WO2009025373A1 - 固体撮像装置及び距離画像測定装置 - Google Patents

固体撮像装置及び距離画像測定装置 Download PDF

Info

Publication number
WO2009025373A1
WO2009025373A1 PCT/JP2008/065049 JP2008065049W WO2009025373A1 WO 2009025373 A1 WO2009025373 A1 WO 2009025373A1 JP 2008065049 W JP2008065049 W JP 2008065049W WO 2009025373 A1 WO2009025373 A1 WO 2009025373A1
Authority
WO
WIPO (PCT)
Prior art keywords
solid state
state imaging
distance image
image measurement
pair
Prior art date
Application number
PCT/JP2008/065049
Other languages
English (en)
French (fr)
Inventor
Mitsuhito Mase
Seiichiro Mizuno
Mitsutaka Takemura
Original Assignee
Hamamatsu Photonics K.K.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hamamatsu Photonics K.K. filed Critical Hamamatsu Photonics K.K.
Priority to US12/674,199 priority Critical patent/US8767189B2/en
Priority to CN2008801038653A priority patent/CN101784911B/zh
Priority to EP08827639.9A priority patent/EP2187237B1/en
Priority to KR1020097026612A priority patent/KR101348522B1/ko
Publication of WO2009025373A1 publication Critical patent/WO2009025373A1/ja

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01SRADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/483Details of pulse systems
    • G01S7/486Receivers
    • G01S7/4861Circuits for detection, sampling, integration or read-out
    • G01S7/4863Detector arrays, e.g. charge-transfer gates
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/70Circuitry for compensating brightness variation in the scene
    • H04N23/72Combination of two or more compensation controls
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01SRADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S17/00Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
    • G01S17/02Systems using the reflection of electromagnetic waves other than radio waves
    • G01S17/06Systems determining position data of a target
    • G01S17/08Systems determining position data of a target for measuring distance only
    • G01S17/10Systems determining position data of a target for measuring distance only using transmission of interrupted, pulse-modulated waves
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01SRADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S17/00Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
    • G01S17/88Lidar systems specially adapted for specific applications
    • G01S17/89Lidar systems specially adapted for specific applications for mapping or imaging
    • G01S17/8943D imaging with simultaneous measurement of time-of-flight at a 2D array of receiver pixels, e.g. time-of-flight cameras or flash lidar
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/50Control of the SSIS exposure
    • H04N25/57Control of the dynamic range
    • H04N25/59Control of the dynamic range by controlling the amount of charge storable in the pixel, e.g. modification of the charge conversion ratio of the floating node capacitance
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/76Addressed sensors, e.g. MOS or CMOS sensors
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/76Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/77Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
    • H04N25/771Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising storage means other than floating diffusion
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/14603Special geometry or disposition of pixel-elements, address-lines or gate-electrodes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Radar Systems And Details Thereof (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Measurement Of Optical Distance (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)

Abstract

 一対の第1ゲート電極IGR,IGLが、光感応領域SAと一対の第1蓄積領域AR,ALとの間のポテンシャルφTX1,φTX2が交互に傾斜するよう半導体基板100上に設けられている。一対の第2ゲート電極IGR,IGLは、第1蓄積領域AR,ALと第2蓄積領域FDR,FDLとの間にそれぞれ介在する第1ポテンシャル障壁φBGの高さを制御するよう半導体基板100上に設けられており、光検出素子によって検出される背景光の出力が高いほどキャリアに対する第1ポテンシャル障壁φBGの高さを増加させる。
PCT/JP2008/065049 2007-08-22 2008-08-22 固体撮像装置及び距離画像測定装置 WO2009025373A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US12/674,199 US8767189B2 (en) 2007-08-22 2008-08-22 Solid state imaging device and distance image measurement device
CN2008801038653A CN101784911B (zh) 2007-08-22 2008-08-22 固体摄像装置和距离图像测量装置
EP08827639.9A EP2187237B1 (en) 2007-08-22 2008-08-22 Solid state imaging device and distance image measurement device
KR1020097026612A KR101348522B1 (ko) 2007-08-22 2008-08-22 고체 촬상 장치 및 거리 화상 측정 장치

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-216517 2007-08-22
JP2007216517A JP5171158B2 (ja) 2007-08-22 2007-08-22 固体撮像装置及び距離画像測定装置

