WO2006018940A1 - 洗浄除去用溶剤 - Google Patents
洗浄除去用溶剤 Download PDFInfo
- Publication number
- WO2006018940A1 WO2006018940A1 PCT/JP2005/012574 JP2005012574W WO2006018940A1 WO 2006018940 A1 WO2006018940 A1 WO 2006018940A1 JP 2005012574 W JP2005012574 W JP 2005012574W WO 2006018940 A1 WO2006018940 A1 WO 2006018940A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- solvent
- cleaning
- photosensitive resin
- resin composition
- propylene glycol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/43—Solvents
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Definitions
- the present invention relates to a solvent for cleaning and removing a photosensitive resin composition.
- Photolithographic techniques are used in the manufacture of semiconductor elements and liquid crystal display elements, and for these, positive or negative photosensitive resin compositions are used.
- the photosensitive resin composition is applied in the form of a coating solution on a substrate such as a semiconductor substrate or a glass substrate, and is appropriately dried to form a film, which is selectively exposed, and then developed. By performing the treatment, a patterned photosensitive resin film is formed.
- a rotary coating method is generally used.
- a coating and spin method, a non-spin method, or the like is applied. Means have been proposed.
- the nozzle for discharging the photosensitive resin composition, the inner wall of the coating apparatus, the peripheral edge of the substrate, the back surface of the substrate, and other piping systems are contaminated by the photosensitive resin composition. It is necessary to perform a cleaning process at any time.
- a pigment-dispersed photosensitive resin composition for forming a pigment-dispersed material such as a color filter or a black matrix pattern, is difficult to remove by washing, and it is required to realize a washing-removing solution having excellent washing properties. It was.
- Patent Documents 1 and 2 are known as cleaning removal liquids for the pigment-dispersed photosensitive resin composition.
- Patent Document 1 Japanese Patent Laid-Open No. 2001-188364
- Patent Document 2 Japanese Patent Publication No. 2000-273370
- the present invention is suitable for cleaning such a photosensitive resin composition, and particularly an excellent solvent for cleaning removal for cleaning a pigment-dispersed photosensitive resin composition for forming a color filter or a black matrix pattern.
- the purpose is to provide.
- the present invention employs the following configuration.
- the present invention relates to the hydrogen bonding parameter ( ⁇ ) in the Hansen solubility parameter.
- a solvent for cleaning and removing a photosensitive resin composition wherein the force is from S5 to 10
- the photosensitive resin composition to be cleaned in the present invention is not particularly limited.
- Any positive, negative, chemically amplified, or non-chemically amplified photosensitive resin composition that has been used for liquid crystals, color filters, and the like can be used.
- the photosensitive resin composition basically contains a resin component and a photosensitive component such as a photopolymerization initiator as essential components. In addition, it may contain a monomer component, a surfactant, an acid component, a nitrogen-containing organic compound, a pigment, a solvent, and the like.
- the photosensitive resin composition exhibiting a cleaning effect is a photosensitive resin composition in which a pigment is dispersed, and more preferably red (R), green (G), and blue (dark blue).
- Examples of the resin component include one or more selected from monomers having a carboxy group such as acrylic acid and methacrylic acid, and methyl acrylate, methyl methacrylate, acrylic Ethyl acid, Ethyl methacrylate, 2-Hydroxyethyl acrylate, 2-Hydroxyethyl methacrylate, 2-Hydroxypropyl methacrylate, N-Butyl acrylate, N-Butyl methacrylate, Isobutyl acrylate, Isobutyl methacrylate Tallylate, benzyl acrylate, benzyl methacrylate, phenoxy acrylate, phenoxy methacrylate, isobornyl acrylate, isobornyl methacrylate, glycidyl methacrylate, styrene, acrylate, acrylonitrile, etc.
