an embodiment of the invention.
With reference to Fig. 8; Under the situation of common sniffer 400; The cost of main body block B and probe NDL occupies very big proportion, and exists such as because the tip of probe NDL causes on the lead-in wire LD of panel 110, occurring scraping or because scraping causes the problem the particle.
In addition, because the pitch between the quantity of lead-in wire LD and the lead-in wire LD depends on the kind of panel 110,, should make and aim at the independent probe NDL of sniffer 400 separately therefore for each panel to be tested.Along with the space between the lead-in wire of panel 110 narrows down, be difficult to itself and probe NDL are mated.
Correspondingly, in sniffer 500, main body block B and probe NDL are removed; In addition, the oriented film GF that in the TCP piece, uses is removed.And as shown in Figure 9, the TAB IC TIC that is used for panel 110 is attached to a bottom and the side of main body block BB, and the probe lead PRLD of TAB IC TIC is exposed in order to directly to contact with the lead-in wire LD of panel 110.
Can under the situation that need not main body block B and probe NDL, contact with the lead-in wire LD of panel according to original pitch.
In main body block BB; Non-conductive bolster 510 is attached to bottom and the edge between a side of panel 110; And TAB IC TIC is as follows around its outside: when the probe lead PRLD of TAB IC TIC contacts with the lead-in wire LD of panel 110, to TAB IC TIC elastic force is provided.
Bolster 510 is formed by one of them of rubber and silicone.In addition, the non-conductive product such as plastic resin also can be used as bolster 510.Do not having under the situation of bolster, TAB IC TIC can contact with the edge of main body block BB is perfect.
Figure 10 shows the conceptual view of the structure of the TCP piece among Fig. 9.
TAB IC TIC comprises ground floor L1, the second layer and is formed on the probe lead PRLD between the ground floor L1 and the second layer.With part that the lead-in wire LD of panel 110 contacts in, ground floor L1 contacts and is mounted with main body block BB, the second layer is removed to expose probe lead PRLD.Usually, ground floor L1 is formed by polyimide, and the second layer is formed by welding resistor.
Figure 11 shows another instance constructs view of TCP piece according to an embodiment of the invention.
TCP piece TCP comprises TAB IC TIC, and wherein the bottom of the main body block BB of TAB IC TIC on the bottom that is installed in executor MP contacts with main body block BB.In TAB IC TIC, the end of probe lead PRLD is rounded, and forms probe lead PRLD as follows: with to probe lead PRLD elastic force is provided when the lead-in wire LD of panel 110 contacts.The end of TAB IC TIC is outstanding towards the outside towards the edge of panel 110 of main body block BB.Because the end is outwards outstanding, when the probe lead PRLD of TAB IC TIC contacted with panel 110, the user can aim at TAB IC TIC.
In TAB IC TIC, non-conductive bolster 510 is inserted in the inner space that forms circular end, and non-conductive bolster 510 can be rubber and silicone one of them.
The side of TAB IC TIC contacts with main body block BB, and its end reeled with rounded, forms TCP piece TCP shown in Figure 11 thus.In structure shown in Figure 11, TAB IC TIC comprise non-conductive layer L1, second layer L2 and be formed on ground floor L1 and second layer L2 between probe lead PRLD.With part that the lead-in wire LD of panel 110 contacts in, second layer L2 is removed, only probe lead PRLD is exposed.
With part that the lead-in wire LD of panel 1110 contacts in, ground floor L1 and second layer L2 can be removed, only probe lead PRLD can be exposed.
Figure 12 shows the decomposition diagram of the structure of TCP piece TCP according to another embodiment of the present invention.
Figure 13 shows the side view of TCP piece TCP shown in Figure 12.
With reference to Figure 12 and Figure 13, the sniffer that is used for test panel according to another embodiment of the present invention comprises TCP piece TCP and flexible PCB FPCB.TCP piece TCP among Figure 12 and Figure 13 is installed on the bottom of executor (not shown).Figure 12 and Figure 13 separately show the TCP piece TCP of whole structure of the sniffer 500 of Fig. 7.
