WO2009125656A1 - Composant électronique - Google Patents

Composant électronique Download PDF

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Publication number
WO2009125656A1
WO2009125656A1 PCT/JP2009/055113 JP2009055113W WO2009125656A1 WO 2009125656 A1 WO2009125656 A1 WO 2009125656A1 JP 2009055113 W JP2009055113 W JP 2009055113W WO 2009125656 A1 WO2009125656 A1 WO 2009125656A1
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WO
WIPO (PCT)
Prior art keywords
coil
layer
electronic component
insulating layer
stacking direction
Prior art date
Application number
PCT/JP2009/055113
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English (en)
Japanese (ja)
Inventor
徹平 赤澤
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to CN2009801125124A priority Critical patent/CN101981635B/zh
Priority to JP2010507201A priority patent/JPWO2009125656A1/ja
Publication of WO2009125656A1 publication Critical patent/WO2009125656A1/fr
Priority to US12/898,464 priority patent/US8198972B2/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F2017/0066—Printed inductances with a magnetic layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H01F41/046—Printed circuit coils structurally combined with ferromagnetic material

Definitions

  • the present invention relates to an electronic component, and relates to a laminated electronic component having a built-in coil.
  • the multilayer inductance element includes a spiral conductor coil formed of an inner conductor, a first nonmagnetic material layer provided so as to be orthogonal to the coil axis of the coil, and a first nonmagnetic material layer provided between the inner conductors. 2 nonmagnetic layers.
  • the coil since the first nonmagnetic material layer is provided across the coil, the coil has an open magnetic circuit structure. As a result, even if the current of the multilayer inductance element is increased, it is difficult for the inductance to rapidly decrease due to magnetic saturation. That is, the direct current superimposition characteristics of the multilayer inductance element are improved.
  • the inductance value required for the coil may differ between the low output current region and the high output current region. More specifically, an electronic component incorporating a coil used in a DC-DC converter can obtain a relatively large inductance value in a low output current region and a relatively small inductance value in a high output current region. Such DC superposition characteristics are required.
  • an object of the present invention is to provide an electronic component having a built-in coil that takes different inductance values depending on the magnitude of current and can suppress a rapid decrease in inductance value due to magnetic saturation.
  • An electronic component includes a laminated body in which a plurality of first insulating layers are laminated, a plurality of coil electrodes constituting a coil by being connected to each other in the laminated body, A second insulating layer provided across the coil and having a lower magnetic permeability than the first insulating layer; and an outer side of the region where the coil is formed when viewed from the stacking direction And a third insulating layer having a lower magnetic permeability than the first insulating layer, and the third insulating layer on the upper side in the stacking direction than the second insulating layer.
  • the structure of the layer is different from the structure of the third insulating layer on the lower side in the stacking direction than the second insulating layer.
  • the second insulating layer having a lower magnetic permeability than the first insulating layer is provided so as to cross the coil, the direct current superimposition characteristics of the electronic component are improved.
  • the structure of the third insulating layer on the upper side in the stacking direction from the second insulating layer and the structure of the third insulating layer on the lower side in the stacking direction from the second insulating layer Therefore, it is possible to obtain different inductance values depending on the magnitude of the current.
  • FIG. 1A is an external perspective view of an electronic component according to an embodiment of the present invention.
  • FIG. 1B is a sectional structural view taken along the line AA of the electronic component.
  • FIG. 1C is a cross-sectional structure view taken along the line BB of the electronic component.
  • FIG. 1D is a cross-sectional structural view taken along the line CC of the electronic component.
  • FIG. 2 is an equivalent circuit diagram of the electronic component shown in FIG. 1. It is the graph which showed the direct current
  • FIG. 4A is a cross-sectional structure diagram of an electronic component according to a first modification.
  • FIG. 4B is a cross-sectional structural view taken along the line DD of the electronic component.
  • FIG. 1A is an external perspective view of the electronic component 10a.
  • FIG. 1B is a cross-sectional structure view taken along the line AA of the electronic component 10a.
