WO2007049441A1 - シート切断用テーブル - Google Patents
シート切断用テーブル Download PDFInfo
- Publication number
- WO2007049441A1 WO2007049441A1 PCT/JP2006/319931 JP2006319931W WO2007049441A1 WO 2007049441 A1 WO2007049441 A1 WO 2007049441A1 JP 2006319931 W JP2006319931 W JP 2006319931W WO 2007049441 A1 WO2007049441 A1 WO 2007049441A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- adhesive
- sheet
- adhesive sheet
- plate
- wafer
- Prior art date
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
- B26D3/10—Making cuts of other than simple rectilinear form
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
- B26F1/3846—Cutting-out; Stamping-out cutting out discs or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/768—Rotatable disc tool pair or tool and carrier
- Y10T83/7684—With means to support work relative to tool[s]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/768—Rotatable disc tool pair or tool and carrier
- Y10T83/7684—With means to support work relative to tool[s]
- Y10T83/7688—Plural tool elements successively actuated at same station
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/768—Rotatable disc tool pair or tool and carrier
- Y10T83/7684—With means to support work relative to tool[s]
- Y10T83/7693—Tool moved relative to work-support during cutting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/768—Rotatable disc tool pair or tool and carrier
- Y10T83/7684—With means to support work relative to tool[s]
- Y10T83/7693—Tool moved relative to work-support during cutting
- Y10T83/7697—Tool angularly adjustable relative to work-support
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/768—Rotatable disc tool pair or tool and carrier
- Y10T83/7684—With means to support work relative to tool[s]
- Y10T83/7701—Supporting surface and tool axis angularly related
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/768—Rotatable disc tool pair or tool and carrier
- Y10T83/7684—With means to support work relative to tool[s]
- Y10T83/7701—Supporting surface and tool axis angularly related
- Y10T83/7705—Adjustable angular relationship
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/768—Rotatable disc tool pair or tool and carrier
- Y10T83/7684—With means to support work relative to tool[s]
- Y10T83/7709—Unidirectionally movable work support
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/768—Rotatable disc tool pair or tool and carrier
- Y10T83/7684—With means to support work relative to tool[s]
- Y10T83/7709—Unidirectionally movable work support
- Y10T83/7713—With opposed work-presser
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/768—Rotatable disc tool pair or tool and carrier
- Y10T83/7684—With means to support work relative to tool[s]
- Y10T83/7709—Unidirectionally movable work support
- Y10T83/7713—With opposed work-presser
- Y10T83/7718—Presser co-axial with tool
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/768—Rotatable disc tool pair or tool and carrier
- Y10T83/7684—With means to support work relative to tool[s]
- Y10T83/7722—Support and tool relatively adjustable
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/768—Rotatable disc tool pair or tool and carrier
- Y10T83/7684—With means to support work relative to tool[s]
- Y10T83/7722—Support and tool relatively adjustable
- Y10T83/7726—By movement of the tool
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/768—Rotatable disc tool pair or tool and carrier
- Y10T83/7684—With means to support work relative to tool[s]
- Y10T83/773—Work-support includes passageway for tool [e.g., slotted table]
Definitions
- the present invention relates to a sheet cutting table, and more specifically, without causing wrinkles in the adhesive sheet when cutting the adhesive sheet bonded to the plate member along the outer periphery of the plate member.
- the present invention relates to a sheet cutting table capable of cutting.
- a protective sheet for protecting the circuit surface is attached to a plate-shaped member such as a semiconductor wafer (hereinafter simply referred to as “wafer”), or a heat-sensitive adhesive property is applied to the back surface or the surface.
- a plate-shaped member such as a semiconductor wafer (hereinafter simply referred to as “wafer”)
- a heat-sensitive adhesive property is applied to the back surface or the surface.
- An adhesive sheet is affixed.
- Patent Document 1 Japanese Patent Application Laid-Open No. 2002-176011
- the present invention has been devised by paying attention to such inconveniences, and the purpose of the present invention is to cut the adhesive sheet with high accuracy by preventing the occurrence of wrinkles on the adhesive sheet when cutting.
- An object of the present invention is to provide a sheet cutting table.
