TW538071B - Polyimide resin and cast-on-copper laminate - Google Patents
Polyimide resin and cast-on-copper laminate Download PDFInfo
- Publication number
- TW538071B TW538071B TW90128251A TW90128251A TW538071B TW 538071 B TW538071 B TW 538071B TW 90128251 A TW90128251 A TW 90128251A TW 90128251 A TW90128251 A TW 90128251A TW 538071 B TW538071 B TW 538071B
- Authority
- TW
- Taiwan
- Prior art keywords
- polyimide
- cast
- copper laminate
- polyimide resin
- thermal expansion
- Prior art date
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- Laminated Bodies (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Abstract
The invention relates to a polyimide using for producing polyimide cast-on-copper laminate, wherein the polyimide, which is produced by polyamic acid solution prepared from reactant of dianhydrides and diamines, has similar thermal expansion coefficient, and result polyimide cast-on-copper laminate has good dimensional stability. The polyamic acid solution contained propriety of inorganic filler so as to obtain a less differential thermal expansion coefficient between the polyimide and the copper foil.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW90128251A TW538071B (en) | 2001-11-14 | 2001-11-14 | Polyimide resin and cast-on-copper laminate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW90128251A TW538071B (en) | 2001-11-14 | 2001-11-14 | Polyimide resin and cast-on-copper laminate |
Publications (1)
Publication Number | Publication Date |
---|---|
TW538071B true TW538071B (en) | 2003-06-21 |
Family
ID=29546786
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW90128251A TW538071B (en) | 2001-11-14 | 2001-11-14 | Polyimide resin and cast-on-copper laminate |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW538071B (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI412314B (en) * | 2006-09-29 | 2013-10-11 | Nippon Steel & Sumikin Chem Co | Method for manufacturing double-sided flexible copper-clad laminated substrate and double-sided flexible copper-clad laminated substrate with carrier |
TWI425051B (en) * | 2007-11-30 | 2014-02-01 | Mitsui Chemicals Inc | Polyimine composite material and film thereof |
US8691131B2 (en) | 2011-09-14 | 2014-04-08 | Mortech Corporation | Polyimide film |
-
2001
- 2001-11-14 TW TW90128251A patent/TW538071B/en active
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI412314B (en) * | 2006-09-29 | 2013-10-11 | Nippon Steel & Sumikin Chem Co | Method for manufacturing double-sided flexible copper-clad laminated substrate and double-sided flexible copper-clad laminated substrate with carrier |
TWI425051B (en) * | 2007-11-30 | 2014-02-01 | Mitsui Chemicals Inc | Polyimine composite material and film thereof |
US9540487B2 (en) | 2007-11-30 | 2017-01-10 | Mitsui Chemicals, Inc. | Polyimide composite material and film thereof |
US8691131B2 (en) | 2011-09-14 | 2014-04-08 | Mortech Corporation | Polyimide film |
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