WO2004051290A1 - Dispositif d'inspection de motifs de circuits et procede d'inspection de motifs de circuits - Google Patents

Dispositif d'inspection de motifs de circuits et procede d'inspection de motifs de circuits Download PDF

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Publication number
WO2004051290A1
WO2004051290A1 PCT/JP2003/015290 JP0315290W WO2004051290A1 WO 2004051290 A1 WO2004051290 A1 WO 2004051290A1 JP 0315290 W JP0315290 W JP 0315290W WO 2004051290 A1 WO2004051290 A1 WO 2004051290A1
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WO
WIPO (PCT)
Prior art keywords
pattern
inspection
detection
electrode
inspected
Prior art date
Application number
PCT/JP2003/015290
Other languages
English (en)
Japanese (ja)
Inventor
Shuji Yamaoka
Hiroshi Hamori
Shogo Ishioka
Original Assignee
Oht Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oht Inc. filed Critical Oht Inc.
Priority to CN200380104631.8A priority Critical patent/CN1720458B/zh
Priority to US10/536,997 priority patent/US20060043153A1/en
Priority to AU2003302525A priority patent/AU2003302525A1/en
Publication of WO2004051290A1 publication Critical patent/WO2004051290A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors

Definitions

  • the present invention relates to a circuit pattern inspection device and a circuit pattern inspection method capable of inspecting the quality of a conductive pattern formed on a substrate.
  • a pin is contacted at both ends of a conductive pattern, an electric signal is supplied from the pin on one end to the conductive pattern, and the A contact-type inspection method (pin contact method) that performs a continuity test of a conductive pattern or the like by receiving an electric signal is known. Electrical signals are supplied by setting up metal probes on all terminals and passing current through the conductive patterns.
  • This pin contact method is used to directly contact the pin probe.
  • the probe force is fragile due to its fine structure, and it was necessary to always consider the risk of breakage in actual use.
  • Patent Document 2 a pin probe is brought into direct contact with one end of a conductor pattern to be inspected to apply an inspection signal containing an AC component, and a probe at the other end has a predetermined contact without contacting the conductor pattern.
  • a contact-non-contact system in which the inspection signal is detected through capacitive coupling by positioning the electrodes in a state where they are separated from each other.
  • the probe at the other end of the pattern line does not need to be in direct contact with the pattern like a pin probe, so that the positioning accuracy can be reduced. Furthermore, since the non-contact portion can be shared for a plurality of pattern lines, the number of probes can be reduced. Therefore, it is possible to cope with a case where the distance between the conductive patterns is fine.
  • the detection signal processing from the probes arranged at both ends of the conductive pattern is performed in accordance with the arrangement interval of the conductive patterns.
  • the shape of the conductive pattern is a predetermined type, and if the conductive pattern is different, the jig also had to be manufactured according to the pattern.
  • one end of the conductor pattern to be inspected for directly contacting the pin probe is also made finer, and it is becoming difficult for the pin probe to make contact.
  • the present invention has been made to solve the above-mentioned problems of the prior art, and it is an object of the present invention to provide an inspection apparatus and an inspection method capable of forming a fine wiring pattern with a simple configuration and capable of responding to a change in the wiring pattern. is there.
  • an embodiment of the present invention has the following configuration.
  • a circuit pattern inspection apparatus that inspects the inspection target pattern, comprising: a supply unit having a supply electrode that supplies the inspection signal to the inspection target pattern from one of inspection target regions of the inspection target pattern; Detecting means having a detection electrode for detecting a signal from the pattern; and a supply electrode of the supply means and a detection electrode of the detection means separated from the pattern to be inspected and near both ends of the area to be inspected. Moving means for moving across the row pattern portion.
  • the pattern to be inspected is a conductive pattern formed in a substantially bar shape with a predetermined width on a substrate.
  • the width of the detection electrode is at least two columns of the pattern to be inspected.
  • the detection means includes: a first detection electrode disposed at the other end position of the inspection target pattern to which the detection signal is supplied by the supply electrode at one end position; Arranged at the other end of the test pattern adjacent to the test pattern to which the test signal is supplied by the supply electrode And a second detection electrode.
  • the width of the first detection electrode is not more than the pattern width of the pattern to be inspected.
  • the width of the second detection electrode is not more than the pattern width of the pattern to be inspected.
  • the moving unit traverses a row-like portion near both ends of the inspection target area in a state where a supply electrode surface of the supply unit and a detection electrode surface of the detection unit are capacitively coupled to the inspection target pattern. It is characterized by being moved. '
  • the apparatus further includes a determination unit that determines that the inspection target pattern is normal when the detection result of the detection unit is within a predetermined range, and that determines that the inspection target pattern is defective when the detection result is out of the predetermined range.
  • the supply electrode of the supply unit and the detection electrode of the detection unit are moved to both ends of the inspection target pattern that the determination unit has determined to be defective, and the supply electrode of the supply unit or the detection electrode of the detection unit is moved.
  • a second moving means for moving one of them along the pattern toward the other, and a position detecting means for detecting a detected change position based on a detection result of the detecting means are provided.
  • a contact unit is provided for bringing one of the supply electrode of the supply unit and the detection electrode of the detection unit into contact with the pattern to be inspected.
