TWI456640B - 半導體晶片之壓縮成形方法及壓縮成形模具 - Google Patents
半導體晶片之壓縮成形方法及壓縮成形模具 Download PDFInfo
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- TWI456640B TWI456640B TW100133352A TW100133352A TWI456640B TW I456640 B TWI456640 B TW I456640B TW 100133352 A TW100133352 A TW 100133352A TW 100133352 A TW100133352 A TW 100133352A TW I456640 B TWI456640 B TW I456640B
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- cavity
- resin
- semiconductor wafer
- partition member
- substrate
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- 239000004065 semiconductor Substances 0.000 title claims 23
- 238000000748 compression moulding Methods 0.000 title claims 16
- 238000000034 method Methods 0.000 title claims 7
- 238000007906 compression Methods 0.000 title claims 2
- 230000006835 compression Effects 0.000 title claims 2
- 239000011347 resin Substances 0.000 claims 46
- 229920005989 resin Polymers 0.000 claims 46
- 238000005192 partition Methods 0.000 claims 26
- 239000000758 substrate Substances 0.000 claims 17
- 239000000463 material Substances 0.000 claims 8
- 238000010438 heat treatment Methods 0.000 claims 6
- 238000000638 solvent extraction Methods 0.000 claims 3
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Claims (11)
- 一種半導體晶片的壓縮成形方法,其使用半導體晶片之壓縮成形模具,將離型薄膜覆蓋在設於該壓縮成形模具的空腔,並且,將樹脂材料供給至覆蓋了該離型薄膜的空腔內並將其加熱,藉由將該成形模具關模,使得安裝在基板上的半導體晶片浸漬在該空腔內的樹脂中,並且,藉由空腔底面構材將該空腔內的樹脂加壓,使得將該半導體晶片壓縮成形在對應於該空腔形狀且具有所欲之厚度的樹脂成形體內,該半導體晶片的壓縮成形方法包括:準備區隔構材的步驟,其係用以藉由區隔該空腔內以形成分割空腔;在將該區隔構材向該空腔內方向彈性施力的狀態下,將該區隔構材設置在該空腔底面構材的步驟;設定該區隔構材中從該空腔底面起算的高度的步驟,該高度設定為使得在該空腔底面構材加壓時該區隔構材的尖端面彈性推壓該基板面;設置調整供給至該空腔之該分割空腔內的樹脂量的樹脂連通路的步驟;將已平坦化的樹脂材料一起供給至該空腔內之空腔底面的全面的步驟;在該空腔底面構材加壓前述空腔內的樹脂的時候,使該區隔構材的尖端面彈性按壓在基板面的步驟;在該區隔構材的尖端面彈性按壓在基板面時,用該樹脂連通路調整該分割空腔內的樹脂量的步驟; 在該區隔構材的尖端面彈性按壓在基板面時,在該空腔內壓縮成形的樹脂成形體形成對應於該區隔構材的形狀之溝部的步驟;將該半導體晶片壓縮成形於對應於該分割空腔的形狀之分割樹脂成形體的步驟。
- 如申請專利範圍第1項所述之半導體晶片的壓縮成形方法,其包括將樹脂材料個別供給至由該區隔構材分隔形成的分割空腔內。
- 一種半導體晶片的壓縮成形方法,其包括:準備區隔構材的步驟,其係用以藉由區隔空腔內以形成複數個分割空腔;在將該區隔構材彈性地推壓的狀態下,將該區隔構材設置於構成空腔底面的構材,以使得用以調整上述複數個分割空腔中各個內部的樹脂量的樹脂連通路能夠起作用,並且,使得該區隔構材從該空腔底面突出,此時,將該區隔構材中從該空腔底面起算的高度設定為,在由構成該空腔的底面的構材加壓該空腔內的樹脂的時候,使該區隔構材的尖端面按壓在基板上的步驟;將樹脂供應至前述空腔內的步驟;以構成該空腔的底面的構材加壓空腔內的樹脂的時候,藉由使該區隔構材的尖端面按壓在基板上,利用該樹脂連通路的功能調整前述複數的分割空腔內的樹脂量的步驟;藉由使前述樹脂硬化,形成具有對應於該區隔構材形 狀之溝部的前述樹脂成形體的步驟;該樹脂成形體包含由該溝部區隔出的複數個分割樹脂成形體,該複數個分割樹脂成形體之每一者將半導體晶片包於其內。
- 如申請專利範圍第3項所述之半導體晶片的壓縮成形方法,在前述將樹脂供應至前述空腔內的步驟中,將該樹脂同時提供至所有的該複數分割空腔。
- 如申請專利範圍第3項所述之半導體晶片的壓縮成形方法,在前述將樹脂供應至前述空腔內的步驟中,個別將該樹脂提供至該複數分割空腔中每一者。
- 一種半導體晶片之壓縮成形模具,其包括:具有設置於壓縮成形模具且朝向上方側的空腔開口部的壓縮成形用的空腔;設置於該空腔開口部的上方位置,並且,使裝設有半導體晶片的基板上的半導體晶片側面向下方的狀態下,供給設定的基板設定部;覆蓋該空腔內的離型薄膜;供給至覆蓋該離型薄膜的空腔內的樹脂材料;加熱該空腔內的樹脂材料的加熱裝置;藉由使該基板和該空腔閉合,將安裝在該基板上的半導體晶片浸漬在該空腔內的樹脂中的關模機構;以及從空腔的底面側加壓該空腔內的該樹脂之空腔底面構材;其於該空腔底面之特定位置,設置分隔該空腔以形成 分割空腔的區隔構材、調整供給至該分割空腔內的樹脂量的樹脂連通路、在該空腔底面構材將該區隔構材向模具面方向彈性施力的彈性機構,並且,將該區隔構材從該空腔底面起算的高度設定為使得在該空腔底面構材加壓時該區隔構材的尖端面推壓該基板面。
