WO2002008479A1 - Materiau en alliage de cuivre destine a des pieces de materiel electronique ou electrique - Google Patents
Materiau en alliage de cuivre destine a des pieces de materiel electronique ou electrique Download PDFInfo
- Publication number
- WO2002008479A1 WO2002008479A1 PCT/JP2001/004351 JP0104351W WO0208479A1 WO 2002008479 A1 WO2002008479 A1 WO 2002008479A1 JP 0104351 W JP0104351 W JP 0104351W WO 0208479 A1 WO0208479 A1 WO 0208479A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- mass
- electronic
- electric equipment
- copper alloy
- alloy material
- Prior art date
Links
- 239000000956 alloy Substances 0.000 title abstract 3
- 229910000881 Cu alloy Inorganic materials 0.000 title abstract 2
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 239000013078 crystal Substances 0.000 abstract 1
- 239000012535 impurity Substances 0.000 abstract 1
- 230000003746 surface roughness Effects 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/04—Alloys based on copper with zinc as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12708—Sn-base component
- Y10T428/12715—Next to Group IB metal-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12889—Au-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12993—Surface feature [e.g., rough, mirror]
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Conductive Materials (AREA)
- Contacts (AREA)
- Non-Insulated Conductors (AREA)
- Electroplating Methods And Accessories (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP01934329A EP1325964B1 (en) | 2000-07-25 | 2001-05-24 | Copper alloy material for electronic or electric equipment parts |
DE60131763T DE60131763T2 (de) | 2000-07-25 | 2001-05-24 | Material aus kupferlegierung für elektronik oder elektronische bauteile |
US10/005,880 US20020127133A1 (en) | 2000-07-25 | 2001-11-02 | Copper alloy material for parts of electronic and electric machinery and tools |
US10/354,151 US7172662B2 (en) | 2000-07-25 | 2003-01-30 | Copper alloy material for parts of electronic and electric machinery and tools |
US11/130,134 US20050208323A1 (en) | 2000-07-25 | 2005-05-17 | Copper alloy material for parts of electronic and electric machinery and tools |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000-224425 | 2000-07-25 | ||
JP2000224425A JP3520034B2 (ja) | 2000-07-25 | 2000-07-25 | 電子電気機器部品用銅合金材 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/005,880 Continuation US20020127133A1 (en) | 2000-07-25 | 2001-11-02 | Copper alloy material for parts of electronic and electric machinery and tools |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2002008479A1 true WO2002008479A1 (fr) | 2002-01-31 |
Family
ID=18718391
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2001/004351 WO2002008479A1 (fr) | 2000-07-25 | 2001-05-24 | Materiau en alliage de cuivre destine a des pieces de materiel electronique ou electrique |
Country Status (8)
