WO2006129446A1 - 太陽電池および太陽電池の製造方法 - Google Patents
太陽電池および太陽電池の製造方法 Download PDFInfo
- Publication number
- WO2006129446A1 WO2006129446A1 PCT/JP2006/309073 JP2006309073W WO2006129446A1 WO 2006129446 A1 WO2006129446 A1 WO 2006129446A1 JP 2006309073 W JP2006309073 W JP 2006309073W WO 2006129446 A1 WO2006129446 A1 WO 2006129446A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- bus bar
- electrode
- solar cell
- bar electrode
- shape
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 239000000758 substrate Substances 0.000 claims abstract description 42
- 239000004065 semiconductor Substances 0.000 claims abstract description 33
- 238000007639 printing Methods 0.000 claims description 14
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 5
- 229910052733 gallium Inorganic materials 0.000 claims description 5
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 description 11
- 241000264877 Hippospongia communis Species 0.000 description 7
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- 239000007772 electrode material Substances 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 238000001782 photodegradation Methods 0.000 description 2
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 2
- 101100520660 Drosophila melanogaster Poc1 gene Proteins 0.000 description 1
- 101100520662 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) PBA1 gene Proteins 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 229910021478 group 5 element Inorganic materials 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/022433—Particular geometry of the grid contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0236—Special surface textures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the present invention relates to at least a semiconductor substrate on which a PN junction is formed, a finger electrode formed in a comb shape on at least one surface of the semiconductor substrate, and the finger electrode connected to the finger electrode on the semiconductor substrate.
- the present invention relates to a high-efficiency solar cell having a small shielding of sunlight in which a connector to be attached is difficult to peel off.
- a solar cell has a comb-like finger electrode for taking out electric power from a semiconductor substrate on a light-receiving surface of a semiconductor substrate on which a PN junction is formed, and is connected to the finger electrode.
- a bus bar electrode for taking out electric power is formed.
- a connector is attached to the bus bar electrode by soldering, for example, to connect the solar cells to each other.
- the present invention has been made in view of the above problems, and the object of the present invention is to It is an object of the present invention to provide a solar cell and a solar cell manufacturing method that are difficult to peel off a connector soldered to a bus bar electrode and that has a low-cost and high-efficiency solar cell shielding capability.
- a solar cell comprising a bus bar electrode connected to the finger electrode on a semiconductor substrate, wherein the bus bar electrode has an uneven pattern formed on a surface thereof.
- bus bar electrode is formed with the uneven pattern on the surface, the contact area with the solder to which the connector is attached is increased, and the adhesive strength between the bus bar electrode and the connector is improved. In addition, this eliminates the need to increase the width of the bus bar electrode, thereby reducing the shielding of sunlight by the bus bar electrode, resulting in a low-cost and high-efficiency solar cell.
- the height of the convex portion with respect to the concave portion of the concave-convex pattern is 5 to 50 m.
- the surface force of the bus bar electrode can be increased with a small electrode material that does not cause the electrode to become too high because the height force of the convex portion to the concave portion of the concave-convex pattern is 5-50 / ⁇ .
- the pattern shape of the concavo-convex pattern is any one of a striped shape, a mesh shape, a heart shape, and a dot shape!
- the solder enters between the concavo-convex areas, increasing the contact area between the two, and the electrode and solder. Can be firmly bonded.
- it is a mesh shape or a hard cam shape, it is possible to eliminate the difference in directionality of the connector peeling difficulty, and if it is a dot shape, the amount of electrode material used can be reduced.
- the interval between the protrusions of the unevenness is 50 ⁇ m to lmm.
- the contact area is increased and the solder can surely flow between the concave and convex portions on the electrode surface. It can be really improved.
- the bus bar electrode preferably has a width of 1 to 2 mm and a thickness of 80 ⁇ m or less.
- the bus bar electrode has a width of 1 to 2 mm and a thickness of 80 m or less.
- the bus bar electrode has a two-layer force.
