KR101108862B1 - 도전체 접속용 부재 및 그의 제조 방법, 접속 구조, 및 태양 전지 모듈 - Google Patents
도전체 접속용 부재 및 그의 제조 방법, 접속 구조, 및 태양 전지 모듈 Download PDFInfo
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- KR101108862B1 KR101108862B1 KR1020097014261A KR20097014261A KR101108862B1 KR 101108862 B1 KR101108862 B1 KR 101108862B1 KR 1020097014261 A KR1020097014261 A KR 1020097014261A KR 20097014261 A KR20097014261 A KR 20097014261A KR 101108862 B1 KR101108862 B1 KR 101108862B1
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- Prior art keywords
- metal foil
- conductor
- adhesive
- connection
- protrusion
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Classifications
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- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
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- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
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- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0508—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module the interconnection means having a particular shape
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- C—CHEMISTRY; METALLURGY
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
- C09J2301/206—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer comprising non-adhesive protrusions
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1002—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Organic Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Sustainable Energy (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Photovoltaic Devices (AREA)
- Adhesive Tapes (AREA)
- Non-Insulated Conductors (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Conductive Materials (AREA)
Abstract
Description
Claims (28)
- 금속박의 한쪽면 상에 접착제층이 형성되어 이루어지는 도전체 접속용 부재이며,상기 금속박은 상기 접착제층이 형성되어 있는 면에 상기 금속박과 일체화되고 기부와 정부를 갖는 실질적으로 높이가 동일한 복수의 돌기를 갖고, 상기 접착제층이 형성되어 있는 면과는 반대측의 면이 평활하고,상기 접착제층은 상기 돌기를 매립하고, 상기 금속박과 반대측의 표면이 실질적으로 평활하게 형성되어 있는, 태양전지셀끼리를 접속시키기 위해 사용되는 도전체 접속용 부재.
- 금속박의 양면 상에 접착제층이 형성되어 이루어지는 도전체 접속용 부재이며,상기 금속박은 상기 접착제층이 형성되어 있는 양면에 상기 금속박과 일체화되고 기부와 정부를 갖는 실질적으로 높이가 동일한 복수의 돌기를 갖고,상기 접착제층은 상기 돌기를 매립하고, 상기 금속박과 반대측의 표면이 실질적으로 평활하게 형성되어 있는, 태양전지셀끼리를 접속시키기 위해 사용되는 도전체 접속용 부재.
- 제1항 또는 제2항에 있어서, 상기 돌기의 정부로부터 상기 접착제층의 상기 표면까지의 거리가 20 ㎛ 이하이고, 도전체에 가열 가압에 의해 접속된 경우, 상기 금속박과 상기 도전체 사이에서 전기적으로 도통 가능한 도전체 접속용 부재.
- 제3항에 있어서, 상기 돌기의 정부로부터 상기 접착제층의 상기 표면까지의 거리가 15 ㎛ 이하인 도전체 접속용 부재.
- 제3항에 있어서, 상기 돌기의 정부로부터 상기 접착제층의 상기 표면까지의 거리가 12 ㎛ 이하인 도전체 접속용 부재.
- 제1항 또는 제2항에 있어서, 상기 돌기의 높이가 20 내지 5000 ㎛인 도전체 접속용 부재.
- 제1항 또는 제2항에 있어서, 상기 돌기는 기부의 단면적보다 정부의 단면적이 작은 형상을 갖고, 인접하는 돌기 정부의 중심점 간격 L이 0.1 내지 5 ㎜의 범위 내가 되도록 규칙적으로 배열되어 있는 도전체 접속용 부재.
- 제7항에 있어서, 상기 돌기의 높이는 상기 중심점 간격 L 미만인 도전체 접속용 부재.
- 제7항에 있어서, 상기 중심점 간격 L이 0.2 내지 3 mm인 도전체 접속용 부재.
- 제7항에 있어서, 상기 중심점 간격 L이 0.3 내지 2 mm인 도전체 접속용 부재.
- 제1항 또는 제2항에 있어서, 상기 돌기는, 상기 돌기를 상기 금속박의 두께 방향으로 수직인 면으로 절단한 경우에 상기 기부로부터 상기 정부에 걸쳐서 단면적이 작아지는 형상을 가지고 있는 도전체 접속용 부재.
- 제1항 또는 제2항에 있어서, 상기 돌기의 높이는 ±20 % 이내의 오차를 갖는 도전체 접속용 부재.
- 제1항 또는 제2항에 있어서, 상기 돌기의 높이는 ±15 % 이내의 오차를 갖는 도전체 접속용 부재.
- 제1항 또는 제2항에 있어서, 상기 금속박이 Cu, Ag, Au, Fe, Ni, Pb, Zn, Co, Ti, Mg, Sn 및 Al로 이루어지는 군으로부터 선택되는 적어도 1종의 금속을 포함하는 것인 도전체 접속용 부재.
- 제1항 또는 제2항에 있어서, 상기 접착제층이 잠재성 경화제를 함유하는 열경화성의 접착제 조성물로 이루어지는 층인 도전체 접속용 부재.
- 제15항에 있어서, 상기 접착제층이 에폭시 수지를 포함하는 도전체 접속용 부재.
- 제1항 또는 제2항에 있어서, 상기 접착제층이 도전 입자를 함유하는 접착제 조성물로 이루어지는 층이고, 상기 도전 입자의 평균 입경이 상기 금속박의 상기 돌기의 높이 이하인 도전체 접속용 부재.
