WO2007023288A3 - Solder alloy - Google Patents
Solder alloy Download PDFInfo
- Publication number
- WO2007023288A3 WO2007023288A3 PCT/GB2006/003167 GB2006003167W WO2007023288A3 WO 2007023288 A3 WO2007023288 A3 WO 2007023288A3 GB 2006003167 W GB2006003167 W GB 2006003167W WO 2007023288 A3 WO2007023288 A3 WO 2007023288A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- solder alloy
- alloy
- antimony
- germanium
- gallium
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C12/00—Alloys based on antimony or bismuth
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Conductive Materials (AREA)
Abstract
An alloy suitable for use in a ball grid array, the alloy comprising from 0.15 - 1.5 wt.% copper, from 0.1 - 4 wt.% silver, from 0 - 0.1 wt.% phosphorus, from 0 - 0.1 wt.% germanium, from 0 - 0.1 wt.% gallium, from 0 - 0.3 wt.% of one or more rare earth elements, from 0 - 0.3 wt.% indium, from 0 - 0.3 wt.% magnesium, from 0 - 0.3 wt.% calcium, from 0 - 0.3 wt.% silicon, from 0 - 0.3 wt.% aluminium, from 0 - 0.3 wt.% zinc, from 0 - 1 wt.% antimony, and at least one of the following elements from 0.02 - 0.3 wt% nickel, from 0.008 - 0.2 wt% manganese, from 0.01 - 0.3 wt% cobalt, from 0.005 - 0.3 wt% chromium, from 0.02 - 0.3 wt% iron, and from 0.008 - 0.1 wt% zirconium, and the balance tin, together with unavoidable impurities.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP06779198A EP1924394A2 (en) | 2005-08-24 | 2006-08-24 | Solder alloy |
KR1020087007074A KR101339025B1 (en) | 2005-08-24 | 2006-08-24 | Solder alloy |
JP2008527511A JP2009506203A (en) | 2005-08-24 | 2006-08-24 | Solder alloy |
US12/036,528 US20080159904A1 (en) | 2005-08-24 | 2008-02-25 | Solder alloy |
US12/036,497 US8641964B2 (en) | 2005-08-24 | 2008-02-25 | Solder alloy |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US71091705P | 2005-08-24 | 2005-08-24 | |
US60/710,917 | 2005-08-24 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/036,497 Continuation-In-Part US8641964B2 (en) | 2005-08-24 | 2008-02-25 | Solder alloy |
US12/036,528 Continuation-In-Part US20080159904A1 (en) | 2005-08-24 | 2008-02-25 | Solder alloy |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2007023288A2 WO2007023288A2 (en) | 2007-03-01 |
WO2007023288A3 true WO2007023288A3 (en) | 2007-07-12 |
Family
ID=36691605
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/GB2006/003167 WO2007023288A2 (en) | 2005-08-24 | 2006-08-24 | Solder alloy |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1924394A2 (en) |
JP (1) | JP2009506203A (en) |
KR (1) | KR101339025B1 (en) |
WO (1) | WO2007023288A2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102554504A (en) * | 2011-12-28 | 2012-07-11 | 常熟市华银焊料有限公司 | Self-soldering silver solder containing praseodymium, zirconium and gallium |
CN102513727B (en) * | 2011-12-28 | 2013-07-24 | 南京航空航天大学 | Self-fluxing silver solder containing neodymium, zirconium and gallium |
US12017306B2 (en) * | 2018-04-13 | 2024-06-25 | Senju Metal Industry Co., Ltd. | Solder paste |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009028147A1 (en) * | 2007-08-24 | 2009-03-05 | Kabushiki Kaisha Toshiba | Bonding composition |