  • At least one of the supply electrode and the detection electrode moved by the second moving means is provided with an imaging means.
  • the distance between at least one of the supply electrode and the detection electrode moved by the second moving means and the pattern to be inspected becomes substantially constant. It is characterized by having a separation control means for performing positioning control as described above. And, for example, a separation distance control means for performing positioning control such that a separation distance between at least one of the supply electrode and the detection electrode moved by the movement means and the pattern to be inspected becomes substantially constant is provided. .
  • the separation processing control means includes a displacement meter that moves together with the detection electrode or the supply electrode at a position near the detection electrode or the supply electrode, and inspects the detection electrode or the supply electrode in accordance with a detection result of the displacement meter. Positioning control is performed in a direction orthogonal to the inspection object so that the distance from the object is substantially constant.
  • the separation processing control means sets an average displacement of the detection result of the displacement meter between a plurality of pitches of the pattern to be inspected as a separation distance between the detection electrode or the supply electrode and the inspection object, and is orthogonal to the inspection object. It is characterized by performing positioning control in the direction of movement.
  • a supply pot stage having a supply electrode for supplying an inspection signal to the inspection target pattern from one of the inspection target regions of the inspection target pattern in which the vicinity of both ends of the inspection target region is formed in a row
  • a pattern inspection method in a circuit pattern inspection apparatus comprising: a detection unit having a detection electrode for detecting a signal from a target pattern, wherein a supply electrode of the supply unit and a detection electrode of the detection unit are supplied by the supply unit. While maintaining the state in which the electrode surface and the detection electrode surface of the detection means are separated from the surface of the pattern to be inspected, the supply electrode, the detection electrode, and the pattern to be inspected are line-shaped patterns near both ends of the region to be inspected.
  • Circuit pattern inspection method characterized by detecting a signal from the turn inspecting said inspection target pattern.
  • the circuit pattern is a conductive pattern formed in a substantially bar shape with a predetermined width on a substrate.
  • the width of the detection electrode is at least two columns of the pattern to be inspected, and a signal from a conductive pattern adjacent to the conductive pattern supplying the inspection signal is detected to detect a gap between the adjacent conductive patterns. It is characterized in that a short circuit can be detected.
  • a signal from a conductive pattern supplying an inspection signal from the detection electrode can be detected by a first detection electrode of the detection means to enable a disconnection between the conductive patterns to be detected.
  • a signal from a conductive pattern adjacent to the supplied conductive pattern is detected by a second detection electrode of the detection means, and a short circuit between the adjacent conductive patterns can be inspected.
  • a schematic disconnection position of the conductive pattern is detected from a position of the detection unit which is not detected by the detection unit.
  • the pattern to be inspected is determined to be normal when the detection result by the detection means is within a predetermined range, and to be defective when the detection result is out of the predetermined range.
  • the position of the inspection target pattern determined by the determination unit to be defective is identified and held, and the supply electrode of the supply unit and the detection electrode of the detection unit are provided at both ends of the inspection target pattern determined to be defective. Moving one of the supply electrode and the detection electrode along the pattern toward the other, and setting a change position as a defective position of the pattern to be inspected based on a detection result of the detection means.
  • one of the supply electrode of the supply unit and the other of the detection electrodes of the detection unit is brought into contact with the pattern to be inspected. Further, for example, provided on one of the supply electrode and the detection electrode The imaging means is moved along the pattern toward the other side, and an image of the defective state at the defective position of the pattern to be inspected is taken.
  • a displacement meter that moves together with the detection electrode or the supply electrode is disposed at a position near the detection electrode or the supply electrode, and a separation distance between the detection electrode or the supply electrode and the test object according to a detection result of the displacement meter.
  • the positioning control is performed in a direction orthogonal to the inspection object so that the result becomes substantially constant, and the result of the detection electrode is made constant.
  • the positioning of the inspection object is controlled by setting an average displacement of the detection result of the displacement meter between a plurality of pitches of the inspection object pattern as a separation distance between the detection electrode or the supply electrode and the inspection object.
  • Circuit pattern inspection method according to claim 25 BRIEF DESCRIPTION OF THE FIGURES
  • FIG. 1 is a diagram for explaining a pattern inspection principle of an embodiment of the present invention.
  • FIG. 2 is a flowchart for explaining the inspection control of the inspection apparatus according to the present embodiment.
  • FIG. 3 is a diagram showing an example of detection signals when three adjacent inspection target patterns are short-circuited (short-circuited) in the inspection apparatus according to the present embodiment.
  • FIG. 4 is a diagram showing an example of a detection waveform in a case where one of the inspection target patterns in the inspection apparatus according to the present embodiment is disconnected (open) in the middle.
  • FIG. 5 is a diagram showing a configuration of an inspection apparatus according to a second embodiment of the present invention.
  • FIG. 6 is a diagram showing a configuration of an inspection apparatus according to a third embodiment of the present invention.
  • FIG. 7 is a diagram for explaining electrode movement control in the inspection apparatus according to the third embodiment.
  • FIG. 8 is a flowchart for explaining the pattern defect location specifying control according to the third embodiment.
  • FIG. 9 is a diagram showing an example of a defective pattern detection signal waveform at a sensor electrode in the device according to the third embodiment.
  • FIG. 10 is a diagram showing an example of a detection signal waveform of a sensor electrode in a defective pattern.
