WO2002056662A1 - Dispositif de montage de composants, fournisseur de services et procede de prestation de services - Google Patents
Dispositif de montage de composants, fournisseur de services et procede de prestation de services Download PDFInfo
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- WO2002056662A1 WO2002056662A1 PCT/JP2002/000103 JP0200103W WO02056662A1 WO 2002056662 A1 WO2002056662 A1 WO 2002056662A1 JP 0200103 W JP0200103 W JP 0200103W WO 02056662 A1 WO02056662 A1 WO 02056662A1
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- Prior art keywords
- service
- component
- mounting
- information
- supply device
- Prior art date
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- 238000000034 method Methods 0.000 title claims description 140
- 238000004519 manufacturing process Methods 0.000 claims abstract description 176
- 238000004891 communication Methods 0.000 claims abstract description 60
- 229910000679 solder Inorganic materials 0.000 claims description 187
- 230000005540 biological transmission Effects 0.000 claims description 138
- 238000007689 inspection Methods 0.000 claims description 132
- 238000007639 printing Methods 0.000 claims description 131
- 239000006071 cream Substances 0.000 claims description 130
- 238000012544 monitoring process Methods 0.000 claims description 105
- 238000004458 analytical method Methods 0.000 claims description 104
- 238000012423 maintenance Methods 0.000 claims description 96
- 230000008439 repair process Effects 0.000 claims description 62
- 230000008859 change Effects 0.000 claims description 44
- 230000007547 defect Effects 0.000 claims description 31
- 238000012546 transfer Methods 0.000 claims description 28
- 230000007423 decrease Effects 0.000 claims description 26
- 230000006872 improvement Effects 0.000 claims description 18
- 239000002245 particle Substances 0.000 claims description 15
- 230000004044 response Effects 0.000 claims description 15
- 238000012549 training Methods 0.000 claims description 11
- 238000011156 evaluation Methods 0.000 claims description 9
- 238000003908 quality control method Methods 0.000 abstract 1
- 238000007726 management method Methods 0.000 description 158
- 238000012384 transportation and delivery Methods 0.000 description 119
- 238000005457 optimization Methods 0.000 description 109
- 238000003860 storage Methods 0.000 description 70
- 238000004088 simulation Methods 0.000 description 63
- 238000010586 diagram Methods 0.000 description 60
- 230000008569 process Effects 0.000 description 48
- 239000000853 adhesive Substances 0.000 description 45
- 230000001070 adhesive effect Effects 0.000 description 45
- 238000013500 data storage Methods 0.000 description 34
- 239000000284 extract Substances 0.000 description 28
- 238000004364 calculation method Methods 0.000 description 26
- 230000007704 transition Effects 0.000 description 25
- 238000012545 processing Methods 0.000 description 24
- 230000006870 function Effects 0.000 description 21
- 230000002829 reductive effect Effects 0.000 description 21
- 230000005856 abnormality Effects 0.000 description 19
- 230000036961 partial effect Effects 0.000 description 19
- 239000011295 pitch Substances 0.000 description 18
- 238000011068 loading method Methods 0.000 description 17
- 238000009826 distribution Methods 0.000 description 16
- 238000009434 installation Methods 0.000 description 16
- 230000015556 catabolic process Effects 0.000 description 12
- 238000001179 sorption measurement Methods 0.000 description 12
- 239000000758 substrate Substances 0.000 description 12
- 238000005476 soldering Methods 0.000 description 11
- 238000011179 visual inspection Methods 0.000 description 11
- 239000000463 material Substances 0.000 description 10
- 238000010276 construction Methods 0.000 description 9
- 230000002950 deficient Effects 0.000 description 9
- 230000002159 abnormal effect Effects 0.000 description 8
- 238000003745 diagnosis Methods 0.000 description 8
- 238000000605 extraction Methods 0.000 description 8
- 230000008676 import Effects 0.000 description 7
- 238000000926 separation method Methods 0.000 description 7
- 238000004140 cleaning Methods 0.000 description 6
- 238000003780 insertion Methods 0.000 description 6
- 230000037431 insertion Effects 0.000 description 6
- 238000011084 recovery Methods 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 230000004907 flux Effects 0.000 description 5
- 238000012937 correction Methods 0.000 description 4
- 230000003247 decreasing effect Effects 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 4
- 238000012552 review Methods 0.000 description 4
- 238000010561 standard procedure Methods 0.000 description 4
- 241000196324 Embryophyta Species 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000012790 confirmation Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 230000000737 periodic effect Effects 0.000 description 3
- 238000010926 purge Methods 0.000 description 3
- 238000004904 shortening Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000013024 troubleshooting Methods 0.000 description 3
- 238000011144 upstream manufacturing Methods 0.000 description 3
- 230000000740 bleeding effect Effects 0.000 description 2
- 238000004422 calculation algorithm Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000005108 dry cleaning Methods 0.000 description 2
- 238000000556 factor analysis Methods 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000011022 operating instruction Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000003449 preventive effect Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000006641 stabilisation Effects 0.000 description 2
- 238000011105 stabilization Methods 0.000 description 2
- 230000032258 transport Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 241001070941 Castanea Species 0.000 description 1
- 235000014036 Castanea Nutrition 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 240000002989 Euphorbia neriifolia Species 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 238000005352 clarification Methods 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000001921 mouthing effect Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 230000009974 thixotropic effect Effects 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- 230000002747 voluntary effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/41805—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by assembly
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
- G06Q10/00—Administration; Management
- G06Q10/10—Office automation; Time management
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/0882—Control systems for mounting machines or assembly lines, e.g. centralized control, remote links, programming of apparatus and processes as such
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/31—From computer integrated manufacturing till monitoring
- G05B2219/31457—Factory remote control, monitoring through internet
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/32—Operator till task planning
- G05B2219/32226—Computer assisted repair, maintenance of system components
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45026—Circuit board, pcb
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
- Y10T29/5136—Separate tool stations for selective or successive operation on work
- Y10T29/5137—Separate tool stations for selective or successive operation on work including assembling or disassembling station
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53022—Means to assemble or disassemble with means to test work or product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53143—Motor or generator
- Y10T29/53161—Motor or generator including deforming means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
Definitions
- the present invention relates to a service receiving apparatus, a production equipment, which derives services for realizing high efficiency and high quality production of a production line in which a plurality of production facilities including a component mounting machine are connected in a process order from a production facility supplier.
- the present invention relates to a service supply device for supplying a service from a maker that supplies products, and a method for supplying a service from a production equipment supplier.
- the present invention also relates to a service receiving program for operating the service receiving device, and a service providing program for operating the service providing device.
- This component mounting line is a type of production line that automatically mounts components on circuit boards. Examples include a board supply device that supplies circuit boards one by one, a cream solder printing machine that prints cream solder on a circuit board, a cream solder print inspection machine that checks the state of printed cream solder, and a component board.
- Adhesive applicator that applies adhesive to adhere to components, high-speed mounting machine that mounts components on circuit boards at high speed, multi-function mounting machine that mounts various types of parts, including odd-shaped components, on circuit boards
- a mounting component inspection machine that inspects for missing or misaligned components on the circuit board after mounting components, melts cream solder, solders the electrodes of the components to the lands on the circuit board, and mounts the components It consists of a single riff opening device, a visual inspection machine that visually inspects the soldering state and the mounting state of components, and a board storage device that stores the mounted circuit boards.
- a component inserter that inserts radial leads, axial leads, or jumper wires, or a component that is mounted with friction between metals, friction diffusion, or fusion bonding
- Other types of equipment, such as mounting machines, are also used.
- the component mounter 450 has a data storage unit 451 that records the operation information and error information of the component mounter for trouble recovery and maintenance, etc. Outputs information to an output device 452 (printer, video disk, display screen, etc.) that outputs the stored information, and to an external PC 453 A communication device 4 5 4 is provided.
- the component mounter 450 is delivered, and the customer's factory 171, which is operating, is repaired and maintained for the trouble that occurs in the component mounter 450.
- a service base 17 2 is provided on the manufacturer side to perform the service.
- step S601 if a trouble occurs in the component mounting machine 450 in the customer factory 17 1 (step S601), the customer operator will provide the details of the trouble, for example, the operation information of the component mounting machine. , Error—information is output by the output device 452 of the component mounter 450 (step S602). The output information is communicated to the service base 172 using information transmission means such as a telephone and a facsimile (step S603).
- the service technician at the service base 1 72 who received the notification receives the details of the trouble (operation information of the component mounter, error information, etc.) and checks whether all the data necessary for analysis is available (Ste S604). If the data is not available, contact the customer's customer service center again at 17-1 to collect information. When all the data is ready, the analysis is performed (step S605), and the trouble is recovered by a serviceman's business trip (step S606).
- the level of operation of the parts mounter delivery destination varies.
- the quality of component mounting production varies depending on the level of the operator at the destination of the component mounting machine, making it difficult to ensure uniform quality at all the factories at the destination.
- explanations and training for operators when delivering a component mounter are usually performed for operations on a specific test circuit board, and in many cases, the types of circuit boards and mounted components It does not cover how to mount components under different conditions. As a result, it takes a considerable amount of time for the operating personnel at the delivery site to acquire such know-how.
- an operator who operates the component mounter 450 needs to create an NC data necessary for the component mounter to perform a component mounting operation. To do so, as shown in Fig. 23, considerable information must be examined and input for each component to be mounted. Nevertheless, if a system that automatically generates NC data from a parts database is used, there is an advantage that surveys and inputs are not required for parts that have been used once and registered in the parts database. However, there are times when trial and error is performed while producing whether the entered content is really suitable. In addition, the total number of types of mounted components used in the component mounting industry is over 100,000. At mounting sites where various types of components are mounted, the number of newly mounted components does not readily decrease. For this reason, it is easy to make mistakes in the input contents when creating NC data. If there is an error in the input contents, it will lead to a trouble or poor quality of the component mounter. In addition, as the workload for creating the NC data becomes enormous, the possibility of input errors further increases.
- the work load is similarly high, and input errors can occur in teaching component recognition data, setting squeegee operating conditions in screen printing of cream solder, and setting heating temperature profiles in reflow equipment.
- the nature is high.
- the main object of the present invention is that the component mounter can provide the customer service related to production, such as productivity and quality maintenance, from the manufacturer or service provider who supplies the component mounter.
- the purpose of the present invention is to provide a component mounting machine, a service supply device, and a service method, which are received or given by any communication including, for example, to facilitate production. Disclosure of the invention
- a component mounter of the present invention is a component mounter that mounts components on a circuit board, and is connectable to an Internet line, and is used for mounting and manufacturing by communication through the Internet line. It is equipped with a communication device that can receive necessary services. Further, the communication device may be used for monitoring the operation status of the component mounting machine by the service provider, notifying the service provider of the occurrence of the trouble so that the service can be received, For remote operation at the time of component mounting from the customer, or collection of data for analysis of troubles such as production mounting data or device operation record data stored in the component mounting machine by the service provider. Or install the software for operating the component mounter, the component library for operating the component mounter, and other services from the service provider. Also, the service is extracted from the service information database provided on the service provider side and storing the service information.
- a service method is a service method for a component mounter that mounts a component on a circuit board, wherein the component mounter performs a service of the component mounter.
- the service provider is connected to the service provider through the Internet network, and the service provider monitors the movement status of the component mounter through the Internet.
- a service supply device of the present invention includes: a component supply device that supplies components; and component holding means that retains components from the component supply device and mounts the components on a circuit board.
- a service supply device provided at a supplier or a service provider side of a mounting machine or a component mounting line connected to and including the component mounting machine, and providing a service necessary for mounting production, wherein the component mounting machine or the component mounting is provided.
- a service receiving device provided on the user side that mounts and produces using the line, a transmitting and receiving unit that transmits and receives information via communication means such as an Internet network, and the service receiving device via the transmitting and receiving unit.
- a control unit for service withdrawal Further, the control unit may provide, via the transmission / reception unit, the service receiving device to retrieve the service data or the service software with respect to the service information data pace, or a service for analyzing a problem occurring in the component mounter. Or withdrawing services for monitoring the production status.
- a component mounting machine is a component mounting machine including a cream solder printing machine for printing cream solder on a circuit board for mounting components, A transmission / reception unit that transmits and receives information via communication means such as a service supply device and an internet connection provided on the machine provider or service provider side, and an input unit for inputting an instruction for extracting a service And a control unit that receives an instruction from the input unit and controls so as to draw out a service required for printing cream solder from the service supply device via the transmission / reception unit.
- control unit communicates with the service side that provides the service of the component mounting machine including the cream solder printing machine to the service side via the transmission / reception unit via the Internet line, regarding the characteristics or printing conditions of the various types of cream solder. Service to retrieve the information, or notify the service provider of the printing conditions and printing conditions selected and used for cream solder printing on the cream solder printing machine. To get access to
- a service method of the present invention also provides a component mounting method including a cream solder printing machine for printing cream solder on a circuit board for mounting components.
- a supply method for machine service, wherein information on cream solder printing can be extracted from the service person side through the Internet with a service person providing the component mounter service.
- a service supply device of the present invention further comprises a component mounting machine supplier or service including a cream solder printing machine for printing cream solder on a circuit board to mount components.
- a service supply device that is provided on the customer side and supplies services required for cream solder printing, comprising a service information database for supplying services, characteristic information of cream solder, and a service receiving device. Monitoring and evaluation of information on printing conditions, status or status selected and used by the user or the component mounting line supplier or service provider received from , Countermeasures, and information that has been optimized by implementing at least one of the following improvements are registered as data that can be withdrawn by the service receiving device.
- the control unit can converge while accumulating print condition evaluation results as needs in a print condition database for registering cream solder printing conditions in the service information database.
- the solder property information includes the solder manufacturer, product number, particle size, viscosity, and other items.
- the control unit executes a search for the product number, and if the search is not successful, the search by particle size or viscosity is performed. It is preferable that the result is obtained by performing the operation and retrieving a value approximate to that of the desired solder part number in the retrieved characteristic data.
- the printing condition database is migrated when it is judged that the new data base based on newly input data and the new data registered in the new database are appropriate or stable.
- the search object is composed of a basic data base to be searched and a search target.
- even the same solder number, particle size, and viscosity data are stored separately, and the most appropriate data is selected from the stored data to create a basic data base. It is preferable to move. Further objects and features of the present invention will become apparent from the following detailed description and drawings. The features of the present invention can be employed alone or in combination in various combinations as much as possible.
- FIG. 1 is a block diagram illustrating a component mounter according to a first embodiment of the present invention
- FIG. 2 is a flowchart illustrating a flow from the component mounter to the Internet according to the first embodiment.
- FIG. 3 is a flowchart for connecting to the component mounter from the outside through the Internet network in the first embodiment.
- FIG. 4 is an overall configuration diagram of a customer service method and an apparatus thereof according to a second embodiment of the present invention.
- FIG. 5 is a specific example of a state in which the state of the component mounter is monitored from a remote place via an Internet network in the second embodiment of the present invention.
- FIG. 6 is a flowchart showing the processing in FIG.
- FIG. 7 is a specific example of a state in which trouble and error information of a component mounter according to the second embodiment are notified to a remote location via an internet connection.
- FIG. 8 is a specific example of a state in which a component mounter is operated from a remote place through an in-net network in the second embodiment.
- FIG. 9 is a flowchart showing the processing in FIG.
- FIG. 10 is a specific example of a state in which the production result data accumulated in the component mounting machine according to the second embodiment and the device operation record data are collected from a remote place via an Internet line.
- FIG. 11 is a flowchart showing the processing in FIG. 10,
- FIG. 12 is a specific example of a state in which the software in the component mounting machine is updated through the Internet line in the second embodiment
- FIG. 13 is a flowchart showing the processing in FIG. 12,
- FIG. 14 is a configuration diagram of a component mounting system according to the third embodiment of the present invention.
- FIG. 15 is an overall configuration diagram of a service system according to the third embodiment.
- FIG. 16 is an overall configuration diagram of a service system according to the third embodiment.
- B shows the configuration of the main part of the cream solder printing machine according to the third embodiment,
- FIG. 17A is a plan view,
- FIG. 17B is a front view,
- FIG. 18A is a configuration diagram of a main part of one type of mounting machine in the third embodiment
- FIG. 18B is a main part of another type of mounting machine in the third embodiment.
- FIG. 19 is a control configuration diagram of the mounting machine in the third embodiment.
- FIG. 20 is a control configuration diagram of the management device according to the third embodiment.
- FIG. 21 is a storage configuration diagram of a data storage unit of the management device according to the third embodiment.
- FIG. 22 is a configuration diagram of equipment information according to the third embodiment.
- FIG. 23 is a configuration diagram of the NC data in the third embodiment
- FIG. 24 is a diagram showing a web screen of the service receiving apparatus according to the third embodiment.
- FIG. 25 is a control configuration diagram of a service supply device according to the third embodiment
- FIG. 26 is a control configuration diagram of a service reception device according to the third embodiment
- FIG. FIG. 27B is a diagram showing a configuration of a speed and a speed in the third embodiment
- FIG. 27B is a diagram showing a configuration of a tact simulation and a parameter in the third embodiment
- FIG. 28 is a configuration diagram of the operation quality information DB according to the third embodiment
- FIG. 29 is a configuration diagram of the service information DB according to the third embodiment
- FIG. FIG. 10 is a configuration diagram of a contract DB in the embodiment of FIG.
- FIG. 31 is a configuration diagram of a sales information DB according to the third embodiment.
- FIG. 32 is a configuration diagram of the instruction manual DB according to the third embodiment.
- FIG. 33 is a configuration diagram of a repair part DB in the third embodiment
- FIG. 34 is a configuration diagram of a virtual training DB in the third embodiment.
- FIG. 35 is a configuration diagram of a maintenance information DB according to the third embodiment
- FIG. 36 is a configuration diagram of a software DB according to the third embodiment
- FIG. 37 is a configuration diagram of the third embodiment.
- FIG. 3 is a configuration diagram of a mounted component DB in the form of FIG.
- FIG. 38 is a configuration diagram of the mounting method DB in the third embodiment.
- FIG. 39 is a configuration diagram of the optimization software DB in the third embodiment.
- FIG. 40 is a configuration diagram of the monitoring and analysis software DB in the third embodiment.
- FIG. 41 is a schematic flow chart of the entire service system according to the third embodiment.
- FIG. 42 is the first half of a flowchart showing contracts and services in the third embodiment
- Figure 43 is the second half of the flowchart showing contracts and services in the third embodiment.
- FIG. 44A is a flowchart showing a graph display operation of the line operation rate transition analysis processing related to monitoring and analysis in the third embodiment.
- FIG. 44B is a flowchart showing the monitoring in the third embodiment.
- Fig. 44C is a flowchart showing the operation of the graph display for the line mounting tact analysis process related to the analysis.
- Fig. 44C shows the graph display of the adsorption rate transition analysis process for the monitoring and analysis in the third embodiment. This is a flow chart showing the operation.
- FIG. 45 is a flowchart in the case where the operation rate indicating the operation of monitoring and analysis according to the third embodiment is equal to or higher than the target value.
- FIG. 46 is a flowchart in the case where the operation rate indicating the operation of monitoring and analysis according to the third embodiment is not higher than the target value,
- FIG. 47A is a diagram illustrating a display screen of the line utilization analysis in the third embodiment
- FIG. 47B is a diagram illustrating a display screen of the line sunset analysis corresponding to FIG. 47A. Yes,
- FIG. 48A is a diagram showing another display screen of the line operation rate transition analysis according to the third embodiment
- FIG. 48B is a display screen of the line sunset analysis corresponding to FIG. 47A.
- FIG. 48A is a diagram showing another display screen of the line operation rate transition analysis according to the third embodiment
- FIG. 48B is a display screen of the line sunset analysis corresponding to FIG. 47A.
- FIG. 49A is a diagram showing another display screen of the line operation rate transition analysis according to the third embodiment
- FIG. 49B is a table of the line mounting evening analysis corresponding to FIG. 49A.
- Fig. 5 OA is a diagram showing another display screen of the line operation rate transition analysis in the third embodiment
- Fig. 50B is a display screen of the line mounting evening analysis corresponding to Fig. 5 OA.
- FIG. 5 OA is a diagram showing another display screen of the line operation rate transition analysis in the third embodiment
- Fig. 50B is a display screen of the line mounting evening analysis corresponding to Fig. 5 OA.
- FIG. 51A is a diagram showing still another display screen of the line operation rate transition analysis in the third embodiment
- FIG. 51B is a display screen of the stop time transition analysis corresponding to FIG. 51A.
- FIG. 52A is a diagram showing still another display screen of the line operation rate transition analysis according to the third embodiment
- FIG. 52B is a display of the component suction rate transition analysis corresponding to FIG. 52A. It is a diagram showing a screen
- FIG. 53A is a diagram showing still another display screen of the line operation rate transition analysis in the third embodiment
- FIG. 53B is a diagram of the line mounting tact analysis corresponding to FIG. 53A. It is a diagram showing a display screen
- FIG. 54A is a diagram showing another display screen of the line operation rate transition analysis in the third embodiment, and FIG. 54B is a table of the stop time transition analysis corresponding to FIG. 54A.
- FIG. FIG. 55A is a diagram showing another display screen of the line operation rate transition analysis in the third embodiment, and FIG. 55B is a table of the stop time transition analysis corresponding to FIG. 55A.
- FIG. 55A is a diagram showing another display screen of the line operation rate transition analysis in the third embodiment
- FIG. 55B is a table of the stop time transition analysis corresponding to FIG. 55A.
- FIG. 56 is a flowchart showing the mounting machine single unit optimization process according to the third embodiment.
- FIG. 57 is an image diagram showing the relationship between the division of the component supply device and the component mounting order in the third embodiment.
- FIG. 58 is a flowchart showing the mounting machine single unit optimization process and the optimization process for reviewing the common component arrangement in the third embodiment.
- FIG. 59A is an image diagram showing the relationship between the fixed mounting order of the component supply device according to the third embodiment, and FIG. 59B is the fixed mounting order shown in FIG. 59A changed to the free mounting order. It is an image diagram showing the relationship of the time,
- FIG. 6 OA is a diagram showing one simulation example of the common component arrangement and the production tact in the third embodiment
- FIG. 60B is a diagram showing a simulation example of the type change time corresponding to FIG. 6 OA.
- FIG. 61A is a diagram showing an example of a simulation of a partial common component arrangement and a production event in the third embodiment
- FIG. 61B is a simulation of a product change time corresponding to FIG. 61A.
- FIG. 62A is a diagram illustrating an example of a simulation of an optimal arrangement of individual parts and a production tact according to the third embodiment.
- FIG. 62B is a diagram illustrating a model switching time corresponding to FIG. 62A. It is a diagram showing a simulation example,
- FIG. 63 is a flowchart showing a component distribution correction process according to the third embodiment.
- FIG. 64 is a flowchart showing the mounting machine unit optimizing process and the component distribution correcting process according to the third embodiment.
- FIG. 65 is a flowchart showing a mounting machine single unit optimization process for suppressing vibration of the component supply device according to the third embodiment.
- FIG. 66 is a flowchart showing the process of optimizing the addition of a component supply device according to the third embodiment.
- Fig. 67 is a block diagram of a conventional component mounter.
- FIG. 68 is a configuration diagram of a conventional customer service method and its device.
- FIG. 69 is a flowchart showing a procedure of a conventional trouble recovery method.
- FIG. 70 is a flowchart of the third embodiment.
- FIG. 3 is a configuration diagram showing an example of a solder property DB relating to solder properties in cream solder information in a mounting method DB in FIG.
- FIG. 71 is a configuration diagram illustrating an example of a cream solder printing condition DB in cream solder information in the mounting method DB according to the third embodiment.
- FIG. 72 is a menu screen for handling cream solder information on the service receiving device side in the third embodiment
- FIG. 73 is a flowchart showing a search operation of the solder characteristic DB.
- FIG. 74 is a flowchart showing the procedure for creating the print condition DB. BEST MODE FOR CARRYING OUT THE INVENTION
- the component mounter 151 includes a communication device 152 that can be connected to an Internet network and a software group.
- the communication device 152 is, for example, a computer or the like, and can be an internal function of a control device 153 such as a computer that controls the operation of the component mounter 151, as in the present embodiment, or a dedicated device. It may be a device.
- the communication device 15 2 may be a host computer that manages a plurality of component mounters 15 1, or may be a component mounter 15 A computer that can communicate with 1 may be used.
- the software group runs on the communication device 15 2 and connects to an internet connection line (for example, a provider), and performs communication via the connection network 16 1 and communication device 15 2
- a browsing software that operates on the Internet and can refer to the homepage on the evening network
- a server software that runs on the communication device and responds to requests from communications from the Internet.
- 63 and operates on the communication device 152, exchanges information with the server software 163, and transmits the data stored in the data storage unit 154 to the Internet line. Equipped with application software 164 for updating software and settings inside the device.
- These software groups operate in the communication device, and the communication device 152 is incorporated in the component mounter 151.
- the control unit 15 3 has the data storage unit 15 4 and includes the display 15 5 a.
- the operation of the output device 15 5 is controlled and the data of the component mounting machine 15 1 Input and save operation record data and production result data including errors and errors, while inputting them to the data storage section 154 or saving the data stored in the data storage section 154. It can be output to the outside by the output device 155 to be used.
- the output is performed by recording on a recording medium 168a such as a floppy disk, printing on recording paper 168b, or displaying a screen on a display 155a.
- the output device 155 also outputs the communication data from the server software 163 responding to the request by the communication by the communication device 152.
- step S 1 The procedure for connecting the component mounter 151 to the Internet connection network will be described with reference to the flowchart shown in Fig. 2.
- communication software 16 Start up and connect to the Internet via communication media such as telephone line 156 and LAN 157 (step S 1).
- step S 2 the browsing software 16 2 is started up, and the home page of the server connected to the Internet is referenced and the data is obtained overnight (step S 2).
- step S 2 the browsing software 16 2 is started up, and the home page of the server connected to the Internet is referenced and the data is obtained overnight.
- security should be ensured through ID management.
- a procedure for connecting to the component mounter 151 from outside through the Internet network will be described with reference to the flowchart shown in FIG.
- the communication software 161 for connecting to the Internet network is activated, and the connection to the Internet is made via a communication medium such as a telephone line 156 or a LAN 157 (step S11).
- the server software 163 receives the request (step S12), and based on the request content, the server software 163 issues a request to the application software 164.
- the application software 164 is stored in the data storage unit 154. Is acquired (step S14), and transferred to the request source via the communication software 161 (step S15).
- the component mounter 15 1 always communicates via the Internet line, conducts daily monitoring, regular inspections, recovery and maintenance when trouble occurs, and software Updates and customer services can be received from the communication destination, and the service does not take much time, and the cost of moving service personnel and the cost of dedicated line facilities for each customer are unnecessary. Costs are reduced. Therefore, it is particularly advantageous when the customer is remote from the servicer.
- the customer service method and the device thereof according to the second embodiment use a component mounter 151, which is not particularly different from the one shown in the first embodiment. It has a service base 17 2 for service providers who provide customer service.
- a service base 17 2 for service providers who provide customer service.
- the component mounter 151 common portions are denoted by the same reference numerals for simplicity of explanation and understanding, and duplicate description is omitted.
- the component mounter 151 is delivered and installed at a customer factory 171, and the communication device 152 is connected to the Internet via a telephone line 156 or LAN 157.
- the communication device 152 can also be an internal function of the control device 153 of the component mounter 151.
- the above-described computer that manages a plurality of component mounters may be used, or each part may be installed at a customer's factory. It may be a computer for receiving a service that can communicate with the component mounter 15 1.
- a service base 17 2 is located at a remote location different from the customer's factory 17 1, and the service base 17 2 has a telephone line 156 or LAN 157
- the communication device 180 connected to the device, for example, a convenience store is installed.c
- the communication device 180 may be an internal function of a computer that performs customer management or may be a dedicated device. .
- FIG. 5 shows a specific example of monitoring the status of the component mounter 151 from the remote location via the Internet line at the service bases 1-2 in FIG. Figure 6 shows the processing flow.
- the service base Communication between browsing software 1 6 2a running on communication device 1 8 0 in 1 7 2 and server software 1 6 3 running on communication device 1 5 2 in component mounter 1 5 1 (Steps S23, S24)
- the server software 163 starts the application software 164 (Step S25).
- the application software 16 4 transfers the operation information held in the data storage unit 15 4 in the component mounter 15 1 to the server software 16 3 (steps S 26, S 2 7) Further, the browsing software 16 2a in the service base 1 12 receives the information (step S28), so that the serviceman can stay at the service base 17
- the operation information of the component mounter 151 in the factory 17 1 can be referred to, and the status of the component mounter 15 1 can be monitored by repeating this process automatically or manually.
- the operation information is information indicating the operation status of the component mounter 151, and includes, for example, a total of an operation rate, an operation time, and a stop time, and a real time indicating whether the current operation is being performed, stopped, or in trouble Information etc. are included.
- FIG. 7 shows a specific example of notifying the trouble and error information of the component mounter 15 1 of FIG. 4 to the remote service bases 1 and 2 via the Internet line.
- Components mounted when communication devices 152, 180 are connected to the Internet If an error such as a trouble occurs on the machine 151, browse the information on the error. Notification is sent to the service base 17 2 via the line.
- FIG. 8 shows a specific example in which the component mounter 151 is operated from a remote location at the service base 172 shown in FIG. 4 via the Internet network.
- Figure 9 shows the processing flow. In a state where the communication devices 152 and 180 are connected to the Internet (steps S31 and S32), the application software 1664 in the component mounter 151 is connected to the server.
- step S34 and S35 the information of the screen currently displayed on the display 15a of the component mounter 151 is displayed on the server software 163.
- step S 36, S 37 Screen operation (mouse operation, input from the keyboard, etc.) of the viewing software 16 2 a on the side is received via the server software 16 3, and is displayed on the display 15 5 a of the component mounter 15 1 (Steps S39, S40).
