PT1921111T - Composição de resina epóxi e material de fixação de pastilha compreendendo a composição - Google Patents

Composição de resina epóxi e material de fixação de pastilha compreendendo a composição

Info

Publication number
PT1921111T
PT1921111T PT67966846T PT06796684T PT1921111T PT 1921111 T PT1921111 T PT 1921111T PT 67966846 T PT67966846 T PT 67966846T PT 06796684 T PT06796684 T PT 06796684T PT 1921111 T PT1921111 T PT 1921111T
Authority
PT
Portugal
Prior art keywords
composition
epoxy resin
bonding material
die bonding
resin composition
Prior art date
Application number
PT67966846T
Other languages
English (en)
Inventor
Honda Tsuyoshi
Takenaka Hiroyuki
Original Assignee
Shin-Etsu Chemical Company Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin-Etsu Chemical Company Ltd filed Critical Shin-Etsu Chemical Company Ltd
Publication of PT1921111T publication Critical patent/PT1921111T/pt

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Classifications

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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/36—Material effects
    • H01L2924/364—Polymers
    • H01L2924/3641—Outgassing

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
  • Epoxy Resins (AREA)
PT67966846T 2005-09-02 2006-08-23 Composição de resina epóxi e material de fixação de pastilha compreendendo a composição PT1921111T (pt)

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US (1) US20090133833A1 (pt)
EP (1) EP1921111B1 (pt)
JP (1) JP4809355B2 (pt)
KR (1) KR100900863B1 (pt)
CN (1) CN101184809A (pt)
PT (1) PT1921111T (pt)
WO (1) WO2007029504A1 (pt)

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JP5263926B2 (ja) * 2007-11-30 2013-08-14 信越化学工業株式会社 ダイボンド剤組成物及びそれを用いた半導体装置
JP5234910B2 (ja) * 2007-12-28 2013-07-10 信越化学工業株式会社 接着剤組成物
JP5209329B2 (ja) * 2008-01-21 2013-06-12 信越化学工業株式会社 半導体装置の製造方法
EP2250227A4 (en) * 2008-02-25 2013-08-21 Henkel Ag & Co Kgaa OUT OF THEIR PUNCHING CHIP FIXING PASTE
KR101114360B1 (ko) * 2008-04-25 2012-02-10 주식회사 엘지화학 에폭시계 조성물, 접착 필름, 다이싱 다이본딩 필름 및 반도체 장치
JP2010006912A (ja) * 2008-06-25 2010-01-14 Shin-Etsu Chemical Co Ltd 接着剤組成物、接着フィルム及びダイシング・ダイアタッチフィルム
JP5375638B2 (ja) * 2010-02-05 2013-12-25 三菱化学株式会社 三次元集積回路用の層間充填材組成物、塗布液、三次元集積回路の製造方法
JP5586313B2 (ja) * 2010-04-23 2014-09-10 京セラケミカル株式会社 接着剤層の形成方法、及び接着剤組成物
DE102010043871A1 (de) * 2010-11-12 2012-05-16 Tesa Se Klebmasse und Verfahren zur Kapselung einer elektronischen Anordnung
JP5691881B2 (ja) * 2011-06-27 2015-04-01 信越化学工業株式会社 接着剤組成物
JP5725559B2 (ja) * 2011-12-28 2015-05-27 信越化学工業株式会社 液状導電性樹脂組成物及び電子部品
JP2016037529A (ja) * 2014-08-06 2016-03-22 信越化学工業株式会社 液状エポキシ樹脂組成物及びヒートシンク、スティフナー用接着剤
US10233325B2 (en) * 2015-08-31 2019-03-19 Zeon Corporation Resin composition
CN108565335B (zh) * 2018-06-13 2022-03-18 咸阳天华电子科技有限公司 一种压力传感器用的不锈钢基覆康铜箔板的制备工艺
RU2756173C1 (ru) * 2020-11-12 2021-09-28 Федеральное государственное бюджетное учреждение науки Институт высокомолекулярных соединений Российской академии наук Клеевая композиция для полимерных композиционных материалов

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JPS6199356A (ja) * 1984-10-19 1986-05-17 Nitto Electric Ind Co Ltd 半導体装置
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JPH07224144A (ja) * 1994-02-07 1995-08-22 Nippon Zeon Co Ltd エポキシ樹脂系接着性組成物の製造方法
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Publication number Publication date
KR20080009288A (ko) 2008-01-28
KR100900863B1 (ko) 2009-06-04
JPWO2007029504A1 (ja) 2009-03-19
JP4809355B2 (ja) 2011-11-09
EP1921111A1 (en) 2008-05-14
CN101184809A (zh) 2008-05-21
EP1921111B1 (en) 2017-04-12
EP1921111A4 (en) 2010-03-03
US20090133833A1 (en) 2009-05-28
WO2007029504A1 (ja) 2007-03-15

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