JP5746060B2 - Probe unit for panel testing - Google Patents

Description

  The present invention relates to a probe unit, and more particularly to a probe unit having an improved structure for testing a panel such as an LCD or PDP.

 FIG. 1 is a plan view showing a display device having a general film type package.

  Referring to FIG. 1, the display device includes a printed circuit board 100, a tab IC (TAB IC) 120, and a panel 110. Various components such as a control unit (not shown) and a drive voltage generation unit (not shown) are mounted on the printed circuit board 100. The control unit on the printed circuit board 100 outputs a control signal, and the drive voltage generation unit outputs voltages necessary for the operation of the display device, such as a power supply voltage, a gate-on voltage, and a gate-off voltage.

  The upper bonding pad 121 of the tab IC 120 on which the driving integrated circuit 125 is mounted is electrically connected to a bonding pad (not shown) of the printed circuit board 100. In addition, the lower bonding pad 123 of the tab IC 120 is electrically connected to the panel 110. The tab IC 120 and the printed circuit board 100 or the panel 110 are in mutual contact by an anisotropic conductive film.

  The driving integrated circuit 125 of the tab IC 120 can drive and test the panel 110.

FIG. 2 is an enlarged plan view of the portion 130 in FIG.
FIG. 3 is a front view of FIG. 2 viewed from the front.

  2 and 3, the film of the tab IC 120 includes a lead PLD formed between the first layer L1 and the second layer L2, and between the first layer L1 and the second layer L2. Usually, the first layer L1 is formed of polyimide, and the second layer L2 is formed of a solder resistor.

  As can be seen from FIG. 3, the lead wires PLD of the tab IC 120 are in one-to-one contact with the lead wires LD formed on the panel 110 and transmit electrical signals to the panel 110.

FIG. 4 is a conceptual diagram illustrating the structure of an existing probe unit for testing the panel of FIG.
FIG. 5 is a diagram showing an actual structure of the conceptual diagram of FIG.

While the performance of the panel 110 is improved, the interval (pitch) between the lead wires LD of the panel 110 is very narrow, and the existing probe unit 400 has a structure as shown in FIG. Use.
That is, the TCP block (TCP) is connected to the socket S of the module M of the probe unit 400 by the flexible circuit board FPCB, and the body block B including the probe NDL is positioned between the TCP block (TCP) and the panel 110. The module M is attached with a control chip TCON.

The same tab IC as the tab IC 120 mounted on the panel 110 is mounted on the lower surface of the TCP block (TCP).
A guide film GF is attached to the front end of the tab IC 120, and the probe NDL directly contacts the front end of the tab IC 120.

  The body block B is equipped with a probe NDL. The probe NDL is in contact with the lead wire LD of the panel 110, and the tip on one side is the length of the guide film GF of the TCP block (TCP) on the other side. It directly contacts the lead wire of the tab IC 120 (for fixing the position) through the hole. The panel 110 can be tested through the driving integrated circuit 125 of the tab IC 120.

  FIG. 5 shows the actual structure of FIG. 4, and a TCP block (TCP) and a body block B are attached to the lower end of the manipulator MP attached to the edge of the probe base PB of the probe unit 400. The flexible circuit board FPCB is electrically connected to the tab IC 120 mounted on the lower surface of the TCP block (TCP). The flexible circuit board FPCB is coupled to the pogo block POGO and electrically connected to the module M.

  However, as can be seen from FIGS. 4 and 5, since the tip of the probe NDL mounted on the body block B and the lead wire LD of the panel 110 are in direct contact, the lead wire LD of the panel 110 is sharpened to the sharp tip of the probe NDL. Causes scratches. The scratch causes a problem in the lead wire LD itself, and the fine section of the lead wire LD generated by the scratch is connected to the adjacent lead wire LD, so that the lead wires are electrically connected to each other to cause a defect. There are problems that occur.

  Further, the pitch of the lead wires LD of the panel is gradually miniaturized, and it becomes increasingly difficult to manufacture a probe block for testing the panel.

  Further, a probe NDL having the same pitch as the lead wire LD of the panel 110 must be attached to the body block B. When the panel 110 is changed to the body block B having such a probe NDL, There is a problem that the cost for testing increases because it must be newly created and changed.

  The technical problem to be solved by the present invention is that a tab IC used for a panel to be tested is mounted on the bottom surface of the body block, the panel is easily tested, and the alignment with the panel is accurately aligned, It is another object of the present invention to provide a probe unit having a structure capable of preventing burnt.

  A probe unit for a panel test according to an embodiment of the present invention for achieving the technical problem includes a body block and a flexible circuit board.

  In the body block, a tab IC used for the panel is attached to the bottom surface and contacts a lead wire of the panel, and the contact portion is flat on the opposite side of the tab IC and the contact portion of the panel. A buffer block is formed that holds and provides elasticity to the contact site.

  A flexible circuit board is electrically connected to the rear surface of the tab IC, and transmits a test signal to the panel through the tab IC.

  The body block has a bottom surface that is inclined downward toward the contact direction with the panel and is flat, and an insertion groove into which the buffer block is inserted is formed at a tip portion in a direction in contact with the panel. The buffer block is inserted into the insertion groove, and the tip protrudes outside the insertion groove.