  • FIG. 1C is a cross-sectional structure view taken along the line BB of the electronic component 10a.
  • FIG. 1D is a cross-sectional structure view taken along the line CC of the electronic component 10a.
  • the direction in which the insulating layers are stacked when the electronic component 10a is formed is defined as the stacking direction.
  • the coil electrodes 18a to 18g of the electronic component 10a are indicated by dotted lines.
  • the boundary line of each layer is indicated by a dotted line, but there may actually be a case where there is no boundary line that can be visually recognized.
  • the electronic component 10a includes a rectangular parallelepiped laminated body 12 including a coil therein, and two external electrodes 14a and 14b formed on opposite side surfaces of the laminated body 12. Yes.
  • the laminated body 12 is configured by laminating a plurality of coil electrodes and a plurality of magnetic layers as will be described below.
  • the laminate 12 includes a plurality of insulating layers (magnetic layers 16a to 16i) made of ferromagnetic ferrite (eg, Ni—Zn—Cu ferrite or Ni—Zn ferrite).
  • the insulating layers (non-magnetic layers 20 and 22) made of a material having a lower magnetic permeability than the magnetic layers 16a to 16i are stacked.
  • the magnetic permeability of the insulating layers (nonmagnetic layers 20 and 22) made of a material having a lower magnetic permeability than the magnetic layers 16a to 16i is 1.
  • the magnetic layers 16a, 16b, 16d to 16i and the nonmagnetic layer 20 are layers having a rectangular shape.
  • the nonmagnetic layer 22 is a layer having a frame shape in which a central portion is hollowed out into a rectangle.
  • the magnetic layer 16c is a layer having a shape that matches the central portion of the nonmagnetic layer 22 that is hollowed out into a rectangle.
  • the magnetic layers 16a and 16b On the main surfaces of the magnetic layers 16a and 16b, the nonmagnetic layer 22, the magnetic layer 16d, the nonmagnetic layer 20, and the magnetic layers 16e and 16f, they are connected to each other in the multilayer body 12 to form a coil.
  • Coil electrodes 18a to 18g constituting L are formed.
  • the magnetic layers 16g, 16a, 16b, and 16c, the nonmagnetic layer 22, the magnetic layer 16d, the nonmagnetic layer 20, and the magnetic layers 16e, 16f, 16h, and 16i. are stacked from the bottom in this order.
  • an alphabet is added after the reference symbol, and when referring to them collectively, the alphabet after the reference symbol is omitted. .
  • Each coil electrode 18 is made of a conductive material made of Ag and has a “U” shape. Thus, one coil electrode 18 constitutes a part of the coil L corresponding to 3/4 turns.
  • the coil electrode 18 may be made of a conductive material such as a noble metal mainly composed of Pd, Au, Pt or the like, or an alloy thereof.
  • the coil electrode 18 is not limited to 3/4 winding.
  • the plurality of coil electrodes 18 are connected to each other to constitute a spiral coil L.
  • the coil electrodes 18a and 18g formed on the lowermost and uppermost sides in the stacking direction are connected to the external electrodes 14a and 14b, respectively.
  • the plurality of coil electrodes 18 overlap each other to form a “B” shape when viewed from the upper side in the stacking direction.
  • the nonmagnetic layer 22 is formed outside the region ⁇ (inside the “B” in FIG. 1C) surrounded by the coil electrode 18 when viewed from the stacking direction. That is, the nonmagnetic layer 22 is formed in a region overlapping with the coil electrodes 18b and 18c in the stacking direction as shown in FIG. 1B, and the coil electrode 18 as shown in FIG. 1C. It is formed in a region (so-called side gap) outside the region where is formed. Further, the position in the stacking direction is the same as that of the nonmagnetic material layer 22, and the magnetic material layer 16c is formed in the region ⁇ .
  • the nonmagnetic layer 20 is formed over the entire surface of the cross section perpendicular to the stacking direction so as to cross the coil L in the direction perpendicular to the stacking direction.