- Steps S39, S40 As a result, by operating the screen on the computer display 108a as the communication device 180 in the service base 172, the display of the component mounter 155 in the customer site 171 can be obtained.
- the same operation as screen operation can be realized in 15.5a, and the restoration operation is performed. Instead of this operation, or in addition to this operation, an operation instruction is given, and it is possible to cope with an operation that is difficult or impossible to perform automatically.
- Figure 10 shows the production performance data stored in the data storage unit 15 4 in the component mounter 15 1, and the equipment operation record data of the component mounter 15 1
- Figure 2 shows a specific example of collecting data from a remote location via the Internet network.
- Figure 11 shows the processing flow. If a problem occurs in the component mounter 151, with the communication devices 152, 180 connected to each other (steps S41, S42), the service base The service person 17 2 starts the viewing software 16 2 a running on the communication device 180 in the service base 17 2. to this The browsing software 16 2a running on the communication device 18 0 in the service base 1 2 communicates with the server software 16 3 in the component mounter 15 1 (step S 4 3, S44), the server software 163 activates the application software 164 (step S45).
- the application software 16 4 transfers production performance data and equipment operation record data in the component mounter 15 1 to the server software 16 3 (steps S 46 and S 47), and furthermore, the service base 17
- the browsing software 16 2a in 2 receives the information (step S48), so that the serviceman can be mounted at the customer factory 17 1 while at the service base 17 2
- the information required for the trouble analysis of the machine 15 1 can be referred to and analyzed by the analysis software 16 5 (step S 49), and the analysis results can be obtained by remote operation using the flowchart of FIG. 5 Reflect the information to 1 and use it for recovery operations such as troubles. ⁇
- the production mounting data is total data of the number of circuit boards produced, the number of errors, and the like
- the device operation record data is log information such as error occurrence contents and time during operation of the component mounting machine 151, From these data, the cause of the trap can be analyzed.
- FIG. 12 shows a specific example of updating the software in the communication device 152 of the component mounting machine 151 from a remote location via the Internet line at the service base 172 in FIG. I have.
- the communication device 180 has the software of the component mounter 151, the component library for each component to operate the component mounter 151, and the component mounter 151, Instructions are stored in the service information database at 26.
- Figure 13 shows the processing flow. In a state where the communication devices 152, 180 are connected to each other (steps S51, S52), the operator in the customer's factory 171, the component mounting machine 151, A reference request is output to the communication device 180 in the service base 172 using the browsing software 162 in the communication device 152 in (step S53), and the communication receiving the request is performed.
- Apparatus 180 Application software started by server software 1 63 64a obtains a list of the corresponding software from the service information DB 26 (steps S54 to S56). The obtained list is transferred to the viewing software 162a of the communication device 152 via the communication device 180's server software, and the operation of the customer's factory can be referred to (Steps S57, S57). 5 8). If there is an updated version of the software related to the component mounter 151, the browsing software 162a in the component mounter 151 and the service The component mounter 1 51 obtained from the service information database 26 on the communication device 180 of the service base 17 2 by communicating with the software 16 3 a was updated. Download the software into the component mounter 151, and update it (steps S59 to S64).
- a component library and an instruction manual can also be acquired from the service information DB 26 of the service base 1-2 and referenced by the same procedure as described above.
- FIG. 15 relates to a service system for the component mounting system 120 provided with 101 and FIG. 15.
- FIG. 15 shows the entire system configuration of the service system 380 of the present embodiment.
- the service system 380 connects each factory to which the component mounting machine with the component mounting system 120 is delivered with the service receiving device 1 of the customer by a network 3, and the service receiving device 1 and the component are connected.
- An example of a case in which the service supply device 2 for mounting machine supply is connected via a network 60 will be described.
- the service supply device 2 has a service information database 26 (hereinafter referred to as a service information DB).
- services received at the destination company Device 1 fetches service information from service supply device 2 at the component mounter supplier via network 60, and uses the received service information to send information to factories A, B, C, etc. under the umbrella of the destination company A service is provided to the component mounting lines 100a, 100b, and 100c of the factory via the management device 101.
- the network 60 may be any communication means capable of performing communication including, for example, the Internet.
- the Internet connection is preferred because it can transmit and receive information at a high speed.
- the network 3 may be a similar communication means, but in the present embodiment, it is assumed to be an intranet connecting global bases in the company.
- each factory A, B, and C of the customer company is assumed to be located at each global base, but is not limited thereto, and may be all domestic.
- the service supply device 2 may be a device other than the component mounter supplier and installed in a service provider that provides services for the component mounter.
- the same service can be supplied to the user in any region of the world via the network 60 to the service receiving device 1 provided on the user side.
- the service receiving device 1 provided on the user side.
- we can provide services that accumulate know-how on how to mount components depending on the type of circuit board and mounted components. It can realize uniform high-efficiency, high-quality mounting production worldwide.
- the service can be independently pulled out from the user side, the service can be pulled out at any time at the time required by the user side, and the efficiency and quality of mounting production can be maintained for each user. There is no damage due to delays in taking action.
- the content of the disclosure of the service that the service receiving device 1 draws from the service supplying device 2 varies depending on the level at which the delivery destination company has contracted with a component mounting machine supply manufacturer. If the contract level is low, it is possible to disclose and extract only the latest instruction manual information and repair inventory information, but as the contract level increases, the scope of disclosure will be extended via a network to virtual training and implementation Component information, mounting order optimization Software and spread sequentially. As a result, it is possible to provide appropriate services that match the user level. In addition, it is possible to easily manage services to be provided for each user, and it is not necessary for users who have not contracted to withdraw services unnecessarily.
- the service receiving device 1 and the operator can interact with each other interactively, or the service receiving device 1 or the service supplying device 2 can automatically determine and determine an appropriate contract level. .
- the delivery user is charged based on this contract level.
- Billing is performed periodically, for example, on a monthly basis.
- charging is performed at once according to the level of the service contract, for example, on a monthly basis. This simplifies charging processes for both users and manufacturers. it can.
- the service providing apparatus 2 of the component mounting apparatus manufacturing supplier of components mounted through the net Wa Ichiku 6 0 A service that monitors the quality and operation status of the line 100, and a service that provides feedback to the component mounting line 100 for countermeasures when an abnormality occurs during monitoring, is also possible.
- Equipment information such as the operation rate, stop time, and type change time of the component mounter 105 to 111
- tact information such as mounting time and tact loss, which is the time for mounting on one circuit board, and further, poor quality Quality information such as presence / absence and content of defects is collected in the management device 101.
- the service receiving device 1 of the company to which the mounting machine is delivered is connected to the service receiving device 1 via network 3.c
- the equipment information, tact information, and quality information collected by the management devices 101 a to 101 c are collected by the service receiving device 1, and further supplied to the service of the component mounting machine supplier via the network 60.
- These equipment information, sunset information and quality information are converted into a data structure that is easy to analyze for operation, and the operation quality information database 51 provided in the service supply device 2 (hereinafter referred to as the operation quality information DB) ).
- the service supply device 2 monitors whether the operation rate, the mounting time, and the defect rate have reached the targets, and performs the factor analysis if the targets have not been reached. As a result of the factor analysis, if a factor that does not reach the target is found, a service for eliminating the factor is provided to the service receiving device 1.
- the service receiving device 1 feeds back the provided service to the component mounting lines 100a to 100c via the management devices 101a to 101c at each site.
- the user can monitor the production status and, if there is a problem, analyze the problem at any time. As a result, if there is a sign before a trap occurs, it can be sensed and a trouble can be prevented before it occurs, so that stable high-efficiency and high-quality production can be continued.
- the network 102 is a LAN (Local Area Network) for exchanging information wirelessly (hereinafter, referred to as a wireless LAN), but is not limited to this.
- a wireless LAN Local Area Network
- the service information extracted can be transmitted not only to the component mounter 151, but also to mobile terminals such as mobile phones and PHSs carried by the operator of the component mounter 151.
- the operation of the component mounter 15 1 can be directly reflected in the production of the received service.
- the service supply device 2 can provide the required service to the customer factory according to the contract level desired by the customer.
- the operation and quality of each mounting factory can be provided by the service supply device 2.
- the situation can be monitored and analyzed simultaneously in real time. Then, it is possible to discover the factors that lower the operation and quality conditions, and provide a service to eliminate the factors in real time. Therefore, the operation and quality status of all mounting factories deployed globally can be managed by the same method, and high uniform quality and production status can be maintained.
- a service supply device 2 may be provided at a specific factory among the factories that perform mounting production, and a service may be provided to other factories via a network such as an Internet connection.
- one management device 101 was provided for one component mounting line 1 ⁇ 0, this is not a limitation, and one management device 101 is provided for a plurality of component mounting lines 100. May be used. Also, one management device 101 may be provided for only one component mounter.
- each of the component mounters is provided with the above-mentioned service receiving device 1 as an internal function in the control unit 201, and the component mounter itself is connected to the network 6.
- the service from the service supply device 2 may be received via the “0” according to the contract level.
- the component mounting line 100 composed of the component mounters 151 has been described, but this is not a limitation. Other than component mounting, it may be a single production facility that processes or assembles a product, or may be a production line that connects the production facilities.
- the component mounting system 120 is a production system for mounting and manufacturing a circuit board by mounting components on a circuit board on which no components are mounted. As shown in FIG. It is composed of a wireless LAN 102 as a network and a component mounting line 100. Component mounting line 100, supply device 104, cream solder printing machine 105, cream solder printing inspection machine 106, adhesive application machine 107, high-speed mounting machine 108a, multifunctional mounting It consists of a machine 108b, a mounted part inspection machine 109, a reflow device 110, a visual inspection machine 111, and a storage device 112.
- the reflow device 110 and the appearance inspection device 111 are connected to the management device 101 via the wireless LAN 102, respectively.
- the high-speed placement machine 108a and the multi-function placement machine 108b are one type of component mounters, which mount chip components on a circuit board by surface mounting. Also called.
- the component mounter also includes a component inserter that inserts a lead of a component such as an axial component or a radial component into a lead insertion hole on a circuit board.
- the parts importer is also called the "Insatsu", and sometimes a jumper is installed.
- cream solder printing machine 105, cream solder printing inspection machine 106, adhesive application machine 107, mounting part inspection machine 109, reflow device 110 constituting the component mounting line 100 0, visual inspection machine 1 1 1 etc. are also component mounting machines in a broad sense.
- cream solder printing machines are used unless otherwise specified.
- cream solder printing inspection machine 106 adhesive application machine 107, mounted component inspection machine 109, reflow device 110, visual inspection machine 111, etc. are also included in the component mounting machine and
- “mounting” refers to surface mounting of a chip component including diffusion and melting by friction or the like using ultrasonic waves between electrode lands on a circuit board, where metal bonding is performed.
- idioms that include “mounting” as well as “mounting” used hereinafter in the present embodiment are defined as being included in “mounting” that forms a circuit by mounting on a circuit board. This means that the above-mentioned chip component is surface-mounted.
- “implementation” also means idioms that include “implementation”, and its meaning is not limited to “wearing”, unless otherwise specified.
- mounting tact The time required for the component mounter to mount one circuit board is defined as “mounting tact”.
- mounting tact the standard value of the mounting tact when operating as specified in the component mounting machine without loss is ⁇ standard mounting tact '', and the results of mounting tact detected or collected from the component mounting machine The value is called the actual value
- the supply device 104 stores a plurality of circuit boards in advance. No components are mounted on these circuit boards yet. The supply device 104 supplies one circuit board to the cream solder printing machine 105.
- the cream solder printing machine 105 receives the circuit boards one by one from the supply device 104, prints the cream solder on the received circuit boards, and prints the circuit board on which the cream solder is printed with a cream solder printing inspection machine. Supply to 106. Also, it outputs equipment information and the like relating to cream solder printing to the management device 101 via the wireless LAN 102. In addition, the NC device for instructing various conditions for printing by the cream solder printing machine 105 is used. —Even if you can install it from the management device 101 via the wireless LAN 102
- the cream solder printing machine 105 has a stage 67 on which the circuit board 10 is mounted, and a circuit that covers the circuit board 10.
- a screen plate 66 having an opening (not shown) in a shape and position corresponding to a land on the substrate 10, and a squeegee 62 held by a squeegee head 64 on the screen plate 66. a.
- the squeegee 62 a is driven by the squeegee driving unit 65 via the squeegee head 64 and moved along the screen plate 66 in the direction of the arrow in the figure.
- the squeegee 6 2a moves while pressing the cream solder 68 supplied on the screen plate 66 to the screen plate 66, and moves on the land of the circuit board 10 through the opening provided in the screen plate 66. And print it.
- the squeegee head 6 4 now also holds one squeegee 6 2b and can print when it is moved in the opposite direction as when printing with the squeegee 62 a.
- the cream solder printing machine 105 in order to maintain the quality, it is necessary to set in accordance with the NC data in consideration of various conditions for cream solder printing. For example, it is necessary to select the type, temperature, and viscosity of the cream solder in consideration of the material of the circuit board, the mounting density, and the like. Also, depending on the type of the circuit board 1 0 type and the cream solder 6 8, by also selecting accurately c above conditions it is necessary to set the moving speed of the squeegee 6 2 a, 6 2 b, chestnut Ichimu Solder can be spread well on the land of the circuit board 10 through the opening of the screen plate 66, and printing defects such as blurring or bleeding of cream solder can be prevented.
- the mounting time in the cream solder printing machine 105 includes the loading and unloading time of the circuit board 10 (loading time), the time for attaching and detaching the screen board 66 to and from the circuit board 10, and the squeegee 62 a , 62b.
- the cream solder printing inspection machine 106 receives the circuit boards 10 one by one from the cream solder printing machine 105 and inspects the state of the cream solder 68 printed on the received circuit board 10,
- the inspected circuit board 10 is supplied to the adhesive applicator 107. Also, it outputs equipment information and inspection result information related to the cream solder printing inspection to the management device 101 via the wireless LAN 102.
- the cream solder printing inspection machine 106 can install an NC data and the like for instructing an inspection data for the inspection from the management device 101 via the wireless LAN 102.
- the inspection data includes a land position where the cream solder 68 is printed, a threshold value of the inspection OK / NG, and the like.
- the cream solder printing inspection machine 106 captures an image of the circuit board on which the cream solder 68 has been printed, processes the obtained image, and determines whether the printing of the cream solder 68 has been performed normally. . If it is determined that the printing is defective, it outputs the location on the board and the type of defect that has occurred. Examples of defective contents include misalignment of printing position of cream solder 68, blurring of cream solder 68, bleeding and overflow.
- the location on the board is specified by, for example, a circuit number assigned to each component to be mounted and an electrode number assigned to each electrode of each mounted component.
- the mounting time of the cream solder printing inspection machine 106 is the loading and unloading time (loading time) of the circuit board 10, the time to image the circuit board 1, and the image data of the circuit board 10. Is determined by the time for processing and inspection.
- the adhesive application machine 107 receives the circuit boards one by one from the cream solder printing inspection machine 106, applies the adhesive for mounting the components to the board on the received circuit board 10,
- the circuit board 10 to which the adhesive has been applied is supplied to the high-speed mounting machine 108a. Also, it outputs equipment information and the like regarding the application of the adhesive to the management device 101 via the wireless LAN 102.
- NC data and the like indicating the position where the adhesive coating machine 107 applies the adhesive and various conditions for applying the adhesive are installed from the management device 101 via the wireless LAN 102. It is possible.
- the adhesive application machine 107 includes a syringe storing the adhesive, an application nozzle connected to a syringe for applying the adhesive extruded from the syringe by air pressure, and a circuit board below the application nozzle. And an XY table for positioning the application position.
- an adhesive applicator 107 in order to maintain the quality, it is necessary to set the condition based on the NC data in consideration of various conditions for applying the adhesive. For example, by appropriately controlling the type of adhesive, temperature, viscosity, application pressure, application time, etc., it is possible to apply an appropriate amount of adhesive for bonding components without stringing. is important. Also, by controlling the above conditions, it is necessary to prevent nozzle clogging.
- the mounting tact time of the adhesive applicator 107 is the time required to apply the adhesive to one circuit board, and the loading and unloading time of the circuit board 10 (opening time). And the time for applying the adhesive to all application points corresponding to the mounting position of each component.
- the mounting time is limited to the application of the adhesive, and is also referred to as “application time”.
- the standard mounting time is limited to the application of the adhesive, and is also referred to as the “standard application time”.
- the actual mounting value is limited to the application of the adhesive, and is also referred to as the “applying value”.
- the excess of that evening is called “evening loss”.
- the breakdown of evening loss is, for example, the movement loss of the XY table 9.
- the standard application time per application point is defined as “standard application time per point”
- the application time per application point is defined as “application time per point”
- the tact loss per application point is defined as “ Tact loss ".
- High-speed mounting machine 1 08a The high-speed placement machine 1 08a received the circuit boards 10 one by one from the adhesive applicator 107, mounted the components on the received circuit board 10 at a high speed, and mounted the components.
- the circuit board 10 is supplied to the multi-function mounting machine 108b. Also, it outputs equipment information and the like regarding the mounting of parts to the management device 101 via the wireless LAN 102. Further, it is possible to install NC data or the like indicating the position at which the component is to be mounted and various conditions for mounting the component from the management device 101 via the wireless LAN 102.
- the high-speed placement machine 1 08a and the multi-function placement machine 1 08b are each a type of placement machine that places components on the circuit board 10 and are common to each other. However, the same reference numerals are used, and overlapping descriptions are omitted.
- the high-speed placement machine 108a is mainly intended for placing small chip components on the circuit board 10 at high speed
- the multi-function placement machine 108b is designed for many types of The purpose is to mount chip components on the circuit board 10, which is common in that components are mounted on the circuit board 10.
- the high-speed placement machine 108a has a component supply unit 11 in which a plurality of component supply devices 5 for supplying components are mounted on a moving table 6, a circuit board 10, and an XY An XY table 9 for moving and positioning in the direction for mounting components, a rotating table 8 that rotates intermittently, and a component suction nozzle 7 arranged at a constant pitch on the outer periphery of the rotating table 8 And a mounting head 4 for mounting a component supplied from the IC card at a predetermined position on the circuit board 10 positioned.
- a component storage tape in which a plurality of component storage tapes each storing a plurality of components of the same type with a fixed pitch are mounted is mounted.
- the parts supply unit 11 supplies parts one by one by intermittently feeding the parts in units of the parts storage pitch.
- the parts supply unit 11 mounts the necessary number of parts supply devices 5 on the moving table 6 according to the type of the parts to be mounted.
- the moving table 6 moves in the direction indicated by the arrow 12 and positions the component supply device 5 that can supply the component to be mounted so as to match the component supply position.
- the mounting head 4 sucks the component supplied from the component supply device 5 by the component suction nozzle 7 at the position where the component is taken out from the component supply device 5 positioned at the component supply position.
- the rotating tape 8 rotates intermittently in the direction of arrow 13 in units of the arrangement pitch of the component suction nozzles 7.
- the component suction nozzle 7 that has picked up the component comes to a position on the outer periphery of the turntable 8 opposite to the position where the component is sucked due to the sequential intermittent rotation of the turntable 8, the component suction nozzle 7 is placed on the circuit board 10. Attach the component to the attachment position.
- the XY table 9 positions the circuit board 10 in accordance with the mounting position of the component to be mounted by the component suction nozzle 7.
- the component supply unit 11, the XY table 9, the mounting head 4, and the like are controlled by the control unit 201.
- the rotation of the component suction nozzle 7 during the movement from the position where the component is removed from the component supply device 5 to the position where the component is mounted on the circuit board 10 is performed. Equipped with a recognition unit that recognizes the sucked component from below at the stop position and detects the suction position deviation (deviation in the X and Y directions, rotation rotation amount around the axis of the component suction nozzle 7). .
- the control unit 201 corrects the rotation of the component suction nozzle 7 about its axis so as to eliminate the rotational deviation detected by the recognition unit, and also eliminates the deviation in the X and Y directions detected by the recognition device. Control to correct the positioning amount of the XY table 9 as described above.
- the component supply device 5 is not limited to the tape feed type described above, but also includes a tray stick type, for example.
- the tape feed type described above is also called a parts cassette or a paper feeder.
- the placement head 4 is provided with the component suction nozzle 7, and the component suction nozzle 7 holds the component by suction.
- the holding chuck may be used.
- a chuck for holding and holding a component is often used.
- most chucks are used in component insertion machines.
- the mounting speed specifically, the rotation speed of the rotary table 8 and the moving speed and acceleration of the XY table 9 depending on the type, size, weight, and the like of the component. If a heavy component is to be mounted at high speed, the suction position shifts due to the inertia force of the component, resulting in a position shift of the component mounting or a drop in the component from the component suction nozzle 7, etc. Leads to.
- the recognition unit in order for the recognition unit to recognize the amount of misalignment of a component, it is necessary to teach in advance a recognition process that is an image of a normal component posture without a misalignment. It is necessary to select in advance which recognition algorithm should be used for image processing.
- the component supply device 5 or the component suction nozzle 7 becomes defective, a component suction error occurs and the operating rate of the mounting machine decreases, so that the defective component supply device 5 or component suction nozzle
- the mounting tact time of the high-speed mounting machine 108a is the time required to mount components on one circuit board, and the loading and unloading time (loading time) of the circuit board 10 and all components. Is determined by the time for mounting at the mounting position.
- the mounting time is limited to component mounting and is also called “mounting time”
- the standard mounting time is limited to component mounting and is also called “standard mounting time”.
- the actual mounting sunset value is limited to component mounting, and is also referred to as the “mounting evening actual value”.
- the excess of the tact is referred to as “dusk loss”.
- the breakdown of the evening loss includes, for example, the movement loss of the XY table 9 and the movement loss of the parts supply unit 11.
- the standard mounting tact per mounting point is ⁇ standard mounting tact per point
- '' the mounting takt per mounting point is ⁇ per mounting tact per point
- '' and the tact loss per mounting point is Tact loss ".
- the component is to be mounted at the high speed that is the original purpose, that is, the component is mounted by the standard mounting tact, which is a standard mounting task.
- the standard mounting tact which is a standard mounting task.
- it is necessary to optimize the order of mounting the components and the arrangement position of the component supply device 5 on the moving table 6. For example, rotating tape of mounting head 4
- the time required for one pitch of rotation of the le 8 corresponds to one point of the standard installation, but if the component supply device 5 is not positioned at the component supply position during that one point of the standard mounting tact, one point of the standard installation Can not mount parts.
- the XY template 9 positions the circuit board 10 at the component mounting position during the one-point standard mounting tact, components cannot be mounted with the one-point standard mounting tact.
- an allowable movement range that can be moved within one point of the standard mounting tact is determined.
- the component mounting order and the arrangement of the component supply devices 5 are optimized so that both the movement of the component supply device 5 and the movement of the XY table 9 fall within this allowable movement range.
- the tact loss is calculated based on the amount of movement of the component supply device 5 exceeding the allowable movement range and the time calculated based on the amount of movement of the XY table 9 exceeding the allowable movement range. Theoretically, it can be obtained by calculating the larger time.
- two mounting machines that is, a high-speed mounting machine 108a and a multi-function mounting machine 108b
- Machines may be connected in series.
- the component mounting line 100 it is assumed that a plurality of mounting machines are connected in series, and the n-th mounting machine among the plurality of mounting machines is connected to the mounting machine n108. And Hereinafter, the placement machine n 108 will be described in place of the description of the high-speed placement machine 108 a.
- control unit 201 As shown in Fig. 19, the control system of the mounting machine n 10 08 is as follows: control unit 201, mounting control unit 202, mounting unit 203, storage unit 204, recognition unit 210, transmission / reception It comprises a unit 205, an input unit 206, a screen control unit 207, and a display unit 208.
- the mounting portion 203 corresponds to the component supply portion 11, the XY tape 9 and the mounting head 4 shown in FIG. 18A in the high-speed mounting machine 108a.
- the transmission / reception unit 205 transmits and receives data to and from the management apparatus 101.
- the transmission / reception unit 205 includes an antenna capable of transmitting and receiving data via the wireless LAN 102.
- the present invention is not limited to this, and a network adapter connected by a cable may be used.
- the storage unit 204 stores the equipment information 211 shown in FIG. 22 and the NC data 220 shown in FIG. 23 and control software necessary for the control unit to control the mounting machine n 108. I remember.
- the equipment information 211 includes production management information and cassette information (part supply device 5, that is, information related to a per-cassette).
- the production management information includes information such as the number of sheets to be produced, the number of circuits to be produced, the number of sheets to be produced, the operation rate, the suction rate, and the like, and the cassette information indicates the arrangement position of the component supply device 5. It contains information such as the ZNO. Number, the part name, and the number of remaining parts in the part supply device 5.
- the number of products produced is the number of circuit boards produced by the mounting machine n 108
- the operating rate is a ratio of the mounting and mounting time of the components on the circuit board of the mounting machine n 108 to the total operating time.
- the suction rate is a ratio of the actual suction number of components by the component suction nozzle 7 in the mounting machine nl08 to the total suction number.
- the NC data 222 includes an NC program 221, an array program 231, and a part library 241.
- the NC program 222 is a program for the mounting machine n108 to specify the type and position of components to be mounted and the mounting order on one circuit board. Specifically, as shown in FIG. 23, step No. is the component mounting order, and for each step No., the mounting position (X, Y, W (mounting angle), circuit number), Z ( The arrangement number of the part supply device 5 for extracting parts) and the part name are specified.
- the array program 2 31 corresponds to the NC program 2 21, and the component name and shape code set in the component supply device 5 with the Z number specified in each step No. of the NC program 2 21 Is specified.
- the shape code is a code uniquely assigned to a component having the same shape.
- the part library 2 41 consists of detailed data on each part.
- the part arrangement program (length, width, thickness, etc.), mounting conditions (head speed, Information such as the XY speed, nozzle, and pen, etc., and recognition data (not shown in Fig. 23 but included in the component library) are stored.
- the head speed is the speed at which the mounting head 4 rotates intermittently in the example of the high-speed mounting machine 108a of FIG. 18A, and can be specified (for each shape code) according to the size of the component. .
- a small chip component such as a 105 chip component (1 mm long and 0.5 mm wide) can rotate the mounting head 4 at a high speed, but a large component such as an SOP component has a low speed. If it does not rotate, the sucked parts will shift the suction position due to inertia.
- the XY speed is the moving speed of the XY table 9, and the nozzle is the type of the component suction nozzle 7 to be used, and can be designated for each shape code.
- the recognition data teaches a posture that should be in advance for the recognition unit 210 to recognize the posture in which the component suction nozzle 7 has suctioned the component.
- the control software is necessary for controlling the placement machine n108, and the control unit 201 controls the placement machine n108 according to the control software read out from the storage unit 204. .
- the control unit 201 transmits control software to the mounting control unit 202 so that the mounting unit 203 is controlled.
- the NC data 220 and control software can be installed from the management device 101 via the transmission / reception unit 205.
- the mounting control unit 202 reads out the NC data 220 from the storage unit 204 according to the instruction of the control unit 201, and sequentially mounts the components as instructed by the NC data 220.
- the mounting section 203 is controlled. In addition, it receives information of a result of mounting from the mounting unit 203 and updates each information included in the equipment information 211 stored in the storage unit 204.
- the basic operation of the mounting section 203 that is, the intermittent rotation and the component mounting operation of the mounting head 4, the moving operation of the component supply section 11, and the positioning operation of the XY table 9 are controlled in accordance with the control software.
- the transmission / reception unit 205 Upon receiving the request to upload the equipment information 211 or the NC data 220 from the management apparatus 101, the transmission / reception unit 205 outputs the received request to the control unit 201. According to an instruction from the control unit 201, the equipment information 211 or NC data 220 stored in the storage unit 204 is read and transmitted to the management device 101.
- the transmitting / receiving unit 205 receives the newly created NC data 220 from the management device 101 or the once uploaded and re-optimized NC data 220 and receives the received NC data 200 20 is stored in the storage unit 204 in accordance with an instruction from the control unit 201.
- the transmission / reception unit 205 receives the control software from the management device 101 and stores the control software in the storage unit 204.
- the suctioned part is recognized by a force sensor from below and the suction position shift (the amount of shift in the X and Y directions, the part around the axis of the part suction nozzle 7). Rotation error).
- the control unit 210 corrects the rotation of the component suction nozzle 7 about its axis so as to eliminate the rotational deviation detected by the recognition unit 210, and also detects the X, Y detected by the recognition unit 210. Control is performed so that the positioning amount of the XY table 9 is corrected so as to eliminate the deviation amount in the direction.
- the recognition data (included in the NC data 220) taught in advance is stored in the storage unit 204.
- the recognition data and the pre-designated recognition algorithm (included in the control software) are read from the storage unit 204 to perform the recognition process.
- the control unit 201 controls each part of the mounting machine, and uploads the equipment information 211, NC data 220, and downloads NC data 220 as described above. In addition, instructions are given to the mounting control unit 202, the transmitting and receiving unit 205, and the like, and controlled.
- control unit 201 receives an instruction command from the operation unit 206 from the input unit 206 and performs processing according to the received instruction command. Also, it outputs an instruction and a display content relating to the screen display to the screen control unit 207.
- the k-th component mounter among the component mounters in which a plurality of component mounters including the mounting machine are connected is referred to as a component mounter k.
- the component mounter k is broader than the mounting machine nl08, and, of course, the mounting machine n108 is included in the component mounter k.
- the configuration of the control system of the component mounter k is the same as the configuration of the control system of the mounting machine n108.
- a control unit 201, a storage unit 204, a recognition unit 210, a transmission / reception unit 205, an input unit 206, a screen control unit 207, and a display unit 208 are provided.
- an operation control unit that corresponds to the mounting control unit 202 of the mounting machine nl08 and controls the original operation of the component mounting machine k is provided.