  • FIG. 11 is a diagram for explaining a configuration of an inspection apparatus according to a fourth embodiment of the present invention.
  • the present invention is not limited to the examples described below, and is not limited in any way as long as at least the vicinity of both ends of the inspection target area is formed in a row.
  • FIG. 1 is a view for explaining the principle of pattern inspection according to an embodiment of the present invention.
  • reference numeral 10 denotes a substrate on which a conductive pattern to be inspected according to the present embodiment is provided.
  • a glass substrate used for a liquid crystal display panel is used.
  • Conductive patterns 15 for forming a dot matrix display panel to be inspected by the circuit pattern inspection apparatus of the present embodiment are arranged in rows on the surface of the glass substrate 10 at regular intervals.
  • the width of each pattern 15 is substantially the same, and the intervals between the patterns are also substantially equal.
  • the inspection can be performed in the same manner even when the pattern intervals are not equal.
  • a control section that controls the entire inspection device 70 is a port controller that controls the scalar robot 80, 80 is a device that positions and holds the liquid crystal panel 10 at the inspection position and controls the robot controller 70 Is a scalar rod that scans so that the sensor electrode of the sensor unit 20 and the supply electrode of the inspection signal supply unit 30 sequentially traverse all the connection terminals of the conductive pattern to be inspected on the liquid crystal panel 10.
  • the scalar port 80 is configured to be three-dimensionally positionable in order to position the inspection target substrate (liquid crystal panel) 10 at a predetermined inspection position. Similarly, three-dimensional positioning control is possible so that the sensor unit 20 and the inspection signal supply unit 30 are moved on the inspection target pattern while maintaining a predetermined distance from the surface of the inspection target substrate 10. .
  • the present embodiment is not limited to the above example.
  • the sensor unit 20 and the inspection signal supply unit 30 are fixed, and the inspection target substrate 10 is the sensor unit 20 and the inspection signal supply unit 3.
  • Control may be performed so that the substrate is moved while maintaining a predetermined distance from the surface of the 0-end electrodes 25, 35. Even with this control, exactly the same effect can be obtained. You. .
  • the moving distance of the sensor electrode 25 and the moving distance of the supply electrode 35 are mutually set. It is necessary to synchronize and control at least a part of the sensor electrode 25 so that the supply electrode 35 is always at the other end position of the power supply line where the inspection signal is actually supplied. By controlling in this way, even if the pattern intervals are not equal or the pattern pitches at both ends are different, it is possible to respond simply by controlling the moving speed of both electrodes of the scalar robot. .
  • a sensor electrode 25 and a supply electrode 35 are provided on at least the distal end surfaces of the sensor unit 20 and the inspection signal supply unit 30 according to the present embodiment.
  • the sensor electrode 25 and the supply electrode 35 are formed of metal, for example, copper (Cu) or gold (Au).
  • Each electrode may be covered with an insulating material for protection. Further, for example, a semiconductor may be used as the electrode, but the reason why the electrode is formed of metal is that the capacitance between the electrode and the conductive pattern can be increased.
  • the inspection signal supply unit 30 is moved by the scalar port 80 so as to cross one terminal of the pattern to be inspected such as the liquid crystal panel 10 and the like. It is preferable that the width of the supply electrode 35 at the tip is, for example, equal to or less than the pattern pitch of the pattern to be inspected (the size of the pattern width and the pattern gap of the inspection pattern).
  • the width of the supply electrode 35 is larger than the pattern pitch of the pattern to be inspected, when the sensor electrode 25 of the sensor unit 20 detects the inspection signal, the inspection signal from the pattern to be inspected other than the pattern to be inspected is detected. Is detected.
  • the width of the supply electrode 35 does not necessarily have to be equal to or smaller than the pattern pitch of the pattern to be inspected. If only a plurality of patterns to be inspected and patterns adjacent to this pattern can be grasped, the present embodiment, which will be described in detail later, will be described. The inspection can be performed by the inspection method of the embodiment.
  • the sensor section 20 is moved by a scalar bite port 80 so as to cross one terminal section of the pattern to be inspected, such as the liquid crystal panel 10, and sequentially supplies an inspection signal to each pattern to be inspected via capacitive coupling.
  • the detection signal supplied by the section 30 is detected, and the width of the sensor electrode 25 at the tip is wider than the width of the supply electrode 35 by at least one pitch of the pattern to be inspected, for example. It is desirable.
  • a detection signal from the sensor unit 20 is sent to an analog signal processing circuit 50 and subjected to analog signal processing.
  • the analog signal processed by the analog signal processing circuit 50 is sent to the control unit 60, and the quality of the test pattern with which the test signal supply unit 30 of the liquid crystal panel 10 is in contact is determined.
  • the control section 60 also controls the supply of the test signal to the test signal supply section 30.
  • the analog signal processing circuit 50 amplifies the detection signal from the sensor section 20 by the amplifier 51 and the amplifier 51.
  • a smoothing circuit 54 for smoothing the detected signal. It is not necessary to provide the rectifier circuit 53 for performing full-wave rectification and the smoothing circuit 54 for smoothing the detection signal.