Country | Link |
---|---|
US (3) | US20020127133A1 (ja) |
EP (1) | EP1325964B1 (ja) |
JP (1) | JP3520034B2 (ja) |
KR (1) | KR100519850B1 (ja) |
CN (1) | CN1183263C (ja) |
DE (1) | DE60131763T2 (ja) |
TW (1) | TWI225519B (ja) |
WO (1) | WO2002008479A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130014861A1 (en) * | 2010-04-02 | 2013-01-17 | JX Nippon Mining & Metal Corporation | Cu-ni-si alloy for electronic material |
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3520034B2 (ja) * | 2000-07-25 | 2004-04-19 | 古河電気工業株式会社 | 電子電気機器部品用銅合金材 |
JP3520046B2 (ja) | 2000-12-15 | 2004-04-19 | 古河電気工業株式会社 | 高強度銅合金 |
US7090732B2 (en) | 2000-12-15 | 2006-08-15 | The Furukawa Electric, Co., Ltd. | High-mechanical strength copper alloy |
JP4584692B2 (ja) * | 2004-11-30 | 2010-11-24 | 株式会社神戸製鋼所 | 曲げ加工性に優れた高強度銅合金板およびその製造方法 |
JP2006286604A (ja) * | 2005-03-07 | 2006-10-19 | Furukawa Electric Co Ltd:The | 配線接続器具用金属材 |
JP4494258B2 (ja) | 2005-03-11 | 2010-06-30 | 三菱電機株式会社 | 銅合金およびその製造方法 |
US8317948B2 (en) * | 2005-03-24 | 2012-11-27 | Jx Nippon Mining & Metals Corporation | Copper alloy for electronic materials |
WO2006109801A1 (ja) * | 2005-04-12 | 2006-10-19 | Sumitomo Metal Industries, Ltd. | 銅合金およびその製造方法 |
JP5306591B2 (ja) * | 2005-12-07 | 2013-10-02 | 古河電気工業株式会社 | 配線用電線導体、配線用電線、及びそれらの製造方法 |
JP4986499B2 (ja) * | 2006-04-26 | 2012-07-25 | Jx日鉱日石金属株式会社 | Cu−Ni−Si合金すずめっき条の製造方法 |
ES2362346T3 (es) * | 2006-06-30 | 2011-07-01 | L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude | Placas conductoras para elementos de célula de combustible. |
US20080190523A1 (en) * | 2007-02-13 | 2008-08-14 | Weilin Gao | Cu-Ni-Si-based copper alloy sheet material and method of manufacturing same |
EP1967596B1 (en) * | 2007-02-13 | 2010-06-16 | Dowa Metaltech Co., Ltd. | Cu-Ni-Si-based copper alloy sheet material and method of manufacturing same |
JP5170881B2 (ja) * | 2007-03-26 | 2013-03-27 | 古河電気工業株式会社 | 電気・電子機器用銅合金材およびその製造方法 |
CN101541987B (zh) * | 2007-09-28 | 2011-01-26 | Jx日矿日石金属株式会社 | 电子材料用Cu-Ni-Si-Co系铜合金及其制造方法 |
CN101809177B (zh) * | 2007-10-03 | 2011-09-07 | 古河电气工业株式会社 | 电气电子部件用铜合金板材 |
EP2221390B1 (en) * | 2007-11-01 | 2014-06-18 | The Furukawa Electric Co., Ltd. | Method for producing a copper alloy sheet excellent in strength, bending workability and stress relaxation resistance |
US20100316879A1 (en) * | 2008-02-08 | 2010-12-16 | Kuniteru Mihara | Copper alloy material for electric/electronic components |
CN101946014A (zh) | 2008-02-18 | 2011-01-12 | 古河电气工业株式会社 | 铜合金材料 |
KR101114147B1 (ko) * | 2008-03-31 | 2012-03-13 | 후루카와 덴키 고교 가부시키가이샤 | 전기전자기기용 동합금 재료 및 전기전자부품 |
JP2010018885A (ja) * | 2008-06-12 | 2010-01-28 | Furukawa Electric Co Ltd:The | 電解銅皮膜、その製造方法及び銅電解皮膜製造用の銅電解液 |
CN101440444B (zh) * | 2008-12-02 | 2010-05-12 | 路达(厦门)工业有限公司 | 无铅易切削高锌硅黄铜合金及其制造方法 |
JP4708485B2 (ja) * | 2009-03-31 | 2011-06-22 | Jx日鉱日石金属株式会社 | 電子材料用Cu−Co−Si系銅合金及びその製造方法 |
