WO2005100220A1 - カバーレイフィルム貼り合わせ装置 - Google Patents
カバーレイフィルム貼り合わせ装置 Download PDFInfo
- Publication number
- WO2005100220A1 WO2005100220A1 PCT/JP2005/000921 JP2005000921W WO2005100220A1 WO 2005100220 A1 WO2005100220 A1 WO 2005100220A1 JP 2005000921 W JP2005000921 W JP 2005000921W WO 2005100220 A1 WO2005100220 A1 WO 2005100220A1
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- WO
- WIPO (PCT)
- Prior art keywords
- film
- coverlay
- temporary
- coverlay film
- bonding
- Prior art date
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H37/00—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations
- B65H37/04—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations for securing together articles or webs, e.g. by adhesive, stitching or stapling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
- B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
- B32B38/1833—Positioning, e.g. registration or centering
- B32B38/1841—Positioning, e.g. registration or centering during laying up
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H29/00—Delivering or advancing articles from machines; Advancing articles to or into piles
- B65H29/38—Delivering or advancing articles from machines; Advancing articles to or into piles by movable piling or advancing arms, frames, plates, or like members with which the articles are maintained in face contact
- B65H29/46—Members reciprocated in rectilinear path
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H5/00—Feeding articles separated from piles; Feeding articles to machines
- B65H5/04—Feeding articles separated from piles; Feeding articles to machines by movable tables or carriages
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
Definitions
- the present invention relates to a cover lay film bonding apparatus for bonding a cover lay film to a base film for forming a flexible substrate.
- thermosetting adhesive is applied to a pattern-formed surface of a base film made of a polyimide resin, PET resin, polyester resin, or the like on which a conductor pattern such as copper foil is formed. It is known that there is a step of bonding a cover lay film made of a polyimide resin, a PET resin or the like having a layer.
- this type of cover lay film laminating operation is performed by manually passing through a base film and a cover lay film to a number of positioning pins erected on a work table, and then manually positioning the pins. Is being done.
- release film since a coverlay film usually has many holes corresponding to the conductor pattern of the base film, a release film or release paper must be removed from the coverlay film in order to perform the work of bonding the coverlay film.
- the peel-off of the coverlay film makes the stiffness of the coverlay film disappear, making it extremely difficult to handle.
- FIG. 10 is a view for explaining a conventional coverlay film bonding apparatus.
- a conventional coverlay film laminating apparatus 800 includes a base finolem delivery roll 801A, a coverlay film delivery roll 802A, a release film delivery roll 803A, 804A, and two pairs of roll storage 805, 805, 807. , 807, a laminated finolem take-up roll 801B, a release film take-up roll 803B, 804B, and a calo-heat press 806, 806 (for example, see Patent Document 1).
- the base film Wl1 fed from the base film feed roll 801A and the coverlay film W12 fed from the coverlay film feed roll 802A are integrated. After being sandwiched by the release films W13 and W14 unwound from the release film unwinding rolls 803A and 804A, they are integrally laminated by the heating presses 806 and 806 to form a laminated film W15. The film is wound around a laminated film winding roll 801B.
- the bonding operation of the base film W11 and the cover lay film W12 can be automated, and as a result, the base film W11 and the cover lay film can be combined.
- the productivity in the bonding work with W12 can be increased.
- Patent Document 1 JP-A-2-226793 (FIG. 1)
- the base film W11 and the cover lay film W12 are bonded together in a state where long films are integrally laminated. I have. For this reason, the more the film is fed, the more the positioning errors in the longitudinal direction of the base film are accumulated, and it is difficult to secure the positioning accuracy in the longitudinal direction of the base film. It is. In addition, a meandering phenomenon caused by feeding out these films causes a positioning error in the short direction of the base film. Therefore, it is not easy to secure the positioning accuracy of the base film in the short direction. For this reason, it is not easy to increase the accuracy of the position at which the coverlay film is bonded to the base film. As a result, there is a problem that it is not easy to increase the quality of the flexible substrate.
- the present invention has been made to solve such a problem, and it is easy to increase the accuracy of the position at which the coverlay film is bonded to the base finolem. As a result, the quality of the flexible substrate is reduced. It is an object of the present invention to provide a coverlay film bonding apparatus that can be easily raised. Means for solving the problem
- the cover lay film bonding apparatus of the present invention is provided with a base film supply device for intermittently feeding a roll-shaped base film in a sheet form, and the base finole feeding device.
- a temporary bonding apparatus for temporarily bonding a strip-shaped cover lay film to a sheet-shaped base film to form a sheet-like laminated film in which the cover lay film is temporarily bonded to the base film;
- a laminated film collecting device for winding a sheet-shaped laminated film formed by the device into a roll, and a laminated film collecting device for winding the sheet-shaped laminated film into a roll.
- temporary pressure bonding area and a force-barley film are supplied toward the temporary pressure bonding area.
- the coverlay film can be supplied along the coverlay film supply path connecting the position (hereinafter referred to as “coverlay film supply position”), and the position and orientation of the coverlay film with respect to the base film can be adjusted. It has a crimping table.
- the strip cover lay film is temporarily pressure-bonded to the intermittently fed sheet base film. Even when a long base film is used, the alignment error in the long direction of the base film does not accumulate, and the positioning accuracy in the long direction of the base film does not decrease.
- the cover lay film is supplied to the temporary crimping area by the temporary crimping table capable of adjusting the position and the posture of the cover lay film with respect to the base film. It is easy to increase the accuracy of the position at which the coverlay film is bonded to the base film. As a result, it is easy to increase the quality of the flexible substrate, and the object of the present invention is achieved.
- the cover lay film bonding apparatus of the present invention instead of completely bonding the cover lay film to the base film to form a laminated film, the cover lay film is temporarily pressure-bonded to the base film. A laminated film is to be formed.
- the above-mentioned bonding step is greatly shortened, and the overall productivity is improved.
