WO2008050726A1 - Nouveau composé aromatique à cycle fusionne, son procédé de production et son utilisation - Google Patents
Nouveau composé aromatique à cycle fusionne, son procédé de production et son utilisation Download PDFInfo
- Publication number
- WO2008050726A1 WO2008050726A1 PCT/JP2007/070569 JP2007070569W WO2008050726A1 WO 2008050726 A1 WO2008050726 A1 WO 2008050726A1 JP 2007070569 W JP2007070569 W JP 2007070569W WO 2008050726 A1 WO2008050726 A1 WO 2008050726A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- group
- general formula
- chemical
- compound
- atom
- Prior art date
Links
- 150000001491 aromatic compounds Chemical class 0.000 title abstract 4
- 238000000034 method Methods 0.000 title description 61
- 230000008569 process Effects 0.000 title description 8
- 150000001875 compounds Chemical class 0.000 claims abstract description 189
- 239000004065 semiconductor Substances 0.000 claims abstract description 162
- 239000000463 material Substances 0.000 claims abstract description 121
- 230000005669 field effect Effects 0.000 claims abstract description 41
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims abstract description 34
- 125000003118 aryl group Chemical group 0.000 claims abstract description 30
- 239000000126 substance Substances 0.000 claims description 120
- 238000004519 manufacturing process Methods 0.000 claims description 64
- 239000010409 thin film Substances 0.000 claims description 36
- 125000000217 alkyl group Chemical group 0.000 claims description 35
- 150000001787 chalcogens Chemical group 0.000 claims description 31
- 125000003342 alkenyl group Chemical group 0.000 claims description 29
- 239000003153 chemical reaction reagent Substances 0.000 claims description 29
- 125000005843 halogen group Chemical group 0.000 claims description 27
- 125000004414 alkyl thio group Chemical group 0.000 claims description 26
- 125000000304 alkynyl group Chemical group 0.000 claims description 26
- 125000003545 alkoxy group Chemical group 0.000 claims description 25
- 125000004429 atom Chemical group 0.000 claims description 25
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 25
- 125000000524 functional group Chemical group 0.000 claims description 24
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 18
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 claims description 12
- 239000011630 iodine Substances 0.000 claims description 12
- 229910052740 iodine Inorganic materials 0.000 claims description 12
- 239000007788 liquid Substances 0.000 claims description 11
- WQOXQRCZOLPYPM-UHFFFAOYSA-N dimethyl disulfide Chemical group CSSC WQOXQRCZOLPYPM-UHFFFAOYSA-N 0.000 claims description 8
- 229910052798 chalcogen Inorganic materials 0.000 claims description 7
- NAWXUBYGYWOOIX-SFHVURJKSA-N (2s)-2-[[4-[2-(2,4-diaminoquinazolin-6-yl)ethyl]benzoyl]amino]-4-methylidenepentanedioic acid Chemical compound C1=CC2=NC(N)=NC(N)=C2C=C1CCC1=CC=C(C(=O)N[C@@H](CC(=C)C(O)=O)C(O)=O)C=C1 NAWXUBYGYWOOIX-SFHVURJKSA-N 0.000 claims description 5
- 125000004434 sulfur atom Chemical group 0.000 claims description 5
- VLXBWPOEOIIREY-UHFFFAOYSA-N dimethyl diselenide Chemical compound C[Se][Se]C VLXBWPOEOIIREY-UHFFFAOYSA-N 0.000 claims description 4
- DQFBYFPFKXHELB-UHFFFAOYSA-N Chalcone Natural products C=1C=CC=CC=1C(=O)C=CC1=CC=CC=C1 DQFBYFPFKXHELB-UHFFFAOYSA-N 0.000 claims description 2
- 235000005513 chalcones Nutrition 0.000 claims description 2
- DQFBYFPFKXHELB-VAWYXSNFSA-N trans-chalcone Chemical compound C=1C=CC=CC=1C(=O)\C=C\C1=CC=CC=C1 DQFBYFPFKXHELB-VAWYXSNFSA-N 0.000 claims description 2
- 235000004347 Perilla Nutrition 0.000 claims 1
- 244000124853 Perilla frutescens Species 0.000 claims 1
- 239000002904 solvent Substances 0.000 abstract description 26
- 125000000623 heterocyclic group Chemical group 0.000 abstract description 12
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 6
- 229910052760 oxygen Inorganic materials 0.000 abstract description 6
- 239000001301 oxygen Substances 0.000 abstract description 6
- 230000009878 intermolecular interaction Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 177
- 239000000758 substrate Substances 0.000 description 54
- 238000006243 chemical reaction Methods 0.000 description 41
- -1 polycyclic aromatic compound Chemical class 0.000 description 39
- 239000000243 solution Substances 0.000 description 37
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 36
- 230000015572 biosynthetic process Effects 0.000 description 34
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 27
- 239000010408 film Substances 0.000 description 27
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 24
- 238000003786 synthesis reaction Methods 0.000 description 21
- 239000007787 solid Substances 0.000 description 18
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 18
- 239000011241 protective layer Substances 0.000 description 17
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 16
- 238000000746 purification Methods 0.000 description 16
- 229910052710 silicon Inorganic materials 0.000 description 16
- 239000010703 silicon Substances 0.000 description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 15
- MZRVEZGGRBJDDB-UHFFFAOYSA-N N-Butyllithium Chemical compound [Li]CCCC MZRVEZGGRBJDDB-UHFFFAOYSA-N 0.000 description 14
- 238000005481 NMR spectroscopy Methods 0.000 description 14
- 230000006870 function Effects 0.000 description 14
- 239000011347 resin Substances 0.000 description 14
- 229920005989 resin Polymers 0.000 description 14
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 13
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 13
- 230000005525 hole transport Effects 0.000 description 12
- 238000010992 reflux Methods 0.000 description 12
- 238000010438 heat treatment Methods 0.000 description 11
- 229910052757 nitrogen Inorganic materials 0.000 description 11
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 10
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 10
- 239000005977 Ethylene Substances 0.000 description 10
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 10
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 9
- 238000001914 filtration Methods 0.000 description 9
- 238000002844 melting Methods 0.000 description 9
- 239000000203 mixture Substances 0.000 description 9
- 239000002994 raw material Substances 0.000 description 9
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 8
- 238000002451 electron ionisation mass spectrometry Methods 0.000 description 8
- 238000002347 injection Methods 0.000 description 8
- 239000007924 injection Substances 0.000 description 8
- 230000008018 melting Effects 0.000 description 8
- 230000000704 physical effect Effects 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical class [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 239000011669 selenium Substances 0.000 description 7
- 238000000859 sublimation Methods 0.000 description 7
- 230000008022 sublimation Effects 0.000 description 7
- 239000011701 zinc Substances 0.000 description 7
- 229910052725 zinc Inorganic materials 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000000969 carrier Substances 0.000 description 6
- 229940125782 compound 2 Drugs 0.000 description 6
- 238000001816 cooling Methods 0.000 description 6
- 229910052737 gold Inorganic materials 0.000 description 6
- 239000010931 gold Substances 0.000 description 6
- 239000012044 organic layer Substances 0.000 description 6
- 229920006395 saturated elastomer Polymers 0.000 description 6
- 235000012239 silicon dioxide Nutrition 0.000 description 6
- XJDNKRIXUMDJCW-UHFFFAOYSA-J titanium tetrachloride Chemical compound Cl[Ti](Cl)(Cl)Cl XJDNKRIXUMDJCW-UHFFFAOYSA-J 0.000 description 6
- 238000001771 vacuum deposition Methods 0.000 description 6
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- 238000000151 deposition Methods 0.000 description 5
- BOCFGAMKSYQRCI-UHFFFAOYSA-N dinaphtho[2,3-b:2',3'-d]furan Chemical compound C1=CC=C2C=C3C4=CC5=CC=CC=C5C=C4OC3=CC2=C1 BOCFGAMKSYQRCI-UHFFFAOYSA-N 0.000 description 5
- CZWHMRTTWFJMBC-UHFFFAOYSA-N dinaphtho[2,3-b:2',3'-f]thieno[3,2-b]thiophene Chemical compound C1=CC=C2C=C(SC=3C4=CC5=CC=CC=C5C=C4SC=33)C3=CC2=C1 CZWHMRTTWFJMBC-UHFFFAOYSA-N 0.000 description 5
- 230000003993 interaction Effects 0.000 description 5
- 229910052744 lithium Inorganic materials 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 238000003541 multi-stage reaction Methods 0.000 description 5
- 238000000059 patterning Methods 0.000 description 5
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 5
- 238000010898 silica gel chromatography Methods 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 5
- 238000012546 transfer Methods 0.000 description 5
- JOJRXIBRTRSVKZ-UHFFFAOYSA-N 2-methylsulfanyl-3-[2-(3-methylsulfanylnaphthalen-2-yl)ethenyl]naphthalene Chemical group C1=CC=C2C=C(SC)C(C=CC3=CC4=CC=CC=C4C=C3SC)=CC2=C1 JOJRXIBRTRSVKZ-UHFFFAOYSA-N 0.000 description 4
- XWUYJMONJUOJCD-UHFFFAOYSA-N 6-methyl-3-methylsulfanylnaphthalene-2-carbaldehyde Chemical compound CC1=CC=C2C=C(C=O)C(SC)=CC2=C1 XWUYJMONJUOJCD-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000004952 Polyamide Substances 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 4
- 229910052804 chromium Inorganic materials 0.000 description 4
- 239000011651 chromium Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 229940125904 compound 1 Drugs 0.000 description 4
- 239000000470 constituent Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 239000000706 filtrate Substances 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 229910052749 magnesium Inorganic materials 0.000 description 4
- 239000011777 magnesium Substances 0.000 description 4
- 125000002816 methylsulfanyl group Chemical group [H]C([H])([H])S[*] 0.000 description 4
- 239000000123 paper Substances 0.000 description 4
- 229920002647 polyamide Polymers 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 238000003980 solgel method Methods 0.000 description 4
- 125000001424 substituent group Chemical group 0.000 description 4
- 238000011282 treatment Methods 0.000 description 4
- 238000007740 vapor deposition Methods 0.000 description 4
- FANCTJAFZSYTIS-IQUVVAJASA-N (1r,3s,5z)-5-[(2e)-2-[(1r,3as,7ar)-7a-methyl-1-[(2r)-4-(phenylsulfonimidoyl)butan-2-yl]-2,3,3a,5,6,7-hexahydro-1h-inden-4-ylidene]ethylidene]-4-methylidenecyclohexane-1,3-diol Chemical compound C([C@@H](C)[C@@H]1[C@]2(CCCC(/[C@@H]2CC1)=C\C=C\1C([C@@H](O)C[C@H](O)C/1)=C)C)CS(=N)(=O)C1=CC=CC=C1 FANCTJAFZSYTIS-IQUVVAJASA-N 0.000 description 3
- WWIKFXPBGKBXLZ-UHFFFAOYSA-N 6-methylnaphthalene-2-carbaldehyde Chemical compound C1=C(C=O)C=CC2=CC(C)=CC=C21 WWIKFXPBGKBXLZ-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 3
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- DWAQJAXMDSEUJJ-UHFFFAOYSA-M Sodium bisulfite Chemical compound [Na+].OS([O-])=O DWAQJAXMDSEUJJ-UHFFFAOYSA-M 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 239000011575 calcium Substances 0.000 description 3
- 229910052791 calcium Inorganic materials 0.000 description 3
- 238000004440 column chromatography Methods 0.000 description 3
- 229940126214 compound 3 Drugs 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- UAOMVDZJSHZZME-UHFFFAOYSA-N diisopropylamine Chemical compound CC(C)NC(C)C UAOMVDZJSHZZME-UHFFFAOYSA-N 0.000 description 3
- 239000002019 doping agent Substances 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 235000019000 fluorine Nutrition 0.000 description 3
- 125000002485 formyl group Chemical group [H]C(*)=O 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 125000003357 methylseleno group Chemical group [H]C([H])([H])[Se][*] 0.000 description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 3
- YNPNZTXNASCQKK-UHFFFAOYSA-N phenanthrene Chemical compound C1=CC=C2C3=CC=CC=C3C=CC2=C1 YNPNZTXNASCQKK-UHFFFAOYSA-N 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 229920001197 polyacetylene Polymers 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 229920000515 polycarbonate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000001953 recrystallisation Methods 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- QKDYDXJISKWZQE-UHFFFAOYSA-N selenopheno[3,2-b]selenophene Chemical compound [se]1C=CC2=C1C=C[se]2 QKDYDXJISKWZQE-UHFFFAOYSA-N 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 229940079827 sodium hydrogen sulfite Drugs 0.000 description 3
- 235000010267 sodium hydrogen sulphite Nutrition 0.000 description 3
- 229910052717 sulfur Inorganic materials 0.000 description 3
- VJYJJHQEVLEOFL-UHFFFAOYSA-N thieno[3,2-b]thiophene Chemical compound S1C=CC2=C1C=CS2 VJYJJHQEVLEOFL-UHFFFAOYSA-N 0.000 description 3
- 238000007738 vacuum evaporation Methods 0.000 description 3
- NGQSLSMAEVWNPU-YTEMWHBBSA-N 1,2-bis[(e)-2-phenylethenyl]benzene Chemical compound C=1C=CC=CC=1/C=C/C1=CC=CC=C1\C=C\C1=CC=CC=C1 NGQSLSMAEVWNPU-YTEMWHBBSA-N 0.000 description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 2
- ISPYQTSUDJAMAB-UHFFFAOYSA-N 2-chlorophenol Chemical compound OC1=CC=CC=C1Cl ISPYQTSUDJAMAB-UHFFFAOYSA-N 0.000 description 2
- PJKVFARRVXDXAD-UHFFFAOYSA-N 2-naphthaldehyde Chemical compound C1=CC=CC2=CC(C=O)=CC=C21 PJKVFARRVXDXAD-UHFFFAOYSA-N 0.000 description 2
- MKFDXMSXDXBYSD-UHFFFAOYSA-N 6-methyl-2-[2-(6-methyl-3-methylsulfanylnaphthalen-2-yl)ethenyl]-3-methylsulfanylnaphthalene Chemical group C1=C(C)C=C2C=C(SC)C(C=CC3=CC4=CC=C(C)C=C4C=C3SC)=CC2=C1 MKFDXMSXDXBYSD-UHFFFAOYSA-N 0.000 description 2
- 229920003026 Acene Polymers 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000004695 Polyether sulfone Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- YLEIFZAVNWDOBM-ZTNXSLBXSA-N ac1l9hc7 Chemical compound C([C@H]12)C[C@@H](C([C@@H](O)CC3)(C)C)[C@@]43C[C@@]14CC[C@@]1(C)[C@@]2(C)C[C@@H]2O[C@]3(O)[C@H](O)C(C)(C)O[C@@H]3[C@@H](C)[C@H]12 YLEIFZAVNWDOBM-ZTNXSLBXSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000001299 aldehydes Chemical group 0.000 description 2
- 239000010405 anode material Substances 0.000 description 2
- 150000007514 bases Chemical class 0.000 description 2
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- OSVHLUXLWQLPIY-KBAYOESNSA-N butyl 2-[(6aR,9R,10aR)-1-hydroxy-9-(hydroxymethyl)-6,6-dimethyl-6a,7,8,9,10,10a-hexahydrobenzo[c]chromen-3-yl]-2-methylpropanoate Chemical compound C(CCC)OC(C(C)(C)C1=CC(=C2[C@H]3[C@H](C(OC2=C1)(C)C)CC[C@H](C3)CO)O)=O OSVHLUXLWQLPIY-KBAYOESNSA-N 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 229920001940 conductive polymer Polymers 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 239000012043 crude product Substances 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000000609 electron-beam lithography Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000004210 ether based solvent Substances 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 238000007641 inkjet printing Methods 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000000543 intermediate Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000006263 metalation reaction Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- VRDKYJSLDJDLML-UHFFFAOYSA-N methylselenol Chemical compound [Se]C VRDKYJSLDJDLML-UHFFFAOYSA-N 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- 239000012046 mixed solvent Substances 0.000 description 2
- HVOYZOQVDYHUPF-UHFFFAOYSA-N n,n',n'-trimethylethane-1,2-diamine Chemical compound CNCCN(C)C HVOYZOQVDYHUPF-UHFFFAOYSA-N 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 238000007645 offset printing Methods 0.000 description 2