- 如申請專利範圍第6項所述之半導體晶片之壓縮成形模具,在區隔構材的尖端面設置樹脂連通路。
- 如申請專利範圍第6項所述之半導體晶片之壓縮成形模具,設置於區隔構材的尖端面的樹脂連通路為薄層狀的樹脂連通路。
- 如申請專利範圍第6項所述之半導體晶片之壓縮成形模具,在空腔底面構材以可自由裝卸的方式裝設區隔構材。
- 一種半導體晶片之壓縮成形模具,其包括:具有朝向上方側的開口部的空腔;設置於該開口部的上方位置,並且,使基板上的半導體晶片面向下方的狀態下,設定該基板的設定部;加熱預定要被供應到前述空腔內的樹脂材料的加熱裝置;藉由使該基板和前述空腔閉合,將安裝在該基板上的半導體晶片浸漬在由該加熱裝置形成之該空腔內的熔融樹脂中的機構;從空腔的底面加壓該空腔內的前述熔融樹脂之空腔底面構材; 設置於該空腔的底面之特定位置,且藉由分隔該空腔形成複數個分割空腔的區隔構材;以及調整該複數個分割空腔內的熔融樹脂的量的樹脂連通路;將該區隔構材對於該空腔底面構材彈性地推壓的機構;將該區隔構材中從該空腔底面起算的高度設定為,在由構成該空腔的底面的構材加壓該熔融樹脂的時候,使該區隔構材的尖端面按壓在基板面上。
- 如申請專利範圍第10項所述之半導體晶片之壓縮成形模具,前述樹脂連通路有縫隙形狀。
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JP2010231096A JP5237346B2 (ja) | 2010-10-14 | 2010-10-14 | 半導体チップの圧縮成形方法及び圧縮成形型 |
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TWI456640B true TWI456640B (zh) | 2014-10-11 |
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CN (1) | CN102456583A (zh) |
MY (1) | MY158239A (zh) |
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JP5682033B2 (ja) * | 2011-03-14 | 2015-03-11 | アピックヤマダ株式会社 | 樹脂封止装置 |
JP6242763B2 (ja) * | 2014-07-18 | 2017-12-06 | Towa株式会社 | 電子部品パッケージの製造方法 |
JP6525580B2 (ja) * | 2014-12-24 | 2019-06-05 | Towa株式会社 | 樹脂成形装置及び樹脂成形方法 |
CN108015943B (zh) * | 2016-10-28 | 2019-08-20 | 中国科学院声学研究所 | 一种用于拖拽线列阵的电子模块的灌封模具及方法 |
CN106881826B (zh) * | 2017-02-24 | 2022-11-11 | 日荣半导体(上海)有限公司 | 封装模具和使用该封装模具的注塑方法 |
JP6876637B2 (ja) * | 2018-01-22 | 2021-05-26 | Towa株式会社 | 成形型、樹脂成形装置及び樹脂成形品の製造方法 |
CN109016437B (zh) * | 2018-08-30 | 2024-07-09 | 谷田(广东)电子科技有限公司 | 头梁护套的制作模具及头梁护套的制备方法 |
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TW200839967A (en) * | 2006-12-13 | 2008-10-01 | Hitachi Cable | Singulation metal mold and method for producing semiconductor device |
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TW421833B (en) * | 1998-07-10 | 2001-02-11 | Apic Yamada Corp | Method of manufacturing semiconductor devices and resin molding machine |
JP3722058B2 (ja) * | 2001-12-07 | 2005-11-30 | ヤマハ株式会社 | 半導体素子の製造方法及び製造装置 |
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US7520052B2 (en) * | 2005-06-27 | 2009-04-21 | Texas Instruments Incorporated | Method of manufacturing a semiconductor device |
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TW201234448A (en) | 2012-08-16 |
KR20120038893A (ko) | 2012-04-24 |
JP2012081678A (ja) | 2012-04-26 |
SG180084A1 (en) | 2012-05-30 |
KR101311014B1 (ko) | 2013-09-24 |
MY158239A (en) | 2016-09-30 |
CN102456583A (zh) | 2012-05-16 |
JP5237346B2 (ja) | 2013-07-17 |
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