- 제1항에 있어서, 태양 전지셀끼리를 복수개 병렬로 접속하기 위해 사용되는 도전체 접속용 부재.
- 제2항에 있어서, 태양 전지셀끼리를 복수개 직렬; 또는 병렬; 또는 직렬 및 병렬로 접속하기 위해 사용되는 도전체 접속용 부재.
- 제1항 또는 제2항에 기재된 도전체 접속용 부재의 제조 방법이며,상기 금속박의 적어도 한쪽면에 상기 돌기를 형성한 후, 상기 금속박의 상기 돌기가 형성되어 있는 면 상에 접착제 필름을 라미네이트하여 상기 접착제층을 형성하는 공정을 포함하는, 도전체 접속용 부재의 제조 방법.
- 제1항 또는 제2항에 기재된 도전체 접속용 부재의 제조 방법이며,상기 금속박의 적어도 한쪽면에 상기 돌기를 형성한 후, 상기 금속박의 상기 돌기가 형성되어 있는 면 상에 접착제와 용제를 포함하는 접착제층 형성용 용액을 유연하고, 가열에 의해 상기 용제를 제거하여 상기 접착제층을 형성하는 공정을 포함하는, 도전체 접속용 부재의 제조 방법.
- 제1항 또는 제2항에 기재된 도전체 접속용 부재의 제조 방법이며,상기 금속박의 적어도 한쪽면에 상기 돌기를 형성한 후, 상기 금속박의 상기 돌기가 형성되어 있는 면 상에 접착제 필름을 라미네이트하거나, 또는 접착제와 용제를 포함하는 접착제층 형성용 용액을 유연하여 가열에 의해 용제를 제거함으로써 제1 접착제층을 형성하고, 상기 제1 접착제층 상에 접착제 필름을 라미네이트하거나, 또는 접착제와 용제를 포함하는 접착제층 형성용 용액을 유연하여 가열에 의해 용제를 제거함으로써 제2 접착제층을 형성하여, 상기 제1 접착제층 및 상기 제2 접착제층으로 이루어지는 상기 접착제층을 형성하는 공정을 포함하는, 도전체 접속용 부재의 제조 방법.
- 제1항 또는 제2항에 기재된 도전체 접속용 부재와 도전체를, 상기 도전체 접속용 부재에서의 상기 금속박의 상기 돌기가 형성되어 있는 면과 상기 도전체가 상기 접착제층을 통해 대향하도록 배치하고, 이들을 가열 가압함으로써 얻어지는, 상기 금속박과 상기 도전체가 전기적으로 접속되고 있음과 동시에 접착된 접속 구조.
- 제23항에 있어서, 상기 도전체의 상기 금속박과 접속되는 면이 표면 조도를 갖고,상기 도전체의 표면 조도부의 돌기와 상기 금속박의 상기 돌기가 접촉하고 있는 접속 구조.
- 제23항에 있어서, 상기 접착제층이 도전 입자를 함유하고,상기 도전체와 상기 금속박이 상기 도전 입자를 통해 전기적으로 접속되어 있는 접속 구조.
- 표면 전극을 갖는 복수의 태양 전지셀을 구비하는 태양 전지 모듈이며,상기 태양 전지셀끼리가 상기 표면 전극에 접착 부재로 접착된 금속박을 통해 전기적으로 접속되어 있고,상기 금속박이 제1항 또는 제2항에 기재된 도전체 접속용 부재에 의해 설치되어 있으며,상기 금속박의 상기 표면 전극과 접하는 면이 상기 돌기가 형성되어 있는 면인 태양 전지 모듈.
- 제26항에 있어서, 상기 접착 부재가 도전 입자를 함유하고,상기 표면 전극과 상기 금속박이 상기 도전 입자를 통해 전기적으로 접속되어 있는 태양 전지 모듈.
- 제26항에 있어서, 상기 표면 전극의 상기 금속박과 접속되는 면이 표면 조도를 갖고,상기 표면 전극의 표면 조도부의 돌기와 상기 금속박의 상기 돌기가 접촉하여 전기적인 접속부가 형성되어 있으며,상기 금속박에서 상기 전기적인 접속부 이외의 부분은 실질적으로 상기 접착 부재로 피복되어 있는 태양 전지 모듈.
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PCT/JP2008/067333 WO2009041526A1 (ja) | 2007-09-26 | 2008-09-25 | 導電体接続用部材及びその製造方法、接続構造、並びに、太陽電池モジュール |
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EP (1) | EP2200046A1 (ko) |
JP (2) | JP5029695B2 (ko) |
KR (1) | KR101108862B1 (ko) |
CN (1) | CN101779255B (ko) |
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JP2012182480A (ja) | 2012-09-20 |
CN101779255B (zh) | 2013-01-02 |
WO2009041526A1 (ja) | 2009-04-02 |
EP2200046A1 (en) | 2010-06-23 |
KR20090097914A (ko) | 2009-09-16 |
US20100288328A1 (en) | 2010-11-18 |
CN101779255A (zh) | 2010-07-14 |
JPWO2009041526A1 (ja) | 2011-01-27 |
TWI391955B (zh) | 2013-04-01 |
TW200939254A (en) | 2009-09-16 |
JP5029695B2 (ja) | 2012-09-19 |
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