- monomers having a carboxy group such as acrylic acid and methacrylic acid, and methyl acrylate
- photopolymerization initiator examples include 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy-1-methyl 2-phenylpropane-1-one, 1- [4- (2-hydroxyethoxy) phenyl] 2 —Hydroxy-1-2-methyl 1-propane-1-one, 1— (4-Isopropylpyruphenyl) 2-hydroxy-1-2-methylpropane-1-one, 1— (4-dodecinole phenyl) 1-2-hydroxy 1-Methylpropane 1-one, 2,2-Dimethoxy-1-, 2-diphenylethane 1-one, bis (4-dimethylaminophenyl) ketone, 2-methyl-1- 1- [4- (methylthio) phenyl ] -2-Morpholinopropane 1-one, 2-Benzyl-2-dimethylamino-1- 1- (4-morpholinophenyl) 1-butane-1-one, 2, 4, 6-trimethylbenzoyldiphenylphosphin
- JP 2004-69754 A and JP 11-231523 A have been proposed.
- the photosensitive materials described in JP-A-11-84125, JP-A-10-221843, JP-A-9-269410, JP-A-10-90516 and the like are preferably used.
- the present invention relates to the hydrogen bonding parameter ( ⁇ ) in the Hansen solubility parameter.
- the Hansen solubility parameter is one of the methods for defining the solubility parameter of the solvent. (pp. 22 — 29, Blackie Academic
- the hydrogen bonding parameter ( ⁇ ) in the Hansen dissolution parameter is 5 to 10, preferably
- the photosensitive resin composition contains Removability of organic components such as resin components, monomer components, and photopolymerization initiators is poor. If the upper limit of the above range is exceeded, components that are dispersed without being dissolved in the photosensitive resin composition such as pigments. May remain after washing that easily causes aggregation or the like.
- the solvent for washing and removal has a hydrogen bond parameter ( ⁇ ) of 5 to 10, more preferably 6
- the hydrogen bonding parameter after mixing should be within the above range.
- the hydrogen bond parameter ( ⁇ ) is within the above range
- the hydrogen bonding force parameter ( ⁇ ) of the mixed solvent is a value theoretically determined by the following equation.
- Hydrogen bond strength parameter ( ⁇ ) A X a + B X b + C X c + (where A
- H, B, and C are the hydrogen bond strength parameters of each solvent used for mixing, and a, b, and c indicate the content ratio (mass basis) of each solvent when the total mass of the mixed solvent is “1”. . )
- the hydrogen bonding parameter of propylene glycol monomethyl ether acetate is 6.6
- propylene glycol monomethyl ether is 13.6, and xylene is 2.5, so these are mixed at a mass ratio of 6: 2: 2.
- the solvent for washing and removing containing propylene glycol monoalkyl ether acetate is preferable because it has an effect on the removability of organic components in the photosensitive resin composition.
- propylene glycol monoalkyl ether is preferred. Of these, alkyl groups having 1 to 5 carbon atoms are preferred.
- an aromatic solvent is used in a pigment-dispersed photosensitive resin composition, particularly a black pigment (carbon) -dispersed photosensitive resin composition for forming a black matrix pattern. This is preferable because an effect of suppressing the carbon aggregation phenomenon can be obtained.
- an aromatic solvent having an alkyl group For example, monoalkylbenzene, dialkylbenzene, trialkylbenzene and the like are preferable.
- the alkyl group contained in the aromatic solvent preferably has 1 to 5 carbon atoms. Further, the ratio of the aromatic solvent contained in the washing and removing solvent is preferably at least 5% by mass.
- an aromatic solvent containing both dialkylbenzene and trialkylbenzene is preferable.
- These are preferably used in combination with the above propylene glycol monoalkyl ether acetate and Z or propylene glycol monoalkyl ether, and adjusted so that the hydrogen bonding parameter of the mixed solvent is 5 to 10:
- aromatic solvents containing both dialkylbenzene and trialkylbenzene include commercially available Solvesso 100, Sonorebesso 150, Solvesso 200 (trade names, manufactured by Eksony Chemical Co., Ltd.) Etc. are available. Since these commodities are petroleum fractions, it is difficult to quantitatively indicate the aromatic compounds contained in them.
- Solvesso 100 includes ethylmethylbenzene, methylpropylbenzene, jetylbenzene, trimethylbenzene, and ethyldimethylbenzene.