- a special permanent bonding device for example, a vacuum press machine
- bonding (final bonding) the laminated film to which the coverlay film has been temporarily bonded. ) Is prepared separately, and the coverlay film is completely bonded to the base film using this permanent bonding device.
- the “strip shape” means a substantially rectangular shape including a square shape, which does not necessarily mean only an elongated shape when viewed from a plane. .
- the force burley film supply path is connected to a base film supply path connecting the base film supply apparatus and the laminated film collection apparatus.
- a base film supply path connecting the base film supply apparatus and the laminated film collection apparatus are preferably orthogonal.
- the present invention is not limited to this. Even when a strip-shaped base film is used as the base film, the same effects as in the case of the coverlay film bonding apparatus described in (1) above can be obtained.
- the cover lay film bonding apparatus of the present invention includes a base film supply device for supplying a strip-shaped base film toward the temporary press-bonding area, and a strip film supplied by the base film supply device.
- a temporary crimping device for temporarily bonding a strip-shaped cover lay film to the base film to form a strip-shaped laminated film, and collecting the strip-shaped laminated film formed by the temporary crimping device.
- Laminated layer A coverlay film bonding apparatus provided with a film recovery device, wherein the temporary bonding apparatus can supply a coverlay film along a coverlay film supply path connecting a temporary bonding area and a coverlay film supply position.
- a temporary pressure bonding table capable of adjusting the position and posture of the cover lay film with respect to the base film.
- the cover lay film adjusts the position and posture of the cover lay film with respect to the base film. Since the adhesive is supplied to the temporary crimping area by the adjustable temporary crimping table, it is easy to increase the positional accuracy of bonding the coverlay film to the base film. As a result, it is easy to increase the quality of the flexible substrate, and the object of the present invention is achieved.
- the temporary crimping table moves in two horizontal directions orthogonal to each other. And it is preferable that it is rotatable in the circumferential direction about the virtual point in the horizontal plane as the center of rotation.
- the coverlay film can be arranged with high accuracy in position (and posture) with respect to the base film. It becomes easy to do.
- a direction along the base film supply path and a direction along the cover lay film supply path as the two horizontal directions orthogonal to each other.
- the virtual point in the horizontal plane it is preferable to select the center point on the surface of the temporary crimping table on which the coverlay film is placed.
- the temporary crimping table is provided with at least two imaging holes which are spaced apart from each other. This It is preferable that an imaging element is provided corresponding to each of the imaging holes.
- the position and orientation of the coverlay film with respect to the base film can be accurately measured by at least two image sensors.
- the coverlay film can be arranged with high accuracy in position (and posture) with respect to the base film, and it becomes easy to increase the positional accuracy of bonding the coverlay film to the base film.
- At least two imaging holes are arranged at both ends of the temporary pressure bonding table.
- the temporary crimping table moves upward in the temporary crimping area. Accordingly, it is preferable to perform the temporary pressing operation.
- the temporary crimping apparatus may perform the temporary crimping operation when the temporary crimping table performs the temporary crimping operation in the temporary crimping area. It is preferable to further include a buffer mechanism for receiving the temporary pressure bonding table.
- the entire coverlay film can be temporarily pressure-bonded to the base film with a uniform force.
- the base film can be adsorbed to a large number of the base film suction holes, and the base film can be fixed to the temporary pressure bonding area.
- the temporary bonding apparatus presses the base film against the buffer mechanism before the temporary bonding operation is performed. It is preferable to further have a holding mechanism for applying.
- the pressing operation by the pressing mechanism is performed before the temporary pressing operation is performed, the pressing operation can be performed smoothly without being disturbed by the temporary pressing operation by the temporary pressing table.
- the temporary crimping table that has completed the temporary crimping operation moves from the temporary crimping area to the coverlay film supply position, places a new coverlay film, and returns to the temporary crimping area again. Since the holding mechanism is used to perform the holding operation using this time, there is no need to take extra time to perform the holding operation. That doesn't even lower productivity.
- the holding mechanism moves from outside the temporary crimping area to the inside of the temporary crimping area.
- the temporary crimping table is preferably configured to move from the coverlay film supply position toward the temporary crimping area.
- both the temporary pressing operation by the temporary pressing table and the pressing operation by the pressing mechanism can be performed smoothly.
- the temporary crimping table preferably has a heater for heating the cover lay film.
- the temperature of the cover lay film can be raised in advance in the process of supplying the cover lay film to the base film prior to the temporary crimping. Temporary pressure bonding of the coverlay film to the cover can be performed more smoothly in a shorter time.
- a force burley for intermittently feeding a roll-shaped cover lay film into a sheet shape.
- the film is fed by this film feeding device and this coverlay film feeding device.
- a coverlay film cutting device for cutting the sheet-like coverlay film thus formed into a strip-shaped coverlay film, and a strip-shaped coverlay film formed by the coverlay film cutting device.
- the apparatus further includes a coverlay film cutting / loading device having a force for mounting on the temporary pressure bonding table.
- a roll-shaped coverlay film force can be formed into a strip-shaped power burley film, and the strip-shaped coverlay film can be supplied to the temporary pressure bonding table.
- the coverlay film can be used. For this reason, the productivity as a whole can be further increased.
- the cover lay film cutting apparatus has a push cutting blade for cutting a sheet-like cover lay film into a strip shape.
- the blade receiving sheet fed by the blade receiving sheet feeding device can always receive the push-cutting blade.
- the coverlay film can be cut well. Further, it is possible to prevent the cutting edge of the push cutting blade from being damaged.
- cover lay film bonding apparatus In the cover lay film bonding apparatus according to any one of the above (1) and (12), a large number of strip-shaped cover lay films may be attached to the temporary pressure bonding table. It is preferable that the cover lay film suction hole is provided.
- the cover lay film cutting and placing apparatus may include a cover lay film attached to the plurality of cover lay film suction holes.
- Release film gripping device that grips the end of release film
- the temporary pressure bonding table moves from the coverlay film supply position toward the temporary pressure bonding region, It is preferable to release the release film from the coverlay film.