- the present invention provides a region protruding from the outer periphery of the plate-shaped member after an adhesive sheet having a plane area larger than the plane area of the plate-shaped member is attached to the plate-shaped member In cutting tape for cutting sheets with a cutting device as an unnecessary adhesive sheet,
- An inner table serving as a mounting surface for the plate-like member, and an outer table positioned outside the inner table and facing the unnecessary adhesive sheet region,
- the upper surface of the outer table is configured as a non-adhesive treatment surface, and an adhesive member capable of adhering the unnecessary adhesive sheet region is provided in a partial region thereof.
- the adhesive member can be attached to and detached from the sheet cutting table, and the adhesive area can be increased or decreased according to the adhesive force of the adhesive sheet.
- the adhesive member is constituted by one or a plurality of members, and can be attached to and detached from the sheet cutting table, and the number thereof can be increased or decreased according to the adhesive force of the adhesive sheet.
- the adhesive member may be provided in a closed loop shape surrounding the outer periphery of the plate member. [0011] Further, the adhesive member may be provided intermittently on the outer periphery side of the plate member. It may be adopted.
- the adhesive member can be configured to be thermally conductive or heatable by a heater.
- the upper surface of the outer table is configured as a non-adhesive treatment surface, and the adhesive member to which the adhesive sheet can be bonded is provided in a partial region thereof. It will adhere to an adhesive member partially. Therefore, even if tensile force is applied to the adhesive sheet by the cutter blade, the unnecessary adhesive sheet area around the wafer does not move, and the generation of wrinkles that can occur on the adhesive sheet can be avoided and cutting can be performed with high accuracy.
- the adhesive member is provided in a closed loop shape surrounding the outer periphery of the plate-like member, it is possible to completely eliminate the room for generating wrinkles on the adhesive sheet, and it is possible to further improve the cutting accuracy.
- FIG. 1 is a schematic front view of a sheet sticking device according to the present embodiment.
- FIG. 2 is a schematic perspective view of the sheet sticking apparatus.
- FIG. 3 is a schematic plan view of a sheet cutting table.
- FIG. 4 is an enlarged cross-sectional view taken along line A—A in FIG.
- FIG. 5 is a schematic plan view showing a modification of the sheet cutting table.
- FIG. 6 is a schematic plan view showing another modification of the sheet cutting table.
- FIG. 7 is a schematic plan view showing still another modification of the sheet cutting table.
- FIG. 1 shows a schematic front view of a sheet sticking apparatus to which a sheet cutting table according to the present invention is applied
- FIG. 2 shows a schematic perspective view thereof.
- the sheet sticking apparatus 10 includes a sheet feeding unit 12 arranged on the upper part of the base 11, a table 13 for supporting the wafer W as a plate-like member, and a pressure-sensitive pressure fed to the upper surface side of the wafer W.
- a pressing roller 14 that applies a pressing force to the adhesive sheet S and attaches the adhesive sheet S to the wafer W, and the adhesive sheet S is applied along the outer periphery of the wafer W after the adhesive sheet S is applied to the wafer W.
- the apparatus 19 is comprised.
- the sheet feeding unit 12 includes a support roller 20 that supports a roll-shaped raw sheet L in which a strip-shaped adhesive sheet S is temporarily attached to one surface of a strip-shaped release sheet PS, and the support roller 20
- the peeled-out sheet L is abruptly reversed to peel the adhesive sheet S from the release sheet PS, the peel plate 22 that winds up and collects the release sheet PS, the support roller 20 and the recovery roller 23
- a plurality of guide rollers 25 to 31 arranged between the guide rollers 25 and 26, a buffer roller 33 arranged between the guide rollers 25 and 26, and arranged between the guide rollers 27 and 28, and supported by the load cell 39 and the load cell 39
- the tension measuring means 35 including the tension measuring roller 40 positioned on the base side of the peel plate 22, and the peel plate 22, guide rollers 27, 28, 29, and the tension measuring means 35 are integrally supported and pressed.
- the guide rollers 27 and 29 are provided with brake shoes 32 and 42. These brake shoes 32 and 42 correspond to the cylinders 38 and 48 when the adhesive sheet S is attached to the wafer W, respectively. By advancing and retreating with respect to the guide rollers 27 and 29, the adhesive sheet S is sandwiched and its feeding is suppressed.