- anisole methoxybenzene
- hydrogen bonding parameter 6.7
- a mixed solvent of three types of propylene glycol monoalkyl ether acetate, propylene glycol monoalkyl ether, and aromatic solvent is most preferable for washing and removing the pigment dispersion type photosensitive resin composition.
- the mixing ratio of these solvents is not particularly limited, and can be adjusted as appropriate so that the hydrogen bonding parameter of the mixed solvent is 5 to 10:
- the solvent for cleaning and removing of the present invention preferably contains a good solvent for the resin component of the photosensitive resin composition.
- the good solvent includes a solvent used in the photosensitive resin composition.
- the resin resin component refers to the above-mentioned resin components known as constituent components of the photosensitive resin composition for forming a color filter and the photosensitive resin composition for forming a black matrix pattern.
- the resin component contained in the photosensitive resin composition to be cleaned is known in advance, it is preferable to include the solvent contained in the photosensitive resin composition.
- Examples of good solvents for the resin component of the photosensitive resin composition include ethylene glycol monomethylenoatenore, ethyleneglycolenomethinoleatenore, ethyleneglycolenopropenoreatenore, ethyleneglycolenole Mononochinoleatenore, Ethylene Glyconorezi Methinoleetenore, Ethylene Glyconore Jetinoreetenore, Ethylene Glyconoresi Propinorenotere, Propylene Glyconore Monomethinoreteinole, Propylene Glyconore Monoete Norenoatere, Propylene Glycol Noremono propenoate monothere, propylene glycol monobutene ether, propylene glycol dimethyl ether, propylene glycol jet noreate nore, diethylene glycol nore monomethinore Tenoré, Diethyleneglycolenotino chinoreateol, Diethyleneg
- the cleaning removal solvent of the present invention includes a cleaning removal composition containing a solvent and other components in addition to a so-called solvent (single solvent or mixed solvent).
- a surfactant known as a constituent of the photosensitive resin composition for forming a color filter and the photosensitive resin composition for forming a black matrix pattern can be used, but the photosensitive resin to be cleaned is used. If the surfactant contained in the composition is known in advance, the same type of surfactant is preferred.
- Examples of the surfactant include fluorine-based surfactant.
- fluorine-based surfactant include fluorine-based surfactant.
- nonionic fluorine-based surfactants (E-1) in which perfluoroalkyl ester groups, alkylsiloxane groups, ethyleneoxy groups, and propyleneoxy groups are combined are preferred.
- Specific examples include MegaFac R-08, R-60 (product name, manufactured by Dainippon Ink & Chemicals, Inc.).
- a surfactant component (E 2) having a fluorine content of 10 to 25% by mass and a silicon content of 3 to 10% by mass.
- Specific examples include X_70_090, X_70_091, X-70-092, X_70_093 (product name, manufactured by Shin-Etsu Chemical Co., Ltd.), and the like.
- a polyester-modified polydialkylsiloxane surfactant (E3) having a specific siloxane skeleton is also preferred.
- Specific examples include BYK_310, BYK315, (product, manufactured by Bicchemi).
- surfactants other than the above (E— :!) to (E 3) include Florard FC_430, FC431 (product name, manufactured by Sumitomo 3M), Ftop EF122A, EF122B, EF122C, EF1 26 (product name, Fluorosurfactants such as Tochem Products).
- surfactant one kind may be used alone, or two or more kinds may be used in combination.
- the content of the surfactant in the cleaning removal solvent of the present invention is preferably such that the concentration of the surfactant in the composition is 0.0001-1. 0% by mass. Mass% more preferable.
- the compounding amount of the surfactant is not less than the lower limit of the above range, the effect of adding the surfactant can be obtained.
- the surfactant concentration in the photosensitive resin composition increases more than necessary by setting the upper limit value within the above range. Is prevented. If the concentration of the surfactant in the photosensitive resin composition is too high, bubbles are likely to be generated and coating unevenness is likely to occur, and pinholes may be generated in the coating film.