- the operation control unit controls, for example, an operation of inserting a component into a circuit board in the case of a component insertion machine, and an operation of printing cream solder on a circuit board in the case of a cream solder printing machine 105.
- the storage unit 204 stores equipment information 211 similar to that shown in FIG. 22, NC data 220 similar to that shown in FIG. 23, and a control unit 201 controls the component mounter k. It stores the control software required for this.
- the equipment information 211 is a common item in the type of the component mounting machine k from the top to the operation rate in the production management information of FIG.
- Other production management information and cassette information can be applied as they are in the part insertion machine, but cream solder printing machine 105, adhesive
- the applicator 107, the reflow device 110, or various types of inspection machines have specific information.
- the NC library 220 is almost common to the various component mounters k for the component library 241.
- the NC program 221 and the array program 231 can be applied as they are to the component insertion machine.
- the NC program 222 can be applied to the adhesive application machine 107 and various inspection machines as it is.
- the transmission / reception unit 205 performs transmission / reception to / from the management apparatus 101.
- the transmission / reception unit 205 includes an antenna capable of transmitting / receiving via the wireless LAN 102.
- the present invention is not limited to this, and may be a network connected by a cable.
- the multi-function placement machine 108b receives the circuit boards 10 one by one from the high-speed placement machine 108a, mounts the components on the received circuit board 10, and mounts the components on the circuit board. 10 is supplied to the mounted component inspection machine 109. In addition, it outputs equipment information and the like relating to component mounting to the management device 101 via the wireless LAN 102. In addition, NC data 220 indicating the position at which the component is mounted and various conditions for mounting the component can be installed from the management device 101 via the wireless LAN 102.
- the multi-function mounting machine 108 b mounts many types of chip components including odd-shaped components on the circuit board 10.
- Figure 18B shows the configuration of the multi-function mounting machine 108b.
- reference numeral 5 denotes a component supply device of a tray type. Although only one tray is shown in the figure for simplicity, multiple trays are actually stored in the tray storage device according to the type of parts, and the necessary trays are pulled out to supply the parts.
- the multi-function mounting machine can also mount a part cassette as used in FIG. 18A as the component supply device 5.
- 10 is a circuit board, which is fixed at a predetermined position. 4 is the mounting head In the example of FIG. 18B, two are provided.
- Reference numeral 7 denotes a component suction nozzle, which is provided in the mounting head 4.
- Reference numeral 14 denotes an XY robot that positions the component suction nozzle 7 at the component suction position of the component supply device 5 and the mounting position of the circuit board 10 and moves between them.
- Reference numeral 15 denotes a component that is sucked by the component suction nozzle 7 and mounted on the circuit board 10.
- Reference numeral 201 denotes a control unit that controls the XY robot 14 and the like.
- the multi-function mounting machine 108b includes a recognition unit 210 that recognizes the component 15 sucked by the component suction nozzle 7 from below with a force camera and detects a suction position shift.
- the drive 4 drives the XY robot 14 to suck the component 15 from the component supply device 5 and then moves to the recognition unit 210. Therefore, the recognition unit 210 recognizes the component 15 and detects a suction deviation. After that, by driving the XY robot 14, the mounting head 4 is moved to the mounting position after correcting so as to eliminate the suction displacement detected by the recognition unit 210, and mounts the component 15.
- the mounting time in the multi-function mounting machine 108b is the time required to mount components on one circuit board, and the loading and unloading time (loading time) of the circuit board 10 and the It is determined by the time for mounting all components to the mounting position.
- the mounting tact is limited to component mounting, also called “mounting tact”
- the standard mounting tact is limited to component mounting, also called “standard mounting tact”.
- the actual mounting sunset value is limited to component mounting, and is also referred to as “mounting evening actual value”.
- the excess of that evening is called “evening loss”.
- the breakdown of the evening loss includes, for example, a movement loss of the mounting head 4 and a replacement time of the component suction nozzle 7.
- the standard installation time per mounting point is defined as “1
- the mounting tact time is called “1 point per tact” and the tact loss per mounting point is “1 point per tact”.
- the mounting head 4 moves to the component supply device 5, moves to the mounting position after sucking the component 1 It is determined by the moving distance of the cycle. If this movement distance is within the specified range, it can be mounted with one point per standard mounting tact, but if it exceeds the predetermined range, it cannot be mounted with one point per standard mounting tact, and one point including tact loss This is the mounting contact. Therefore, in the case of a multi-function placement machine, the point of optimization is to minimize the distance between the placement position and the position of the component supply device 5 in the components to be mounted. In addition, as shown in FIG.
- the configuration of the control system of the multi-function mounting machine 108 b is the same as that of the mounting machine n 108 described above, and therefore, the description thereof is omitted.
- the mounting component inspection machine 109 receives the circuit boards 10 one by one from the multi-function mounting machine 108b, inspects the received components on the circuit board 10 for missing or misaligned components, and ends the inspection.
- the supplied circuit board 10 is supplied to the reflow device 110.
- it outputs equipment information and inspection result information related to the inspection of the mounted parts to the management apparatus 101 via the wireless LAN 102.
- the NC data 222 indicating the inspection data to be inspected by the mounted component inspection machine 109 can be installed from the management device 101 via the wireless LAN 102.
- the inspection data includes the component mounting position, the threshold value of the inspection OKZNG, and the like.
- the output contents of the mounted component inspection machine 109 are the determination result of whether or not each component has been mounted normally, and the identification of the position of the component determined to be defectively mounted and the content of the defect.
- the position of the component is specified by, for example, a circuit number assigned to each component to be mounted.
- the mounting tact time of the mounted component inspection machine 109 includes a time for loading and unloading the circuit board 10 (a mouthing time), a time for capturing the circuit board 10, and an image for capturing the circuit board 10. It depends on the time to process and inspect the data.
- the reflow device 110 receives the circuit boards 10 one by one from the mounted component inspection machine 109 and melts the cream solder with respect to the received circuit board 10 so that the electrodes of the components and the circuit board 10 are placed on the circuit board 10. Solder with the land. Then, the soldered circuit board 10 is supplied to the visual inspection device 111. Also, it outputs equipment information and the like relating to reflow to the management device 101 via the wireless LAN 102. In addition, the control device 101 can send information such as the NC profile 220 (including the temperature profile) for instructing various conditions for soldering by the riff opening device 110 from the management device 101 to the wireless LAN 100. Installation via 2 is possible.
- the reflow device 110 transports the circuit board 10 to be soldered in a riff opening furnace, melts the cream solder, and solders the electrodes of the components to the lands on the circuit board 10. is there.
- a reflow device 110 in order to maintain the quality, it is necessary to consider various conditions for performing the soldering of the riff opening.
- the temperature profile in the reflow furnace must be appropriately set according to the type of the circuit board 10, the type of mounted components, the type of cream solder, and the like.
- the mounting time in the reflow device 110 is determined by the time for transporting the circuit board 10 through the riff opening device 110 and the like.
- the visual inspection machine 1 1 1 receives the circuit boards 10 one by one from the reflow device 1 10, and displays the soldering state, component mounting state, etc. of the received circuit board 10. Examined, the management circuit board 1 0 non-defective finished the examination supplied to the storage device 1 1 2 c Also, the facility information 2 1 1 and test results relating to the appearance inspection information or the like via the wireless LAN 1 0 2 Output to device 101.
- NC data 220 and the like for instructing the inspection data to be inspected by the visual inspection machine 111 can be installed from the management device 101 via the wireless LAN 102.
- the inspection data includes a component mounting position, an inspection OK / NG threshold, and the like.
- the output contents of the visual inspection machine 1 1 1 are the result of judgment whether each part was soldered normally, the identification of the position of the component and the electrode judged as the soldering failure, and the identification of the position of the defective part.
- the circuit number is assigned to each component to be mounted, and the position of the electrode is specified by the electrode number assigned to each electrode of the component.
- the storage device 112 receives the circuit boards one by one from the visual inspection machine 111, and stores the received circuit boards 110.
- the management device 101 includes a transmission / reception unit 401 on the component mounter, a transmission / reception unit 400 on the service receiving device, a control unit 402, a data storage unit 403, It comprises an input section 404 and a display section 405.
- the component mounter-side transmitting / receiving section 401 has an antenna so as to be able to transmit and receive to and from each component mounter k via the wireless LAN 102.
- the service receiving device side transmitting / receiving section 406 can transmit and receive to and from the service receiving device 1 via the network 3.
- the storage unit 400 stores the equipment information 2 11 of each component mounting machine k, the inspection result information 2 12 of each inspection machine, and the mounting tact of each component mounting machine k.
- Information 2 1 3 The NC data of each component mounter k 220, service data 215, service program 216, and delivery result information 217 are stored.
- the equipment information 2 1 1, the inspection result information 2 1 2, and the mounting tact information 2 1 3 are performance information uploaded from each component mounter k, and are stored for each component mounter k.
- the NC data 220 is for downloading to each component mounter k or uploaded from each component mounter k, and is stored for each component mounter k.
- the service data 2 15 and the service program 2 16 are specific contents of the service information extracted from the service supply device 2 by the service reception device 1 and transmitted from the service reception device 1. Things are stored.
- the service data 215 includes business information, instruction information, maintenance information, and the like, and is a service for providing services to users of various component mounting machines.
- the service program 216 includes virtual training software, optimization software, and the like, and provides services by executing the service program 216.
- the delivery result information 217 shows the delivery results of the component mounting machines, and includes, for example, the delivered models, the number of the delivered machines, and the like.
- the delivery result information 217 is collected by the service supply device 2 via the service receiving device, and is used to provide the service program 215 and the service program 216.
- the component mounter-side transmitting / receiving section 401 receives the equipment information 211 and the upload instruction of NC data 220 from the control section 402, all the transmission / reception sections 401 via the wireless LAN 102
- the equipment information 211 and NC data 220 are uploaded to the component mounter k, and the received equipment information 211 and NC data 220 are stored in the data storage section 4003.
- the component mounter-side transmitting / receiving section 401 receives the NC data 220 to be downloaded from the control section 402 to the component mounter k, and sends the component mounter via the wireless LAN 102. Send to k.
- the transmission / reception section 406 on the service receiving device side receives equipment information 2 1 1, inspection result information 2 1 2, mounting tact information 2 1 3, delivery result information 2 1 7 and Sends NC data 220 to the service receiving device 1.
- the service receiving device side transmitting / receiving section 406 receives the NC data 220, the service data 215 and the service program 216 downloaded from the service receiving device 1.
- the control unit 402 automatically determines the timing to upload the equipment information 211, inspection result information 212, and NC data 220, or transmits / receives data to the component mounter based on the operator's judgment. Instruct the part 401 to upload the equipment information 211, inspection result information 212 and NC data 220. Then, equipment information 211, inspection result information 212 and NC data 220 for each component mounter k are received from the component mounter side transmitting / receiving section 401 and stored in the data storage section 4003. It is stored for each component mounter k. (The timing for automatically uploading the equipment information 211 is set to a regular period, for example, once every 10 minutes. NC Upload of data 220 can also be sent by specifying a specific component mounter k.
- control unit 402 automatically determines the timing, or reads out the NC data 220 of each component mounting machine k stored in the data storage unit 4003 by the judgment of the operator.
- the readout NC data 220 of the component mounter k is output to the component mounter-side transmitting / receiving section 401 to download.
- the timing at which the NC data 220 is automatically downloaded is, for example, before the start of production of a circuit board of that type.
- control unit 402 automatically determines the timing or calculates the actual mounting tact value based on the judgment of the operator.
- the actual mounting tact value is included in the mounting tact information 2 13 and each component mounter k takes one circuit board to produce. It is the actual time. In particular, in the case of the high-speed placement machine 108a and the multi-function placement machine 108b, it is the actual time required to place components on one circuit board.
- the equipment information 2 1 1 uploaded at regular intervals described above is used.
- the divided value becomes the actual value of the mounting event.
- an average of the values obtained several times in the actual value of the mounting tact is output as the actual value of the mounting tact.
- the control unit 402 writes and updates the mounting tact actual value calculated as described above in the area of the mounting tact information 213 of the data storage unit 403.
- the timing for automatically calculating the actual value of the mounting event is, for example, when the production of a circuit board of the type starts.
- the actual mounting tact value has been introduced in the management device 101 based on the equipment information 211 collected from the component mounting machine k, this is not limited to this.
- the time for mounting one circuit board is detected and stored as a mounting tact result value, and the mounting tact result value is associated with the equipment information 2 11 1 etc. It may be something that is up-closed.
- the control unit 402 receives the input from the input unit 404 by the operator, creates the delivery result information 217, and stores it in the data storage unit 403.
- the method of creating the delivery result information 217 is not limited to this.
- the control unit 402 receives an upload instruction from the service receiving device 1 via the service receiving device side transmitting / receiving unit 406, and receives the equipment information 211, inspection result information 2 from the data storage unit 4003. 1 2, mounting event information 2 1 3, delivery record information 2 1 7 and And the NC data 222 are read and transmitted to the service receiving device 1 via the service receiving device side transmitting / receiving section 406.
- control unit 402 is configured to transmit the NC data 220, the service data 210, and the service program 216 from the service receiving device 1 via the service receiving device transmitting / receiving unit 406. Receive downloads.
- control unit 402 receives an instruction command from the operator from the input unit 404, generates screen data based on the received instruction command, and transmits the generated screen data to the display unit 405. Output.
- the service receiving device 1 is installed at the component mounting machine delivery destination, and is a device that derives the provision of mounting-related services from the service supplying device 2 at the component mounting machine supplier through the network 60 such as the Internet. is there.
- the service receiving device 1 launches a WEB screen as a specific example of a selection screen as shown in Fig. 24 on the display unit 25, and presses a menu displayed on the WEB screen to select a service to be provided. You can choose.
- the service receiving device 1 retrieves and retrieves the corresponding service data and service program from the service information DB 26 of the service supplying device 2 for the service corresponding to the menu selected by the operator.
- the extracted service data 215 and service program 216 can be confirmed on the screen of the service receiving device 1, and can be transferred to the management device 101 of each factory.
- the content of the disclosure of the service that the service receiving device 1 draws from the service supplying device 2 varies depending on the level at which the delivery destination company has contracted with a component mounting machine supply manufacturer. As contract levels increase, the scope of disclosure extends to more advanced services.
- the contract level is It is desirable to decide according to the level of the operation of the component mounting machine k, or the difficulty of the mounting method used in production at the factory, and further according to the request of the customer.
- the contract level can be selected by selecting the “contract” menu on the WEB screen of the display unit 25 shown in FIG. 24.
- the contract is at the initial level, and only the menus of “sales information”, “electronic instruction manual” and “repair parts” can be selected.
- other menus indicated by broken lines cannot be selected unless the contract level is raised.
- New product information can be obtained. You can receive electronic files of catalogs and specifications for each type of component mounter k.
- repair packs such as the part cassette, which is the component supply device 5, or the component suction nozzle 7, to the factory where the component mounting machine is delivered.
- virtual training is performed by displaying the operation guide on the management device 101 or the display unit 208 of the component mounter k.
- virtual training software is transferred from the service supply device 2.
- the virtual training software can be transferred to the management device 101 of the relevant factory, and the virtual training software can be activated on the management device 101 of the relevant factory or the component mounter k to perform the training.
- start virtual training software on service receiving device 1. Training can also be performed remotely via network 3.
- each component mounter k can receive information on troubles that have occurred so far. In order to resolve the disclosed defect, it is possible to know, for example, whether it is necessary to replace the repair part or to upgrade the software, and how to deal with it.
- a service for purging up to the latest version of software that has solved software problems that occurred in the past can be provided. Even if it is not a malfunction, the latest version allows you to know, for example, how much the operability has improved, and allows you to know whether Purge Yonup is free or charged.
- Software is transferred. The latest version of the software is transferred to the management device 101 of the corresponding factory and installed on the corresponding component mounter k.
- the part library 24 1 can be provided in the NC Data Center 220. Service information of the service supply device 2
- the DB 26 stores a normal parts library 21 containing all parts that have been produced in good quality, and all of the parts library 24 1 or necessary parts It can be obtained for the specified range of mounter k, component type, etc. This allows even a novice operator to perform mounting production suitable for obtaining good quality according to the type of components and circuit boards used.
- Component mounting order and component supply unit 11 to reduce the mounting time in one mounting machine nl 08 Optimizing the arrangement of the component supply device 5 and multiple units that make up the component mounting line 100 Of the components to balance the mounting tact of the mounting machine n108 to each mounting machine n108, and the type switching time to replace the component supply device 5 when switching the type of production circuit board.
- NC data 220 such as creating a common component array to share the array of component supply devices 5 for shortening.
- This optimization software optimizes the NC data 220 uploaded from the component mounter k at each factory, and feeds back the optimized NC data 222 to the component mounter k at each factory. can do.
- mounting tact simulation software that performs mounting tact simulation for the NC data 220 optimized by the optimization software to the air and performs theoretical calculation of mounting time. .
- optimization has also been performed to reduce the mounting time, which is the time required to produce or inspect one circuit board in one component mounter k.
- the components to be mounted and the applied components to each component mounter k are also distributed in consideration of the mounting tact balance of each component mounter k including the mounting machine n108.
- optimization for shortening the type switching time is performed for the component mounter k other than the mounter nl08. This optimization is performed on the NC data 220 of the component mounter k other than the mounting machine n108, and the optimized NC data 220 is fed to each component mounter k. Back.
- the service supply device 2 of the component mounter supplier monitors the quality and operation status of the component mounting line 100 via the network 60. When a normal event occurs, a service is provided to analyze the cause and provide feedback to the component mounting line 100 for countermeasures. This monitoring and analysis service is realized by executing monitoring and analysis software provided by the service supply device 2.
- the service supply device 2 includes a transmission / reception unit 305, a storage unit 302, a DB conversion unit 308, a service information DB 26, an operation quality information DB 51, a control unit 301, an input unit 306, and the like. And a display unit 307.
- the transmitting / receiving section 305 is connected to the network 60, and can transmit / receive information to / from the service supplying / receiving section 23 of the service receiving apparatus 1.
- the storage unit 302 includes a program area 303 and a data area 304.
- a service supply program for performing an operation of a procedure to be described later in order for the service supply device 2 to realize various functions for providing a service requested from the service receiving device 1 is installed and stored in advance.
- the service supply program can be installed and sold via a storage medium such as a floppy disk, a CD ROM, or a transmission medium such as the Internet.
- the service program 2 16 extracted from the service information DB 26 by the service supply program is stored in the program area 303 of the storage unit 302, and the service program 2 16 is executed by the service supply device 2.
- Such service programs 211 include, for example, optimization software, implementation simulation software, monitoring and analysis software, and the like.
- the service program 216 can also be installed and sold via a storage medium such as a floppy disk or CD ROM or a transmission medium such as the Internet.
- a storage medium such as a floppy disk or CD ROM or a transmission medium such as the Internet.
- the equipment information 2 1 1, mounting tact information 2 1 3, delivery result information 2 1 7 and NC data 2 2 0 of each component mounting machine k at the factory where each component mounting machine is delivered Remember.
- the inspection result information 2 1 2 of each inspection machine is stored.
- the speed cell 414 and the tact simulation parameter 413 (see Fig. 27A and Fig. 27B) used for the implementation simulation are also stored.
- the equipment information 2 1 1 and the inspection result information 2 1 2 are the result information applied from each component mounter k via the service receiving device 1 and are stored for each component mounter k.
- the mounting tact information 2 1 3 is the actual information including the actual mounting tact value uploaded from the management device 101 via the service receiving device 1, and the mounting tact and the evening loss calculated by the mounting tact simulation. And is stored for each component mounter k.
- the delivery result information 2 17 is data uploaded from the management device 101 via the service receiving device 1 and is data such as the model, number, and delivery date of the delivered component mounters k.
- the NC data 220 stored for each delivery user is for down-loading to each component mounting machine k via the service receiving device 1 or each This is an application developed by the component mounter, and is stored for each component mounter k.
- the speed mass 414 is different for each placement machine name that identifies the placement machine n108, and for each component shape.
- the one-point per-unit standard mounting event for a uniquely determined shape code is stored.
- loading time, tool change time, and cassette change time are stored for each installed machine name.
- the loading time is the time from when the previous circuit board has been mounted to when the circuit board to be mounted next is set at a mounting position. It is time to change the tool for chucking the nozzles 7 or parts, which should be taken into account in the multi-function machine 108b. From these, it is possible to calculate the standard mounting time for mounting one circuit board.
- the cassette replacement time is the time required to replace one gas cassette, that is, the component supply device 5.
- the type change time is theoretically calculated based on the pre-stored cassette change time and the NC data 220 before and after the type change. C That is, from the NC data 220 before and after the type change.
- the number of replacements of the component supply device 5 is known, and the number of replacements is multiplied by the cassette replacement time to obtain the type switching time.
- Fig. 27B shows an example of the mounting machine n108.
- the standard tact (this is the standard mounting tact for one point), XY range (XY table 9 XY speed (XY-tape moving speed), Z range (standard TAC moving range of parts feeder 5) and Z speed (parts feeder moving speed) It is stored in advance.
- the mounting speed refers to the mounting head speed or the XY tape moving speed. With these, the XY table movement loss and the component supply device movement loss are calculated.
- the transmission / reception unit 305 receives a request for withdrawal of the service program 215 and the service program 216 from the service receiving device 1, receives permission from the control unit 301 for the withdrawal request, and performs control.
- the unit 301 transmits the service data 215 and the service program 216 retrieved from the service information DB 26 to the service receiving apparatus 1 via the network 60.
- the NC data 220 is downloaded to the service receiving device 1 via the network 60.
- Operation quality information DB 5 1 Operation quality information DB 51 captures equipment information 2 11, mounting tact information 2 13, inspection result information 2 1 2. ⁇ The quality status is processed into a data structure that can be easily analyzed and stored in a database.
- the operation quality information DB 51 includes equipment information DB 30, mounting tact DB 32, and inspection result DB 34.
- the equipment information DB 30 is written in the equipment information 31 for each index of the equipment specified by the name of the component mounting machine delivery factory and the name of the component mounting machine and for each index of the time specified by the time.
- the equipment information 3 1 is based on the equipment information 2 1 1 fetched from the management device 101 of each component mounting machine delivery factory and written in the data area 304 of the storage unit 302, and the operation rate, It consists of the adsorption rate, P board waiting time, trouble stop time, maintenance time, etc.
- Mounting event DB32 exists for each name of the factory to which the component mounter is delivered.
- the production start time and production end time are stored for each production type of circuit board, and the mounting tact information 33 is used as the index of the equipment specified by the component mounting machine name and the index of the type specified by the production type. Written every time.
- the mounting tact information 33 is taken from the management device 101 at the delivery site of each component mounting machine, and the mounting tact information 2 1 3 written in the data area 304 of the storage unit 302 (storage unit 3). (Including the dusk loss calculated using the takt simulation parameter 413 stored in advance in the de-emphasis area 302 of 002).
- Inspection results DB34 exists for each name of the factory to which the component mounter is delivered.
- the inspection result information 35 is written for each index of the inspection machine specified in each of the printing, mounting, and appearance inspections, and for each index of the type specified in the production type.
- the inspection result information 35 is based on the inspection result information 2 12 taken from the management unit 101 of each component mounting machine delivery factory and written into the data storage area 304 of the storage unit 302.
- the inspection result information 35 further includes the identification code, circuit number, and electrode number of each circuit board 10 therein. By specifying by number, it is possible to search for information indicating OK / NG, which circuit number, electrode number, and which defect content for each of the circuit boards 10.
- the facility information 211 and the mounting tact information 213 collected from each component mounter k are stored for each index of each product type or each time index, and for each index of each component mounter k, or In order to accumulate the inspection result information 212 collected from each inspection machine for each index of each production type and for each index of each inspection machine, production type, time, component mounting machine k, which are important keywords for analysis, It can be easily searched, collated and analyzed with an inspection machine.
- the target value of the line operation rate, the line mounting time, the suction rate, and the allowable range of the line time balance and the evening loss are written in advance.
- Line operation rate, line implementation time, these target values and allowable range are written in advance.
- the DB conversion unit 308 includes the equipment information 211 and the mounting tact information 213 (including the actual mounting tact value and the theoretical tact loss) written in the data area 304 of the storage unit 3 ⁇ 2 and inspection.
- the result information 212 is converted into the data structure of the operation quality information DB 51 and written into the operation quality information DB 51.
- the equipment information 211 is taken into consideration which component mounting machine delivery factory, which component mounting machine k, and at what time. Searches the index of the equipment information DB 30 and writes the converted equipment information 31 to the corresponding index location.
- the DB conversion unit 308 writes the delivery result information 217 written in the data storage area 304 of the storage unit 302 to a contract DB 320 (described later) of the service information DB 26 for each user.
- Service information DB 26 stores service data 215 and service programs 216 required to provide service functions, and can be retrieved when needed to provide services. It consists of the databases shown in Figure 29.
- the service data 215 and the service program 216 are specific contents of the service information.
- the Service Data 215 is data required to provide services to users. For example, contract information, sales information, instruction information, repair part information, maintenance information, and software for component mounting machines , Mounted component information, and mounting method information.
- the service program 216 can provide services to users by executing itself, and includes, for example, virtual training software, optimization software, and monitoring and analysis software.
- the service information DB 26 or service program 215 or service program 216 will be accumulated one after another as new implementation know-how in the service information DB 26, and the service receiving device will be available from anywhere in the world.
- the latest know-how, Service Day 2 15 or Service Program 2 16 can be easily searched from 1, so the latest service data 2 15 and service program 2 16 required for users Can be obtained immediately and reliably.
- mounting and manufacturing based on the latest know-how that has already been established can be performed without trial and error and without establishing through a production loss at startup. Can be realized.
- the contract data base 320 (hereinafter referred to as the contract DB, and other databases below are also referred to using the DB) is shown in Figure 30.
- the contract level can be searched and accessed by the user code or the delivery destination user name.c This allows the contract level for each user to be centrally managed and registered on a contract basis.
- the disclosure range of services for each user can be easily determined based on the content of the contract level.
- the contract level “0” indicates that the contract is at the lowest level, which is the initial level. For this user, only the minimum services such as sales information and electronic instruction manuals are provided. Disclosed. A contract level of “2” indicates that the contract level is two ranks higher than the initial level, and the service disclosure range is wider than that of contract level 0.
- the delivery user is charged based on this contract level.
- Billing is performed periodically, for example, on a monthly basis.
- charging is performed at once according to the level of the service contract, for example, on a monthly basis, so that both the user and the manufacturer can process the charging. Can be simplified.
- the contract DB 3 2 for each Interview one
- The, service de Isseki 2 1 5 and service programs 2 1 The presence / absence of automatic sending in 6 and the delivery record of the component mounter k are registered.
- the service data 215 and the service program 216 are automatically sent, as shown in FIG. 30.
- one of the service data 215 or service program 216 is selected individually, for example, sales information, instruction manual, maintenance information, component mounting machine software, or optimization software, Only the service data and service program 216 selected and registered will be automatically sent at the timing of revision or upgrade.
- the delivery record information of this component mounter k is collected from the service receiving device 1 and written in the data area 304 of the storage unit 302, and the delivery record information 210 is stored in the DB conversion unit 300. Converted and registered by 8.
- the business information DB 3 21 has a catalog code, which is the address of the catalog, and a specification, which is the address of the specification, for each type of component mounter k.
- the code is stored.
- the catalog file allows searching for the electronic file 350 of the catalog of the corresponding model
- the specification code allows searching for the electronic file 351 of the specification of the model.
- the sales information DB 3 21 specifies each user's desired specification conditions in order to identify the model of the component mounter k from the specification conditions specified by the user. It has a database structure that allows searching for matching models.
- the specification conditions specified by the user are, for example, as shown in the figure, the installation time (1 point installation time), mounting accuracy, price, mountable parts, occupied area, etc. If a mounting machine that is faster than 0.15 seconds, has a mounting accuracy of 0.05 mm or more, and is capable of mounting 105 chip components is desired, a search is made for a mounting machine that meets the conditions.
- the corresponding catalog code and specification code can be used to search the catalog and electronic file of the corresponding “Component Mounter 2”.
- business information such as catalogs and specifications of component mounters that match the specification conditions specified by the user, so that it is possible to easily search for component mounters k that satisfy the conditions desired by the user, The catalogs and specifications of the component mounter k can be obtained efficiently.
- catalogs and specifications are stored for each issue number consisting of the year of publication and the serial number, so that not only the latest version but also old catalogs can be referenced.
- the summary information designating the model as "Summary"
- the electronic file 352 of the general catalog can be searched, and the electronic file of the general power log is also stored for each issue number. So you can refer to not only the latest version, but also old general catalogs.
- the prices are shown in Japanese yen in the figure, but it is also assumed that the prices in US currencies, Canadian dollars, European euros and other national currencies are also prepared in the business information DB 321.
- the instruction manual DB3222 stores an instruction code, which is an address of an instruction manual, for each model of the component mounter k. With the instruction code, you can search the electronic file 355 of the instruction manual of the corresponding model. In addition, since the instruction manual is stored for each issue number consisting of the issued year and serial number, not only the latest version but also the old instruction manual can be referred to. In addition, we can always provide the latest version of the instruction manual when necessary for the user.
- the repair part DB3232 is composed of inventory information 358 and arrangement information 359.
- the stock information 358 stores the number of stocks at each service base for each repair part number.
- the repair part is, for example, a part supply device 5 such as a part cassette, a part suction nozzle 7, or the like.
- the order information 359 stores information such as the part number of the repair part to be arranged, its quantity, the delivery date and the corresponding base for each user who has ordered the repair part.
- Location 1, Location 2,... may be each location in Japan or each location in each country.
- C the order information 359 is taken out from the repair service DB3 23, and the user who has a short delivery time It is possible to refer to them in order.