JP5249958B2 (en) * | 2008-02-22 | 2013-07-31 | 株式会社日本スペリア社 | Ni concentration adjustment method for lead-free solder containing Ni |
DE202009019184U1 (en) * | 2009-08-29 | 2017-11-14 | Umicore Ag & Co. Kg | solder alloy |
US20110281136A1 (en) * | 2010-05-14 | 2011-11-17 | Jenq-Gong Duh | Copper-manganese bonding structure for electronic packages |
WO2012137901A1 (en) * | 2011-04-08 | 2012-10-11 | 株式会社日本スペリア社 | Solder alloy |
US9735126B2 (en) * | 2011-06-07 | 2017-08-15 | Infineon Technologies Ag | Solder alloys and arrangements |
JP5777979B2 (en) * | 2011-08-30 | 2015-09-16 | 日本アルミット株式会社 | Solder alloy |
CN103796788A (en) * | 2011-09-16 | 2014-05-14 | 株式会社村田制作所 | Electroconductive material, and connection method and connection structure using same |
CN102321830B (en) * | 2011-10-24 | 2012-11-28 | 南京信息工程大学 | Low-smelting point high-strength lead-bismuth rare earth alloy and preparation method thereof |
KR101283580B1 (en) | 2011-12-14 | 2013-07-05 | 엠케이전자 주식회사 | Tin-based solder ball and semiconductor package including the same |
PT2679335T (en) * | 2012-04-09 | 2017-07-26 | Senju Metal Industry Co | Solder alloy |
CN103889644B (en) * | 2012-10-09 | 2019-12-31 | 阿尔法组装解决方案公司 | High-temperature reliable lead-free and antimony-free tin solder |
CN102922164A (en) * | 2012-11-01 | 2013-02-13 | 青岛英太克锡业科技有限公司 | Sn-Zn solder for soft-soldering tin wires and preparation method thereof |
JP2015077601A (en) * | 2013-04-02 | 2015-04-23 | 千住金属工業株式会社 | Lead-free solder alloy |
CN103243234B (en) * | 2013-04-27 | 2015-08-26 | 深圳市同方电子新材料有限公司 | A kind of Electronic Packaging soldering serial low silver leadless solder and preparation method thereof |
KR101688463B1 (en) * | 2013-11-15 | 2016-12-23 | 덕산하이메탈(주) | Solder alloy and solder ball |
CN104275561A (en) * | 2014-09-17 | 2015-01-14 | 明光市锐创电气有限公司 | Environment-friendly lead-free soldering-aiding paste |
CN104400248A (en) * | 2014-10-24 | 2015-03-11 | 云南锡业锡材有限公司 | Photovoltaic tin-alloy solder, and preparation method and use thereof |
CN104759783B (en) * | 2015-03-24 | 2017-02-01 | 广东工业大学 | Low-silver lead-free solder and preparation method thereof |
JP5880766B1 (en) | 2015-05-26 | 2016-03-09 | 千住金属工業株式会社 | Solder alloy, solder ball, chip solder, solder paste and solder joint |
CN105551566A (en) * | 2016-02-01 | 2016-05-04 | 安徽渡江电缆集团有限公司 | Anti-static copper alloy cable |
JP6365653B2 (en) | 2016-08-19 | 2018-08-01 | 千住金属工業株式会社 | Solder alloy, solder joint and soldering method |
CN106238951A (en) * | 2016-08-26 | 2016-12-21 | 王泽陆 | A kind of environment-friendly high-intensity lead-free brazing and preparation technology thereof |
JP6439893B1 (en) * | 2018-05-25 | 2018-12-19 | 千住金属工業株式会社 | Solder ball, solder joint and joining method |
CN109048114B (en) * | 2018-09-20 | 2021-02-12 | 南京理工大学 | Sn-Cu-Ni lead-free solder containing Ga and Nd |
CN109848606B (en) * | 2018-12-17 | 2020-08-07 | 中南大学 | Sn-Ag-Cu lead-free solder with high interface bonding strength and preparation method thereof |
JP7068370B2 (en) * | 2020-03-19 | 2022-05-16 | 千住金属工業株式会社 | Solder alloys, solder balls and solder fittings |
Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5837191A (en) * | 1996-10-22 | 1998-11-17 | