WO2004100187A1 - 電子部品及びその製造方法 - Google Patents
電子部品及びその製造方法 Download PDFInfo
- Publication number
- WO2004100187A1 WO2004100187A1 PCT/JP2004/006276 JP2004006276W WO2004100187A1 WO 2004100187 A1 WO2004100187 A1 WO 2004100187A1 JP 2004006276 W JP2004006276 W JP 2004006276W WO 2004100187 A1 WO2004100187 A1 WO 2004100187A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- base
- electronic component
- conductive film
- absorbing layer
- shock absorbing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
- H01C17/281—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thick film techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
- H01C1/032—Housing; Enclosing; Embedding; Filling the housing or enclosure plural layers surrounding the resistive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49107—Fuse making
Definitions
- the present invention relates to an electronic component used for various electronic devices and a method for manufacturing the same.
- FIG. (A) of FIG. 4 is a perspective view of a circuit protection element as an example of a conventional electronic component
- (b) of FIG. 4 is a cross-sectional view taken along line AA in (a) of FIG.
- the circuit protection element includes a base 1, a conductive film 2, a protective film 5, and a plating layer 7.
- the base 1 has a columnar shape such as a cylinder or a prism, and is made of any one of ceramic, glass, and a mixture of ceramic and glass having an insulating property.
- the conductive film 2 is made of copper, silver, nickel, or the like, and is formed on the entire surface of the base 1.
- Electrodes 6 are formed from portions of conductive film 2 located at both ends of base 1, and plating layer 7 is formed on the surface of electrodes 6.
- the protective film 5 is made of an epoxy resin or the like, and is formed so as to cover portions of the surface of the conductive film 2 other than the portions located at both ends of the base 1.
- the resistance value adjusting groove 3 of approximately one turn whose leading ends overlap each other is formed on the conductive film 2.
- the region between the overlapping portions at the tip of the resistance value adjusting groove 3 becomes the narrow portion 4.
- an electronic component having such a groove for example, there is a chip component disclosed in Japanese Patent Application Laid-Open No. 7-307201.
- the conductive film 2 is a portion that exhibits an electrical function of the circuit protection element.
- the electronic component when it is a resistor, it becomes a resistor, and when the circuit protection element shown in FIG. Fusing portion.
- constant when the above-described overcurrent is applied, the narrow portion 4 provided in the conductive film 2 generates heat and melts, thereby cutting off the current applied to the circuit protection element.
- a conductive film 2 is formed on the entire surface of the base 1 by a plating process.
- the conductive films 2 located at both ends of the base 1 constitute the electrodes 6.
- a resistance adjusting groove 3 of approximately one turn whose leading ends overlap each other is formed.
- a narrow portion 4 is formed in a region between the overlapping portions at the tip of the resistance value adjusting groove 3.
- a protective film 5 made of epoxy resin or the like is formed so as to cover the surface of the conductive film 2 other than the portions located at both ends of the base 1. Finally, a plating layer ⁇ is formed on the surface of the electrode 6.
- the resistance is measured or the resistance adjusting groove 3 is formed during the manufacturing process. In order to perform these measurements, it is necessary to hold the circuit protection element, and the circuit protection element is held by pressing the check against the electrode 6 to make contact therewith.
- the contact resistance between the chuck and the electrode 6 becomes large, the contact resistance at this portion has an adverse effect on the resistance value measurement, and the resistance value adjustment cannot be performed accurately. For this reason, the contact resistance between the chuck and the electrode 6 must be as small as possible, and in order to reduce the contact resistance between the chuck and the electrode 6, it is necessary to press the chuck against the electrode 6 with a strong force. is there.
- the conductive film 2 is formed on the entire surface of the base 1 so that the conductive film 2 and the electrodes 6 located at both ends of the base 1 are integrally formed.
- the conductive film 2 and the electrode 6 are formed so as to be continuous, and electrical and mechanical connection stability can be achieved.
- the film thickness of the conductive film 2 becomes thin depending on the resistance value of the circuit protection element, and the conductive film 2 becomes thin.
- the thickness of pole 6 is also reduced.