  • the control unit 60 controls the entire inspection apparatus of the present embodiment, and processes the computer 62 (CPU) 61, the ROM 62 storing the control procedures of the CPU 61, and the like, and the processing of the CPU 61. Temporarily store progress information, detection signals, etc. RAM 6 3, A / D converter that converts analog signals from analog signal processing circuit 50 to corresponding digital signals 6 4, Signal supply section 6 that supplies test signals to be supplied to test signal supply section 30 5. It has a display unit 66 that displays inspection results and guidance for operating instructions.
  • the signal supply unit 65 is, for example, an AC 200 kHz as an inspection signal.
  • the band-pass filter 52 is a band-pass filter that passes the test signal 200 kHz. It is needless to say that the inspection signal is not limited to a sine wave signal, but may be a rectangular wave or a pulse wave as long as it is an AC signal.
  • FIG. 2 is a flowchart for explaining inspection control of the inspection apparatus of the present embodiment.
  • the glass substrate on which the conductive pattern to be inspected is formed is moved to a position (work position) of the circuit pattern inspection apparatus according to the present embodiment on a transport path (not shown). It is transported.
  • the liquid crystal panel 10 to be inspected is set in the inspection device.
  • the substrate to be inspected that has been automatically transported may be set in the inspection apparatus by a transport rod (not shown), or may be directly set by an operator.
  • the control unit 60 activates the robot controller 70 to control the scalar robot 80 and positions the inspection object at the inspection position.
  • step S3 an inspection signal is supplied to an initial position on one end side of the inspection target pattern 15 to be inspected (the liquid crystal panel) 10 (the position of the first inspection target pattern separated by a predetermined distance).
  • the initial position on the other end of the pattern to be inspected predetermined
  • the sensor electrode 25 of the sensor unit 20 is transported and positioned at the end of the pattern to be inspected at the farthest distance.
  • the gap (distance between the pattern to be inspected and the electrode) is kept in a range of, for example, 100 m to 200 m.
  • the gap is not limited to the above example, and the gap in the present embodiment is determined according to the size of the pattern to be inspected. If the size of the pattern is large, the gap can be widened and the gap of the pattern can be widened. When the size is small, the gap becomes narrow. '
  • the pattern size is very small, a coating is formed on the electrode surface with an insulating material so that the pattern and the electrode do not come into direct contact with each other.
  • the gap is almost the same as the thickness of the insulating material by bringing the supply section 30 directly into contact with the substrate, the distance between the pattern to be inspected and the electrode can be easily and accurately adjusted to a constant distance. It can be performed.
  • the signal supply unit 65 is instructed to start supplying a test signal to the supply electrode 35 of the test supply unit 30.
  • step S7 keeping the distance between the pattern and the electrode constant, synchronizing the electrodes 25 and 35 of the sensor section 20 and the inspection signal supply section 30 so as to cross the pattern to be inspected.
  • the control for moving is started while controlling to keep the distance from the surface of the pattern to-be-inspected constant.
  • the sensor electrode 25 subsequently detects the signal potential from the pattern to be inspected to which the inspection signal is supplied by capacitive coupling with the supply electrode 35.
  • the supply electrode 35 is located at the position of the pattern to which the inspection signal is supplied.
  • at least a part of the sensor electrode 25 is located at the other end position of the pattern to be inspected to which the inspection signal is supplied, and while the supply electrode 35 is moved by one pitch of the pattern to be inspected at the negative end. Then, the sensor electrode 25 at the other end is also controlled to move by one pitch of the pattern to be detected.
  • step S 10 the signal processing circuit 50 is started, and control is performed so that the detection signal from the sensor electrode 25 is processed and output to the control unit 60.
  • the detection signal from the sensor electrode 25 of the sensor section 20 is amplified to a required level by the amplifier 51, and the detection signal amplified by the amplifier 51 is converted into a signal of the inspection signal frequency.
  • the signal from the band-pass filter 52 is sent to a band-pass filter 52, which removes noise components. And sends it to the AZD converter 64 of the controller 60.
  • the CPU 61 activates the A / D conversion section 64 to convert the input analog signal into a corresponding digital signal, and reads the detection signal detected by the sensor electrode 25 as a digital value.
  • the CPU 61 sends the read detection signal to RAM 63 in the following step S12.
  • the RAM 63 sequentially stores the sent detection signals.
  • the read detection signal includes all of the detection signals from the normal inspection target pattern, the detection signals from the disconnected inspection target pattern, and the detection signals from the adjacent inspection target pattern short-circuited with the inspection target pattern. It is.
  • step S14 it is determined whether or not the inspection of the pattern to be inspected is completed, for example, whether or not the sensor electrode 25 has moved to a position beyond the last pattern of the pattern to be inspected. Check whether the inspection of the target pattern has been completed).
  • step S16 the scanning of the electrodes is continued to supply the inspection signal to the next pattern. Then, the process returns to step S10 to continue the reading process.
  • step S 14 when the inspection for all the inspection target patterns is completed, the process proceeds to step S 20, instructs the signal supply unit 65 to stop the supply of the inspection signal, and sets the signal processing circuit 5. 0, Stops operation of A / D conversion section 64.
  • step S22 the inspection target is removed from the inspection position, positioned and transported to the next transport position, and necessary post-processing is performed.
  • pattern inspection can be performed without any contact between the sensor electrode 25 and the supply electrode 35 at all with the pattern to be inspected. For this reason, even a substrate having a low strength of the inspection target pattern can be inspected without causing a problem such as damaging the inspection target pattern.
