WO2009069688A1 - ポリイミド系複合材料およびそのフィルム - Google Patents

ポリイミド系複合材料およびそのフィルム Download PDF

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Publication number
WO2009069688A1
WO2009069688A1 PCT/JP2008/071524 JP2008071524W WO2009069688A1 WO 2009069688 A1 WO2009069688 A1 WO 2009069688A1 JP 2008071524 W JP2008071524 W JP 2008071524W WO 2009069688 A1 WO2009069688 A1 WO 2009069688A1
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WO
WIPO (PCT)
Prior art keywords
composite material
polyamide acid
polyimide composite
film
same
Prior art date
Application number
PCT/JP2008/071524
Other languages
English (en)
French (fr)
Inventor
Kenichi Fukukawa
Yoshihiro Sakata
Ichiro Fujio
Wataru Yamashita
Original Assignee
Mitsui Chemicals, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Chemicals, Inc. filed Critical Mitsui Chemicals, Inc.
Priority to JP2009543842A priority Critical patent/JP5462631B2/ja
Priority to CN2008801177092A priority patent/CN101874078B/zh
Priority to US12/744,934 priority patent/US9540487B2/en
Priority to EP08855621.2A priority patent/EP2218754B1/en
Priority to KR1020107012571A priority patent/KR101181192B1/ko
Publication of WO2009069688A1 publication Critical patent/WO2009069688A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C08G73/1082—Partially aromatic polyimides wholly aromatic in the tetracarboxylic moiety
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2206—Oxides; Hydroxides of metals of calcium, strontium or barium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2217—Oxides; Hydroxides of metals of magnesium
    • C08K2003/2224—Magnesium hydroxide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)

Abstract

　本発明のポリアミド酸溶液は、ポリアミド酸と、当該ポリアミド酸（ＰＡＡ１）が溶解する溶媒（Ｃ）と、周期律表の１族および２族から選ばれる少なくとも１つの金属を金属イオンとして放出できる物質（Ｍ）、または当該物質（Ｍ）を含有する物質（ｍ）とを含む。本発明のポリイミド複合体は、上記ポリアミド酸溶液から製造される。 　本発明によれば、ポリイミド単体が本来有する諸物性を損なうことなく、ガラス転移温度が大幅に向上した、ポリイミド複合体が得られる。
PCT/JP2008/071524 2007-11-30 2008-11-27 ポリイミド系複合材料およびそのフィルム WO2009069688A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2009543842A JP5462631B2 (ja) 2007-11-30 2008-11-27 ポリイミド系複合材料およびそのフィルム
CN2008801177092A CN101874078B (zh) 2007-11-30 2008-11-27 聚酰亚胺系复合材料及其膜
US12/744,934 US9540487B2 (en) 2007-11-30 2008-11-27 Polyimide composite material and film thereof
EP08855621.2A EP2218754B1 (en) 2007-11-30 2008-11-27 Polyimide composite material and film of the same
KR1020107012571A KR101181192B1 (ko) 2007-11-30 2008-11-27 폴리이미드계 복합 재료 및 그 필름

Applications Claiming Priority (12)

Application Number Priority Date Filing Date Title
JP2007-311130 2007-11-30
JP2007311130 2007-11-30
JP2008161917 2008-06-20
JP2008161920 2008-06-20
JP2008-161916 2008-06-20
JP2008-161917 2008-06-20
JP2008161916 2008-06-20
JP2008161919 2008-06-20
JP2008-161920 2008-06-20
JP2008-161918 2008-06-20
JP2008-161919 2008-06-20
JP2008161918 2008-06-20

Publications (1)

Publication Number Publication Date
WO2009069688A1 true WO2009069688A1 (ja) 2009-06-04

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ID=40678580

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PCT/JP2008/071524 WO2009069688A1 (ja) 2007-11-30 2008-11-27 ポリイミド系複合材料およびそのフィルム

Country Status (7)

Country Link
US (1) US9540487B2 (ja)
EP (1) EP2218754B1 (ja)
JP (1) JP5462631B2 (ja)
KR (1) KR101181192B1 (ja)
CN (1) CN101874078B (ja)
TW (1) TWI425051B (ja)
WO (1) WO2009069688A1 (ja)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011030860A1 (ja) * 2009-09-11 2011-03-17 宇部興産株式会社 ポリイミド前駆体およびポリイミド
WO2011033751A1 (ja) * 2009-09-18 2011-03-24 三井化学株式会社 透明熱可塑性ポリイミド、およびそれを含む透明基板
JP2011168013A (ja) * 2010-02-22 2011-09-01 Toppan Printing Co Ltd 感熱転写記録媒体
JP2012233083A (ja) * 2011-04-28 2012-11-29 Mitsubishi Chemicals Corp デバイス製造方法
JP2012251080A (ja) * 2011-06-03 2012-12-20 Mitsui Chemicals Inc 新規ポリイミドおよびその用途
WO2017022796A1 (ja) * 2015-08-04 2017-02-09 三井化学株式会社 リチウムイオン二次電池の負極用の合材ペースト、リチウムイオン二次電池用の負極、リチウムイオン二次電池用の負極の製造方法およびリチウムイオン二次電池
JP2018125496A (ja) * 2017-02-03 2018-08-09 国立研究開発法人理化学研究所 有機薄膜太陽電池用基板、積層構造体およびその製造方法、ならびにフレキシブル・エレクトロニクス素子の製造方法
WO2020141614A3 (ja) * 2019-05-10 2020-09-03 Ｊｘｔｇエネルギー株式会社 ポリイミド、ポリアミド酸、樹脂溶液、コーティング剤及びポリイミドフィルム
KR20210010571A (ko) 2018-06-22 2021-01-27 미쓰이 가가쿠 가부시키가이샤 폴리아마이드산 및 이것을 포함하는 바니시, 필름, 터치 패널 디스플레이, 액정 디스플레이, 및 유기 el 디스플레이
JPWO2021176779A1 (ja) * 2020-03-03 2021-09-10
WO2023068025A1 (ja) * 2021-10-21 2023-04-27 住友電装株式会社 車載通信システム及び通信ケーブル

