WO2008105143A1 - 発光素子の圧縮成形方法 - Google Patents
発光素子の圧縮成形方法 Download PDFInfo
- Publication number
- WO2008105143A1 WO2008105143A1 PCT/JP2008/000215 JP2008000215W WO2008105143A1 WO 2008105143 A1 WO2008105143 A1 WO 2008105143A1 JP 2008000215 W JP2008000215 W JP 2008000215W WO 2008105143 A1 WO2008105143 A1 WO 2008105143A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- light emitting
- frame
- emitting elements
- compression
- tape
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/34—Feeding the material to the mould or the compression means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
- B29C43/38—Moulds for making articles of definite length, i.e. discrete articles with means to avoid flashes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/00009—Production of simple or compound lenses
- B29D11/00278—Lenticular sheets
- B29D11/00298—Producing lens arrays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/0074—Production of other optical elements not provided for in B29D11/00009- B29D11/0073
- B29D11/00807—Producing lenses combined with electronics, e.g. chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/34—Feeding the material to the mould or the compression means
- B29C2043/3433—Feeding the material to the mould or the compression means using dispensing heads, e.g. extruders, placed over or apart from the moulds
- B29C2043/3438—Feeding the material to the mould or the compression means using dispensing heads, e.g. extruders, placed over or apart from the moulds moving during dispensing over the moulds, e.g. laying up
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/0022—Multi-cavity moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2011/00—Optical elements, e.g. lenses, prisms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Ophthalmology & Optometry (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Led Device Packages (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/438,155 US20100065983A1 (en) | 2007-02-27 | 2008-02-13 | Method of compression-molding light-emitting elements |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007046348A JP2008207450A (ja) | 2007-02-27 | 2007-02-27 | 発光素子の圧縮成形方法 |
JP2007-046348 | 2007-02-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008105143A1 true WO2008105143A1 (ja) | 2008-09-04 |
Family
ID=39720986
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/000215 WO2008105143A1 (ja) | 2007-02-27 | 2008-02-13 | 発光素子の圧縮成形方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20100065983A1 (ja) |
JP (1) | JP2008207450A (ja) |
KR (1) | KR20090018057A (ja) |
CN (1) | CN101541499A (ja) |
TW (1) | TW200836381A (ja) |
WO (1) | WO2008105143A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013525145A (ja) * | 2011-03-23 | 2013-06-20 | 新韓鑽石工業股▲ふん▼有限公司 | 封止材成形方法 |
Families Citing this family (37)
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---|---|---|---|---|
JP5153548B2 (ja) * | 2008-09-30 | 2013-02-27 | Towa株式会社 | 樹脂封止成形用型の加熱冷却装置 |
CN102271887B (zh) * | 2009-01-08 | 2014-03-05 | 旭硝子株式会社 | 脱模膜及发光二极管的制造方法 |
JP5347681B2 (ja) * | 2009-04-20 | 2013-11-20 | 日亜化学工業株式会社 | 発光装置 |
KR100920335B1 (ko) * | 2009-04-29 | 2009-10-07 | 우리마이크론(주) | 반도체 몰딩장치 |
JP4681071B1 (ja) * | 2009-12-17 | 2011-05-11 | 株式会社スズデン | 照明器具 |
JP5894723B2 (ja) * | 2009-12-29 | 2016-03-30 | 株式会社朝日ラバー | 半導体発光装置の製造方法 |
JP2011155187A (ja) * | 2010-01-28 | 2011-08-11 | Konica Minolta Opto Inc | 発光ダイオードユニットの製造方法 |
JP2011155188A (ja) * | 2010-01-28 | 2011-08-11 | Konica Minolta Opto Inc | 発光ダイオードユニットの製造方法 |
JP5522462B2 (ja) | 2010-04-20 | 2014-06-18 | 東芝ライテック株式会社 | 発光装置及び照明装置 |
DE102010044471A1 (de) * | 2010-09-06 | 2012-03-08 | Heraeus Noblelight Gmbh | Beschichtungsverfahren für ein optoelektronisches Chip-On-Board-Modul |
US8956922B2 (en) | 2010-09-06 | 2015-02-17 | Heraeus Noblelight Gmbh | Coating method for an optoelectronic chip-on-board module |
DE102011107892A1 (de) | 2011-07-18 | 2013-01-24 | Heraeus Noblelight Gmbh | Beschichtungsverfahren für einoptoelektronisches Chip-On-Board-Modul |
KR20120081809A (ko) * | 2011-01-12 | 2012-07-20 | 삼성엘이디 주식회사 | 형광체 도포 방법 및 형광체 도포 장치 |