The TAB IC that is used for corresponding panel 110 is installed in TCP piece TCP, and contacts with the lead-in wire LD of panel 11, and test panel 110 thus.Flexible PCB FPCB is electrically connected to the TABIC TIC of TCP piece TCP, and via TCP piece TCP to panel 110 transmitted test signals.Flexible PCB directly contacts with TAB IC TIC, and the lead-in wire (not shown) that is formed on the flexible PCB FPCB contacts with probe lead (not shown) on being formed on TAB IC TIC one to one.
That is to say; The sniffer that is installed in according to another embodiment of the present invention on the probe base (not shown) has following structure: in this structure; The existing main body block that pin shape probe is installed and is installed on the executor (not shown) is removed; And the TAB IC identical with the TAB IC that is used for panel to be tested is installed in the bottom of main body block, with as the probe that will be one to one directly contacts with the lead-in wire LD of panel 110.
In this case, TAB IC TIC is installed on the bottom BBM of main body block BB through bonding agent, and constitutes single main body with main body block BB need not to utilize under the situation of another structure.
TCP piece TCP comprises the TAB IC TIC that is installed on the main body block BB (main body block BB is installed on the bottom of executor) and the bottom of main body block BB, in TAB IC TIC, is formed with the probe lead that directly contacts one to one with the lead-in wire LD of panel 110.Although the probe lead of not shown TABIC TIC in Figure 12 and Figure 13, the probe lead of TAB IC TIC is identical with shown in Fig. 9 those.In TABIC TIC, except probe lead, form driver IC 830 in the central.
On main body block BB, like Figure 12 and shown in Figure 13, on the top, form the screw 850 that can fit together with executor, and can form hole 840 at the rear portion of main body block, in hole 840, insert auxiliary element to reinforce the assembling with executor.
In addition, main body block BB is downward-sloping on the bottom of main body block BB BBM and direction that panel 110 contacts.The probe lead of this feasible TAB IC TIC that contacts with the bottom BBM of main body block BB can accurately contact with the lead-in wire LD of panel 110.
Like Figure 12 and shown in Figure 13, the bottom BBM of main body block BB is smooth, and TAB IC TIC directly adheres to flat bottom BBM, to constitute single main body with main body block BB.In a side relative, form driver IC 830 and probe lead with that side that adheres to main body block.
In addition, on main body block BB, with direction that panel 110 contacts on the end form insertion groove 820, wherein in insertion groove 820, insert buffer stopper 810.Buffer stopper 810 is compressed and is inserted in the insertion groove 820, and its end 825 is outstanding towards the outside of insertion groove 820.Buffer stopper 810 can be compressed and be inserted in the insertion groove 820.Yet as shown in figure 13, buffer stopper 810 also can be coupled by spiral through the coupling element (not shown) such as screw, wherein coupling element is inserted in the patchhole 910 that on the top of main body block BB, forms.In this case, should on buffer stopper 810, form the hole that allows coupling element to pass.
In addition, as shown in figure 14, can on the bottom of main body block BB, form patchhole 910, wherein in patchhole 910, insert the coupling element that is used for spiral coupling buffer stopper 810.
The outstanding end 825 of fining away as follows: make the bottom of buffer stopper 810 transverse to main body block BB towards the outside of insertion groove 820.Buffer stopper 810 more preferably, forms such as rubber, urethane, silicone and naval stores by having the definite hardness and the rubber-like material that can be molded by processed nonmetallic materials forming.Buffer stopper 810 support TAB IC TIC with the relative side of contact portion TAB IC TIC touch panel so that keep the flatness of TAB IC TIC, and when contact, cushion TAB IC TIC with panel 110.
As shown in figure 12, buffer stopper 810 is the square shape, and its length is equal to or greater than horizontal (promptly arranging the direction of probe lead) length of TAB IC TIC, and its end 825 is sharpened.Then, the tilting bottom BBM of main body block BB can be transverse to the end 825 of buffer stopper 810, makes contacting between TAB ICTIC and the bottom BBM become easy thus.
The angle that insertion groove 820 forms can be multiple.