- the virtual training DB 324 stores a training code which is an address of virtual training software for each model of each component mounting machine k. With the training code, you can search for the virtual training software 361 of the corresponding model.
- the operation of the component mounter k can be controlled in order to prevent the operation error of the component mounter k from occurring. Training can be provided at any time when required.
- the maintenance information DB 325 can search the maintenance information 363 corresponding to each part for each model of the component mounter k.
- the maintenance information 366 can be extracted by designating these parts with the mounting head 4, the XY table 9, the component supply unit 11, the recognition unit, and the like.
- the maintenance information 3 6 3 consists of the contents of the error, the contents of the troubles that occurred in the past, and the countermeasures.
- a list of past failures can be extracted by specifying the type and part name of the component mounter k, and it is possible to know how to deal with each extracted failure. .
- the measures to be taken include, for example, the need to replace repair parts or upgrade the software version.
- the maintenance information DB325 As another extraction method, for the maintenance information DB325, specify the model of the component mounting machine k, the name of the part, and the content of the defect, and extract a countermeasure for the content of the defect. You can also. As a result, in the vast amount of maintenance information, how to recover from errors in the component mounter Because the laws and preventive measures can be quickly extracted, the error pause time of the component mounting apparatus k can be suppressed to a minimum, it is possible to prevent the error one occurs again (and maintenance information DB 3 25 stores the maintenance code, which is the address of the maintenance manual, for each model of the component mounter k as shown in Fig. 35. The maintenance code for the corresponding model is stored using the maintenance code.
- the maintenance manual consists of the information required for maintenance, such as periodic inspections, control wiring diagrams, and sequence control drawings, in addition to the maintenance information 363 described above.
- the maintenance manual is stored for each issue number consisting of the year it was issued and the serial number. Ku can also see old maintenance manual. In addition, always, it is possible to provide the latest version of the Maintenance Manual.
- the software DB 326 can search for version up information 366 and software code corresponding to the type of software for each component mounter k model. ing.
- the software types are shown in the figure as software 1, software 2,..., For example, operation control software, positioning software for the component supply unit, and the like.
- the version upgrade information 366 includes software version-up contents for each software purge line, for example, contents of resolved defects, contents with improved operability and functions, and the like.
- the software code indicates the address of the corresponding software. You can search for software 366 of the corresponding model by software code. In addition, in addition to the latest version, you can search past versions of the software.
- the mounted component DB 327 exists for each shape code of the component.
- the type indicating the classification of the component the common data such as the component dimensions, etc., which are data common to the model of the component mounter k 369, and the model of each component mounter k It consists of unique mounting condition data 370.
- the common data 369 is the length, width, and thickness of parts and the packaging style supplied with tape.
- the mounting condition data 370 includes the moving speed of the mounting head 4, the moving speed of the XY table 9, the type of the component suction nozzle 7 to be used, and the like, and includes the recognition data.
- the component library 241 is accumulated one after another as new mounting know-how, and the latest know-how of the component library 241 is acquired from the service receiving device 1 from anywhere in the world. Since the search can be easily performed, the latest parts library 241 necessary for the user can be immediately and reliably obtained. As a result, even with complex mounting methods that tend to cause trouble due to operation errors, mounting production based on the latest know-how that has already been established can be realized without having to establish through trial and error through a production loss at the start. can do.
- the mounting method DB 328 can search and extract mounting method information such as cream solder information, adhesive information, and reflow information according to each board condition.
- the board conditions are the material and thickness of the circuit board, the type of components to be mounted, the narrow adjacent state of the SOPQFP lead pitch, and so on. Search for the conditions that match, and extract the relevant mounting method information.
- Cream solder information includes information such as cream solder material, viscosity, and temperature.
- the adhesive information is information such as the material, viscosity, and temperature of the adhesive to be applied.
- the reflow information includes the temperature profile, the substrate transfer speed in the furnace, and the like.
- the optimization software DB329 has an optimization code and an installation simulation that are the address of the optimization software for each model of the component mounting machine k. It stores the simulation code that is the address of the software.
- the optimization code allows you to search for the optimization software 368 of the corresponding model, and the simulation code allows you to search the mounting tact simulation software 375 of the model.
- the optimization software 368 provides optimization that reduces the mounting time for each component mounter k, including, for example, optimizing the component mounting order of the component mounters and the arrangement of the component supply devices 5. Do. If you select “Total optimization” for the model, you can search the total optimization software 374 that optimizes the total of the component mounting line 100. Total optimization software 374 is used to sort mounting parts and coating parts, taking into consideration the mounting tact balance on the component mounting machine k including each mounting machine n 108 on the component mounting line 100, and multiple product types. Then, a common component array, which is an array of common component supply devices 5, is generated.
- the mounting tact simulation software 375 reads the NC data 220 of the mounting machine alone and performs a theoretical calculation of the mounting time in consideration of the tact loss of the mounting machine alone. If you select “Total optimization” for the model, you can search the total mounting tact simulation software 371, which performs the mounting tact simulation of the component mounting line 1 ⁇ 0. The total mounting tact simulation software 371 performs the theoretical calculation of the mounting tact balance of the component mounting line 100 and the theoretical calculation of the total production time of the type of product to be manufactured in one day.
- optimization software DB 329 various optimization software 368 or mounting tact simulation software 375 necessary for each model of the component mounting machine k or for each application to be used is stored on a data base. Since it is possible to search for and extract items that match the model and application, it is suitable for the component mounter k of the model whose evening loss is to be eliminated. The available mounting order can be optimized and the event simulation can be supplied promptly. As a result, even if the user does not establish the know-how to eliminate the tact loss of the component mounter k by trial and error, the already established optimization know-how is reflected in the mounting order, realizing high-efficiency production. can do.
- the monitoring and analysis software DB330 has version-up information that records the version-up content of each version of monitoring and analysis software, and monitoring and analysis software. It stores the monitoring and analysis software code, which is the address of the wear.
- the monitoring and analysis software 372 can be searched using the monitoring and analysis software code.
- the monitoring and analysis software 372 can search not only the latest version but also the previous version.
- the monitoring / analysis software 372 provides a service to monitor the quality and operation status of the component mounting line 100 via the network J and the network 60 in the service supply device 2, and an abnormality occurs during monitoring. This is software for executing a service that analyzes the cause of the problem and provides feedback to the component mounting line 100 for countermeasures.
- This monitoring / analysis software DB330 allows the latest monitoring and analysis know-how to be accumulated to monitor the production status of the mounting factory and monitor the analysis.
- the analysis software 372 is centrally managed in a database. It is possible to accumulate the latest know-how one after another, so it is possible to monitor and analyze from anywhere in the world, Know-how can be provided at any time. As a result, monitoring and analysis services with the same know-how can be provided to users in any region of the world, and uniform quality production can be realized for each user in the world. Further, the monitoring and analysis software 372 can be executed by the service receiving device 1 on the user side.
- Control unit 3 0 1 The control unit 301 reads out the service supply program from the program area 303 of the storage unit 302 and executes the service supply program. Thereby, the following functions for the service supply device 2 to provide the service required by the service reception device 1 can be realized.
- the control unit 301 pulls out the service device 21 and the service program 21 6 from the service information DB 26 in response to a pull-out request from the service receiving device 1 via the transmitting and receiving unit 30 5 and sends and receives it. Is transferred to the service receiving device 1 via the service receiving device 1 ( here, in actuality, as described above, the control unit 301 transmits the service information DB 2 by a withdrawal request from the service receiving device 1). 6 from the service information DB 26 through the service receiving device 1, even if the service data 2 1 5 and the service program 2 16 are drawn from 6 This means that the program 2 16 has been pulled out, which means that the service receiving device 1 pulls out the service information 2 15 and the service program 2 16 from the service information DB 26.
- the service requesting device 1 may include a service information DB 26 that pulls out the service data 215 and the service program 216 from the service information DB 26.
- the service requesting device 1 may also include a service service DB 2 The service receiving device 1 naturally draws out the service data 2 15 from the service information DB 26 and the service program 2 16 as a matter of course.
- the service receiving device 1 is simply a terminal, and the control unit 301 displays a WEB screen on the display unit 25 of the service receiving device 1 according to a service supply program operated by the service receiving device 2. It may be displayed and prompt menu selection. In this case, a request to withdraw the service corresponding to the selected menu is input to the control unit 301, and the control unit 301 extracts the requested service from the service information DB 26, and the service receiving device 1 Is output. In this case as well, the service receiving device 1 uses the service information DB 26 to provide the service. This means that the service program should be withdrawn from the service program on December 25, 2016.
- control unit 301 sends a service request from the service information DB 26 in response to a withdrawal request instructed by the operator operating the service supply device 2 using the display unit 107 or the input unit 310. 2 15, pull out the service program 2 16 and output it to the display unit 3 07 or transfer it to the service receiving device 1 via the transmitting and receiving unit 3 05.
- control unit 301 registers the input service data 215 and the service program 216 in the service information DB 26 according to a command from the display unit 307 and the input unit 306. .
- the specific contents of extracting the service data 2 15 and the service program 2 16 from the service information DB 26 are as follows.
- the control unit 301 searches for the contract DB 320 by designating the user to which the component mounter is to be delivered, and refers to or updates the contract contents such as the contract level.
- the control unit 301 mounts the delivery result information 217 such as the delivery model, delivery quantity, delivery date, etc. of the component mounting machine k uploaded from the service receiving device 1 via the transmission / reception unit 305 Specify the machine delivery user and register it in the contract DB320.
- the control unit 301 automatically sends the service data 215 and service program 216 of the model with the delivery record to the service data 215 and service program 216 at the time of revision or version upgrade. Whether or not to do so is specified in the contract DB3200 by designating the user to which the component mounter is to be delivered.
- the control unit 301 searches the business information DB 3 21 by specifying the model of the component mounter k or the specification conditions of the component mounter k, and extracts the catalog and specification sheet of the corresponding component mounter k. I do.
- the specification conditions of the component mounter k are mounting tact, mounting accuracy, price, mountable components, and the like.
- control unit 301 searches the instruction manual DB322 by designating the model of the component mounter k, and extracts the electronic file 355 of the instruction manual of the corresponding component mounter k. Unless otherwise specified when searching, the electronic file 355 of the latest version of the instruction manual is extracted. Is done. If the issue number is specified, the electronic file 355 of the instruction manual of the specified issue number is extracted. Further, the control unit 301 searches the repair part database DB 323 by designating the repair part number, and extracts the stock information of the corresponding repair part number. Further, the control unit 301 specifies the user name and the repair part number, and registers the quantity, delivery date, and corresponding base of the repair part to be arranged for the repair part DB 323. At this time, the control unit 301 determines a corresponding base in consideration of the number of repair parts specified by the user, a base capable of meeting the delivery date, and whether the base is geographically closest to the user, and registers the corresponding base.
- the control unit 301 searches the virtual training DB 324 by designating the model of the component mounter k, and extracts the virtual training software 361 of the corresponding component mounter k.
- the control unit 301 searches the maintenance information DB 325 by designating the model of the component mounter k and each part of the component mounter k, and finds the corresponding part of the corresponding component mounter k. Extract maintenance information 3 6 3 Each part of the component mounter k is a mounting head 4, an XY table 9, a component supply unit 11, etc.Maintenance information 3 63 3 is based on the contents of errors and past troubles, and how to deal with them. Consists of Further, the control unit 301 searches the maintenance information DB 325 by designating the model of the component mounter k, and extracts the electronic file 3.64 of the maintenance manual of the corresponding component mounter k. .
- the maintenance manual is composed of information necessary for maintenance such as periodic inspection, control wiring diagram, sequence control drawing, etc. in addition to the above maintenance information. Unless otherwise specified when searching, the electronic file 364 of the latest maintenance manual is extracted. If the issue number is specified, the maintenance file electronic file 364 of the specified issue number is extracted.
- control unit 301 searches the software DB 326 by designating the model of the component mounter k and the type of software, and upgrades the version of the corresponding software of the component mounter k.
- Extract information 36 6 and software 36 7 c The types of software include operation control software and positioning software for the component supply unit 11.
- the version-up information 366 includes software version-up contents for each software-to-air version, for example, contents of resolved defects, contents with improved operability and functions, and the like. Unless otherwise specified when searching, the latest version of software 366 is extracted. If a version number is specified, software 366 with the specified version number is extracted.
- control unit 301 searches the mounting component DB 327 by designating the shape code and the model of the component mounter k, and determines the component line of the corresponding component mounter k of the corresponding shape code. Extract Prali 2 4 1 Further, the control unit 301 searches the mounted component DB 327 by designating the model of the component mounter k, and extracts the component library 241 of all the shape codes of the corresponding component mounter k. Further, the control unit 301 searches the mounted component DB 327 by designating the type of the component and the type of the component mounter k, and searches for the corresponding mounter k of the shape code included in the type. Extract part library 2 4 1 The type is the classification of the component, for example, “square tip”, “QFP”, and the like.
- the control unit 301 searches the mounting method DB 328 by designating the board condition, and extracts the mounting method information of the corresponding board condition.
- the board conditions are the material and thickness of the circuit board, the type of parts to be mounted, the narrow adjacent state of the SOP and QFP lead pitch, etc.
- the mounting method information is cream solder information, adhesive information, rifle opening information, etc. It is.
- the cream solder information is information such as the material, viscosity, and temperature of the cream solder.
- the adhesive information is information such as the material, viscosity, and temperature of the adhesive to be applied.
- the reflow information includes a temperature profile, a substrate transfer speed in the furnace, and the like.
- control unit 301 searches the optimization software DB 329 by designating the model of the component mounter k, and extracts the optimization software 368 of the corresponding component mounter k.
- the optimization software 368 optimizes, for example, the component mounting order of the mounting machine alone and the arrangement of the component supply device 5.
- Total optimization is selected for the model, the control unit 301 searches the optimization software DB 329 to optimize the total of the component mounting line 100. 3 7 4 can be searched.
- Total optimization software 3 74 is to sort components in consideration of the mounting tact balance of the component mounting line 100 to each mounting machine, generate a common component array, which is an array of component supply devices 5 common to multiple production types, and Optimize the component mounting order of each mounting machine and the arrangement of the component supply device 5.
- control unit 301 searches the optimization software DB 329 by designating the model of the component mounter k, and extracts the mounting tact simulation software 375 of the corresponding component mounter k. .
- the mounting tact simulation software 375 reads the NC data 220 of the mounting machine alone and performs a theoretical calculation of the mounting time in consideration of the tact loss of the mounting machine alone. If "Total optimization" is selected for the model, the total mounting tact simulation software 371 that performs the total mounting tact simulation of the component mounting line 100 can be searched.
- the total mounting tact simulation software 371 performs the theoretical calculation of the mounting tact balance of the component mounting line 100 and the theoretical calculation of the total production time of the types produced in one day.
- the control unit 301 searches the monitoring / analysis software DB 330 and extracts the monitoring / analysis software 372.
- the monitoring and analysis software 372 provides the service supply device 2 with a service for monitoring the quality and operation status of the component mounting line 100 via the network 60, and an abnormality occurs during monitoring. This is software for executing a service that analyzes the cause and provides feedback for the countermeasures to the component mounting line 100 when it is done.
- the control unit 301 executes the monitoring and analysis software 372, and collects the equipment information 211, mounting event information 213, and inspection result information 212 from the service receiving device 1.
- the collected equipment information 2 1 1, mounting event information 2 1 3, and inspection result information 2 1 2 are stored in the operation quality information DB 51.
- the control unit 301 monitors the production status based on the accumulated information, analyzes the cause of the problem if found, and provides feedback to the service receiving device 1.
- the control unit 301 automatically determines the timing for collecting the equipment information 211, the mounting tact information 211, the inspection result information 212, and the delivery result information 211, and the transmission / reception unit. Instruct the collection request of the equipment information 2 11, the mounting tact information 2 13, the inspection result information 2 12 and the delivery result information 2 17 to 3 05. Then, it receives equipment information 211 for each component mounting machine, mounting tact information 213, and inspection result information 212 from the transmission / reception unit 305, and stores the data area 300 in the storage unit 302. 4 is stored for each component mounter k. Also, the delivery result information 217 for each user is received from the transmission / reception unit 305, and is stored in the data storage area 304 of the storage unit 302 for each user.
- the timing for automatically collecting the equipment information 2 11, mounting tact information 2 13, inspection result information 2 12 and delivery record information 2 17 can be set arbitrarily. For example, it may be collected every hour.
- the service receiving device 1 stores one day of equipment information 2 1 1, mounting event information 2 1 3, inspection result information 2 1 2 and delivery result information 2 1 7 It may be collected from the service receiving device 1.
- other timings may be used.
- it may be possible to determine whether to collect data in a short cycle or in a long cycle according to the urgency of quality and operation status analysis.
- the equipment information, the mounting tact information 2 13, the inspection result information 2 12 and the delivery result information 2 1.7 may be collected by the operation of the operation.
- the transmission / reception unit 305 is instructed to collect, from the service receiving apparatus 1, the NC data 220 of the production type at the time of collecting the data.
- the data is stored in the data area 304 of the storage section 302 for each component mounting machine k. Then, by using the collected NC data 220, the velocity cell 414 stored in the data storage area 304 of the storage unit 302, and the tact simulation parameter 413, Implement the theoretical calculation of sunset and sunset loss.
- the theoretical values of the mounting tact and the tact loss obtained as a result are written in the data storage area 304 of the storage unit 302 so as to be added to the mounting tact information 213.
- the details of the above-mentioned theoretical calculation of the mounting tact time and the tectonic loss, that is, the mounting tact simulation will be described later.
- the tact loss is detected by the component mounting machine k including the mounting machine n 108, and the tact loss is collected by including the tact loss in the mounting tact information 2 13, and the data is stored in the data storage unit 302. It may be stored in the overnight area 304.
- the method of detecting dusk loss in the mounting machine n108 is, for example, to measure the time from the start of movement of the component supply device 5 or the XY table 9 to the end of positioning, and calculate the amount of time over the standard tact May be detected as tact loss.
- the evening loss is a completely actual value, and the evening loss accuracy is improved.
- the tact simulation does not have to be performed every time the mounting tact information 2 13 is updated in the service supply device 2, so that the load on the service supply device 2 is reduced.
- there are few component mounters k that detect tact loss and even if a component mounter k that detects tact loss comes out, all component mounters k on the component mounting line 100 will have tact loss. Since it seems that there are almost no cases in which the tact loss is detected, it can be said that calculating tact loss by tact simulation in terms of system construction is quite effective.
- control unit 301 reads out the NC data 220 after the optimization by the NC data overnight optimization function from the data area 304 of the data storage unit 302, and reads the read NC data. Output to the transmitting and receiving unit 3 0 5 to transmit the data 220 to the service receiving device 1 ⁇
- the mounting tact simulation is a function that performs the theoretical calculation of the mounting tact based on the NC data after optimization (or before optimization). Theoretical calculation of the mounting tact on the circuit board and the theoretical calculation of the replacement time of the component supply device 5 at the time of product type switching are performed.
- the mounting tact simulation software 375 retrieved from the service information DB 26 and stored in the program area 303 of the storage unit 302, the mounting tact simulation of the model of the corresponding component mounting machine k When the control unit 301 activates the software 375, the mounting tact simulation is executed.
- the standard tact (1 point per standard tact) for each mounted part is obtained from the speed mass 4 1 4 and the evening simulation parameter 4 13 stored in the data area 3 04 of the storage unit 3 2.
- the allowable movement range within the standard tact of the XY table 9 and the allowable movement range within the standard tact of the component supply device 5 are read, and the corresponding NC stored in the storage area 302 in the evening area 304 is stored.
- the theoretical value of the mounting sunset is calculated based on the relative movement distance from the previous mounting position at the time of mounting each component of the XY table 9 and the component supply device 5 obtained from the data 220. Specifically, the calculation method will be described below. First, the standard wearing event is calculated using (Equation 1).
- the loading time and tool change time can be obtained by searching the mounted machine name from the speed box 414.
- the standard mounting time for one part of a part can be obtained by searching the mounting machine name and shape code from the speed mask 4 14.
- the number of parts can be obtained by counting the number of steps for mounting the corresponding part from the NC program 222.
- the number of times of change is obtained by counting the number of times the component suction nozzle 7 or the nozzle used in each mounting step is switched in the NC program 221.
- ⁇ (the standard mounting tact per part per component x the number of parts) is the sum of (the standard mounting tact per part per component x the number of parts) for all types of parts mounted on one circuit board. It means to do.
- XY movement loss per point (movement amount-allowable movement range) /) speed
- the XY movement amount is the mounting before the XY tape 9 when mounting per point in each mounting step.
- the relative movement distance from the position, and the XY allowable movement range is the allowable movement range within the standard sunset of the XY table 9 searched at the corresponding mounting speed from the evening simulation 413.
- the XY movement loss per point is the XY table movement loss when mounting per one point in each mounting step, and the XY speed was retrieved from the sunset simulation parameter 413 at the corresponding mounting speed. This is the moving speed of the XY table 9.
- the Z movement amount is a relative movement amount from the position in the immediately preceding mounting step of the component supply device 5 when mounting per one point in each mounting step
- the Z allowable movement range is: It is the allowable movement range within the standard sunset of the component supply device 5 retrieved from the takt simulation parameter 413 at the corresponding mounting speed.
- the Z movement loss per point is
- the Z-speed is the movement speed of the part supply device 5 searched for the corresponding mounting speed from the tact simulation 413. is there.
- the XY tape movement loss is calculated.
- the XY table movement loss is calculated using (Equation 4).
- the XY table movement loss is the sum of the evening loss relating to the movement of the XY table 9 when one circuit board is mounted.
- the component supply device movement loss is calculated.
- the component supply device movement loss is calculated using (Equation 5).
- the component supply device movement loss is the sum of the evening loss related to the movement of the component supply device when one circuit board is mounted.
- ⁇ ((Z movement loss per point> XY movement loss per point) is the Z movement loss when mounting per point in each mounting step) is the XY movement loss. It means the sum of the Z movement loss of the mounting steps that exceeds.
- the mounting tact is calculated by (Equation 6). Is calculated.
- Theoretical values for the mounting time of the component mounter k other than the mounting machine nl08 are also calculated by a method according to the mounting operation of the component mounter k.
- the service receiving device 1 includes a transmitting / receiving unit 20 on the management device side, a transmitting / receiving unit 23 on the service supply device side, a storage unit 22, a control unit 21, an input unit 24, and a display unit 25.
- the management device side transmission / reception unit 20 is connected to the network 3 and can transmit / receive information to / from the service reception device side transmission / reception unit 406 of the management device 101 of each component mounting machine delivery factory.
- the service supply device side transmission / reception section 23 is connected to the network 60, and can transmit / receive information to / from the service supply device 2.
- the storage unit 22 includes a program area 27 and a data area 28.
- a service receiving program for performing an operation of a procedure described later in order to realize various functions for the service receiving apparatus 1 to derive a desired service from the service supplying apparatus 2 is installed and stored in advance.
- a service program 216 drawn from the service supply device 2 is stored.
- the service receiving program and the service program 216 can be installed and sold via a storage medium such as a floppy disk, a CD ROM, or a transmission medium such as an Internet connection.
- the equipment information 211, the mounting tact information 2113, and the NC data 220 of each component mounter k of each component mounter delivery factory are stored. Also, it stores the inspection result information 212 of each inspection machine and the delivery result information 217 for each user. Further, service data 215 drawn from the service supply device 2 is stored.
- the equipment information 211 is performance information uploaded from each component mounter k, and is stored for each component mounter k.
- the mounting tact information 2 13 includes a mounting result value uploaded from each component mounter k, and is stored for each component mounter k.
- the inspection result information 2 12 is the actual information uploaded from each inspection machine, and is stored for each inspection machine.
- the delivery result information 217 is the result information uploaded from the management device 101 of each factory and uploaded, and is stored for each user.
- the NC data 220 is downloaded for each component mounter k or uploaded from each component mounter k, and is stored for each component mounter k. Further, the service program 215 and the service program 216 are drawn from the service supply device 2 and are transferred to the management device 101 of each factory. It could be done.
- the transmission / reception unit 20 on the management device side receives a request from the control unit 21 to collect equipment information 211, mounting tact information 213, inspection result information 212, delivery result information 217, and NC data 220 specifying the factory to which the component mounting machine is to be delivered.
- the equipment information 211, the mounting tact information 213, the inspection result information 212, the delivery result information 217, and the NC data 220 are uploaded from the management device 101 of the designated component mounting machine delivery site via the network 3 to the storage unit. Write to data area 28 of 22.
- the transmission / reception unit 20 on the management device side receives the transmission request of the NC data 220, the service data 215, and the service program 216 designating the factory to which the component mounting machine is to be delivered from the control unit 21, and delivers the designated component mounting machine.
- the data is transmitted to the management device 101 of the previous factory via the network 3.
- the transmission / reception unit 23 on the service supply device side retrieves the service data 215 and the service program 216 from the service supply device 2 via the network 60, and retrieves the data from the storage unit 22. Write to area 28.
- the equipment information 211, the mounting information 213, the inspection result information 213, the delivery result information 217, and the NC data 220 are requested from the service supply device 2 via the network 60, and the equipment information 211 is received.
- Mounting tact information 213, inspection result information 212, delivery result information 217, and NC data overnight 220 are transmitted. Further, it receives the download of the NC data 220 from the service supply device 2 via the network 60 and writes it into the data area 28 of the storage unit 22.
- Control unit 21 reads out the service receiving program from the program area 27 of the storage unit 22 and executes the service receiving program.
- the service receiving program is started up, the implementation WEB screen shown in Fig. 24 is displayed on the display unit 25, and the operation for pulling out the service from the display unit 25 or the input unit 24 is enabled. . Accordingly, the following functions for the service receiving device 1 to draw out a desired service from the service providing device 2 can be realized.
- control unit 21 executes the service receiving program
- the service receiving device 1 does not function, but the control unit 301 of the service supplying device 2 executes the service supplying program.
- the function of the control unit 21 described below may be performed by the remote control of the control unit 301 of the single screw supply device 2.
- the control unit 21 controls the service supply device side transmitting / receiving unit 23 by operating the display unit 25 and the input unit 24.
- the service program 215 and the service program 216 are fetched from the service supply device 2 via the service supply device 2, and the service program 215 is stored in the service area 218 of the storage unit 22 and the service program 215. 16 is written to the program area 27 of the storage section 22.
- the control unit 21 transfers the service data 215 and the service program 216 to the management device 101 of each factory via the management device-side transmission / reception unit 20. Further, the control unit 21 can read and execute the service program 2 16 stored in the storage unit 22 to execute a desired service in the service receiving device 1.
- the specific contents of drawing out the service data from the service supply device 2 through the service supply device side transmitting / receiving section 23 and the service program 216 are as follows.
- the control unit 21 designates the user name of the delivery destination of the component mounting machine, and instructs the service supply device 2 to refer to or renew the contract contents such as the contract level through the transmission / reception unit 23 on the service supply device side. Transmits and supplies the service via the service supply device side transceiver 23 Refer to or update the contract contents such as the contract level for the device 2.
- the control unit 21 causes the service supply device 2 to upload the delivery result information 217 such as the delivery model, delivery quantity, delivery date, etc. of the component mounting machine to the service delivery device 2 via the service delivery device side transmission / reception unit 23.
- the control unit 21 specifies the user name of the user to which the component mounting machine is to be delivered, and sends the service data to the service supply device 2 via the service supply / reception unit 23 on the service supply device side. 15. Instruct the registration of whether to automatically send the service program 2 16 to the service server 2 15 or the service program 2 16 at the timing of the upgrade or version upgrade.
- control unit 21 specifies the model of the component mounter k or the specification condition of the component mounter k, and mounts the corresponding component mount on the service supply device 2 via the service supply device side transmitting / receiving unit 23. It instructs the extraction of the catalog and specifications of the machine k, and extracts the power log and specifications of the corresponding component mounting machine k to the service supply device 2 via the transmission / reception section 23 on the service supply device side.
- the specification conditions of the component mounter k are mounting tact, mounting accuracy, price, mountable components, and the like.
- control unit 21 designates the type of the component mounter k, and sends the service supply device 2 to the service supply device 2 via the service supply device side transmission / reception unit 23, as described in the instruction manual of the component mounter k. Instruct the extraction of the electronic file 355, and extract the electronic file 355 of the instruction manual of the relevant component mounter k to the service supply device 2 via the service supply device side transmitting / receiving section 23. . Unless otherwise specified when searching, the latest version of the electronic manual 355 will be extracted. If the issue number is specified, the electronic file 355 of the instruction manual of the specified issue number is extracted.
- control unit 21 designates the repair part number, and instructs the service supply unit 2 to extract stock information of the corresponding repair part number via the service supply unit transmitting / receiving unit 23 to supply the service.
- the stock information of the corresponding repair part number is extracted from the service supply device 2 via the device-side transmitting / receiving section 23.
- control unit 21 By specifying the user name and the repair part number, the service supply device 2 is instructed via the service supply device transmission / reception section 23 to register the quantity of the repair parts to be arranged and the delivery date. The quantity of the repair parts to be arranged and the delivery date are registered in the service supply device 2 via the part 23.
- control unit 21 designates the model of the component mounter k, and sends the service training device 23 to the service supply unit 2 via the service supply unit side transmission / reception unit 23. Instruct the extraction of 361, and extract the virtual training software 361 of the corresponding component mounter k to the service supply device 2 via the service supply device side transmitting / receiving section 23.
- the control unit 21 specifies the model of the component mounter k and each part of the component mounter k, and mounts the corresponding component on the service supply device 2 via the service supply device side transmission / reception unit 23. Instructs the extraction of maintenance information 3 6 3 for the corresponding part of the machine, and sends the maintenance information of the corresponding part of the corresponding component mounting machine k to the service supply unit 2 via the service supply unit side transmitting / receiving unit 23. 3 6 3 is extracted.