Publications (1)

Publication Number Publication Date
WO2009025373A1 true WO2009025373A1 (ja) 2009-02-26

Family

ID=40378273

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/065049 WO2009025373A1 (ja) 2007-08-22 2008-08-22 固体撮像装置及び距離画像測定装置

Country Status (6)

Country Link
US (1) US8767189B2 (ja)
EP (1) EP2187237B1 (ja)
JP (1) JP5171158B2 (ja)
KR (1) KR101348522B1 (ja)
CN (1) CN101784911B (ja)
WO (1) WO2009025373A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011133464A (ja) * 2009-11-24 2011-07-07 Hamamatsu Photonics Kk 距離センサ及び距離画像センサ
EP2346079A1 (en) * 2010-01-13 2011-07-20 CMOSIS nv Pixel structure with multiple transfer gates
US10509126B2 (en) 2014-01-13 2019-12-17 Sony Depthsensing Solutions Sa/Nv Method for driving a time-of-flight system
JP2020141396A (ja) * 2019-02-28 2020-09-03 三星電子株式会社Samsung Electronics Co.,Ltd. イメージセンサー

Families Citing this family (76)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009047661A (ja) * 2007-08-22 2009-03-05 Hamamatsu Photonics Kk 測距装置
JP5089289B2 (ja) * 2007-08-22 2012-12-05 浜松ホトニクス株式会社 測距センサ及び測距装置
JP5154862B2 (ja) * 2007-08-22 2013-02-27 浜松ホトニクス株式会社 測距装置
JP5171157B2 (ja) * 2007-08-22 2013-03-27 浜松ホトニクス株式会社 測距装置
KR101605046B1 (ko) 2009-07-29 2016-03-21 삼성전자주식회사 싱글 게이트 픽셀 및 싱글 게이트 픽셀 동작 방법
DE102009037596B4 (de) * 2009-08-14 2014-07-24 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Pixelstruktur, System und Verfahren zur optischen Abstandsmessung sowie Steuerschaltung für die Pixelstruktur
WO2011085079A1 (en) 2010-01-06 2011-07-14 Mesa Imaging Ag Demodulation sensor with separate pixel and storage arrays
KR101681198B1 (ko) 2010-02-04 2016-12-01 삼성전자주식회사 센서, 이의 동작 방법, 및 상기 센서를 포함하는 데이터 처리 시스템
JP5302244B2 (ja) 2010-02-26 2013-10-02 浜松ホトニクス株式会社 距離画像センサ
JP5616170B2 (ja) * 2010-09-06 2014-10-29 浜松ホトニクス株式会社 距離センサ及び距離画像センサ
KR101669412B1 (ko) * 2010-11-01 2016-10-26 삼성전자주식회사 3d 카메라를 위한 깊이 정보 측정 방법 및 장치
DE102011089629B4 (de) 2010-12-22 2022-08-04 pmdtechnologies ag Lichtlaufzeitkamera und Verfahren zum Betreiben einer solchen
JP5829036B2 (ja) 2011-03-31 2015-12-09 本田技研工業株式会社 単位画素の信号加算方法
JP5635938B2 (ja) 2011-03-31 2014-12-03 本田技研工業株式会社 固体撮像装置
JP5635937B2 (ja) * 2011-03-31 2014-12-03 本田技研工業株式会社 固体撮像装置
JP5660959B2 (ja) 2011-03-31 2015-01-28 本田技研工業株式会社 受光装置
JP5743837B2 (ja) * 2011-10-07 2015-07-01 キヤノン株式会社 光電変換装置、撮像装置および撮像システム
JP5876289B2 (ja) 2011-12-28 2016-03-02 浜松ホトニクス株式会社 距離測定装置
US8642938B2 (en) 2012-01-13 2014-02-04 Omnivision Technologies, Inc. Shared time of flight pixel
JP6026755B2 (ja) * 2012-02-28 2016-11-16 浜松ホトニクス株式会社 距離センサ及び距離画像センサ
JP2012185174A (ja) * 2012-05-29 2012-09-27 Hamamatsu Photonics Kk 距離センサ及び距離画像センサ
WO2014000793A1 (en) * 2012-06-27 2014-01-03 Teledyne Dalsa B.V. Image sensor and apparatus comprising such image sensor
CN103581645B (zh) * 2012-07-24 2017-05-24 三星电子株式会社 深度感测设备和方法
GB201219782D0 (en) 2012-11-02 2012-12-19 St Microelectronics Res & Dev Improvements in time of flight pixel circuits