- the table 13 includes an inner table 52 having a substantially circular shape in plan view, which sucks and supports the wafer W and forms a mounting surface of the wafer W, and the inner table 52. It is constituted by an outer table 51 having a substantially square shape in a plan view provided so as to form a gap C between the outer peripheral edge and the outer peripheral edge.
- the outer table 51 includes a recess that can receive the inner table 52, and is provided so as to be movable up and down with respect to the base 11 via a single-axis robot (not shown).
- the inner table 52 is provided to be movable up and down with respect to the outer table 51 via a single-axis robot 56. Therefore, the outer table 51 and the inner table 52 can be moved up and down integrally, and can be moved up and down independently of each other, so that a predetermined amount can be set according to the thickness of the adhesive sheet S and the thickness of the wafer W. It can be adjusted to the height position.
- the outer table 51 is configured as a non-adhesion treated surface 51A in which the upper surface thereof is processed with fluororesin so that the adhesion surface side of the adhesive sheet S is not adhered, and the inner peripheral region thereof has a non-adhesion treatment.
- a ring member 53 that is also a stainless steel member constituting the adhesive member is disposed and fixed by a fixing tool (not shown).
- the adhesive member is made of a stainless steel material, but is not limited to this, and may be made of an iron material, an aluminum material, or the like.
- the ring member 53 adheres to the upper surface of the wafer W together with the upper surface of the wafer W. It is like that.
- the ring member 53 can be controlled by controlling the adhesive force of the adhesive sheet S to the ring member 53 by installing a heater such as -chrome wire inside, and the adhesive sheet S is a heat-sensitive adhesive sheet. It is also possible to cope with heat-sensitive adhesiveness.
- the heater may be provided inside the outer table 51 not inside the ring member 53 so that the ring member 53 is indirectly heated! /.
- a plurality of ring members 53 can be mounted, and the number of the ring members 53 can be increased or decreased according to the adhesive strength of the adhesive sheet S.
- the pressing roller 14 is supported via a portal frame 57.
- Cylinders 59, 59 are provided on the upper surface side of the portal frame 57, and the pressing roller 14 is provided so that it can be moved up and down by the operation of these cylinders 59.
- the portal frame 57 can be moved in the X direction in the figure via the single-axis robot 60 and the guide rail 61 as shown in FIG. Noh is provided.
- the cutting device 15 is constituted by an articulated robot.
- the cutting device 15 includes a robot main body 62 and a cutter blade 63 supported on the free end side of the robot main body 62.
- the robot body 62 includes a base part 64, first arm 65A to sixth arm 65F arranged on the upper surface side of the base 64 part and provided to be rotatable in a predetermined direction, and the distal end side of the sixth arm 65F, A tool holding chuck 69 attached to the free end side of the robot body 52.
- the tool holding chuck 69 is detachably attachable to a cutter blade receiver 70 having a substantially cylindrical shape and a cutter blade 63 having a blade 63 B disposed at a position spaced apart by approximately 120 degrees in the circumferential direction of the cutter blade receiver 70. And three chuck claws 71 for holding.
- the cutting device 15 in the present embodiment is specifically the same as that disclosed in Japanese Patent Application No. 2005-229226 already filed by the present applicant, and therefore detailed description thereof is omitted.
- the peeling device 18 is composed of a small diameter roller 80 and a large diameter roller 81.
- the small diameter roller 80 and the large diameter roller 81 are supported by the moving frame F.
- This moving frame F is composed of a front frame F 1 that is relatively arranged along the Y direction in FIG. 2 and a rear frame F 2 that is connected to the front frame F 1 via a connecting member 83.
- the front frame F1 is supported by the guide rail 61 while being supported by the single-axis robot 85, so that the moving frame F can move in the X direction in FIG.
- the large-diameter roller 81 is supported by an arm member 84, and the arm member 84 is displaceable in a direction in which the large-diameter roller 81 is separated from and approaches the small-diameter roller 80 by a cylinder 88.
- the scraping device 19 is supported on the free end side of the driving roller 90 supported by the moving frame F and the rotating arm 91, and is in contact with the outer peripheral surface of the driving roller 90 via the spring 92. It is constituted by a take-off roller 93 that pulls up S1.