  • the nonmagnetic layers 20 and 22 have the structure shown in FIG. 1B, so that the structure of the nonmagnetic layer 22 on the upper side of the nonmagnetic layer 20 in the stacking direction and the nonmagnetic layer 20 are stacked.
  • the structure of the nonmagnetic layer 22 on the lower side in the direction is different. More specifically, the nonmagnetic layer 22 is not provided above the nonmagnetic layer 20 in the stacking direction, and the nonmagnetic layer is positioned below the nonmagnetic layer 20 in the stacking direction. 22 is provided.
  • the structure of the nonmagnetic layer 22 refers to the position, shape, and number of the nonmagnetic layer 22.
  • the electronic component 10a is obtained. It is done.
  • the DC superimposition characteristics can be improved as described below.
  • the non-magnetic layer 20 is provided in the electronic component 10a.
  • the coil L becomes an open magnetic circuit type coil.
  • the occurrence of magnetic saturation in the electronic component 10a is suppressed, and the DC superposition characteristics of the electronic component 10a are improved.
  • FIG. 2 is an equivalent circuit diagram of the electronic component 10a.
  • FIG. 3 is a graph showing the DC superposition characteristics of the electronic component 10a. The vertical axis represents inductance, and the horizontal axis represents current.
  • the nonmagnetic layer 20 is formed so as to cross the coil L in the vicinity of the center of the coil L in the stacking direction.
  • the coil L having such a configuration can be regarded as a coil L1 and a coil L2 connected in series as shown in FIG.
  • the coil L1 is a coil composed of coil electrodes 18a to 18d located below the nonmagnetic layer 20.
  • the coil L2 is a coil composed of coil electrodes 18e to 18g located above the nonmagnetic layer 22.
  • the coil L Since the coil L is provided with the nonmagnetic layer 22 as shown in FIG. 1B, it constitutes an open magnetic circuit type coil. Therefore, until a relatively large current flows through the coil L1, as shown by the dotted line in FIG. 3, the inductance value of the coil L1 does not rapidly decrease.
  • the coil L2 is not provided with the non-magnetic layer 22 as shown in FIG. 1B, and thus constitutes a closed magnetic circuit type coil. Therefore, only when a relatively small current flows through the coil L2, the inductance value of the coil L2 rapidly decreases as shown by the one-dot chain line in FIG.
  • the structure of the nonmagnetic layer 22 on the upper side in the stacking direction than the nonmagnetic layer 20 and the structure of the nonmagnetic layer 22 on the lower side in the stacking direction with respect to the nonmagnetic layer 20 By making them different, the DC superposition characteristics of the coil L1 and the DC superposition characteristics of the coil L2 are made different.
  • the inductance value of the coil L in which the coil L1 and the coil L2 are connected in series is represented by the sum of the inductance value of the coil L1 and the inductance value of the coil L2. That is, the DC superimposition characteristic of the coil L is a curve obtained by adding the dotted line and the alternate long and short dash line in FIG. As a result, the direct current superimposition characteristics of the coil L are such that the inductance decreases stepwise as the current increases, as shown by the solid line in FIG. More specifically, in the coil L, when a relatively small current flows through the coil L, a relatively large inductance value is obtained, and when a relatively large current flows through the coil L, Small inductance value can be obtained.
  • the electronic component 10a can be applied to a DC-DC converter.
  • FIG. 4A is a cross-sectional structure diagram of an electronic component 10b according to a first modification.
  • FIG. 4B is a cross-sectional structure view taken along the line DD of the electronic component 10a.
  • FIG. 5 is a cross-sectional structure diagram of an electronic component 10c according to a second modification.
  • the nonmagnetic material layer 22 has a "B" shape.
  • the nonmagnetic material layer 22 has a “U” shape.
  • the structure of the nonmagnetic layer 22 is different. As a result, the direct current superposition characteristics of the coil L1 and the direct current superposition characteristics of the coil L2 can be made different.