  The buffer block is made of a non-metallic material that is machined so that the tip projecting outside the insertion groove is pointed, is level with the bottom surface of the body block, and can be machined.

  The tab IC protrudes outward from the tip of the buffer block so as to facilitate alignment with the corresponding lead wire of the panel. The probe lead wires formed on the tab IC mounted on the bottom surface of the body block correct the interval between the probe lead wires so as to coincide with the interval between the lead wires of the panel.

  An elastic groove is formed on the bottom surface of the body block toward the inner end of the insertion groove, and compressive elasticity is generated when the tab IC contacts the panel.

  The tab IC is bonded and fixed to the bottom surface of the body block with an adhesive, prevents damage due to exposure of the tab IC, and an auxiliary fixing portion that fixes the tab IC to the bottom surface of the body block is provided on the tab IC. It is further mounted on the outside.

  The flexible circuit board includes a flexible lead wire that is in direct contact with the rear surface of the tab IC and is electrically connected to a probe lead wire of the tab IC, and prevents current that may occur during the panel test. A breaker is formed on the flexible lead. The current interrupting device is a diode, and is formed on the flexible lead so that the panel direction is a forward direction on the flexible circuit board.

  Of the probe lead wires formed on the tab IC mounted on the bottom surface of the body block, the probe lead wire that directly contacts the lead wire of the panel without passing through the driver IC of the tab IC is a metal plate. A probe lead wire formed by etching is used.

  The probe lead wire that directly contacts the lead wire of the panel without passing through the driver IC of the tab IC is a probe lead wire for supplying an electric signal to the gate IC of the panel.

  A tip portion for contacting the panel among probe lead wires formed on the tab IC mounted on the bottom surface of the body block has a black dyeing phenomenon caused by a high voltage generated at the time of contact with the lead wire of the panel. In order to prevent this, it is surface-treated with a highly conductive material that is stable against thermal oxidation.

  The probe lead wire formed on the tab IC mounted on the bottom surface of the body block has a high conductivity stable against thermal oxidation in order to prevent blackening due to high voltage generated when contacting the lead wire of the panel. Surface treatment with sex material. The highly conductive material stable to the thermal oxidation for the surface treatment is gold (Au) or nickel (Ni).

  Of the probe lead wires formed on the tab IC mounted on the bottom surface of the body block, the probe lead wire that directly contacts the lead wire of the panel without passing through the driver IC of the tab IC is a blade chip (blade chip). tip) type.

  The probe unit according to the present invention can test the panel easily and accurately by using the tab IC attached to the panel to be tested as it is without the body block, the probe and the guide film.

  In addition, since the probe lead wire formed on the tab IC is directly brought into contact with the lead wire of the panel (surface contact), there is no risk of damage to the lead wire of the panel, and the scrub mark and fineness on the lead wire Generation of a particle is prevented and a tab IC mounted on the panel is used, so that any panel pattern and pitch can be dealt with.

  In addition, since the probe unit does not require a body block, the cost of the probe unit can be reduced.

  In order to more fully understand the drawings cited in the detailed description of the invention, a brief description of each drawing is provided.

It is a top view which shows the display apparatus which has a general film type package. It is the top view which expanded and looked at 130 part of FIG. It is the front view which looked at FIG. 2 from the front. It is a conceptual diagram explaining the structure of the existing probe unit which tests the panel of FIG. It is a figure which shows the actual structure of the conceptual diagram of FIG. It is a conceptual diagram explaining the structure of the probe unit by embodiment of this invention. It is a figure explaining the actual structure of FIG. It is a figure explaining the panel test system in the existing probe unit. It is a figure explaining the panel test system in the probe unit by embodiment of this invention. It is a conceptual diagram explaining the structure of the TCP block of FIG. It is a figure explaining the other structure of the TCP block by embodiment of this invention. It is a disassembled perspective view explaining the other structure of the TCP block by other embodiment of this invention. It is a side view of the TCP block of FIG. FIG. 13 is a side view according to another embodiment of the TCP block of FIG. 12. It is a figure which expands and shows the lead wire of the panel to be tested. It is the figure which showed notionally the case where a probe lead wire is connected with the lead wire of the panel. FIG. 17 is a diagram illustrating a case where voltages having different voltage levels are applied between lead wires connected by fine particles as in FIG. 16. It is a figure explaining the shape where a tab IC and a flexible circuit board contact. It is a conceptual diagram explaining the shape by which the probe unit by embodiment of this invention is connected with a panel. It is a conceptual diagram explaining the function of an electric current interruption apparatus. It is the figure which showed tab IC. It is the figure which replaced a part of tab IC with the metal plate material. It is a figure which shows the shape which modify | reformed the surface of the front-end | tip part of the probe lead wire of tab IC. It is the photograph which produced drawing of FIG. 22 with the actual product.

  For a full understanding of the invention and its operational advantages for accomplishing the foregoing technical problems, and the objects achieved by the practice of the invention, the accompanying drawings illustrating preferred embodiments of the invention and Reference should be made to the contents described in the drawings.

  Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Like reference numerals in the drawings denote like members.

FIG. 6 is a conceptual diagram illustrating the structure of a probe unit according to an embodiment of the present invention.
FIG. 7 is a diagram for explaining the actual structure of FIG.

  6 and 7, a probe unit 500 for panel test according to an embodiment of the present invention includes a TCP block (TCP) and a flexible circuit board FPCB.

  The TCP block (TCP) is attached to the bottom surface of the manipulator MP attached to the tip of the probe base PB, and the probe lead wire PRLD having the same pitch as the lead wire LD of the corresponding panel 110 is formed. Panel 110 is tested in contact with line LD. The flexible circuit board FPCB has one side electrically connected to the rear end of the TCP block (TCP) and the other side connected to the pogo block POGO, and transmits a test signal (not shown) to the panel 110 through the TCP block (TCP). To do.

  Specifically, unlike the conventional probe unit 400, the probe unit 500 according to the embodiment of the present invention does not include the body block B including the probe NDL of FIG. Further, the guide film GF of the TCP block (TCP) in FIG. 4 does not exist.

  That is, the body block B and the guide film GF are removed, a tab IC (film type package) used for the panel 110 is attached to the bottom surface of the TCP block (TCP), and the lead wire (probe lead wire PRLD) inside the tab IC is attached. ) To directly contact the lead wire LD of the panel 110 as it is. Therefore, it is possible to make contact with the pitch between the lead wires LD of the panel 110.

  The TCP block (TCP) in FIG. 6 includes a body block BB and a tab IC (TIC).

  Therefore, the shape of the TCP block (TCP) is determined by the body block BB and the tab IC (TIC). The body block BB is attached to the bottom surface of the manipulator MP. The tab IC (TIC) surrounds the panel side edge of the body block BB and the bottom surface of the body block BB, and directly contacts the lead wire LD of the panel 110 to form a probe lead wire PRLD for testing the panel 110. Is done.

  The tab IC (TAB IC) is a tab IC mounted on the panel 110 to be tested. That is, the tab IC used for the panel 110 to be tested is used by directly contacting the body block BB of the probe unit. As described with reference to FIG. 1, the tab IC (TIC) is mounted on the panel 110 and directly contacts the lead wires LD of the panel 110. Therefore, the tab IC (TIC) includes lead wires having the same pitch as the lead wires LD of the panel 110. Order the lead wire as the probe lead wire PRLD. Therefore, the probe lead PRLD is a thin and long wire having a constant surface area, similar to the lead LD of the panel 110, and the probe lead PRLD makes surface contact with the lead LD of the panel 110 to be tested. . Since the surface contact is performed, the generation of scrub marks and fine sections in the lead wires LD of the panel 110 is prevented.

  Here, the constant surface area of the probe lead wire PRLD means the same surface area as the surface area of the lead wire LD of the corresponding panel 110.

FIG. 8 is a diagram for explaining a panel test method using an existing probe unit.
FIG. 9 is a diagram for explaining a panel test method in the probe unit according to the embodiment of the present invention.

  As shown in FIG. 8, in the existing probe unit 400, the body block B and the probe NDL occupy a large cost specific gravity, and the tip of the probe NDL is sharp and generates a scratch on the lead wire LD of the panel 110. There is a problem that fine sections are generated by scratching.

  Further, since the number of the lead wires LD and the pitch between the lead wires LD are different depending on the type of the panel 110, the probe NDL of the probe unit 400 is individually manufactured for each panel 110 to be tested. Therefore, as the distance between the lead wires LD of the panel 110 becomes gradually smaller, it is difficult to make the probe NDL correspond.

  Therefore, the probe unit 500 of the present invention removes the body block B and the probe NDL, and also removes the guide film GF used for the TCP block (TCP). Then, as shown in FIG. 9, the tab IC (TIC) used for the panel 110 is attached to the bottom surface and part of the lateral surface of the body block BB, and the lead wire (probe lead) of the tab IC (TIC). The line PRLD) is exposed and brought into direct contact with the lead wire LD of the panel 110.

  Then, the pitch of the lead wires LD of the panel 110 can be contacted as it is without using the body block B and the probe NDL.

  The body block BB has a non-conductive buffer 510 attached to an edge between a bottom surface and a lateral surface in the direction of the panel 110, and a tab IC (TIC) is surrounded by a tab IC (TIC) probe. When the lead wire PRLD contacts the lead wire LD of the panel 110, elasticity is generated in the tab IC (TIC).

  The buffer 510 is rubber or silicon. Alternatively, non-conductive products such as plastic resin products can also be used as the buffer 510. Alternatively, the tab IC (TIC) may be formed so as to completely contact the edge of the body block BB without a buffer.

  FIG. 10 is a conceptual diagram illustrating the structure of the TCP block of FIG.

  The tab IC (TIC) includes a non-conductive first layer L1 and a second layer, and a probe lead PRLD formed between the first layer L1 and the second layer. The first layer is attached in contact with the body block BB, and the second layer is removed to expose the probe lead PRLD. In general, the first layer L1 is made of polyimide, and the second layer is made of a solder register.