- the release film can be peeled from the coverlay film during the process of transporting the coverlay film to the temporary pressure bonding area. There is no need to provide a special process for peeling the film. Therefore, the work of attaching the coverlay film to the base film can be shortened.
- the coverlay film can be handled with the release film attached thereto, so that handling is extremely easy.
- the cover lay film cutting In the cover lay film bonding apparatus according to the above (14), the cover lay film cutting.
- the mounting apparatus may cut the cover lay film from the cover lay film prior to cutting the cover lay film. It is preferable to further include a release film peeling blade for partially peeling the release film to form a partially peeled portion.
- the coverlay film placed on the temporary pressure-bonding table is preliminarily formed with a partial peeling portion by the release film peeling blade.
- the end of the release film can be easily gripped.
- the cover lay film mounting apparatus may include a cover lay film cutting apparatus configured to cut a bar lay film cut by the cover lay film cutting apparatus into the temporary crimping table.
- the side of the temporary film bonding apparatus in the base film supply path is the side of the laminated film collection apparatus. It is preferable to further include an auxiliary temporary crimping device that is disposed on the base film and that further temporarily press-fits the cover lay film temporarily crimped to the base film by the temporary crimping device.
- the cover lay film bonding apparatus After the step of temporarily bonding the cover lay film to the base film to form the laminated film, the laminated film is placed in the area where the auxiliary temporary compression is performed.
- the steps of supplying and supplying a new base film to the temporary pressure-bonding area and moving the temporary pressure-bonding table to supply a new coverlay film to the temporary pressure-bonding area on the base film supply path are performed.
- the latter process requires much longer time than the former process. Therefore, by performing the auxiliary temporary crimping process using the time difference between these processes, a special process for the auxiliary temporary crimping process is performed.
- the auxiliary temporary bonding step can be performed without taking much time. For this reason, the time of the first temporary crimping can be reduced, and the productivity as a whole can be further improved.
- At least two image sensors are disposed between the auxiliary temporary crimping apparatus and the laminated film collecting apparatus in the base film supply path. It is preferable that they are arranged apart from each other.
- the base film supply device In the cover lay film bonding apparatus according to (17) or (18), the base film supply device, the laminated film collection device, the temporary compression bonding device, and the auxiliary temporary compression bonding device It should be equipped with a controller to operate synchronously. Is preferred.
- the temporary press-bonding step and the auxiliary temporary press-bonding step can be performed while adjusting the tact time, so that the position of bonding the cover lay film to the base film is kept high. As a whole, it becomes possible to perform temporary crimping with high productivity as a whole.
- FIG. 1 is a plan view showing a coverlay film bonding apparatus according to Embodiment 1.
- FIG. 2 is a simplified plan view showing a coverlay film bonding apparatus according to Embodiment 1.
- FIG. 3 is a front view showing a coverlay film bonding apparatus according to Embodiment 1.
- FIG. 4 is an enlarged view of an essential part for explaining a temporary crimping device.
- FIG. 5 is a side view for explaining a temporary crimping device and a coverlay film cutting and placing device.
- FIG. 6 is a rear view showing the coverlay film cutting and placing device.
- FIG. 7 is a side view showing a coverlay film cutting and placing device.
- FIG. 8 is a flowchart shown to explain a method of temporarily bonding a coverlay film to a base film.
- FIG. 9 is a simplified plan view showing a coverlay film bonding apparatus according to Embodiment 2.
- FIG. 10 is a front view showing a conventional coverlay film bonding apparatus.
- FIG. 1 is a plan view showing a coverlay film bonding apparatus according to the first embodiment.
- FIG. 2 is a simplified plan view showing the coverlay film bonding apparatus according to the first embodiment.
- FIG. 3 is a front view showing the coverlay film bonding apparatus according to the first embodiment.
- FIG. 4 is an enlarged view of a main part for explaining a temporary crimping device.
- FIG. 5 is a side view for explaining a temporary crimping device and a coverlay film cutting and placing device.
- FIG. 6 is a rear view showing the coverlay film cutting and placing apparatus.
- FIG. 7 is a side view showing a cover lay film cutting and placing device.
- the cover lay film bonding apparatus 1 includes an apparatus main body 100 for mounting and fixing various apparatuses (described below), and a roll-shaped apparatus.
- a base film supply device 200 for intermittently feeding the base film Wb into a sheet shape, and a strip-shaped coverlay film Wc for the sheet-like base film Wb fed by the base film supply device 200 are temporarily provided.
- the laminated film Ws has a structure in which a strip-shaped coverlay film Wc is temporarily pressure-bonded to one pattern forming surface side of the base film Wb.
- the apparatus main body 100 is configured by a machine base having a substantially rectangular shape in plan view. As shown in FIG. 3, a controller for synchronously operating the base film supply device 200, the laminated film collecting device 300, the temporary crimping device 400, and the auxiliary temporary crimping device 500 is provided on the right side of the device main body 100, as shown in FIG. A built-in controller box 110 is provided.
- a base film supply device 200 and a laminated film A base film supply path LI connecting the collection device 300, a cover lay film supply path L2 connecting the cover lay film supply position P1 and the temporary crimping area P2, a cover lay film feeding device 610 described later, and a cover lay film supply position.
- a coverlay film transport path L3 connecting to P1 is formed.
- the base film supply device 200 has a feeding roller 210 and a guide roller 220.
- the feeding roller 210 is rotatably supported on the upper end of the roller support 150.
- the roll base film Wb is fed out into a sheet shape by the rotation of the torque motor 212.
- the guide roller 220 is rotatably supported by the apparatus main body 100 and is configured to guide the sheet-like base film Wb to the laminated film collecting apparatus 300 side.
- the laminated film collecting apparatus 300 has a take-up roller 310 and a guide roller 320.
- the take-up roller 310 is rotatably supported on the upper end of the roller support 152. Then, the sheet-shaped laminated film Ws is wound into a roll shape by rotation by driving of the torque motor 312.
- the guide roller 320 is rotatably supported by the apparatus main body 100, and is configured to guide the sheet-shaped laminated film Ws to the winding roller 310 side.
- the tension device 250 on the side of the base film supply device 200 has a lifting / lowering port 252 and is disposed below the base film supply device 200.
- the elevating roller 252 has a roller shaft 254 supported by an elevating guide 256 so as to be rotatable and elevable. Then, the base film Wb is relaxed by driving up a cylinder (not shown) and tensioned by lowering by its own weight.
- the tension device 350 on the side of the laminated film collecting device 300 has an elevator port 352 and is disposed below the laminated film collecting device 300.
- the elevating roller 352 has a roller shaft 354 supported by an elevating guide 356 so as to be rotatable and vertically movable.
- the laminated film Ws is configured to relax by driving the cylinder (not shown), and to tension the laminated film Ws by descending by its own weight.
- the temporary crimping device 400 can supply the coverlay film Wc along the coverlay film supply path L2, and can position the force barley film Wc with respect to the base film Wb.
- a buffer mechanism 480 for receiving the temporary crimping table 410 when the temporary crimping table 410 performs the temporary crimping operation in the temporary crimping area P2, and a base before the temporary crimping operation is performed.
- a holding mechanism 490 for holding the film Wb against the buffer mechanism 480 is provided.
- the temporary crimping table 410 has a cover on which the first moving device 420, the second moving device 430, the third moving device 440, the fourth moving device 450, and the coverlay film Wc are placed. It has one ray film mounting part 460.
- the first moving device 420 extends along the servomotor 422, the screw shaft 424 supported by the servomotor 422, the first table 426, and the y-axis direction. It has a guide 428 and is disposed on the apparatus main body 100.
- the first moving device 420 is configured such that the first table 426 moves on the guide 428 along the y-axis direction by the rotation of the screw shaft 424 driven by the servo motor 422.
- the second moving device 430 includes a servomotor 432, a screw shaft 434 supported by the servomotor 432, a second table 436, and a guide 438 extending along the X-axis direction. It is arranged above.
- the second moving device 430 is configured such that the second table 436 moves on the guide 438 along the X-axis direction by rotation of the screw shaft 434 driven by the servo motor 432.
- the third moving device 440 includes a servomotor 442, a screw shaft 444 supported by the servomotor 442, a third taper 446, and a mover 447 for applying a rotating force to the third table 446. Arranged on table 436.
- the third table 446 is pivotally supported by a pivot 448 on the second table 436, and is swingably disposed via a table receiver 449.
- the third moving device 440 is configured to rotate in the circumferential direction (around the z axis) around the pivot 448 by the rotation of the screw shaft 444 driven by the servo motor 442.
- the fourth moving device 450 includes a servomotor 452, a screw shaft 454 supported by the servomotor 452, a fourth table 456, and a guide 458 extending along the X-axis direction. It is arranged on three tables 446.
- the fourth moving device 450 is configured such that the fourth table 456 moves on the guide 458 along the X-axis direction by rotation of the screw shaft 454 driven by the servomotor 452.
- the coverlay film mounting portion 460 is disposed on the fourth table 456 via an inclined portion 462 having a leftward force and a gradient rising toward the right side and a roller 464. It is established. Further, a spring 466 is locked to the fourth table 456 and the coverlay film mounting portion 460. As a result, when the fourth table 456 moves to the left in FIG. 4, the coverlay film mounting section 460 moves up. When the fourth table 456 moves to the right in FIG. 4, the coverlay film mounting section moves. 460 will fall.
- the temporary pressure-sensitive adhesive tape groove 410 can be moved in two horizontal directions (X-axis direction and y-axis direction) orthogonal to each other, and It can rotate in the circumferential direction (around the z-axis) with the virtual point in the horizontal plane as the center of rotation.
- the coverlay film Wc can be accurately positioned (and oriented) with respect to the base film Wb, so that it is easy to increase the bonding position accuracy of the coverlay film Wc with respect to the base film Wb. It becomes.
- the two horizontal directions (X-axis direction and y-axis direction) orthogonal to each other include the direction along the base film supply path L1 and the cover. This is the direction along the ray film supply path L2 (see Fig. 2).
- the virtual point in the horizontal plane is the center point of the coverlay film mounting portion 460 of the temporary crimping table 410.
- the temporary crimping table 410 has two imaging holes 470a spaced apart from each other.
- An image sensor 470 is provided corresponding to each of the imaging holes 470a.
- the position and orientation of the cover lay film Wc with respect to the base film Wb can be accurately measured by the two image sensors 470. Therefore, it is necessary to position the coverlay film Wc with high accuracy (and posture) with respect to the base film Wb. This makes it easy to increase the positional accuracy of bonding the coverlay film Wc to the base film Wb.
- the two imaging holes 470a are arranged at both ends of the temporary crimping table 410 (see FIG. 2).
- the temporary pressure bonding tape 410 is configured to perform a temporary pressure bonding operation by moving upward in the temporary pressure bonding area P2.
- the temporary bonding table 410 moves upward as it is with the position (and posture) of the coverlay film Wc accurately positioned with respect to the base film Wb.
- Temporary crimping can be performed while maintaining the position (and posture) with high accuracy. For this reason, it becomes easy to increase the positional accuracy of bonding the cover lay film Wc to the base film Wb.
- the temporary bonding table 410 performs the temporary bonding operation in the temporary bonding area P2.
- a buffer mechanism 480 for receiving the temporary press-bonding table 410. This makes it possible to temporarily press the entire coverlay film Wc against the base film Wb with a uniform force.
- the buffer mechanism 480 is provided with a number of base film suction holes (not shown) for sucking the base film Wb.
- the base film Wb can be adsorbed to a large number of base film suction holes, and the base film Wb can be fixed in the temporary press-bonding area P2.
- the temporary bonding apparatus 400 uses the buffer mechanism 480 to release the base film Wb before the temporary bonding operation is performed. Further, there is provided a pressing mechanism 490 for pressing down against.