- Each part of the component mounter k is a mounting head 4, an XY table 9, a component supply unit 11, and the like.Maintenance information 36 3 is based on the content of errors and faults that occurred in the past and how to deal with them. Become.
- control unit 21 designates the model of the component mounter k, instructs to extract the electronic file 364 of the maintenance manual of the corresponding component mounter k, and sends and receives the service supply device side transmission / reception unit 2 3 Then, the electronic file 364 of the maintenance manual of the corresponding component mounting machine k is extracted to the service supply device 2 via.
- the maintenance manual consists of the information required for maintenance, such as periodic inspections, control wiring diagrams, and sequence control drawings, in addition to the maintenance information described above. Unless specified otherwise, the latest maintenance manual electronic file 364 is extracted. If the issue number is specified, the maintenance manual electronic file 364 with the specified issue number is extracted.
- control unit 21 designates the model of the component mounter k and the type of software, and provides version-up information 3 of the type of the corresponding software to the corresponding mounter k. 6 6 and software 3 6 7 are instructed to be extracted, and version upgrade information of the corresponding software type of the corresponding component mounter k is supplied to the service supply device 2 via the service supply device side transmitting / receiving section 23. Extract 366 and software 366.
- the types of software include operation control software, positioning software for the component supply unit 11, and the like.
- the version upgrade information 366 includes software version upgrade contents for each version of the software, for example, contents of resolved defects, contents with improved operability and functions, and the like. Unless you specify otherwise when searching, the latest version of software 366 will be extracted. If a version number is specified, the software 365 with the specified version number is extracted.
- control unit 21 designates the shape code and the model of the component mounter k, instructs to extract the component library of the corresponding component mounter k of the corresponding shape code, and provides a service supply device.
- the component library of the corresponding component mounter k of the corresponding shape code is extracted from the service supply device 2 via the side transmitting / receiving unit 23.
- control unit 21 designates the model of the component mounter k, instructs the extraction of the component library of all the shape codes of the corresponding component mounter k, and sends the command via the service supply unit side transmitting / receiving unit 23.
- For the service supply device 2 a component library of all the shape codes of the corresponding component mounter k is extracted.
- control unit 21 designates the type of the component and the model of the component mounter k, instructs to extract the component library of the corresponding component mounter k of the shape code included in the corresponding type, and provides a service.
- the component library of the component mounter k corresponding to the shape code included in the corresponding type is extracted from the service supplying device 2 via the transmitting / receiving unit 23 on the supplying device side.
- the type is a classification of parts, such as “square chip” and “QFP”.
- control unit 21 designates the board condition, instructs to extract the mounting method information of the corresponding board condition, and instructs the service supply device 2 via the service supply device side transmission / reception unit 23 to the relevant condition. Extract mounting method information on board conditions.
- the board conditions are the material and thickness of the circuit board, the type of parts to be mounted, the situation where the SOP and QFP lead pitches are closely adjacent, etc.
- the mounting method information is cream solder information, adhesive information, reflow information, etc. It is.
- the cream solder information is information such as the material, viscosity, and temperature of the cream solder.
- the adhesive information is information such as the material, viscosity, and temperature of the adhesive to be applied.
- the information of the lift is a temperature profile, a substrate transfer speed in the furnace, and the like.
- control unit 21 designates the model of the component mounter k, instructs the extraction of the optimization software 368 of the corresponding component mounter k, and provides the service via the service supply device side transmission / reception unit 23.
- the optimization software 368 of the corresponding component mounter k is extracted.
- the optimization software 368 optimizes, for example, the component mounting order of the mounting machine alone and the arrangement of the component supply devices 5.
- the control unit 301 searches the optimization software DB 329 to perform the total optimization of the component mounting line 100 Total optimization software 3 7 4 Can be searched.
- the total optimization software 3 7 4 is used to sort components in consideration of the mounting tact balance of each component mounting line 100 to each mounting machine, and to provide a common component that is an array of component supply devices 5 common to multiple production types. Generates an array, and optimizes the component mounting order of each mounting machine and the array of the component supply device 5. Further, the control unit 21 designates the model of the component mounter k, instructs extraction of the mounting tact simulation software 375 of the corresponding component mounter k, Then, the mounting tact simulation software 375 of the corresponding component mounting machine k is extracted from the service supply device 2 via the server.
- the mounting sunset simulation software 375 reads, for example, the NC data 220 of the mounting machine alone, and performs a theoretical calculation of the mounting time in consideration of the evening loss of the mounting machine alone. If "Total optimization" is selected for the model, the total mounting tact simulation software 371 that performs the total mounting tact simulation of the component mounting line 100 can be searched. The total mounting tact simulation software 371 performs the theoretical calculation of the mounting tact balance of the component mounting line 100 and the theoretical calculation of the total production time of the types produced in one day.
- the control unit 21 instructs the service supply device 2 to execute the monitoring / analysis software 372, and instructs the service supply device 2 to monitor and analyze the software via the service supply device transmitting / receiving unit 23.
- the wear 3 7 2 is executed.
- Monitoring ⁇ Analysis software The ware 372 is a service that monitors the quality and operation status of the component mounting line 100 via the network 60 in the service supply device 2, and furthermore, when an abnormality occurs during monitoring, the cause This is software for executing a service for analyzing the component mounting and providing feedback for the countermeasures to the component mounting line 100.
- the equipment information 2 1 1, the mounting tact information 2 1 3, .Instruction for collection of test result information 2 1 2 will come.
- the control unit 21 collects the facility information 21 1, the mounting event information 2 13, and the inspection result information 2 12 from the management device 101 via the management device side transmitting / receiving unit 20. Then, these information are uploaded to the service supply device 2 via the service supply device side transmitting / receiving section 23. When the feedback of the result of analysis from the service supply device 2 via the service supply device side transmission / reception unit 23 comes, the control unit 21 transfers the feedback information to the management device 101.
- the control unit 21 automatically determines the timing to collect the equipment information 2 11, mounting tact information 2 13, delivery result information 2 17 and inspection result information 2 12 Instruct 20 to collect equipment information 2 1 1, mounting tact information 2 1 3, delivery result information 2 1 7 and inspection result information 2 1 2. Then, equipment information 2 11 and mounting tact information 2 13 for each component mounting machine k are received from the management device side transmitting / receiving section 20 and are stored in the data area 28 of the storage section 22 for each component mounting machine k.
- it receives the inspection result information 212 for each inspection machine from the transmission / reception unit 20 on the management device side, and stores it in the data storage area 28 of the storage unit 22 for each inspection machine.
- the delivery result information 217 for each user is received from the transmission / reception unit 20 on the management device side, and stored in the data storage area 28 of the storage unit 22 for each user.
- the timing for automatically collecting the equipment information 2 1 1, mounting tact information 2 1 3, delivery result information 2 1 7 and inspection result information 2 1 2 can be set arbitrarily. You. For example, it may be collected every hour at the same time for all the parts mounting machine delivery factories. Also, one day's worth of equipment information 2 1 1, mounting tact information 2 1 3, delivery performance information 2 17 and inspection result information 2 1 2 are stored in the management device 101 of each component mounting machine delivery factory. The data may be collected once a day at the same time for all the component mounting machine delivery plants or at a different timing for each component mounting machine delivery plant. Other timings are also acceptable. Furthermore, it may be possible to determine whether to collect data in a short cycle or in a long cycle according to the urgency of quality and operation status analysis. Further, the equipment information, the mounting tact information 2 13, the delivery result information 2 17 and the inspection result information 2 12 may be collected by the operation of the operator.
- control unit 21 includes equipment information 2 1 1, mounting tact information 2 13, delivery result information 2 17, and inspection result information from the service supply device 2 via the service supply device side transmission / reception unit 23.
- equipment information 2 1 1, mounting tact information 2 1 3, delivery result information 2 1 7 and inspection result information 2 1 2 from the data storage area 2 8 of the storage unit 2 2 Is read and transmitted to the service supply device 2 via the service supply device side transmission / reception section 23.
- the control unit 2 After collecting the mounting tact information 2 1 3, the control unit 2 1, the same production type as collecting the mounting tact information 2 1 3 at the same factory where the mounting tact information 2 1 3 was collected
- the management device-side transmission / reception unit 20 is instructed to collect the NC data 220 of the management device.
- the data is stored in the data area 28 of the storage unit 22 for each component mounter k.
- control unit 21 reads out the NC data 220 from the data storage area 28 of the data storage unit 22 and reads the read NC data 220 at the factory where the component mounting machine is delivered. Output to the management device side transmission / reception unit 20 for transmission to the management device 101.
- control unit 21 receives an instruction for uploading the NC data 220 from the service supply device 2 via the service supply device side transmission / reception unit 23, and receives the data from the storage unit 22. — Read out the NC data 220 from the evening area 28 and transmit it to the service supply device 2 via the service supply device side transceiver 23.
- control unit 21 receives the download of the NC data 220 from the service supply device 2 via the service supply device side transmitting / receiving unit 23, and stores the NC data in the data storage area 28 of the storage unit 22. Data 220 is stored.
- Fig. 41 shows the general data flow of the entire service system 380.
- the service receiving apparatus 1 launches the mounting web screen shown in FIG. 24 on the display unit 25.
- the service receiving device 1 sends the contract DB 3 20 Browse and update.
- the contract contents and the renewal result are transmitted to the service receiving device 1. For example, you can find out how much the contract level is, how much it has been renewed, and what the delivery record is.
- the service receiving device 1 determines whether or not to automatically send the service program 2 15 and the service program 2 16 for the model of the component mounter k with the delivery record. Register for 320.
- the service supply device 2 periodically uploads the delivery result information 217 from the service receiving device 1 and registers the delivery result information 217 in the contract DB 320.
- the service receiving device 1 receives the upload request from the service supplying device 2, and uploads the delivery result information 217 from the management device 101.
- the service receiving device 1 sends the sales information to the sales information DB 3 21 of the service supply device 2.
- Make a reference For example, an electronic file of the specifications of the desired component mounter k can be imported.
- Service receiving device 1 The referred sales information is transferred to the management device 101 of the factory. As a result, the sales information can also be viewed in the management device 101 of each factory.
- the service supply device 2 reads the business information from the business information DB 3 21 at the timing when the sales information is revised, and the service receiving device 1 Automatically send to.
- the service receiving device 1 When the operator operates the input unit 24 and selects the “Electronic Manual” menu, the service receiving device 1 will be instructed to use the service DB 2 22 Import the electronic file of the book.
- the service receiving device 1 transfers the electronic file of the received instruction manual to the management device 101 of the factory.c By doing so, the instruction manual can also be viewed on the management device 101 of each factory. If the automatic transmission is registered in the contract DB320, the service supply device 2 reads the electronic file of the instruction manual from the instruction manual DB32 at the timing when the instruction manual is revised, and Automatically send to service receiving device 1.
- the service receiving device 1 Reference the stock information of the repair shop.
- the service receiving device 1 transfers the stock information of the repair part referred to to the management device 101 of the factory. As a result, the stock information of the repaired parts can be viewed in the management device 101 of each factory.
- the service receiving device 1 registers the repair parts arrangement with the repair part DB 323 of the service supplying device 2. Specifically, the part number, quantity, and delivery date of the repair part are registered, and the result is sent to the service receiving device 1 as to whether or not the order was delivered as it was.c The service receiving device 1 sends the received repair Management device 1 0 1 Transfer to As a result, even in the management device 101 of each factory, the arrangement result of the repair part can be seen.
- the service receiving device 1 transfers the acquired virtual training software to the management device 101 of the factory.
- virtual training software can be activated and virtual training can be performed.
- the management apparatus 101 can transfer the virtual training software to the corresponding component mounter k, and activate the virtual training software on the component mounter k to perform the virtual training. is there.
- the service receiving device 1 When the operator operates the input unit 24 on the WEB screen and selects the “Maintenance information” menu, the service receiving device 1 performs maintenance information and maintenance on the maintenance information DB 3 25 of the service supply device 2. Import the manual. The service receiving device 1 transfers the acquired maintenance information and maintenance manual to the factory management device 101. As a result, the maintenance information can be viewed on the management device 101 of each factory.
- the service supply device 2 If the automatic delivery is registered in the contract DB 325, the service supply device 2 reads out the maintenance information from the maintenance information DB 325 at the timing when the maintenance information is revised, and provides the service. Automatically send to receiving device 1.
- the service supply device 2 reads out the software from the software DB 326 at the timing when the software version is updated, and automatically transmits the software to the service receiving device 1. Send it.
- the service receiving device 1 2 4 Take in 1.
- the service receiving apparatus 1 transfers the imported parts library 2241 to the factory management apparatus 101. Further, the management apparatus 101 transfers the component library 241 to the corresponding component mounter k, and installs the component library on the component mounter k. This eliminates the man-hours required to create a parts library for factory operations.
- the service receiving device 1 mounts the service supply device 2 and the mounting method information for the DB 3 288. Import The service receiving device 1 transfers the acquired mounting method information to the management device 101 of the factory. Further, the management device 101 transfers the mounting method information to the corresponding component mounter k, and installs the information on the component mounter k. Do thor. This allows the factory operator to perform cream solder printing, adhesive application, and riffing by the most appropriate method according to the type of circuit board and other conditions.
- the service receiving device 1 sends the optimization software DB 3 29 of the service supplying device 2 to the Imports optimization software and implementation tact simulation software.
- the optimization software can be started on the service receiving apparatus 1 and the NC data 220 of the component mounter k up to the service receiving apparatus 1 can be optimized.
- transfected simulation software in service receiving device 1 performs a mounting Takutoshimyure one Chillon with respect NC de Isseki 2 2 0 after optimization, c can be obtained theoretical value of mounting tact
- the service receiving device 1 transfers the acquired optimization software and implementation tact simulation software to the management device 101 of the factory.
- the optimization software can be started, and the uploaded NC data 220 can be optimized. Also, in the management device 101 of the factory, start the mounting tact simulation software, perform the mounting tact simulation on the NC data 220 after optimization, and obtain the theoretical value of the mounting tact. Can be.
- the management apparatus 101 transfers the optimization software to the corresponding component mounter k, and installs the software on the component mounter k.
- the optimization software is started on the component mounter k, and after optimizing the NC data 222, or while optimizing, the mounting production is performed with the optimized NC data 220. It can be carried out.
- the service supply device 2 will be switched from the optimization software DB329 to the optimization software in the evening when the version of the optimization software is upgraded. And automatically sends it to the service receiving device 1.
- the service receiving device 1 sends a message to the service Request to analyze the cause of the trouble that occurred in the component mounting line 100 of the factory.
- the service supply device 2 activates the monitoring / analysis software 372 extracted from the monitoring / analysis software DB 330, and periodically sends the requested service reception device 1 to the service supply device 1.
- the equipment information 2 1 1, the mounting tact information 2 1 3, the NC data 2 2 0 and the inspection result information 2 1 2 are uploaded, and the cause of the trap is analyzed. If the analysis reveals the cause, feedback to the service receiving device 1 is taken to remove the cause.
- the service receiving device 1 monitors the service supplying device 2 and monitors the service supplying device 2. Request to monitor the component mounting line 100 in your own factory. Upon receiving this request, the service supply device 2 starts the monitoring and analysis software 372 extracted from the monitoring and analysis software DB 330, and periodically sends the requested service receiving device 1 to the service reception device 1. Then, equipment information 211, mounting tact information 213, NC data 220 and inspection result information 212 are uploaded, and the production status is monitored.
- the uploaded equipment information 211, mounting tact information 212, NC data 220 and inspection For the result information 2 12, the cause analysis of the sign of the trouble or the trap is performed. If the analysis reveals the cause, feedback to the service receiving device 1 is given on measures to eliminate the cause.
- the types of monitoring 'analysis' include operation analysis, sunset analysis, and quality analysis.
- the operation analysis monitors the operation rate of the component mounting line 100, analyzes the cause of the decrease in the operation rate, and provides feedback to eliminate the cause.
- the management device 101 receives the upload request of the equipment information 211 from the service receiving device 1, and receives the equipment information 210 collected from each component mounting machine k from the component mounting line 100. Upload You.
- the service receiving device 1 receives the upload request for the equipment information 211 from the service supply device 2, and uploads the equipment information 211 from the management device 101.
- the service supply device 2 uploads the equipment information 2 1 1 from the service reception device 1.
- the service supply device 2 accumulates the collected equipment information 211 in the equipment information DB 30 of the operation quality information DB 51 in chronological order.
- the service supply device 2 looks at the transition of the operation rate from the equipment information DB 30 and analyzes the cause of the decrease in the operation rate to find out. Then, feedback for removing the cause is provided to the service receiving device 1. For example, if the cause is a defective component suction nozzle 7, repair parts are arranged. In the case of an operation error during the operation of the component mounter k, the virtual training software is transmitted to the service receiving device 1. If the parts library 24 1 is inadequate, the optimal parts library 2 1 is sent to the service receiving device 1.
- the management device 101 receives the upload request of the NC data 220 from the service receiving device 1, and receives the NC data 220 of the component mounting machine k from the component mounting line 100.
- the service receiving device 1 receives the upload request of the mounting tact information 2 13 and the NC data 220 from the service supplying device 2, and receives the mounting event information 2 13 and the NC data 2 from the management device 101. 20 0 is raised.
- the service supply device 2 uploads the mounting tact information 2 13 and the NC data 220 from the service receiving device 1.
- the service supply device 2 performs a mounting tact simulation on the collected NC data 220, calculates a tact loss, and compares the collected mounting tact information and the calculated tact loss with the operation quality information DB 51. It is stored in the mounting tact DB32.
- the service supply device 2 looks at the mounting event from the mounting event DB 32 and analyzes the cause of the drop in the event to find out. Then, feedback for removing the cause is provided to the service receiving apparatus 1. For example, if the movement loss of the XY table 9 of the mounting machine nl 08 is the cause, the NC data that collected the optimization of the mounting order to remove the movement loss of the XY table 9 is Do.
- the NC data 220 optimized in this way performs the mounting tact time simulation and confirms that the decrease in mounting time has been eliminated, and then the optimized NC data to the service receiving device 1.
- the service receiving apparatus 1 feeds back the optimized NC data 220 to the management apparatus 101.
- the management device 101 feeds the NC data 220 that has been optimized to each mounting machine nl08 of the component mounting line 100.
- the quality analysis monitors the inspection results of each inspection machine in the component mounting line 100, analyzes the cause of the quality defect, and provides feedback to eliminate the cause of the defect.
- the management device 101 receives the upload request of the inspection result information 212 from the service receiving device 1 and uploads the inspection result information 212 of each inspection machine from the component mounting line 100. I do.
- the service receiving apparatus 1 receives the upload request for the inspection result information 2 12 from the service supplying apparatus 2 and uploads the inspection result information 2 12 from the management apparatus 101.
- the service supply device 2 uploads the inspection result information 2 1 2 from the service reception device 1.
- the service supply device 2 accumulates the collected inspection result information 2 12 in the inspection result DB 34 of the operation quality information DB 51.
- the service supply device 2 recognizes the defect based on the inspection result DB 34 and analyzes the cause with reference to the equipment information DB 30 and the uploaded NC data 220. Then, feedback for removing the cause is provided to the service receiving apparatus 1. For example, if the movement speed of the XY template 9 specified in the parts library 2 41 was incorrectly increased, and the parts were misaligned due to inertial force, resulting in poor quality, move the XY table 9 The component library 2 4 1 with the corrected speed is fed back to the service receiving device 1.
- Step S 101 (Contract level: ⁇ Setting)
- step S 101 in the service receiving device 1, in response to an instruction from the input unit 24 through an operation, the control unit 21 transmits the program area 2 of the storage unit 22 to the program area 2.
- the control unit 21 displays the mounting WEB screen shown in Fig. 24 on the display unit 25 according to the contents of the service receiving program, and displays the display unit 25 and the input unit. From 24, you will be prompted to perform an operation to withdraw the service.
- the control unit 21 prompts the operator to input a user name from the display unit 25 and the input unit 24.
- the control unit 21 transmits the input user name to the service supply device 2 via the network 60 by the service supply device-side transmitting / receiving unit 23.
- the control unit 301 registers the user name received by the transmission / reception unit 305 via the network 60 in the contract DB 322 of the service information DB 266 (at this time, the user Also register the user code assigned so that each name is unique.)
- the control unit 301 automatically sets a contract level 0 to the contract DB 320.
- the control unit 301 transmits the fact that the user name is registered and the contract level 0 has been set to the service receiving apparatus 1 via the network 60 by the transmitting / receiving unit 305.
- the control unit 21 receives, via the network 60, that the user name has been registered and the contract level 0 has been set, via the network 60, and the control unit 21 displays the service.
- the menu of the implementation WEB screen (see Fig. 24) is displayed so that the service of contract level 0 can be selected. That is, in the state of contract level 0, the sales information service (step S103), the electronic instruction manual service (step Step S104) and repair parts service (Step S105) can be selected.
- the user When the contract level 0 is registered, the user is charged at the contract level 0. Billing is performed periodically, for example, on a monthly basis. As a result, instead of being charged each time a service is supplied, billing is performed on a regular basis, for example, on a monthly basis, depending on the level of the service contract, so that both the user and the manufacturer can perform the billing process. Can be simplified. In addition, there is no problem for users to select unnecessary services and be charged incorrectly.
- Step S 10 2 (Automatic sending setting)
- step S 102 in the service receiving device 1, the control unit 21 displays on the display unit 25 whether or not the service program 2 15 and the service program 2 16 are automatically sent (the contract shown in FIG. 30). Prompts you to specify (see DB320).
- the control unit 21 transmits the input contents to the service supply device side transmitting / receiving unit 23, The data is transmitted to the service supply device 2 via the network 60.
- the control unit 301 transmits and receives the service data 215 and the service program 216 received from the service receiving device 1 via the network 60 by the transmission and reception unit 305. Register the specified contents of whether or not to automatically send to the contract DB320.
- the program 216 is read from the service information DB 26 and transmitted to the service receiving device 1 via the network 60 by the transmission / reception unit 305.
- the control unit 21 transmits the service data 215 automatically transmitted from the service supplying device 2 via the network 60 by the transmitting / receiving unit 23 on the service supplying device side, and the service program.
- the display 25 indicates that the received service program 2 15 and the service program 2 16 have been revised or upgraded.
- a message prompting the user to confirm whether or not to replace is displayed. If an input to replace is received from the input unit 24, replacement is performed.
- the control unit 301 of the service supply device 2 refers to the delivery results stored in the contract DB 3200, Only the service data 215 and service program 216 related to the model of the component mounter that the user has delivered in the past are read from the service information DB 26, and the network Service via 60 It may be transmitted to the receiving device 1. As a result, the user can receive only the service program 215 and the service program 216 related to the necessary component mounting machine model, and can receive the service efficiently without waste.
- step S103 when the "sales information" menu is selected by the operator in the service receiving device 1, the control unit 21 issues an instruction to refer to the sales information on the service receiving device side.
- the transmission / reception unit 23 transmits the data to the service supply device 2 via the network 60. This is received by the transmission / reception unit 305, and in the service supply device 2, the control unit 301 references the sales information to the sales information DB 321 and transmits the referred sales information to the transmission / reception unit 3. By means of 05, it transmits to the service receiving apparatus 1 via the network 60.
- the control unit 21 In the service receiving device 1, when the sales information referred to is received by the transmission / reception unit 23 on the service supply device side, the control unit 21 outputs the sales information to the display unit 25 or the transmission / reception unit 20 on the management device side. Thus, the information is transmitted to the management device 101 of the corresponding factory via the intranet 3.
- the sales information for example, an electronic file of a catalog or specification of a desired component mounter can be imported (see the sales information DB 3221 in Fig. 31).
- the user or c can consider the specifications of the latest component mounter evening to Imuri, it is possible to obtain information of the component mounter desired specifications such mounting tact Ya mounting accuracy can be realized.
- control of service supply device 2 Part 301 refers to the delivery results accumulated in the contract DB320 and determines whether the sales information for the model of component mounting machines that the user has delivered in the past has been revised. I do.
- the control unit 301 fetches the revised business information from the business information DB 321, and the transmission / reception unit 305 sends the service receiving device 1 via the network 60. Send to As a result, the service receiving device 1 does not always check the service supply device 2 for the revision of the business information, and the latest power of the necessary component mounting machine at the timing of the revision.
- the timing of automatic sending of business information be other than that there is the revision, for example, at the timing when the new models of the component mounting machine is released, the exhibition It may be automatically sent at the timing immediately before listing the component mounter or periodically (for example, at the beginning of the year).
- step S104 when the operator selects the “electronic instruction manual” menu in the service receiving device 1, the control unit 21 issues an instruction to refer to the electronic instruction manual to the service supply device.
- the transmission / reception unit 23 transmits the data to the service supply device 2 via the network 60. This is received by the transmission / reception unit 305, and in the service supply device 2, the control unit 301 refers to the electronic file of the instruction manual with respect to the operation manual DB322, and The electronic file of the instruction is transmitted to the service receiving apparatus 1 via the network 60 by the transmission / reception unit 305.
- the control unit 21 when the electronic file of the referenced instruction manual is received by the transmission / reception unit 23 on the service supply device side, the control unit 21 outputs the electronic file of the instruction manual to the display unit 25.
- the data is transmitted to the management device 101 of the corresponding factory via the intranet 3 by the management device side transmission / reception unit 20.
- the latest instruction manual for the component mounter of the desired model can be obtained in the evening and the operation of the component mounter can be understood.
- the service supply device 2 refers to the delivery results stored in the contract DB 320 and determines whether the user has revised the instruction manual for the model of the component mounting machine that has been delivered in the past. If there is a revision, the control unit 301 fetches the electronic file of the revised instruction from the instruction DB 322, and the transmission / reception unit 305 The data is transmitted to the service receiving device 1 via the network 60. As a result, the service receiving apparatus 1 does not always check the service supply apparatus 2 for the revision of the instruction manual, and describes the latest handling of the component mounter of the required model at the timing of the revision. You can get an electronic file of the book.
- step S105 when the operator selects the "repair part" menu in the service receiving device 1, the control unit 21 issues an instruction to refer to the stock information of the repair part II to the service supply unit.
- the transmission / reception unit 23 transmits the data to the service supply device 2 via the network 60. This is received by the transmission / reception unit 305, and in the service supply device 2, the control unit 301 refers to the repair information DB 323 to the repair information stock information (see FIG. 33). Then, the stock information of the repaired PC referred to is transmitted to the service receiving apparatus 1 via the network 60 by the transmission / reception unit 305.
- the control unit 21 When the service receiving device 1 receives the stock information of the repair part referred by the service sending and receiving unit 23 on the service supply device side, the control unit 21 outputs the stock information of the repair part to the display unit 25, or performs management.
- the transmission / reception unit 20 transmits the data to the management device 101 of the corresponding factory via the intranet 3.
- the user can view the stock information of the repair parlor in the service receiving device 1 or the management device 101 of each factory, and the delivery date of the repair parlor when the repair parcel is arranged. Can know how much.
- the control unit 21 causes the display unit 25 to display a message prompting the input of the repair shop, and when the input of the repair shop is input from the input unit 24,
- the contents of the arrangement of the repair parts are transmitted to the service supply device 2 via the network 60 by the transmission / reception section 23 on the service supply device side. This is received by the transmission / reception unit 305, and in the service supply device 2, the control unit 301 registers the contents of the arrangement of the repair part with the repair part DB 323. Specifically, the part number, quantity, and delivery date of the repair part are registered (refer to the order information 359 of the repair part DB 323 in FIG. 33).
- the control unit 301 determines whether or not the order has been made as input by the user, and 5 to the service receiving device 1 via the network 60. This allows the user to know exactly when the repair shop requested for the arrangement will be delivered.
- step S106 the control unit 21 of the service receiving device 1 or the control unit 301 of the service supply device 2 determines whether the operator of the component mounter k is frequently replaced.
- a specific method for the control unit 21 of the service receiving device 1 or the control unit 301 of the service supplying device 2 to determine whether the operator of the component mounter k is frequently replaced may be as follows.
- control unit 21 of the service receiving apparatus 1 prompts the display unit 25 to input an answer as to whether or not the operation of the component mounting machine k has been switched, and the answer from the input unit 24 In the case where the content is “Yes”, the controller 21 may determine that the operation of the component mounter k is frequently replaced.
- the operator name of the component mounter k is registered in the component mounter k, the management device 101, or the service receiving device 1, and the control unit 21 of the service receiving device 1 is registered in each component mounter k.
- the control unit 21 checks the operator name of the component mounter k when a new operator name is registered or when it is recognized that the operator name changes frequently. You may decide that the night will change frequently. In such processing, when it is determined that the operator of the component mounter k is frequently replaced, the control unit 21 displays on the display unit 25 a message indicating that the contract level 1 is to be registered, and the operation of the service receiving device 1 is performed. It may be one that prompts you to confirm overnight.
- control unit 21 of the service receiving device 1 or the control unit 301 of the service supplying device 2 does not judge whether or not the operation of the component mounting machine k has been switched.
- the operator determines whether the component mounter k has been replaced. Then, by selecting the “Contract” menu on the service receiving device 1 and entering the contract level 1, the service supplying device 2 may register the contract level 1 in the contract DB 3 20.
- Step S 107 (Contract level: 1 setting)
- step S106 the control unit 21 of the service receiving device 1 or the control unit 301 of the service supplying device 2 determines whether the operation has been performed, or the operator of the service receiving device 1 selects the "contract" menu.
- the control unit 301 of the service supply device 2 sets the contract level 1 to the contract DB 3200.
- the control unit 301 transmits the fact that the contract level 1 has been set to the service receiving apparatus 1 via the network 60 by the transmission / reception unit 350.