JP5543386B2 (ja) * | 2011-01-21 | 2014-07-09 | スタンレー電気株式会社 | 発光装置、その製造方法及び照明装置 |
DE102011107893A1 (de) | 2011-07-18 | 2013-01-24 | Heraeus Noblelight Gmbh | Optoelektronisches Modul mit verbesserter Optik |
DE102011107895B4 (de) | 2011-07-18 | 2020-11-05 | Heraeus Noblelight Gmbh | Optoelektronisches Modul mit Linsensystem |
JP5658108B2 (ja) * | 2011-08-23 | 2015-01-21 | Towa株式会社 | 反射体付基板の製造方法及び製造装置 |
JP5751154B2 (ja) | 2011-12-14 | 2015-07-22 | 豊田合成株式会社 | 発光装置及びその製造方法 |
JP5817044B2 (ja) * | 2011-12-14 | 2015-11-18 | アピックヤマダ株式会社 | 樹脂封止装置および樹脂封止方法 |
JP5723800B2 (ja) * | 2012-02-02 | 2015-05-27 | Towa株式会社 | 半導体チップの圧縮樹脂封止成形方法及び装置 |
TWI527273B (zh) * | 2012-02-02 | 2016-03-21 | Towa Corp | Method and apparatus for sealing resin sealing of semiconductor wafer and apparatus for preventing edge of resin |
JP6087507B2 (ja) * | 2012-02-02 | 2017-03-01 | Towa株式会社 | 半導体チップの圧縮樹脂封止成形方法及び樹脂封止された半導体チップの生産方法 |
RU2617880C2 (ru) * | 2012-02-10 | 2017-04-28 | Конинклейке Филипс Н.В. | Прессованная линза, формирующая led-модуль масштаба интегральной схемы, и способ ее изготовления |
DE102012008637A1 (de) * | 2012-05-02 | 2013-11-07 | Heraeus Noblelight Gmbh | Optisches Modul mit Ausformung zur Montage |
CN102683232B (zh) * | 2012-05-31 | 2015-08-19 | 无锡佰恒光电科技有限公司 | 一种半导体封装模具及其封装工艺 |
TWI466337B (zh) * | 2012-07-06 | 2014-12-21 | Advanced Optoelectronic Tech | 側光式發光二極體的製作方法 |
DE102012214484A1 (de) * | 2012-08-14 | 2014-02-20 | Osram Gmbh | Verfahren zum Herstellen eines bandförmigen Leuchtmoduls |
US8748202B2 (en) | 2012-09-14 | 2014-06-10 | Bridgelux, Inc. | Substrate free LED package |
US9470395B2 (en) * | 2013-03-15 | 2016-10-18 | Abl Ip Holding Llc | Optic for a light source |
WO2014156722A1 (ja) * | 2013-03-29 | 2014-10-02 | 住友ベークライト株式会社 | 工程フィルム、その使用方法、成型品の製造方法および成型体 |
JP6208967B2 (ja) * | 2013-04-03 | 2017-10-04 | アピックヤマダ株式会社 | Led装置の製造方法 |
JP5747947B2 (ja) * | 2013-06-10 | 2015-07-15 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
TWI566914B (zh) * | 2014-12-05 | 2017-01-21 | 峻泓光電股份有限公司 | 製作led的模具及其製作led的方法 |
DE102015200219A1 (de) * | 2015-01-09 | 2016-07-14 | Robert Bosch Gmbh | Verfahren zum Herstellen eines Elektronikmoduls insbesondere eines Getriebesteuermoduls |
CN108140619B (zh) * | 2015-11-16 | 2021-08-06 | 惠普发展公司,有限责任合伙企业 | 电路封装 |
JP2017193095A (ja) * | 2016-04-20 | 2017-10-26 | Towa株式会社 | 樹脂成形装置及び樹脂成形方法 |
JP6677232B2 (ja) * | 2017-09-29 | 2020-04-08 | 日亜化学工業株式会社 | 発光装置の製造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000277551A (ja) * | 1999-03-26 | 2000-10-06 | Apic Yamada Corp | 樹脂封止装置及び樹脂封止方法 |
JP2005305954A (ja) * | 2004-04-26 | 2005-11-04 | Towa Corp | 光素子の樹脂封止成形方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000294580A (ja) * | 1999-04-12 | 2000-10-20 | Nitto Denko Corp | 半導体チップの樹脂封止方法及びリ−ドフレ−ム等貼着用粘着テ−プ |
JP4388654B2 (ja) * | 2000-02-01 | 2009-12-24 | アピックヤマダ株式会社 | 樹脂封止装置及び樹脂封止方法 |
JP4066050B2 (ja) * | 2003-05-23 | 2008-03-26 | 松下電器産業株式会社 | 樹脂封止型半導体装置及びその製造方法 |
-
2007
- 2007-02-27 JP JP2007046348A patent/JP2008207450A/ja active Pending
-
2008
- 2008-02-13 CN CNA2008800003534A patent/CN101541499A/zh active Pending
- 2008-02-13 US US12/438,155 patent/US20100065983A1/en not_active Abandoned
- 2008-02-13 KR KR1020087028095A patent/KR20090018057A/ko not_active Application Discontinuation
- 2008-02-13 WO PCT/JP2008/000215 patent/WO2008105143A1/ja active Application Filing
- 2008-02-19 TW TW097105661A patent/TW200836381A/zh unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000277551A (ja) * | 1999-03-26 | 2000-10-06 | Apic Yamada Corp | 樹脂封止装置及び樹脂封止方法 |
JP2005305954A (ja) * | 2004-04-26 | 2005-11-04 | Towa Corp | 光素子の樹脂封止成形方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013525145A (ja) * | 2011-03-23 | 2013-06-20 | 新韓鑽石工業股▲ふん▼有限公司 | 封止材成形方法 |
Also Published As
Publication number | Publication date |
---|---|
US20100065983A1 (en) | 2010-03-18 |
KR20090018057A (ko) | 2009-02-19 |
TW200836381A (en) | 2008-09-01 |
CN101541499A (zh) | 2009-09-23 |
JP2008207450A (ja) | 2008-09-11 |
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