  FIG. 11 is a diagram illustrating another structure of a TCP block according to an embodiment of the present invention.

  The TCP block (TCP) is in contact with the body block BB attached to the bottom surface of the manipulator MP and the bottom surface of the body block BB, the probe lead wire PRLD is formed inside, and the tip is wound roundly to form the panel 110. A tab IC (TIC) for generating elasticity in the probe lead wire PRLD when contacting the lead wire LD is provided. The tip protrudes outside the edge of the body block BB on the panel side. By projecting to the outside, alignment can be made when the user brings the probe lead PRLD of the tab IC (TIC) into contact with the panel 110.

  In the tab IC (TIC), a non-conductive buffer agent 510 is inserted into an inner space of a tip formed by rolling it, and the buffer agent 510 may be rubber or silicon.

  One surface of the tab IC (TIC) is brought into contact with the body block BB, and the tip is rolled up to form a TCP block (TCP) as shown in FIG. In the structure of FIG. 11, the tab IC (TIC) is composed of a non-conductive first layer L1 and second layer L2, and a probe lead PRLD formed between the first layer L1 and the second layer L2. The contact portion of the panel 110 with the lead wire LD has a structure in which only the probe lead wire PRLD is exposed by removing the second layer L2.

  Alternatively, at the contact portion of the panel 110 with the lead wire LD, both the first layer L1 and the second layer L2 may be removed and only the probe lead wire PRLD may be exposed.

FIG. 12 is an exploded perspective view illustrating another structure of a TCP block according to another embodiment of the present invention.
FIG. 13 is a side view of the TCP block of FIG.

  Referring to FIGS. 12 and 13, a probe unit for panel testing according to another embodiment of the present invention includes a TCP block (TCP) and a flexible circuit board FPCB. The TCP block (TCP) shown in FIGS. 12 and 13 is attached to the bottom surface of a manipulator (not shown). 12 and 13 separately show only the TCP block (TCP) in the entire structure of the probe unit 500 of FIG.

  In the TCP block (TCP), a tab IC used for the corresponding panel 110 is mounted, and the panel 110 is tested by contacting the lead wire LD of the panel 110. The flexible circuit board FPCB is electrically connected to a tab IC (TIC) of a TCP block (TCP) and transmits a test signal to the panel 110 through the TCP block (TCP). The flexible circuit board FPCB is in direct contact with the tab IC (TIC), and a lead wire (not shown) formed on the flexible circuit board FPCB is a probe lead wire (not shown) formed on the tab IC (TIC). And one-to-one contact.

  That is, a probe unit according to another embodiment of the present invention mounted on a probe base (not shown) removes an existing body block on which a pin-shaped probe attached to a manipulator (not shown) is attached. The same tab IC as the tab IC used for the panel 110 to be tested is attached to the bottom surface of the body block so as to serve as a probe and directly contact the lead wire LD of the panel 110 in a one-to-one manner. .

  At this time, the tab IC (TIC) is attached to the bottom surface BBM of the body block BB by adhesion, and forms one body with the body block BB without using other structures.

  The TCP block (TCP) is attached to the bottom surface of the body block BB and the body block BB attached to the bottom surface of a manipulator (not shown) and directly contacts the lead wire LD of the panel 110 in a one-to-one manner (see FIG. A tab IC (TIC) on which is formed). 12 and 13 do not show the probe lead wire of the tab IC (TIC), but this is the same as that shown in FIG. In addition to the probe lead wire (not shown), a driver IC 830 for control is formed at the center of the tab IC (TIC).

  As shown in FIGS. 12 and 13, the body block BB has a screw hole 850 that can be coupled to a manipulator (not shown) on the top surface, and a manipulator (not shown) on the back side of the body block BB. A hole 840 is formed in which an auxiliary member for firmly connecting the head member is inserted.

  Further, the body block BB is inclined downward as the bottom surface BBM goes in the contact direction with the panel 110. This is because the probe lead wire (not shown) of the tab IC (TIC) that is in contact with the bottom surface BBM of the body block BB is surely brought into contact with the lead wire LD of the panel 110.

  The bottom surface of the body block BB is flat as shown in FIGS. 12 and 13, and a tab IC (TIC) is directly bonded to the flat bottom surface BBM so as to be integrated with the body block BB. A driver IC 830 and a probe lead wire (not shown) are formed on the surface opposite to the surface bonded to the surface.

  In addition, the body block BB has an insertion groove 820 into which the buffer block 810 is inserted at the distal end in the direction in contact with the panel 110. The buffer block 810 is inserted into the insertion groove 820, and the distal end is outside the insertion groove 820. Protrusively. The buffer block 810 can be inserted into the insertion groove 820, but as shown in FIG. 13, a coupling member (not shown, for example, an assembly screw) is inserted through an insertion hole 910 formed in the upper portion of the body block BB. Etc.). In this case, the buffer block 810 must be formed with a hole through which the coupling member can pass.

  Further, as shown in FIG. 14, it may be screwed by a coupling member (not shown) inserted through an insertion hole 910 formed in the lower part of the body block BB.