- the base 1 is made of ceramic, glass, or a mixture of ceramic and glass. As a result, the mechanical shock during pressing cannot be fully absorbed, and the corners at both ends of the base 1 are chipped. Mounting circuit protection elements with missing corners on a printed circuit board or the like does not provide a stable electrical connection, so it is necessary to eliminate the circuit protection elements with missing corners. However, the production yield is reduced. Disclosure of the invention
- An object of the present invention is that even if a chuck is pressed with strong force against electrodes located at both ends of a base to hold electronic components, corners at both ends of the base will be chipped. It is an object of the present invention to provide an electronic component capable of preventing the occurrence of the problem and improving the yield, and a method of manufacturing the same.
- An electronic component includes: a base having insulation; a shock absorbing layer formed to cover at least a corner of both ends of the base; and at least a part of a surface of the base and A conductive film formed so as to cover the surface of the shock absorbing layer.
- the mechanical shock can be absorbed by the shock absorbing layer, so that the electronic component is held. Therefore, even if the chuck is pressed against the electrodes located at both ends of the base with a strong force, the corners at both ends of the base are prevented from being chipped, and the yield can be improved.
- a method of manufacturing an electronic component according to another aspect of the present invention includes: a first step of forming a shock absorbing layer so as to cover at least corners of both ends of an insulating base; and at least one surface of the base. And a second step of forming a conductive film so as to cover the portion and the surface of the shock absorbing layer.
- the insulating base may be provided at both ends.
- the conductive film is formed so as to cover at least a part of the surface of the base and the surface of the shock absorbing layer.
- An impact absorbing layer can be formed between the film and the film.
- the shock absorbing layer is formed before the conductive film is formed, the conductive film serving as a body of the electronic component is damaged during the formation of the shock absorbing layer, thereby deteriorating the characteristics of the electric component. Can be prevented beforehand.
- FIG. 1A is a perspective view of a circuit protection element according to one embodiment of the present invention
- FIG. 1B is a cross-sectional view taken along line AA in FIG. 1A.
- FIG. 2 are manufacturing process diagrams for describing a method of manufacturing the circuit protection element shown in FIG.
- FIG. 3 are manufacturing process diagrams for describing a method of manufacturing the circuit protection element shown in FIG.
- FIG. 4 is a perspective view of a circuit protection element as an example of a conventional electronic component
- (b) of FIG. 4 is a cross-sectional view taken along line AA in (a) of FIG. BEST MODE FOR CARRYING OUT THE INVENTION
- FIG. 1A is a perspective view of a circuit protection element according to one embodiment of the present invention
- FIG. 1B is a cross-sectional view taken along line AA in FIG. 1A.
- a circuit protection element will be described as an example of an electronic component.
- the electronic component to which the present invention is applied is not particularly limited to this example.
- the present invention can be similarly applied to various chip components and the like.
- the circuit protection device shown in FIGS. 1A and 1B includes a base 11, a shock absorbing layer 12, a conductive film 13, a protective film 17, and a plating layer 18.
- the base 11 is made of a mixture of an insulating ceramic and glass, and has a prismatic shape and an iron array shape in which the thickness of the cross section at both ends is larger than the thickness of the cross section at the center.
- the shock-absorbing layer 12 is made of ductile metal material, copper, and copper is electrolessly applied to the entire surface of both ends of the base 11, that is, both end surfaces of the base 11 and the side surfaces extending from both end surfaces. It is formed by sticking.
- ductility means the property that an object is stretched without being destroyed.
- the conductive film 13 is formed of a metal film formed by a sputtering method using titanium and copper, and is further formed of a multilayer film on which nickel, copper, and gold are sequentially deposited. 2 is formed to cover the entire surface. The part of the conductive film 13 that covers the surface of the shock absorbing layer 12 is used as the electrode 14.
- An approximately one-turn resistance value adjusting groove 15 is formed, which overlaps at a predetermined interval.
- a narrow portion 16 is formed in a region between the overlapping portions of the tip portions of the resistance value adjusting grooves 15, and the narrow portion 16 forms a fusing portion that functions as a fuse. Therefore, when an overcurrent exceeding a certain level is applied to the circuit protection element, the narrow portion 16 provided in the conductive film 13 generates heat and melts, thereby interrupting the current applied to the circuit protection element. .
- the protective film 17 is made of epoxy resin or the like, and is formed so as to cover the entire surface of the central portion of the conductive film 13 to protect portions other than the conductive film 13 located on both ends of the base 11. I do.