JP5476149B2 (ja) * | 2010-02-10 | 2014-04-23 | 株式会社神戸製鋼所 | 強度異方性が小さく曲げ加工性に優れた銅合金 |
WO2012160684A1 (ja) * | 2011-05-25 | 2012-11-29 | 三菱伸銅株式会社 | 深絞り加工性に優れたCu-Ni-Si系銅合金板及びその製造方法 |
KR20140025607A (ko) | 2011-08-04 | 2014-03-04 | 가부시키가이샤 고베 세이코쇼 | 구리 합금 |
JP5827090B2 (ja) * | 2011-09-29 | 2015-12-02 | 三菱伸銅株式会社 | 導電性、耐熱性及び曲げ加工性に優れたCu−Fe−P系銅合金板及びその製造方法 |
JP5610643B2 (ja) * | 2012-03-28 | 2014-10-22 | Jx日鉱日石金属株式会社 | Cu−Ni−Si系銅合金条及びその製造方法 |
WO2014016934A1 (ja) * | 2012-07-26 | 2014-01-30 | 三菱電機株式会社 | 銅合金及びその製造方法 |
JP5501495B1 (ja) * | 2013-03-18 | 2014-05-21 | 三菱マテリアル株式会社 | 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用導電部品及び端子 |
JP6166414B1 (ja) * | 2016-03-30 | 2017-07-19 | 株式会社神戸製鋼所 | ベーパチャンバー用銅又は銅合金条 |
RU2618955C1 (ru) * | 2016-07-11 | 2017-05-11 | Юлия Алексеевна Щепочкина | Сплав на основе меди |
JP6302009B2 (ja) * | 2016-07-12 | 2018-03-28 | 古河電気工業株式会社 | 銅合金圧延材及びその製造方法並びに電気電子部品 |
CN106222480A (zh) * | 2016-08-29 | 2016-12-14 | 芜湖楚江合金铜材有限公司 | 一种环保的高耐磨铜线及其加工工艺 |
CN106119596A (zh) * | 2016-08-30 | 2016-11-16 | 芜湖楚江合金铜材有限公司 | 一种环保无铅高性能的铜合金线材及其加工工艺 |
RU2629403C1 (ru) * | 2016-12-06 | 2017-08-29 | Юлия Алексеевна Щепочкина | Спеченный сплав на основе меди |
MX2017001955A (es) * | 2017-02-10 | 2018-08-09 | Nac De Cobre S A De C V | Aleaciones de cobre bajas en plomo. |
JP7296757B2 (ja) * | 2019-03-28 | 2023-06-23 | Jx金属株式会社 | 銅合金、伸銅品及び電子機器部品 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01180932A (ja) * | 1988-01-11 | 1989-07-18 | Kobe Steel Ltd | ピン・グリッド・アレイicリードピン用高力高導電性銅合金 |
JPH0559468A (ja) * | 1991-04-24 | 1993-03-09 | Nikko Kyodo Co Ltd | 導電性ばね用銅合金 |
JPH06100983A (ja) * | 1992-09-22 | 1994-04-12 | Nippon Steel Corp | 高ヤング率・高降伏強度を有するtabテープ用金属箔およびその製造方法 |
JPH11222641A (ja) * | 1998-01-30 | 1999-08-17 | Furukawa Electric Co Ltd:The | 導電性ばね用銅合金及及びその製造方法 |
JPH11256256A (ja) * | 1998-03-06 | 1999-09-21 | Kobe Steel Ltd | 電気・電子部品用銅合金 |
Family Cites Families (43)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5841782B2 (ja) * | 1978-11-20 | 1983-09-14 | 玉川機械金属株式会社 | Ic用リ−ド材 |
JPS5853059B2 (ja) | 1979-12-25 | 1983-11-26 | 日本鉱業株式会社 | 析出硬化型銅合金 |
US4425168A (en) * | 1982-09-07 | 1984-01-10 | Cabot Corporation | Copper beryllium alloy and the manufacture thereof |
JPS59193233A (ja) | 1983-04-15 | 1984-11-01 | Toshiba Corp | 銅合金 |
EP0132415B1 (en) * | 1983-07-26 | 1988-11-02 | Oki Electric Industry Company, Limited | Printing system for a dot printer |
US4612167A (en) * | 1984-03-02 | 1986-09-16 | Hitachi Metals, Ltd. | Copper-base alloys for leadframes |
JPS61127842A (ja) | 1984-11-24 | 1986-06-16 | Kobe Steel Ltd | 端子・コネクタ−用銅合金およびその製造方法 |
US4656003A (en) * | 1984-10-20 | 1987-04-07 | Kabushiki Kaisha Kobe Seiko Sho | Copper alloy and production of the same |
DE3660351D1 (en) * | 1985-02-01 | 1988-08-04 | Kobe Steel Ltd | Lead material for ceramic package ic |