- a drive motor M is disposed at the shaft end of the drive roller 90. The drive roller 90 rotates by driving the motor M, and the take-off roller 93 rotates following the rotation of the drive roller 90. It is getting rolled up. Note that the scraping roller 93 rotates to the right in FIG. 1 against the force of the spring 92 as the scraping amount increases.
- the method for applying the adhesive sheet S is substantially the same as that in Japanese Patent Application No. 2005-198806. At this time, only the area corresponding to the upper surface of the ring member 53 adheres relatively strongly to the unnecessary adhesive sheet S1 around the UE and W, and the other area is the upper surface of the outer table 51, that is, the non-adhesive treated surface 51A. It is kept in a state of slight adhesion or non-adhesion.
- the cutting device 15 reads the movement trajectory data stored in the storage unit of the control device (not shown), and the blade 63B cuts the adhesive sheet S along the outer periphery of the wafer W on the inner table 52.
- the ring member 53 is partially bonded to the unnecessary adhesive sheet S1
- the adhesive sheet region between the outer peripheral edge of the wafer W and the ring member 53 is in a stretched state, whereby the blade 63B
- the adhesive sheet S will not be dragged by the blade 63B due to its tensile force, and no wrinkles will be generated on the side of the wafer.
- the scraping device 19 removes the unnecessary adhesive sheet S1. It is wound up. At the time of winding, the unnecessary adhesive sheet S1 is only partially bonded to the ring member 53, so that it can be easily peeled off by being wound up by the small-diameter roller 80, and the unnecessary adhesive sheet S1 is cut or stretched. There will be no problems with the winding. Since this winding is the same as the action disclosed in Japanese Patent Application No. 2005-198806, detailed description is omitted here.
- FIGS. 5 to 7 illustrating the case where the bonding surface is constituted by the ring member 53 along the outer periphery of the wafer W can be adopted. That is, in the example shown in FIG. 5, a plurality of plate members 63 as adhesive members having a frame force along a substantially square locus corresponding to the outer shape of the outer table 51 are arranged. In the example shown in FIG.
- plate members 63 as adhesive members are arranged on all sides of the outer table 51. Furthermore, in the example shown in FIG. 7, a plate material 63 as a disk-shaped adhesive member is intermittently disposed along the outer periphery of the inner table 52.
- reference numeral 51B indicates a hole with a bottom, and a disc-shaped plate material 63 is detachably disposed in the hole 51B.
- an adhesive surface can be formed instead of the adhesive member by not performing the non-adhesion processing in the region corresponding to the adhesive member.
- the wafer W is targeted as the plate-like member.
- the plate-like member in the present invention is not limited to the semiconductor wafer W, but is made of glass, steel plate, or resin plate. Other plate-like members can also be targeted, and the semiconductor wafer may be a silicon wafer or a compound wafer. Further, the plate-like member is not limited to a circular shape, and may be a polygonal shape.