- the concentration of the surfactant contained in the photosensitive resin composition to be cleaned is known in advance, it is possible to make the concentration and the surfactant concentration in the solvent for cleaning removal the same level. It is preferable from the viewpoint of energy balance.
- the solvent for cleaning and removing of the present invention is used for removing an unnecessary photosensitive resin composition on a substrate after the photosensitive resin composition is applied to the substrate, and also used for a coating process. It is suitably used for cleaning photosensitive resin compositions adhering to apparatus nozzles, rollers, pipes, and the like.
- the solvent for washing and removing of the present invention has excellent detergency particularly for a pigment-dispersed photosensitive resin composition for forming a color filter or a black matrix pattern.
- the solvent for washing and removing of the present invention may be composed of only one kind of solvent, but in order to satisfy various properties such as washing property, drying property, prevention of settling of washed pigment, etc.
- a mixed solvent using a plurality of types of solvents is preferable because a balanced cleaning solution can be easily designed.
- the resin component, monomer component, photopolymerization initiator, and other components in the photosensitive resin composition are excellent in removability, and the aggregation of pigments and the like are suppressed, resulting in good cleanability. can get.
- the car- rier dispersed in the photosensitive resin composition washed and removed by the solvent. Aggregation of pigment particles such as Bonn is suppressed, and the pigment is efficiently dispersed in the solvent for washing and removing. That is, if the dispersibility of the pigment in the solvent for washing and removal is poor, the pigment particles once washed and removed tend to aggregate and settle on the surface to be washed, but this can be prevented and the washing residue can be eliminated.
- an aromatic solvent having an alkyl group and / or an alkoxy group is preferable because carbon can be efficiently dispersed.
- the cleaning liquid attached to the nozzle or the like is discharged when the photosensitive resin composition is discharged again after cleaning. It dissolves in the photosensitive resin composition and changes the composition of the photosensitive resin composition. This may lead to deterioration of properties such as applicability of the photosensitive resin composition, and may cause uneven coating, for example.
- a surfactant is added to the photosensitive resin composition, the concentration of the surfactant decreases due to contact with the cleaning liquid, and as a result, coating unevenness tends to occur.
- the present invention it is possible to provide a solvent for cleaning and removal excellent in drying property (fast drying property), and thereby it is possible to suppress the dissolution of the cleaning solution into the photosensitive resin composition.
- a solvent for cleaning and removal excellent in drying property fast drying property
- propylene glycol monoalkyl ether it is effective for improving the drying property.
- C Carbon PR BK-5005SLJ
- a photosensitive resin composition for forming a black matrix pattern was adhered to a 1 ml pipette made of glass. Next, 1 ml of the pipette was washed. A cleaning process was performed 10 times with the solvent for removal, and the subsequent cleaning condition was visually checked.A was the case where there was no cleaning residue at all. Those that were not evaluated were evaluated as B, and those that had a lot of cleaning residue and had practical problems were evaluated as C.
- a 10 ml sample of each of the upper layer portion and the lower layer portion extracted by the same method as in the evaluation of the sedimentation property of the pigment was spin-coated on the substrate, and coating unevenness was visually confirmed. Uneven coating The evaluation was A, the coating unevenness was slightly confirmed, but the practical force was evaluated as B, and the confirmed practical problem was evaluated as C.
- a cleaning solution consisting of PGMEA (hydrogen bonding parameter 6.6) was prepared.
- a detergent (trade name: Additol XL 121; manufactured by Sol Issia Co.) 5 Oppm was added to the detergent of Example 3 to prepare a detergent.
- a detergent (trade name: Additol XL 121; manufactured by Sol Issia Co.) 5 Oppm was added to the detergent of Example 5 to prepare a detergent.
- Examples 3 to 6 containing an aromatic solvent were good without aggregation and sedimentation of the pigment.