- the pattern shape of the concave-convex pattern is formed by at least one layer. I like it!
- the pattern shape of the concave-convex pattern can be easily formed by at least one layer.
- the bus bar electrode is preferably one obtained by printing and baking a conductive paste.
- the bus bar electrode is obtained by printing and baking the conductive paste, it is possible to improve the production yield of a high-efficiency solar cell at a low cost.
- the bus bar electrode is manufactured using the conductive paste and the connector is soldered, the problem of peeling of the connector is likely to occur, so that the present invention is particularly effective.
- the semiconductor substrate is preferably a p-type single crystal silicon substrate doped with gallium.
- a method of manufacturing a solar cell comprising: forming a bus bar electrode having a two-layer structure by printing and baking a conductive paste twice, and at least one of the two times of printing and baking.
- a method of manufacturing a solar cell is provided in which a concavo-convex pattern is formed on the surface of the bus bar electrode having the two-layer structure by printing and baking.
- the conductive paste is printed twice and fired to form a two-layered bus bar electrode, and at least one of the two printings and firings is performed by printing and firing.
- the surface area of the bus bar electrode can be increased without increasing the width of the bus bar electrode.
- the strength is improved, the connector is difficult to peel off, and the width of the bus bar electrode is narrow V. Therefore, the sunlight shielding is small! / Low cost and high efficiency.
- FIG. 1 is a schematic plan view of an example of a solar cell according to the present invention, in which the pattern shape of the uneven pattern formed on the surface of the bus bar electrode is a mesh shape.
- FIG. 2 is a perspective view showing a schematic cross-section of an example of a solar cell according to the present invention, in which the pattern shape of the uneven pattern formed on the surface of the bus bar electrode is striped.
- FIG. 3 is a perspective view showing a schematic cross section of an example of a solar cell according to the present invention, in which the pattern shape of the uneven pattern formed on the surface of the bus bar electrode is a mesh shape.
- FIG. 4 is a perspective view showing a schematic cross-section of an example of a solar cell according to the present invention, in which the pattern shape of the uneven pattern formed on the surface of the bus bar electrode is a dot shape.
- the force required to reduce the electrode width reduces the contact area between the bus bar electrode and the connector by reducing the electrode width.
- the adhesive strength is lowered and the connector attached by soldering is easily peeled off.
- the present inventors have conducted extensive research, and at least a semiconductor substrate in which a PN junction is formed, a finger electrode formed in a comb shape on at least one surface of the semiconductor substrate, and the semiconductor described above And a bus bar electrode connected to the finger electrode on a substrate.
- the bus bar electrode has a concavo-convex pattern formed on the surface, so that the connector soldered to the bus bar electrode is difficult to peel off, and the sunlight shielding power by the nosba electrode is low. It has been found that a high-efficiency solar cell can be obtained at low cost.
- FIGS. 1 to 4 are views of examples of solar cells according to the present invention, in which an uneven pattern shape is formed on the surface of a bus bar electrode.
- the solar cell of the present invention includes at least a semiconductor substrate 5 on which a PN junction is formed, a finger electrode 4 formed in a comb shape on at least one surface of the semiconductor substrate 5, and a finger electrode on the semiconductor substrate 5.
- 4 is a solar cell comprising a bus bar electrode 3 connected to 4, wherein the bus bar electrode 3 has an uneven pattern 1 formed on the surface thereof.
- the semiconductor substrate 5 is preferably a p-type single crystal silicon substrate doped with gallium, so that the solar cell to be manufactured has a practically high photoelectric conversion efficiency that does not cause photodegradation. Become. First, after removing the damaged layer from the semiconductor substrate 5 by etching, it is preferable to form a PN junction on the semiconductor substrate 5 on which a texture structure for preventing reflection is formed.
- the PN junction is preferably formed by thermal diffusion of n-type impurities such as phosphorus on the light receiving surface side, but may be formed by coating diffusion or ion implantation.