JP6231741B2 (ja) 2012-12-10 2017-11-15 キヤノン株式会社 固体撮像装置およびその製造方法
KR102003322B1 (ko) 2012-12-17 2019-07-24 삼성전자주식회사 3차원 이미지 센서의 거리 픽셀의 구동 방법 및 3차원 이미지 센서의 구동 방법
KR102007275B1 (ko) 2012-12-27 2019-08-05 삼성전자주식회사 3차원 이미지 센서의 거리 픽셀 및 이를 포함하는 3차원 이미지 센서
KR102003496B1 (ko) * 2013-03-06 2019-10-01 삼성전자주식회사 이미지 센서 및 이미지 픽업 장치
US10203399B2 (en) * 2013-11-12 2019-02-12 Big Sky Financial Corporation Methods and apparatus for array based LiDAR systems with reduced interference
JP6312420B2 (ja) * 2013-12-20 2018-04-18 スタンレー電気株式会社 距離画像生成装置
JP6012589B2 (ja) * 2013-12-27 2016-10-25 オムロンオートモーティブエレクトロニクス株式会社 レーザレーダ装置及び物体検出方法
US9360554B2 (en) 2014-04-11 2016-06-07 Facet Technology Corp. Methods and apparatus for object detection and identification in a multiple detector lidar array
JP6231940B2 (ja) * 2014-05-08 2017-11-15 浜松ホトニクス株式会社 測距装置及び測距装置の駆動方法
EP2955539B1 (en) 2014-06-12 2018-08-08 Delphi International Operations Luxembourg S.à r.l. Distance measuring device
JP6280002B2 (ja) 2014-08-22 2018-02-14 浜松ホトニクス株式会社 測距方法及び測距装置
JP6433243B2 (ja) * 2014-11-04 2018-12-05 キヤノン株式会社 固体撮像素子及び撮像装置
US10036801B2 (en) 2015-03-05 2018-07-31 Big Sky Financial Corporation Methods and apparatus for increased precision and improved range in a multiple detector LiDAR array
JP6439181B2 (ja) * 2015-03-12 2018-12-19 本田技研工業株式会社 光通信装置、及びプログラム
EP3159711A1 (en) 2015-10-23 2017-04-26 Xenomatix NV System and method for determining a distance to an object
US9812483B2 (en) * 2015-10-26 2017-11-07 Taiwan Semiconductor Manufacturing Co., Ltd. Back-side illuminated (BSI) image sensor with global shutter scheme
US9866816B2 (en) 2016-03-03 2018-01-09 4D Intellectual Properties, Llc Methods and apparatus for an active pulsed 4D camera for image acquisition and analysis
EP3232224B1 (de) * 2016-04-12 2018-06-13 Sick Ag Entfernungsmessender optoelektronischer sensor und verfahren zur erfassung und abstandsbestimmung von objekten
JP6814967B2 (ja) 2016-06-17 2021-01-20 パナソニックIpマネジメント株式会社 撮像装置
CN106067818B (zh) * 2016-07-11 2023-04-25 浙江悦和科技有限公司 带高温漏电补偿的积分型模数转换电路及方法
EP3301477A1 (en) * 2016-10-03 2018-04-04 Xenomatix NV System for determining a distance to an object
EP3301479A1 (en) 2016-10-03 2018-04-04 Xenomatix NV Method for subtracting background light from an exposure value of a pixel in an imaging array, and pixel for use in same
EP3301480A1 (en) * 2016-10-03 2018-04-04 Xenomatix NV System and method for determining a distance to an object
EP3301478A1 (en) 2016-10-03 2018-04-04 Xenomatix NV System for determining a distance to an object
JP6808463B2 (ja) * 2016-11-30 2021-01-06 キヤノン株式会社 光電変換装置および光電変換システム
EP3343246A1 (en) 2016-12-30 2018-07-04 Xenomatix NV System for characterizing surroundings of a vehicle
EP3349043B1 (de) 2017-01-13 2022-01-05 Espros Photonics AG Verfahren zum auslesen eines demodulationspixels sowie entfernungssensor