- 239000012074 organic phase Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000012071 phase Substances 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920006393 polyether sulfone Polymers 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 239000011591 potassium Substances 0.000 description 2
- 229910052700 potassium Inorganic materials 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 239000011541 reaction mixture Substances 0.000 description 2
- 238000005215 recombination Methods 0.000 description 2
- 230000006798 recombination Effects 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 229910052711 selenium Inorganic materials 0.000 description 2
- MABNMNVCOAICNO-UHFFFAOYSA-N selenophene Chemical group C=1C=C[se]C=1 MABNMNVCOAICNO-UHFFFAOYSA-N 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 229910000029 sodium carbonate Inorganic materials 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- KZNICNPSHKQLFF-UHFFFAOYSA-N succinimide Chemical compound O=C1CCC(=O)N1 KZNICNPSHKQLFF-UHFFFAOYSA-N 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 2
- FYSNRJHAOHDILO-UHFFFAOYSA-N thionyl chloride Chemical compound ClS(Cl)=O FYSNRJHAOHDILO-UHFFFAOYSA-N 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- SCYULBFZEHDVBN-UHFFFAOYSA-N 1,1-Dichloroethane Chemical compound CC(Cl)Cl SCYULBFZEHDVBN-UHFFFAOYSA-N 0.000 description 1
- GQEZCXVZFLOKMC-UHFFFAOYSA-N 1-hexadecene Chemical group CCCCCCCCCCCCCCC=C GQEZCXVZFLOKMC-UHFFFAOYSA-N 0.000 description 1
- IBXNCJKFFQIKKY-UHFFFAOYSA-N 1-pentyne Chemical group CCCC#C IBXNCJKFFQIKKY-UHFFFAOYSA-N 0.000 description 1
- 238000001644 13C nuclear magnetic resonance spectroscopy Methods 0.000 description 1
- 238000005160 1H NMR spectroscopy Methods 0.000 description 1
- YGYNBBAUIYTWBF-UHFFFAOYSA-N 2,6-dimethyl naphthalene Natural products C1=C(C)C=CC2=CC(C)=CC=C21 YGYNBBAUIYTWBF-UHFFFAOYSA-N 0.000 description 1
- DIMCZPYICJYSFJ-UHFFFAOYSA-N 2,6-dimethylnaphthalene Chemical compound C1=CC(C)=CC2=C[CH]C(C)=C=C21 DIMCZPYICJYSFJ-UHFFFAOYSA-N 0.000 description 1
- HIXDQWDOVZUNNA-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-hydroxy-7-methoxychromen-4-one Chemical compound C=1C(OC)=CC(O)=C(C(C=2)=O)C=1OC=2C1=CC=C(OC)C(OC)=C1 HIXDQWDOVZUNNA-UHFFFAOYSA-N 0.000 description 1
- WXVYIUWVQRUEBW-UHFFFAOYSA-N 2-(bromomethyl)-6-methylnaphthalene Chemical compound C1=C(CBr)C=CC2=CC(C)=CC=C21 WXVYIUWVQRUEBW-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 125000001622 2-naphthyl group Chemical group [H]C1=C([H])C([H])=C2C([H])=C(*)C([H])=C([H])C2=C1[H] 0.000 description 1
- VEQJRCRMCYYJMV-UHFFFAOYSA-N 3,4-bis(2-phenylethenyl)benzene-1,2-diamine Chemical compound C=1C=CC=CC=1C=CC1=C(N)C(N)=CC=C1C=CC1=CC=CC=C1 VEQJRCRMCYYJMV-UHFFFAOYSA-N 0.000 description 1
- LDDNRNSKVVDQCS-UHFFFAOYSA-N 3-methylsulfanylnaphthalene-2-carbaldehyde Chemical compound C1=CC=C2C=C(C=O)C(SC)=CC2=C1 LDDNRNSKVVDQCS-UHFFFAOYSA-N 0.000 description 1
- ICTXTLJJZYZRQT-UHFFFAOYSA-N 4-methylsulfanylnaphthalene-2-carbaldehyde Chemical compound CSC1=CC(=CC2=CC=CC=C12)C=O ICTXTLJJZYZRQT-UHFFFAOYSA-N 0.000 description 1
- AAFVYQRQJBENSZ-UHFFFAOYSA-N 6-methylnaphthalene-2-carbaldehyde Chemical compound CC=1C=C2C=CC(=CC2=CC1)C=O.CC=1C=C2C=CC(=CC2=CC1)C=O AAFVYQRQJBENSZ-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- XMWRBQBLMFGWIX-UHFFFAOYSA-N C60 fullerene Chemical compound C12=C3C(C4=C56)=C7C8=C5C5=C9C%10=C6C6=C4C1=C1C4=C6C6=C%10C%10=C9C9=C%11C5=C8C5=C8C7=C3C3=C7C2=C1C1=C2C4=C6C4=C%10C6=C9C9=C%11C5=C5C8=C3C3=C7C1=C1C2=C4C6=C2C9=C5C3=C12 XMWRBQBLMFGWIX-UHFFFAOYSA-N 0.000 description 1
- 229920002284 Cellulose triacetate Polymers 0.000 description 1
- 241000282693 Cercopithecidae Species 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 206010011703 Cyanosis Diseases 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 1
- 229910052691 Erbium Inorganic materials 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- 229910052693 Europium Inorganic materials 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 208000033962 Fontaine progeroid syndrome Diseases 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L Magnesium chloride Chemical compound [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 101710100266 Serine/threonine-protein phosphatase 6 catalytic subunit Proteins 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 229910002367 SrTiO Inorganic materials 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 229910052769 Ytterbium Inorganic materials 0.000 description 1
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 1
- DGEZNRSVGBDHLK-UHFFFAOYSA-N [1,10]phenanthroline Chemical compound C1=CN=C2C3=NC=CC=C3C=CC2=C1 DGEZNRSVGBDHLK-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- BYAHGBISZMGZJN-UHFFFAOYSA-N acetyl acetate;hexane Chemical compound CCCCCC.CC(=O)OC(C)=O BYAHGBISZMGZJN-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 1
- 125000005427 anthranyl group Chemical group 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 150000003934 aromatic aldehydes Chemical class 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000006399 behavior Effects 0.000 description 1
- 150000001555 benzenes Chemical class 0.000 description 1
- JRXXLCKWQFKACW-UHFFFAOYSA-N biphenylacetylene Chemical group C1=CC=CC=C1C#CC1=CC=CC=C1 JRXXLCKWQFKACW-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000008280 blood Substances 0.000 description 1
- 210000004369 blood Anatomy 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000012267 brine Substances 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- KDKYADYSIPSCCQ-UHFFFAOYSA-N but-1-yne Chemical group CCC#C KDKYADYSIPSCCQ-UHFFFAOYSA-N 0.000 description 1
- ANUZKYYBDVLEEI-UHFFFAOYSA-N butane;hexane;lithium Chemical compound [Li]CCCC.CCCCCC ANUZKYYBDVLEEI-UHFFFAOYSA-N 0.000 description 1
- 229910052792 caesium Inorganic materials 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000010406 cathode material Substances 0.000 description 1
- 150000004770 chalcogenides Chemical class 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000007806 chemical reaction intermediate Substances 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- 238000006356 dehydrogenation reaction Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000002274 desiccant Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- DNGRSVWAENAWJR-UHFFFAOYSA-N dianthra[2,3-b:2',3'-f]thieno[3,2-b]thiophene Chemical compound C1=CC=C2C=C(C=C3C(C=4SC=5C(C=4S3)=CC3=CC4=CC=CC=C4C=C3C=5)=C3)C3=CC2=C1 DNGRSVWAENAWJR-UHFFFAOYSA-N 0.000 description 1
- 238000004455 differential thermal analysis Methods 0.000 description 1
- 229940043279 diisopropylamine Drugs 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000002612 dispersion medium Substances 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000000921 elemental analysis Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 125000004705 ethylthio group Chemical group C(C)S* 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 229910003472 fullerene Inorganic materials 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000005283 ground state Effects 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 229910052809 inorganic oxide Inorganic materials 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- PNDPGZBMCMUPRI-UHFFFAOYSA-N iodine Chemical compound II PNDPGZBMCMUPRI-UHFFFAOYSA-N 0.000 description 1
- INQOMBQAUSQDDS-UHFFFAOYSA-N iodomethane Chemical compound IC INQOMBQAUSQDDS-UHFFFAOYSA-N 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 125000003253 isopropoxy group Chemical group [H]C([H])([H])C([H])(O*)C([H])([H])[H] 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 238000007644 letterpress printing Methods 0.000 description 1
- 239000012280 lithium aluminium hydride Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- SJCKRGFTWFGHGZ-UHFFFAOYSA-N magnesium silver Chemical compound [Mg].[Ag] SJCKRGFTWFGHGZ-UHFFFAOYSA-N 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000004949 mass spectrometry Methods 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- DVSDBMFJEQPWNO-UHFFFAOYSA-N methyllithium Chemical compound C[Li] DVSDBMFJEQPWNO-UHFFFAOYSA-N 0.000 description 1
- 238000000813 microcontact printing Methods 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001451 molecular beam epitaxy Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 238000007040 multi-step synthesis reaction Methods 0.000 description 1
- APVPOHHVBBYQAV-UHFFFAOYSA-N n-(4-aminophenyl)sulfonyloctadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(=O)NS(=O)(=O)C1=CC=C(N)C=C1 APVPOHHVBBYQAV-UHFFFAOYSA-N 0.000 description 1
- 125000006606 n-butoxy group Chemical group 0.000 description 1
- 125000004708 n-butylthio group Chemical group C(CCC)S* 0.000 description 1
- 125000003935 n-pentoxy group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])O* 0.000 description 1
- 125000004712 n-pentylthio group Chemical group C(CCCC)S* 0.000 description 1
- 125000003506 n-propoxy group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])O* 0.000 description 1
- 125000004706 n-propylthio group Chemical group C(CC)S* 0.000 description 1
- 150000004002 naphthaldehydes Chemical class 0.000 description 1
- 150000002790 naphthalenes Chemical class 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- VOFUROIFQGPCGE-UHFFFAOYSA-N nile red Chemical compound C1=CC=C2C3=NC4=CC=C(N(CC)CC)C=C4OC3=CC(=O)C2=C1 VOFUROIFQGPCGE-UHFFFAOYSA-N 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 1
- SLIUAWYAILUBJU-UHFFFAOYSA-N pentacene Chemical compound C1=CC=CC2=CC3=CC4=CC5=CC=CC=C5C=C4C=C3C=C21 SLIUAWYAILUBJU-UHFFFAOYSA-N 0.000 description 1
- 125000004817 pentamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 150000002987 phenanthrenes Chemical class 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920000052 poly(p-xylylene) Polymers 0.000 description 1
- 229920000553 poly(phenylenevinylene) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 125000003367 polycyclic group Chemical group 0.000 description 1
- 229920000015 polydiacetylene Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920000417 polynaphthalene Polymers 0.000 description 1
- 229920000128 polypyrrole Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920000123 polythiophene Polymers 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- MWWATHDPGQKSAR-UHFFFAOYSA-N propyne Chemical group CC#C MWWATHDPGQKSAR-UHFFFAOYSA-N 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 210000001525 retina Anatomy 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052706 scandium Inorganic materials 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
- 235000017557 sodium bicarbonate Nutrition 0.000 description 1
- HPALAKNZSZLMCH-UHFFFAOYSA-M sodium;chloride;hydrate Chemical compound O.[Na+].[Cl-] HPALAKNZSZLMCH-UHFFFAOYSA-M 0.000 description 1
- 238000002174 soft lithography Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- 229960002317 succinimide Drugs 0.000 description 1
- 238000001308 synthesis method Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229910001936 tantalum oxide Inorganic materials 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- GKTQKQTXHNUFSP-UHFFFAOYSA-N thieno[3,4-c]pyrrole-4,6-dione Chemical compound S1C=C2C(=O)NC(=O)C2=C1 GKTQKQTXHNUFSP-UHFFFAOYSA-N 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- YONPGGFAJWQGJC-UHFFFAOYSA-K titanium(iii) chloride Chemical compound Cl[Ti](Cl)Cl YONPGGFAJWQGJC-UHFFFAOYSA-K 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C319/00—Preparation of thiols, sulfides, hydropolysulfides or polysulfides
- C07C319/14—Preparation of thiols, sulfides, hydropolysulfides or polysulfides of sulfides
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C319/00—Preparation of thiols, sulfides, hydropolysulfides or polysulfides
- C07C319/14—Preparation of thiols, sulfides, hydropolysulfides or polysulfides of sulfides
- C07C319/20—Preparation of thiols, sulfides, hydropolysulfides or polysulfides of sulfides by reactions not involving the formation of sulfide groups
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C321/00—Thiols, sulfides, hydropolysulfides or polysulfides
- C07C321/24—Thiols, sulfides, hydropolysulfides, or polysulfides having thio groups bound to carbon atoms of six-membered aromatic rings
- C07C321/28—Sulfides, hydropolysulfides, or polysulfides having thio groups bound to carbon atoms of six-membered aromatic rings
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C323/00—Thiols, sulfides, hydropolysulfides or polysulfides substituted by halogen, oxygen or nitrogen atoms, or by sulfur atoms not being part of thio groups
- C07C323/22—Thiols, sulfides, hydropolysulfides or polysulfides substituted by halogen, oxygen or nitrogen atoms, or by sulfur atoms not being part of thio groups containing thio groups and doubly-bound oxygen atoms bound to the same carbon skeleton
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C391/00—Compounds containing selenium
- C07C391/02—Compounds containing selenium having selenium atoms bound to carbon atoms of six-membered aromatic rings
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D495/00—Heterocyclic compounds containing in the condensed system at least one hetero ring having sulfur atoms as the only ring hetero atoms
- C07D495/02—Heterocyclic compounds containing in the condensed system at least one hetero ring having sulfur atoms as the only ring hetero atoms in which the condensed system contains two hetero rings
- C07D495/04—Ortho-condensed systems
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D517/00—Heterocyclic compounds containing in the condensed system at least one hetero ring having selenium, tellurium, or halogen atoms as ring hetero atoms
- C07D517/02—Heterocyclic compounds containing in the condensed system at least one hetero ring having selenium, tellurium, or halogen atoms as ring hetero atoms in which the condensed system contains two hetero rings
- C07D517/04—Ortho-condensed systems
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/484—Insulated gate field-effect transistors [IGFETs] characterised by the channel regions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/30—Organic light-emitting transistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/60—Organic compounds having low molecular weight
- H10K85/649—Aromatic compounds comprising a hetero atom
- H10K85/657—Polycyclic condensed heteroaromatic hydrocarbons
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/60—Organic compounds having low molecular weight
- H10K85/649—Aromatic compounds comprising a hetero atom
- H10K85/657—Polycyclic condensed heteroaromatic hydrocarbons
- H10K85/6576—Polycyclic condensed heteroaromatic hydrocarbons comprising only sulfur in the heteroaromatic polycondensed ring system, e.g. benzothiophene
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/917—Electroluminescent
Definitions
- Novel condensed polycyclic aromatic compound process for producing the same, and use thereof
- the present invention relates to a novel condensed polycyclic aromatic compound, a method for producing the same, and use thereof, and more specifically, has electrical, electronic, and photoelectric properties and is soluble.
- the present invention relates to a novel condensed polycyclic aromatic compound that can be used as a high organic semiconductor material, a simple production method thereof, and use thereof.
- the field effect mobility affects the charge transport efficiency, and is important for realizing high-efficiency light emission and low-voltage driving.
- field effect mobility directly affects the switching speed and the performance of the driven device, so it is very important to improve field effect mobility when putting organic FET devices into practical use. .