  The buffer block 810 is processed so that a tip 825 protruding outside the insertion groove 820 is pointed, and is level with the bottom surface of the body block BB. The buffer block 810 is made of a non-metallic material that can be processed. Desirably, the material is elastic, such as rubber, urethane, silicon, or a moldable resin product, although it is hard to some extent and can be molded. The buffer block 810 supports the opposite side of the contact portion of the tab IC (TIC) that contacts the panel 110 to maintain the flatness of the tab IC (TIC), and when the tab IC (TIC) contacts the panel 110, Performs a buffering action by elasticity.

  As shown in FIG. 12, the buffer block 810 has a rectangular block shape, and is the same as the length in the lateral direction of the tab IC (TIC) (direction 831 in which probe leads (not shown) are arranged). Alternatively, the tip 825 is processed to be sharp. Then, the inclined bottom surface BBM of the body block BB and the tip of the buffer block 810 can be made horizontal, and the tab IC (TIC) can be easily brought into contact with the bottom surface BBM of the body block BB.

  The formation angle of the insertion groove 820 is various.

  The tab IC (TIC) is provided to protrude outward from the tip of the buffer block 810 so as to facilitate alignment with the lead wire LD of the corresponding panel 110.

  The length of the tab IC (TIC) protruding from the tip of the buffer block 810 is preferably about 0.01 mm to 0.5 mm.

  As shown in FIG. 13, the upper surface of the body block BB is bent so as to be inclined. This is because the front end of the body block BB, that is, the front end 825 of the buffer block 810 is accurate when the user looks up from above. Since the tip of the tab IC (TIC) further protrudes from the tip 825 of the buffer block 810, the probe lead wire (not shown) of the tab IC (TIC) and the lead wire of the panel 110 Alignment for one-to-one surface contact with LD is facilitated.

  The tab IC (TIC) is bonded and fixed to the bottom surface BBM of the body block BB with an adhesive. However, besides the adhesive, a thread groove can be formed and fixed to the body block BB by screwing. In addition, an auxiliary fixing portion (not shown) for fixing the tab IC (TIC) to the bottom surface of the body block BB may be further mounted outside the tab IC (TIC).

  That is, although not shown in FIGS. 12 and 13, a tab IC (TIC) mounted on the bottom surface BBM of the body block BB and the tab IC on the outside of the flexible circuit board FPCB in the direction of the bottom surface BBM of the body block BB. Further, an auxiliary fixing portion (not shown) that can be pressed and fixed to prevent breakage due to exposure of the probe lead wire of the tab IC (TIC) and the driver IC 830 is further mounted, so that the TCP block (TCP ).

  An elastic groove 920 is formed on the bottom surface BBM of the body block BB toward the inner end of the insertion groove 820. As shown in FIG. 13, the elastic groove 920 is a groove formed on the bottom surface BBM of the body block BB. When the tab IC (TIC) contacts the panel 110, the elastic groove 920 functions as a leaf spring and compresses elastically. The bottom surface BBM of the body block BB transmits the tab IC (TIC) more effectively. That is, when the front end of the tab IC (TIC) is brought into contact with the lead wire LD of the panel 110 and pressed, the bottom surface of the body block BB is pushed by the empty space of the elastic groove 920 by the applied pressure, and the applied pressure is applied to the tab IC (TIC). ).

  In this manner, the panel can be accurately and easily tested by using the TCP block (TCP) on which the tab IC of the panel 110 to be tested is mounted.

  As described above, the tab IC used for the panel 110 to be tested is used as it is for the tab IC (TIC) bonded to the bottom surface of the body block BB. However, the interval between the lead wires formed on the tab IC mounted on the panel 110 is actually narrower than the interval between the lead wires of the panel 110, but is narrow.

  Accordingly, when the tab IC attached to the panel 110 to be tested is used as the tab IC (TIC) attached to the bottom surface BBM of the body block BB, the probe lead wire formed on the tab IC (TIC). The spacing between (not shown) must be corrected. That is, in the embodiment of the present invention, the tab IC (TIC) mounted on the bottom surface of the body block BB increases the interval between the probe lead wires little by little, and the interval between the lead wires LD of the panel 110 to be tested. To match.

  The method of increasing the interval between the probe lead wires of the tab IC (TIC) can fix the one side end of the tab IC and pull the one side end on the opposite side to increase the interval between the probe lead wires. A person skilled in the art can understand how to increase the distance between the probe leads of the tab IC (TIC), and thus will not be described in detail.

  The burnt generated during the inspection of the display panel is not applied between the lead wires of the panel 110 to which different voltages are applied at the moment when the probe unit and the panel are brought into contact with each other in order to give an electrical signal and power to the panel 110. When normal electrical connection is made, heat is generated by an overcurrent flowing between the lead wires that generate a potential difference, and the generated heat causes a contact site between the probe unit and the lead wire LD of the panel 110 to be generated. It is a phenomenon that melts and is damaged.

  The occurrence of burnt affects not only the probe unit to be tested, but also the panel 110 to be tested, causing a substantially large production loss.