  • the AC sine wave signal which is a continuous signal from the supply electrode 35 is moved while moving the sensor electrode 25 and the supply electrode 35 across the pattern to be inspected. Is supplied to the pattern to be inspected, and the signal potential from the pattern to be inspected is detected by the sensor electrode 25.Therefore, the detection signal, which is the signal potential obtained from the sensor electrode 25, has a certain constant continuous detection signal value. Is detected as
  • a defect inspection pattern such as an open (disconnection inspection pattern) or a short (an inspection pattern short-circuited with an adjacent inspection pattern) a defect inspection pattern. If there is The detection signal value of a certain constant continuous detection signal value that is detected in a continuous range where a normal inspection target pattern without open or short circuit is detected and the defect detection signal value detected at the defect inspection target pattern position with open or short circuit There is a numerical difference between them.
  • the detection signal value of the failure due to the open shortcut appears as a numerical difference, that is, a change in the numerical value, among the detection signal values that are constant to a certain extent.
  • the detection signal detection result will be described later in detail.
  • the determination of the defect of the inspection target substrate and the determination of the position of the defect inspection target pattern having an open or a short by the control of the inspection of the conductive pattern of the present embodiment are performed within a certain constant continuous detection signal value. It is possible to use the numerical value difference of the detection signal value of the defect due to the appearing open or short, that is, the change of the relative numerical value of the detection signal.
  • a relative value such as a ratio of a failure detection signal value to a continuous detection signal value or a variation ratio of a failure detection signal value can be used as a threshold value for determining a failure and specifying a failure position.
  • the inspection control of the conductive pattern of the present embodiment is not limited to the above example, and the detection control read in step S12 is performed between step S12 and step S14. It is checked whether or not the signal is within the threshold range based on the relative value. If the detection result is within the threshold range, the process proceeds to step S14.
  • FIGS. 3 and 4 show test signal detection results by the sensor electrode 25 under the above control.
  • FIG. 3 is a diagram showing an example of detection of an inspection signal when three points of an inspection target pattern are broken (open) in the inspection apparatus of the present embodiment.
  • FIG. 4 is a diagram showing one inspection target pattern in the present embodiment.
  • FIG. 6 is a diagram showing an example of detection of a test signal when a short circuit occurs during the operation.
  • the inspection signal (AC signal) supplied from the signal supply unit 65 to the supply electrode 35 is supplied to the capacitively coupled inspection target pattern, and the inspection target pattern is , Reaches the lower part of the sensor electrode 25, is detected by the sensor electrode 25 by capacitive coupling with the sensor electrode 25, and is output to the controller 60.
  • the supply electrode 35 and the sensor electrode 25 supply and detect the inspection signal (AC signal) while crossing the pattern to be inspected, the detection signal is continuously obtained as a somewhat constant detection signal value. Is detected. .
  • the detection signal value of the disconnected inspection target pattern portion is smaller than a continuous constant value detected from the normal inspection target pattern.
  • the test signal (AC power) supplied to the supply electrode 35 from the signal supply unit 65 will Since the detection signal from the sensor electrode 25 is superimposed on the detection signal of the adjacent test target pattern because the detection signal from the sensor electrode 25 also flows through the short-circuited portion, the detection signal value increases. Therefore, as shown in FIG. 4, the detection signal value of the short-circuited inspection target pattern portion is larger than a continuous constant value detected from the normal inspection target pattern.
  • the disconnection and short circuit of the pattern to be detected as described above can be performed with one sensor electrode 25 because the width of the sensor electrode 25 is wider than the width of the supply electrode 35 by at least one pitch of the pattern to be inspected.
  • the width of the sensor electrode 25 must not necessarily be greater than the width of the supply electrode 35 by at least one pitch of the pattern to be inspected. If the inspection target pattern short-circuited with the adjacent inspection target pattern can be inspected, for example, the configuration of the second embodiment described later in detail may be adopted.
  • a threshold value is set within a certain range for the detection signal value which is a certain constant as an absolute value, if the detection signal value is smaller than the threshold value, the disconnection of the pattern to be inspected, and the detection signal value becomes the threshold value If it is larger, it can be determined that the pattern to be inspected is short-circuited.
  • the threshold value is set to 0.02 V pp with respect to a constant detection signal value of 0.60 V pp to some extent, the sensor movement distance that is 0.58 V pp or less is obtained.
  • the pattern to be inspected at the positions of about 22 mm, 42 mm and 78 mm is judged to be disconnected.
  • continuous detection is used as the threshold for determining defects and specifying the location of defects.
  • relative values such as the ratio of the detected signal value of the defect to the signal value and the rate of change in the detected signal value of the defect, for example, when the continuous detected signal value decreases by 3% or more, the If the value of the disconnection or the continuous detection signal rises by 3% or more, it can be determined that the test pattern is short-circuited.
  • the optimal threshold can be set according to the detection result even if the inspection equipment performs inspection while sequentially changing the substrate to be inspected, and the detection signal value varies from inspection to inspection. However, even when the detection signal value is low, these effects can be completely prevented, and an accurate inspection result can be obtained.