  • the nonmagnetic layer 22 is provided by one layer below the nonmagnetic layer 20 in the stacking direction.
  • a nonmagnetic layer 22c for one layer is provided above the nonmagnetic layer 20 in the stacking direction, and below the stacking direction of the nonmagnetic layer 20 in the stacking direction.
  • Two non-magnetic layers 22a and 22b are provided.
  • the structure of the nonmagnetic layer 22 above the nonmagnetic layer 20 in the stacking direction and the stacking direction than the nonmagnetic layer 20 The structure of the nonmagnetic layer 22 on the lower side is different.
  • the direct current superposition characteristics of the coil L1 and the direct current superposition characteristics of the coil L2 can be made different.
  • a method for manufacturing the electronic component 10a will be described as an example of a method for manufacturing the electronic components 10a to 10c.
  • 6 to 9 are a plan view and a cross-sectional structure diagram showing a manufacturing process of the electronic component 10a.
  • a plurality of electronic components 10a are actually manufactured at the same time.
  • a method for manufacturing one electronic component 10a will be described in order to simplify the description.
  • the ceramic green sheets 116a, 116g, 116h and 116i in FIGS. 6 to 9 indicate the unfired layers or sheets of the magnetic layers 16a, 16g, 16h and 16i in FIG.
  • the alphabet after the reference symbol is omitted, and when referring to the individual ceramic green sheets 116, the alphabet is appended after the reference symbol.
  • the ceramic green sheet 116 is produced as follows. Ferrous oxide (Fe 2 O 3 ), zinc oxide (ZnO), nickel oxide (NiO), and copper oxide (CuO) were weighed at a predetermined ratio, and the respective materials were put as raw materials into a ball mill and wet. Mix. The obtained mixture is dried and then pulverized, and the obtained powder is calcined at 750 ° C. for 1 hour. The obtained calcined powder is wet pulverized by a ball mill, dried and then crushed to obtain a ferrite ceramic powder.
  • Ferrous oxide (Fe 2 O 3 ), zinc oxide (ZnO), nickel oxide (NiO), and copper oxide (CuO) were weighed at a predetermined ratio, and the respective materials were put as raw materials into a ball mill and wet. Mix. The obtained mixture is dried and then pulverized, and the obtained powder is calcined at 750 ° C. for 1 hour. The obtained calcined powder is wet pulverized by a ball mill
  • a binder (vinyl acetate, water-soluble acrylic, etc.), a plasticizer, a wetting material, and a dispersing agent are added and mixed with a ball mill, and then defoamed under reduced pressure.
  • the obtained ceramic slurry is formed into a sheet by the doctor blade method and dried to produce a ceramic green sheet 116 having a desired film thickness (for example, 35 ⁇ m).
  • one prepared ceramic green sheet 116a is prepared.
  • a coil paste 18a is formed on the ceramic green sheet 116a by applying a conductive paste by a method such as screen printing or photolithography.
  • the coil electrode 18a is formed of Ag, Pd, Cu, Au, an alloy thereof, or the like so as to have a “U” shape.
  • a printing layer 116b to be the magnetic layer 16b is formed by printing a ferrite paste by a screen printing method.
  • This ferrite paste is made of the same material as the ceramic green sheet 116a.
  • the printed layer 116b is formed such that the end of the coil electrode 18a that is not connected to the external electrode 14a is exposed from the printed layer 116b. Thereby, the connection part of the coil electrode 18a and the coil electrode 18b is formed.
  • a conductive paste is applied onto the printed layer 116b by a method such as a screen printing method or a photolithography method, thereby forming a “U” -shaped coil electrode 18b.
  • the coil electrode 18b is formed so that one end thereof is located at a portion where the coil electrode 18a is exposed from the printed layer 116b. Thereby, the coil electrode 18a and the coil electrode 18b are connected.
  • a nonmagnetic material paste is printed on the ceramic green sheet 116b by a screen printing method, thereby forming a printed layer 122 that becomes the nonmagnetic material layer 22.
