WO2004100473A2 - Isolateurs de signal utilisant des micro-transformateurs - Google Patents

Isolateurs de signal utilisant des micro-transformateurs Download PDF

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Publication number
WO2004100473A2
WO2004100473A2 PCT/US2004/013806 US2004013806W WO2004100473A2 WO 2004100473 A2 WO2004100473 A2 WO 2004100473A2 US 2004013806 W US2004013806 W US 2004013806W WO 2004100473 A2 WO2004100473 A2 WO 2004100473A2
Authority
WO
WIPO (PCT)
Prior art keywords
winding
signal
signals
isolator
transformer
Prior art date
Application number
PCT/US2004/013806
Other languages
English (en)
Other versions
WO2004100473A3 (fr
WO2004100473A9 (fr
Inventor
Baoxing Chen
Geoffrey Haigh
Original Assignee
Analog Devices, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=33434960&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO2004100473(A2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Analog Devices, Inc. filed Critical Analog Devices, Inc.
Priority to EP04751265A priority Critical patent/EP1618712A2/fr
Publication of WO2004100473A2 publication Critical patent/WO2004100473A2/fr
Publication of WO2004100473A9 publication Critical patent/WO2004100473A9/fr
Publication of WO2004100473A3 publication Critical patent/WO2004100473A3/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F19/00—Fixed transformers or mutual inductances of the signal type
    • H01F19/04—Transformers or mutual inductances suitable for handling frequencies considerably beyond the audio range
    • H01F19/08—Transformers having magnetic bias, e.g. for handling pulses
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K5/00—Manipulating of pulses not covered by one of the other main groups of this subclass
    • H03K5/125—Discriminating pulses
    • H03K5/1252—Suppression or limitation of noise or interference
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L25/00—Baseband systems
    • H04L25/02—Details ; arrangements for supplying electrical power along data transmission lines
    • H04L25/0264—Arrangements for coupling to transmission lines
    • H04L25/0266—Arrangements for providing Galvanic isolation, e.g. by means of magnetic or capacitive coupling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F2017/0093—Common mode choke coil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F19/00—Fixed transformers or mutual inductances of the signal type
    • H01F19/04—Transformers or mutual inductances suitable for handling frequencies considerably beyond the audio range
    • H01F19/08—Transformers having magnetic bias, e.g. for handling pulses
    • H01F2019/085—Transformer for galvanic isolation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F38/00—Adaptations of transformers or inductances for specific applications or functions
    • H01F38/14—Inductive couplings
    • H01F2038/143—Inductive couplings for signals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/645—Inductive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Multimedia (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dc Digital Transmission (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Near-Field Transmission Systems (AREA)

Abstract

L'invention concerne un isolateur de signal logique comprenant un transformateur muni d'un enroulement principal et d'un enroulement secondaire; un circuit émetteur qui excite ledit enroulement principal en réponse à un signal logique reçu, si bien que, en réponse à un premier type d'arête dans le signal logique, un signal d'un premier type préétabli est transmis à l'enroulement principal; et en réponse à un second type d'arête dans le signal logique, un signal d'un second type préétabli est transmis à l'enroulement principal. L'enroulement principal et l'émetteur sont référencés par rapport à une première masse; et l'enroulement secondaire est référencé par rapport à une seconde masse isolée par glavanisation de la première masse. L'enroulement secondaire transmet à un circuit récepteur des signaux reçus correspondants aux signaux transmis à l'enroulement principal. Le récepteur reconstitue le signal logique reçu à partir des signaux reçus.
PCT/US2004/013806 2003-04-30 2004-04-29 Isolateurs de signal utilisant des micro-transformateurs WO2004100473A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP04751265A EP1618712A2 (fr) 2003-04-30 2004-04-29 Isolateurs de signal utilisant des micro-transformateurs

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US46660203P 2003-04-30 2003-04-30
US60/466,602 2003-04-30

Publications (3)

Publication Number Publication Date
WO2004100473A2 true WO2004100473A2 (fr) 2004-11-18
WO2004100473A9 WO2004100473A9 (fr) 2005-01-06
WO2004100473A3 WO2004100473A3 (fr) 2005-09-15

Family

ID=33434960

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/013806 WO2004100473A2 (fr) 2003-04-30 2004-04-29 Isolateurs de signal utilisant des micro-transformateurs

Country Status (3)

Country Link
US (5) US7075329B2 (fr)
EP (2) EP1618712A2 (fr)
WO (1) WO2004100473A2 (fr)

Cited By (12)

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US7622887B2 (en) 2006-03-16 2009-11-24 Fuji Electric Device Technology Co., Ltd. Power electronics equipments
JP2010056593A (ja) * 2008-08-26 2010-03-11 Keio Gijuku 電子回路
US8288894B2 (en) 2006-03-16 2012-10-16 Fuji Electric Co., Ltd. Power electronics equipment for transmitting signals to switching devices through air-cored insulating transformer
WO2013100005A1 (fr) * 2011-12-28 2013-07-04 株式会社日立製作所 Système de communication, dispositif d'attaque à semi-conducteur et dispositif de conversion de puissance
US20160080182A1 (en) * 2014-09-15 2016-03-17 Analog Devices, Inc. Demodulation of on-off-key modulated signals in signal isolator systems
EP3116179A1 (fr) * 2015-07-08 2017-01-11 Power Integrations Switzerland GmbH Communication à travers une isolation galvanique, par exemple dans un convertisseur de puissance
EP3072026A4 (fr) * 2013-11-22 2017-07-19 NXP USA, Inc. Procédé et appareil de commande d'un dispositif igbt
WO2018069771A1 (fr) 2016-10-13 2018-04-19 Analog Devices Global Systèmes et procédés de transfert d'énergie à travers une barrière d'isolement
US9998301B2 (en) 2014-11-03 2018-06-12 Analog Devices, Inc. Signal isolator system with protection for common mode transients
RU188979U1 (ru) * 2018-08-23 2019-04-30 Дмитрий Валерьевич Хачатуров Приемопередающее устройство с гальванической развязкой
US10536309B2 (en) 2014-09-15 2020-01-14 Analog Devices, Inc. Demodulation of on-off-key modulated signals in signal isolator systems
US11018660B2 (en) 2018-09-07 2021-05-25 Analog Devices Global Unlimited Company Multi-mode feedback control through digital isolator

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EP3116179A1 (fr) * 2015-07-08 2017-01-11 Power Integrations Switzerland GmbH Communication à travers une isolation galvanique, par exemple dans un convertisseur de puissance
CN106341034B (zh) * 2015-07-08 2020-08-21 电力集成瑞士有限公司 用于跨过电流隔离进行通信的信号传输系统
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US7075329B2 (en) 2006-07-11
US20050057277A1 (en) 2005-03-17
US20080169834A1 (en) 2008-07-17
US7683654B2 (en) 2010-03-23
US20100134139A1 (en) 2010-06-03
US7920010B2 (en) 2011-04-05
WO2004100473A3 (fr) 2005-09-15
US20110175642A1 (en) 2011-07-21
US7692444B2 (en) 2010-04-06
WO2004100473A9 (fr) 2005-01-06
US8736343B2 (en) 2014-05-27
EP2302850A1 (fr) 2011-03-30
EP1618712A2 (fr) 2006-01-25
US20060250155A1 (en) 2006-11-09

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