- the organic semiconductor material one using an existing compound or one obtained by modifying an existing compound has been used.
- polyacene such as pentacene has been used as a material for a semiconductor layer. It was.
- the number of condensed rings increases, the field effect mobility of an organic semiconductor using the above materials is improved. This is because the interaction between molecules is strengthened by the expansion of the ⁇ -electron system. Therefore, in order to improve field effect mobility in organic semiconductors, a method of increasing the number of condensed rings can be considered.
- Patent Document 1 discloses that this is an excellent material having both characteristics and excellent transistor characteristics (high field-effect mobility, high on / off ratio, low threshold and swing).
- Non-Patent Document 12 describes a compound in which both X 1 and X 2 in the following formula (2) of the present application are sulfur atoms and all of R 1 to R 12 are hydrogen atoms. It is described in Non-Patent Document 13 that the structural formula of this compound is incorrect and that the compound is a structural isomer of the following formula (2) of the present application.
- Patent Documents 2 and 3 and Non-Patent Document 111 all require multi-step synthesis, and it is necessary to construct molecules in stages. This is a very time-consuming method and there is a problem that it is not a practical manufacturing method. That is, a method for easily producing an organic semiconductor material capable of achieving sufficient field effect mobility has not yet been established!
- Patent Document 1 Pamphlet of International Publication No. 2006/077888 (published July 27, 2006)
- Patent Document 2 Japanese Patent Publication “JP 2001-261794 (published September 26, 2001)”
- Patent Document 3 Japanese Patent Gazette “International Publication No. 2006/031893 Pamphlet (published March 23, 2006)”
- Non-patent literature l Mazaki, ⁇ ; obayashi, ⁇ ⁇ , Tetrahedron Lett. 1989, 30, 3315-3318 ⁇
- Non-Patent Document 2 Kobayashi, K. Phosp. Sulf., Silicon and the Related Elements 1989, 4 3, 187-208.
- Non-Patent Document 3 Mazaki, Y .; obayashi, K.J. Chem. So, Perkin Trans.2, 1992, 761-764.
- Non-Patent Document 4 Mazaki, Y .; Hayashi, ⁇ ; Kobayashi, K., J. Chem. Soc, Chem. Comm un. 1992, 1381-1383.
- Non-specific S No. 5 Mazaki, Y .; Awaga,.; Kobayashi, K., J. Chem. Soc, Chem. Commu n. 1992, 1661-1663.
- Non-Patent Document 6 Zhang, X .; Matzger, AJ, J. Org. Chem. 2003, 68, 9813-9815
- Non-Patent Document 7 Zhang, X .; Cote, AP; Matzger, AJj, J. Am. Chem. Soc. 2005, 12
- Non-Patent Document 8 Xiao, K .; Liu, Y .; Qi, ⁇ ; Zhang, V .; Wang, F .; Gao, J .; Qiu, V .; Ma, Y .; Cui, G .; Chen, S .; Zhan, X .; Yu, G .; Qin, J .; Hu, W .; Zhu, D., J. Am. Chem. Soc. 2005, 127, 13281-13286.
- Non-Patent Document 9 Oyaizu, K .; Iwasaki, ⁇ ⁇ ; Tsukahara, Y .; Tsuchida, ⁇ ⁇ , Macromolecules 2004, 37, 1257-1270.
- Non-Patent Document 10 Okamoto, T .; Kudoh,.; Wakamiya, A .; Yamaguchi, S., Org. Lett. 2005, 7, 5301-5304.
- Non-Patent Document 11 Kudoh, K .; Okamoto, ⁇ ; Yamaguchi, S., Organometallics 2006, 25, 2374-2377.
- Non-Patent Document 12 Horton, A. W., J. Org. Chem., 1949, 14, 761-770 ⁇
- Non-Patent Document 13 Murthy, T. S .; Pandya, J .; Tilak, B. D., J. Sci. Industr. Res., 196
- the present invention has been made in view of the above-described conventional problems, and its object is to provide a compound having electrical, electronic, and photoelectric properties that can be used as a semiconductor material, a simple production method thereof, and To provide its use.
- a novel condensed polycyclic aromatic compound having an aromatic ring on the outside of the BXBX skeleton, and a BXBX skeleton An object of the present invention is to provide a novel condensed polycyclic aromatic compound having a heterocyclic ring moiety as a heterocyclic ring, a method for producing the same, and use thereof.
- the compound according to the present invention has the general formula (1)
- [0014] is a compound having a structure in which a benzene ring is condensed to at least one of the benzene ring portions of the benzodichalcogenophenobenzodichalcogenophene skeleton represented by the formula: , X 1 and X 2 are each independently a chalcogen atom, and the hydrogen atom of the benzene ring is selected from the group consisting of a halogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, an alkyloxy group and an alkylthio group It is characterized by the fact that it is substituted with an atom or a functional group! /, Or may! / (In the general formula (1)! /, Both X 1 and X 2 are sulfur atoms In this case, the compound represented by the general formula (1) is represented by the following general formula (2):
- R 1 to R 12 are each independently composed of a hydrogen atom, a halogen atom, an arolequinol group, an alkenyl group, an alkynyl group, an aryleno group, an alkyloxy group, and an alkylthio group. (At least one atom or functional group selected from the group)
- x 1 and x 2 are each independently a chalcogen atom
- Each of R 1 to R 12 is independently at least one atom or functional group selected from the group consisting of a hydrogen atom, a halogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, an alkyloxy group, and an alkylthio group. It is preferable that
- X 1 and X 2 are each independently a chalcogen atom, and each of R 13 to R 28 is independently a hydrogen atom, a halogen atom, an alkyl group, an alkenyl group, or an alkynole group. And at least one atom or functional group selected from the group consisting of an aryl group, an alkyloxy group, and an alkylthio group.
- the compound according to the present invention has the general formula (4)
- X 1 and X 2 are each independently a chalcogen atom, and each of R 29 to R 44 is independently a hydrogen atom, a halogen atom, an alkyl group, an alkenyl group, or an alkynole group. And at least one atom or functional group selected from the group consisting of an aryl group, an alkyloxy group, and an alkylthio group.
- Each of X 3 to X 8 is independently a chalcogen atom.
- the compounds represented by the general formulas (1) to (5) are compounds having an aromatic ring further outside the BXBX skeleton, or the benzene ring portion of the BXBX skeleton is a heterocyclic ring. It is a compound.
- Such a new condensed polycyclic aromatic compound having a condensed ring more than BXBX can strengthen the interaction between molecules by extending the ⁇ electron system. For this reason, when used as a material for an organic semiconductor device, the field effect mobility of the organic semiconductor is improved, so that it can be used as a very useful material for developing a new organic semiconductor device.
- the condensed polycyclic aromatic compound has a large number of condensed rings
- a compound having a very large number of condensed rings generally exhibits an atmospheric stability due to a high affinity with oxygen. There is no reduction. Therefore, it can be suitably used as an organic semiconductor material.
- the method for producing a compound according to the present invention has the general formula (6) [0032]
- X 9 is a chalcogen atom
- Ar is a structure in which one or more benzene rings are condensed, and the hydrogen atom of the benzene ring is selected from the group consisting of a halogen atom, an alkenoquino group, an alkenyl group, an alkynyl group, an aryleno group, an alkyloxy group, and an alkylthio group.
- Chemical structure optionally substituted by atoms or functional groups,
- X 1U and X 11 are each independently a chalcogen atom.
- a compound represented by the general formula (7) can be efficiently produced by introducing chalcogen atoms efficiently. Since the compound represented by the general formula (7) becomes an intermediate of the compound represented by the general formula (16) described later, it can be preferably used as a material for the condensed polycyclic aromatic compound.
- X 12 to X 17 are independently chalcogen atoms, and R 45 to R 66 are And at least one atom or functional group selected from the group consisting of a hydrogen atom, a halogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, an alkyloxy group, and an alkylthio group)
- the method for producing a compound according to the present invention comprises reacting the compounds represented by the general formula (7) obtained by the above-described method for producing a compound with the general formula (16).
- x 18 and X 19 are each independently a chalcogen atom
- Ar is independently a structure in which one or more benzene rings are condensed, and the hydrogen atom of the benzene ring is a halogen atom.
- a chemical structure optionally substituted by an atom or a functional group selected from the group consisting of an alkyl group, an alkenyl group, an alkynyl group, an aryl group, an alkyloxy group and an alkylthio group,
- a compound having an aromatic ring on the outside of the BXBX skeleton or a compound in which the benzene ring portion of the BXBX skeleton is a heterocyclic ring can be easily prepared without using a multi-step reaction. Can be manufactured.
- the above method since it is difficult for impurities to be mixed into the obtained compound, it is possible to obtain a compound with high purity.
- the liquid chalcogen atom-containing reagent is preferably dimethylenoresinreflex or dimethylenoreselenide.
- the organic semiconductor material of the present invention contains at least one compound selected from the compounds represented by the general formulas (1) to (5) and the compound obtained by the method for producing the compound. It is characterized by.
- the above compound is a condensed polycyclic aromatic compound having a condensed ring more than BXBX, and the interaction between molecules is strengthened by expansion of the ⁇ electron system. Therefore, the organic semiconductor material has a high field effect mobility.
- the above compounds have a large number of condensed rings, generally, there is no deterioration in atmospheric stability due to the high affinity with oxygen, which is exhibited by compounds having a very large number of condensed rings. Therefore, the organic semiconductor material is an organic semiconductor material having atmospheric stability and excellent electrical, electronic, and photoelectric characteristics.
- the organic semiconductor device of the present invention includes the organic semiconductor material described above.
- the organic semiconductor device is preferably a thin film transistor having an organic semiconductor layer.
- the thin film transistor can be used as a switching transistor, a signal driver circuit element, a memory circuit element, a signal processing circuit element, or the like of a pixel constituting a display, and can be widely used for IJ. Since the organic semiconductor device is a thin film transistor, the thin film makes it possible to reduce the size and weight of the organic semiconductor device, simplify the manufacturing process, and significantly reduce the cost of equipment required for manufacturing. Can also
- the organic semiconductor device is preferably a light emitting device having an organic carrier transport layer and / or a light emitting layer.
- the light-emitting device since the light-emitting device has the organic carrier transport layer, carriers freely move in the transport layer, so that it is easy to form an electrode or the like when manufacturing the light-emitting device.
- the carriers can freely move in the transport layer, and the holes injected from the anode side and the electrons injected from the cathode side when a voltage is applied are emitted from the light emitting layer. Can be transported up to. As a result, the power S can be used to make organic semiconductor devices emit light.
- the organic semiconductor device preferably has a field effect mobility of 1. Ocm 2 V- 1 or more.
- the organic semiconductor device preferably has an on / off current ratio of 10 5 or more.
- the on / off current ratio is the above value, the current in the state where the current between the source and drain is the largest (on state) becomes large because the ratio of the on current to the off current is large.
- a high-performance organic semiconductor device can be provided.
- the thin film transistor is a bottom contact type field effect transistor.
- the source and drain electrode portions can be formed in the manufacturing process, so that a field effect transistor capable of high definition can be provided.
- the thin film transistor is preferably a top contact type field effect transistor.
- FIG. 1 is a schematic cross-sectional view showing the structure of an organic semiconductor device according to an embodiment of the present invention.
- FIG. 2 showing an embodiment of the present invention, is a schematic cross-sectional view showing the structure of an organic semiconductor device.
- FIG. 3, showing an embodiment of the present invention is a schematic sectional view showing an assembly process of an organic semiconductor device.
- FIG. 4 A graph showing the FET response curve of an organic semiconductor device using dinaphtho [2,3b: 2 ', 3'-f] thieno [3,2b] thiophene.
- FIG. 5 Graph showing the transfer curve of an organic semiconductor device (substrate temperature during deposition: 60 ° C) using dinaphtho [2, 3 b: 2 ', 3'—f] thieno [3, 2 b] thiophene. is there. Explanation of symbols
- the manufacturing method according to the present embodiment is
- X 9 is a chalcogen atom
- Ar is a structure in which one or more benzene rings are condensed, and the hydrogen atom of the benzene ring is selected from the group consisting of a halogen atom, an alkenoquino group, an alkenyl group, an alkynyl group, an aryleno group, an alkyloxy group, and an alkylthio group.
- Chemical structure optionally substituted by atoms or functional groups,
- X 1U and X 11 are each independently a chalcogen atom).
- the “chalcogen atom” means oxygen, sulfur, selenium or tellurium. That means.
- the Ar is a structure in which one or more benzene rings are condensed, a structure in which at least one selenophene ring is condensed, or a benzochalcogenophene ring.
- the hydrogen atom of the benzene ring is a halogen atom, an alkyl group, an alkenyl group, an alkyl group, Substituted with an atom or a functional group selected from the group consisting of a nyl group, an aryl group, an alkyloxy group, and an alkylthio group.
- halogen atom examples include fluorine, chlorine, bromine and iodine.
- Examples of the alkyl group include a methyl group, an ethyl group, a propyl group, a butyl group, or a pentyl group.
- Examples of the alkenyl group include an ethylene group, a propylene group, a butene group, and a pentene group.
- As the alkynyl group for example, an acetylene group, a propyne group, a butyne group or a pentyne group can be exemplified.
- the number of carbon atoms of the alkyl group, alkenyl group and alkynyl group is not particularly limited! /.
- the molecular structure of the alkyl group, alkenyl group, and alkynyl group may be any of linear, branched, and cyclic.
- aryl group examples include a phenyl group, a naphthyl group, an anthranyl group, a frinole group, a chenyl group, a selenophyl group, and a thienocenyl group.
- the compound represented by the general formula (7) has an aryl group, a condensed polycyclic aromatic compound that can be used for an organic semiconductor device excellent in both field effect mobility and on / off current ratio. Preferable because it can be a raw material.
- alkyloxy group examples include, but are not limited to, a methoxy group, an ethoxy group, an n-propoxy group, an isopropoxy group, an n -butoxy group, and an n-pentyloxy group.
- alkylthio group examples include, but are not limited to, a methylthio group, an ethylthio group, an n-propylthio group, an n-butylthio group, and an n-pentylthio group.
- the carbon atom of the alkyl group, alkenyl group, alkynyl group, aryl group, alkyloxy group and alkylthio group may be substituted with an oxygen atom and / or a sulfur atom.
- the molecular structure in which one or more hydrogen atoms contained in the substituent may be partially substituted with a halogen atom is not particularly limited.
- some of the above substituents may be substituted with aryl groups!
- Ar is independently selected from the general formula (10)
- X 12 to X 17 are each independently a chalcogen atom, and each of R 45 to R 66 is independently a hydrogen atom, a halogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, an alkyloxy group. And at least one atom or functional group selected from the group consisting of alkylthio groups)
- alkyl metal reagent examples include butyl lithium, methyl lithium, and phenyl. Of the above alkyl lithium, butyl lithium is particularly preferably used.
- Basic compounds include N,
- N, N'-trimethylethylenediamine, dimethylamine, diisopropylamine, morpholine and the like can be mentioned.
- the amount of the alkyl metal reagent used is preferably 2 mol or more and 10 mol or less with respect to 1 mol of the compound represented by the general formula (6).
- the general formula An alkyl metal reagent may be further added to the reaction solution to which the compound represented by (6) is added within the above range of use amount. In this way, the alkyl metal reagent is divided into two stages and added to form an intermediate in which the ortho position of the compound represented by the general formula (6) is replaced with a metal such as lithium. can do.
- the temperature at which the compound represented by the general formula (6) is reacted with the alkyl metal reagent is preferably 30 ° C or higher and 0 ° C or lower, more preferably 30 ° C or higher and 20 ° C or lower.
- ether solvents are preferred. Specific examples include tetrahydrofuran (THF), ether, dimethoxyethane, dioxane and the like. These solvents are preferably dried in order to suppress moisture contamination.
- the liquid chalcogen atom-containing reagent contains a chalcogen atom, and the reagent itself is liquid. Specifically, it is preferable to use dialkyl chalcogenides such as dimethyl disulfide and dimethyl diselenide. These can be easily reacted with the compound represented by the general formula (6), and the compound represented by the general formula (7) can be easily produced.