  15 shows an enlarged view of the lead wire LD of the panel 110 to be tested, and FIG. 16 shows a connection of the probe lead wire PRLD mounted on the bottom surface of the existing body block BB to the lead wire LD of the panel 110. This is a conceptual display of the case where the operation is performed. At this time, some of the lead wires LD of the panel 110 are connected by the fine particles R.

  FIG. 17 shows the electric current formed when voltages having different voltage levels are applied through the corresponding probe leads PRLD1 and PRLD2 between the leads LD1 and LD2 connected by the fine particles R as shown in FIG. Explain the target route. A current of several hundred mA or more flows through this electrical path. Generally, when a current of about 250 mA or more flows, the film that supports the probe lead PRLD is deformed by the heat generated in the case of a tab IC (TIC). Occurs. In addition, if a larger current flows, a burnt is generated in which a contact portion between the probe lead PRLD and the lead LD of the panel 110 is instantaneously melted.

  Therefore, it is necessary to prevent such an overcurrent flow.

  In an embodiment of the present invention, the flexible circuit board FPCB includes a flexible lead FLD that directly contacts the rear surface of the tab IC (TIC) and is electrically connected to the probe lead PRLD of the tab IC (TIC).

  FIG. 18 illustrates a shape in which the tab IC (TIC) and the flexible circuit board FPCB are in contact with each other.

  At this time, in the embodiment of the present invention, the current interrupt device 1000 for preventing burnt that may occur during the test of the panel 110 is formed on the flexible lead wire FLD. With such a current interrupting device 1000, it is possible to interrupt the overcurrent generated by the burnt phenomenon.

  FIG. 19 is a conceptual diagram illustrating a shape in which a probe unit according to an embodiment of the present invention is connected to a panel.

  It can be seen that the flexible circuit board FPCB on which the current interrupting device 1000 is formed is connected to the tab IC (TIC) bonded to the bottom surface BBM of the body block BB.

  In particular, the current interrupt device 1000 is formed of a diode, and is formed on the flexible lead wire FLD so that the panel 110 direction is the forward direction with the flexible circuit board FPCB.

  FIG. 20 is a conceptual diagram illustrating the function of the current interrupt device.

  In FIG. 20, a current interrupt device 1000, that is, a diode is formed on a path through which a voltage is applied to the lead wire LD of the panel 110. Specifically, as described above, a diode is formed in series on the flexible lead wire FLD of the flexible circuit board FPCB.

  Even if an electrical path is formed between the adjacent lead wires by the fine particles R, the current is prevented from flowing by the diode from the high potential side of 30V to the low potential side of 3V. Eventually, the low potential side is cut off, and a voltage of 30 V is applied to the lead wires connected by the fine particles R. In this case, the overcurrent does not flow in the normal state on the panel 110 side, and the increase in the total current measured on the panel 110 side is not large, and therefore a burnt due to the overcurrent does not occur.

  The present invention can greatly improve the productivity of the panel 110 when considering that there is no existing special application means for preventing the burnt phenomenon that can always occur in the inspection of the display panel 110. .

  In the embodiment of the present invention, the formation position of the current interrupt device 1000 is described as the flexible circuit board FPCB, but it may be formed in the drive module M. In this case, since it is not the drive module M used for the panel 110 to be tested, a separate drive module must be manufactured. The attachment position of the current interrupt device 1000 may be changed to various forms depending on the ease of manufacture.

  A probe unit for panel testing according to another embodiment of the present invention includes a body block BB and a flexible circuit board FPCB.

  In the body block BB, a tab IC used for the panel 110 is mounted on the bottom surface, and contacts the lead wire LD of the panel 110. The contact portion is on the opposite side of the contact portion between the tab IC (TIC) and the panel 110. A buffer block 810 is formed which maintains the flatness of the substrate and gives elasticity to the contact portion.

  The flexible circuit board FPCB is electrically connected to the rear surface of the tab IC (TIC) and transmits a test signal to the panel 110 through the tab IC (TIC).

  In a probe unit according to another embodiment of the present invention, the structures of the body block BB and the flexible circuit board FPCB are disclosed in FIGS.

  A tab IC (TIC) capable of testing the panel 110 is in direct contact with the bottom surface BBM of the body block BB while directly contacting the lead wire LD of the panel 110, and the tab IC (TIC) is in contact with the panel 110. When contacting, a buffer block 810 is inserted into the body block BB that maintains the flatness of the contact portion and accurately makes a one-to-one contact between the probe lead PRLD of the tab IC (TIC) and the lead LD of the panel 110. The The buffer block 810 protrudes outside the tip of the body block BB, and gives elasticity to the tab IC (TIC) while maintaining the flatness of the tab IC (TIC).

  The tip of the tab IC (TIC) protrudes further outward than the tip of the buffer block 810 to facilitate alignment when contacting the lead wire LD of the panel 110.

  Since the material for the buffer block 810, the interval correction between the probe lead wires PRLD formed on the tab IC (TIC), and the structure for preventing burnt have been described above, detailed description thereof will be omitted.