  • the inspection apparatus of the present embodiment even in the inspection method in which the detection signal value is minute because both the sensor unit and the inspection signal supply unit are non-contact, by using the inspection apparatus of the present embodiment, The difference can be reliably recognized, and the inspection of the pattern state can be performed easily and surely.
  • the quality of the pattern can be detected very accurately and easily compared to the conventional method of determining the quality using the absolute value of the detection signal value as a threshold.
  • accurate positioning accuracy is not required, and the inspection can be performed with high accuracy even on a substrate having a very fine pattern pitch to be inspected.
  • FIG. 5 is a diagram for explaining the configuration of the inspection apparatus according to the second embodiment of the present invention.
  • a first sensor electrode 22 and a second sensor electrode 24 are provided on at least the distal end surface of the sensor section 20.
  • the first sensor electrode 22 and the second sensor electrode 24 are spaced apart by the pattern pitch of the pattern to be inspected, and the first sensor electrode 22 is actually connected to the supply electrode 35.
  • the second sensor electrode 24 is provided adjacent to the pattern to be received where the supply electrode 35 is actually supplying the test signal. It is provided in an offset state at the other end position of the pattern to be directly inspected.
  • the width of the first sensor electrode 22 and the second sensor electrode 24 be equal to or smaller than the pattern width of the pattern to be inspected. This is because the first sensor electrode 22 performs an inspection for disconnection of the pattern to be received and the second sensor electrode 24 performs an inspection for a short circuit between the pattern to be received and the adjacent pattern to be inspected. This is for realizing a highly accurate inspection. Specifically, if the width of the first sensor electrode 22 is smaller than the pattern width of the pattern to be inspected, the pattern to be inspected is disconnected, and the pattern to be inspected and the adjacent pattern to be inspected are short-circuited. The first sensor electrode 22 is adjacent to the pattern to be inspected through the short circuit. It is less affected by the inspection signal from the inspection signal from the adjacent inspection target pattern that flows into the target inspection target pattern. In addition, the second sensor electrode 2
  • the width of 4 is smaller than the pattern width of the pattern to be inspected, there is no disconnection or short circuit in the pattern to be inspected, or there is no disconnection in the pattern to be inspected but the pattern to be inspected and the adjacent pattern to be inspected. Even if it is short-circuited, the second sensor electrode 24 is less affected by the inspection signal from the received inspection target pattern.
  • the inspection of the disconnection / short-circuit by the first sensor electrode 22 and the second sensor electrode 24 is based on how the presence / absence of disconnection of the pattern to be received and the presence / absence of short-circuit of the adjacent inspection target pattern Even if it exists, very high-precision inspection can be realized.
  • the widths of the first sensor electrode 22 and the second sensor electrode 24 do not necessarily have to be smaller than the pattern width of the pattern to be detected is due to the sensor electrode 25 in the first embodiment. it is obvious.
  • the offset sensor electrode is described as the second sensor electrode 24, but the adjacent test target pattern adjacent to the receiving target pattern is described. Is short-circuited with two adjacent test patterns adjacent to both sides of the power-receiving test pattern by providing a third sensor electrode that detects the test signal from the second adjacent test pattern adjacent on the opposite side Can be inspected simultaneously.
  • the sensor electrodes provided in the sensor section 20 may be configured by using only the first sensor electrode 22 or the second sensor electrode 24 without any problem, or by providing three or more offset sensor electrodes. Needless to say, it is good.
  • the above explanation describes an example of detecting a defective pattern by moving the sensor electrode 25 and the supply electrode 35 across the end of the pattern to be inspected.
  • the present invention is not limited to the above example.
  • one of the sensor electrode 25 and the supply electrode 35 can be moved and controlled along the pattern to be inspected. After identifying the defective pattern, both electrodes are positioned at the position of the defective pattern, one electrode is moved on the pattern along the defective pattern, the detected signal value at sensor electrode 25 is read, and the detected signal value changes.
  • a configuration may be adopted in which the position can be detected and specified as a pattern failure occurrence location.
  • FIG. 6 is a diagram illustrating an inspection device according to a second embodiment of the present invention
  • FIG. 7 is a diagram illustrating electrode movement control in the inspection device according to the second embodiment of the present invention
  • FIG. 9 is a flowchart for explaining the pattern defect location specifying control of the second embodiment
  • FIG. 9 is an example of a defect pattern detection signal waveform at the sensor electrode 25 in the device of the second embodiment
  • FIG. 10 is a diagram showing an example of a detection signal waveform of the sensor electrode 25 in a defective pattern.
  • a camera 26 is attached to the detection unit 20.
  • the camera 26 is connected to, for example, a display unit 66 of the control unit 60 to display a captured image, and is used to observe a defect occurrence state at a pattern defect occurrence location.
  • the test signal supply unit 30 is provided with probe contact means 32 to which a test signal supply probe for supplying a test signal is attached.
  • the probe contact means 32 and the inspection signal supply probe are used to reliably identify the location where the pattern defect has occurred.
  • the scalar port is configured so that the electrodes can be moved not only in the direction of the arrow in FIG. 1 but also in the longitudinal direction of the pattern in FIG. I do.
  • the inspection control shown in FIG. 2 of the first embodiment described above is performed to check whether or not the inspection target pattern has a defect.
  • the inspection target pattern position of the inspection target pattern which is determined to be the pattern disconnection is held in, for example, RAM63.