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- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE200611002689 DE112006002689T5 (de) | 2005-10-24 | 2006-10-05 | Folienschneidetisch |
CN2006800384490A CN101291785B (zh) | 2005-10-24 | 2006-10-05 | 薄片切断用工作台 |
KR1020087007199A KR101278463B1 (ko) | 2005-10-24 | 2006-10-05 | 시트 절단용 테이블 |
US12/067,280 US7954533B2 (en) | 2005-10-24 | 2006-10-05 | Sheet cutting table |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005308272A JP4795772B2 (ja) | 2005-10-24 | 2005-10-24 | シート切断用テーブル及びシート貼付装置 |
JP2005-308272 | 2005-10-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2007049441A1 true WO2007049441A1 (ja) | 2007-05-03 |
Family
ID=37967559
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2006/319931 WO2007049441A1 (ja) | 2005-10-24 | 2006-10-05 | シート切断用テーブル |
Country Status (7)
Country | Link |
---|---|
US (1) | US7954533B2 (ja) |
JP (1) | JP4795772B2 (ja) |
KR (1) | KR101278463B1 (ja) |
CN (1) | CN101291785B (ja) |
DE (1) | DE112006002689T5 (ja) |
TW (1) | TWI391982B (ja) |
WO (1) | WO2007049441A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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US7987886B2 (en) * | 2008-05-02 | 2011-08-02 | Nitto Denko Corporation | Protective tape joining apparatus |
JP2012206233A (ja) * | 2011-03-30 | 2012-10-25 | Brother Industries Ltd | 切断装置 |
CN103521542A (zh) * | 2013-09-26 | 2014-01-22 | 芜湖环球汽车配件有限公司 | 一种钣金件挤压成型机的自动升降机构 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
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JP4740927B2 (ja) * | 2007-11-27 | 2011-08-03 | 日東精機株式会社 | 半導体ウエハの保護テープ切断方法およびその装置 |
JP5112534B2 (ja) | 2011-04-26 | 2013-01-09 | 株式会社東芝 | 磁気記録媒体、その製造方法、及び磁気記録再生装置 |
US8261804B1 (en) * | 2011-10-28 | 2012-09-11 | Meicer Semiconductor Inc. | IC layers separator |
CN103302697B (zh) * | 2013-05-23 | 2015-07-29 | 亚洲新能源(中国)有限公司 | 黏贴橡胶胎架 |
US10674928B2 (en) | 2014-07-17 | 2020-06-09 | Medtronic, Inc. | Leadless pacing system including sensing extension |
CN104191044B (zh) * | 2014-08-14 | 2016-08-31 | 浙江德清森朗装饰材料有限公司 | 一种铝板开槽切割机 |
CN105437280B (zh) * | 2015-12-16 | 2017-09-15 | 重庆嘉威特节能玻璃有限公司 | 一种切割效果好的可移动玻璃制造拉伸成型设备 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61276231A (ja) * | 1985-05-30 | 1986-12-06 | Nitto Electric Ind Co Ltd | ウエハ保護フイルムの切断方法 |
JP2004047976A (ja) * | 2002-05-21 | 2004-02-12 | Nitto Denko Corp | 保護テープ貼付方法およびその装置 |
JP2004221469A (ja) * | 2003-01-17 | 2004-08-05 | Nitto Denko Corp | 粘着テープ貼付け方法およびその装置 |
JP2004266183A (ja) * | 2003-03-04 | 2004-09-24 | Nitto Denko Corp | 粘着テープ貼付け方法およびその装置 |
JP2006095606A (ja) * | 2004-09-28 | 2006-04-13 | Nitto Denko Corp | 保護テープ切断方法およびこれを用いた装置 |
JP2006102822A (ja) * | 2004-09-30 | 2006-04-20 | Nitto Denko Corp | 粘着テープ切断装置 |
JP2006108503A (ja) * | 2004-10-07 | 2006-04-20 | Nitto Denko Corp | 粘着テープ貼付方法およびこれを用いた装置 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4172750A (en) * | 1977-04-05 | 1979-10-30 | General Binding Corporation | Small manual laminating system |
JPH1032179A (ja) * | 1996-07-15 | 1998-02-03 | Teikoku T-Pingu Syst Kk | シリコンウエハー加工用マスキングシートの切断方法 |
JP2001063908A (ja) * | 1999-08-24 | 2001-03-13 | Nitto Denko Corp | 粘着テープ貼付け剥離装置 |