TAB IC TIC is installed to be more outstanding than the end 825 of buffer stopper 810, so that easily aim at the corresponding lead-in wire LD of panel 110.
The length of the outshot outside the end that is projected into buffer stopper 810 825 of TAB IC can be about 0.01mm to 0.5mm.
The top of main body block 810 is bent, and with such inclination as shown in figure 13, this makes the end 825 of buffer stopper 810 can clearly be shown to the user who watches from the top.Because the end of TAB IC TIC is more outstanding than the end of buffer stopper 810, so the probe lead of TAB IC TIC can easily aim at the lead-in wire LD of panel, contacts so that carry out the surface one to one.
TAB IC TIC is adhered to and is fastened to the bottom BBM of main body block BB through bonding agent.Yet, except bonding agent, also can on TAB IC TIC, form screw, so that be fastened to main body block through screw.In addition, can the assisted fasteners (not shown) that be used for TAB IC TIC is fastened to the bottom BBM of main body block BB be installed in the outside of TAB IC TIC.
That is to say; Although it is not shown in Figure 12 and Figure 13; The additional assisted fasteners of installing in the outside of TAB IC TIC and flexible PCB FPCB; The TCP piece has been reinforced in the wherein assisted fasteners damage that can further TAB IC be compressed to the bottom BBM of main body block BB and avoid the exposure owing to the probe lead of TAB IC TIC and driver IC 830 to produce thus more.
On the BBM of the bottom of main body block BB, form elastic groove 920 towards the inner of insertion groove 820.As shown in figure 13, elastic groove 920 is formed on the bottom BBM of main body block BB, when TAB IC TIC contacts with panel 110, forms compression elasticity as leaf spring, and the feasible thus pressure from bottom BBM is passed to TAB IC TIC well.That is to say; When the end of TAB IC TIC with being pressed when lead-in wire LD contacts of panel 110 time; Because pressure makes the bottom BBM of main body block BB promoted by the free space of elastic groove 920 (empty space), thus pressure is passed to well TAB IC TIC.
As stated, through utilizing TCP piece (the TAB IC of panel 110 is installed) on the TCP piece, can be accurately and test panel 110 easily.
When TAB IC TIC adhered to the bottom BBM of main body block BB, as stated, the TAB IC that is used for panel 110 to be tested was used same as before.Yet in fact, be formed on the pitch between the lead-in wire LD that pitch between the lead-in wire on the TAB IC (TAB IC is installed on the panel 110) is narrower than panel 110, although the difference between them is very little.
Therefore, when use is installed in TAB IC on the panel 110 as the TAB IC TIC that is installed on the bottom BBM of main body block BB, should regulate the pitch between the probe lead that is formed on the TAB IC TIC.That is to say, in the present embodiment, the pitch that is installed between the probe lead of the TABIC TIC on the bottom BBM of main body block BB is increased a bit, so that identical with pitch between the lead-in wire LD of panel 110.
As the method for the pitch between a kind of probe lead that increases TAB IC TIC, the end of TAB IC TIC to be fixed, the pulling other end is to increase the pitch between the probe lead.Because the method for the pitch between the probe lead of increase TAB IC TIC is known for one of ordinary skill in the art, therefore will omit its detailed description.
The calcination that when the test display panel, takes place is a kind of like this phenomenon: wherein; Contact with panel 110 so that the moment of electric signal and electric power to be provided to panel 110 at sniffer; When carrying out the abnormal electrical connection between the lead-in wire that is applied in different voltages each other at panel 110; Excess current can be flowed through and had the lead-in wire of different potentials each other, and generation can cause the heat of the damage of the contact portion fusing between the lead-in wire LD of sniffer and panel 110 thus.
The generation of calcination not only all can bring harmful effect to sniffer but also counter plate 110, causes bigger production loss thus.
Figure 15 shows the enlarged drawing of the lead-in wire LD of panel 110, and Figure 16 shows the conceptual view of situation that probe lead PRLD on the bottom that is installed in main body block BB is connected to the lead-in wire LD of panel 110.In this case, some lead-in wire LD of panel 110 connect through particulate R.