- the holding mechanism 490 holds the base film Wb against the buffer mechanism 480. Therefore, the base film Wb can be more reliably adsorbed to a large number of the base film adsorption holes.
- the pressing operation by the pressing mechanism 490 is performed before the temporary pressing operation is performed, the pressing operation can be performed smoothly without being interrupted by the temporary pressing operation by the temporary pressing table 410.
- the pre-crimping tape is transferred from the pre-crimping area P2 to the coverlay film supply position P1, and a new cover film Wc is placed on it again. This is the time until returning to the temporary crimping area P2, and since the pressing operation is performed by the pressing mechanism 490 using this time, no special time is required for performing the pressing operation. However, there is no decrease in overall productivity.
- the holding mechanism 490 moves out of the temporary pressure-bonding area.
- the temporary crimping table 410 moves from the coverlay film supply position P1 toward the temporary crimping area P2. It is configured.
- both the temporary pressing operation by the temporary pressing table 410 and the pressing operation by the pressing mechanism 490 can be performed smoothly.
- the temporary pressure-sensitive adhesive tape notch 410 has a heater (not shown) for heating the cover lay film Wc.
- the temperature of the cover lay film Wc can be raised in advance, so that the cover lay film Wc is temporarily bonded to the base film Wb. Can be performed more smoothly in a shorter time.
- the temporary pressure-sensitive adhesive tape knurls 410 have a large number of cover lay film suction holes (not shown) for sucking the strip-shaped cover lay film Wc. ) Is provided.
- the coverlay film supplied at the coverlay film supply position P1 is Wc can be smoothly transported to the temporary crimping area P2 by the temporary crimping table 410.
- fixed clampers 120 are provided upstream (on the base film supply device 200 side) and downstream (on the laminated film recovery device 300 side) of the temporary crimping device 400 in the base film supply path L1.
- 130 are provided, and a movable clamper 140 is provided between an auxiliary temporary crimping device 500 and a laminated film collecting device 300 described later.
- the auxiliary temporary crimping device 500 is provided on the side of the laminated film collection device 300 of the temporary crimping device 400 in the base film supply path L1. Therefore, the cover lay film Wc provisionally press-bonded to the base film Wb is further strongly press-bonded to the base film Wb.
- the auxiliary temporary crimping time of the auxiliary temporary crimping device 500 is set by the controller 110 to a desired time.
- the coverlay film cutting and placing device 600 is a coverlay film feeding device 610 for intermittently feeding a roll-shaped coverlay film WcO into a sheet.
- the coverlay film cutting device 630 and the coverlay film cutting device 630 for cutting the sheet-like coverlay film WcO fed by the coverlay film feeding device 610 to form the strip-shaped coverlay film Wc.
- a coverlay film mounting device 650 for mounting the strip-shaped coverlay film Wc thus formed on the temporary crimping table 410 is provided.
- a strip-shaped coverlay film Wc can be formed from the roll-shaped coverlay film WcO, and the strip-shaped coverlay film Wc can be supplied to the temporary crimping table 410.
- Rayfilm WcO can be used. For this reason, the productivity as a whole can be further increased.
- the coverlay film feeding device 610 has a feeding roller 612, a driving roller 616, and a guide roller 620 as shown in Figs.
- the feeding roller 612 is rotatably supported at the upper end of the roller support 160.
- the roll-shaped coverlay film WcO is fed out into a sheet shape by the rotation of the torque motor 614.
- the drive roller 616 is rotatably supported on the roller support 162.
- the sheet-shaped coverlay film WcO is fed out toward the guide roller 620 by rotation of the torque motor 618 when driven.
- the guide roller 620 is rotatably supported by the apparatus main body 100, and is configured to guide the sheet-like coverlay film WcO to the coverlay film cutting device 630 side.
- an elevating roller 622 for relaxing and tensioning the cover lay film WcO is provided below the cover lay film feeding device 610.
- a drawer roller 624 for pulling the sheet-like cover lay film WcO from the cover lay film feeding device 610 and a moving clamper 626 are provided. It is arranged.
- the cover lay film cutting device 630 includes a press cutting blade mold 632 having a press cutting blade for cutting the sheet-like cover lay film WcO into a strip shape, and a press cutting blade mold 632. Receiving mold 634 for receiving the same. Also, the cover lay film is cut.
- the placing device 600 includes a blade receiving sheet feeding device 640 that pushes out the blade receiving sheet Wh receiving the press cutting blade between the cutting die 632 and the receiving die 634, and a blade receiving sheet Wh.
- a blade receiving sheet winding device 642 for winding is further provided.
- the blade receiving sheet Wh fed by the blade receiving sheet feeding device 640 can always receive the push-cutting blade.
- the film can be cut well. Further, it is possible to prevent the cutting edge of the press cutting blade from being damaged.
- the coverlay film mounting device 650 is used to transfer the strip-shaped coverlay film Wc cut by the coverlay film cutting device 630 to the coverlay film transfer position P3. It has a moving clamper 652 and a suction pad 654 for transporting the coverlay film Wc placed at the coverlay film delivery position P3 to the temporary crimping table 410 at the coverlay film supply position P1.
- the suction pad 654 can move in the X-axis direction, and can move up and down at the coverlay film supply position P1 and the coverlay film delivery position P3.
- the cover lay film cutting and placing apparatus 600 includes a cover lay film placing apparatus 650 as shown in FIG. 1, FIG.
- a release film gripping device 660 for gripping an end of the release film in the cover lay film Wc placed on the temporary pressure bonding table 410. Then, with the release film gripping device 660 gripping the end of the release film, the temporary pressure bonding table 410 moves from the force barley film supply position P1 to the temporary pressure bonding area P2, and the cover lay is moved.
- the release film is configured to be peeled from the film Wc.
- coverlay film Wc can be handled with the release film attached until the coverlay film Wc is placed on the temporary pressure bonding table 410, so that the handling becomes extremely easy.