- the amount of the liquid chalcogen atom-containing reagent used is preferably from 1 to 10 equivalents relative to the aldehyde in order to obtain the compound represented by the general formula (7) with high yield. .
- the purification method is not particularly limited, and a known purification method is used depending on the physical properties of the compound. That power S. For example, after completion of heating, water can be removed from the cooled reaction solution in the reactor with saturated sodium carbonate and the like, followed by purification by column chromatography, sublimation purification or recrystallization.
- the following production method is an example for obtaining the compound represented by the general formula (16), and is not particularly limited.
- the production method for obtaining the compound represented by the general formula (16) includes the following reaction formula (IV):
- a zinc reagent and a solvent are mixed in a reaction container such as a flask.
- the reaction vessel is preferably purged with nitrogen or argon.
- zinc reagents that can be used include powdered zinc and solid zinc.
- ether solvents such as tetrahydrofuran, dioxane, dimethoxyethane and the like can be used.
- the solvent used is preferably a dried solvent to prevent water from entering.
- titanium tetrachloride After cooling the mixed solution of the zinc reagent and the solvent, titanium tetrachloride is added dropwise.
- the amount of titanium tetrachloride added can be 0.1 mol or more and 0.2 mol or less with respect to 1 mol of the zinc reagent. Within the above range, the compounds represented by the general formula (7) can be efficiently coupled to each other.
- the mixture in the reactor may be heated at the reflux temperature depending on the type of solvent that is preferably heated to 50 ° C or higher and 200 ° C or lower.
- the heating time may be appropriately changed depending on the amount of raw material used, but anhydrous tetrahydrofuran is used and heating is performed at the reflux temperature.
- the heating time can be set to 1 hour or more and 20 hours or less.
- Use a magnetic stirrer to stir the mixed solution in the reactor.
- the inside of the reactor is cooled to room temperature or lower, and the compound represented by the general formula (7) dissolved in the solvent is dropped into the reactor. After dripping, depending on the type of solvent it is preferable to heat the inside of the reactor again, it may be heated at the reflux temperature.
- the heating time may be appropriately changed depending on the amount of raw material used, but when anhydrous tetrahydrofuran is used and heating is performed at reflux temperature, the heating time can be set to 5 hours or more and 30 hours or less.
- the purification method is not particularly limited, and a known purification method can be used according to the physical properties of the compound. For example, after heating, after removing water from the cooled reaction solution in the reactor with saturated sodium carbonate or the like, a method of purification by column chromatography, sublimation purification or recrystallization can be used. It is also possible to use titanium trichloride instead of the titanium tetrachloride and lithium aluminum hydride instead of the zinc reagent.
- X 18 and X 19 are each independently a chalcogen atom
- Ar is independently a structure in which one or more benzene rings are condensed, and the hydrogen atom of the benzene ring is a halogen atom.
- a chemical structure which may be substituted with an atom or a functional group selected from the group consisting of an atom, an anoleno quinole group, an alkenyl group, an alkynyl group, an aranol group, an alkyloxy group and an alkylthio group;
- halogen atom alkyl group, alkenyl group, alkynyl group, aryl group, alkynoxy group, and alkylthio group are the same as those described in Embodiment 1.
- each Ar is independently represented by the general formula (10) [0155] [Chemical 42]
- X 12 to X 17 are each independently a chalcogen atom, and each of R 45 to R 66 is independently a hydrogen atom, a halogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, an alkyloxy group. And at least one atom or functional group selected from the group consisting of alkylthio groups)
- Ar in the compound represented by the general formula (16) used in the above-described method for producing a compound may have a different chemical structure without necessarily having the same chemical structure.
- Ar has a different chemical structure
- an asymmetric general formula (17) can be obtained, and a wider molecular design becomes possible.
- the compound represented by the general formula (17) obtained is obtained as a single substance, which can be easily purified and reduced in production cost S.
- the iodine used in the above production method is not particularly limited, and a commercially available product may be used.
- the amount of iodine used is 2 mol or more with respect to lmol of the compound represented by the general formula (16) , Preferably less than lOOmol.
- the amount of iodine used is in the above range, the compound represented by the general formula (17) can be efficiently generated.
- a halogenated hydrocarbon solvent such as chlorophenol, methylene chloride, carbon tetrachloride, dichloroethane or the like can be used. Monkey.
- reaction temperature of the above reaction is 30 ° C or more and 200 ° C or less
- the reaction may be performed at the reflux temperature when chlorophenol is used as the solvent.
- the reaction time can be 1 hour or more and 100 hours or less.
- the purification method is not particularly limited, and the physical properties of the compound represented by the general formula (17) are not limited.
- known purification methods can be used. For example, after the heating is completed, water can be removed from the reaction solution in the cooled reactor with saturated sodium carbonate and the like, followed by purification by column chromatography, sublimation purification, recrystallization, or the like.
- the compound represented by the general formula (17) according to the present invention can be obtained in a high yield with a small number of reaction steps. Further, since the above production method is not a multi-step process, the compound represented by the general formula (17) is hardly contaminated with impurities. Further, the above compound is a compound having an aromatic ring on the outside of the BXBX skeleton, or a compound in which the benzene ring portion of the BXBX skeleton is a heterocyclic ring. That is, the above compound has a large number of condensed rings, has electrical, electronic, and photoelectric properties, and can be used as a highly soluble semiconductor material and is very useful. Furthermore, since the above compound has a small number of condensed rings, its solubility in a solvent is high and its atmospheric stability is high, so that it can be suitably used as an organic semiconductor material.
- At least one of the benzene ring portions of the benzodichalcogenophenobenzodichalcogenophene skeleton represented by the general formula (1) is further added to the benzene.
- the compound represented by the above general formula (1) is represented by the general formula (2)
- R 1 to R 12 are each independently selected from the group consisting of a hydrogen atom, a halogen atom, an alkenoquinole group, an alkenyl group, an alkynyl group, an aryleno group, an alkyloxy group, and an alkylthio group. At least one atom or functional group).
- R 1 to R 12 are each independently selected from the group consisting of a hydrogen atom, a halogen atom, an alkenoquinole group, an alkenyl group, an alkynyl group, an aryleno group, an alkyloxy group, and an alkylthio group. At least one atom or functional group).
- X 3 to X 8 is independently a chalcogen atom.
- These compounds are compounds having an aromatic ring on the outside of the BXBX skeleton, or novel condensed polycyclic aromatic compounds in which the benzene ring portion of the BXBX skeleton is a heterocyclic ring.
- the interaction between molecules is strengthened by extending the ⁇ electron system. For this reason, when used as a material for the organic semiconductor device, field effect mobility can be improved, so that it can be used as a very useful material for developing a new organic semiconductor device.
- FIG. 1 shows an embodiment of the present invention and is a schematic sectional view showing the structure of an organic semiconductor device (thin film transistor device).
- the organic semiconductor device includes the novel condensed polycyclic aromatic compound and the compound represented by the general formula (17) obtained by the production method described in Embodiment 2. At least one compound is used as an organic semiconductor material.
- the organic semiconductor material may contain only one kind as the condensed polycyclic aromatic compound, or may contain plural kinds in combination. In the case of including only one type, it is possible to easily deposit the organic semiconductor material when depositing the organic semiconductor material described later. When a plurality of types are used in combination, the physical properties of the organic semiconductor material can be adjusted by appropriately changing the condensed polycyclic aromatic compound used.
- an organic semiconductor device 7 includes a gate electrode contact 3 on the surface of a substrate 4 that acts as a gate electrode, and is on the surface opposite to the gate electrode contact 3 with respect to the substrate 4.
- a dielectric layer 5 is formed, and an organic semiconductor material 6 is further formed on the dielectric layer 5.
- Organic semiconductor material 6 is provided with source 1 and drain 2 and contact channel between source 1 and drain 2.
- the substrate 4 may be p-type or n-type, but is preferably n-doped in order to function as a gate electrode.
- the material used for the substrate 4 include ceramic substrates such as glass, quartz, aluminum oxide, sapphire, silicon nitride, and silicon carbide, semiconductor substrates such as silicon, germanium, gallium arsenide, gallium phosphorus, and gallium nitrogen, polyethylene terephthalate.
- Polyesters such as polynaphthalene terephthalate, polyethylene, polypropylene, polyvinylinoleo vinylene, ethylene vinylinoleo vinylene copolymer, cyclic polyolefin, polyimide, polyamide, polystyrene and other resin substrates, paper, non-woven fabric, etc. Silicone is preferably used.
- Metals preferably used for the gate electrode contact 3 include gold, platinum, silver, copper, aluminum, nickel, titanium, chromium, magnesium silver, organic conductive compounds, and calcium. It is not limited to. In view of ease of handling, the gate electrode contact 3 is preferably gold or silver.
- silicon dioxide can be used as the dielectric layer 5.
- thermal oxidation As means for forming the dielectric layer 5 on the substrate 4, it is preferable to use thermal oxidation.
- means for providing a contact channel between the source 1 and the drain 2 include, but are not limited to, electron beam drawing, photolithography, shadow mask, silk screen method, and the like. Preferably, the contact channel is provided by shadow masking, electron beam lithography or photolithography.
- a dry film formation method such as a vacuum evaporation method, a CVD method, a sputtering method, a laser evaporation method, a solution on the substrate
- a dry film formation method such as a vacuum evaporation method, a CVD method, a sputtering method, a laser evaporation method, a solution on the substrate
- Examples include, but are not limited to, a wet film formation method in which a thin film is formed by removing the solvent and the dispersion medium after applying the dispersion.
- the organic semiconductor material 6 is preferably deposited by vacuum evaporation.
- the pressure can force S preferably 10 or less, and more preferably less 10 3 Pa.
- the surface of the dielectric layer 5 is coated with a silane coupling agent such as otatiltrichlorosilane or hexamethyldisilazane.
- a silane coupling agent such as otatiltrichlorosilane or hexamethyldisilazane.
- the temperature of the substrate 4 is usually about 140 ° C from the room temperature, preferably about 40 ° C to 120 ° C, more preferably 60 ° C to 100 ° C.
- the organic semiconductor material 6 generally has a strong p-type (hole transportability) property, and therefore many excellent p-type organic semiconductor materials have been developed.
- n-type (electron transportability) materials are limited in their types, and their performance is generally lower than that of p-type materials. Therefore, there is a great demand for the development of n-type organic semiconductor materials and their manufacturing methods.
- p-type to n-type can be obtained by introducing electron-withdrawing substituents into p-type organic semiconductor materials that exhibit excellent properties.
- a change in polarity is being made.
- a substituent containing a plurality of cyanos, fluorines and the like is preferably used. That is, those skilled in the art can convert an organic semiconductor material, which is generally p-type, to n-type as necessary.
- the organic semiconductor device 7 according to the present invention having the configuration shown in FIG.
- a diode a thin film transistor, a memory, a photodiode, a light emitting diode, a light emitting transistor, a gas sensor, a biosensor, a blood sensor, and an immunosensor.
- an artificial retina, a taste sensor, etc. and preferably function as a thin film transistor or a light emitting device.
- the thin film transistor can be suitably used as a switching transistor, a signal driver circuit element, a memory circuit element, a signal processing circuit element, or the like of a pixel constituting the display.
- the thickness of the thin film transistor may be appropriately selected depending on the structure and size of the device.
- a film thickness of 10 nm or more and lOOOnm or less is generally used force S, but is not limited to this.
- “Thin film” is preferably 1 nm or more and l ⁇ m or less, preferably 5 nm or more and 500 ⁇ m or less, more preferably l Onm or more and 500 nm or less, for use in an organic semiconductor device in which a thin film is preferred. It has the film thickness of the range.
- Examples of the display include a liquid crystal display, a dispersive liquid crystal display, an electrophoretic display, a particle rotation type display element, an electochromic display, an organic electroluminescence display, and electronic paper.
- the organic semiconductor device of the present invention is preferably a light-emitting device having an organic carrier transport layer and / or a light-emitting layer.
- a light emitting device having only an organic carrier transport layer, a light emitting device having only a light emitting layer, or a light emitting device having an organic carrier transport layer and a light emitting layer may be used.
- the organic carrier transport layer By having the organic carrier transport layer, carriers can freely move in the transport layer, so that it is easy to form an electrode or the like when manufacturing a semiconductor device.
- the light emitting layer it is possible to provide a field where holes injected from the anode side and electrons injected from the cathode side are recombined when a voltage is applied.
- carriers move freely in the transport layer, and holes injected from the anode side and electrons injected from the cathode side when voltage is applied to the light emitting layer. It can be transported and the organic semiconductor device can emit light.
- the organic carrier transport layer is a layer for transporting carriers to the light emitting layer.
- Organic spear Examples of the charge transport layer include two types, a hole transport layer and an electron transport layer.
- the hole transport layer has a function of transporting holes injected from the anode to the light emitting layer
- the electron transport layer has a function of transporting electrons injected from the cathode to the light emitting layer. Is.
- the light-emitting layer is a semiconductor layer containing a light-emitting material, which can inject electrons from the anode side and holes when a voltage is applied, and can inject electrons from the cathode side. It is possible to provide a place to combine.
- the light-emitting materials include various low-molecular light-emitting materials and various high-molecular light-emitting materials as described below, and it is possible to use at least one of them.
- Examples of the low-molecular light-emitting materials include benzene compounds such as distyrylbenzene (DSB) and diaminodistyrylbenzene (DADSB), naphthalene compounds such as naphthalene and nile red, and phenanthrene compounds such as phenanthrene. Conventionally known compounds such as compounds can be listed.
- benzene compounds such as distyrylbenzene (DSB) and diaminodistyrylbenzene (DADSB)
- naphthalene compounds such as naphthalene and nile red
- phenanthrene compounds such as phenanthrene.
- Conventionally known compounds such as compounds can be listed.
- examples of the polymer light-emitting material include trans-polyacetylene, cis-polyacetylene, poly (diphenylacetylene) (PDPA), and poly (alkylphenylacetylene) (PAPA). And the like, and conventionally known compounds such as polyacetylene-based compounds, poly (paraphenylenevinylene) (PP V), and the like.
- a light emitting device including a hole transport light emitting layer and an electron transport layer is obtained.
- a light emitting device including an electron transport light emitting layer and a hole transport layer is obtained.
- the vicinity of the interface between the hole transporting light emitting layer and the electron transporting layer and the vicinity of the interface between the electron transporting light emitting layer and the hole transporting layer function as the light emitting layer.
- an organic EL element can be exemplified.
- an aspect and manufacturing method of the above-mentioned organic EL element other than using the organic semiconductor material of the present invention for example, known ones described in JP-A-2006-199909 can be exemplified.
- the organic EL element includes a substrate, an anode layer provided on the substrate, a semiconductor layer containing the organic semiconductor material of the present invention provided on the anode, a cathode layer provided on the semiconductor layer, It can comprise from the protective layer provided so that each layer might be covered.
- the semiconductor layer has an organic carrier transport layer and / or a light emitting layer. Furthermore, the organic carrier transport layer includes two layers of a hole transport layer and an electron transport layer.
- the semiconductor layer has an organic carrier transport layer and a light emitting layer
- the semiconductor layer is disposed on the anode in the order of a hole transport layer, a light emitting layer, and an electron transport layer.
- the hole transport layer has a function of transporting holes injected from the anode to the light emitting layer
- the electron transport layer has a function of transporting electrons injected from the cathode to the light emitting layer. is there.
- the semiconductor layer may have an organic carrier transport layer without a light emitting layer.
- the above-mentioned hole transportable light emitting layer and electron transportable light emitting layer can be used for the said organic carrier transport layer.
- the vicinity of the interface between the hole transporting light emitting layer and the electron transporting layer and the vicinity of the interface between the electron transporting light emitting layer and the hole transporting layer function as the light emitting layer.
- the hole transporting light emitting layer the holes injected from the anode into the hole transporting light emitting layer are confined by the electron transporting layer.