  • This non-magnetic material paste is obtained by mixing ferric oxide (Fe 2 O 3 ), zinc oxide (ZnO), and copper oxide (CuO) at a predetermined ratio.
  • the printed layer 122 is formed so as to surround the range ⁇ as shown in FIG. 1C when viewed from the stacking direction. Therefore, the printing layer 122 is formed in a “B” shape. Furthermore, the printed layer 122 is formed so that the end of the coil electrode 18 b that is not connected to the coil electrode 18 a is exposed from the printed layer 122. Thereby, the connection part of the coil electrode 18b and the coil electrode 18c is formed.
  • a print layer 116c to be the magnetic permeability layer 16c is formed on the region ⁇ of the ceramic green sheet 116b by printing a ferrite paste by a screen printing method.
  • This ferrite paste is made of the same material as the ceramic green sheet 116a.
  • a conductive paste is applied on the printed layer 122 by a method such as a screen printing method or a photolithography method, thereby forming a “U” -shaped coil electrode 18c.
  • the coil electrode 18 c is formed so that one end thereof is located at a portion where the coil electrode 18 b is exposed from the printed layer 122. Thereby, the coil electrode 18b and the coil electrode 18c are connected.
  • a ferrite paste is printed on the printing layers 116c and 122 by a screen printing method to form a printing layer 116d to be the magnetic layer 16d.
  • This ferrite paste is made of the same material as the ceramic green sheet 116a.
  • the printed layer 116d is formed so that the end of the coil electrode 18c that is not connected to the coil electrode 18b is exposed from the printed layer 116d. Thereby, the connection part of the coil electrode 18c and the coil electrode 18d is formed.
  • a conductive paste is applied on the printed layer 116d by a method such as a screen printing method or a photolithography method, thereby forming a “U” -shaped coil electrode 18d.
  • the coil electrode 18d is formed so that one end thereof is located at a portion where the coil electrode 18c is exposed from the printed layer 116d. Thereby, the coil electrode 18c and the coil electrode 18d are connected.
  • a printing layer 120 to be the nonmagnetic material layer 20 is formed on the printing layer 116d by printing a paste of a nonmagnetic material by a screen printing method.
  • This nonmagnetic material paste is made of the same material as the printed layer 122.
  • the printed layer 120 is formed so that the end of the coil electrode 18 d that is not connected to the coil electrode 18 c is exposed from the printed layer 120. Thereby, the connection part of the coil electrode 18d and the coil electrode 18e is formed.
  • a conductive paste is applied onto the printed layer 120 by a method such as a screen printing method or a photolithography method, thereby forming a “U” -shaped coil electrode 18e.
  • the coil electrode 18e is formed so that one end thereof is located at a portion where the coil electrode 18d is exposed from the printed layer 120. Thereby, the coil electrode 18d and the coil electrode 18e are connected.
  • a print layer 116e to be the magnetic layer 16e is formed on the print layer 120 by printing a ferrite paste by a screen printing method.
  • This ferrite paste is made of the same material as the ceramic green sheet 116a.
  • the printed layer 116e is formed such that the end of the coil electrode 18e that is not connected to the coil electrode 18d is exposed from the printed layer 116e. Thereby, the connection part of the coil electrode 18d and the coil electrode 18e is formed.
  • a conductive paste is applied onto the printed layer 116e by a method such as a screen printing method or a photolithography method, thereby forming a “U” -shaped coil electrode 18f.
  • the coil electrode 18f is formed so that one end thereof is located at a portion where the coil electrode 18e is exposed from the printed layer 116e. Thereby, the coil electrode 18e and the coil electrode 18f are connected.
  • a print layer 116f to be the magnetic layer 16f is formed on the print layer 116e by printing a ferrite paste by a screen printing method.
  • This ferrite paste is made of the same material as the ceramic green sheet 116a.
  • the printed layer 116f is formed so that the end of the coil electrode 18f that is not connected to the coil electrode 18e is exposed from the printed layer 116f. Thereby, the connection part of the coil electrode 18f and the coil electrode 18g is formed.