Figure 17 shows the view of the electric pathway that forms when the voltage that will have different voltage levels each other via the probe lead PRLD1 of correspondence and PRLD2 is applied between the lead-in wire LD1 that connected by particulate R shown in Figure 16 and the LD2.The electric current that surpasses hundreds of milliampere (mA) flows on electric pathway.Usually, when the electric current that surpasses about 250mA flows, because heat can cause distortion to the film of the probe lead PRLD that supports TAB IC.In addition,, bigger electric current can produce calcination, the wherein contact site branch transient melting between the lead-in wire LD of probe lead PRLD and panel 110 when flowing.
Therefore, need avoid flowing of excess current.
In the present embodiment, flexible PCB FPCB directly contacts with the rear portion of TAB IC TIC, and comprises the flexible lead wire FLD that is electrically connected with the probe lead PRLD of TAB IC TIC.
Figure 18 shows the view that TAB IC contacts with flexible PCB FPCB.
In this case, in the present embodiment, forming isolating switch 1000 contingent calcination when avoiding on the flexible lead wire FLD at test panel 110.Through isolating switch 1000, can avoid because the overcurrent flows that the calcination phenomenon produces.
Figure 19 shows the conceptual view that sniffer is connected to panel 110.
Can find out that the flexible PCB FPCB with isolating switch 1000 is connected to TAB IC TIC, wherein TAB IC TIC adheres to the bottom BBM of main body block BB.
Especially, isolating switch 1000 can be formed by diode, and is formed on the flexible lead wire FLD with the mode that in flexible PCB FPCB, makes panel 110 be in forward.
Figure 20 shows the conceptual view of the function of isolating switch 1000.
In Figure 20, on the path of the lead-in wire LD that voltage is applied to panel 110, form isolating switch 1000 as diode.Particularly, as stated, a plurality of diode series connection are formed on the flexible lead wire FLD of flexible PCB FPCB.
Although, can avoid electric current to flow to the electronegative potential of 3V from the noble potential of 30V through diode because particulate R forms electric pathway between adjacent legs.Correspondingly, electronegative potential breaks off, and the voltage of 30V is applied to the lead-in wire that is connected by particulate R.In this case, do not have excess current and flow in the panel 110, the total current of in panel 110, measuring does not have big increase yet, has avoided thus because the calcination that excess current causes.
According to one embodiment of present invention, consider the special device that is not provided for avoiding the calcination phenomenon that possibly when test panel 110, always take place, can significantly improve the throughput rate of panel 110.
Although having described the position of isolating switch 1000 in the present embodiment is on flexible PCB FPCB, isolating switch 1000 also can be formed on the driver module M.In this case, be not the driver module M that in panel 110, uses, but need to make other driver module.The attachment location of isolating switch 1000 can change along with the easy degree of producing.
Sniffer comprises main body block BB and flexible PCB FPCB according to another embodiment of the present invention.
On main body block, install and be used in the TAB IC of panel 110, main body block contacts with the lead-in wire LD of panel 110.With TAB IC TIC and panel 110 between the relative part of contact portion on, form buffer stopper 810, be used to keep in touch the flatness of part and elastic force be provided to contact portion.
Flexible PCB FPCB is electrically connected to the rear portion of TAB IC TIC, and via TAB IC TIC to panel 110 transmitted test signals.
In sniffer according to another embodiment of the present invention, the structure of main body block BB and flexible PCB FPCB such as Figure 12 are to shown in Figure 20.
Can directly contact with the bottom BBM of main body block BB at TAB ICTIC with test panel 110 when the lead-in wire LD direct surface of panel 110 contacts; And buffer stopper 810 is inserted among the main body block BB, and wherein buffer stopper 810 makes the probe lead PRLD of TAB IC TIC accurately contact one to one with the lead-in wire LD of panel 110 through the flatness that when TAB IC TIC contacts with panel 110, keeps in touch part.Buffer stopper 810 is outstanding towards the outside of the end of main body block BB, keeps the flatness of TAB IC TIC, and to it elastic force is provided.
The end of TAB IC TIC is more outstanding than the end of buffer stopper, so as with panel 110 be easy to aligning when lead-in wire LD contact.