  When testing the panel 110, the contact portion where the lead wire LD of the panel 110 and the probe lead wire PRLD of the tab IC (TIC) contact, that is, the tip of the probe lead wire PRLD of the tab IC (TIC) is blackened. May occur. Due to the black dyeing phenomenon, the contact resistance at the tip of the probe lead wire PRLD is increased, so that a stable voltage is not transmitted to the panel 110 and an accurate test cannot be performed.

  The black dyeing phenomenon that occurs at the contact site frequently occurs in the probe lead wire to which a high voltage is transmitted from the probe lead wire PRLD of the tab IC (TIC), and this is in contact with the lead wire LD of the panel 110. This is because the metal material at the contact portion of the probe lead PRLD changes when a high current flows instantaneously.

  In general, a probe lead PRLD of a tab IC (TIC) has a structure in which tin (Sn) is surface-treated on a copper (Cu) pattern. This is because the surface treatment of tin (Sn) uses the corrosion characteristics of copper (Cu) and the welding characteristics of tin (Sn) at a relatively low temperature when the driver IC 830 is bonded to the tab IC film. However, such a target tin (Sn) does not cause a blackening phenomenon in a probe lead wire that does not pass a high current, but a high current instantaneously flows in a probe lead wire that passes a high current. In addition, the black dyeing phenomenon occurs.

  FIG. 21 is a diagram showing a tab IC (TIC).

  The probe lead wire PRLD is divided into two. One is a probe lead line PRLDa that directly contacts the lead wire LD of the panel 110 without passing through the driver IC 830, and the other is a probe lead wire PRLDb that is connected to the lead wire LD of the panel 110 through the driver IC 830. It is.

  The probe lead PRLDa supplies electrical signals and power necessary for a gate IC (not shown) of the panel 110 in general. Although the gate IC of the panel 110 is formed on the left and right sides of the panel 110, the probe lead PRLDa of the tab IC (TIC) that transmits an electrical signal and power to the gate IC does not pass through the driver IC 830.

  Since the voltage used for the gate IC is higher than other voltages supplied to the panel 110, an abnormal spark phenomenon occurs at the contact point when the lead wire LD of the panel 110 and the probe lead wire PRLDa are in contact. As a result, a black dyeing phenomenon occurs on the surface of tin (Sn).

  Therefore, it is important to remove the black dyeing phenomenon. One method for removing the black dyeing phenomenon is to directly connect the panel from the probe lead PRLD formed on the tab IC (TIC) mounted on the bottom surface of the body block BB without passing through the driver IC 830 of the tab IC (TIC). As the probe lead line PRLDa in contact with the 110 lead line LD, a probe lead line PTN formed by etching on a metal plate 1200 having the same length as the tab IC (TIC) is used (see FIG. 22).

  Here, the probe lead wire PRLDa that directly contacts the lead wire LD of the panel 110 without passing through the driver IC 830 of the tab IC (TIC) is a probe for supplying an electric signal to the gate IC (not shown) of the panel 110. Lead wire.

  That is, probe lead wires for supplying an electrical signal to a gate IC (not shown) of panel 110 are power wires through which a high voltage signal passes, and these probe lead wires are connected to lead wires LD of panel 110. The probe lead wire PTN formed by etching on a thin metal plate 1200 that can replace the probe lead wire of the tab IC (TIC) is used to prevent the black dyeing phenomenon due to the spark from occurring at the contact portion of the tab.

  In place of the portion where the probe lead wire PRLDa of FIG. 21 is formed, as shown in FIG. 22, a metal plate material 1200 on which the probe lead wire PTN formed by etching is patterned is replaced with a tab IC (TIC) film. To touch. The metal plate 1200 is bonded to a tab IC (TIC) film as a thin plate that can be etched, such as beryllium nickel and beryllium copper.

  A probe lead wire PTN is formed on the plate material 1200 by etching, and the probe lead wire PTN provides an electrical signal to the gate IC of the panel 110.

  Unlike FIG. 22, as shown in FIG. 23, the tip portion for contacting the panel 110 from the probe lead PRLD formed on the tab IC (TIC) mounted on the bottom surface of the body block BB. The surface 1210 can be surface-treated with a highly conductive material that is stable against thermal oxidation in order to prevent a blackening phenomenon due to a high voltage generated when contacting the lead wire LD of the panel 110.

  That is, after removing tin (Sn) from the tip portion 1210 of the probe lead PRLD, a stable metal film is formed, and a highly conductive material stable to thermal oxidation for surface treatment is: A material that has good electrical conductivity such as gold (Au) or nickel (Ni) and is not oxidized can be used. Here, only gold or nickel is given as an example, but those skilled in the art will understand that other materials other than gold and nickel that are highly conductive while being stable to thermal oxidation are also possible. Can do.

  In this way, the tin at the tip 1210 of the probe lead PRLD is removed, and a film is formed on the surface with a metal such as gold or nickel, thereby preventing black dye development that occurs at the contact portion of the probe lead PRLD. can do.

  As shown in FIG. 23, in addition to the tip portion 1210 of the probe lead wire PRLD formed of a metal such as gold or nickel, it is formed on a tab IC (TIC) mounted on the bottom surface of the body block BB. The entire probe lead PRLD can be surface-treated with a stable metal material such as gold or nickel.

