ATE534149T1 - Lichtemittierende vorrichtung - Google Patents

Lichtemittierende vorrichtung

Info

Publication number
ATE534149T1
ATE534149T1 AT05844850T AT05844850T ATE534149T1 AT E534149 T1 ATE534149 T1 AT E534149T1 AT 05844850 T AT05844850 T AT 05844850T AT 05844850 T AT05844850 T AT 05844850T AT E534149 T1 ATE534149 T1 AT E534149T1
Authority
AT
Austria
Prior art keywords
resin material
lens
recess
encapsulation member
led chip
Prior art date
Application number
AT05844850T
Other languages
English (en)
Inventor
Mikio Masui
Youji Urano
Original Assignee
Panasonic Elec Works Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Elec Works Co Ltd filed Critical Panasonic Elec Works Co Ltd
Application granted granted Critical
Publication of ATE534149T1 publication Critical patent/ATE534149T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Surgical Instruments (AREA)
AT05844850T 2005-11-21 2005-12-28 Lichtemittierende vorrichtung ATE534149T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005336192A JP4013077B2 (ja) 2005-11-21 2005-11-21 発光装置およびその製造方法
PCT/JP2005/024033 WO2007057984A1 (ja) 2005-11-21 2005-12-28 発光装置

Publications (1)

Publication Number Publication Date
ATE534149T1 true ATE534149T1 (de) 2011-12-15

Family

ID=38048376

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05844850T ATE534149T1 (de) 2005-11-21 2005-12-28 Lichtemittierende vorrichtung

Country Status (8)

Country Link
US (1) US8278678B2 (de)
EP (2) EP1953835B1 (de)
JP (1) JP4013077B2 (de)
KR (1) KR101010229B1 (de)
CN (1) CN101313415B (de)
AT (1) ATE534149T1 (de)
ES (1) ES2374927T3 (de)
WO (1) WO2007057984A1 (de)

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US8318545B2 (en) * 2010-01-28 2012-11-27 Freescale Semiconductor, Inc. Method of making a mounted gallium nitride device
DE112011100650B4 (de) * 2010-02-24 2020-12-31 Citizen Electronics Co., Ltd. Trägerplatine und struktur von dieser
US8350453B2 (en) * 2010-05-25 2013-01-08 Nepes Led Corporation Lamp cover including a phosphor mixed structure for light emitting device
CN102299231B (zh) * 2010-06-23 2013-11-06 九江正展光电有限公司 发光二极管封装结构及其制造方法
CN103026518B (zh) * 2010-07-23 2016-04-20 京瓷株式会社 光照射设备、光照射模块以及印刷装置
CN101958390A (zh) * 2010-08-13 2011-01-26 李刚 发光芯片封装结构
JP5767062B2 (ja) * 2010-09-30 2015-08-19 日東電工株式会社 発光ダイオード封止材、および、発光ダイオード装置の製造方法
CN102447042A (zh) * 2010-10-15 2012-05-09 展晶科技(深圳)有限公司 Led封装结构及制程
CN102456804A (zh) * 2010-10-20 2012-05-16 展晶科技(深圳)有限公司 封装体、发光二极管封装结构及封装体的制造方法
EP2482333A1 (de) * 2011-01-31 2012-08-01 AZURSPACE Solar Power GmbH Solarzellenempfänger
DE102011100028A1 (de) * 2011-04-29 2012-10-31 Osram Opto Semiconductors Gmbh Bauelement und Verfahren zur Herstellung eines Bauelements
CN103378252B (zh) * 2012-04-16 2016-01-06 展晶科技(深圳)有限公司 发光二极管模组
CN103375736A (zh) * 2012-04-28 2013-10-30 Ge医疗系统环球技术有限公司 Led灯及包括led灯的限束器和x射线设备
JP2014135350A (ja) * 2013-01-09 2014-07-24 Ntec Co Ltd ヒートシンク
ES2535586B2 (es) * 2014-04-22 2016-04-27 Fernando RUÍZ DE APODACA CARDEÑOSA Sistema óptico para luminarias y lámparas LED.
US10103300B2 (en) * 2014-05-21 2018-10-16 Lumileds Llc Method of attaching a lens to an LED module with high alignment accuracy
US10622522B2 (en) * 2014-09-05 2020-04-14 Theodore Lowes LED packages with chips having insulated surfaces
KR20160038568A (ko) * 2014-09-30 2016-04-07 (주)포인트엔지니어링 복수의 곡면 캐비티를 포함하는 칩 기판
CN105870307A (zh) * 2016-04-30 2016-08-17 浙江单色电子科技有限公司 一种低光衰紫光led及其制造方法
JP6297741B1 (ja) * 2017-03-31 2018-03-20 旭化成エレクトロニクス株式会社 光デバイス及びその製造方法
CN107833952A (zh) * 2017-11-28 2018-03-23 西安科锐盛创新科技有限公司 一种大功率led封装工艺
CN107819064A (zh) * 2017-11-28 2018-03-20 西安科锐盛创新科技有限公司 Led封装结构
CN107833948A (zh) * 2017-11-28 2018-03-23 西安科锐盛创新科技有限公司 Led封装结构及其方法
CN107833947B (zh) * 2017-11-28 2020-12-18 浙江清华柔性电子技术研究院 一种led封装方法
CN110179218A (zh) * 2019-06-24 2019-08-30 连云港市龙腾科技广告有限公司 一种建筑物墙面悬挂式整体内发光徽标及其制作方法
TWI790671B (zh) * 2021-07-04 2023-01-21 郭明騰 光源模組

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Also Published As

Publication number Publication date
ES2374927T3 (es) 2012-02-23
KR20080073344A (ko) 2008-08-08
EP1953835A1 (de) 2008-08-06
CN101313415A (zh) 2008-11-26
CN101313415B (zh) 2011-08-17
EP2264797A3 (de) 2011-08-03
EP1953835A4 (de) 2010-01-20
KR101010229B1 (ko) 2011-01-21
US20090095967A1 (en) 2009-04-16
WO2007057984A1 (ja) 2007-05-24
JP4013077B2 (ja) 2007-11-28
EP1953835B1 (de) 2011-11-16
US8278678B2 (en) 2012-10-02
JP2007142281A (ja) 2007-06-07
EP2264797A2 (de) 2010-12-22
EP2264797B1 (de) 2018-04-18

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