- the electron transporting light emitting layer is used, the cathode is transported. Since electrons injected into the electron-transporting light-emitting layer are confined in the electron-transporting light-emitting layer, both have the advantage that the recombination efficiency between holes and electrons can be improved.
- the semiconductor layer may have a light emitting layer without an organic carrier transport layer. According to said structure, the light emitting layer containing the organic-semiconductor material of this invention and the above-mentioned luminescent material can be used.
- the substrate serves as a support of the organic EL element, and the above-described substrate is formed on the substrate. Each layer is arranged.
- a material having translucency and good optical characteristics can be used as the constituent material of the substrate.
- Examples of such materials include various materials such as polyethylene terephthalate, polyethylene naphthalate, polypropylene, cycloolefin polymer, polyamide, polyethersulfone, polymethyl methacrylate, polycarbonate, and polyarylate. Examples thereof include resin materials and various glass materials, and at least one of them can be used.
- the thickness of the substrate is not particularly limited, but is preferably 0.1 mm or more and 30 mm or less, and more preferably 0.1 mm or more and 10 mm or less.
- the anode is an electrode for injecting holes into the hole transport layer.
- the anode is substantially transparent (colorless transparent, colored transparent, semi-transparent) so that light emission from the light emitting layer can be visually recognized.
- Examples of such anode materials include ITO (Indium Tin Oxide), SnO, Sb-containing SnO, Al-containing ZnO, and other oxides, Au, Pt, Ag, Cu, or these.
- the thickness of the anode is not particularly limited, but is preferably 10 nm or more and 200 nm or less.
- the thickness of the anode is 50 nm or more and 150 nm or less. If the thickness of the anode is too thin, the function as the anode may not be sufficiently exerted. On the other hand, if the anode is too thick, the light transmittance may be significantly reduced depending on the type of anode material. May not be suitable for practical use
- the cathode is an electrode for injecting electrons into the electron transport layer.
- Such cathode materials include Li, Mg, Ca, Sr, La, Ce, Er, Eu, Sc, Y, Yb, Ag, Cu, Al, Cs,
- Rb or an alloy containing these may be used, and at least one of these may be used.
- the thickness of the cathode is preferably not less than 1 nm and not more than 1 ⁇ m, more preferably not less than lOOnm and not more than 400 nm. If the thickness of the cathode is too thin, the function as the cathode may not be sufficiently exhibited. On the other hand, if the cathode is too thick, the light emission efficiency of the organic EL element may be reduced.
- the organic semiconductor material of the present invention can be used in each of the hole transport layer, the light emitting layer, and the electron transport layer of the semiconductor layer. Therefore, the organic carrier transport layer of the present invention and A light-emitting device having a light-emitting layer is one that is arranged in any one of the above semiconductor layers, one that is arranged in a plurality of layers, or one that is arranged in all layers. Including.
- An arbitrary target layer may be provided between the layers.
- a hole injection layer that improves the efficiency of hole injection from the anode can be provided between the hole transport layer and the anode.
- an electron injection layer or the like for improving the efficiency of electron injection from the cathode can be provided between the electron transport layer and the cathode.
- the organic semiconductor material of the present invention can be used as a constituent material of the hole injection layer and the electron injection layer.
- Each layer constituting the organic EL element is preferably covered with a protective layer.
- This protective layer has a function of hermetically sealing each layer constituting the organic EL element and blocking oxygen and moisture. By providing the protective layer, it is possible to improve the reliability of the organic EL element and prevent deterioration and deterioration.
- Examples of the constituent material of the protective layer include Al, Au, Cr, Nb, Ta, T, alloys containing these, silicon oxide, and various resin materials. Note that when a conductive material is used as a constituent material of the protective layer, an insulating film is preferably provided between the protective layer and each layer as necessary in order to prevent a short circuit.
- the organic field effect transistor (FET element) should have high performance! /, Ff
- the condensed polycyclic aromatic compound since the condensed polycyclic aromatic compound is used, high field-effect mobility and on / off current ratio can be realized.
- the field effect mobility of the present organic semiconductor device is preferably 1. Ocm 2 / Vs or more. Thereby, an organic semiconductor device excellent in high-efficiency light emission, low-voltage driving and switching speed can be provided.
- the organic semiconductor device preferably has an on / off current ratio of 10 5 or more.
- the on / off current ratio is the above value, the current in the state where the ratio between the on current and the off current is large and the current between the source and the drain is the largest (on state) becomes large. Therefore, a high-performance organic semiconductor device can be provided.
- the threshold voltage V (threshold voltage) is V—I 1/2 (I 1/2 is the current value th gdd
- the on / off current ratio is calculated as follows. That is, the gate voltage (V
- the on-state is the state in which the current between the source and drain is the largest over time, and the ratio of the current (I) between the source and drain in the on state and off state is calculated as the on / off ratio.
- the organic semiconductor device since the organic semiconductor device has very high performance, it can be used very effectively as a thin film transistor or a light emitting device having an organic carrier transport layer or a light emitting layer. Furthermore, the organic semiconductor device according to the present invention can be operated with a force S that operates in the atmosphere not only having a high field effect mobility but without significantly reducing its performance.
- the organic semiconductor device (thin film transistor device) according to the present invention will be further described below.
- the thin film transistor device of the present invention is also called a field effect transistor (hereinafter sometimes abbreviated as FET), and has two electrodes (a source electrode and a drain electrode) in contact with a semiconductor. The flowing current is controlled by a voltage applied to another electrode called a gate electrode.
- FET field effect transistor
- a thin film transistor device often has a structure in which a gate electrode is insulated by an insulating film (METal-Insulator- Semiconductor; MIS structure).
- An insulating film that uses a metal oxide film is called a MOS structure.
- MOS structure Metal-Insulator- Semiconductor
- FIG. 2 shows some embodiments (thin layer transistor devices 7A to 7E) of the thin film transistor device according to the present invention.
- 1 represents a source (source electrode)
- 2 represents a drain (drain electrode)
- 3a represents a gate electrode
- 4a represents a substrate
- 5 represents a dielectric layer
- 6 represents an organic semiconductor material.
- positioning of each layer and an electrode can be suitably selected according to the use of an element.
- the FETs indicated by A to D in Figure 2 are called lateral FETs because current flows in the direction parallel to the substrate 4a.
- A shows the bottom contact structure
- B shows the FET called the top contact structure.
- the thin film transistor device described in FIG. 1 corresponds to B in FIG. 2, that is, the top contact structure.
- FIG. 1 represents a source (source electrode)
- 2 represents a drain (drain electrode)
- 3a represents a gate electrode
- 4a represents a substrate
- 5 represents a dielectric layer
- 6 represents an organic semiconductor
- gate electrode 3a is clearly shown, and “gate electrode contact 3” in FIG. 1 is omitted.
- the “gate electrode contact 3” can be placed at any part in contact with the gate electrode 3a as long as it is not electrically short-circuited with the source 1 and the drain 2.
- FIGS. 2A, 2B, and 2D when the gate electrode 3a is in contact with the substrate 4a and the substrate 4a is conductive, the above “gate electrode contact 3" It is also possible to install it at an arbitrary part in contact with the substrate 4a.
- C is a structure often used in the production of organic single-crystal FETs.
- Source 1 and drain 2 and dielectric layer 5 are provided on organic semiconductor material 6, and gate electrode 3a is provided thereon.
- D is a thin layer with a structure called a top & bottom contact transistor
- E is a schematic diagram of a FET having a vertical structure, that is, a static induction transistor (SIT).
- SIT static induction transistor
- a large amount of carriers can move at a time because the current flow spreads in a plane.
- source 1 and drain 2 are arranged vertically, the distance between the electrodes can be reduced, so response Is fast. Therefore, it can be preferably applied to applications such as flowing a large current and performing high-speed switching.
- the substrate 4a is not described in E in the figure, but in the normal case, the substrate is provided outside the source 1 and the drain 2 in E in FIG.
- Substrate 4 and substrate 4a need to be able to hold each layer formed thereon without peeling off.
- insulating materials such as resin plates and films, paper, glass, quartz, ceramics, etc .; an insulating layer formed on a conductive substrate such as metal or alloy by coating; materials consisting of various combinations such as resin and inorganic materials; Etc.
- the resin film that can be used include polyethylene terephthalate, polyethylene naphthalate, polyethersulfone, polyamide, polyimide, polycarbonate, cellulose triacetate, polyether terimide, and the like.
- the thickness of the substrate is usually from 1 m to 1 Omm, and preferably 5 ⁇ m to 5 mm.
- a conductive material is used for the source 1, the drain 2, and the gate electrode 3a.
- a conductive material for example, platinum, gold, silver, aluminum, chromium, tungsten, tantalum, nickel, cobalt, copper, iron, lead, tin, titanium, indium, palladium, molybdenum, magnesium, calcium, norium, lithium, potassium, sodium, etc. Metals and alloys containing them; InO
- Conductive polymer compounds such as cetylene, polyparaphenylene, vinylene, and polydiacetylene; semiconductors such as silicon, germanium, and gallium arsenide; carbon materials such as carbon black, fullerene, carbon nanotube, and graphite; Also, conductive polymer compounds and semiconductors are doped! /, May! /. Examples of the dopant include inorganic acids such as hydrochloric acid and sulfuric acid; organic acids having an acidic functional group such as sulfonic acid; PF
- Norelic acid such as AsF and FeCl
- Halogen atom such as iodine
- the distance (channel length) between source 1 and drain 2 (drain electrode) is an important factor that determines the characteristics of the device.
- the channel length is usually 300 to 0. ⁇ , preferably 100 to 2111. If the channel length is short, the amount of current that can be extracted will increase. On the other hand, leakage current will occur, so an appropriate channel length is required.
- the width between the source 1 and the drain 2 (channel width) is usually 5000 to 10 ⁇ m, preferably 3000 to 100 ⁇ m. In addition, this channel width can be made longer by forming the electrode structure into a comb structure, etc., and can be adjusted to an appropriate length depending on the amount of current required and the structure of the element. It ’s good.
- Source 1 and drain 2 [0231] The structures (forms) of the source 1 and the drain 2 will be described. Source 1 and drain
- the two structures may be the same or different.
- the thin layer transistor device has a bottom contact structure, it is generally preferable to form each electrode using a lithography method and form it in a rectangular parallelepiped.
- the length of source 1 and drain 2 (electrode) may be the same as the channel width described above.
- the width between the source 1 and the drain 2 (between the electrodes) is not particularly specified, but a shorter one is preferable in order to reduce the area of the element within the range where the electrical characteristics can be stabilized.
- the width of the electrode is usually 5000 to 10 m, preferably 3000 to 100 ⁇ m.
- the thickness of the electrode is usually 1 nm to l ⁇ m, preferably 5 nm to 0.5 nm, more preferably 10 nm to 0.2111.
- the force wiring in which wiring is connected to the source 1, drain 2 and gate electrode 3a is also made of the same material as the source 1, drain 2 and gate electrode 3a.
- an insulating material is used as the dielectric layer 5.
- polymers such as polyparaxylylene, polytalarylate, polymethylmetatalylate, polystyrene, polybutylphenol, polyamide, polyimide, polycarbonate, polyester, polybulal alcohol, polyacetic acid butyl, polyurethane, polysulfone, epoxy resin, phenolic resin, etc. And copolymers of these; metal oxides such as silicon dioxide, aluminum oxide, titanium oxide and tantalum oxide; ferroelectric metal oxides such as SrTiO and BaTiO; silicon nitride and aluminum nitride
- a nitride such as a minimum; a sulfide; a dielectric such as a fluoride; or a polymer in which particles of the dielectric are dispersed may be used.
- the film thickness of the dielectric layer 5 varies depending on the material, but is usually from 0.5 nm to! OO ⁇ um, preferably from 0.5 ⁇ to 50 ⁇ , more preferably from lnm to 10 ⁇ . m.
- the means for forming the dielectric layer 5 is as described above.
- the organic semiconductor material 6 is as described above.
- the thickness of the organic semiconductor material 6 ranges from In m to 10 ⁇ m, preferably 5 nm to 5 ⁇ m, more preferably 10 nm to 3 ⁇ m.
- another layer can be provided between the substrate and the dielectric layer, between the dielectric layer and the organic semiconductor material layer, and / or on the outer surface of the device as necessary.
- a protective layer is formed directly on the organic semiconductor material layer or through another layer, the influence of outside air such as humidity can be reduced, and the on / off ratio of the device can be increased.
- electrical characteristics can be stabilized.
- the material of the protective layer is not particularly limited.
- films made of various resins such as epoxy resin, acrylic resin such as polymethyl methacrylate, polyurethane, polyimide, polybutyl alcohol, fluorine resin, and polyolefin; silicon oxide, An inorganic oxide film such as aluminum oxide and silicon nitride; a film made of a dielectric such as a nitride film; and the like are preferably used, and a resin (polymer) having a low oxygen and moisture permeability and a low water absorption rate is particularly preferable.
- protective materials developed for organic EL displays can also be used.
- the film thickness of the protective layer can be selected arbitrarily depending on the purpose, but is usually lOOnm to 1 mm.
- examples of a method of providing each layer such as a substrate layer and a dielectric layer, or a dielectric layer and an organic semiconductor material layer include a vacuum deposition method, a sputtering method, a coating method, a printing method, and a sol-gel method. It can be adopted as appropriate.
- the thin film transistor device of the present invention is manufactured by providing various layers and electrodes necessary on the substrate 4a (see FIG. 3 (1)).
- the substrate 4a may be provided with the function of an electrode on the substrate 4a as required by the force as described above.
- a gate electrode 3a is formed on the substrate 4a (see FIG. 3 (2)).
- the material of the gate electrode 3a is as described above.
- Various methods can be used as the method for forming the electrode film. For example, a vacuum deposition method, a sputtering method, a coating method, a thermal transfer method, a printing method, a sol-gel method and the like are employed. It is preferable to perform patterning as needed so as to obtain a desired shape during or after film formation.
- a patterning method various methods can be used. For example, a photolithographic method in which patterning of photoresist and etching is combined.
- the film thickness of the gate electrode 3a varies depending on the material. Usually, it is 0.1 nm to 10 nm, preferably 0.5 n 111 to 5 111, and more preferably 11 111 to 3 111. When the gate electrode 3a is also used as the substrate 4a, it may be larger than the above film thickness.
- the dielectric layer 5 is formed on the gate electrode 3a (see FIG. 3 (3)).
- the material of the dielectric layer 5 those described above are used.
- Various methods can be used to form the dielectric layer 5. For example, spin coating, spray coating, dip coating, casting, bar coating, blade coating and other coating methods, screen printing, offset printing, inkjet printing, vacuum deposition, molecular beam epitaxy, ion Examples include dry process methods such as the cluster beam method, ion plating method, sputtering method, atmospheric pressure plasma method, and CVD method.
- sol-gel methods such as alumite on aluminum and silicon oxide on silicon can be used.
- the source electrode 1 and the drain 2 can be formed by the method of the gate electrode 3a or in accordance with the method (see FIG. 3 (4)).
- the organic semiconductor material is as described above, and the formation method is also as described above.
- Forming the protective layer 6a on the organic semiconductor material 6 has the advantages of minimizing the influence of outside air and stabilizing the electrical characteristics of the organic thin film transistor device as described above (see Fig. 3 (6)). ).
- the materials described above can be used as the material for the protective layer 6a.
- a formation method in a vacuum process such as a sputtering method or a vapor deposition method
- a formation method in a solution process such as a sol-gel method
- a protective layer can be provided between the layers as necessary. These layers may also help stabilize the electrical properties of organic thin film transistor devices.
- an object of the present invention is to provide a novel condensed polycyclic aromatic compound that can satisfy both high field effect mobility and high on / off current ratio required as an organic semiconductor material.
- Another object of the present invention is to provide an organic semiconductor device having good performance using the condensed polycyclic aromatic compound.