DE102017101945A1 (de) * 2017-02-01 2018-08-02 Osram Opto Semiconductors Gmbh Messanordnung mit einem optischen Sender und einem optischen Empfänger
EP3392674A1 (en) * 2017-04-23 2018-10-24 Xenomatix NV A pixel structure
JP7028588B2 (ja) * 2017-09-04 2022-03-02 株式会社日立エルジーデータストレージ 3次元距離測定装置
US10768301B2 (en) 2017-12-15 2020-09-08 Xenomatix Nv System and method for determining a distance to an object
KR102488321B1 (ko) 2017-12-29 2023-01-13 삼성전자주식회사 3차원 이미지 센서의 픽셀 어레이 및 3차원 이미지 센서의 구동 방법
CN108566524B (zh) * 2018-01-31 2023-10-27 光微信息科技(合肥)有限公司 像素单元、图像传感器芯片、成像系统、像素单元的形成方法以及深度信息测算方法
CN110612430B (zh) * 2018-04-16 2021-11-19 深圳市汇顶科技股份有限公司 影像传感系统及电子装置
JP7300185B2 (ja) * 2018-05-25 2023-06-29 公立大学法人大阪 化学センサ
JP2021176154A (ja) * 2018-07-18 2021-11-04 ソニーセミコンダクタソリューションズ株式会社 受光素子および測距モジュール
US11294039B2 (en) 2018-07-24 2022-04-05 Samsung Electronics Co., Ltd. Time-resolving image sensor for range measurement and 2D greyscale imaging
TWI801572B (zh) * 2018-07-24 2023-05-11 南韓商三星電子股份有限公司 影像感測器、成像單元及生成灰階影像的方法
EP3627178B1 (en) * 2018-09-19 2022-04-20 ams AG Sensor device, sensor module, imaging system and method to operate a sensor device
DE102019107115A1 (de) * 2019-03-20 2020-09-24 Valeo Schalter Und Sensoren Gmbh LIDAR-Vorrichtung für ein Fahrzeug und Verfahren zum Vergrößern der Erfassungsreichweite einer entsprechenden LIDAR-Vorrichtung
KR102648089B1 (ko) 2019-03-26 2024-03-19 삼성전자주식회사 이미징 장치 및 이미지 센서
JP2020162100A (ja) * 2019-03-28 2020-10-01 ソニーセミコンダクタソリューションズ株式会社 受光装置および測距モジュール
CN110221273B (zh) * 2019-05-09 2021-07-06 奥比中光科技集团股份有限公司 时间飞行深度相机及单频调制解调的距离测量方法
CN114556048B (zh) * 2019-10-24 2023-09-26 华为技术有限公司 测距方法、测距装置及计算机可读存储介质
TW202127637A (zh) * 2019-11-19 2021-07-16 日商索尼半導體解決方案公司 受光元件、測距模組
WO2021131399A1 (ja) * 2019-12-26 2021-07-01 浜松ホトニクス株式会社 測距装置、及び測距センサの駆動方法
JP6895595B1 (ja) * 2019-12-26 2021-06-30 浜松ホトニクス株式会社 測距装置、及び測距センサの駆動方法
CN111526303B (zh) * 2020-04-30 2022-05-24 长春长光辰芯光电技术有限公司 结构光成像中去除背景光的方法
JP7006722B2 (ja) * 2020-05-01 2022-01-24 株式会社ニコン 撮像素子および撮像装置
US20210356568A1 (en) * 2020-05-15 2021-11-18 Analog Devices International Unlimited Company Proximity detection system
US20220050183A1 (en) * 2020-08-12 2022-02-17 Beijing Voyager Technology Co., Ltd. Intertwined detector array for an optical sensing system
JP2021013179A (ja) * 2020-10-07 2021-02-04 株式会社ニコン 撮像装置および測距装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6373557B1 (en) 1997-12-23 2002-04-16 Siemens Aktiengesellschaft Method and apparatus for picking up a three-dimensional range image
WO2006010284A1 (en) 2004-07-26 2006-02-02 Csem Centre Suisse D'electronique Et De Microtechnique Sa Solid-state photodetector pixel and photodetecting method
WO2007026777A1 (ja) * 2005-08-30 2007-03-08 National University Corporation Shizuoka University 半導体測距素子及び固体撮像装置
WO2007055375A1 (ja) * 2005-11-14 2007-05-18 Matsushita Electric Works, Ltd. 空間情報検出装置および同装置に好適な光検出素子