- the cover lay film cutting / placing device 600 includes a cover lay film WcO prior to cutting the cover lay film WcO.
- the film further includes a release film peeling blade 670 for partially releasing the release film from the ray film WcO to form a partial release portion.
- the coverlay film Wc placed on the temporary pressure bonding table 410 has a partial peeling portion formed in advance by the release film peeling blade 670, so that the release film gripping device 660 The end can be easily gripped.
- the suction pad 654 is placed on the temporary pressure bonding table 410, and then released by the release film holding device 660. Until the edge of the film is gripped, the film is configured to adsorb the partially peeled portion.
- the release film holding device 660 can more easily hold the end of the release film with the force S. Become.
- two light emitting elements 170 for illumination are disposed at an intermediate position between the cover lay film supply position P1 and the temporary crimping area P2 as shown in FIG. ing.
- the cover lay film bonding apparatus 1 includes the base film supply apparatus 200 and the base film supply apparatus for intermittently feeding the roll-shaped base film Wb into a sheet.
- the cover-lay film Wc is temporarily pressure-bonded to the base film Wb by temporarily bonding the cover-like film Wc to the sheet-like base film Wb fed out by the method 200.
- a laminated film collection device 300 for winding the sheet-shaped laminated film Ws formed by the temporary compression device 400 into a roll.
- the temporary bonding apparatus 400 includes a temporary bonding table 410 that can supply the cover lay film Wc along the cover lay film supply path L2 and that can adjust the position and orientation of the cover lay film Wc with respect to the base film Wb. Have.
- the strip-shaped coverlay film Wc is temporarily pressure-bonded to the intermittently fed sheet-shaped base film Wb. Therefore, even when a long base film is used, the positioning error in the long direction of the base film is not accumulated, and the positioning accuracy in the long direction of the base film is reduced. Is gone.
- the cover lay film Wc is moved to the temporary crimping area P2 by the temporary crimping table 410 capable of adjusting the position and the posture of the cover lay film Wc with respect to the base film Wb. Since it is supplied, it is easy to increase the accuracy of the bonding position of the cover lay film Wc to the base film Wb. As a result, it is easy to increase the quality of the flexible substrate.
- FIGS. In the coverlay film bonding apparatus 1 according to the first embodiment, FIGS. As shown in the figure, two image pickup devices 180 are disposed apart from each other between the auxiliary temporary crimping device 500 and the laminated film recovery device 300 in the base film supply path LI. This allows the image pickup device 180 to photograph the laminated film Ws, and thus allows the laminated film recovery device 300 to check the temporarily pressed state before the laminated film Ws is recovered. If the position of the cover lay film Wc to be attached to the base film Wb is shifted or the temporary crimping is incomplete as a result of photographing by the image sensor 180, the operation of the apparatus is stopped, and thereafter, It is possible to prevent the formation of a laminated film in which such temporary press bonding is incomplete.
- the base film supply apparatus 200, the laminated film recovery apparatus 300, the temporary bonding apparatus 400, and the auxiliary temporary bonding apparatus 500 are synchronized. It further includes a controller 110 for operating.
- FIG. 8 is a flowchart for explaining a method of temporarily bonding a coverlay film to a base film.
- the clamper 140 is disposed near the auxiliary temporary crimping device 500, and the moving clamper 652 of the cover lay film mounting device 650 is disposed near the cover lay film cutting device 630, and the suction pad 654 of the force bar lay film mounting device 650. Is located at the coverlay film transfer position P3. Also, it is assumed that the temporary pressure bonding table 410 is arranged at the coverlay film supply position P1.
- the base film Wb is intermittently fed out along the base film supply path L1 by driving the base film supply device 200, the moving clamper 140, and the laminated film collection device 300 (step Ql in FIG. 8).
- the coverlay film feeding device 610 is driven to turn the roll-shaped coverlay film WcO into a sheet, and then intermittently feeds it along the coverlay film transport path L3 (step Rl in FIG. 8). At this time, in the coverlay film WcO, the release film in the coverlay film WcO is partially peeled by the release film peeling blade 670 to form a partially peeled portion.
- the sheet-like coverlay finolem WcO fed from the coverlay film feeding device 610 is moved by the moving clamper 626 between the push-cutting die 632 and the receiving die 634 in the coverlay film cutting device 630. Supplied. Then, the cover lay film cutting device 630 cuts the sheet-like cover lay film WcO while the edge of the cover lay film delivery position P3 side of the cover lay film WcO is gripped by the moving clamper 652 (step R2 in FIG. 8). . At this time, the cover lay film WcO is cut while the blade receiving sheet Wh is always fed out between the sheet-like cover lay film WcO and the receiving die 634. It becomes.
- the cover lay film Wc cut into strips by the cover lay film cutting device 630 is arranged at the cover lay film transfer position P 3 by the moving clamper 652.
- the cover lay film Wc disposed at the cover lay film transfer position P3 is sucked by the suction pad 654, and is conveyed from the cover lay film transfer position P3 to the temporary crimping table 410 at the cover lay film supply position P1. (Step R3 in Fig. 8).
- the peeled release film is collected in a release film collection box (not shown) provided near the coverlay film supply position P1.
- the temporary bonding table 410 to which the coverlay film Wc has been supplied at the coverlay film supply position P1 is moved to a position where the light emitting element 170 is provided in the coverlay film supply path L2.
- the coverlay film Wc is photographed by the two image sensors 470 disposed on the temporary crimping table 410, and the position of the coverlay film Wc on the temporary compression table 410 is measured based on the photographed result. (Step Sl in Figure 8).
- temporary crimping table 410 is moved to temporary crimping area P2.
- the pressing mechanism 490 is disposed outside the temporary crimping area.
- the base film Wb is photographed by the two image sensors 470, and based on the photographed result, the temporary crimping table 410
- the position of the base film Wb is measured based on the position (step S2 in FIG. 8).