- the control unit 21 receives the fact that the contract level 1 has been set via the network 60 by the transmitting / receiving unit 23 on the service supplying device side, and displays the mounted WEB Display the menu on the screen (see Fig.
- contract level 1 services can be selected.
- the virtual training service (step S108) has been added to the menu on the implementation WEB screen (see Fig. 24). Can be selected.
- contract level 1 When the contract level 1 is registered, the user is charged at the contract level 1. Billing is performed periodically, for example, on a monthly basis. Since contract level 1 is a contract level that can derive more advanced services than contract level 0, the amount of billing is usually higher than contract level 0.
- Step S 10 8 (Virtual training service)
- step S108 when the operator selects the "virtual training" menu in the service receiving apparatus 1, the control unit 21 issues an instruction to load virtual training software to the service receiving apparatus 1.
- the transmission / reception unit 23 on the supply device side transmits the data to the service supply device 2 via the network 60. This is received by the transmission / reception unit 305, and in the service supply device 2, the control unit 301
- the virtual training software is loaded into the char training DB 324, and the loaded virtual training software is transmitted to the service receiving apparatus 1 via the network 60 by the transmission / reception unit 305.
- the control unit 21 outputs a notification to that effect to the display unit 25, and the virtual training is performed.
- the software is stored in the program area 27 of the storage unit 22.
- the transmission / reception unit 20 on the management apparatus side transmits the data to the management apparatus 101 of the corresponding factory via the intranet 3.
- virtual training software can be activated to perform virtual training. Also, by transferring the virtual training software to the factory management device 101, virtual training can be performed with the factory management device 101. Therefore, even if the operation of the component mounter k is replaced by a beginner, the beginner can learn the operation of the component mounter k by virtual training, and trouble due to an operation error can be prevented. .
- step S109 the control unit 21 of the service receiving device 1 or the control unit 301 of the service supplying device 2 determines whether it is necessary to improve the maintenance level of the operation of the component mounter k. If it is determined, the contract level 2 is set in step S110.
- the control unit 21 of the service receiving device 1 or the control unit 301 of the service supply device 2 determines whether the maintenance level of the operator of the component mounter k needs to be improved.
- the specific method is as follows. good.
- control unit 21 of the service receiving device 1 prompts the display unit 25 to input an answer on the necessity of improving the maintenance level of the operation of the component mounter k. If the content of the answer entered from 4 is "Yes", The control section 21 may determine that the maintenance level of the component mounting machine k during the operation is required to be improved.
- each component mounting machine k stores the frequency of occurrence of troubles that hinder the production of the component mounting machine k due to the maintenance level of the operator of the component mounting machine k, and based on the stored contents, the service receiving device 1
- the control unit 21 or the control unit 301 of the service supply device 2 may determine whether it is necessary to improve the maintenance level of the operation of the component mounter k. In such a process, when the control unit 21 determines that the maintenance level of the operation of the component mounter k needs to be improved, the control unit 21 displays on the display unit 25 a message indicating that the contract level 2 is to be registered, and receives the service. Operation of device 1 It may be one that prompts confirmation of the operation overnight.
- control unit 21 of the service receiving device 1 or the control unit 301 of the service supplying device 2 does not judge whether the maintenance level of the operation of the component mounter k needs to be improved, and the service is received.
- the operator of device 1 determines whether the maintenance level of the operation of component mounter k needs to be improved, selects the ⁇ contract '' menu on service receiving device 1 and enters contract level 2
- the service supply device 2 may register the contract level 2 in the contract DB 3200.
- Step S 110 (Contract level: 2 settings)
- step S109 the control unit 21 of the service receiving device 1 or the control unit 301 of the service receiving device 2 determines the result, or the operator of the service receiving device 1 selects the "contract" menu, By inputting the contract level 2, in step S110, the control unit 301 of the service supply device 2 sets the contract level 3 in the contract DB 3200.
- the control unit 301 transmits the fact that the contract level 2 has been set to the service receiving apparatus 1 via the network 60 by the transmission / reception unit 350.
- the control unit 21 receives the fact that the contract level 2 has been set via the network 60 by the transmitting / receiving unit 23 on the service supplying device side, and displays the mounting WE on the display unit 25. Display the menu on the B screen (see Fig.
- Step S111 the maintenance information service
- Step S 1 1 2 the software version-up service
- Contract level 2 is a contract level that can derive more advanced services than contract level 1, so the charge is usually higher than contract level 1.
- step S111 when the operator selects the "maintenance information" menu in the service receiving device 1, the control unit 21 issues an instruction to refer to the maintenance information to the service transmitting / receiving unit on the service supply device side. According to 23, the data is transmitted to the service supply device 2 via the network 60. This is received by the transmitting / receiving section 305, and in the service supply device 2, the control section 301 refers to the maintenance information DB 325 to the maintenance information (see FIG. 35). At the same time, the control unit 301 transmits the referred maintenance information to the service receiving device 1 via the network 60 by the transmission / reception unit 350.
- the control unit 21 outputs the maintenance information to the display unit 25, or the management device side transmission / reception unit 20 To the management device 101 of the corresponding factory via the intranet 3. C. Thereby, the user can immediately receive the service management device 101 or the management device 101 of each factory in the evening.
- the maintenance information 3 6 3 and the maintenance manual can be viewed, and it is possible to know how to solve the problem of the component mounter k and how to maintain it so that it does not cause a problem.Maintenance of the operation of the component mounter k Level can be improved.
- step SI 11 it is set in the contract DB 3 20 that the batch automatic transmission or the automatic transmission of the maintenance information is set.
- contract level 2 the control unit 301 of the service supply device 2 refers to the delivery record accumulated in the contract DB 3 It is determined whether maintenance information related to a certain mounter model has been revised.
- the control unit 301 fetches the revised maintenance information from the maintenance information DB 325 and sends it to the service receiving apparatus 1 via the network 60 by the transmission / reception unit 305. Send.
- the service receiving apparatus 1 obtains the latest maintenance information of the required type of component mounting machine at the timing of the revision without always checking the maintenance information for the service supplying apparatus 2 with respect to the service supplying apparatus 2. be able to.
- Step S112 (Software Version Up Service)
- the control unit 21 transmits an instruction to take in software version-up to the service supply device 2 via the network 60 by the service supply device-side transmission / reception unit 23. This is received by the transmission / reception unit 305, and in the service supply unit 2, the control unit 301 sends the software version information 366 and the latest software 366 to the software DB 326. Import At the same time, the control unit 301 transmits the acquired software version information 366 and the latest software 366 to the service receiving apparatus 1 via the network 60 by the transmission / reception unit 305.
- the control unit 21 sends a message to that effect and the software version.
- the software version upgrade information 3666 is output to the display unit 25, and the software version upgrade information 3666 and the latest software 3667 are applied via the intranet 3 by the management device transmitting / receiving unit 20.
- the factory management device 101 As a result, the user can view the software version-up information 366 on the service receiving device 1 or the management device 101 of each factory, and is currently operating on the component mounter k. You can check if there is a newer version than the existing software, and if so, what the version up contents are.
- the management apparatus 101 transfers the latest software 3667 transferred to the component mounter k and installs the same.
- the version of the component mounter k can be upgraded to operate with the latest software, and the function of the component mounter k can be improved or maintenance can be performed to resolve the problem with the old version. .
- the control unit 301 of the service supply device 2 refers to the delivery record stored in the contract DB 3200 and determines the model of the component mounter that the user has delivered in the past. It is determined whether there has been a software version update 366 revision or the latest software 366 version upgrade, and if there has been a revision or version upgrade, the software version update information 366 or The latest software version 369, which has been upgraded, is imported from the software DB 326, and the transmission / reception section 305 provides services via the network 60. And transmits to the feeding device 1.
- the service receiving device 1 does not always check the service supply device 2 for the revision of the software version-up information 366 or the version upgrade of the latest software 366.
- the latest software version upgrade information 366 or the latest software 366 of the required component mounter can be obtained.
- Step S 1 1 3 (Contract level 3 conditions)
- the control unit 21 of the service receiving device 1 or the control unit 301 of the service supplying device 2 determines whether or not the support information at the time of starting the board is necessary.
- a specific method for the control unit 21 of the service receiving device 1 or the control unit 301 of the service supply device 2 to determine whether the support information at the time of starting the board is necessary may be as follows.
- control unit 21 of the service receiving apparatus 1 prompts the display unit 25 to input an answer on the necessity of the support information at the time of starting the board. If the answer is "Yes", the control unit 21 may determine that support information for starting the board is necessary.
- each component mounter k stores the frequency of occurrence of troubles that hinder the production of the component mounter k due to lack of support information at the time of starting the board.
- the control unit 21 or the control unit 301 of the service supply device 2 may determine whether or not support information for starting the board is necessary. In such a process, when the control unit 21 determines that the support information at the time of starting the board is necessary, the control unit 21 displays on the display unit 25 a message indicating that the contract level 3 is to be registered, and displays the operation information of the service receiving apparatus 1. It may be one that prompts the user to confirm.
- control unit 21 of the service receiving device 1 or the control unit 301 of the service supplying device 2 does not judge whether the support information at the time of starting the substrate is necessary, and the operation of the service receiving device 1 is performed. Judgment is needed as to whether or not support information is needed at the time of board start-up.Select the “Contract” menu on the service receiving device 1 and enter the contract level 3 so that the service supplying device 2 can enter the contract DB 3 20 It is sufficient to register contract level 3.
- step S113 the control unit 21 of the service receiving device 1 or the control unit 301 of the service supplying device 2 determines the result of the judgment, or the operator of the service receiving device 1 selects the "contract" menu. Then, by entering the contract level 3, in step S114, the control unit 301 of the service supply device 2 Set contract level 3 to 3 2 0. The control unit 301 transmits the fact that the contract level 3 has been set to the service receiving apparatus 1 via the network 60 by the transmission / reception unit 305. In the service receiving device 1, the control unit 21 receives, via the network 60, the fact that the contract level 3 has been set by the transmitting / receiving unit 23 on the service providing device side, and displays the implemented WEB on the display unit 25. Display the menu on the screen (see Fig.
- step S 1 15 the mounting part data service (step S 1 15) and the construction method overnight service (step S 1 16) can be newly selected.
- contract level 3 When contract level 3 is registered, the user is charged at contract level 3. Billing is performed periodically, for example, on a monthly basis. Contract level 3 is a contract level that can derive more advanced services than contract level 2, so the charge is usually higher than contract level 2.
- Step S 1 15 (Mounted part data service)
- step S115 when the operator selects the menu of "Installed parts data" in the service receiving apparatus 1, the control unit 21 issues an instruction to import the parts library 241.
- the data is transmitted to the service supply device 2 via the network 60 by the transmission / reception section 23 on the service supply device side. This is received by the transmission / reception unit 305, and in the service supply device 2, the control unit 301 fetches the component library 241 to the mounted component DB 327, and the fetched component library 241 1 is transmitted to the service receiving apparatus 1 via the network 60 by the transmitting / receiving section 305.
- the control unit 21 outputs the fact to the display unit 25, and the captured component library 24 1 is transmitted to the management device 101 of the corresponding factory via the intranet 3 by the management device side transmission / reception unit 20.
- the management device 101 installs the transferred component library 241 to the component mounter k.
- Step S 1 16 (Construction method overnight service)
- step S116 when the "method data" menu is selected in the service receiving device 1 by the operation, the control unit 21 executes the processing method such as cream solder information and adhesive information.
- An instruction to take in is transmitted to the service supply device 2 via the network 60 by the transmission / reception section 23 on the service supply device side. This is received by the transmission / reception unit 305, and in the service supply device 2, the control unit 301 fetches the construction method data into the mounting method DB 328. At the same time, the control unit 301 transmits the received construction method data to the service receiving device 1 via the network 60 by the transmitting / receiving unit 3 ⁇ 5.
- the control unit 21 when the service method transmitting / receiving unit 23 receives the captured method data, the control unit 21 outputs the fact to the display unit 25, and the captured method data is
- the transmission / reception unit 20 on the management apparatus side transmits the data to the management apparatus 101 of the corresponding factory via the intranet 3. Further, the management apparatus 101 installs the transferred method data into the component mounter k.
- Step S 1 1 7 (Contract level 4 conditions)
- step S117 the control unit 21 of the service receiving device 1 or the control unit 301 of the service supplying device 2 determines whether or not productivity improvement support is necessary. Set the contract level 4 in S118.
- a specific method for the control unit 21 of the service receiving device 1 or the control unit 301 of the service supplying device 2 to determine whether the productivity improvement support is necessary may be as follows. For example, the control unit 21 of the service receiving apparatus 1 prompts the display unit 25 to input an answer as to whether or not there is a need to support productivity improvement. If the content of "" is "Yes", the control unit 21 may judge that it is necessary to support productivity improvement.
- each component mounter k stores the frequency of occurrence of troubles that hinder the production of the component mounter k because there is no support for improving the productivity, and controls the service receiving device 1 based on the stored content.
- the unit 21 or the control unit 301 of the service supply device 2 may determine whether the productivity improvement support is necessary. In such a process, when the control unit 21 determines that it is necessary to support productivity improvement, the control unit 21 displays on the display unit 25 that the contract level 4 is to be registered, and confirms the operation of the service receiving device 1. It may be something that encourages you.
- control unit 21 of the service receiving device 1 or the control unit 301 of the service supplying device 2 does not judge whether or not it is necessary to support the productivity improvement, and the operation of the service receiving device 1 is produced. Judgment as to whether support for improvement of the serviceability is necessary, select the “Contract” menu on the service receiving device 1 and enter the contract level 4 so that the service supplying device 2 registers the contract level 4 in the contract DB 3 20 What you do is good.
- step S117 the control unit 21 of the service receiving device 1 or the control unit 301 of the service supplying device 2 determines whether or not the operator of the service receiving device 1 selects the "contract" menu according to the result of the determination. Then, by inputting the contract level 4, in step S118, the control unit 301 of the service supply device 2 Set contract level 4 to 320.
- the control unit 301 transmits the fact that the contract level 4 has been set to the service receiving device 1 via the network 60 by the transmission / reception unit 350.
- the control unit 21 receives the fact that the contract level 4 has been set via the network 60 by the transmitting and receiving unit 23 on the service supplying device side, and the display unit 25 implements the WE B Display the menu on the screen (see Fig.
- step S119 the optimization service (step S119) is newly added. Can be selected.
- contract level 4 When contract level 4 is registered, users at contract level 4 are charged. Billing is performed periodically, for example, on a monthly basis. Contract level 4 is more contract level than contract level 3 and can provide more advanced services, so the charge is usually higher than contract level 3.
- step S119 in the service receiving device 1, when the "optimization" menu is selected by the operator, the control unit 21 controls the optimization software 3668 and the tool optimization software 374.
- the instruction to load the optimization software such as the implementation tact simulation software 375 and the total implementation tact simulation software 371 is sent to the network 6 by the transmission / reception unit 23 on the service supply device side. 0 to the service supply device 2.
- This is received by the transmission / reception unit 305, and in the service supply device 2, the control unit 301 loads the optimization software into the optimization software DB 329 and loads the obtained optimization software.
- the data is transmitted to the service receiving apparatus 1 via the network 60 by the transmission / reception unit 305.
- the control unit 21 In the service receiving device 1, when the received optimization software is received by the service supply device transmitting / receiving unit 23, the control unit 21 outputs a message to that effect to the display unit 25, and the captured optimization software is displayed. It is stored in the program area 27 of the storage section 22.
- the control unit 21 includes the optimization software 3668, the total optimization software 374, the mounting tact simulation and the total mounting tact from the program area 27 of the storage unit 22. Activate optimization software such as simulation software 371 to optimize the mounting order and simulate the mounting time for the NC data 220 uploaded from the factory. This reduces the tact loss of the component mounter k and reduces the mounting time. Can be recognized. By downloading the optimized NC data 220 into the component mounter k, it is possible to realize effective production support with greatly improved production efficiency.
- control unit 21 transmits the optimization software to the management device 101 of the corresponding factory via the intranet 3 by the management device-side transmission / reception unit 20. Further, the management device 101 installs the transferred optimization software to the component mounter k. As a result, the management device 101 and the component mounter k can also perform optimization and mounting simulation.
- step S119 it is set in the contract DB320 that batch automatic transmission or automatic transmission of optimization software is set, and the contract level 4 If is set, the control unit 301 of the service supply device 2 refers to the delivery record accumulated in the contract DB 3200, and the parts that have been delivered by the user in the past. Judge whether the version of the optimization software for the model of the mounting machine has been upgraded. When there is a version upgrade, the control unit 301 retrieves the upgraded optimization software from the optimization software DB 329, and receives the service via the network 60 by the transmission and reception unit 305. Send to device 1.
- Step S 120 (Contract level 5 conditions)
- step S120 the control unit 21 of the service receiving device 1 or the control unit 301 of the service supply device 2 determines whether an analysis and diagnosis is necessary when the component mounter k is abnormal. If this is the case, set contract level 5 in step S121.c Check whether control analysis of the service receiving device 1 or the service supplying device 2
- the specific method of determining by the unit 301 may be as follows.
- control unit 21 of the service receiving device 1 prompts the display unit 25 to input an answer on the necessity of analysis and diagnosis when the component mounter k is abnormal, and inputs the answer from the input unit 24. If the content of the answer given is “Yes”, the control unit 21 may determine that analysis and diagnosis are necessary when the component mounter k is abnormal.
- each component mounter k stores the frequency of occurrence of troubles that hinder the production of component mounter k due to lack of analysis and diagnosis when component mounter k is abnormal, and provides a service based on the stored contents.
- the control unit 21 of the receiving device 1 or the control unit 301 of the service supply device 2 may determine whether analysis and diagnosis are necessary when the component mounter k is abnormal. In such a process, the control unit 21 displays on the display unit 25 a message indicating that the contract level 5 is to be registered when it is determined that an analysis and diagnosis is necessary when the component mounting machine k is abnormal, and the service receiving device 1 It may be one that prompts confirmation of the operation evening.
- control unit 21 of the service receiving device 1 or the control unit 301 of the service supplying device 2 does not judge whether the analysis and diagnosis when the component mounting machine k is abnormal is necessary, and the control of the service receiving device 1 is not performed.
- the operator decides whether an analysis and diagnosis is necessary when the component mounter k is abnormal, selects the “Contract” menu on the service receiving device 1 and enters the contract level 5, and the service supplying device 2 contracts. It is sufficient to register the contract level 5 in DB320.
- step S120 the control unit 21 of the service receiving device 1 or the control unit 301 of the service supplying device 2 determines the result, or When the operator selects the “Contract” menu and enters the contract level 5, the control unit 301 of the service supply device 2 sets the contract level 3 in the contract DB 3 20 in step S121. I do.
- the control unit 301 transmits the fact that the contract level 5 has been set to the service receiving apparatus 1 via the network 60 by the transmission / reception unit 350.
- the control unit 21 receives, via the network 60, that the contract level 5 has been set by the transmitting / receiving unit 23 on the service supplying device side, and displays the mounted WEB screen on the display unit 25.
- Step S122 is newly added in the menu on the mounting WEB screen (see Fig. 24). Can be selected.
- Contract level 5 When the contract level 5 is registered, the user is charged at the contract level 5. Billing is performed periodically, for example, on a monthly basis. Contract level 5 is a contract level that can derive more advanced services than contract level 4, so the charge is usually higher than contract level 4.
- step S122 when the "analysis" menu is selected in the service receiving device 1 by the operation overnight, the control unit 21 displays on the display unit 25 a message prompting the user to input an error content.
- the control unit 21 sends an instruction to analyze the content of the abnormality by the transmitting / receiving unit 23 on the service supply device side via the network 60 to the service supply device. Send to 2. This is received by the transmission / reception unit 305, and in the service supply device 2, the control unit 301 receives the request, and extracts the monitoring ⁇ analysis software 372 from the monitoring ⁇ analysis software DB 330, and Start.
- control unit 301 periodically monitors the equipment information 211, mounting tact information 212, NC data 220, and inspection results according to the procedure of the monitoring and analysis software 372.
- An upload request for the information 2 12 is transmitted to the service receiving apparatus 1 via the network 60 by the transmitting / receiving section 3 05.
- Control unit 301 is up Analyze abnormalities based on loaded equipment information 2 1 1, mounting tact information 2 1 3, NC data 2 2 0 and inspection result information 2 1 2.
- the analysis result is fed back to the service receiving device 1, and this feedback is performed from the service receiving device 1 to the management device 101, and from the management device 101 to the component mounting machine k.
- the cause of the abnormality that occurred in the component mounter k can be immediately identified, and the countermeasure can be taken appropriately, so that the abnormality can be eliminated with high response.
- step S123 the control unit 21 of the service receiving device 1 or the control unit 301 of the service supplying device 2 determines whether it is necessary to monitor the state of the component mounter k, and determines that it is necessary. In such a case, the contract level 6 is set in step S124.
- a specific method for the control unit 21 of the service receiving device 1 or the control unit 301 of the service supplying device 2 to determine whether the status monitoring of the component mounter k is necessary is as follows.
- control unit 21 of the service receiving apparatus 1 prompts the display unit 25 to input an answer as to whether or not it is necessary to monitor the state of the component mounter k. If the content from 24 is “Yes”, the controller 21 may determine that monitoring of the state of the component mounter k is necessary.
- each component mounter k stores the frequency of occurrence of troubles that hinder the production of the component mounter k due to no monitoring of the state of the component mounter k.
- the service receiving device 1 The control unit 21 of the service supply device 2 or the control unit 301 of the service supply device 2 may determine whether it is necessary to monitor the state of the component mounter k. In such a process, when the control unit 21 determines that it is necessary to monitor the state of the component mounter k, the control unit 21 displays on the display unit 25 that the contract level 6 is to be registered, and the operator of the service receiving device 1 It may be one that prompts confirmation.
- control unit 21 of the service receiving device 1 or the control unit 301 of the service supplying device 2 does not determine whether the state of the component mounter k needs to be monitored, and the service receiving device The operator of Operation 1 judges whether it is necessary to monitor the status of the component mounter k, selects the “Contract” menu on the service receiving device 1 and enters the contract level 6, and the service supplying device 2 What is necessary is to register the contract level 6 in the contract DB320.
- step S123 the control unit 21 of the service receiving device 1 or the control unit 301 of the service providing device 2 determines whether or not the operator of the service receiving device 1 selects the "contract" menu.
- step S 124 the control unit 301 of the service supply device 2 sets the contract level 3 in the contract DB 320.
- the control unit 301 transmits the fact that the contract level 6 has been set to the service receiving apparatus 1 via the network 60 by the transmission / reception unit 350.
- the control unit 21 receives, via the network 60, that the contract level 6 has been set by the transmitting / receiving unit 23 on the service supplying device side, and displays the implemented WEB on the display unit 25.
- a monitoring service (step S125) is newly added in the menu (see Fig. 24) on the mounting WEB screen. Can be selected.
- contract level 6 When contract level 6 is registered, users at contract level 6 are charged. Billing is performed periodically, for example, on a monthly basis. Contract level 6 is more contract level than contract level 5 and can provide more advanced services, so the charge is usually higher than contract level 5.
- step S125 when the "monitoring" menu is selected in the service receiving device 1 by the operation overnight, the control unit 21 executes the component mounting line of the factory using the monitoring and analysis software 372.
- the monitoring / monitoring of 100 is transmitted to the service providing device 2 via the network 60 by the service providing device side transmitting / receiving section 23. This is received by the transmission / reception unit 305 and the service supply device 2
- the control unit 301 reads out the monitoring / analysis software 372 from the monitoring / analysis software DB 330 and activates it.
- the control unit 301 periodically follows the procedure of the monitoring and analysis software 372, and acquires the equipment information 211, the mounting tact information 213, the NC data 210, and the inspection result information 210 on a regular basis.
- the upload request of (12) is transmitted to the service receiving apparatus (1) via the network (60) by the transmitting / receiving section (305).
- the control unit 301 monitors the production status based on the uploaded equipment information 211, mounting tact information 212, NC data 220 and inspection result information 212.
- the control unit 301 analyzes the cause of the problem and feeds back the analysis result to the service receiving device 1 via the network 60 by the transmission / reception unit 350. This monitoring and analysis procedure will be described in detail later.
- the result of analyzing the abnormalities discovered by monitoring and the tendency before the abnormalities are analyzed is fed back to the service receiving device 1, and this feedback is sent from the service receiving device 1 to the management device 101 and from the management device 101 to the parts. Implemented for mounting machine k.
- the component mounter k can immediately detect an abnormality, or the state immediately before the abnormality can be detected, the cause can be immediately identified, and the countermeasures can be taken appropriately, resulting in high response and reliability. Abnormalities can be eliminated or abnormalities can be prevented.
- the monitoring / analysis service is performed in the service supply device 2 by the control unit 301 executing the monitoring / analysis software 372 and controlling according to the procedure of the monitoring / analysis software 372.
- Monitoring and analysis software 372 includes monitoring software and analysis software. When both monitoring and analysis are performed, the monitoring software and analysis software are executed in this order.
- the control unit 301 sends the equipment information 211, the mounting tact information 211, the NC data 220, and the inspection result information 212 to the transmission / reception unit 305 via the network. Collect regularly through Work 60.
- the collected equipment information 2 1 1, mounting event information 2 1 3 and NC data 2 2 0 are stored in the operation quality information DB 51.
- the control unit 301 creates a graph for monitoring the operation status and the quality status based on the collected and accumulated data in the operation quality information DB 51, and displays the graph on the display unit 307. As a result, the occurrence of an abnormality can be immediately recognized, and it becomes easy to analyze the abnormality.
- control unit 301 analyzes the contents of the abnormality found from the monitoring result or input from the service receiving device 1, and pursues the cause.6. Feedback to eliminate the cause is transmitted to the service receiving apparatus 1 by the transmission / reception unit 305 via the network 60.
- the monitoring and analysis software 372 is executed in the service supply device 2 to perform monitoring and analysis, and a graph is displayed on the display section 307 of the service supply device 2. Feedback is provided from the service supply device 2, but this is not a limitation.
- the monitoring and analysis software 372 is installed from the service supply device 2 to the service reception device 1 via the network 60, and the monitoring and analysis software 372 is executed on the service reception device 1, and the service is executed. It is also possible to display a graph on the display unit 25 of the receiving device 1 and provide feedback from the service receiving device 1 to the management device 101 of each factory.
- FIG. 44A shows a flowchart of the operation of the line utilization rate transition analysis.
- the line operation rate indicates the operation rate of the entire component mounting line 100, for example, the operation rate of the neck component mounter, which is the component mounter with the largest actual mounting tact value on the component mounting line 100. Is the line operation rate.
- the control unit 301 based on the mounting quality of the operation quality information DB 51, can be used to determine the actual mounting tact time for each product type of all component mounting machines k at the factory to which the specified component mounting machine is delivered from the mounting stage DB 32.
- the value is read (step S201), and it is determined which component mounter k is the next component mounter (the component mounter with the largest mounting tact value in the component mounting line 100) for each product type. (Step S202). Next, from the equipment information DB 30 of the operation quality information DB 51, the time when the production type was produced for the operation rate of the neck component mounter determined for each of the above production mouth types at the designated component mounter delivery destination factory (Step S203), and the line operation rate transition is displayed on the display unit 307 as a graph (Step S204).
- step S205 For example, if the operator of the service supply device 2 performs an input operation to display details of the stop time in order to analyze the cause of the decrease in the line operation rate (step S205), the operation quality information From the DB 51 facility information DB 30, the facility information 31 of each component mounter k at the specified component mounter delivery destination factory is read every hour (step S 206), and each component mounter k is read.
- the breakdown of the stop time that is, the P board waiting time, the trouble stop time, the maintenance time, and the like are displayed for each time zone every time (step S207).
- Fig. 44B shows a flowchart of the line display tact analysis graph display operation.
- the line mounting tact represents the mounting tact of the entire component mounting line 100.
- the line mounting tact is the maximum mounting tact actual value of the mounting tact actual value of each component mounting machine k of the component mounting line 100.
- the control unit 301 performs the operation tact time of the operation quality information DB 51]
- the information 33 is read (Step S221), and the actual mounting tact values of the respective component mounters k are arranged in a graph so that the tact balance can be understood and displayed on the display section 307 in a graph (Step S222). Then, mount each component mounter k displayed as a graph.
- the tact actual value for example, in the case of the mounting machine n108, the XY table movement loss and the component supply device movement loss of each mounting machine n108 are simultaneously displayed.
- Fig. 44 C shows a flowchart of the operation of the graph display of the adsorption rate transition analysis.
- the c control unit 301 mounts components specified from the equipment information DB 30 of the operation quality information DB 51 as shown in the figure.
- the adsorption rates of all mounting machines at the factory to which the machines are to be delivered are extracted (step S 2 41), and the change in the adsorption rate of each mounting machine n 108 is displayed in a graph on the display section 307 (step S 2 42). ).
- the control unit 301 displays a transition of the rate of occurrence of NG in the inspection result on the display unit 307 in a graph.
- the rate at which NG occurs may be, for example, a rate indicating whether NG occurs even at one location on one circuit board, or a rate at which NG occurs at each and every component mounted.
- the control unit 301 displays the breakdown of the NG of the inspection result on the display unit 307 in a graph. For example, in the inspection results for each time zone or production type, the frequency of occurrence of misplacement of parts, missing parts, bridge and solder connection failure, etc. is displayed in a graph. In addition, for example, it is displayed whether the breakdown of the failure that specifies the circuit board or the circuit number of each one is a component mounting displacement, a component shortage, a bridge, a solder connection failure, or the like.
- the monitoring / analyzing operation will be described with reference to the flowcharts of FIGS. 45 and 56.
- the following monitoring / analysis operation will be described in the case of monitoring and analyzing the placement machine n 108 in the component mounting line 100, but this is not restrictive.
- Other component mounters k may be monitored and analyzed in the same way.