- the plating layer 18 includes a nickel plating layer and a tin plating layer, and is formed so as to cover a portion of the conductive film 13 that covers the surface of the shock absorbing layer 12, that is, a surface of the electrode 14. Note that in Figure 1 In (a), the protective film 17 is not shown to clearly show the resistance value adjusting groove 15 and the narrow portion 16.
- the shock absorbing layer 12 is provided so as to cover at least a part of the corners at both ends of the base 11 made of a brittle material which is a mixture of insulating ceramic and glass.
- the conductive film 13 is formed so as to cover the surfaces of the shock absorbing layer 12 and the base 11, and the portion of the conductive film 13 that covers the surface of the shock absorbing layer 12 is used as the electrode 14. .
- the impact absorbing layer 12 provided between both ends of the base 11 and the electrodes 14 can absorb the mechanical shock during pressing, so that the corners at both ends of the base 11 can be absorbed. Partial loss can be prevented, and the yield can be improved.
- the shock absorbing layer 12 is made of copper, which is a ductile metal material, the above-described mechanical shock can be reliably absorbed, and the conductive film is formed so as to cover at least the resistance adjusting groove 15. Since the protective film 17 is provided on the surface of 13, the resistance value adjusting groove 15 can also be reliably protected. Furthermore, since the plating layer 18 composed of the nickel plating layer and the tin plating layer is formed on the surface of the conductive film 13 located at both ends of the base 11, the circuit protection element can be surface-mounted. In addition, a circuit or the like on which the circuit protection element is mounted can be reduced in size and thickness.
- the three-dimensional shape of the base 11 is not particularly limited to the above example, and other shapes than the prismatic shape, for example, a cylindrical shape, a sheet-like shape, or the like, may be used.
- the one having the same cross-sectional thickness from one end to the other end may be used without changing the thickness of the cross-section and the thickness of the cross-section at the center.
- the cross-sectional shape of the base 11 is not particularly limited to the above example, and various shapes such as a regular polygon, a circle, a rectangle, and an ellipse can be used.
- the material of the base 11 is not particularly limited to the above example, and a single material such as insulating ceramic or glass may be used. Thus, the present invention can be suitably used.
- the method of forming the shock absorbing layer 12 is not particularly limited to the above example, and various other forming methods such as a plating method, a sputtering method, and a printing method can be used. Also, the material of the shock absorbing layer 12 is not particularly limited to the above example, and a metal material having ductility such as gold, silver, platinum, nickel, chromium, palladium, or an alloy thereof can be used.
- the portion where the shock absorbing layer 12 is formed on the base 11 is not particularly limited to the above-described example, and at least corner portions of both ends of the base 11 that are easily chipped by mechanical shock, that is, It may be provided so as to cover a portion where the end surface of the base 11 and the side surface extending from the end surface intersect (the edge portion at both ends).
- the portion on which the conductive film 13 is formed is not particularly limited to the above-described example, and covers portions other than the electrodes 14 located at both ends of the base 11, that is, the entire surface of the central portion of the base 11. It is not necessary, and it is formed so as to cover only a part of the surface of the central part of the base 11, that is, the part where the current concentrating part serving as the fusing part for realizing the fuse function is formed, and both ends of the base 11 It may be integrally formed so as to be continuous with the electrode 14 located on the side.
- the material and the formation method of the conductive film 13 are not particularly limited to the above examples, and only a metal film formed by sputtering a titanium and copper film may be used, or nickel, copper, Use a multilayer film formed by plating one or two selected from gold, silver, etc., or use a plating method with one or more selected from Nigel, copper, gold, silver, etc. , Or various conductive films can be used. These conductive films are used for the purpose of use of the electric component, for example, determination of a resistance value range, prevention of surface oxidation of the conductive film 13, promotion of fusing of the narrow portion 16 made of the conductive film 13, and width. It is arbitrarily selected according to various purposes such as heat storage of the heat generated in the narrow portion 16.
- the shape of the resistance value adjusting groove 15 is not particularly limited to the above example, and various shapes can be used.
- the conductive film 13 is formed with a groove of approximately one turn so that the tips of the resistance value adjusting grooves face each other at intervals and do not overlap with each other. Tip of value adjustment groove A region between them may be used.