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US8574720B2 (en) 2009-08-03 2013-11-05 E.I. Du Pont De Nemours & Company Matte finish polyimide films and methods relating thereto
US9631054B2 (en) 2010-07-23 2017-04-25 E I Du Pont De Nemours And Company Matte finish polyimide films and methods relating thereto
US11203192B2 (en) 2009-08-03 2021-12-21 E I Du Pont De Nemours And Company Matte finish polyimide films and methods relating thereto
US9926415B2 (en) 2010-08-05 2018-03-27 E I Du Pont De Nemours And Company Matte finish polyimide films and methods relating thereto
US8541107B2 (en) 2009-08-13 2013-09-24 E. I. Du Pont De Nemours And Company Pigmented polyimide films and methods relating thereto
EP2596052A1 (en) * 2010-07-23 2013-05-29 E.I. Du Pont De Nemours And Company Matte finish polyimide films and methods relating thereto
TWI522438B (zh) 2010-11-02 2016-02-21 Ｌｇ化學股份有限公司 黏著層及利用其封裝有機電子裝置之方法
US9204528B2 (en) * 2011-04-28 2015-12-01 Kaneka Corporation Flexible printed circuit integrated with stiffener
KR101370639B1 (ko) * 2011-12-09 2014-03-10 이동복 수지 가열방법 및 수지 가열장치
JP6020239B2 (ja) * 2012-04-27 2016-11-02 東京エレクトロン株式会社 成膜方法及び成膜装置
JP2014033056A (ja) * 2012-08-02 2014-02-20 Hiroshima Univ ポリイミド膜の成膜方法、半導体装置の製造方法及び成膜装置
CN102807794A (zh) * 2012-08-22 2012-12-05 江苏亚宝绝缘材料股份有限公司 一种聚全氟乙丙烯涂料
KR101537845B1 (ko) * 2012-12-12 2015-07-17 코오롱인더스트리 주식회사 투명 폴리이미드 기판 및 그 제조방법
TWI483967B (zh) * 2012-12-13 2015-05-11 Chi Mei Corp 軟性基板用組成物及軟性基板
JP6317733B2 (ja) * 2013-04-03 2018-04-25 三井化学株式会社 ポリアミド酸、及びこれを含むワニス、並びにポリイミドフィルム
CN103642055B (zh) * 2013-09-29 2016-04-13 桐城市福润包装材料有限公司 一种聚酰亚胺薄膜的生产工艺
JP6919564B2 (ja) * 2015-06-12 2021-08-18 宇部興産株式会社 ポリイミド前駆体組成物、及びポリイミド組成物
CN108701831B (zh) * 2016-02-10 2021-06-04 日本电气株式会社 二次电池用粘合剂
JP7125721B2 (ja) * 2017-07-29 2022-08-25 国立研究開発法人科学技術振興機構 親水性ポリアミド又はポリイミド
WO2020040057A1 (ja) * 2018-08-24 2020-02-27 三菱瓦斯化学株式会社 ポリイミド樹脂、ポリイミドワニス及びポリイミドフィルム
EP3978548A4 (en) * 2019-05-31 2022-07-20 Mitsubishi Gas Chemical Company, Inc. POLYIMIDE RESIN COMPOSITION
KR20220031543A (ko) * 2019-06-28 2022-03-11 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 수지 시트, 적층체, 수지 조성물층 부착 반도체 웨이퍼, 수지 조성물층 부착 반도체 탑재용 기판, 및 반도체 장치
CN113529272B (zh) * 2020-04-17 2023-04-28 北京化工大学 一种表面具有羧基功能基元的聚酰亚胺纳米纤维膜及其制备方法
CN112251024A (zh) * 2020-08-21 2021-01-22 湖南国柔科技有限公司 一种小半径弯曲耐温快cpi膜及其制备方法
CN114989432B (zh) * 2022-07-08 2023-05-05 中国地质大学（北京） 一种聚酰亚胺及其制备方法和应用、热塑性聚酰亚胺工程塑料及其制备方法和应用

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CN101874078A (zh) 2010-10-27
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