- reaction solution was extracted with methylene chloride, and the organic layer was dried over anhydrous magnesium sulfate. After filtration, the solvent was distilled off with a rotary evaporator. The obtained crude product was subjected to silica gel column chromatography using hexane acetyl acetate 9: 1 as a developing solvent to obtain a component of Rf 0.3 as a yellow liquid. After concentrating the solvent, 2 methylthio 3 naphtholaldehyde (1.49 g, 7.37 mmol, 58% yield) was obtained as a yellow solid.
- reaction solution was cooled to room temperature, saturated aqueous sodium hydrogen sulfite solution (about 20 ml) was added, the insoluble solid was collected by filtration, and washed with black mouth form and water.
- the resulting yellow solid was purified by sublimation to produce dinaphtho [2,3-b: 2,, 3,1f] thieno [3,2-b] Kunststoff phen (0.1730 g, 0.51 mmol, yield 85 %) was obtained as a yellow solid.
- the melting point of this compound was measured, the melting point was measured by TG / DTA because it had sublimation at a temperature of 300 ° C or higher and was unable to be measured accurately.
- N, N, N 'Trimethylethylenediamine (2.87 ml, 21.0 mmol) and anhydrous tetrahydrofuran (35 ml) and anhydrous tetrahydrofuran (35 ml) were added to a 100 ml three-necked flask equipped with a dropping funnel under a nitrogen stream — cooled to 40 ° C.
- a hexane solution of butyllithium (1.59 M, 13.2 ml, 21.0 mmol
- reaction solution was extracted with methylene chloride, the organic phase was dried over anhydrous magnesium sulfate, filtered, and the solvent was distilled off with a rotary evaporator.
- the obtained reaction mixture was separated and purified by silica gel column chromatography using a mixed solvent of hexane and ethyl acetate 9: 1 as a mobile phase to obtain a yellow liquid.
- the yellow liquid was allowed to stand to obtain 3 methinores seleno 2 naphthanol aldehyde (1 ⁇ 01 g, 4.05 mmol, 32%) as a yellow solid.
- a silicon substrate (substrate 5) having silicon dioxide (dielectric layer 5, SiO 2) 200 nm formed by thermal oxidation on an n-doped silicon wafer.
- the device performance at the substrate temperature can be improved.
- the surface of the dielectric layer 5 is treated with a substrate (OTS treatment) and a substrate (HMD) treated with hexamethyldisilazane (HMDS) vapor.
- OTS treatment a substrate
- HMD hexamethyldisilazane
- Table 1 shows the data for which reproducibility was confirmed by producing 10 or more FET devices under any conditions.
- Tsub./°C represents the temperature condition of the silicon substrate
- FET represents the field effect mobility of the FET device
- I / ⁇ represents the on / off ratio. Shown in Table 1 on off
- the semiconductor device fabricated in Example 3 has a good on / off ratio.
- the field-effect mobility is 1.2 cm 2 V—— 1 or more and 1.7 cm 2 V— 1 or less. So far, devices using organic semiconductor materials have been used. It is in the highest category reported in. This also dinaphtho [2, 3- b: 2 f ] thieno [3, 2-b] it Chiofen is excellent semiconductor material becomes bright et force, and.
- FIG. 4 shows an FET response curve obtained from the FET element produced in this example.
- FIG. 5 shows the transfer characteristics of the organic semiconductor device 7 produced in this example.
- the graph shown by the solid line shows Id (drain current, left scale), and the graph shown by a broken line shows the square root (right scale) of the absolute value of the drain current. Indicates a low gate voltage.
- the organic semiconductor device of the present invention was stored in the atmosphere for 6 months, and the transfer characteristics were measured again. As a result, the transfer characteristics were almost the same as those immediately after fabrication, and the durability was extremely high. It became clear.
- HMDS Hexamethyldisilazane
- a resist material was applied onto a silicon wafer, exposed to patterning, and chromium (In m) and gold (40 nm) were deposited thereon.
- the electrodes are comb-shaped electrodes with a channel length of 25 m X channel width of 2 mm X 20 pieces.
- a substrate (bare SiO 2) and a substrate subjected to hexamethyldisilazane (HMDS) treatment in which the surface of the dielectric layer 5 was not treated in the same manner as in Example 3 were placed in a vacuum deposition apparatus. and was evacuated to a vacuum degree in the apparatus is equal to or less than 1.
- HMDS hexamethyldisilazane
- the compound synthesized according to Example 1 was deposited by resistance heating vapor deposition to a thickness of 50 nm at a substrate temperature of 60 ° C. to form a layer of organic semiconductor material 6 to obtain the field effect transistor of the present invention. .
- the organic field effect transistor in this example has a function of the dielectric layer 5 in the thermal oxide film in the n-doped silicon wafer with the thermal oxide film, as indicated by A in FIG.
- a silicon wafer functions as a substrate and a gate electrode.
- Table 2 below shows the FET device data as in Table 1 above.
- This material is the most expensive X reported so far for bottom-type thin film transistors.
- the bottom-type structure is desirable from the viewpoint of high definition of the device because the source and drain electrodes can be formed first.
- the creation of excellent materials is required. At present, the superiority of this semiconductor material has been clearly demonstrated.
- an organic device was produced in the same manner as in Example 3 above.
- the obtained organic device was transferred in the same way as when the above materials were used. One characteristic was shown.
- Non-Patent Document 12 that is, the compound represented by Formula (XXI) described in Patent Document 13, wherein the compound represented by Formula (XIX) in Non-Patent Document 13 is corrected by Non-Patent Document 13.
- the compound represented by the formula (XXI) was synthesized by the following method, and the compound of Example 1 and the physical properties were synthesized. The values were compared.
- Patent Document 13 in which the structural formula of the compound corresponding to Formula (2) described in Patent Document 12 is actually the formula (XXI) was correct.
- the compound according to the present invention is a compound further provided with an aromatic ring outside the BXBX skeleton, or a compound in which the benzene ring portion of the BXBX skeleton is a heterocyclic ring.
- interaction between molecules is strengthened by expansion of the electronic system.
- the field effect mobility of the organic semiconductor is improved, so that it can be used as a very useful material for developing a new organic semiconductor device. And! /, Has the effect.
- a compound having an aromatic ring further outside the BXBX skeleton, or a compound in which the benzene ring portion of the BXBX skeleton is a heterocyclic ring is subjected to a multistage reaction. It can manufacture simply, without using. Furthermore, the above-described production method has an effect that a compound with high purity can be obtained because impurities are hardly mixed in the obtained compound.
- the compound of the present invention contains little impurities during the synthesis process, the mobility reaching 1. Ocm 2 / Vs in organic semiconductor devices and a high on / off ratio (maximum) can be achieved by a single sublimation purification. High io 7 ) can be achieved. Therefore, according to the present invention, various organic semiconductor materials having excellent electrical, electronic, and photoelectric properties can be easily produced, and can be widely applied.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Optics & Photonics (AREA)
- Heterocyclic Carbon Compounds Containing A Hetero Ring Having Oxygen Or Sulfur (AREA)
- Thin Film Transistor (AREA)
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020097010362A KR101177970B1 (ko) | 2006-10-25 | 2007-10-22 | 신규한 축합다환방향족 화합물 및 그의 제조 방법과 그의 용도 |
JP2008540982A JP4958119B2 (ja) | 2006-10-25 | 2007-10-22 | 新規な縮合多環芳香族化合物およびその製造方法、並びにその利用 |
EP07830303.9A EP2098527B1 (en) | 2006-10-25 | 2007-10-22 | Novel fused-ring aromatic compound, process for producing the same, and use thereof |
US12/312,083 US8232546B2 (en) | 2006-10-25 | 2007-10-22 | Fused polycyclic aromatic compound, process for producing the same, and use thereof |
CN200780039700XA CN101528753B (zh) | 2006-10-25 | 2007-10-22 | 缩合多环芳香族化合物及其制造方法和用途 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006-290192 | 2006-10-25 | ||
JP2006290192 | 2006-10-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008050726A1 true WO2008050726A1 (fr) | 2008-05-02 |
Family
ID=39324523
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2007/070569 WO2008050726A1 (fr) | 2006-10-25 | 2007-10-22 | Nouveau composé aromatique à cycle fusionne, son procédé de production et son utilisation |
Country Status (7)
Country | Link |
---|---|
US (1) | US8232546B2 (ja) |
EP (1) | EP2098527B1 (ja) |
JP (1) | JP4958119B2 (ja) |
KR (1) | KR101177970B1 (ja) |
CN (1) | CN101528753B (ja) |
TW (1) | TWI363760B (ja) |
WO (1) | WO2008050726A1 (ja) |
Cited By (50)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009196975A (ja) * | 2008-01-23 | 2009-09-03 | Tosoh Corp | ヘテロアセン誘導体、その前駆化合物及びそれらの製造方法 |
JP2010001236A (ja) * | 2008-06-19 | 2010-01-07 | Hiroshima Univ | 芳香族化合物の誘導体とそれらの中間体の製造方法 |
JP2010083785A (ja) * | 2008-09-30 | 2010-04-15 | Chisso Corp | 平面性の高い分子構造を有する化合物およびこれを用いた有機トランジスタ |
JP2010123951A (ja) * | 2008-11-19 | 2010-06-03 | Xerox Corp | 薄膜トランジスタおよび半導体組成物 |
WO2010098372A1 (ja) | 2009-02-27 | 2010-09-02 | 国立大学法人広島大学 | 電界効果トランジスタ |
JP2010275192A (ja) * | 2009-05-26 | 2010-12-09 | Hiroshima Univ | 芳香族化合物の製造方法 |
JP2011011977A (ja) * | 2009-06-30 | 2011-01-20 | Ushio Chemix Kk | スルホン構造を有する有機半導体化合物 |
WO2011024804A1 (ja) | 2009-08-28 | 2011-03-03 | 帝人株式会社 | 新規な付加化合物、縮合多環芳香族化合物の精製及び製造方法、有機半導体膜形成用溶液、及び新規なα-ジケトン化合物 |
WO2011030918A1 (en) * | 2009-09-11 | 2011-03-17 | Ricoh Company, Ltd. | Leaving substituent-containing compound, organic semiconductor material, organic semiconductor film containing the material, organic electronic device containing the film, method for producing film-like product, pi-electron conjugated compound and method for producing the pi-electron conjugated compound |
JP2011086836A (ja) * | 2009-10-16 | 2011-04-28 | Tokai Univ | 大気安定性に優れた有機トランジスタ |
JP2011148743A (ja) * | 2010-01-22 | 2011-08-04 | Teijin Ltd | 縮合多環芳香族化合物の精製及び製造方法 |
JP2011162510A (ja) * | 2010-02-12 | 2011-08-25 | Teijin Ltd | 新規なα−ジケトン化合物、及び有機半導体デバイス |
JP2011168569A (ja) * | 2009-08-28 | 2011-09-01 | Teijin Ltd | 新規な付加化合物、及び有機半導体デバイス |
JP2011213705A (ja) * | 2010-01-12 | 2011-10-27 | Ricoh Co Ltd | 置換基脱離化合物および有機半導体材料およびその膜およびそれを用いた有機トランジスタ |
JP2011256144A (ja) * | 2010-06-10 | 2011-12-22 | Yamamoto Chem Inc | チオフェン化合物の製造方法 |
JP2012020987A (ja) * | 2010-06-15 | 2012-02-02 | Ricoh Co Ltd | 置換基脱離化合物とそれから得られる有機半導体材料、それを用いた有機電子デバイス、有機薄膜トランジスタおよびディスプレイ装置 |
JP2012067039A (ja) * | 2010-09-24 | 2012-04-05 | Denso Corp | 化合物、有機半導体材料、及び半導体デバイス |
JP2012094691A (ja) * | 2010-10-27 | 2012-05-17 | Nippon Kayaku Co Ltd | フェノール性水酸基含有芳香族ポリアミド樹脂を含有する絶縁層を有する有機半導体素子並びにその製造方法 |
WO2012115236A1 (ja) | 2011-02-25 | 2012-08-30 | 国立大学法人広島大学 | 新規複素環式化合物及びその中間体の製造方法並びにその用途 |
WO2013021953A1 (ja) | 2011-08-05 | 2013-02-14 | 帝人株式会社 | 縮合多環芳香族化合物、芳香族重合体、及び芳香族化合物の合成方法 |
WO2013125599A1 (ja) | 2012-02-22 | 2013-08-29 | Jnc株式会社 | 新規なカルコゲン含有有機化合物およびその用途 |
WO2014027685A1 (ja) | 2012-08-15 | 2014-02-20 | 帝人株式会社 | 有機半導体溶液及び有機半導体膜 |
WO2014027581A1 (ja) | 2012-08-14 | 2014-02-20 | 国立大学法人九州大学 | 複素環化合物及びその利用 |