JP2001219936A (ja) * | 2000-02-10 | 2001-08-14 | Sekisui Seikei Ltd | ラベル貼り付け面を有するプラスチック容器 |
JP2002176011A (ja) | 2000-12-05 | 2002-06-21 | Mck:Kk | テープ貼り機 |
JP4480926B2 (ja) * | 2001-09-11 | 2010-06-16 | テイコクテーピングシステム株式会社 | シリコンウエハに対する保護フィルムの貼着方法及び貼着装置 |
JP3770820B2 (ja) * | 2001-10-03 | 2006-04-26 | 日東電工株式会社 | 保護テープの貼付け方法 |
KR100469169B1 (ko) * | 2002-08-14 | 2005-02-02 | 삼성전자주식회사 | 절연 접착 테이프를 이용한 적층 칩 접착 장치 |
JP4630551B2 (ja) * | 2003-02-14 | 2011-02-09 | 理想科学工業株式会社 | インク容器 |
JP4530638B2 (ja) * | 2003-10-07 | 2010-08-25 | 日東電工株式会社 | 半導体ウエハへの保護テープ貼付方法及び貼付装置 |
JP2006135272A (ja) * | 2003-12-01 | 2006-05-25 | Tokyo Ohka Kogyo Co Ltd | 基板のサポートプレート及びサポートプレートの剥離方法 |
JP2005198806A (ja) | 2004-01-15 | 2005-07-28 | Jnb:Kk | ゴルフ・プレイの画像製作方法 |
JP4342973B2 (ja) | 2004-02-10 | 2009-10-14 | アルパイン株式会社 | ドライブ情報の収集方法及びナビゲーション装置 |
JP2005243888A (ja) * | 2004-02-26 | 2005-09-08 | Nitto Denko Corp | 粘着シート貼付け方法およびこれを用いた装置 |
JP4540403B2 (ja) * | 2004-06-16 | 2010-09-08 | 株式会社東京精密 | テープ貼付方法およびテープ貼付装置 |
JP4441450B2 (ja) | 2005-07-07 | 2010-03-31 | リンテック株式会社 | シート貼付装置及び貼付方法 |
-
2005
- 2005-10-24 JP JP2005308272A patent/JP4795772B2/ja active Active
-
2006
- 2006-10-05 DE DE200611002689 patent/DE112006002689T5/de not_active Withdrawn
- 2006-10-05 CN CN2006800384490A patent/CN101291785B/zh active Active
- 2006-10-05 KR KR1020087007199A patent/KR101278463B1/ko active IP Right Grant
- 2006-10-05 US US12/067,280 patent/US7954533B2/en active Active
- 2006-10-05 WO PCT/JP2006/319931 patent/WO2007049441A1/ja active Application Filing
- 2006-10-17 TW TW95138239A patent/TWI391982B/zh active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61276231A (ja) * | 1985-05-30 | 1986-12-06 | Nitto Electric Ind Co Ltd | ウエハ保護フイルムの切断方法 |
JP2004047976A (ja) * | 2002-05-21 | 2004-02-12 | Nitto Denko Corp | 保護テープ貼付方法およびその装置 |
JP2004221469A (ja) * | 2003-01-17 | 2004-08-05 | Nitto Denko Corp | 粘着テープ貼付け方法およびその装置 |
JP2004266183A (ja) * | 2003-03-04 | 2004-09-24 | Nitto Denko Corp | 粘着テープ貼付け方法およびその装置 |
JP2006095606A (ja) * | 2004-09-28 | 2006-04-13 | Nitto Denko Corp | 保護テープ切断方法およびこれを用いた装置 |
JP2006102822A (ja) * | 2004-09-30 | 2006-04-20 | Nitto Denko Corp | 粘着テープ切断装置 |
JP2006108503A (ja) * | 2004-10-07 | 2006-04-20 | Nitto Denko Corp | 粘着テープ貼付方法およびこれを用いた装置 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7987886B2 (en) * | 2008-05-02 | 2011-08-02 | Nitto Denko Corporation | Protective tape joining apparatus |
TWI492287B (zh) * | 2008-05-02 | 2015-07-11 | Nitto Denko Corp | 保護帶貼附裝置 |
JP2012206233A (ja) * | 2011-03-30 | 2012-10-25 | Brother Industries Ltd | 切断装置 |
CN103521542A (zh) * | 2013-09-26 | 2014-01-22 | 芜湖环球汽车配件有限公司 | 一种钣金件挤压成型机的自动升降机构 |
Also Published As
Publication number | Publication date |
---|---|
TWI391982B (zh) | 2013-04-01 |
US7954533B2 (en) | 2011-06-07 |
TW200746235A (en) | 2007-12-16 |
JP2007111845A (ja) | 2007-05-10 |
CN101291785B (zh) | 2012-04-25 |
KR101278463B1 (ko) | 2013-07-02 |
JP4795772B2 (ja) | 2011-10-19 |
US20090151875A1 (en) | 2009-06-18 |
DE112006002689T5 (de) | 2008-10-23 |
CN101291785A (zh) | 2008-10-22 |
KR20080049065A (ko) | 2008-06-03 |
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