WO2002063763A1 - Dispositif de traitement des ondes acoustiques de surface, procede de fabrication associe, et dispositif a circuit electronique - Google Patents

Dispositif de traitement des ondes acoustiques de surface, procede de fabrication associe, et dispositif a circuit electronique Download PDF

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Publication number
WO2002063763A1
WO2002063763A1 PCT/JP2002/000949 JP0200949W WO02063763A1 WO 2002063763 A1 WO2002063763 A1 WO 2002063763A1 JP 0200949 W JP0200949 W JP 0200949W WO 02063763 A1 WO02063763 A1 WO 02063763A1
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WO
WIPO (PCT)
Prior art keywords
surface acoustic
acoustic wave
wave device
piezoelectric substrate
terminal electrode
Prior art date
Application number
PCT/JP2002/000949
Other languages
English (en)
French (fr)
Inventor
Akihiko Nanba
Keiji Onishi
Yasuhiro Sugaya
Katsunori Moritoki
Original Assignee
Matsushita Electric Industrial Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2001029079A external-priority patent/JP4496652B2/ja
Priority claimed from JP2001082149A external-priority patent/JP2002280491A/ja
Priority claimed from JP2001147377A external-priority patent/JP4507452B2/ja
Application filed by Matsushita Electric Industrial Co., Ltd. filed Critical Matsushita Electric Industrial Co., Ltd.
Priority to EP02711321.6A priority Critical patent/EP1361657B1/en
Priority to US10/399,305 priority patent/US6969945B2/en
Publication of WO2002063763A1 publication Critical patent/WO2002063763A1/ja
Priority to US11/220,815 priority patent/US7246421B2/en

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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
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    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0542—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a lateral arrangement
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    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/568—Temporary substrate used as encapsulation process aid
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    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
PCT/JP2002/000949 2001-02-06 2002-02-06 Dispositif de traitement des ondes acoustiques de surface, procede de fabrication associe, et dispositif a circuit electronique WO2002063763A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP02711321.6A EP1361657B1 (en) 2001-02-06 2002-02-06 Surface acoustic wave device
US10/399,305 US6969945B2 (en) 2001-02-06 2002-02-06 Surface acoustic wave device, method for manufacturing, and electronic circuit device
US11/220,815 US7246421B2 (en) 2001-02-06 2005-09-07 Method for manufacturing surface acoustic wave device

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2001029079A JP4496652B2 (ja) 2001-02-06 2001-02-06 弾性表面波装置とその製造方法
JP2001-29079 2001-02-06
JP2001-82149 2001-03-22
JP2001082149A JP2002280491A (ja) 2001-03-22 2001-03-22 電子部品およびその製造方法
JP2001-147377 2001-05-17
JP2001147377A JP4507452B2 (ja) 2001-05-17 2001-05-17 電子部品、その製造方法及び電子回路装置

Related Child Applications (2)

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US10399305 A-371-Of-International 2002-02-06
US11/220,815 Division US7246421B2 (en) 2001-02-06 2005-09-07 Method for manufacturing surface acoustic wave device

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WO2002063763A1 true WO2002063763A1 (fr) 2002-08-15

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US (2) US6969945B2 (ja)
EP (1) EP1361657B1 (ja)
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CN111200410A (zh) * 2018-11-16 2020-05-26 开元通信技术（厦门）有限公司 一种声波器件晶圆级封装结构及其制备方法

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Cited By (10)

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US9324677B2 (en) 2011-04-04 2016-04-26 Rohm Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
US9653384B2 (en) 2011-04-04 2017-05-16 Rohm Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
US10186496B2 (en) 2011-04-04 2019-01-22 Rohm Co., Ltd. Semiconductor device and method for manufacturing semiconductor device to prevent separation of terminals
US10497666B2 (en) 2011-04-04 2019-12-03 Rohm Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
US10707185B2 (en) 2011-04-04 2020-07-07 Rohm Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
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US11735561B2 (en) 2011-04-04 2023-08-22 Rohm Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
CN111200410A (zh) * 2018-11-16 2020-05-26 开元通信技术（厦门）有限公司 一种声波器件晶圆级封装结构及其制备方法
CN111200410B (zh) * 2018-11-16 2023-03-21 开元通信技术（厦门）有限公司 一种声波器件晶圆级封装结构及其制备方法
CN109861662A (zh) * 2019-02-12 2019-06-07 南方科技大学 一种薄膜体声波谐振器及其制备方法

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EP1361657A4 (en) 2010-03-24
CN1221076C (zh) 2005-09-28
EP1361657B1 (en) 2013-07-24
US6969945B2 (en) 2005-11-29
US20060006760A1 (en) 2006-01-12
EP1361657A1 (en) 2003-11-12
US7246421B2 (en) 2007-07-24
CN1476670A (zh) 2004-02-18
US20040026361A1 (en) 2004-02-12

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