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- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Emergency Medicine (AREA)
- Health & Medical Sciences (AREA)
- Optical Filters (AREA)
- Detergent Compositions (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Materials For Photolithography (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Paints Or Removers (AREA)
Abstract
Description
Claims
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/573,839 US7932221B2 (en) | 2004-08-20 | 2005-07-07 | Solvent for cleaning |
| CNB200580027716XA CN100521100C (zh) | 2004-08-20 | 2005-07-07 | 清洗除去用溶剂 |
| KR1020077003517A KR100888571B1 (ko) | 2004-08-20 | 2005-07-07 | 세정 제거용 용제 |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004241617 | 2004-08-20 | ||
| JP2004-241617 | 2004-08-20 | ||
| JP2005132036A JP4005092B2 (ja) | 2004-08-20 | 2005-04-28 | 洗浄除去用溶剤 |
| JP2005-132036 | 2005-04-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2006018940A1 true WO2006018940A1 (ja) | 2006-02-23 |
Family
ID=35907332
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2005/012574 Ceased WO2006018940A1 (ja) | 2004-08-20 | 2005-07-07 | 洗浄除去用溶剤 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7932221B2 (ja) |
| JP (1) | JP4005092B2 (ja) |
| KR (1) | KR100888571B1 (ja) |
| CN (1) | CN100521100C (ja) |
| TW (1) | TWI277650B (ja) |
| WO (1) | WO2006018940A1 (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014104192A1 (ja) * | 2012-12-27 | 2014-07-03 | 富士フイルム株式会社 | レジスト除去液およびレジスト剥離方法 |
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| US6534079B1 (en) * | 1999-06-04 | 2003-03-18 | S. C. Johnson & Son, Inc. | Passive space insect repellant strip |
| TWI276929B (en) * | 2003-12-16 | 2007-03-21 | Showa Denko Kk | Photosensitive composition remover |
| JP4596894B2 (ja) * | 2003-12-16 | 2010-12-15 | 昭和電工株式会社 | 感光性組成物除去液 |
| TW200634448A (en) * | 2005-02-09 | 2006-10-01 | Showa Denko Kk | Photosensitive composition removing liquid |
| JP4812453B2 (ja) * | 2005-02-09 | 2011-11-09 | 昭和電工株式会社 | 感光性組成物除去液 |
| EP1903400A1 (en) * | 2006-09-20 | 2008-03-26 | Interuniversitair Microelektronica Centrum | A method to remove resist layers from a substrate |
| JP5346686B2 (ja) * | 2008-09-08 | 2013-11-20 | ライオン株式会社 | 液晶除去用洗浄剤組成物及び液晶パネルの洗浄方法 |
| JP5340198B2 (ja) | 2009-02-26 | 2013-11-13 | 富士フイルム株式会社 | 分散組成物 |
| JP5535692B2 (ja) | 2009-03-17 | 2014-07-02 | 富士フイルム株式会社 | 着色硬化性組成物、カラーフィルタ、及びカラーフィルタの製造方法 |
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| JP7453343B2 (ja) * | 2020-03-27 | 2024-03-19 | 富士フイルム株式会社 | パターン形成方法、電子デバイスの製造方法 |
| JP7593842B2 (ja) * | 2021-03-17 | 2024-12-03 | 本田技研工業株式会社 | 内燃機関 |
| CN116855316B (zh) * | 2023-06-20 | 2025-08-29 | 广州安达净水材料有限公司 | 一种去离子清洗剂及其在电子电路产品领域中去除污染物的应用 |
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- 2005-07-07 CN CNB200580027716XA patent/CN100521100C/zh not_active Expired - Fee Related
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| JP2014142635A (ja) * | 2012-12-27 | 2014-08-07 | Fujifilm Corp | レジスト除去液およびレジスト剥離方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100888571B1 (ko) | 2009-03-12 |
| CN100521100C (zh) | 2009-07-29 |
| JP4005092B2 (ja) | 2007-11-07 |
| TWI277650B (en) | 2007-04-01 |
| KR20070043837A (ko) | 2007-04-25 |
| JP2006085140A (ja) | 2006-03-30 |
| TW200615374A (en) | 2006-05-16 |
| US20080039355A1 (en) | 2008-02-14 |
| US7932221B2 (en) | 2011-04-26 |
| CN101006561A (zh) | 2007-07-25 |
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