US8658805B2 (en) | 2011-11-07 | 2014-02-25 | Samsung Electronics Co., Ltd. | Fused polyheteroaromatic compound, organic thin film including the compound, and electronic device including the organic thin film |
WO2014030700A1 (ja) | 2012-08-24 | 2014-02-27 | 日本化薬株式会社 | 芳香族化合物の製造方法 |
WO2014115749A1 (ja) * | 2013-01-22 | 2014-07-31 | 日本化薬株式会社 | 溶液プロセス用有機半導体材料及び有機半導体デバイス |
WO2014136436A1 (ja) * | 2013-03-04 | 2014-09-12 | 出光興産株式会社 | 有機薄膜トランジスタ及びその製造方法 |
WO2014136827A1 (ja) | 2013-03-05 | 2014-09-12 | Jnc株式会社 | カルコゲン含有有機化合物およびその用途 |
JP2014531435A (ja) * | 2011-09-12 | 2014-11-27 | ポリエラ コーポレイション | 半導体特性を有する化合物、ならびに関連する組成物およびデバイス |
US8927977B2 (en) | 2012-03-16 | 2015-01-06 | Jnc Corporation | Organic semiconductor thin film, organic semiconductor device and organic field effect transistor |
JP2016506068A (ja) * | 2012-11-30 | 2016-02-25 | ユニバーシティー オブ フロリダ リサーチ ファウンデーション,インコーポレイテッドUniversity Of Florida Research Foundation,Inc. | アンバイポーラ垂直電界効果トランジスタ |
JP2016113434A (ja) * | 2014-12-18 | 2016-06-23 | 住友化学株式会社 | 化合物、該化合物と高分子化合物を含む組成物、該化合物を含む有機薄膜および有機半導体素子 |
JP2016185951A (ja) * | 2010-04-28 | 2016-10-27 | ユニバーサル ディスプレイ コーポレイション | 融合環を形成するために関与する置換基を持つ、トリフェニレン−ベンゾフラン/ベンゾチオフェン/ベンゾセレノフェン化合物 |
JPWO2015129877A1 (ja) * | 2014-02-28 | 2017-03-30 | 国立大学法人 奈良先端科学技術大学院大学 | 熱電変換材料および熱電変換素子 |
US9853226B2 (en) | 2015-09-08 | 2017-12-26 | Samsung Electronics Co., Ltd. | Fused polycyclic heteroaromatic compound, organic thin film including compound and electronic device including organic thin film |
JP2018026559A (ja) * | 2016-08-03 | 2018-02-15 | 日本化薬株式会社 | 有機光電変換素子、有機光電変換素子用材料及びこれらを用いた有機撮像素子 |
US9954183B2 (en) | 2015-10-21 | 2018-04-24 | Samsung Electronics Co., Ltd. | Intermediate for heteroacene compound and synthetic method of heteroacene compound using its intermediate |
US9972788B2 (en) | 2015-10-12 | 2018-05-15 | Samsung Electronics Co., Ltd. | Fused polycyclic heteroaromatic compound, organic thin film including compound and electronic device including organic thin film |
US10089930B2 (en) | 2012-11-05 | 2018-10-02 | University Of Florida Research Foundation, Incorporated | Brightness compensation in a display |
JP2018534089A (ja) * | 2015-09-15 | 2018-11-22 | ピクシウム ビジョン エスエー | 前側コーティングを有する感光性画素構造体 |
US10230059B2 (en) | 2015-06-19 | 2019-03-12 | Samsung Electronics Co., Ltd. | Organic compound and organic thin film and electronic device |
US10559764B2 (en) | 2015-01-29 | 2020-02-11 | Samsung Electronics Co., Ltd. | Fused polycyclic heteroaromatic compound, organic thin film including compound and electronic device including organic thin film |
WO2020045597A1 (ja) * | 2018-08-31 | 2020-03-05 | 国立大学法人 東京大学 | カルコゲン含有有機化合物、有機半導体材料、有機半導体膜、及び有機電界効果トランジスタ |
US10686145B2 (en) | 2017-07-28 | 2020-06-16 | Samsung Electronics Co., Ltd. | Organic compound, organic thin film, and electronic device |
US11171163B2 (en) | 2015-05-12 | 2021-11-09 | Pixium Vision Sa | Photosensitive pixel structure with wrapped resistor |
US11197993B2 (en) | 2015-06-24 | 2021-12-14 | Pixium Vision Sa | Photosensitive pixel structure with increased light absorption and photosensitive implant |
KR20220063189A (ko) | 2019-09-17 | 2022-05-17 | 닛뽄 가야쿠 가부시키가이샤 | 축합 다환 방향족 화합물 |
KR20220112820A (ko) | 2019-12-10 | 2022-08-11 | 닛뽄 가야쿠 가부시키가이샤 | 축합 다환 방향족 화합물 |
US11559684B2 (en) | 2017-07-14 | 2023-01-24 | Pixium Vision Sa | Photosensitive array |
WO2023189381A1 (ja) * | 2022-03-30 | 2023-10-05 | ソニーグループ株式会社 | 発光素子および電子機器 |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009129943A (ja) * | 2007-11-20 | 2009-06-11 | Mitsubishi Electric Corp | 窒化物半導体装置とその製造方法 |
KR101068575B1 (ko) * | 2009-07-03 | 2011-09-30 | 주식회사 하이닉스반도체 | 반도체 장치 및 그 제조방법 |
CN101798310B (zh) * | 2010-03-05 | 2012-07-11 | 中国科学院长春应用化学研究所 | 一种有机半导体材料及使用该材料的有机薄膜晶体管 |
KR101736971B1 (ko) | 2010-10-01 | 2017-05-30 | 삼성전자주식회사 | 그래핀 전자 소자 및 제조방법 |
KR101813179B1 (ko) | 2011-06-10 | 2017-12-29 | 삼성전자주식회사 | 복층의 게이트 절연층을 구비한 그래핀 전자 소자 |
GB201203159D0 (en) | 2012-02-23 | 2012-04-11 | Smartkem Ltd | Organic semiconductor compositions |
US9133156B2 (en) | 2012-07-06 | 2015-09-15 | Sejong University Industry Academy Cooperation Foundation | Method for preparing selenyl-substituted aromatic aldehyde compounds |
WO2014094954A1 (en) * | 2012-12-18 | 2014-06-26 | Merck Patent Gmbh | Indenophenanthrene based compounds |
DK3039728T3 (en) * | 2013-08-28 | 2018-08-20 | Smartkem Ltd | POLYMERIC ORGANIC SEMICONDUCTOR COMPOSITIONS |
KR101493032B1 (ko) * | 2013-12-10 | 2015-02-17 | 세종대학교산학협력단 | 셀레닐-치환된 방향족 알데하이드계 화합물의 신규 제조 방법 |
US10522771B2 (en) | 2014-12-01 | 2019-12-31 | Samsung Electronics Co., Ltd. | Composition, electronic device, and thin film transistor |
KR102407114B1 (ko) | 2015-05-29 | 2022-06-08 | 삼성전자주식회사 | 절연액, 절연체, 박막 트랜지스터 및 전자 소자 |
KR102380151B1 (ko) | 2015-08-31 | 2022-03-28 | 삼성전자주식회사 | 박막 트랜지스터, 및 이를 포함하는 전자 장치 |
US10056563B2 (en) | 2016-04-08 | 2018-08-21 | Samsung Electronics Co., Ltd. | Synthetic method of fused heteroaromatic compound and fused heteroaromatic compound, and intermediate thereof |
KR102677490B1 (ko) * | 2016-11-08 | 2024-06-20 | 삼성전자주식회사 | 축합 헤테로방향족 화합물의 합성 방법, 축합 헤테로방향족 화합물 및 그 중간체 및 합성 방법 |
KR102464890B1 (ko) | 2017-10-18 | 2022-11-07 | 삼성전자주식회사 | 축합다환 헤테로방향족 화합물, 유기 박막 및 전자 소자 |
KR102711500B1 (ko) | 2018-11-26 | 2024-09-26 | 삼성전자주식회사 | 화합물, 유기 박막, 박막 트랜지스터 및 전자 소자 |
KR102684640B1 (ko) | 2018-12-03 | 2024-07-11 | 삼성전자주식회사 | 유기 박막, 유기 박막 트랜지스터 및 전자 소자 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001261794A (ja) | 2000-03-13 | 2001-09-26 | Japan Science & Technology Corp | ポリチオフェンラダー化合物とその製造法 |
JP2003528856A (ja) * | 2000-03-29 | 2003-09-30 | イーライ・リリー・アンド・カンパニー | ナフタレン誘導体およびその医薬的使用 |
JP2005320299A (ja) * | 2004-05-11 | 2005-11-17 | Japan Science & Technology Agency | 新規なアントラセン誘導体 |
JP2006031893A (ja) | 2004-07-21 | 2006-02-02 | Matsushita Electric Ind Co Ltd | 光ディスク装置 |
JP2006077888A (ja) | 2004-09-09 | 2006-03-23 | Nsk Warner Kk | クラッチハブ |
WO2006077888A1 (ja) * | 2005-01-19 | 2006-07-27 | National University Of Corporation Hiroshima University | 新規な縮合多環芳香族化合物およびその利用 |
JP2006199909A (ja) | 2004-12-20 | 2006-08-03 | Seiko Epson Corp | 導電性材料用組成物、導電性材料、導電層、電子デバイスおよび電子機器 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101259735B1 (ko) | 2004-09-14 | 2013-04-30 | 코닝 인코포레이티드 | 융합 티오펜, 융합 티오펜의 제조방법 및 그 용도 |
JP5499422B2 (ja) * | 2006-06-28 | 2014-05-21 | コニカミノルタ株式会社 | 有機半導体材料、有機半導体膜、有機薄膜トランジスタ及び有機薄膜トランジスタの製造方法 |
KR20080100982A (ko) * | 2007-05-15 | 2008-11-21 | 삼성전자주식회사 | 헤테로아센 화합물, 이를 포함하는 유기 박막 및 상기박막을 포함하는 전자 소자 |
-
2007
- 2007-10-22 EP EP07830303.9A patent/EP2098527B1/en active Active
- 2007-10-22 KR KR1020097010362A patent/KR101177970B1/ko active IP Right Grant
- 2007-10-22 WO PCT/JP2007/070569 patent/WO2008050726A1/ja active Search and Examination
- 2007-10-22 CN CN200780039700XA patent/CN101528753B/zh active Active
- 2007-10-22 US US12/312,083 patent/US8232546B2/en active Active
- 2007-10-22 JP JP2008540982A patent/JP4958119B2/ja active Active
- 2007-10-23 TW TW096139747A patent/TWI363760B/zh active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001261794A (ja) | 2000-03-13 | 2001-09-26 | Japan Science & Technology Corp | ポリチオフェンラダー化合物とその製造法 |
JP2003528856A (ja) * | 2000-03-29 | 2003-09-30 | イーライ・リリー・アンド・カンパニー | ナフタレン誘導体およびその医薬的使用 |
JP2005320299A (ja) * | 2004-05-11 | 2005-11-17 | Japan Science & Technology Agency | 新規なアントラセン誘導体 |
JP2006031893A (ja) | 2004-07-21 | 2006-02-02 | Matsushita Electric Ind Co Ltd | 光ディスク装置 |
JP2006077888A (ja) | 2004-09-09 | 2006-03-23 | Nsk Warner Kk | クラッチハブ |
JP2006199909A (ja) | 2004-12-20 | 2006-08-03 | Seiko Epson Corp | 導電性材料用組成物、導電性材料、導電層、電子デバイスおよび電子機器 |
WO2006077888A1 (ja) * | 2005-01-19 | 2006-07-27 | National University Of Corporation Hiroshima University | 新規な縮合多環芳香族化合物およびその利用 |
Non-Patent Citations (19)
Title |
---|
CHRISTIAENS L. ET AL.: "Synthesis of ortho-substituted alkylchalcogenobenzenes by ortholithiation", CHEMICA SCRIPTA, vol. 24, no. 4-5, 1984, pages 178 - 184, XP008110422 * |
HORTON A.W.: "THE MECHANISM OF THE REACTIONS OF HYDROCARBONS WITH SULFUR", J. ORG. CHEM., vol. 14, no. 5, 1949, pages 761 - 770, XP008109777 * |
HORTON, A. W., J. ORG. CHEM., vol. 14, 1949, pages 761 - 770 |
KOBAYASHI, K., PHOSP. SULF., SILICON AND THE RELATED ELEMENTS, vol. 43, 1989, pages 187 - 208 |
KUDOH, K.; OKAMOTO, T.; YAMAGUCHI, S., ORGANOMETALLICS, vol. 25, 2006, pages 2374 - 2377 |
MAZAKI, Y.; AWAGA, K.; KOBAYASHI, K., J. CHEM. SOC., 1992, pages 1661 - 1663 |
MAZAKI, Y.; HAYASHI, N.; KOBAYASHI, K., J. CHEM. SOC., CHEM. COMMUN., 1992, pages 1381 - 1383 |
MAZAKI, Y.; KOBAYASHI, K., J. CHEM. SOC., PERKIN TRANS., vol. 2, 1992, pages 761 - 764 |
MAZAKI, Y.; KOBAYASHI, K., TETRAHEDRON LETT., vol. 30, 1989, pages 3315 - 3318 |
MURTHY T.S. ET AL.: "Thiophenes and thiapyrans. XXVI. Synthesis of condensed thiophenes from diaryls", JOURNAL OF SCIENTIFIC & INDUSTRIAL RESEARCH, vol. 20B, 1961, pages 169 - 176, XP008110421 * |
MURTHY, T. S.; PANDYA, L. J.; TILAK, B. D., J. SCI. INDUSTR. RES., vol. 20B, April 1961 (1961-04-01), pages 169 - 176 |
OKAMOTO, T. ET AL., ORG. LETT., vol. 7, 2005, pages 5301 - 5304 |
OYAIZU, K. ET AL., MACROMOLECULES, vol. 37, 2004, pages 1257 - 1270 |
PIHERA P. ET AL.: "Diels-Alder reactions of [1]benzothieno[3,2-c]furan", COLLECTION OF CZECHOSLOVAK CHEMICAL COMMUNICATIONS, vol. 63, no. 5, 1998, pages 681 - 697, XP008109778 * |
See also references of EP2098527A4 |
SZE, S. M., SEMICONDUCTOR DEVICE: PHYSICS AND TECHNOLOGY, 1985, pages 30 - 35 |
XIAO, K. ET AL., J. AM. CHEM. SOC., vol. 127, 2005, pages 13281 - 13286 |
ZHANG, X.; COTE, A. P.; MATZGER, A. J.J, J. AM. CHEM. SOC., vol. 127, 2005, pages 10502 - 10503 |
ZHANG, X.; MATZGER, A. J., J. ORG. CHEM., vol. 68, 2003, pages 9813 - 9815 |
Cited By (92)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009196975A (ja) * | 2008-01-23 | 2009-09-03 | Tosoh Corp | ヘテロアセン誘導体、その前駆化合物及びそれらの製造方法 |
JP2010001236A (ja) * | 2008-06-19 | 2010-01-07 | Hiroshima Univ | 芳香族化合物の誘導体とそれらの中間体の製造方法 |
JP2010083785A (ja) * | 2008-09-30 | 2010-04-15 | Chisso Corp | 平面性の高い分子構造を有する化合物およびこれを用いた有機トランジスタ |
JP2010123951A (ja) * | 2008-11-19 | 2010-06-03 | Xerox Corp | 薄膜トランジスタおよび半導体組成物 |
KR101716196B1 (ko) * | 2009-02-27 | 2017-03-14 | 니폰 가야꾸 가부시끼가이샤 | 전계효과 트랜지스터 |
US20110303910A1 (en) * | 2009-02-27 | 2011-12-15 | Nippon Kayaku Kabushiki Kaisha | Field Effect Transistor |
US9796727B2 (en) | 2009-02-27 | 2017-10-24 | Nippon Kayaku Kabushiki Kaisha | Field effect transistor |
EP2402348A4 (en) * | 2009-02-27 | 2012-06-20 | Univ Hiroshima | FIELD EFFECT TRANSISTOR |
CN102333780B (zh) * | 2009-02-27 | 2014-10-29 | 日本化药株式会社 | 场效应晶体管 |
WO2010098372A1 (ja) | 2009-02-27 | 2010-09-02 | 国立大学法人広島大学 | 電界効果トランジスタ |
CN102333780A (zh) * | 2009-02-27 | 2012-01-25 | 国立大学法人广岛大学 | 场效应晶体管 |
EP2402348A1 (en) * | 2009-02-27 | 2012-01-04 | Hiroshima University | Field effect transistor |
JP5477978B2 (ja) * | 2009-02-27 | 2014-04-23 | 日本化薬株式会社 | 電界効果トランジスタ |
KR20110133025A (ko) | 2009-02-27 | 2011-12-09 | 고쿠리츠다이가쿠호진 히로시마다이가쿠 | 전계효과 트랜지스터 |
JP2010275192A (ja) * | 2009-05-26 | 2010-12-09 | Hiroshima Univ | 芳香族化合物の製造方法 |
JP2011011977A (ja) * | 2009-06-30 | 2011-01-20 | Ushio Chemix Kk | スルホン構造を有する有機半導体化合物 |
CN103880860A (zh) * | 2009-08-28 | 2014-06-25 | 帝人株式会社 | 新型加成化合物及其制造方法 |
JP2011168569A (ja) * | 2009-08-28 | 2011-09-01 | Teijin Ltd | 新規な付加化合物、及び有機半導体デバイス |
US9056871B2 (en) | 2009-08-28 | 2015-06-16 | Teijin Limited | Adduct compound, methods for purification and preparation of fused polycyclic aromatic compound, solution for formation of organic semiconductor film, and novel alpha-diketone compound |
TWI492948B (zh) * | 2009-08-28 | 2015-07-21 | Teijin Ltd | Novel addition compounds, refining and production processes of condensed polycyclic aromatic compounds, solutions for forming organic semiconductors, and novel α-diketone compounds |