  • the process proceeds to the defective portion specifying process.
  • the supply electrode 35 and the sensor electrode 25 are first synchronized with each other and moved to the pattern position determined to be defective, as indicated by 1 in FIG. .
  • the inspection signal is sequentially read while moving the sensor electrode 25 from the pattern end toward the other end, and the position where the read signal changes rapidly (the detection signal is not detected) , Or a position that changes to a low level), and identify that position as a defective part.
  • step S14 the detection signal stored in the RAM 63 is checked to determine whether a defective pattern has been detected. It is determined whether or not a defective pattern has not been detected, and the process proceeds to step S20.
  • the signal supply unit 65 is deenergized, and the electrodes are positioned at the initial position as in step S3, and the process proceeds to the processing shown in FIG. Then, after the processing shown in FIG. 8 is completed, the processing may be shifted to the processing in step S20.
  • a defective pattern position detected in the processing of steps S1 to S16 shown in FIG. 2 is specified.
  • Fig. 9 shows the detection signal waveform when a part of the pattern is broken.
  • the analog signal processing circuit 50 The signal before performing the signal processing is shown.
  • the points indicated by the circles are the signal waveforms detected as open patterns (when two patterns are broken).
  • step S33 the robot controller 70 is started, and the scalar port 80 is controlled to move the sensor electrode 25 and the supply electrode 35 to the defective pattern position while synchronizing with each other.
  • the robot controller 70 is started, and the scalar port 80 is controlled to move the sensor electrode 25 and the supply electrode 35 to the defective pattern position while synchronizing with each other.
  • positioning is performed so that the center in the width direction of the sensor electrode 25 and the supply electrode 35 is substantially at the center in the width direction of the defective pattern (the control shown by 1 in FIG. 7). ).
  • step S35 in which the signal supply unit 65 is activated to supply the supply electrode 3
  • the inspection signal is applied to 5 to supply the inspection signal to the defective pattern.
  • the mouth-bot controller 70 is activated to move the sensor electrode 25 in the direction of the supply electrode 35 along the pattern (control (1) in FIG. 7).
  • step S40 the detection signal from the sensor electrode 25 is read as shown in step S40. Then, in the following step S42, it is checked whether or not the detection signal value from the sensor electrode 25 has changed significantly. If not, the process returns to step S37 to continue the movement of the sensor electrode 25.
  • step S42 the process proceeds to the change step S44, where the detection signal from the sensor electrode 25 starts to change greatly.
  • the position where the large change has disappeared is determined, and the intermediate position between those positions is specified as the pattern defective portion.
  • FIG. 10 shows an example of a detection signal waveform at the sensor electrode 25. As shown in FIG. 10, the inspection signal supplied by the supply electrode 35 did not reach the sensor electrode 25 up to the disconnection point, and the detection signal value was low, but the inspection signal was supplied beyond the disconnection point. Since the inspection signal arrives, the detection signal value increases. For example, the position where the detection signal from the sensor electrode 25 starts to change greatly Since an intermediate position from the position where the large change disappears is specified as a pattern defective portion, a substantially intermediate position of the inclined portion is specified as a pattern defective portion.
  • the sensor electrode 25 is moved in the direction of the supply electrode.
  • the supply electrode 35 may be moved in the direction of the sensor electrode 25.
  • a high-precision pattern inspection can be performed in a non-contact manner as in the first embodiment described above, and the sensor electrode can be connected to the X-axis.
  • the sensor electrode can be connected to the X-axis.
  • the defect occurrence state of the part where the defective part has occurred For example, if it is found that only dust or the like is attached to the pattern defect occurrence location, it can be determined that the repair can be performed on the spot, and if the failure is fatal, it is determined that the repair is not performed. be able to.
  • the camera 26 attached to the detection unit 20 is used for observing the failure occurrence state at the pattern failure occurrence location. Since the camera 2 ′ 6 is attached to the detection unit 20, the photographing of the camera 26 is started in the step S 35, and the photographing is performed while the steps S 40 and S 42 are performed.
  • step S42 The image of the pattern defect location photographed in this manner is displayed on the display unit 66 during the continuation of the photographing and after the pattern defect location is specified, so that the defect occurrence state of the pattern defect location can be observed.
  • the state of the defective part of the pattern is the state of complete disconnection or short circuit. From partial disconnection to partial short-circuit due to deposits such as dust. In this partially disconnected or partially short-circuited state, a test signal waveform as shown in FIG. 10 may not be obtained in an inspection in which both the sensor electrode 25 and the supply electrode 35 are in non-contact. In such a case, when the probe contact means 32 is operated to bring the inspection signal supply probe into contact with one end of the defective pattern, and then the sensor electrode 25 is moved on the pattern along the defective pattern, It is possible to reliably specify the location where the pattern failure has occurred.
  • a contact type sensor probe is used, and this sensor probe is brought into contact with the other end to connect the non-contact supply electrode 35 to the other end of the defective pattern. It may be moved in the direction of the sensor probe at the end.
  • FIG. 11 is a view for explaining the configuration of the inspection apparatus according to the third embodiment of the present invention. 11, the same components as those shown in FIG. 1 of the above-described first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.
  • a laser displacement meter 28 is provided at the detection unit 20 to supply an inspection signal.