- the main subject of the operation to be monitored and analyzed is the operation of the service supply device 2, and the operation of the service supply device 2 displays the operation status graph as described above. You can check what you have done in various ways to narrow down the problem and pursue the cause.
- the control unit 301 of the service supply device 2 not only displays the above-described graph of the operating status, but also internally performs a process for displaying the graph of the operating status. It should be possible to check various aspects and narrow down the problem to pursue the cause.
- the monitoring and analysis operations are performed by the operator of the service supply device 2 and the control unit 301 of the service supply device 2. In FIG.
- Fig. 47A shows the line operation rate of the component mounting line 100 with the component mounting machine delivery destination specified.
- the horizontal axis is the time and the vertical axis is the line operation rate.
- the line operation rate at each time is displayed in a graph every hour.
- Line 40 indicates the target value of the line operation rate.
- the target value of the line operation rate of 40 is set to 73%. According to this graph, the line operation rate has been maintaining the target value or higher.
- the target value 40 of the line operation rate is stored in the operation quality information DB 51 of the service supply device 2 in advance.
- FIG. 47B shows an example in which the line mounting tact is displayed as a graph.
- the graph of FIG. 47B is the same as the graph of FIG. 47A for the component mounting line 100.
- the horizontal axis is the mounting machine, and the vertical axis is the actual mounting tact value.
- the actual mounting tact value of each mounting machine n108 on the component mounting line 100 is displayed.
- As a breakdown of the actual values of the mounting sunset, the standard mounting sunset, the XY table movement loss (XY loss), and the component supply device movement loss (Z loss) are also displayed in a graph.
- Line 41 indicates the target value of the line mounting tact. According to this graph, The installation time is later than the target value. Therefore, the process proceeds to step S302.
- the target value 41 of the line mounting tact is stored in advance in the operation quality information DB 51 of the service supply device 2.
- step S301 it is monitored whether the standard mounting tact of all the mounting machines is equal to or more than the target value of the line mounting tact (step S301). 2).
- step S301 since there is no mounting machine n108 in which the standard mounting tact is equal to or larger than the target value of the line mounting evening, the process proceeds to step S303.
- step S303 it is monitored whether the line sunset balance is within the allowable range in the graph of the line mounting sunset displayed in step S301 (step S303).
- the allowable range of the line intact balance is set in advance in the operation quality information DB51. As an example, it is set to be within 5% of the average value of each mounting machine nl08.
- Fig. 4 7B the difference in the actual mounting tact value between the mounting machine 1 that is the neck mounting machine described above and the mounting machine 2 that has the minimum actual mounting time value 4 2 is the allowable range of the line tact balance. Since it exceeds 4 3, go to step S 304.
- step S304 it is monitored whether the evening loss of the network-attached machine is within the allowable range in the graph of the line mounting sunset displayed in step S301 (step S304).
- the allowable range of evening Kutorosu, as an example c is intended to set in advance operation quality information DB 5 1, set such that within 5% of the standard implementation evening transfected.
- Fig. 47B it can be seen that the evening loss 44 of the placement machine 1, which is the neck placement machine, exceeds the allowable evening loss range 45.
- the tact loss of the placement machine 1 which is the neck placement machine exceeds the allowable range 45, which is the reason that the line mounting tact is slower than the target value. . Therefore, we need to eliminate this evening. In this case, the process proceeds to step S305.
- step S305 it is determined whether the component supply device 5 is fixed at the same position as the previous type (common component arrangement) (step S305).
- the method of making this determination is based on the NC data 220 (array program 2311) and the distribution of the parts supply device 5. It is also possible to check whether the row is the same as the previous production type, or to set the flag indicating whether it is a common part arrangement with the mounting machine n 108 and the management device 101 and install the service receiving device 1 as the equipment It may be collected together with the information 2 1 1 and judged by looking at the collected flags.
- the placement machine alone is optimized to eliminate the neck placement machine tact and to reduce the line mounting time to the target value or less (step S306).
- both the arrangement of the component supply devices 5 and the mounting order are optimized. Details will be described later.
- the placement machine alone is optimized in order to eliminate the necessity of the neck placement machine. This is an optimization of the mounting order under the condition that the arrangement of the component supply device 5 is fixed. If the line mounting tact can be reduced below the target value, the optimization is completed. If the mounting tact does not fall below the target value, optimization is performed by reviewing the common arrangement of the component supply device 5 '(step S307). Details will be described later.
- step S304 as shown in FIG. 48B, if the tact loss 44 of the placement machine 1 which is the neck placement machine falls within the allowable range 45 of the tact loss, each placement machine n of the component This means that there was a problem with the distribution to 108. In this case, it is necessary to correct the distribution. Therefore, the process proceeds to step S308.
- step S308 it is determined whether the component supply device 5 is fixed at the same position as the previous product type (common component arrangement) in the production type under analysis.
- the determination method is the same as in step S305.
- Step S309 If the placement of the component supply device 5 is free, to optimize the line tact imbalance and reduce the line mounting tact to the target value or less, optimize the redistribution of components to each mounting machine n108. Perform (Step S309). In this case, after the component distribution, each mounting machine nl 08 performs single mounting machine optimization for optimizing both the arrangement of the component supply devices 5 and the mounting order. Details will be described later. On the other hand, if the arrangement of the component supply devices 5 is fixed, optimization is performed by reviewing the common arrangement of the component supply devices 5 (step S310). In this case, as a matter of course, optimization for reallocating the components to the respective mounting machines nl08 is also performed. Details will be described later.
- step S303 as shown in Fig. 49B, when the line sunset balance is achieved, the line mounting sunset is greater than the target value for the evening loss of each mounting machine. This is because the tact loss of each mounting machine is large. It is necessary to optimize each mounting machine to eliminate the evening loss. Therefore, the process proceeds to step S311.
- step S 311 it is determined whether or not the component supply device 5 is fixed at the same position as the previous product type (common component arrangement) in the production type under analysis.
- the determination method is the same as in step S3 ⁇ 5.
- Step S 3 1 If the placement of the component supply device 5 is free, the tact loss of each mounting machine n108 is canceled to reduce the line mounting tact to the target value or less. Step S 3 1 2). In this case, both the arrangement and the mounting order of the component supply devices 5 are optimized. Details will be described later.
- the placement machine nl 08 is optimized individually for each placement machine nl 08 in order to eliminate the evening loss of each placement machine. It is possible to optimize the mounting order under the condition that the arrangement is fixed. If the line mounting tact can be reduced below the target value, the optimization is completed. If the line mounting event does not fall below the target value, optimization is performed by reviewing the common arrangement of the component supply device 5 (step S313). Details will be described later.
- step S302 as shown in Fig. 50B, if the standard mounting tact of all the mounting machines is equal to or higher than the target value 41 of the line mounting tact, Assuming that the line mounting tact cannot be less than or equal to the target value in the configuration, the configuration of the component mounting line 100 is proposed (step S3114).
- Fig. 51 A the line operation rate is below the target value between 15 o'clock and 20 o'clock.
- Fig. 51B the breakdown of the stop time between 15 o'clock and 20 o'clock of the neck mounting machine 1 is displayed in a graph.
- the horizontal axis is the time
- the vertical axis is the stop time.
- the breakdown of the stop time is displayed for each time. From the figure, it can be seen that the type change time is long between 15 o'clock and 20 o'clock (step S315). Therefore, the line operation rate is lowered because the type switching time is long, and the process proceeds to step S316 to optimize the type switching time.
- step S316 the common arrangement of the component supply devices 5 is optimized, and the theoretical values are obtained and verified by the tact simulation for the line mounting tact in each production type and the type switching time between the types. Details will be described later.
- the line operation rate is reduced when the type switching time is long in the neck mounting machine has been described, but even if the mounting machine other than the neck mounting machine constitutes the component mounting line 100, If the type change time becomes longer for a machine with a different machine, the stop time of the neck machine becomes longer due to the effect (for example, model change is performed simultaneously for all machines, If you want to start the next production). As a result, the line availability may decrease.
- the line operation rate is below the target value after 20:00.
- the transition of the suction rate of the component suction nozzle 7 of the mounting machine 1 as the neck mounting machine is displayed. 6 (the target value of the adsorption rate is set in advance to 99.9% in the operation quality information DB 51 of the service supply device 2) (step S3 17). It turns out that the cause of the decrease in the line operation rate is the decrease in the adsorption rate. Therefore, the cause of the decrease in the adsorption rate of the mounting machine 1 is further analyzed.
- the change in the suction rate for each type of component suction nozzle 7 of the placement machine 1 is examined (not shown in the equipment information 2 11 in FIG.
- the suction rate for each type shall be collected), if only a specific component suction nozzle 7 If the suction rate of the suction nozzle 7 has decreased (step S 3 18), it is because a failure has occurred in the suction nozzle 7. In this case, a message is sent to the management device 101 of the corresponding component mounting machine delivery factory to replace the suction nozzle 7. If necessary, register in the repair information DB32 in the service information DB26 to arrange to send the component suction nozzle 7 as a repaired part to the relevant component mounting machine delivery factory. (Step S3 19) o
- step S320 the change in the adsorption rate for each type of the component supply device 5 (for example, the parts cassette) of the mounting machine 1 is examined (this is also collected as one day in the equipment information 211). If the suction rate of only the component supply device 5 has decreased (step S320), it is because a defect has occurred in the component supply device 5. In this case, a message is sent to the management device 101 of the corresponding component mounting machine delivery factory to replace the component supply device 5. If necessary, register in the repair table DB32 in the service information DB26 to arrange to ship the part supply device 5 as a repaired part to the relevant factory where the component mounting machine is delivered ( Step S 3 2 1).
- the placement machine 1 is optimized for the placement machine 1 to eliminate the movement loss of the component supply device 5 (step S32).
- a neck placement machine with a reduced suction rate If it is downstream of n108, the stoppage time of waiting for the P board (waiting for circuit board transport) becomes longer, and if the neck mounting machine is upstream of the mounting machine n108 with a reduced suction rate, However, the stoppage time when the circuit board stays downstream is full (one type waiting for the P board) becomes longer. As a result, the line availability may decrease.
- the line operation rate falls between 20 and 22 o'clock.
- the breakdown of the stop time of the mounting machine 1, which is the network mounting machine, from 20 o'clock to 22 o'clock is displayed in a graph. From the figure, it can be seen that the trouble stop time is large between 20 and 22 o'clock. It turns out that the long time to stop the trap is the cause of the decrease in the line operation rate. Therefore, the cause of the increase in the trouble stop time of the mounting machine 1 is further analyzed.
- C the transition of the number of operation errors is examined (the equipment information 2 11 in FIG.
- each mounting machine n108 detects an operation error and collects the number of operation errors.
- An operation error in the evening causes the line operation rate to decrease (step S32).
- a message is sent to the management device 101 of the factory to which the corresponding component mounting machine is delivered, to the effect that the operation error during the operation was the cause of the reduced line operation rate.
- step S325 Take out the virtual training software 361 for the mounting machine 1 from the virtual training DB 324 in the service information DB 266, start the extracted virtual training software 361, Virtual training by remote processing using the management device 101 of the component mounting machine delivery factory or the display unit of the mounting machine 1 is performed for the operation overnight (step S325).
- This virtual training is performed for an operation in which an error has occurred according to the content of the operation error (assumed to be collected as the equipment information 211 and written in the equipment information DB 30).
- a record about the shift of the operation one night is also written, so that an operation error occurs in a specific shift. You can also analyze what is happening. As a result, if it occurs only in a specific shift time period, that is, at the time of a specific operator, it is possible to take a measure specific to the operator, such as performing virtual training for that operator.
- the software version of the mounting machine 1 is checked (not shown in the equipment information 211 of FIG. 22, but the software version information of each mounting machine n 108 is displayed as the equipment information 2 1 1 , Service quality information; stored in DB 51), service information Software in DB 26; upgrade information 3 66 of DB 3 26, refer to current status of mounting machine 1
- step S32 the latest version of software 366 of the applicable mounting machine is fetched from the service supply device 2 from the software DB 326 in the service information DB 26, and the corresponding component mounting machine
- the data is transferred to the management device 101, and is installed in the corresponding mounting device n108 by remote processing (step S3227).
- information on the latest version installed for example, the contents of the version upgrade and the contents of the corrected bugs are also transferred to the management apparatus 101.
- Service information Instructions in DB 26 Retrieve and transfer from DB 3 22 or service information; Virtual training in DB 26 retrieve virtual training software 36 1 from DB 32 4 and perform virtual training And other services.
- the insufficiency of the parts library 241 causes a decrease in the line operation rate (step S328).
- the component library 24 1 of the mounting machine concerned is read out from the mounting component DB 3 27 in the service information DB 26 6 and transferred to the management device 101 of the applicable component mounting machine delivery factory ( Step S32 9).
- the component library 2 41 held in the mounted component DB 327 covers the data of components of all component manufacturers used in the mounting industry.
- the mounting machine other than the neck mounting machine also constitutes the component mounting line 100
- the stoppage time of the neck mounting machine increases due to the influence. For example, if the neck mounting machine is located downstream of the mounting machine with a long trouble stop time, the stop time of waiting for the P board (waiting for circuit board transfer) will be long, and the neck mounting machine will have a long trouble stop time. If it is upstream of the machine, the downtime of the full circuit downstream (a type waiting for the P board), in which the circuit board is stagnated downstream, becomes longer. As a result, the line availability may decrease.
- the line operation rate decreases between 20 o'clock and 22 o'clock.
- the breakdown of the stop time of the neck mounting machine 1 from 20 o'clock to 22 o'clock is displayed in a graph. From the figure, it can be seen that the part outage stop time is large between 20 o'clock and 22 o'clock. C It is clear that the long part outage stop time is the cause of the decrease in the line operation rate (step S330).
- step S33.1 it is important to quickly replace the part supply device 5 that has run out of parts.
- the component it is important to quickly replace the part supply device 5 that has run out of parts.
- the number of parts used by one component supply device 5 If the number of components 5 is increased so as to be shared and supplied from the plurality of component supply devices 5, the component itself does not occur.
- the stop time of the neck mounting machine increases due to the influence. For example, if the neck placement machine is located downstream of the placement machine n1 • 8, where the part cut-off time is long, the stop time of the P board waiting (circuit board transfer waiting) will be long, and the neck placement machine will stop the part cut-off. If it is upstream of the mounting machine n108 that has a long time, the downstream time (one type of waiting for the P board) in which the circuit board is stagnant on the downstream side will be longer. As a result, the line availability may decrease.
- NC data 222 optimization and service Optimum countermeasures such as provision of a line
- NC data 222 optimization and service Optimum countermeasures can be performed by remote control via the network 60, so that the line mounting tact or the line operation rate can be reliably returned to the target value in real time.
- monitoring and analyzing operating conditions at various angles it is possible to take preventive measures before a fatal trouble or production stoppage occurs.
- monitoring and analysis to prevent deterioration of the operation rate and mounting time have been described based on the flowcharts in Figs. 45 and 46.However, monitoring and analysis to prevent quality defects can be performed by the same method. .
- the component library 2 41 Check the specified contents of the mounting speed of those parts. If it turns out that this was specified as high speed, it is assumed that the cause was that the component to be mounted at low speed was mounted at high speed, causing a displacement due to the inertia of the component suction nozzle 7.
- step S306 Operation of single machine optimization in step S306
- the operation of optimizing the mounting machine alone in step S306 will be described with reference to a flowchart shown in FIG. 56 in the case of the high-speed mounting machine 108a.
- step S306 The purpose of the optimization of the mounting machine alone in step S306 is to eliminate the fact that the tact loss of the neck mounting machine has exceeded the allowable range.
- the mounted components are grouped by mounting speed, and the order of mounting from the high-speed to the low-speed is determined in the order of mounting on the circuit board 10 and the arrangement of the component supply devices 5 (step S401).
- the mounting speed is the moving speed of the mounting head 4 or the moving speed of the XY table 9.
- the arrangement of the component supply devices 5 is in the order of high-speed to low-speed groups from near the initial position (origin) on the moving table 6.
- the mounting order and the arrangement of the component supply devices 5 in each speed group are determined (step S402).
- the moving amount of the component supply device 5 is set to be within the allowable movement range (Z movement allowable movement range) within the standard sunset of the component supply device 5.
- the movement amount of the XY table 9 is considered to be within the allowable movement range within the standard tact of the XY table (the XY movement allowable movement range). As a result, there is no moving port for the component supply device 5.
- Making the movement amount of the component supply device 5 fall within the allowable movement range of the component supply device 5 within the standard sunset means, for example, that the allowable movement range of the component supply device 5 within the standard sunset is ⁇ 1. In this case, the components are limited to those of the same component supply device 5 or the component supply device 5 adjacent thereto.
- the movement loss of the XY table 9 is caused. However, even if the amount of movement of the XY table 9 does not fall within the allowable movement range within the standard tact of the XY table 9, consideration should be given to selecting a component at the next mounting position that minimizes the amount of movement. This enables parts supply Even when the movement loss of the device 5 is completely eliminated, the mounting order can be set so as to minimize the movement loss of the XY table 9.
- the movement amount of the component supply device 5 is more strictly limited. That is, the mounting order is such that the component is moved to the next component supply device 5 only after all components of one component supply device 5 have been mounted. In this way, the moving amount of the component supply device 5 can be minimized, and a decrease in the suction rate due to vibration of the component supply device 5 can be prevented.
- the movement loss of the XY table 9 is slightly increased by strictly restricting the movement amount of the component supply device 5, the mounting tact becomes slow.
- a mounting tact simulation is performed, and the theory of the mounting tact is performed.
- the value, that is, the line mounting tact is calculated (step S403).
- the theoretical value of the mounting event is calculated using (Equation 1) to (Equation 6) described above.
- step S404 it is evaluated whether the calculated theoretical value of the line mounting tact has achieved the target value. If the target value has been achieved, the optimization process ends. If the target value has not been achieved, go to step S405.
- step S405 if the components supplied by one component supply device 5 on the circuit board (P board) 10 are largely dispersed, they are dispersed.
- Each group of parts (in the example in the figure, each group is an individual part) is added to a plurality of parts supply devices 5 so as to share and supply them.
- the component supply device 5 for the component a is added to three component supply devices 5. In this way, before adding, in order to eliminate the movement loss of the component supply device 5, for example, if the components of the same component supply device 5 are successively mounted, the XY table 9 moves as shown in the figure.
- the arrangement of the component supply devices 5 can be determined in the order of the closest mounting position of the circuit board 10, so the amount of movement of the XY table 9 is greatly reduced. Is done.
- the arrangement and the mounting order of the component supply device 5 in the same processing as in step S402 are determined (step S406).
- a mounting tact simulation is performed based on the NC data 220 after the optimization in step S 406 to calculate a theoretical value of the mounting time, that is, a theoretical value of the line mounting time (step S407).
- step S408 it is evaluated whether the calculated theoretical value of the line mounting task has achieved the target value. If the target value has been achieved, the optimization process ends. In most cases, it is likely that the target will be achieved. However, if the target value has not been achieved, the process proceeds to step S409.
- step S409 if the target value cannot be achieved even if the above optimization is performed, there is a possibility that there is a problem in the component arrangement on the circuit board. Therefore, a correction of the circuit design is proposed. Or, propose a configuration of the component mounting line 100 so as to have higher capability.
- step S307 The optimization operation in step S307 will be described with reference to a flowchart shown in FIG. 58 in the case of the high-speed placement machine 108a.
- step S307 The purpose of the optimization in step S307 is to eliminate the fact that the tact loss of the neck-mounted machine has exceeded an allowable range.
- step S 4 2 the mounting order is fixed under the condition that the current arrangement of the component supply device 5 is fixed without changing Determine (step S 4 2 1).
- the mounting order as a top priority, consider that the movement amount of the component supply device 5 is within the allowable movement range (Z movement allowable movement range) within the standard sunset of the component supply device 5. As the next priority, consideration is given so that the movement amount of the XY table 9 falls within the allowable movement range (XY movement allowable movement range) within the standard tact of the XY table. Thereby, the movement loss of the component supply device 5 is completely eliminated.
- the moving port of the XY table 9 is further larger than in the case where the arrangement is not fixed.
- FIGS. 59A and 59B As shown in Fig. 59A, if the arrangement of the component supply device 5 is fixed and if the movement of the component supply device 5 is to be kept within the allowable range within the standard tact, for example, the component a is mounted. When finished, the part b of the adjacent parts supply device 5 must be mounted. If part b is far from the current mounting position of part a as shown in the figure, XY table movement loss will result. On the other hand, as shown in FIG.
- the component supply device 5 of d can be arranged next to the component supply device 5 of component a. That is, it is possible to arrange the component supply devices 5 in which the movement loss of the XY table 9 does not occur. Therefore, when the arrangement of the component supply devices 5 is fixed, there is a higher possibility that the movement loss of the XY table 9 will occur as compared with the case where the arrangement is not fixed.
- Step S 4 2 2 a mounting sunset simulation is performed based on the NC data 220 of the optimized neck mounting machine in the determined component mounting order, and a theoretical value of the mounting sunset, that is, a line mounting tact is calculated ( Step S 4 2 2).
- the theoretical value of the mounting tact is calculated using (Equation 1) to (Equation 6) described above.
- step S 4 23 it is evaluated whether or not the calculated theoretical value of the line mounting tact has achieved the target value (step S 4 23). If the target value has been achieved, the optimization process ends. If the target value is not achieved, there is a problem with the arrangement of the component supply devices 5 that are standardized among the product types, that is, the common arrangement of the component supply devices 5 (hereinafter referred to as the common component arrangement). Assuming that the line mounting event did not achieve the target value for the product type, the process proceeds to step S424 in order to perform optimization by reviewing the common component arrangement.
- a common component array is created.
- Figure 6 OA shows an example of creating a common parts array. NC data of all mounting machines of the component mounting line 100 in the production range of the target range (for example, the production type for one day or one week). Evening Create based on 220.
- the mounting machines 1 and 2 are mounted on the component mounting line 100, and three types of production types A, B, and C are described.
- the number of circuit boards to be produced is 200 for type A, 120 for type B, 70 for type C, and the order of A>B> C is large. , B, C.
- the arrangement of the component supply devices 5 of the placement machine 1 and the placement machine 2 (Z in the figure is the arrangement number) is displayed in the order of types A, B, and C.
- the parts supply device 5 for the parts commonly used between the types is arranged at the same position.
- the component supply device 5 of the component is left installed in other types and the component supply device 5 is not used (for example, the component of Z7 of the mounting machine 1).
- g is used only for type A, and is not used for types B and C, and the component supply device 5 is arranged as it is).
- the parts are distributed to the placement machines 1 and 2 so that the tact balance at the standard placement evening calculated by the standard sunset is obtained for the type A with the largest number of products produced.
- the arrangement position of the component supply device 5 for parts commonly used by a plurality of types is set to be an optimal arrangement for the type with the largest number of products to be produced. For example, parts a, b, and c are arranged optimally for type A.
- the arrangement position of the component supply device 5 for a component used only in one type is an optimal arrangement position for the type. For example, the component h is located at the optimum position for the type B.
- step S424 the component mounting order of each mounting machine n108 of each type is determined (step S424).
- the optimization method is the same as in step S 4 21.
- step S424 a simulation of the total production time of all target products is performed, and the total production time is calculated (step S424).
- This is hereafter referred to as packaging production tact simulation.
- the specific calculation method of the mounting production simulation will be described with reference to the examples of FIGS. 60A and 60B.
- the mounting time of each mounting machine is calculated for each product type.
- the calculation of the mounting tact is performed using (Equation 1) to (Equation 6), as in step S422.
- the results of the calculations are shown for each product type in the columns for mounting machine 1 and mounting machine 2.
- the maximum value of the mounting time of each mounting machine becomes the line mounting tact, which can be obtained for each product type as shown in the figure.
- the product production time shown in the figure is obtained.
- the product production time is the time required to mount and produce the boards of the product type for the number of products to be produced.
- the type change time between the respective types is calculated as shown in FIG. 60B.
- the component supply devices 5 used in all target products are mounted on each mounting machine, no replacement of the component supply devices 5 occurs at all.
- the total production time is calculated by taking the sum of the calculated product type production time of each product type and the product change time between the product types.
- the total production time calculated in the case of FIGS. 60A and 60B is 506 minutes and 20 seconds.
- the mounting production tact simulation using this common component arrangement is called the mounting production tact simulation (1).
- the type switching time is considered only for the time required for replacement of the component supply device 5, but the present invention is not limited to this.
- the changeover work time such as the time to change the arrangement of the sabot pin may be considered.
- the partial common component array (Step S 4 2 7).
- the parts supply device 5 for parts commonly used between types has the same arrangement, but it is used only for that type
- the component supply device 5 for components is an array of component supply devices 5 that are used in the production of only the product type and in which parts are partially replaced.
- Figure 61A shows an example of creating a partial common component array.
- the same circuit board as that shown in FIG. 6OA is produced with the same line configuration.
- the arrangement of the component supply devices 5 of the placement machine 1 and the placement machine 2 (Z in the figure is the arrangement number) is displayed in order of types A, B, and C.
- the arrangement of the parts supply devices 5 of parts used in common between types having continuous production orders is the same.
- Z1 to Z3 of the placement machine 1 have the same arrangement for all varieties A, B, and C.
- the component supply device 5 for parts that are not commonly used between consecutive varieties is only that type. It is replaced when the breed changes.
- Z 5 of the mounting machine 1 has a component supply device 5 for component e in type A, but replaces the component supply device 5 for component h in type B, and replaces component e in component C for type C. It is returned to the parts supply device 5 again. Similarly, replacement of the component supply device 5 occurs at the location indicated by the arrow in the figure.
- the components are distributed to the placement machines 1 and 2 so that the tact balance of the standard placement tact calculated by the standard tact for the type A with the largest number of products is distributed.
- the arrangement position of the component supply device 5 for parts commonly used in a plurality of types is set to be an optimal arrangement in the type having the largest number of products to be produced.
- parts a, b, and c are arranged optimally for product type A.
- the arrangement position of the component supply device 5 for a component that is used only in one type is determined to be an optimal arrangement position for the type, and is determined in step S428.
- the component h is located at the optimum position for the type B.
- the component supply device 5 having a common arrangement between the types is fixed, and the component supply device 5 for components used only in that type is not fixed.
- the placement order and the arrangement of the component supply device 5 relating to the components used only for that type are determined for each placement machine n108 and for each type (step S428). Movement of the component supply device 5 is the highest priority in determining the mounting order and determining the arrangement of the component supply device 5 for components used only for that type.
- the allowable movement range Z movement allowable movement range
- XY movement allowable movement range XY movement allowable movement range
- step S 429 a mounting production simulation is performed to calculate the total production time.
- the specific method of calculating the mounting production tact simulation will be described with reference to the examples in FIGS. 61A and 61B.
- the mounting tact of each mounting machine is calculated for each product type.
- the calculation of the mounting tact is performed using (Equation 1) to (Equation 6), as in step S422.
- the calculated results are shown for each type in the mounting tact column of mounting machine 1 and mounting machine 2.
- the mounting tact is slightly shorter than that of the common component arrangement because there is a part that is optimized for each product type.
- the maximum value of the mounting time of each mounting machine becomes the line mounting time, which can be obtained for each product type as shown in the figure.
- the type production time shown in the figure can be obtained.
- the type production time is the time required to mount and produce the boards of the type for the number of products to be produced.
- the type change time between the types is calculated as shown in FIG. 61B.
- the number of replacements of the component supply device 5 when switching between the types A to B and the types B to C in the mounting machines 1 and 2 is shown.
- the time required for one replacement of the component supply device 5 can be obtained by reading out the speed cell 4 14 (cassette replacement time) from the data storage unit 22 of the service receiving device 1.
- the type change time between each type for each mounting machine is calculated by multiplying the part replacement time obtained from the speed You can ask. Then, for the sake of simplicity, if the types are switched simultaneously on the component mounting line 100, the maximum type switching time of the placement machines 1 and 2 becomes the line type switching time. In the case shown in the figure, the line type switching time is 8 minutes for both types A to B and types B to C.
- the total production time is calculated by taking the sum of the calculated product type production time of each product type and the product change time between the product types.
- the total production time calculated in the cases of FIGS. 61A and 61B is 483 minutes.
- the mounting production tact simulation using this partial common component arrangement is called the actual production tact simulation (2).
- NC data of the same production type of each mounting machine of each mounting machine with the same component mounting line 100 as in step S424 and step S422 is performed by setting the arrangement of all the component supply devices 5 free (not fixed) for each product type.
- optimization is performed so that each type is irrelevant and is implemented as a line independently in the shortest possible time. That is, no consideration is given to sharing the component supply device 5 among the types, and the component supply device 5 is arranged in the shortest time individually for each production type. For this purpose, first, for each type, the components are sorted to each mounting machine so that the line tact balance can be obtained (step S430).
- the permissible range of the evening loss of each mounting machine (stored in the operation quality information DB 51 and set, for example, to 5% of the standard mounting evening) is added to the standard mounting takt. Parts are allocated so that the mounting time of each mounting machine can be balanced by the theoretical value of the mounting tact.
- the present invention is not limited to this, and the balance may be obtained in the standard mounting event or in the number of component mounting points. It is also possible to balance with the wearing sunset, which is the average value of the past sunset loss added to the standard wearing evening. However, the balance is more accurate when the balance is set with the mounting sunset taking into account the sunset loss.
- the arrangement of the component supply devices 5 and the order of mounting the components are determined for each mounting machine to which the components have been sorted (step S431).
- the movement amount of the component supply device 5 is within the allowable movement range (Z movement allowable movement range) within the standard tact of the component supply device 5.
- the movement amount of the XY table 9 is within the allowable movement range within the standard sunset of the XY table (XY movement allowable movement range).
- FIG. 62A shows the production of the same circuit board as in FIGS. 60A and 61A with the same line configuration.
