WO2005124464A3 - Vacuum system for immersion photolithography - Google Patents
Vacuum system for immersion photolithography Download PDFInfo
- Publication number
- WO2005124464A3 WO2005124464A3 PCT/GB2005/002205 GB2005002205W WO2005124464A3 WO 2005124464 A3 WO2005124464 A3 WO 2005124464A3 GB 2005002205 W GB2005002205 W GB 2005002205W WO 2005124464 A3 WO2005124464 A3 WO 2005124464A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- tank
- tool
- vacuum system
- fluid
- gas
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D57/00—Separation, other than separation of solids, not fully covered by a single other group or subclass, e.g. B03C
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70841—Constructional issues related to vacuum environment, e.g. load-lock chamber
Landscapes
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Toxicology (AREA)
- Atmospheric Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Degasification And Air Bubble Elimination (AREA)
Abstract
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2005800199796A CN1997943B (en) | 2004-06-16 | 2005-06-06 | Vacuum system for immersion photolithography |
JP2007516020A JP4772787B2 (en) | 2004-06-16 | 2005-06-06 | Vacuum system for immersion photolithography |
KR1020067026392A KR101151767B1 (en) | 2004-06-16 | 2005-06-06 | Vacuum system for immersion photolithography |
DE602005020619T DE602005020619D1 (en) | 2004-06-16 | 2005-06-06 | UNDERPRESSURE SYSTEM FOR IMMERSION PHOTOLITHOGRAPHY |
EP05747245A EP1756672B1 (en) | 2004-06-16 | 2005-06-06 | Vacuum system for immersion photolithography |
KR1020117011954A KR101341923B1 (en) | 2004-06-16 | 2005-06-06 | Vacuum system for immersion photolithography |
AT05747245T ATE464589T1 (en) | 2004-06-16 | 2005-06-06 | VACUUM PRESSURE SYSTEM FOR IMMERSION PHOTOLITHOGRAPHY |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/869,191 | 2004-06-16 | ||
US10/869,191 US7481867B2 (en) | 2004-06-16 | 2004-06-16 | Vacuum system for immersion photolithography |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2005124464A2 WO2005124464A2 (en) | 2005-12-29 |
WO2005124464A3 true WO2005124464A3 (en) | 2006-06-08 |
Family
ID=32851367
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/GB2005/002205 WO2005124464A2 (en) | 2004-06-16 | 2005-06-06 | Vacuum system for immersion photolithography |
Country Status (10)
Country | Link |
---|---|
US (7) | US7481867B2 (en) |
EP (1) | EP1756672B1 (en) |
JP (3) | JP4772787B2 (en) |
KR (2) | KR101341923B1 (en) |
CN (2) | CN1997943B (en) |
AT (1) | ATE464589T1 (en) |
DE (1) | DE602005020619D1 (en) |
GB (1) | GB0414967D0 (en) |
TW (1) | TWI339131B (en) |
WO (1) | WO2005124464A2 (en) |
Families Citing this family (33)
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JP4515385B2 (en) | 2003-07-09 | 2010-07-28 | 株式会社ニコン | Exposure apparatus, exposure method, and device manufacturing method |
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KR101523180B1 (en) * | 2003-09-03 | 2015-05-26 | 가부시키가이샤 니콘 | Apparatus and method for providing fluid for immersion lithography |
US8054448B2 (en) | 2004-05-04 | 2011-11-08 | Nikon Corporation | Apparatus and method for providing fluid for immersion lithography |
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US8373843B2 (en) * | 2004-06-10 | 2013-02-12 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
US8717533B2 (en) * | 2004-06-10 | 2014-05-06 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
US20070139628A1 (en) * | 2004-06-10 | 2007-06-21 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
US8508713B2 (en) * | 2004-06-10 | 2013-08-13 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
EP2624282B1 (en) | 2004-06-10 | 2017-02-08 | Nikon Corporation | Immersion exposure apparatus and method, and methods for producing a device |
US7481867B2 (en) | 2004-06-16 | 2009-01-27 | Edwards Limited | Vacuum system for immersion photolithography |
US7701550B2 (en) | 2004-08-19 | 2010-04-20 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7379155B2 (en) | 2004-10-18 | 2008-05-27 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7397533B2 (en) | 2004-12-07 | 2008-07-08 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
SG124351A1 (en) | 2005-01-14 | 2006-08-30 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
US8692973B2 (en) | 2005-01-31 | 2014-04-08 | Nikon Corporation | Exposure apparatus and method for producing device |
EP1863070B1 (en) | 2005-01-31 | 2016-04-27 | Nikon Corporation | Exposure apparatus and method for manufacturing device |
US8018573B2 (en) * | 2005-02-22 | 2011-09-13 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7433016B2 (en) | 2005-05-03 | 2008-10-07 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8514365B2 (en) * | 2007-06-01 | 2013-08-20 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7924404B2 (en) * | 2007-08-16 | 2011-04-12 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
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JP5001343B2 (en) * | 2008-12-11 | 2012-08-15 | エーエスエムエル ネザーランズ ビー.ブイ. | Fluid extraction system, immersion lithographic apparatus, and method for reducing pressure fluctuations of an immersion liquid used in an immersion lithographic apparatus |
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US20120012191A1 (en) * | 2010-07-16 | 2012-01-19 | Nikon Corporation | Liquid recovery apparatus, exposure apparatus, liquid recovering method, device fabricating method, program, and storage medium |
NL2009899A (en) | 2011-12-20 | 2013-06-24 | Asml Netherlands Bv | A pump system, a carbon dioxide supply system, an extraction system, a lithographic apparatus and a device manufacturing method. |
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JP6534160B2 (en) * | 2014-07-31 | 2019-06-26 | 株式会社資源開発研究所 | Cleaning device |
JP6535649B2 (en) * | 2016-12-12 | 2019-06-26 | 株式会社荏原製作所 | Substrate processing apparatus, discharge method and program |
CN112684675B (en) * | 2020-12-30 | 2023-02-21 | 浙江启尔机电技术有限公司 | Vacuum system and immersion lithography machine using same |
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2004
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