TW538071B - Polyimide resin and cast-on-copper laminate - Google Patents

Polyimide resin and cast-on-copper laminate Download PDF

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Publication number
TW538071B
TW538071B TW90128251A TW90128251A TW538071B TW 538071 B TW538071 B TW 538071B TW 90128251 A TW90128251 A TW 90128251A TW 90128251 A TW90128251 A TW 90128251A TW 538071 B TW538071 B TW 538071B
Authority
TW
Taiwan
Prior art keywords
polyimide
cast
copper laminate
polyimide resin
thermal expansion
Prior art date
Application number
TW90128251A
Other languages
Chinese (zh)
Inventor
Yen-Huey Hsu
Chuan-Yi Huang
Original Assignee
Thinflex Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thinflex Corp filed Critical Thinflex Corp
Priority to TW90128251A priority Critical patent/TW538071B/en
Application granted granted Critical
Publication of TW538071B publication Critical patent/TW538071B/en

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  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)

Abstract

The invention relates to a polyimide using for producing polyimide cast-on-copper laminate, wherein the polyimide, which is produced by polyamic acid solution prepared from reactant of dianhydrides and diamines, has similar thermal expansion coefficient, and result polyimide cast-on-copper laminate has good dimensional stability. The polyamic acid solution contained propriety of inorganic filler so as to obtain a less differential thermal expansion coefficient between the polyimide and the copper foil.
TW90128251A 2001-11-14 2001-11-14 Polyimide resin and cast-on-copper laminate TW538071B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW90128251A TW538071B (en) 2001-11-14 2001-11-14 Polyimide resin and cast-on-copper laminate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW90128251A TW538071B (en) 2001-11-14 2001-11-14 Polyimide resin and cast-on-copper laminate

Publications (1)

Publication Number Publication Date
TW538071B true TW538071B (en) 2003-06-21

Family

ID=29546786

Family Applications (1)

Application Number Title Priority Date Filing Date
TW90128251A TW538071B (en) 2001-11-14 2001-11-14 Polyimide resin and cast-on-copper laminate

Country Status (1)

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TW (1) TW538071B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI412314B (en) * 2006-09-29 2013-10-11 Nippon Steel & Sumikin Chem Co Method for manufacturing double-sided flexible copper-clad laminated substrate and double-sided flexible copper-clad laminated substrate with carrier
TWI425051B (en) * 2007-11-30 2014-02-01 Mitsui Chemicals Inc Polyimine composite material and film thereof
US8691131B2 (en) 2011-09-14 2014-04-08 Mortech Corporation Polyimide film

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI412314B (en) * 2006-09-29 2013-10-11 Nippon Steel & Sumikin Chem Co Method for manufacturing double-sided flexible copper-clad laminated substrate and double-sided flexible copper-clad laminated substrate with carrier
TWI425051B (en) * 2007-11-30 2014-02-01 Mitsui Chemicals Inc Polyimine composite material and film thereof
US9540487B2 (en) 2007-11-30 2017-01-10 Mitsui Chemicals, Inc. Polyimide composite material and film thereof
US8691131B2 (en) 2011-09-14 2014-04-08 Mortech Corporation Polyimide film

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