- the relative displacement amount is calculated from the measured values of the coverlay film Wc and the base film Wb, and based on the calculation result, the temporary crimping table 410 is driven to move in the horizontal direction (X-axis direction and y-axis direction). Adjustment and rotation adjustment in the Z or circumferential direction (around the z-axis) are performed, and the coverlay film Wc is aligned with the base film Wb (step S3 in FIG. 8).
- the fourth moving device 450 of the temporary bonding table 410 is driven to move the temporary bonding table 410 upward, and the cover lay is formed on the base film Wb.
- Temporarily crimp the film Wc (Step S4 in Fig. 8).
- the holding of the fixed clampers 120 and 130 is released.
- the temporary crimping table 410 moves to the coverlay film supply position P1 in order to receive a new coverlay film Wc from the coverlay film cutting and placing apparatus 600.
- the sheet-shaped laminated film Ws formed by the temporary crimping device 400 is sent to the auxiliary temporary crimping device 500 by driving the base film supply device 200, the moving clamper 140 and the laminated film collecting device 300. Then, the auxiliary temporary crimping device 500 performs the auxiliary temporary crimping, thereby forming a laminated film Ws in which the coverlay film Wc is further firmly temporarily crimped to the base film Wb (step S5 in FIG. 8).
- the laminated film Ws subjected to the auxiliary temporary compression is sent to the laminated film collecting device 300 by the moving clamper 140.
- the work of confirming the state of the preliminarily bonded state of the laminated film Ws is performed by the imaging elements 180 arranged at both ends in the width direction of the movable clamper 140 (step SQ1 in FIG. 8).
- the sheet-shaped laminated film Ws is wound around the winding roller 310 by driving the base film supply device 200, the moving clamper 140 and the laminated film collecting device 300 (step SQ2 in FIG. 8).
- the sheet-shaped laminated film Ws is wound up in a roll shape, and is collected as the roll-shaped laminated film Ws.
- cover lay film Wc In order to bond the cover lay film Wc to the base film Wb, at least a cover lay film supply step of supplying the cover lay film Wc to a bonding area on the base film supply path is performed.
- the force required for the lamination process of laminating the cover lay film Wc on the film Wb If the cover lay film Wc is completely laminated on the base film Wb in one step, this lamination process Becomes extremely long, and it becomes difficult to improve the productivity as a whole.
- the cover lay film bonding apparatus 1 instead of completely bonding the cover lay film Wc to the base film Wb to form a laminated film, the cover lay film is bonded to the base film Wb.
- the film Wc is temporarily pressed to form a laminated film Ws.
- the cover lay film bonding apparatus 1 in order to completely bond the cover lay film Wc to the base film Wb, the laminated film Ws to which the cover lay film Wc is temporarily bonded is crimped (finished). A vacuum press machine for performing (press bonding) is separately prepared, and the coverlay film Wc is completely bonded to the base film Wb using the vacuum press machine.
- the special process for the auxiliary temporary crimping process is performed.
- the auxiliary temporary compression bonding step can be performed without taking much time. Cover Leaf according to Embodiment 1 According to the film bonding apparatus 1, since the auxiliary temporary crimping device 500 configured as described above is provided, the time for the first temporary crimping can be reduced, and the productivity as a whole can be further improved. Can be improved.
- FIG. 9 is a simplified plan view showing a cover lay film bonding apparatus according to the second embodiment.
- the same members as those in FIG. 9 the same members as those in FIG.
- the cover lay film bonding apparatus 2 according to the second embodiment includes a roll base as a force base film having basically the same configuration as the cover lay film bonding apparatus 1 according to the first embodiment. The difference is that a strip-shaped base film Wb is used instead.
- the cover lay film bonding apparatus 2 includes a base film supply apparatus 1200 for supplying the strip-shaped base film Wb toward the temporary compression bonding area P2, and a base film supply apparatus 1200. Is formed by a temporary pressing device 400 and a temporary pressing device 400 for temporarily pressing the strip-shaped coverlay film Wc against the strip-shaped base film Wb supplied by A cover lay film laminating device including a laminated film collecting device 1300 for collecting the strip-shaped laminated film Ws, wherein the temporary bonding device 400 includes a temporary bonding region P2 and a cover lay film supply position P1. Cover lay film Wc can be supplied along the cover lay film supply path L2, and the position of the cover lay film Wc with respect to the base film Wb. And it has an adjustable temporary pressure bonding table 410 posture.
- the positioning error in the longitudinal direction of the base film is reduced by using the strip-shaped base film Wb. Since there is no risk of accumulation, the positioning accuracy in the longitudinal direction of the base film may not be reduced.
- the cover lay film bonding apparatus 2 according to the second embodiment is different from the cover lay according to the first embodiment in that a strip-shaped base film Wb is used instead of a roll as a base film.
- the force is different from that of the film laminating apparatus 1.
- the cover lay film laminating apparatus 1 according to the first embodiment has the same configuration as the cover lay film laminating apparatus 1 according to the first embodiment. It has the same effects as the device 1.
- a transport means for transporting the strip-shaped base film Wb and the strip-shaped laminated film Ws along the base film supply path L1 a known transport means such as a suction pad or a moving table may be used. Can be.