- n-type impurities such as phosphorus
- the finger electrode 4 is preferably formed on the light receiving surface of the semiconductor substrate 5 on which the PN junction is formed by screen printing a conductive base in a comb-teeth shape and baking it. This makes it possible to produce high-efficiency solar cells at a low cost.
- the nosba electrode 3 is formed so as to be connected to the root of the comb-like finger electrode 4.
- the bus bar electrode 3 is integrated with the finger electrode 4 which is preferably formed on the light receiving surface of the semiconductor substrate 5 by screen printing and baking it on the light receiving surface of the semiconductor substrate 5 like the finger electrode 4. It is more preferable that the film is formed by being printed and baked, since the manufacturing cost can be suppressed.
- Such a bus bar electrode 3 has an uneven pattern 1 formed on the surface. Therefore, the contact area with the solder to which the connector is attached is increased, an anchor effect is obtained, the adhesive strength between the bus bar electrode 3 and the connector is improved, and it is difficult to peel off.
- the shielding of the sunlight by the bus bar electrode 3 can be reduced, and a low-cost and high-efficiency solar cell can be obtained.
- the bus bar electrode 3 has a width of 1 to 2 mm and a thickness of 80 ⁇ m or less.
- the surface area of the electrode sufficiently large to connect the connector can be obtained by forming the concavo-convex pattern 1 on the surface while keeping the amount of the electrode used small. Note that if the thickness of the bus bar electrode 3 is thin, it is preferable because the electrode material can be saved as much as possible. However, if the thickness is too thin, the resistance value of the bus bar electrode 3 is likely to increase. This can be done.
- the height of the convex portion 2 with respect to the concave portion of the concave / convex pattern 1 is preferably 5 to 50 ⁇ m, and the electrode material is less likely to be too high.
- the surface area can be increased.
- the pattern shape of the concave / convex pattern 1 is one of a stripe shape as shown in FIG. 2, a network shape as shown in FIGS. 1 and 3, a honeycomb shape, or a dot shape as shown in FIG. If so, the solder enters between the irregularities, the contact area between the two increases, and the electrode and the solder can be firmly bonded.
- the interval between the convex and concave portions 2 is preferably 50 ⁇ m to lmm. As a result, the contact area is increased, and the solder can surely flow between the irregularities on the electrode surface, so that the adhesive strength can be reliably improved and the anchor effect can be exhibited.
- FIGS. 1 to 4 show that the convex portion 2 forms the pattern shape of the concave / convex pattern 1, so that solder can surely flow into the concave / convex portions of the force electrode surface.
- stripes, meshes, honeycombs, and dots may be formed by the recesses, not necessarily by the protrusions 2.
- the difference in directionality of the difficulty in peeling off the connector can be eliminated, and the convex portion has a dot-like shape. If 2 is formed, the amount of electrode material used can be reduced.
- the shape of the convex part or concave part formed in a dot shape may be circular, elliptical, polygonal, or star-shaped.
- the bus bar electrode 3 is composed of two layers.
- the pattern shape of the concave / convex pattern 1 can be easily formed by at least one of the two layers.
- the bus bar electrode 3 having a two-layer structure is formed by printing and baking the conductive paste twice, and the two layers are formed by printing and baking at least one of the two times printing and baking. It is preferable to form the uneven pattern 1 on the surface of the bus bar electrode 3 having a structure. This makes it possible to manufacture a highly efficient solar cell that does not easily peel off the connector soldered to the bus bar electrode 3 at low cost.
- bus bar electrode 3 is printed twice in order to form an uneven pattern on the surface of the electrode, there are, for example, the following three combinations of print shapes.
- First layer flat shape
- Second layer striped, mesh, honeycomb, dot
- Second layer Striped, mesh, honeycomb, dot-like Second layer: flat shape
- Second layer Striped, honeycomb, mesh, dot
- the first layer is printed in a flat shape as shown in (1)
- the second layer is printed in a striped pattern as shown in Fig. 2, or as shown in Figs. 1, 3, and 4. It is preferable to print the second layer in the form of a mesh or dots.