- FIG 6 2 A it is displayed arrangement of the component supplying device 5 of the placement machines 1 and 2 (Z in FIG placement ID) varieties A, in the order of B 3 C.
- the arrangement of the component supply devices 5 for each type is individually optimized for each type, and the types are independent. Therefore, even in the case of the component supply device 5 of the same component, the arrangement position is often different, and the component supply device 5 is frequently replaced.
- step S432 a mounting production simulation is performed to calculate a total production time.
- the specific method of calculating the mounting production tact simulation will be described with reference to the example shown in Fig. 62A62B.
- the mounting time of each mounting machine is calculated for each product type.
- the calculation of the mounting tact is performed using (Equation 1) to (Equation 6), as in step S422.
- the results of the calculations are shown for each product type in the columns for mounting machine 1 and mounting machine 2.
- the mounting tact is slightly further reduced by the amount that all the component supply devices 5 are optimized for each product type, as compared with those of the partially common component array.
- the mounting event is shorter in the partial common component array than in the common component array, and in the individual component array than in the partial common component array.
- the maximum value of the mounting time of each mounting machine becomes the line mounting tact, which can be obtained for each product type as shown in the figure.
- multiplying the production number of the corresponding type by the line mounting The product production time shown in FIG.
- the product production time is the time required to mount and produce the boards of the product type in the number of products to be produced.
- the type change time between the respective types is calculated as shown in FIG. 62B.
- the number of replacements of the component supply device 5 when switching between the types A to B and the types B to C in the mounting machines 1 and 2 is shown.
- the time required for one replacement of the component supply device 5 is to read the speed cell 4 14 (force set replacement time) from the data storage area 304 of the storage unit 302 of the service supply device 2. Is obtained by As a result, the type switching time between the types for each mounting machine can be obtained by multiplying the component replacement time obtained from the speed cell 4 14 by the number of component replacements.
- the maximum type switching time of the mounting machines 1 and 2 is the line type switching time.
- the line type switching time is 20 minutes for switching from type A to B and 16 minutes for switching from type B to C.
- the total production time is calculated by taking the sum of the calculated product type production time of each product type and the product change time between the product types.
- the total production time calculated in the case shown in FIGS. 62A and 62B is 490 minutes and 40 seconds.
- the mounting production cycle simulation using this partial common component arrangement is called the mounting production tact simulation (3).
- step S433 Results of optimization to review common component arrangement ⁇
- step S433 the results of mounting tact simulations (1) to (3) are evaluated, and NC data that minimizes the total production time Determine 2 2 0.
- the result of the partial common component arrangement is the minimum total production time of 483 minutes. Therefore, it is determined to be NC data 220 after the partial common component arrangement optimization has been performed.
- the line mounting tact was determined by the NC data 220 determined in step S433. It is evaluated whether it has been improved to achieve the target value (step S434). If the line mounting task has achieved the target value, the optimization process ends. If the target value cannot be achieved even if the optimization is performed as described above, there is a possibility that there is a problem in the component arrangement on the circuit board. Therefore, we propose a modification of the circuit design. Alternatively, the configuration of the component mounting line 100 is proposed so as to have a higher capability (step S435). Alternatively, if the total production time can achieve the target, that is, if the production plan can be achieved, it is assumed that the line mounting tact has not achieved the target only for the relevant product, and the NC data 222 after optimization is used. adopt.
- the mounting speed is described as a single one, and the mounting speed is grouped. However, if there are components with different mounting speeds, it is necessary to arrange component supply devices in order from high to low mounting speed. Similarly, in the following examples of NC data optimization, the description will be made assuming that the mounting speed is single for simplicity. However, if there are components having different mounting speeds, it is necessary to arrange the component supply devices 5 in order of mounting speed from high to low.
- a uniform component arrangement method was used, such as a common component array if the common component array was used for all types, and a partial common component array if the partial common component array was used.
- the arrangement method of parts may be changed. For example, suppose that varieties A, B, C, D, and E are to be continuously produced, and that varieties A, B, and C have a small number of productions, and varieties D and E have a large number of productions. In that case, the common parts arrangement is used for the types A, B, and C, and the individual parts arrangement is used for the types D and E. In this way, if the product types are divided into groups according to the number of products produced and the component arrangement method is switched in the middle, it is possible to optimize the detailed component arrangement that further reduces the total production time.
- Step S309 optimization operation The optimization operation in step S309 will be described with reference to the flowchart shown in FIG. 63 in the case of the high-speed placement machine 108a.
- step S309 The purpose of the optimization in step S309 is to correct the distribution of parts so that line tact balance can be achieved.
- the mounted components are moved in units of the component supply device 5 from the mounting machine with the larger mounting tact value to the mounting machine with the lower mounting tact value so that the mounting tact value is equalized. For example, as many mounting components as necessary to achieve line balance from the neck mounting machine to another mounting machine are moved (step S444). At this time, for example, the mounting parts of the neck mounting machine are gradually moved to the mounting machine with the smallest mounting tact so that the mounting tact of all the mounting machines finally falls within the allowable range.
- the calculation of the mounting tact of each mounting machine after the component movement is a tentative calculation, and the tact of the component added by the movement is added to the mounting tact before the component moving, or the mounting tact before the component moving.
- the tact of the parts reduced by the movement from is subtracted. At this time, the tact of the moving part is the standard tact or the evening tact obtained by multiplying the standard tact by a ratio including a predetermined tact loss.
- the arrangement of the component supply devices 5 and the component placement order are determined (step S4442).
- the movement amount of the component supply device 5 is within the allowable movement range (Z movement allowable movement range) within the standard sunset of the component supply device 5.
- the movement amount of the XY table 9 is considered to be within the allowable movement range within the standard sunset of the XY table 9 (the XY movement allowable movement range).
- a mounting tact simulation is performed based on the determined arrangement of the component supply device 5 and the NC data 222 of the optimized mounting machine nl 08 in the component mounting order. Calculate the theoretical value of the mounting sunset and the line mounting sunset of Step 8 (Step S4443). The theoretical value of the mounting tact is calculated using (Equation 1) to (Equation 6) described above. Next, as a result of the mounting tact simulation, it is evaluated whether the line balance is within an allowable range (Schip S444). If the line sunset balance is within the allowable range, it is evaluated whether the line mounting evening has achieved the target value (step S4445). If the line mounting tact has reached the target value, the optimization process ends.
- step S444 the configuration of the component mounting line 100 is proposed so as to have a higher capability (step S444). Although omitted in Fig. 63, if the line mounting tact does not reach the target value in step S445, it is re-evaluated for tact loss. You may go to the machine.
- step S444 if the line sunset balance is not within the allowable range, investigate the cause. First, because some parts are used more frequently than other parts, that is, the minimum unit of the parts to be sorted is a considerable number of parts. Check if there is any (step S444). If so, go to step S448, otherwise, go to step S448. In step S448, it is checked whether the cause is that the tact loss of the network mounting machine is large. If the cause is a large evening loss of the neck-attaching machine, proceed to step S450, otherwise return to step S441 and repeat steps S441-S443. Perform again and evaluate again whether the tact balance is within the acceptable range.
- step S449 the number of frequently used components is increased so as to be shared and supplied by the plurality of component supply devices 5.
- components that are widely dispersed on the circuit board may be divided so as to be supplied by a plurality of component supply devices 5.
- steps S444 and S443 are performed to evaluate again whether the sunset balance is within the allowable range.
- step S450 as shown in FIG. 57, in the neck mounting machine, components that are widely dispersed on the circuit board are additionally provided so as to be shared and supplied by the plurality of component supply devices 5. Thereby, the movement loss of the XY table 9 can be reduced.
- step S450 the arrangement of the component supply devices 5 and the component mounting order are determined in the neck mounting machine (step S451).
- the movement amount of the component supply device 5 is within the allowable movement range (Z movement allowable movement range) within the standard sunset of the component supply device 5.
- the movement amount of the XY table 9 is within the allowable movement range (XY movement allowable movement range) within the standard sunset of the XY table 9.
- a mounting tact simulation was performed, and the network mounting machine was evaluated.
- step S 4 52 The theoretical value of the mounting time, that is, the line mounting tact is calculated (step S 4 52).
- the theoretical value of the mounting tact is calculated using (Equation 1) to (Equation 6) described above.
- step S445 the line tact balance is within an allowable range.
- step S310 The purpose of the optimization of step S310 is to correct the distribution of parts so that line tact balance can be achieved. However, since it has already been considered to arrange the component supply device 5 common to the types, the same optimization as that in step S307 to review the common component arrangement is performed. Review the distribution of components to each mounting machine. However, in the flowchart of FIG. 58, the processing after step S424 is performed. That is, optimization of common component arrangement, partial common component arrangement, and individual component arrangement shown in (Fig. 60A, Fig. 60B) to (Fig. 62A, Fig. 62B) is performed. Select the optimization result that minimizes the total production time. Others are the same as in the optimization in step S307.
- step S312 Operation of optimization in step S312
- the operation of the optimization in step S312 will be described with reference to the flowchart shown in FIG. 64 in the case of the high-speed placement machine 108a. '
- the purpose of the optimization in step S312 is to keep the evening loss of each mounting machine of the component mounting line 100 within an allowable range so that the line mounting tact achieves the target value.
- the arrangement of the component supply devices 5 and the mounting order of the components are determined (step S4661).
- the movement amount of the component supply device 5 is within the allowable movement range (Z movement allowable movement range) within the standard sunset of the component supply device 5.
- the movement amount of the XY table 9 is within the allowable movement range within the standard sunset of the XY table 9 (XY movement allowable movement range).
- Step S4622 based on the determined arrangement of the component supply devices 5 and the NC data 220 of the respective mounting machines after the optimization in the component mounting order, a mounting tact simulation is performed, and each mounting machine n 10 Calculate the theoretical value of the mounting evening and the line mounting evening in Step 8 (Step S4622).
- the theoretical value of the mounting tact is calculated using (Equation 1) to (Equation 6) described above.
- step S4633 it is evaluated whether the line mounting event has achieved the target value. If the line mounting tact has reached the target value, the optimization process ends. If not, evaluate whether the line sunset balance is within the allowable range (step S464). If the line sunset balance is not within the allowable range, go to step S465 to investigate the cause. If the line tact balance is within the allowable range, the process proceeds to step S 4 72.
- step S4655 since there are parts that are used more frequently than other parts, that is, the minimum unit of the parts to be sorted is a considerable number of parts, so that the mounting machine that has sorted the parts is installed. Investigate whether there is a projecting event. If so, go to step S466; otherwise, go to step S466. In step S 4 6 6, due to the large tact loss of the neck mounting machine Check. If the cause is a large evening loss of the neck mounting machine, the process proceeds to step S469, but if not, the component distribution is corrected in step S468. Correction of component allocation means moving as many mounting components as possible to achieve line balance from a mounting machine with a large mounting tact to a mounting machine with a small mounting tact.
- the mounting parts of the neck mounting machine are gradually moved in order from the mounting machine with the smallest mounting time so that the mounting tact of all the mounting machines finally falls within the allowable range.
- the flow returns to step S461 to determine again the arrangement of the component supply devices 5 of each mounting machine and the component mounting order.
- step S 467 the parts that are frequently used are divided so as to be supplied by a plurality of component supply devices 5.
- the components that are widely dispersed on the circuit board may be additionally provided so as to be shared and supplied by the plurality of component supply devices 5.
- the component distribution is corrected in step S468, and the process returns to step S468.
- step S469 in the network mounting machine, as shown in FIG. 57, the components that are widely dispersed on the circuit board are increased so as to be shared and supplied by the plurality of component supply devices 5. Thereby, the movement loss of the XY table 9 can be reduced.
- step S470 the arrangement of the component supply devices 5 and the order of component mounting are determined in the network mounting machine (step S470).
- the movement amount of the component supply device 5 is within the allowable movement range (Z movement allowable movement range) within the standard tact of the component supply device 5.
- Z movement allowable movement range the allowable movement range
- the XY table 9 is within the allowable movement range within the standard sunset of the XY table 9 (XY movement allowable movement range).
- a mounting tact simulation is performed, and the network mounting machine is executed.
- Step S471 Calculate the theoretical value of the mounting time, ie, the line mounting time (Step S471).
- the theoretical value of the mounting tact is calculated using (Equation 1) to (Equation 6) described above. Put out. Following step S471, in step S463, it is again evaluated whether the line mounting tact has achieved the target value.
- step S4752 the line sunset balance is maintained, but it is checked whether at least one of the mounting machines has a sunset loss within the allowable range. If there is, in the mounting machine whose tact loss is not within the allowable range, as shown in Fig. 57, the parts that are widely dispersed on the circuit board are expanded and supplied by multiple component supply devices 5 (Step S). 4 7 3). Thereby, the movement loss of the XY table 9 can be reduced. After the extension, in step S468, the component distribution is corrected, and the flow returns to step S468.
- step S472 if there is no mounting machine whose evening loss is not within the allowable range, the target value cannot be achieved even if the above optimization is performed. Since there may be a problem, we propose to modify the circuit design. Or, the configuration of the component mounting line 100 is proposed to have higher capability.
- step S313 The purpose of the optimization of step S313 is to keep the tact loss of each mounting machine n108 of the component mounting line 100 within an allowable range and to achieve the target value of the line mounting tact. . Therefore, the same processing as the optimization in step S307 is performed based on the flowchart shown in FIG. However, the difference from the optimization in step S307 is that all the placement machines in the component mounting line 100 are targeted in step S421 and step S422. . In other words, after determining the mounting order under the condition that the arrangement of the component supply devices 5 of all the mounting machines is fixed, the mounting tact of all the mounting machines is simulated to evaluate whether the line mounting tact has achieved the target value. If the target value is not attained, the common component arrangement shown in (FIG.
- step S316 The purpose of the optimization in step S316 is to make the component supply devices 5 common so that the type change time is reduced. Therefore, the same processing as the optimization in step S307 is performed based on the flowchart shown in FIG. However, in FIG. 58, the process starts from step S424. Then, optimization of common component arrangement, partial common component arrangement, and individual component arrangement shown in (Fig. 60A, Fig. 60B) to (Fig. 62A, Fig. 62B) is performed. in c goal of selecting the optimization result the total production time is minimized, last but Ru target maintenance der line operation rate by shortening the type switching time, important to work with the total production time is minimized It is. It is best that the total production time is minimized and the product changeover time is shortened, but it is possible that even if the product changeover time is not shortened, it is good if the total production time is minimal.
- step S323 The operation of optimization in step S323 will be described with reference to a flowchart shown in FIG. 65 in the case of a high-speed placement machine.
- step S32 23 The purpose of the optimization of step S32 23 is to eliminate the movement loss of the component supply device 5, reduce the vibration of the moving table 6 on which the component supply device 5 is mounted, and eliminate the decrease in the suction rate of the component suction nozzle 7. That is.
- step S481 the current arrangement of the component supply devices 5 is fixed and the components of the component supply device 5 on the same circumference are sequentially mounted. That is, the mounting order is such that the component is moved to the next component supply device 5 only after all components of one component supply device 5 have been mounted. In this way, the moving amount of the component supply device 5 can be minimized, and a decrease in the suction rate due to the vibration of the component supply device 5 can be prevented.
- step S4802 the mounting order for mounting the same component supply device 5 is such that the movement of the XY table 9 is within the standard tact movement allowable range. If the movement does not fall within the standard evening movement allowable range, the movement of the XY table 9 should be minimized. .
- the placement order in which the movement amount of the component supply device 5 is strictly limited is determined by the component supply. This is effective in preventing a decrease in the adsorption rate due to the vibration of the part 11.
- the moving distance of the XY table 9 is slightly increased by strictly restricting the moving amount of the component supply device 5, so that the mounting time is delayed.
- step S331 The optimization operation in step S331 will be described with reference to a flowchart shown in FIG. 66 in the case of a high-speed placement machine.
- step S3311 The purpose of the optimization in step S3311 is to increase the number of parts supply devices 5 for frequently used parts, thereby dispersing the reduction in parts and preventing parts from running out during production. It is to be.
- step S 501 the number of components to be used in the production type of the circuit board is estimated (step S 501). Therefore, first, by counting the number of steps of each component ⁇ of the NC program 221, the number of components used by each component supply device 5 used for mounting one circuit board can be obtained. By multiplying the number of parts used in each part supply device 5 by the number of products of the type, the number of parts used in the type of production can be obtained.
- step S502 By comparing the number of used parts with the remaining number of parts in the part supply device 5, it can be determined whether or not parts are to be exhausted during the production of the type (step S502). If the number of parts used is larger, the parts supply device 5 will run out of parts during the production of the product type.
- step S502 if there is a component supply device 5 in which a component shortage occurs, the component supply device 5 is divided so as to be supplied by a plurality of component supply devices 5 (step S503). Set the number of expansions so that the value obtained by dividing the number of used parts by the number of additional parts is less than the number of remaining parts.
- step S504 the process is completed.
- NC Data Center 220 which has been optimized in this way, parts will no longer run out during product production.
- the soldering properties DB3 288a relating to the soldering properties of the cream solder as shown in Fig. 70 and the printing conditions relating to the actual printing data as shown in Fig. 71 are used as the cream soldering information.
- DB3 228b is adopted.
- the service supply device 2 searches the service receiving device 1 for solder characteristic data from the solder characteristic DB 328a shown in FIG. 74, and retrieves the solder characteristic data from the printing condition DB 328 b shown in FIG. It provides a search service that enables you to search for printing conditions and a response service that responds to requests and inquiries about new startup, product change, troubleshooting, quality and productivity improvements.
- the user can easily obtain the appropriate cream solder information and printing conditions corresponding to the issues at the time of launching cream solder printing, changing the product type, and resolving problems. Can respond correctly in a short time.
- service providers can seek their own improvements in quality and productivity to improve their versions.
- the service supply device 2 and the service supply device 2 input the cream solder printing data entered by the service provider themselves, and / or the service. Requests the user to input the actual data on cream solder printing from the screw receiving device 1 and collects and accumulates it. For each type of substrate as shown in Fig. 71, or for each combination of substrate type and number of products produced While creating the printing conditions DB 3 2 bl and 3 2 b 2 And the printing conditions DB3 228b1, 328b2. This allows the service provider to collectively manage the printing conditions selected and executed by the user or the service provider, and treat the data as systematized data that is widely handled as common data regardless of the type of technician.
- the service supply device 2 further determines that the newly entered and registered data, status, and status are appropriate or stable,
- DB3 228c1, 328c2 ⁇ ⁇ To be searched from the service receiving device 1 so that they can be browsed and used at any time.
- the solder property DB328a shown in Fig. 70 is finished as standard data on the service provider side, and is stored while being added or updated each time new data is available, and is provided for retrieval from the user side.
- the information items to be handled are, for example, cream solder manufacturer, cream solder part number, cream solder particle size (M AXZM IN) and viscosity, average solder cream particle size, flux type, flux as shown in the figure.
- the thixo ratio is the ratio of the change in viscosity when a stress is applied to a viscous body, and the fluidity increases with stirring. , The degree of the property of returning to the original state when left standing.
- the corresponding pitch is the corresponding pitch of cream solder for each product number recommended by Meishiri, that is, the pitch between leads and the pitch between electrodes of QFP electronic components to be soldered.
- the alloy composition refers to an alloy composition that causes the properties of cream solder to change depending on the presence or absence of lead, and the presence or absence of lead is a typical example.
- Solder items describe the characteristics of cream solder, and are specifications recommended by the manufacturer according to the product number, such as for high-speed printing, most shipments, and lead-free.
- the flux type is the type of flux used and affects the thixotropic ratio.
- the thixo ratio is related to the kinematic viscosity of the solder during printing. In general, when the content of the flux is large, the viscosity of the cream solder decreases.
- the printing condition DBs 328bl, 328b2 * Shown in FIG. 71 are created and accumulated based on the results data input from the user side.
- the items to be handled are, for example, solder manufacturer, cream solder part number, printing speed, squeegee type, printing pressure (F / R) plate separation operation, plate separation distance, plate separation speed, customer name as shown in the figure.
- the squeegee type refers to the type of squeegee and the moving speed. The type includes urethane, metal, and resin, and the moving speed includes high speed or low speed.
- the printing pressure is a pressing force applied to the screen mask when the squeegee moves, and is input in two ways: a front squeegee F and a rear squeegee R.
- the plate separation operation is a plate separation operation type, and is classified into constant speed, multi-step, and lifting / lowering.
- the plate separation distance and plate separation speed are one condition for constant speed, and one condition for multi-step and lifting You can enter up to 10 conditions.
- the customer name is used to recognize this when using a screen mask or the like that is different from the customer using a printing machine provided by the service provider. It accumulates its custom name. If the name of the maker is unknown, the user is requested to input it. Enter the model number, manufacturing method, minimum pattern, etc.
- the screen gap is the gap between the screen mask at the time of printing and the substrate on which the cream solder is printed. Normally, the substrate slightly lifts the screen mask. I am printing.
- the support method is a method of supporting the board, and there are support pins, support plates, and suction blocks.
- the cleaning mode is used to indicate how to clean and combine dry cleaning D and dry cleaning W in one cleaning. D—D, W—D, W—W, D—D - D, W- W- W- D, W- W- D- D, W- D- D- c number of cleaning times another is a D denotes a cleaning frequency of each printed substrate sheets.
- Mask removal is the state of screen mask squeegee contact.
- 0.5 QFP, 0.4 QFP, and 0.3 QFP indicate the pitch between leads of QFP electronic components in mm in each case, and in each of those pitches, to the minute part of cream solder. Enter the printing faults, such as ridges due to overprinting, thinning due to insufficient printing, slight poorness, and good quality.
- this entry is 0 the. 5 QPF, 0. 4 QPF , 0. 3 c also be entered without limitation QPF, in a state where the squeegee hanging solder cream adhering to the edge after printing After leaving the screen once, when it is pressed again to the screen for printing, the attached cream solder is crushed and wrapped around the back of the squeegee and dragged, adheres to various places on the screen and prints remaining
- QPF Quality of the
- Others are requested by the service provider as required or filled in with the user's data entered without being requested.
- the type of substrate, the number of products to be produced, etc. may be entered here.
- the entry date is the date when the data was entered, the person in charge is the person in charge, and the remarks are all the remarks other than the other items mentioned above. .
- the operation of searching for the solder characteristics data and the operation of inputting and registering the characteristics of the solder characteristics and the printing conditions as described above are performed, for example, on the WEB screen 25 of the service receiving apparatus 1 by cream printing information. Pull out the service homepage under ID management, and follow the selection operation on the menu screen as shown in Fig. 72. On the menu screen shown in the figure, a solder property data input button 1001, a print condition data input button 1002, a search button 1003, and a registration button 1004 are displayed. These selection operations This makes it possible to access the solder characteristics DB328a and the printing conditions DB328b shown in FIGS. 70 and 71 on the service supply device 2 side.
- the printing conditions are substantially determined by the solder part number, the grain size, and the viscosity.
- the part number is at the top of each characteristic item that follows it, and it has the highest priority when searching for those items. If the part number is unknown or the desired solder maker and solder part number cannot be searched, the accuracy is high even if the part number is searched by particle size or viscosity.
- the solder part number is made the highest priority and the efficient search is performed.However, if the solder manufacturer and the solder part number are unknown, the solder part number is searched with priority given to the particle size or viscosity as a semi-essential matter, Thereafter, other solder characteristic data can be sequentially searched as their lower data. Of course, it is of course possible to search from any other items such as the corresponding pitch.
- the procedure of the search operation of this example will be specifically described based on the flowchart shown in FIG. For the sake of simplicity, the operation of searching from all items is omitted, and only the operation of prioritizing the solder part number and re-searching by particle size and viscosity if the search is not possible is described.
- the search is started by selecting the search button 1003 on the web screen 25, and all items below the solder maker shown in Fig. 70 are displayed on the web screen 25 at once (10000) .
- display and guide at least one of the item's character size, arrangement order, and numbering.
- Such guidance can also be provided by textual guidance, displaying one item at a time, starting with the highest priority, and displaying the next item in the next rank when it is unknown and updated.
- the search items are displayed on the screen for the target items, select them and decide (S1001) . If it is determined that the search has been completed or there is an input (S1002), the result of the search is output, for example, by outputting a document to the printer (S1008), and the process ends. If the number of hits becomes large, such as 100 or more hits, the search can be further narrowed down to other items.
- solder property information DB 328a a search for a solder part number based on particle size and viscosity is performed (S1003).
- the search result is output to the web screen 25 (S1004), the closest solder part number is selected. (S1005).
- a search is made for solder properties lower than the solder part number, particle size, and viscosity. If the number of hits is enormous, another item is specified and narrowed down the required number of times (S106). If it is determined that the search is completed, or if there is an input (S1007), the result of the search is output, for example, at the printer (S1008), and the process ends.
- the method program corresponding to the search result can be downloaded from the service supply device, and the method program can be input to the printing press.
- the printing conditions based on the data input from the user side by the service provider DB3 28 b I s 3 28 b 2 ⁇ Basic DB 3 28 c 1, 3 2 8c2 ⁇ Describes how to provide services such as creation, monitoring of printing status, evaluation, countermeasures, and improvement.
- the service supply device 2 receives inquiries and requests from users all over the world that are operating globally for results data, printing status and status data, startup, trouble, and improvements. It is entered and registered every moment. Therefore, each time a registration operation of these inputs is received (S 101), it is determined whether or not it is new data (for example, data input for a new solder part number, board, etc.) (S 101). 1 2). If it is not a new date, the operation is continued (S101), and if the input data is a new date, additional registration or registration to the printing condition DB328b1 Update registration (S0103).
- new data for example, data input for a new solder part number, board, etc.
- the printing conditions DB328b1 and the basic DB328c1 ' which was transferred and accumulated after the optimization or stabilization of the printing conditions, were automatically performed according to the Nikki program or by a technician. By or These are monitored by both parties to analyze and evaluate the relationship between the printing conditions and the printing status or status (S101). As a result of analysis and evaluation, new data registered in the printing conditions DB328b1 ⁇ is judged to be appropriate or stable (S101), and the necessity of overnight change is low. Therefore, it is moved to the basic DB 328c1 1 and registered (S1016), and provided for browsing and use from the user side.
- the new data has the same solder part number, circuit board, particle size, viscosity, etc. as those already registered in S1004 above, it differs from those already registered. It is desirable to register separately. In that case, for example, the solder product number may be distinguished by an additional number that distinguishes them. By doing so, it is possible to accumulate various patterns of printing condition data suitable for each condition, even for the same board and solder part number. From the data accumulated in this way, it is possible to select which one is the most appropriate based on the evaluation result. Industrial applicability
- the trouble content can be grasped, the trouble recovery operation can be performed, and the trouble recovery can be performed.
- Updating and adjusting software and parameter settings for operating instructions or troubleshooting can be performed on a commonly used in-network—without spending time and money using a network line. Problems that need to be resolved, such as the need to start up, change varieties, improve quality and productivity, etc. This is especially useful when the customer is remote from the service provider.
- the user can easily obtain the appropriate cream solder information and printing conditions corresponding to the issues at the time of launching cream solder printing, changing the product type, and solving problems. It is useful for quick and accurate response, and is also suitable for version upgrades, asking service providers for their own improvements in quality and productivity, if desired.
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Description
Claims
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP02715724A EP1357781A4 (en) | 2001-01-10 | 2002-01-10 | "COMPONENT TERMINATION DEVICE, SERVICE DEVICE AND SERVICE PROCESS" |
US10/451,637 US7142939B2 (en) | 2001-01-10 | 2002-01-10 | Component mounter, service supplier, and service supplying method |
US11/341,693 US7536236B2 (en) | 2001-01-10 | 2006-01-30 | Component mounting apparatus, service providing device and servicing method |
US11/341,691 US7440812B2 (en) | 2001-01-10 | 2006-01-30 | Component mounting apparatus, service providing device and servicing method |
US12/191,190 US8086338B2 (en) | 2001-01-10 | 2008-08-13 | Component mounting apparatus, service providing device and servicing method |
US12/421,272 US7885718B2 (en) | 2001-01-10 | 2009-04-09 | Component mounting apparatus, service providing device and servicing method |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001-2066 | 2001-01-10 | ||
JP2001002066 | 2001-01-10 | ||
JP2001092484 | 2001-03-28 | ||
JP2001-92484 | 2001-03-28 |
Related Child Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10451637 A-371-Of-International | 2002-01-10 | ||
US11/341,691 Continuation US7440812B2 (en) | 2001-01-10 | 2006-01-30 | Component mounting apparatus, service providing device and servicing method |
US11/341,693 Continuation US7536236B2 (en) | 2001-01-10 | 2006-01-30 | Component mounting apparatus, service providing device and servicing method |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2002056662A1 true WO2002056662A1 (fr) | 2002-07-18 |
Family
ID=26607442
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2002/000103 WO2002056662A1 (fr) | 2001-01-10 | 2002-01-10 | Dispositif de montage de composants, fournisseur de services et procede de prestation de services |
Country Status (3)
Country | Link |
---|---|
US (5) | US7142939B2 (ja) |
EP (1) | EP1357781A4 (ja) |
WO (1) | WO2002056662A1 (ja) |
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Also Published As
Publication number | Publication date |
---|---|
US20090259333A1 (en) | 2009-10-15 |
EP1357781A1 (en) | 2003-10-29 |
US20040153868A1 (en) | 2004-08-05 |
US20090043413A1 (en) | 2009-02-12 |
US7440812B2 (en) | 2008-10-21 |
US7142939B2 (en) | 2006-11-28 |
US8086338B2 (en) | 2011-12-27 |
US20060136786A1 (en) | 2006-06-22 |
EP1357781A4 (en) | 2008-02-13 |
US20060136787A1 (en) | 2006-06-22 |
US7536236B2 (en) | 2009-05-19 |
US7885718B2 (en) | 2011-02-08 |
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