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3969634A (en) * 1975-07-31 1976-07-13 Hughes Aircraft Company Bucket background subtraction circuit for charge-coupled devices
JPS63296266A (ja) * 1987-05-27 1988-12-02 Fujitsu Ltd 半導体装置
JPH0748826B2 (ja) * 1988-12-01 1995-05-24 三菱電機株式会社 固体撮像装置
JPH04268764A (ja) * 1991-02-25 1992-09-24 Sony Corp 固体撮像装置
JP3702854B2 (ja) * 2002-03-06 2005-10-05 ソニー株式会社 固体撮像素子
EP1521981B1 (en) * 2002-07-15 2008-02-20 Matsushita Electric Works, Ltd. Light receiving device with controllable sensitivity and spatial information detecting apparatus using the same
JP4235729B2 (ja) * 2003-02-03 2009-03-11 国立大学法人静岡大学 距離画像センサ
JP4392492B2 (ja) * 2003-06-02 2010-01-06 国立大学法人静岡大学 広ダイナミックレンジイメージセンサ
WO2004112145A1 (ja) * 2003-06-10 2004-12-23 Fujitsu Limited パンチスルー耐性を向上させた半導体集積回路装置およびその製造方法、低電圧トランジスタと高電圧トランジスタとを含む半導体集積回路装置
JP4439888B2 (ja) * 2003-11-27 2010-03-24 イノテック株式会社 Mos型固体撮像装置及びその駆動方法
JP4660086B2 (ja) 2003-12-01 2011-03-30 三洋電機株式会社 固体撮像素子
JP2005217302A (ja) * 2004-01-30 2005-08-11 Sony Corp 固体撮像装置
JP4280822B2 (ja) * 2004-02-18 2009-06-17 国立大学法人静岡大学 光飛行時間型距離センサ
US7601992B2 (en) * 2004-03-17 2009-10-13 Matsushita Electric Works, Ltd. Light detecting element and control method of light detecting element
JP4539176B2 (ja) * 2004-05-31 2010-09-08 ソニー株式会社 固体撮像素子及びその製造方法
JP5110520B2 (ja) * 2005-08-30 2012-12-26 国立大学法人静岡大学 半導体測距素子及び固体撮像装置
JP2007227761A (ja) * 2006-02-24 2007-09-06 Matsushita Electric Ind Co Ltd 固体撮像装置用素子
JP5110535B2 (ja) * 2006-03-31 2012-12-26 国立大学法人静岡大学 半導体測距素子及び固体撮像装置
JP4375364B2 (ja) * 2006-07-14 2009-12-02 ソニー株式会社 固体撮像装置の駆動方法
KR101030263B1 (ko) * 2006-11-30 2011-04-22 고쿠리츠 다이가꾸 호우진 시즈오까 다이가꾸 반도체 거리 측정 소자 및 고체 촬상 장치
JP5089289B2 (ja) * 2007-08-22 2012-12-05 浜松ホトニクス株式会社 測距センサ及び測距装置
JP5154862B2 (ja) * 2007-08-22 2013-02-27 浜松ホトニクス株式会社 測距装置
JP2009047661A (ja) * 2007-08-22 2009-03-05 Hamamatsu Photonics Kk 測距装置
JP5171157B2 (ja) * 2007-08-22 2013-03-27 浜松ホトニクス株式会社 測距装置
WO2010032842A1 (ja) * 2008-09-19 2010-03-25 国立大学法人静岡大学 情報取得装置及び光通信システム
US8338248B2 (en) * 2008-12-25 2012-12-25 National University Corporation Shizuoka University Semiconductor element and solid-state imaging device
JP4798254B2 (ja) * 2009-05-13 2011-10-19 株式会社デンソー 受光デバイス及びその制御方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6373557B1 (en) 1997-12-23 2002-04-16 Siemens Aktiengesellschaft Method and apparatus for picking up a three-dimensional range image
WO2006010284A1 (en) 2004-07-26 2006-02-02 Csem Centre Suisse D'electronique Et De Microtechnique Sa Solid-state photodetector pixel and photodetecting method
WO2007026777A1 (ja) * 2005-08-30 2007-03-08 National University Corporation Shizuoka University 半導体測距素子及び固体撮像装置
WO2007055375A1 (ja) * 2005-11-14 2007-05-18 Matsushita Electric Works, Ltd. 空間情報検出装置および同装置に好適な光検出素子