Because the top material quality of describing buffer stopper 810 is formed on the adjusting of the pitch between the probe lead PRLD on the TAB IC TIC, is used to avoid the structure of calcination, therefore will omit its detailed description.
When test panel 110, on the contact portion (being the end of the probe lead PRLDD of TAB IC TIC) that possibly contact with the probe lead PRLD of TAB IC TIC at the lead-in wire LD of panel 110 blackening phenomena appears.Because blackening phenomena, increased the contact resistance of the end of probe lead PRLD, voltage stably can not passed to panel 110, thereby cause coarse test.
The blackening phenomena that frequently appears on the contact portion occurs on high-tension those probe leads PRLD of being applied in of TAB IC TIC.That is to say, flowing, thereby changed the metal quality of the contact portion of probe lead PRLD with big electric current when the lead-in wire LD of panel 110 contacts is instantaneous.
Usually, the probe lead PRLD of TAB IC TIC has the structure that comprises copper pattern and carried out surface working with tin.Surface working with tin carries out has avoided copper to be etched, and when driver IC 830 being adhered to the film of TAB IC, has utilized the welding characteristic of tin under relatively lower temp.Yet, using for these reasons under the situation of tin, blackening phenomena can not occur on the little probe lead of the electric current of flowing through, but in the bigger probe lead of the electric current that big electric current can instantaneous inflow be flowed through, thereby produce blackening phenomena.
Figure 21 shows the view of TAB IC TIC.
Probe lead PRLD is divided into two groups.One group comprises the probe lead PRLDa that does not directly contact with the lead-in wire LD of panel 110 via driver IC 830, and another group comprises the probe lead PRLDb that is connected to the lead-in wire LD of panel 110 via driver IC 830.
Probe lead PRLDa provides required electric signal and electric power in the door IC (not shown) of panel 110 usually.The door IC of panel 110 is formed on the both sides of panel 110.The probe lead PRLDa of TAB IC TIC does not provide electric signal and electric power via driver IC 830 to door IC.
Because the voltage that door uses among the IC is higher than the voltage that is applied to panel, therefore the lead-in wire LD of panel 110 with the abnormal ignition phenomenon can take place on contact point when probe lead PRLDa contacts, thereby blackening phenomena takes place on tin surfaces.
Correspondingly, avoid blackening phenomena very important.As a kind of method of avoiding blackening phenomena; Among the probe lead PRLD that is formed on the TAB IC TIC (TAB IC TIC is installed on the bottom of main body block BB); Use has the probe lead PTN (with reference to Figure 22) that the sheet metal 1200 of equal length forms through etching and TAB IC TIC, as the probe lead PRLDa that does not directly contact with the lead-in wire LD of panel 110 via the driver IC 830 of TAB IC TIC.
In this case, not to be used for the probe lead of electric signal being provided with the probe lead PRLDa that the lead-in wire LD of panel 110 directly contacts to the door IC of panel 110 via the driver IC 830 of TAB IC TIC.
That is to say, be used for that the probe lead of electric signal is provided is the line of electric force that high-voltage signal is flowed through to the door IC of panel 110, wherein since with part that the lead-in wire LD of panel 110 contacts on spark blackening phenomena possibly take place.For fear of above-mentioned phenomenon, as the corresponding probe lead of TAB IC TIC, the probe lead PTN that forms through etching metal plate 1200 is thin and interchangeable.
Replace the part of the probe lead PRLDa among Figure 21, as shown in figure 22, sheet metal 1200 contacts with the film of TAB IC TIC, and in sheet metal 1200, the probe lead PTN that forms through etching is patterned.Sheet metal 1200 is the etched thin plates such as nickel beryllium and beryllium copper of ability, through the film of adhesive bond to TAB IC TIC.
On sheet metal 1200, be formed for providing the probe lead PTN of electric signal through etching to the door IC of panel 110.