- the convex / concave pattern 1 can be reliably formed on the bus bar electrode 3 by forming the convex part 2 with the printed shape of the second layer.
- the first layer is printed in a striped, meshed, heart-shaped or dot-like shape
- the second layer is printed in a flat shape thereon, thereby forming an uneven pattern. In this case, it is possible to prevent the second layer from peeling off from the first layer.
- the connector to be soldered may be a connector that directly extracts power from a single solar cell, or an interconnector that connects a plurality of solar cells to extract power.
- the present invention will be described more specifically with reference to examples and comparative examples. However, the present invention is not limited to these examples.
- a p-type single crystal solar cell silicon substrate (100 mm square, surface orientation ⁇ 100 ⁇ , substrate thickness 300 m, resistivity 0.5 Q cm), which uses Group III element gallium as an impurity element, is a potassium hydroxide aqueous solution.
- the damaged layer was removed by etching.
- a texture structure which is an antireflection structure, was formed by using an aqueous solution of potassium hydroxide mixed with IPA.
- Phosphorus of a group V element is formed on the light receiving surface side by thermal diffusion using a POC1 liquid source
- n region with impurities was fabricated on the light-receiving surface.
- a 70-nm-thick nitride film was formed on the light-receiving surface by plasma CVD to prevent sunlight reflection and protect the surface.
- a conductive paste containing aluminum particles was printed on the entire back surface (the surface opposite to the light receiving surface).
- a conductive paste containing silver particles was printed on the light receiving surface in the shape of finger electrodes and bus bar electrodes, and baked at 700 ° C for 3 minutes to complete a solar cell.
- the bus bar electrode was printed twice.
- the first layer (with finger electrodes) was formed in a flat shape, and the second layer was formed in a mesh shape as shown in FIGS. 1 and 3 (Example).
- the width of the bus bar electrode was 1.5 mm, the thickness of the first layer electrode was 20 ⁇ m, and the thickness of the second layer electrode was 30 m (this is the difference in roughness).
- the network line width of the second layer was 100 m, and the line spacing was 200 ⁇ m.
- the solar cell according to the present invention which does not need to widen the electrode width of the nosba electrode, has a small effect on the efficiency as well as an increase in the shielding of sunlight.
- the force described as an example in which the finger electrode and the bus bar electrode are formed by screen printing using a conductive paste is not limited to this, and a connector soldered to the bus bar electrode is used. Peeling is likely to occur even when an electrode is formed by vacuum deposition or the like, and it goes without saying that the occurrence rate of peeling can be reduced by the anchor effect by applying the present invention.
- the present invention may be applied to both the light-receiving surface and the back-side bus bar electrode. Good and effective.
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/919,999 US20090025782A1 (en) | 2005-06-01 | 2006-05-01 | Solar cell and method for manufacturing the same |
ES06745924.8T ES2369989T5 (es) | 2005-06-01 | 2006-05-01 | Célula fotovoltaica y procedimiento de fabricación de una célula fotovoltaica |