  • a laser displacement meter 38 is attached to the supply unit 30. The detection results from the two displacement meters 28, 38 are used to determine the distance between the detection unit 20, the inspection signal supply unit 30, and the surface of the inspection target substrate.
  • a distance measuring unit 90 for measuring a distance is provided.
  • the scalar robot 80 is capable of two-dimensionally controlling the detection unit 20 and the inspection signal supply unit 30 and is also configured to be capable of positioning control in a direction perpendicular to the figure (up and down direction). .
  • the distance measuring unit 90 activates the laser displacement meters 28 and 38 simultaneously with the movement of the electrodes, and the distance between each electrode and the surface of the substrate to be inspected. And outputs the measurement result to the control unit 60. Further, the control unit 60 averages the measurement results of the measurement distances from the distance measurement unit 90 while the electrodes move a fixed distance, and controls the distance between the electrodes and the pattern so that the averaged distance is constant. are doing.
  • the distance between the electrode and the substrate surface is controlled according to the average of the distances of three inspection target patterns.
  • the reason for averaging the distances in this way is to prevent abrupt Z-direction control and provide gentle control, as well as to reduce the effects of noise and measurement errors.
  • Controlling not only the X-Y direction but also the Z-direction in this way is particularly effective for inspecting large substrates. For example, in the inspection of a pattern to be inspected on the surface of a large flat display panel, the curvature of the surface of the substrate cannot be avoided, and even in such a case, it is possible to effectively prevent the electrode from coming into contact with the pattern.
  • the range of the measurement distance to be averaged should be narrowed to enable more sensitive detection. Industrial applicability As described above, according to the present invention, it is possible to reliably detect a defect of a pattern to be inspected.

Abstract

L'invention concerne un dispositif d'inspection de motifs de circuits permettant de détecter facilement et de manière sûre un défaut dans une carte de circuit imprimé. L'invention concerne également un procédé d'inspection de motifs de circuits permettant d'inspecter un motif ayant au moins une extrémité composée de rangées. Ce procédé consiste à déplacer une électrode d'émission de signal d'inspection (35) et une électrode de détection de signal d'inspection (25) à travers le motif tout en maintenant une certaine distance par rapport au motif, aux deux extrémités du motif (15) inspecté. Cette technique permet de détecter un signal d'inspection fourni au motif (15) inspecté par couplage capacitif de l'électrode d'émission (35) à l'aide de l'électrode de détection également couplée capacitivement au motif inspecté. Lorsque la valeur du signal détecté est inférieure à une marge prédéterminée, c'est qu'il y a une déconnexion dans le motif. Lorsque la valeur du signal détecté est supérieure à une marge prédéterminée, c'est qu'il y a un court-circuit dans le motif.
PCT/JP2003/015290 2002-11-30 2003-11-28 Dispositif d'inspection de motifs de circuits et procede d'inspection de motifs de circuits WO2004051290A1 (fr)

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CN200380104631.8A CN1720458B (zh) 2002-11-30 2003-11-28 电路图案检查装置及电路图案检查方法
US10/536,997 US20060043153A1 (en) 2002-11-30 2003-11-28 Circuit pattern inspection device and circuit pattern inspection method
AU2003302525A AU2003302525A1 (en) 2002-11-30 2003-11-28 Circuit pattern inspection device and circuit pattern inspection method

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JP2002382813 2002-11-30
JP2002-382813 2002-11-30
JP2003436043A JP3978178B2 (ja) 2002-11-30 2003-11-28 回路パターン検査装置及び回路パターン検査方法
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JP3989488B2 (ja) * 2005-01-19 2007-10-10 オー・エイチ・ティー株式会社 検査装置及び検査方法並びに検査装置用センサ
JP2006284545A (ja) * 2005-04-04 2006-10-19 Quanta Display Inc 回路欠陥検査補修装置及び方法
JP2006300665A (ja) * 2005-04-19 2006-11-02 Oht Inc 検査装置および導電パターン検査方法
JP5276774B2 (ja) * 2005-11-29 2013-08-28 株式会社日本マイクロニクス 検査方法及び装置
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JP4634353B2 (ja) * 2006-09-20 2011-02-16 オー・エイチ・ティー株式会社 回路パターン検査装置
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JP5432213B2 (ja) * 2011-05-20 2014-03-05 株式会社ユニオンアロー・テクノロジー パターン検査装置
JP5865734B2 (ja) * 2012-03-01 2016-02-17 株式会社Ｓｃｒｅｅｎホールディングス 領域分類装置、そのプログラム、基板検査装置、および領域分類方法
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JP6311223B2 (ja) * 2013-06-07 2018-04-18 日本電産リード株式会社 検査装置、検査装置のキャリブレーション方法及び検査方法
JP6202452B1 (ja) * 2016-06-01 2017-09-27 オー・エイチ・ティー株式会社 非接触型基板検査装置及びその検査方法
CN107567199B (zh) * 2016-06-30 2020-01-07 Oht株式会社 非接触型电路图案检查修复装置
JP6476234B2 (ja) * 2016-06-30 2019-02-27 オー・エイチ・ティー株式会社 非接触型回路パターン検査修復装置

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KR20050084001A (ko) 2005-08-26
JP3978178B2 (ja) 2007-09-19
TW200417742A (en) 2004-09-16

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