US4728372A (en) | 1985-04-26 | 1988-03-01 | Olin Corporation | Multipurpose copper alloys and processing therefor with moderate conductivity and high strength |
US4594221A (en) | 1985-04-26 | 1986-06-10 | Olin Corporation | Multipurpose copper alloys with moderate conductivity and high strength |
JPS63130739A (ja) | 1986-11-20 | 1988-06-02 | Nippon Mining Co Ltd | 半導体機器リ−ド材又は導電性ばね材用高力高導電銅合金 |
JPH01272733A (ja) | 1988-04-25 | 1989-10-31 | Mitsubishi Shindoh Co Ltd | 半導体装置用Cu合金製リードフレーム材 |
JPH02118037A (ja) | 1988-10-28 | 1990-05-02 | Nippon Mining Co Ltd | 酸化膜密着性に優れた高力高導電性銅合金 |
JP2714560B2 (ja) | 1988-12-24 | 1998-02-16 | 日鉱金属株式会社 | ダイレクトボンディング性の良好な銅合金 |
US5028391A (en) | 1989-04-28 | 1991-07-02 | Amoco Metal Manufacturing Inc. | Copper-nickel-silicon-chromium alloy |
JPH03188247A (ja) | 1989-12-14 | 1991-08-16 | Nippon Mining Co Ltd | 曲げ加工性の良好な高強度高導電銅合金の製造方法 |
JP2977845B2 (ja) * | 1990-01-30 | 1999-11-15 | 株式会社神戸製鋼所 | ばね特性、強度及び導電性に優れた耐マイグレーション性端子・コネクタ用銅合金 |
JP2503793B2 (ja) * | 1991-03-01 | 1996-06-05 | 三菱伸銅株式会社 | 打抜金型の摩耗抑制効果を有する電気電子部品用Cu合金板材 |
JPH051367A (ja) * | 1991-06-24 | 1993-01-08 | Mitsubishi Electric Corp | 電気・電子機器用銅合金材料 |
JPH05311278A (ja) | 1991-11-28 | 1993-11-22 | Nikko Kinzoku Kk | 応力緩和特性を改善した銅合金 |
JP3094045B2 (ja) | 1991-12-16 | 2000-10-03 | 富士写真フイルム株式会社 | ディジタル電子スチル・カメラおよびその制御方法 |
US5463247A (en) * | 1992-06-11 | 1995-10-31 | Mitsubishi Shindoh Co., Ltd. | Lead frame material formed of copper alloy for resin sealed type semiconductor devices |
JP2797846B2 (ja) | 1992-06-11 | 1998-09-17 | 三菱伸銅株式会社 | 樹脂封止型半導体装置のCu合金製リードフレーム材 |
JP3275377B2 (ja) | 1992-07-28 | 2002-04-15 | 三菱伸銅株式会社 | 微細組織を有する電気電子部品用Cu合金板材 |
JP2501275B2 (ja) | 1992-09-07 | 1996-05-29 | 株式会社東芝 | 導電性および強度を兼備した銅合金 |
KR940010455B1 (ko) | 1992-09-24 | 1994-10-22 | 김영길 | 고강도, 우수한 전기전도도 및 열적안정성을 갖는 동(Cu)합금 및 그 제조방법 |
US5508001A (en) | 1992-11-13 | 1996-04-16 | Mitsubishi Sindoh Co., Ltd. | Copper based alloy for electrical and electronic parts excellent in hot workability and blankability |
JP3511648B2 (ja) | 1993-09-27 | 2004-03-29 | 三菱伸銅株式会社 | 高強度Cu合金薄板条の製造方法 |
DE4415067C2 (de) | 1994-04-29 | 1996-02-22 | Diehl Gmbh & Co | Verfahren zur Herstellung einer Kupfer-Nickel-Silizium-Legierung und deren Verwendung |
JP3728776B2 (ja) | 1995-08-10 | 2005-12-21 | 三菱伸銅株式会社 | めっき予備処理工程中にスマットが発生することのない高強度銅合金 |
KR0157257B1 (ko) * | 1995-12-08 | 1998-11-16 | 정훈보 | 석출물 성장 억제형 고강도, 고전도성 동합금 및 그 제조방법 |
US5833920A (en) | 1996-02-20 | 1998-11-10 | Mitsubishi Denki Kabushiki Kaisha | Copper alloy for electronic parts, lead-frame, semiconductor device and connector |
JP3408929B2 (ja) * | 1996-07-11 | 2003-05-19 | 同和鉱業株式会社 | 銅基合金およびその製造方法 |
JP3344924B2 (ja) | 1997-03-31 | 2002-11-18 | 日鉱金属株式会社 | 酸化膜密着性の高いリードフレーム用銅合金 |
JP3800269B2 (ja) | 1997-07-23 | 2006-07-26 | 株式会社神戸製鋼所 | スタンピング加工性及び銀めっき性に優れる高力銅合金 |
JP4308931B2 (ja) * | 1997-11-04 | 2009-08-05 | 三菱伸銅株式会社 | SnまたはSn合金メッキ銅合金薄板およびその薄板で製造したコネクタ |
JP3739214B2 (ja) * | 1998-03-26 | 2006-01-25 | 株式会社神戸製鋼所 | 電子部品用銅合金板 |