EP06745924.8A EP1887633B2 (en) | 2005-06-01 | 2006-05-01 | Solar cell and solar cell manufacturing method |
AU2006253714A AU2006253714B2 (en) | 2005-06-01 | 2006-05-01 | Solar cell and solar cell manufacturing method |
KR1020077027657A KR101258968B1 (ko) | 2005-06-01 | 2006-05-01 | 태양 전지 및 태양 전지의 제조 방법 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005161251A JP2006339342A (ja) | 2005-06-01 | 2005-06-01 | 太陽電池および太陽電池の製造方法 |
JP2005-161251 | 2005-06-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2006129446A1 true WO2006129446A1 (ja) | 2006-12-07 |
Family
ID=37481378
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2006/309073 WO2006129446A1 (ja) | 2005-06-01 | 2006-05-01 | 太陽電池および太陽電池の製造方法 |
Country Status (10)
Country | Link |
---|---|
US (1) | US20090025782A1 (ja) |
EP (1) | EP1887633B2 (ja) |
JP (1) | JP2006339342A (ja) |
KR (1) | KR101258968B1 (ja) |
CN (1) | CN101185170A (ja) |
AU (1) | AU2006253714B2 (ja) |
ES (1) | ES2369989T5 (ja) |
RU (1) | RU2007144052A (ja) |
TW (1) | TWI422047B (ja) |
WO (1) | WO2006129446A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013046324A1 (ja) * | 2011-09-27 | 2013-04-04 | 三洋電機株式会社 | 太陽電池および太陽電池モジュール |
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KR101108862B1 (ko) * | 2007-09-26 | 2012-01-31 | 히다치 가세고교 가부시끼가이샤 | 도전체 접속용 부재 및 그의 제조 방법, 접속 구조, 및 태양 전지 모듈 |
TW200926210A (en) * | 2007-09-27 | 2009-06-16 | Murata Manufacturing Co | Ag electrode paste, solar battery cell, and process for producing the solar battery cell |
KR100974221B1 (ko) * | 2008-04-17 | 2010-08-06 | 엘지전자 주식회사 | 레이저 어닐링을 이용한 태양전지의 선택적 에미터형성방법 및 이를 이용한 태양전지의 제조방법 |
JP2009272406A (ja) * | 2008-05-02 | 2009-11-19 | Mitsubishi Electric Corp | 太陽電池素子 |
JP2010034500A (ja) * | 2008-06-27 | 2010-02-12 | Kyocera Corp | 太陽電池モジュール |
JP5368022B2 (ja) * | 2008-07-17 | 2013-12-18 | 信越化学工業株式会社 | 太陽電池 |
DE102008036837A1 (de) * | 2008-08-07 | 2010-02-18 | Epcos Ag | Sensorvorrichtung und Verfahren zur Herstellung |
JP2010073938A (ja) * | 2008-09-19 | 2010-04-02 | Sanyo Electric Co Ltd | 太陽電池モジュール及びその製造方法 |
KR101133028B1 (ko) * | 2008-11-18 | 2012-04-04 | 에스에스씨피 주식회사 | 태양 전지용 전극의 제조방법, 이를 이용하여 제조된 태양 전지용 기판 및 태양 전지 |
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KR101135591B1 (ko) * | 2009-03-11 | 2012-04-19 | 엘지전자 주식회사 | 태양 전지 및 태양 전지 모듈 |
EP2299501A1 (en) * | 2009-09-16 | 2011-03-23 | 3S Industries AG | Method and apparatus for providing a solar cell with a solder ribbon |
KR101146734B1 (ko) * | 2009-10-26 | 2012-05-17 | 엘지전자 주식회사 | 태양 전지 셀 및 이를 구비한 태양 전지 모듈 |
DE102010001780A1 (de) * | 2010-02-10 | 2011-08-11 | Koenen GmbH, 85521 | Solarzelle, Verfahren zur Herstellung einer Solarzelle und Druckschablone zum Aufbringen einer Kontaktierung einer Solarzelle |
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Also Published As
Publication number | Publication date |
---|---|
EP1887633A4 (en) | 2008-10-22 |
AU2006253714B2 (en) | 2011-06-30 |
TWI422047B (zh) | 2014-01-01 |
RU2007144052A (ru) | 2009-07-20 |
CN101185170A (zh) | 2008-05-21 |
KR20080018873A (ko) | 2008-02-28 |
KR101258968B1 (ko) | 2013-04-29 |
EP1887633A1 (en) | 2008-02-13 |
ES2369989T3 (es) | 2011-12-09 |
ES2369989T5 (es) | 2016-09-29 |
JP2006339342A (ja) | 2006-12-14 |
EP1887633B1 (en) | 2011-08-10 |
EP1887633B2 (en) | 2016-06-22 |
US20090025782A1 (en) | 2009-01-29 |
AU2006253714A1 (en) | 2006-12-07 |
TW200705697A (en) | 2007-02-01 |
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