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Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General
(AREA)
Abstract
The invention relates to a polyimide using for producing polyimide cast-on-copper laminate, wherein the polyimide, which is produced by polyamic acid solution prepared from reactant of dianhydrides and diamines, has similar thermal expansion coefficient, and result polyimide cast-on-copper laminate has good dimensional stability. The polyamic acid solution contained propriety of inorganic filler so as to obtain a less differential thermal expansion coefficient between the polyimide and the copper foil.
TW90128251A2001-11-142001-11-14Polyimide resin and cast-on-copper laminate
TW538071B
(en)
RESIN COMPONENT FOR FORMING AN INSULATING INTERMEDIATE LAYER IN A PRINTED CIRCUIT BOARD, RESIN FOIL AND COPPER FOIL WITH A RESIN FOR PRODUCING AN INSULATING LAYER USING THE RESIN AND COPPER CLADDED LAMINATE USING SAME
Process for producing novel silicone polymer, silicone polymer produced by the process, thermosetting resin composition, resin film, metal foil with insulating material, insulating film with metal foil on each side, metal-clad laminate, multilayered metal-clad laminate, and multilayered printed circuit board
Insulating resin composition for multilayer printed wiring boards, multilayer printed wiring boards made by using the composition and process for the production thereof