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Textile Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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CN200580001581XA CN1910100B (zh) | 2004-04-13 | 2005-01-25 | 覆盖层薄膜贴合装置及其截断载置装置 |
JP2006516870A JP4097679B2 (ja) | 2004-04-13 | 2005-01-25 | カバーレイフィルム貼り合わせ装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2004118434 | 2004-04-13 | ||
JP2004-118434 | 2004-04-13 |
Publications (1)
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WO2005100220A1 true WO2005100220A1 (ja) | 2005-10-27 |
Family
ID=35149894
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2005/000921 WO2005100220A1 (ja) | 2004-04-13 | 2005-01-25 | カバーレイフィルム貼り合わせ装置 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP4097679B2 (ja) |
KR (1) | KR100853342B1 (ja) |
CN (1) | CN1910100B (ja) |
TW (1) | TWI308901B (ja) |
WO (1) | WO2005100220A1 (ja) |
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WO2007138687A1 (ja) * | 2006-05-30 | 2007-12-06 | Beac Co., Ltd. | カバーレイフィルム貼り合わせ装置 |
WO2010082441A1 (ja) * | 2009-01-19 | 2010-07-22 | ヤマハファインテック株式会社 | フィルム貼り合わせ装置、小片部材の移載定置装置及びそのヘッド装置 |
JP2010166001A (ja) * | 2009-01-19 | 2010-07-29 | Yamaha Fine Technologies Co Ltd | 小片部材の移載定置装置 |
JP2010168214A (ja) * | 2009-01-26 | 2010-08-05 | Yamaha Fine Technologies Co Ltd | フィルム貼着装置 |
CN111372391A (zh) * | 2020-04-13 | 2020-07-03 | 苏州福莱科斯电子科技有限公司 | 一种具有半切结构的覆盖膜贴合机 |
KR20200099987A (ko) | 2019-02-15 | 2020-08-25 | 베아크 가부시끼가이샤 | 필름 첩부 장치 및 필름 첩부 방법 |
CN114258207A (zh) * | 2021-11-19 | 2022-03-29 | 深圳市景旺电子股份有限公司 | 覆盖膜制作方法、覆盖膜及其贴合方法 |
CN115003051A (zh) * | 2022-07-22 | 2022-09-02 | 苏州欧瑞杰智能科技有限公司 | 一种贴膜设备 |
JP2022539064A (ja) * | 2019-06-25 | 2022-09-07 | ドゥーサン コーポレイション | 複合基板の製造システム及び製造方法 |
CN116344956A (zh) * | 2023-05-11 | 2023-06-27 | 宿迁锂通电子科技有限公司 | 一种锂离子电池极耳生产覆膜设备 |
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KR100733156B1 (ko) * | 2006-04-25 | 2007-06-29 | 김창수 | Fpcb용 커버레이 가접 장치 |
KR100743689B1 (ko) * | 2006-06-27 | 2007-07-30 | 세호로보트산업 주식회사 | 커버레이 부착 시스템 및 그 방법 |
KR100969505B1 (ko) * | 2007-11-30 | 2010-07-09 | 바이옵트로 주식회사 | 커버레이 분리수단 및 이를 구비한 커버레이 가접장치 |
KR100984795B1 (ko) * | 2008-06-24 | 2010-10-04 | 주식회사 케이에스비 | 코팅지 부분 접합장치 |
KR101412054B1 (ko) | 2012-05-18 | 2014-06-26 | 주식회사 비에이치 | 커버레이 필름 밀착 장치 및 이를 이용한 다층 연성회로기판의 제조방법. |
WO2014021192A1 (ja) * | 2012-07-30 | 2014-02-06 | 芝浦メカトロニクス株式会社 | 基板貼合装置及び基板貼合方法 |
KR101562058B1 (ko) * | 2013-08-28 | 2015-10-20 | 삼성전기주식회사 | 커버레이 가접장치 |
KR101414020B1 (ko) * | 2013-12-16 | 2014-07-02 | 김원일 | 점착필름의 관통공 천공방법 및 이를 이용한 점착필름의 관통공 천공시스템 |
CN105084082B (zh) * | 2014-05-08 | 2016-09-28 | 营口金辰自动化有限公司 | 垫条垫块自动化粘贴生产线 |
JP7187034B2 (ja) * | 2019-07-01 | 2022-12-12 | 株式会社 ベアック | 貼り付け装置及び貼り付け方法 |
KR102221149B1 (ko) * | 2019-10-29 | 2021-02-26 | (주)우리엔지니어링 | 다층기판의 접합 장치 |
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Cited By (19)
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WO2007138687A1 (ja) * | 2006-05-30 | 2007-12-06 | Beac Co., Ltd. | カバーレイフィルム貼り合わせ装置 |
JPWO2007138687A1 (ja) * | 2006-05-30 | 2009-10-01 | 株式会社 ベアック | カバーレイフィルム貼り合わせ装置 |
JP4892551B2 (ja) * | 2006-05-30 | 2012-03-07 | 株式会社 ベアック | カバーレイフィルム貼り合わせ装置 |
WO2010082441A1 (ja) * | 2009-01-19 | 2010-07-22 | ヤマハファインテック株式会社 | フィルム貼り合わせ装置、小片部材の移載定置装置及びそのヘッド装置 |
JP2010166001A (ja) * | 2009-01-19 | 2010-07-29 | Yamaha Fine Technologies Co Ltd | 小片部材の移載定置装置 |
CN101953238B (zh) * | 2009-01-19 | 2012-11-21 | 雅马哈精密科技株式会社 | 薄膜贴合装置、小片部件的转移设置装置及其头部装置 |
JP2010168214A (ja) * | 2009-01-26 | 2010-08-05 | Yamaha Fine Technologies Co Ltd | フィルム貼着装置 |
KR20200099987A (ko) | 2019-02-15 | 2020-08-25 | 베아크 가부시끼가이샤 | 필름 첩부 장치 및 필름 첩부 방법 |
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US20220353999A1 (en) * | 2019-06-25 | 2022-11-03 | Doosan Corporation | System and method for manufacturing composite board |
JP7281567B2 (ja) | 2019-06-25 | 2023-05-25 | ドゥーサン コーポレイション | 複合基板の製造システム及び製造方法 |
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CN116344956B (zh) * | 2023-05-11 | 2023-08-04 | 宿迁锂通电子科技有限公司 | 一种锂离子电池极耳生产覆膜设备 |
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TWI308901B (en) | 2009-04-21 |
TW200533583A (en) | 2005-10-16 |
KR100853342B1 (ko) | 2008-08-21 |
KR20060032213A (ko) | 2006-04-14 |
CN1910100B (zh) | 2010-04-14 |
JP4097679B2 (ja) | 2008-06-11 |
JPWO2005100220A1 (ja) | 2007-08-16 |
CN1910100A (zh) | 2007-02-07 |
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