Different with Figure 22; As shown in figure 23; Can be utilized in the stable high conductivity material in thermal oxide aspect surface working is carried out in the end 1210 that is formed on the probe lead PRLD on the TAB IC TIC (TAB IC TIC is installed on the bottom of main body block BB); With the blackening phenomena of avoiding causing owing to the high voltage that when contacting with the lead-in wire LD of panel 110, produces, its medial end portions 1210 is used for contacting with panel 110.
That is to say, after the tin of the end 1210 of removing probe lead PRLD, form the stable metal layer.As be used for surface working in high conductivity material stable aspect the thermal oxide, can use to have high conductivity and not oxidized material such as gold and nickel.Although show gold and nickel as an example, one of ordinary skill in the art can be very clear, can use other material of aspect thermal oxide, stablizing and having high conductivity.
So, the tin in the end 1210 of probe lead PRLD is removed, and through utilizing the metal such as gold and nickel to form a layer from the teeth outwards, has avoided thus on the contact portion of probe lead PRLD, blackening phenomena taking place.
As shown in figure 23; Except through utilizing the metal such as gold and nickel to form the above-mentioned layer, can carry out surface working to the whole probe lead-in wire PRLD that is formed on the TAB IC TIC (TAB IC TIC is installed on the bottom of main body block BB) through utilizing the stable metal material such as gold and nickel in the end 1210 of probe lead PRLD.
Figure 24 shows the actual product photo of the TAB IC TIC that the sheet metal 1200 that utilizes Figure 22 obtains.The photo of Figure 24 is to take from the below of the main body block BB of sniffer, and wherein the sheet metal 1200 that fits together with the film of TAB ICTIC is positioned at the right side of said film, and probe lead PTN is formed on the sheet metal 1200 through etching.Flexible PCB FPCB is connected to the rear portion of TAB IC TIC.
In addition; Among the probe lead PRLD that is formed on the TAB IC TIC (TAB IC TIC is installed on the bottom of main body block BB), can not be formed the form of razor sharpened with the probe lead PRLDa that the lead-in wire LD of panel 110 directly contacts via the driver IC 830 of TAB IC TIC.
When utilizing blade to make the high-voltage signal line, utilize the material behavior of blade can reduce the generation of the calcination that causes by impurity and avoid blackening phenomena.
As stated, a plurality of one exemplary embodiment have been illustrated and have described.Although used concrete term here, these terms only are used for describing the present invention, and are not used for limiting disclosed implication of the present invention and scope in claims.Therefore, one of ordinary skill in the art should recognize, under the situation that does not break away from principle of the present invention and spirit, can change these embodiments.Therefore, technical scope of the present invention is limited claims and equivalent thereof.

Claims (17)

1. sniffer that is used for test panel, said sniffer comprises:
Transmission control protocol (TCP) piece; Be installed on the bottom of executor; Said executor is installed in the end of probe base; In said TCP piece; Be formed with the probe lead that has same pitch with the corresponding lead-in wire of said panel, said probe lead contacts and tests said panel with the lead-in wire of said panel; And
Flexible printed circuit board (FPCB), be electrically connected to the rear end of said TCP piece and via said TCP piece to said panel transmitted test signal.
2. sniffer as claimed in claim 1, wherein said TCP piece comprises:
Main body block is installed on the bottom of said executor; And
Winding engages (TAB) integrated circuit (IC) automatically; Automatically engage in (TAB) integrated circuit (IC) in said winding; Be formed with said probe lead; Said probe lead around said main body block, towards the edge of said panel and the bottom of said main body block, and with test said panel when the lead-in wire of said panel contacts.
3. sniffer as claimed in claim 2, wherein said TAB IC is identical with TAB IC on being installed in institute's test panel.
4. sniffer as claimed in claim 2; Wherein non-conductive bolster be attached to said main body block, towards the edge of said panel; And said TAB IC is as follows around its outside: when the probe lead of said TAB IC contacts with the lead-in wire of said panel; To said TAB IC elastic force is provided, wherein said bolster is formed by one of them of rubber and silicone.
5. sniffer as claimed in claim 1, wherein said TCP piece comprises:
Main body block is installed on the bottom of said executor; And
TAB IC; Contact with the bottom of said main body block; In said TAB IC, be formed with said probe lead; The end of said probe lead forms circle; When contacting with the lead-in wire of said panel, to said probe lead elastic force being provided, the end of said probe lead is towards said main body block, outstanding towards the outside at the edge of said panel.