- a resistance value adjusting groove in the conductive film 13 so as to be wound around the base 11 a plurality of turns, it can be used as an electronic component such as an inductor or a resistor.
- the method of forming the resistance value adjusting groove 15 is not particularly limited to the above example, and the cut portion is formed by providing a cutout in the conductive film 13 by a mechanical cutting method using a trimming blade or the like. A narrow portion may be formed.
- the material of the protective film 17 is not particularly limited to the above examples, and other resins such as a phenol resin, a polyimide resin, and a silicone resin may be used. You may. Further, the position where the protective film 17 is formed is not particularly limited to the above example. It is not always necessary to cover the entire surface of the central portion of the conductive film 13, and at least the portion where the resistance value adjusting groove 15 is formed. May be provided so as to cover.
- FIGS. 2 (a), (c) and (e) are manufacturing process diagrams for explaining a method of manufacturing the circuit protection element shown in FIG. FIGS. 2 (a), (c) and (e), and FIGS. 3 (a), (c) and (e) are perspective views showing the steps of manufacturing the circuit protection device shown in FIG. , Fig. 2 (b), (d), (f) and Fig. 3 (b), (d), (f) are (a), (c), (e) and Fig. 3 ( FIG. 3 is a cross-sectional view taken along line A-A in a), (c), and (e).
- a resist film 19 is formed on the entire surface of the base 11 made of a mixture of insulating ceramic and glass except for both ends.
- a shock absorbing layer 12 made of copper is formed by electroless plating so as to cover all surfaces of both ends of the base 11 except for the resist film 19.
- the shock absorbing layer 12 or the conductive film 13 is formed by electroless plating, the entire surface of the base 11 is etched in advance, and an activation treatment having a catalytic action of electroless plating is performed.
- an activation treatment having a catalytic action of electroless plating is performed.
- the resist film 19 is peeled from the base 11.
- the resist film 19 and the part The impact-absorbing layer 12 that adheres separately is peeled off at the same time.
- the impact absorbing layer 12 remains only at both ends of the base 11, and the surface of the base 11 is exposed in other portions.
- a conductive film 13 is formed so as to cover the entire surface of the exposed portion 11 and the entire surface of the shock absorbing layer 12.
- the conductive film 13 is formed by forming a metal film by a sputtering method using titanium and copper, and further depositing nickel, copper and gold thereon.
- the portion of the conductive film 13 covering the surface of the shock absorbing layer 12 is defined as the electrode 14, so that the conductive film 13 and the electrodes 14 located at both ends of the base 11 are separated from each other.
- the electrode 14 are formed integrally so that the conductive film 13 and the electrode 14 are continuous. In this case, the conductive film 13 and the electrode 14 are formed continuously, and the stability of the electrical and mechanical connection between the conductive film 13 and the electrode 14 can be improved.
- an epoxy resin or the like is used to cover portions of the surface of the conductive film 13 other than those located at both ends of the base 11.
- a protective film 17 is formed.
- a plating layer 18 composed of a nickel plating layer and a tin plating layer is formed on the surface of the electrode 14.
- the shock absorbing layer 12 can be formed between both ends of the base 11 and the electrode 14 '.
- the shock absorbing layer 12 can be formed between both ends of the base 11 and the electrode 14 '.
- the shock absorbing layer 12 is formed before the conductive film 13 is formed, the electric function of the element body of the electronic component, that is, the circuit protection element, is formed when the shock absorbing layer 12 is formed. It can be prevented beforehand that the conductive film 13 serving as an active portion is damaged and the characteristics of the circuit protection element are deteriorated.
- shock absorption is performed so as to cover the entire surfaces of both ends of the base 11. Since the resist film 19 is peeled off from the base 11 after forming the layer 12, the center of the base 11, that is, the part where the shock absorbing layer 12 does not need to be provided.
- the impact absorbing layer 12 can be prevented from protruding, and the impact absorbing layer 12 can be formed only on necessary portions with high accuracy.