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2187237A4

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011133464A (ja) * 2009-11-24 2011-07-07 Hamamatsu Photonics Kk 距離センサ及び距離画像センサ
EP2506036A1 (en) * 2009-11-24 2012-10-03 Hamamatsu Photonics K.K. Range sensor and range image sensor
EP2506036A4 (en) * 2009-11-24 2013-10-30 Hamamatsu Photonics Kk RANGE SENSOR AND AREA IMAGE SENSOR
US9019478B2 (en) 2009-11-24 2015-04-28 Hamamatsu Photonics K.K. Range sensor and range image sensor
EP2346079A1 (en) * 2010-01-13 2011-07-20 CMOSIS nv Pixel structure with multiple transfer gates
GB2477083A (en) * 2010-01-13 2011-07-27 Cmosis Nv Pixel structure with multiple transfer gates to improve dynamic range
US9001245B2 (en) 2010-01-13 2015-04-07 Cmosis Nv Pixel structure with multiple transfer gates
US10509126B2 (en) 2014-01-13 2019-12-17 Sony Depthsensing Solutions Sa/Nv Method for driving a time-of-flight system
JP2020141396A (ja) * 2019-02-28 2020-09-03 三星電子株式会社Samsung Electronics Co.,Ltd. イメージセンサー
JP7493932B2 (ja) 2019-02-28 2024-06-03 三星電子株式会社 イメージセンサー

Also Published As

Publication number Publication date
KR20100062975A (ko) 2010-06-10
JP2009047662A (ja) 2009-03-05
EP2187237A4 (en) 2013-06-05
JP5171158B2 (ja) 2013-03-27
CN101784911A (zh) 2010-07-21
US8767189B2 (en) 2014-07-01
EP2187237B1 (en) 2016-11-23
EP2187237A1 (en) 2010-05-19
US20100231891A1 (en) 2010-09-16
KR101348522B1 (ko) 2014-01-06
CN101784911B (zh) 2012-11-07

Similar Documents

Publication Publication Date Title
WO2009025373A1 (ja) 固体撮像装置及び距離画像測定装置
JP5270835B2 (ja) 光検出素子、空間情報の検出装置
US10924703B2 (en) Sensors and systems for the capture of scenes and events in space and time
US9019478B2 (en) Range sensor and range image sensor
US8890991B2 (en) Solid-state image pickup device and system having photodiodes of varying sizes and sensitivities in each unity cell to detect movement of a subject
JP4321568B2 (ja) 固体撮像装置および撮像装置
US9711546B2 (en) Image sensor pixel for high dynamic range image sensor
EP2009696A3 (en) Backside illuminated image sensor
US8154640B2 (en) Sub-pixels, unit pixels, image sensors and methods of operating the same
JP2012256812A5 (ja) センサ
US20110122111A1 (en) Display device
JP2011211182A5 (ja)
JP5294750B2 (ja) 二つのゲートからなるセンシングトランジスタを備えたイメージセンサー及びその駆動方法
WO2008113067A3 (en) Deep submicron and nano cmos single photon photodetector pixel with event based circuits for readout data-rate reduction
JP5132771B2 (ja) 表示装置
TW200644228A (en) Image sensor with compact pixel layout
EP1732135A3 (en) Solid-state image sensing device
TW200725878A (en) CMOS image sensor
WO2009084744A3 (en) Photon detection system and method of photon detection
JP2006310650A5 (ja)
JPH0518265B2 (ja)
JP2005010114A (ja) 入射光の測定方法及びそれを用いた分光機構を有するセンサー
JPH05505087A (ja) リアルタイム読み出し特性を有するホトダイオードを備えるイメージデバイス
JP2007095849A (ja) 光検出素子、光検出素子の制御方法、空間情報検出装置
JP5266636B2 (ja) 光センサ、および距離検出装置

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880103865.3

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08827639

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 20097026612

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

REEP Request for entry into the european phase

Ref document number: 2008827639

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 2008827639

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 12674199

Country of ref document: US