CN102548998A (zh) * | 2009-08-28 | 2012-07-04 | 帝人株式会社 | 新型加成化合物、稠合多环芳香族化合物的精制以及制造方法、有机半导体膜形成用溶液、以及新型α-二酮化合物 |
WO2011024804A1 (ja) | 2009-08-28 | 2011-03-03 | 帝人株式会社 | 新規な付加化合物、縮合多環芳香族化合物の精製及び製造方法、有機半導体膜形成用溶液、及び新規なα-ジケトン化合物 |
CN103880860B (zh) * | 2009-08-28 | 2017-05-17 | 帝人株式会社 | 新型加成化合物及其制造方法 |
US8680296B2 (en) | 2009-09-11 | 2014-03-25 | Ricoh Company, Ltd. | Leaving substituent-containing compound, products produced using the same, and methods for producing the products |
US9123896B2 (en) | 2009-09-11 | 2015-09-01 | Ricoh Company, Ltd. | Organic electronic device containing an organic semiconductor material film which contains a leaving substituent-containing compound |
WO2011030918A1 (en) * | 2009-09-11 | 2011-03-17 | Ricoh Company, Ltd. | Leaving substituent-containing compound, organic semiconductor material, organic semiconductor film containing the material, organic electronic device containing the film, method for producing film-like product, pi-electron conjugated compound and method for producing the pi-electron conjugated compound |
US9224959B2 (en) | 2009-09-11 | 2015-12-29 | Ricoh Company, Ltd. | Method for producing a pi-electron conjugated compound |
JP2011086836A (ja) * | 2009-10-16 | 2011-04-28 | Tokai Univ | 大気安定性に優れた有機トランジスタ |
JP2011213705A (ja) * | 2010-01-12 | 2011-10-27 | Ricoh Co Ltd | 置換基脱離化合物および有機半導体材料およびその膜およびそれを用いた有機トランジスタ |
JP2011148743A (ja) * | 2010-01-22 | 2011-08-04 | Teijin Ltd | 縮合多環芳香族化合物の精製及び製造方法 |
JP2011162510A (ja) * | 2010-02-12 | 2011-08-25 | Teijin Ltd | 新規なα−ジケトン化合物、及び有機半導体デバイス |
JP2016185951A (ja) * | 2010-04-28 | 2016-10-27 | ユニバーサル ディスプレイ コーポレイション | 融合環を形成するために関与する置換基を持つ、トリフェニレン−ベンゾフラン/ベンゾチオフェン/ベンゾセレノフェン化合物 |
JP2011256144A (ja) * | 2010-06-10 | 2011-12-22 | Yamamoto Chem Inc | チオフェン化合物の製造方法 |
JP2012020987A (ja) * | 2010-06-15 | 2012-02-02 | Ricoh Co Ltd | 置換基脱離化合物とそれから得られる有機半導体材料、それを用いた有機電子デバイス、有機薄膜トランジスタおよびディスプレイ装置 |
JP2012067039A (ja) * | 2010-09-24 | 2012-04-05 | Denso Corp | 化合物、有機半導体材料、及び半導体デバイス |
JP2012094691A (ja) * | 2010-10-27 | 2012-05-17 | Nippon Kayaku Co Ltd | フェノール性水酸基含有芳香族ポリアミド樹脂を含有する絶縁層を有する有機半導体素子並びにその製造方法 |
US9018630B2 (en) | 2011-02-25 | 2015-04-28 | Nippon Kayaku Kabushiki Kaisha | Heterocyclic dinaphtho thieno thiophene (DNTT) compounds for use as organic semiconductor thin films in field effect transistors and related methods |
JPWO2012115236A1 (ja) * | 2011-02-25 | 2014-07-07 | 日本化薬株式会社 | 新規複素環式化合物及びその中間体の製造方法並びにその用途 |
WO2012115236A1 (ja) | 2011-02-25 | 2012-08-30 | 国立大学法人広島大学 | 新規複素環式化合物及びその中間体の製造方法並びにその用途 |
JP5674916B2 (ja) * | 2011-02-25 | 2015-02-25 | 日本化薬株式会社 | 新規複素環式化合物及びその中間体の製造方法並びにその用途 |
EP2889301A1 (en) | 2011-02-25 | 2015-07-01 | Nippon Kayaku Kabushiki Kaisha | Novel heterocyclic compound, method for producing intermediate therefor, and use thereof |
JP2015110571A (ja) * | 2011-02-25 | 2015-06-18 | 日本化薬株式会社 | 新規複素環式化合物及びその中間体の製造方法並びにその用途 |
WO2013021953A1 (ja) | 2011-08-05 | 2013-02-14 | 帝人株式会社 | 縮合多環芳香族化合物、芳香族重合体、及び芳香族化合物の合成方法 |
US8829202B2 (en) | 2011-08-05 | 2014-09-09 | Teijin Limited | Condensed polycyclic aromatic compound, aromatic polymer, and method for synthesizing aromatic compound |
US9911927B2 (en) | 2011-09-12 | 2018-03-06 | Flexterra, Inc. | Compounds having semiconducting properties and related compositions and devices |
JP2014531435A (ja) * | 2011-09-12 | 2014-11-27 | ポリエラ コーポレイション | 半導体特性を有する化合物、ならびに関連する組成物およびデバイス |
US8658805B2 (en) | 2011-11-07 | 2014-02-25 | Samsung Electronics Co., Ltd. | Fused polyheteroaromatic compound, organic thin film including the compound, and electronic device including the organic thin film |
WO2013125599A1 (ja) | 2012-02-22 | 2013-08-29 | Jnc株式会社 | 新規なカルコゲン含有有機化合物およびその用途 |
US9537110B2 (en) | 2012-02-22 | 2017-01-03 | Jnc Corporation | Chalcogen-containing organic compound and use thereof |
KR20140125407A (ko) | 2012-02-22 | 2014-10-28 | 제이엔씨 주식회사 | 신규한 칼코겐 함유 유기 화합물 및 그 용도 |
CN104125951B (zh) * | 2012-02-22 | 2017-05-24 | 捷恩智株式会社 | 含硫族元素有机化合物与其制造方法、有机半导体材料、有机半导体膜及有机场效应晶体管 |
JPWO2013125599A1 (ja) * | 2012-02-22 | 2015-07-30 | Jnc株式会社 | 新規なカルコゲン含有有機化合物およびその用途 |
CN104125951A (zh) * | 2012-02-22 | 2014-10-29 | 捷恩智株式会社 | 新颖的含硫族元素有机化合物及其用途 |
US8927977B2 (en) | 2012-03-16 | 2015-01-06 | Jnc Corporation | Organic semiconductor thin film, organic semiconductor device and organic field effect transistor |
US9187493B2 (en) | 2012-08-14 | 2015-11-17 | Nippon Kayaku Kabushiki Kaisha | Heterocyclic compound and use thereof |
WO2014027581A1 (ja) | 2012-08-14 | 2014-02-20 | 国立大学法人九州大学 | 複素環化合物及びその利用 |
KR20150042257A (ko) | 2012-08-14 | 2015-04-20 | 고쿠리쓰다이가쿠호진 규슈다이가쿠 | 헤테로시클릭 화합물 및 이의 용도 |
WO2014027685A1 (ja) | 2012-08-15 | 2014-02-20 | 帝人株式会社 | 有機半導体溶液及び有機半導体膜 |
WO2014030700A1 (ja) | 2012-08-24 | 2014-02-27 | 日本化薬株式会社 | 芳香族化合物の製造方法 |
US9260451B2 (en) | 2012-08-24 | 2016-02-16 | Nippon Kayaku Kabushiki Kaisha | Method for producing aromatic compound |
JPWO2014030700A1 (ja) * | 2012-08-24 | 2016-07-28 | 日本化薬株式会社 | 芳香族化合物の製造方法 |
US10089930B2 (en) | 2012-11-05 | 2018-10-02 | University Of Florida Research Foundation, Incorporated | Brightness compensation in a display |
JP2016506068A (ja) * | 2012-11-30 | 2016-02-25 | ユニバーシティー オブ フロリダ リサーチ ファウンデーション,インコーポレイテッドUniversity Of Florida Research Foundation,Inc. | アンバイポーラ垂直電界効果トランジスタ |
WO2014115749A1 (ja) * | 2013-01-22 | 2014-07-31 | 日本化薬株式会社 | 溶液プロセス用有機半導体材料及び有機半導体デバイス |
KR20150108918A (ko) | 2013-01-22 | 2015-09-30 | 니폰 가야꾸 가부시끼가이샤 | 용액 프로세스용 유기 반도체 재료 및 유기 반도체 디바이스 |
JPWO2014115749A1 (ja) * | 2013-01-22 | 2017-01-26 | 日本化薬株式会社 | 溶液プロセス用有機半導体材料及び有機半導体デバイス |
WO2014136436A1 (ja) * | 2013-03-04 | 2014-09-12 | 出光興産株式会社 | 有機薄膜トランジスタ及びその製造方法 |
KR20150126898A (ko) | 2013-03-05 | 2015-11-13 | 제이엔씨 주식회사 | 칼코겐 함유 유기 화합물 및 그의 용도 |
US9853225B2 (en) | 2013-03-05 | 2017-12-26 | Jnc Corporation | Chalcogen-containing organic compound and a use thereof |
WO2014136827A1 (ja) | 2013-03-05 | 2014-09-12 | Jnc株式会社 | カルコゲン含有有機化合物およびその用途 |
JPWO2015129877A1 (ja) * | 2014-02-28 | 2017-03-30 | 国立大学法人 奈良先端科学技術大学院大学 | 熱電変換材料および熱電変換素子 |
JP2016113434A (ja) * | 2014-12-18 | 2016-06-23 | 住友化学株式会社 | 化合物、該化合物と高分子化合物を含む組成物、該化合物を含む有機薄膜および有機半導体素子 |
US10559764B2 (en) | 2015-01-29 | 2020-02-11 | Samsung Electronics Co., Ltd. | Fused polycyclic heteroaromatic compound, organic thin film including compound and electronic device including organic thin film |
US11171163B2 (en) | 2015-05-12 | 2021-11-09 | Pixium Vision Sa | Photosensitive pixel structure with wrapped resistor |
US10230059B2 (en) | 2015-06-19 | 2019-03-12 | Samsung Electronics Co., Ltd. | Organic compound and organic thin film and electronic device |
US11197993B2 (en) | 2015-06-24 | 2021-12-14 | Pixium Vision Sa | Photosensitive pixel structure with increased light absorption and photosensitive implant |
US9853226B2 (en) | 2015-09-08 | 2017-12-26 | Samsung Electronics Co., Ltd. | Fused polycyclic heteroaromatic compound, organic thin film including compound and electronic device including organic thin film |
JP2018534089A (ja) * | 2015-09-15 | 2018-11-22 | ピクシウム ビジョン エスエー | 前側コーティングを有する感光性画素構造体 |
US9972788B2 (en) | 2015-10-12 | 2018-05-15 | Samsung Electronics Co., Ltd. | Fused polycyclic heteroaromatic compound, organic thin film including compound and electronic device including organic thin film |
US9954183B2 (en) | 2015-10-21 | 2018-04-24 | Samsung Electronics Co., Ltd. | Intermediate for heteroacene compound and synthetic method of heteroacene compound using its intermediate |
JP2018026559A (ja) * | 2016-08-03 | 2018-02-15 | 日本化薬株式会社 | 有機光電変換素子、有機光電変換素子用材料及びこれらを用いた有機撮像素子 |
US11559684B2 (en) | 2017-07-14 | 2023-01-24 | Pixium Vision Sa | Photosensitive array |
US10686145B2 (en) | 2017-07-28 | 2020-06-16 | Samsung Electronics Co., Ltd. | Organic compound, organic thin film, and electronic device |
JPWO2020045597A1 (ja) * | 2018-08-31 | 2021-08-26 | 国立大学法人 東京大学 | カルコゲン含有有機化合物、有機半導体材料、有機半導体膜、及び有機電界効果トランジスタ |
CN112638895A (zh) * | 2018-08-31 | 2021-04-09 | 国立大学法人东京大学 | 含氧族元素的有机化合物、有机半导体材料、有机半导体膜和有机电力场效应晶体管 |
WO2020045597A1 (ja) * | 2018-08-31 | 2020-03-05 | 国立大学法人 東京大学 | カルコゲン含有有機化合物、有機半導体材料、有機半導体膜、及び有機電界効果トランジスタ |
JP7296068B2 (ja) | 2018-08-31 | 2023-06-22 | 国立大学法人 東京大学 | カルコゲン含有有機化合物、有機半導体材料、有機半導体膜、及び有機電界効果トランジスタ |
US11974501B2 (en) | 2018-08-31 | 2024-04-30 | The University Of Tokyo | Chalcogen-containing organic compound, organic semiconductor material, organic semiconductor film, and organic field-effect transistor |
KR20220063189A (ko) | 2019-09-17 | 2022-05-17 | 닛뽄 가야쿠 가부시키가이샤 | 축합 다환 방향족 화합물 |
US12024526B2 (en) | 2019-09-17 | 2024-07-02 | Nippon Kayaku Kabushiki Kaisha | Fused polycyclic aromatic compound |
KR20220112820A (ko) | 2019-12-10 | 2022-08-11 | 닛뽄 가야쿠 가부시키가이샤 | 축합 다환 방향족 화합물 |
WO2023189381A1 (ja) * | 2022-03-30 | 2023-10-05 | ソニーグループ株式会社 | 発光素子および電子機器 |
Also Published As
Publication number | Publication date |
---|---|
CN101528753A (zh) | 2009-09-09 |
US20100065826A1 (en) | 2010-03-18 |
TW200838866A (en) | 2008-10-01 |
EP2098527A1 (en) | 2009-09-09 |
JP4958119B2 (ja) | 2012-06-20 |
CN101528753B (zh) | 2012-05-23 |
KR20090074248A (ko) | 2009-07-06 |
JPWO2008050726A1 (ja) | 2010-02-25 |
TWI363760B (en) | 2012-05-11 |
EP2098527A4 (en) | 2012-05-23 |
KR101177970B1 (ko) | 2012-08-28 |
US8232546B2 (en) | 2012-07-31 |
EP2098527B1 (en) | 2016-03-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2008050726A1 (fr) | Nouveau composé aromatique à cycle fusionne, son procédé de production et son utilisation | |
WO2006077888A1 (ja) | 新規な縮合多環芳香族化合物およびその利用 | |
TWI594983B (zh) | 有機薄膜電晶體、萘并雙苯并呋喃化合物、非發光性有機半導體元件用塗佈溶液、有機半導體薄膜、有機薄膜電晶體用材料及有機半導體材料 | |
JP2010006794A (ja) | ジオキサアンタントレン系化合物及び半導体装置 | |
JP6061886B2 (ja) | 有機薄膜トランジスタ、有機半導体薄膜および有機半導体材料 | |
JP2010258214A (ja) | バンドギャップが広いことを特徴とする有機半導体化合物 | |
JP5897050B2 (ja) | 有機薄膜トランジスタ、有機半導体薄膜および有機半導体材料 | |
WO2012157474A1 (ja) | 化合物、電界効果トランジスタ及びその製造方法、太陽電池、有機発光素子、組成物、表示装置用アレイ並びに表示装置 | |
JP5940104B2 (ja) | 有機薄膜トランジスタ、有機半導体薄膜および有機半導体材料 | |
EP2068379A1 (en) | Organic semiconductor material, organic semiconductor device using the same, and their production methods | |
WO2014119713A1 (ja) | 有機薄膜トランジスタ、有機半導体薄膜および有機半導体材料 | |
TWI606052B (zh) | 有機薄膜電晶體、化合物及其應用 | |
WO2012165612A1 (ja) | 有機半導体材料及び有機エレクトロニクスデバイス | |
WO2011071018A1 (ja) | チエノピラジン化合物、およびそれを含有した電界効果トランジスタ | |
JP6247568B2 (ja) | 有機薄膜トランジスタ、非発光性有機半導体デバイス用有機半導体材料およびその応用 | |
US8901543B2 (en) | Organic semiconductor device and its production method, and compound | |
US8513466B2 (en) | Class of soluble, photooxidatively resistant acene derivatives | |
WO2011071017A1 (ja) | ジアザボロール化合物、およびそれを含有した電界効果トランジスタ | |
JP2018145109A (ja) | 多環芳香族化合物、多環芳香族化合物の多量体、それらの製造方法、およびそれらを含む有機半導体デバイス | |
JP2008222607A (ja) | 溶解性の高いアセン化合物およびそれを用いた電子素子 | |
JPWO2008108442A1 (ja) | 新規ポルフィラジン誘導体およびその中間体、新規ポルフィラジン誘導体およびその中間体の製造方法、並びにその利用 | |
JP6047969B2 (ja) | ジチエノベンゾジチオフェン誘導体溶液及びこれを用いた有機半導体層 | |
WO2015016343A1 (ja) | 有機トランジスタ、有機半導体膜および有機半導体材料ならびにそれらの応用 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 200780039700.X Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 07830303 Country of ref document: EP Kind code of ref document: A1 |
|
DPE1 | Request for preliminary examination filed after expiration of 19th month from priority date (pct application filed from 20040101) | ||
WWE | Wipo information: entry into national phase |
Ref document number: 2008540982 Country of ref document: JP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 12312083 Country of ref document: US |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2007830303 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1020097010362 Country of ref document: KR |
|
DPE1 | Request for preliminary examination filed after expiration of 19th month from priority date (pct application filed from 20040101) |