  • a conductive paste is applied onto the printed layer 116f by a method such as a screen printing method or a photolithography method, thereby forming a “U” -shaped coil electrode 18g.
  • the coil electrode 18g is formed such that one end thereof is located at a portion where the coil electrode 18f is exposed from the printed layer 116f. Thereby, the coil electrode 18f and the coil electrode 18g are connected.
  • a ceramic green sheet 116g for one layer is laminated and pressure-bonded by a sheet lamination method under the laminate obtained through the steps of FIGS.
  • two layers of ceramic green sheets 116h and 116i are laminated and pressure-bonded on the laminated body by a sheet laminating method.
  • an unfired laminate 12 having a cross-sectional structure as shown in FIG. The unfired laminate 12 is subjected to binder removal processing and firing.
  • the firing temperature is 900 ° C., for example. Thereby, the baked laminated body 12 is obtained.
  • external electrodes 14a and 14b are formed on the surface of the laminate 12 by applying and baking an electrode paste whose main component is silver by a method such as a dipping method.
  • the external electrodes 14a and 14b are formed on the left and right end faces of the multilayer body 12 as shown in FIG.
  • Ni plating / Sn plating is applied to the surface of the external electrode 14.
  • the electronic component 10a is manufactured by combining the printing method and the sheet laminating method, but the manufacturing method of the electronic component 10a is not limited thereto. For example, only a printing method or a sheet lamination method may be used. Furthermore, the electronic component 10a may be manufactured by a transfer method. In this case, a plurality of layers in which the magnetic layer 16, the coil electrode 18, and the nonmagnetic layers 20 and 22 are laminated on a film are prepared in advance. And the laminated body 12 is produced by transferring and laminating these produced layers one after another.
  • the present invention is useful for electronic parts, and is particularly excellent in that it takes different inductance values depending on the magnitude of current and suppresses a rapid decrease in inductance value due to magnetic saturation.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

Cette invention a trait à un composant électronique qui comporte une bobine prenant une valeur d'inductance différente en fonction de l'amplitude d'un courant, et qui peut ralentir la diminution de cette valeur d'inductance qui est provoquée par la saturation magnétique. Un stratifié (12) est obtenu par stratification d'une pluralité de couches magnétiques (16). Des électrodes de bobine (18) interconnectées dans ledit stratifié (12) constituent une bobine (L) qui est traversée par une couche amagnétique (20). La bobine (L) ne se trouve pas dans la même région qu'une couche magnétique (22) vue depuis la direction de stratification. La structure de la couche magnétique (22) située plus haut que la couche amagnétique (20) dans la direction de stratification est différente de celle de la couche magnétique (22) située plus bas que la couche amagnétique (20) dans la direction de stratification.
PCT/JP2009/055113 2008-04-08 2009-03-17 Composant électronique WO2009125656A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2009801125124A CN101981635B (zh) 2008-04-08 2009-03-17 电子元器件
JP2010507201A JPWO2009125656A1 (ja) 2008-04-08 2009-03-17 電子部品
US12/898,464 US8198972B2 (en) 2008-04-08 2010-10-05 Electronic component

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008100302 2008-04-08
JP2008-100302 2008-04-08

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US12/898,464 Continuation US8198972B2 (en) 2008-04-08 2010-10-05 Electronic component

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WO2009125656A1 true WO2009125656A1 (fr) 2009-10-15

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KR20200036237A (ko) * 2018-09-28 2020-04-07 삼성전기주식회사 코일 전자 부품
CN109524215A (zh) * 2018-12-29 2019-03-26 矽力杰半导体技术(杭州)有限公司 层叠变压器及其制造方法
JP7092070B2 (ja) * 2019-03-04 2022-06-28 株式会社村田製作所 積層型コイル部品
JP7243696B2 (ja) * 2020-09-09 2023-03-22 株式会社村田製作所 積層型コイル部品

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