  FIG. 24 is an actual product photograph of a tab IC (TIC) using the plate material 1200 of FIG. FIG. 3 is a photograph taken from the lower part of a body block BB of a probe unit according to an embodiment of the present invention, and a plate material 1200 joined to the film on the right side of a tab IC (TIC) film; P number) is formed by etching. A flexible circuit board FPCB is connected to the back side of the tab IC (TIC).

  Further, the probe lead directly contacting the lead wire LD of the panel 110 without passing through the driver IC 830 of the tab IC (TIC) from the probe lead wire PRLD formed on the tab IC (TIC) mounted on the bottom surface of the body block BB. The lead wire PRLDa is formed in a blade tip type.

  It is possible to reduce the occurrence of burnt due to foreign matters when manufacturing a high voltage signal line with a blade, and to prevent the black dyeing phenomenon by using the characteristics of the material of the blade.

  As mentioned above, the optimal embodiment was disclosed by drawing and the specification. Although specific terms are used herein, they are merely used to describe the present invention and limit the scope of the present invention as defined in the meaning or claims. It was not used for that purpose. Accordingly, those skilled in the art will appreciate that various modifications and equivalent other embodiments are possible. Therefore, the true technical protection scope of the present invention should be determined by the technical idea of the claims.

  The present invention can be used in a field related to a probe unit for panel testing.

TCP: TCP block FPCB: Flexible circuit board BB: Body block TIC: Tab IC
810: Buffer block

Claims (13)

In a probe unit for testing a panel having a plurality of lead wires,
A tab IC used for the panel is attached to the bottom surface, contacts the lead wire of the panel, and holds the flatness of the contact portion on the opposite side of the portion of the tab IC that contacts the panel, A body block formed with a buffer block that gives elasticity and pressure to the contact part;
A flexible circuit board electrically connected to a rear surface of the tab IC and transmitting a test signal to the panel through the tab IC;
With
The tab IC is a tab IC that can be mounted on the panel to be tested.
The tab IC is attached to the body block in a state where one end is pulled with respect to the other end and a space between the plurality of probe lead wires is widened.
The flexible circuit board is
A soft lead wire that directly contacts the rear surface of the tab IC and is electrically connected to a probe lead wire of the tab IC;
A probe unit, wherein a current interruption device for preventing burnt that may occur during the panel test is formed on the flexible lead wire. The body block is
The bottom surface is inclined downward as it goes in the direction of contact with the panel, and is flat,
An insertion groove into which the buffer block is inserted is formed at a tip portion in a direction in contact with the panel,
The probe unit according to claim 1, wherein the buffer block is inserted into the insertion groove, and a tip protrudes outside the insertion groove. The buffer block is
Processed so that the tip protruding to the outside of the insertion groove is sharp, making the bottom of the body block horizontal,
The probe unit according to claim 2, wherein the probe unit is made of a non-metallic material that can be processed. The tab IC is
The probe unit according to claim 1, wherein the probe unit protrudes outward from the tip of the buffer block so as to facilitate alignment with the corresponding lead wire of the panel. On the bottom of the body block,
3. The probe unit according to claim 2 , wherein an elastic groove is formed in a distal direction inside the insertion groove, and the tab IC generates compressive elasticity when contacting the panel. 4. The tab IC is fixed to the bottom surface of the body block by an adhesive.
The probe according to claim 1, wherein an auxiliary fixing portion that prevents damage due to exposure of the tab IC and fixes the tab IC to a bottom surface of the body block is further attached to the outside of the tab IC. unit. The current interrupt device is
2. The probe unit according to claim 1, wherein the probe unit is a diode and is formed on the flexible lead wire so that the panel direction is a forward direction on the flexible circuit board. The probe lead wire that directly contacts the lead wire of the panel without passing through the driver IC of the tab IC among the probe lead wires formed on the tab IC attached to the bottom surface of the body block is:
The probe unit according to claim 1, wherein a probe lead wire formed by etching on a metal plate is used. The probe lead wire that directly contacts the lead wire of the panel without passing through the driver IC of the tab IC is
The probe unit according to claim 8, wherein the probe unit is a probe lead wire for supplying an electric signal to the gate IC of the panel. Of the probe lead wires formed on the tab IC mounted on the bottom surface of the body block, the tip portion for contacting the panel is:
2. The probe unit according to claim 1, wherein a surface treatment is performed with a highly conductive material that is stable against thermal oxidation in order to prevent a blackening phenomenon due to a high voltage generated when contacting the lead wires of the panel. . The probe lead wire formed on the tab IC attached to the bottom surface of the body block is:
2. The probe unit according to claim 1, wherein a surface treatment is performed with a highly conductive material that is stable against thermal oxidation in order to prevent a blackening phenomenon due to a high voltage generated when contacting the lead wires of the panel. . The highly conductive material for surface treatment is
The probe unit according to claim 10, wherein the probe unit is gold (Au) or nickel (Ni). The probe lead wire that directly contacts the lead wire of the panel without passing through the driver IC of the tab IC among the probe lead wires formed on the tab IC attached to the bottom surface of the body block is:
The probe unit according to claim 1, wherein the probe unit is formed in a blade tip type.

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