TW448235B (en) | 1998-12-29 | 2001-08-01 | Ind Tech Res Inst | High-strength and high-conductivity Cu-(Ni, Co)-Si copper alloy for use in leadframes and method of making the same |
JP3520034B2 (ja) | 2000-07-25 | 2004-04-19 | 古河電気工業株式会社 | 電子電気機器部品用銅合金材 |
JP3520046B2 (ja) | 2000-12-15 | 2004-04-19 | 古河電気工業株式会社 | 高強度銅合金 |
US7090732B2 (en) * | 2000-12-15 | 2006-08-15 | The Furukawa Electric, Co., Ltd. | High-mechanical strength copper alloy |
JP3824884B2 (ja) | 2001-05-17 | 2006-09-20 | 古河電気工業株式会社 | 端子ないしはコネクタ用銅合金材 |
-
2000
- 2000-07-25 JP JP2000224425A patent/JP3520034B2/ja not_active Expired - Fee Related
-
2001
- 2001-05-24 DE DE60131763T patent/DE60131763T2/de not_active Expired - Lifetime
- 2001-05-24 TW TW090112482A patent/TWI225519B/zh not_active IP Right Cessation
- 2001-05-24 KR KR10-2001-7016149A patent/KR100519850B1/ko active IP Right Grant
- 2001-05-24 WO PCT/JP2001/004351 patent/WO2002008479A1/ja active IP Right Grant
- 2001-05-24 CN CNB018009425A patent/CN1183263C/zh not_active Expired - Lifetime
- 2001-05-24 EP EP01934329A patent/EP1325964B1/en not_active Expired - Lifetime
- 2001-11-02 US US10/005,880 patent/US20020127133A1/en not_active Abandoned
-
2003
- 2003-01-30 US US10/354,151 patent/US7172662B2/en not_active Expired - Fee Related
-
2005
- 2005-05-17 US US11/130,134 patent/US20050208323A1/en not_active Abandoned
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01180932A (ja) * | 1988-01-11 | 1989-07-18 | Kobe Steel Ltd | ピン・グリッド・アレイicリードピン用高力高導電性銅合金 |
JPH0559468A (ja) * | 1991-04-24 | 1993-03-09 | Nikko Kyodo Co Ltd | 導電性ばね用銅合金 |
JPH06100983A (ja) * | 1992-09-22 | 1994-04-12 | Nippon Steel Corp | 高ヤング率・高降伏強度を有するtabテープ用金属箔およびその製造方法 |
JPH11222641A (ja) * | 1998-01-30 | 1999-08-17 | Furukawa Electric Co Ltd:The | 導電性ばね用銅合金及及びその製造方法 |
JPH11256256A (ja) * | 1998-03-06 | 1999-09-21 | Kobe Steel Ltd | 電気・電子部品用銅合金 |
Non-Patent Citations (1)
Title |
---|
See also references of EP1325964A4 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130014861A1 (en) * | 2010-04-02 | 2013-01-17 | JX Nippon Mining & Metal Corporation | Cu-ni-si alloy for electronic material |
US9005521B2 (en) * | 2010-04-02 | 2015-04-14 | Jx Nippon Mining & Metals Corporation | Cu—Ni—Si alloy for electronic material |
Also Published As
Publication number | Publication date |
---|---|
JP2002038228A (ja) | 2002-02-06 |
KR100519850B1 (ko) | 2005-10-07 |
JP3520034B2 (ja) | 2004-04-19 |
TWI225519B (en) | 2004-12-21 |
EP1325964A4 (en) | 2003-07-30 |
DE60131763T2 (de) | 2008-10-30 |
CN1183263C (zh) | 2005-01-05 |
US20020127133A1 (en) | 2002-09-12 |
DE60131763D1 (de) | 2008-01-17 |
US20030165708A1 (en) | 2003-09-04 |
EP1325964B1 (en) | 2007-12-05 |
US7172662B2 (en) | 2007-02-06 |
CN1366556A (zh) | 2002-08-28 |
US20050208323A1 (en) | 2005-09-22 |
KR20020040677A (ko) | 2002-05-30 |
EP1325964A1 (en) | 2003-07-09 |
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