- the shock absorbing layer 12 is formed only on both ends of the base 11 by the electroless plating method, but the shock absorbing layer 12 is formed by the resist film by the sputtering method. It may be formed so as to cover the entire surface of 19 and the entire surfaces of both ends of the base 11. In this case, since the shock absorbing layer 12 formed on the resist film 19 is simultaneously removed by peeling off the resist film 19, the case where the shock absorbing layer 12 is selectively formed by electroless plating Similarly, the shock absorbing layers 12 can be formed only at both ends of the base 11. Industrial applicability
- both ends of the base made of any of ceramic, glass, and a mixture of ceramic and glass having insulating properties are reduced.
- a shock absorbing layer is provided so as to cover the corners, a conductive film is formed so as to cover the surface of the bracket and the surface of the base, and a portion of the conductive film covering the surface of the shock absorbing layer.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Fuses (AREA)
- Details Of Resistors (AREA)
- Non-Adjustable Resistors (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005506013A JP4435734B2 (ja) | 2003-05-08 | 2004-04-30 | 電子部品及びその製造方法 |
EP04730643A EP1622174A4 (en) | 2003-05-08 | 2004-04-30 | ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME |
US10/554,699 US7884698B2 (en) | 2003-05-08 | 2004-04-30 | Electronic component, and method for manufacturing the same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003-130091 | 2003-05-08 | ||
JP2003130091 | 2003-05-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2004100187A1 true WO2004100187A1 (ja) | 2004-11-18 |
Family
ID=33432096
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2004/006276 WO2004100187A1 (ja) | 2003-05-08 | 2004-04-30 | 電子部品及びその製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7884698B2 (ja) |
EP (1) | EP1622174A4 (ja) |
JP (1) | JP4435734B2 (ja) |
CN (1) | CN100562949C (ja) |
WO (1) | WO2004100187A1 (ja) |
Cited By (1)
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JP2008060287A (ja) * | 2006-08-31 | 2008-03-13 | Tdk Corp | 端子電極および電子部品 |
Families Citing this family (7)
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JP5287154B2 (ja) * | 2007-11-08 | 2013-09-11 | パナソニック株式会社 | 回路保護素子およびその製造方法 |
US9190235B2 (en) * | 2007-12-29 | 2015-11-17 | Cooper Technologies Company | Manufacturability of SMD and through-hole fuses using laser process |
JP5163565B2 (ja) * | 2009-03-19 | 2013-03-13 | 株式会社村田製作所 | 回転センサ |
US8442490B2 (en) * | 2009-11-04 | 2013-05-14 | Jeffrey T. Haley | Modify function of driver's phone during acceleration or braking |
CN103430252B (zh) * | 2011-04-06 | 2017-03-29 | 株式会社村田制作所 | 层叠型电感元件及其制造方法 |
JP6477375B2 (ja) * | 2015-09-14 | 2019-03-06 | 株式会社村田製作所 | コイル部品 |
CN113720563A (zh) * | 2020-05-25 | 2021-11-30 | 泰克元有限公司 | 测试处理器及其控制方法 |
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US6940181B2 (en) * | 2003-10-21 | 2005-09-06 | Micron Technology, Inc. | Thinned, strengthened semiconductor substrates and packages including same |
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2004
- 2004-04-30 EP EP04730643A patent/EP1622174A4/en not_active Withdrawn
- 2004-04-30 JP JP2005506013A patent/JP4435734B2/ja not_active Expired - Fee Related
- 2004-04-30 US US10/554,699 patent/US7884698B2/en not_active Expired - Fee Related
- 2004-04-30 WO PCT/JP2004/006276 patent/WO2004100187A1/ja active Application Filing
- 2004-04-30 CN CNB2004800119994A patent/CN100562949C/zh not_active Expired - Fee Related
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JPH10335103A (ja) | 1997-06-02 | 1998-12-18 | Taiyo Yuden Co Ltd | チップ部品 |
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JP2008060287A (ja) * | 2006-08-31 | 2008-03-13 | Tdk Corp | 端子電極および電子部品 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2004100187A1 (ja) | 2006-07-13 |
EP1622174A4 (en) | 2009-11-11 |
CN100562949C (zh) | 2009-11-25 |
JP4435734B2 (ja) | 2010-03-24 |
EP1622174A1 (en) | 2006-02-01 |
CN1784754A (zh) | 2006-06-07 |
US7884698B2 (en) | 2011-02-08 |
US20060255897A1 (en) | 2006-11-16 |
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