WO2009022491A1 - 光素子の樹脂封止成形方法およびそれに用いられる装置 - Google Patents

光素子の樹脂封止成形方法およびそれに用いられる装置 Download PDF

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Publication number
WO2009022491A1
WO2009022491A1 PCT/JP2008/060661 JP2008060661W WO2009022491A1 WO 2009022491 A1 WO2009022491 A1 WO 2009022491A1 JP 2008060661 W JP2008060661 W JP 2008060661W WO 2009022491 A1 WO2009022491 A1 WO 2009022491A1
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WIPO (PCT)
Prior art keywords
mold assembly
units
substrate
resin encapsulation
optical element
Prior art date
Application number
PCT/JP2008/060661
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English (en)
French (fr)
Inventor
Hiroshi Uragami
Mamoru Nakamura
Kinya Fujino
Tetsuya Yamada
Kazuki Kawakubo
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Towa Corporation
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Publication of WO2009022491A1 publication Critical patent/WO2009022491A1/ja

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H01L21/566—Release layers for moulds, e.g. release layers, layers against residue during moulding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/568—Temporary substrate used as encapsulation process aid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B29C2043/3433—Feeding the material to the mould or the compression means using dispensing heads, e.g. extruders, placed over or apart from the moulds
    • B29C2043/3438—Feeding the material to the mould or the compression means using dispensing heads, e.g. extruders, placed over or apart from the moulds moving during dispensing over the moulds, e.g. laying up
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/0022—Multi-cavity moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2011/00—Optical elements, e.g. lenses, prisms
    • B29L2011/0016—Lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Led Device Packages (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Led Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

　光素子の樹脂封止成形装置は、基板供給ユニット（Ｂ）、基板収容ユニット（Ｃ）、およびそれらの間に配置された１または複数の型組品ユニット（Ａ）を備えている。基板供給ユニット（Ｂ）が、１または複数の型組品ユニット（Ａ）のそれぞれに複数のＬＥＤチップが搭載された基板（１）および液状樹脂を供給する。基板収容ユニット（Ｃ）は、１または複数の型組品ユニット（Ａ）のそれぞれにおいてＬＥＤチップが封止されたＬＥＤ成形品（３）を収容する。１または複数の型組品ユニット（Ａ）のそれぞれは、複数のＬＥＤチップを液状樹脂によって圧縮成形する。
PCT/JP2008/060661 2007-08-10 2008-06-11 光素子の樹脂封止成形方法およびそれに用いられる装置 WO2009022491A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-208925 2007-08-10
JP2007208925A JP5192749B2 (ja) 2007-08-10 2007-08-10 光素子の樹脂封止成形方法及び装置

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WO2009022491A1 true WO2009022491A1 (ja) 2009-02-19

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WO (1) WO2009022491A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6176416B1 (ja) * 2017-03-31 2017-08-09 第一精工株式会社 半導体パッケージの樹脂封止装置、及び半導体パッケージの樹脂封止方法
JP6202292B1 (ja) * 2017-06-28 2017-09-27 第一精工株式会社 半導体パッケージの樹脂封止装置、及び半導体パッケージの樹脂封止方法
JP2018501987A (ja) * 2014-12-15 2018-01-25 ゲオマール ヘルムホルツ−ツェントルム フュア オツェアンフォアシュング キールＧＥＯＭＡＲ Ｈｅｌｍｈｏｌｔｚ−Ｚｅｎｔｒｕｍ ｆｕｅｒ Ｏｚｅａｎｆｏｒｓｃｈｕｎｇ Ｋｉｅｌ ポッティング材料中にポッティングされるｌｅｄ照明装置をポッティングするための方法および装置、ならびにｌｅｄ照明装置
EP3229266A4 (en) * 2014-12-24 2018-08-22 Towa Corporation Resin molding device and resin molding method

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5541797B2 (ja) * 2010-11-12 2014-07-09 アピックヤマダ株式会社 樹脂成形装置
KR101867304B1 (ko) * 2012-03-15 2018-06-15 삼성전자주식회사 반도체 발광장치 제조방법
JP6169516B2 (ja) * 2014-03-31 2017-07-26 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形方法
JP6218666B2 (ja) * 2014-04-25 2017-10-25 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形方法
JP6282564B2 (ja) * 2014-09-16 2018-02-21 東芝メモリ株式会社 半導体装置の製造方法
JP6774865B2 (ja) * 2016-12-13 2020-10-28 アピックヤマダ株式会社 枠体治具、樹脂供給治具及びその計量方法、モールド樹脂の計量装置及び方法、樹脂供給装置、樹脂供給計量装置及び方法、並びに樹脂モールド装置及び方法
CN111823459A (zh) * 2020-06-23 2020-10-27 江苏敦超电子科技有限公司 一种用于微流控芯片制造的pdms浇注系统及浇注方法

Citations (2)

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JPH09117931A (ja) * 1995-10-25 1997-05-06 Towa Kk 電子部品の樹脂封止成形方法及び装置
JP2005305954A (ja) * 2004-04-26 2005-11-04 Towa Corp 光素子の樹脂封止成形方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61148016A (ja) * 1984-12-24 1986-07-05 Hitachi Ltd モールド装置
JP3642637B2 (ja) * 1996-08-20 2005-04-27 アピックヤマダ株式会社 樹脂モールド装置
JP3282988B2 (ja) * 1997-05-01 2002-05-20 アピックヤマダ株式会社 樹脂モールド方法及び樹脂モールド装置
JP4369901B2 (ja) * 2005-06-22 2009-11-25 住友重機械工業株式会社 封止装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09117931A (ja) * 1995-10-25 1997-05-06 Towa Kk 電子部品の樹脂封止成形方法及び装置
JP2005305954A (ja) * 2004-04-26 2005-11-04 Towa Corp 光素子の樹脂封止成形方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018501987A (ja) * 2014-12-15 2018-01-25 ゲオマール ヘルムホルツ−ツェントルム フュア オツェアンフォアシュング キールＧＥＯＭＡＲ Ｈｅｌｍｈｏｌｔｚ−Ｚｅｎｔｒｕｍ ｆｕｅｒ Ｏｚｅａｎｆｏｒｓｃｈｕｎｇ Ｋｉｅｌ ポッティング材料中にポッティングされるｌｅｄ照明装置をポッティングするための方法および装置、ならびにｌｅｄ照明装置
EP3229266A4 (en) * 2014-12-24 2018-08-22 Towa Corporation Resin molding device and resin molding method
JP6176416B1 (ja) * 2017-03-31 2017-08-09 第一精工株式会社 半導体パッケージの樹脂封止装置、及び半導体パッケージの樹脂封止方法
JP2018174200A (ja) * 2017-03-31 2018-11-08 第一精工株式会社 半導体パッケージの樹脂封止装置、及び半導体パッケージの樹脂封止方法
JP6202292B1 (ja) * 2017-06-28 2017-09-27 第一精工株式会社 半導体パッケージの樹脂封止装置、及び半導体パッケージの樹脂封止方法
JP2018174290A (ja) * 2017-06-28 2018-11-08 第一精工株式会社 半導体パッケージの樹脂封止装置、及び半導体パッケージの樹脂封止方法

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JP2009039985A (ja) 2009-02-26
JP5192749B2 (ja) 2013-05-08
TW200909177A (en) 2009-03-01

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