6. sniffer as claimed in claim 5 wherein in said TAB IC, is inserted into non-conductive bolster in the inner space that forms circular end.
7. sniffer as claimed in claim 1, wherein said probe lead be have definite surface area, with the lead-in wire of said panel have identical shaped and pitch and contact with corresponding lead-in wire direct surface linear.
8. sniffer that is used for test panel, said sniffer comprises:
The TCP piece is installed on the bottom of executor, and the TAB IC that is used for said panel is installed on said TCP piece, and said TAB IC contacts and test said panel with the lead-in wire of said panel; And
FPCB is electrically connected to the TAB IC of said TCP piece, and via said TCP piece to said panel transmitted test signal.
9. sniffer as claimed in claim 8, wherein said TCP piece comprises:
Main body block is installed on the bottom of said executor; And
Be installed in the said TAB IC on the bottom of said main body block, in said TAB IC, be formed with the probe lead that directly contacts one to one with the lead-in wire of said panel.
10. sniffer as claimed in claim 9; Wherein in said main body block, its bottom tilts in the direction that contact with said panel, wherein said main body block, with direction that said panel contacts on end formation insertion groove; Buffer stopper is inserted in the said insertion groove, and
Wherein said buffer stopper is inserted in the said insertion groove, and its end is outstanding towards the outside of said insertion groove.
11. sniffer as claimed in claim 10, wherein said buffer stopper is by processed nonmetallic materials forming, and end said buffer stopper, that give prominence to towards the outside of said insertion groove is sharpened with the bottom transverse to said main body block.
12. sniffer as claimed in claim 10, wherein said TAB IC are installed to be more outstanding than the end of said buffer stopper, to be easy to the corresponding lead-in wire aligning with said panel.
13. sniffer as claimed in claim 10 wherein on the bottom of said main body block, is formed with elastic groove on the interior extreme direction of said insertion groove, and said elastic groove said TAB IC with compression elasticity is provided when said panel contacts.
14. sniffer as claimed in claim 9, wherein said TAB IC adhere to and are fastened to the bottom of said main body block through bonding agent, and
Wherein at the outside assisted fasteners of further installing of said TAB IC, the damage that said assisted fasteners is used to avoid the exposure owing to said TAB IC to produce, and be used for said TAB IC is fastened to the bottom of said main body block.
15. sniffer as claimed in claim 9, wherein the pitch that is adjusted between the lead-in wire with said panel in the pitch between the probe lead that forms on the TAB IC that is installed on the bottom of said main body block is identical.
16. sniffer as claimed in claim 9, wherein said FPCB comprises flexible lead wire, and said flexible lead wire and the rear surface of said TAB IC directly contact and be electrically connected to the probe lead of said TAB IC, and
Wherein on said flexible lead wire, form isolating switch, said isolating switch is used to avoid contingent calcination when the said panel of test.
17. sniffer as claimed in claim 16, wherein said isolating switch is a diode, and said isolating switch is formed on the said flexible lead wire with the mode that in said FPCB, makes said panel be in forward.
CN2010800114318A 2009-03-10 2010-03-05 Probe unit for testing panel Pending CN102348990A (en)

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PCT/KR2010/001399 WO2010104289A2 (en) 2009-03-10 2010-03-05 Probe unit for testing panel

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WO2010104303A2 (en) 2010-09-16
KR100972049B1 (en) 2010-07-22
WO2010104289A2 (en) 2010-09-16
TWI482972B (en) 2015-05-01
CN102348991B (en) 2014-05-07
TW201100810A (en) 2011-01-01
JP2012519867A (en) 2012-08-30
CN102348991A (en) 2012-02-08
JP2012519868A (en) 2012-08-30
TW201037321A (en) 2010-10-16
JP5746060B2 (en) 2015-07-08
WO2010104289A3 (en) 2011-01-06
WO2010104303A3 (en) 2011-01-06

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Application publication date: 20120208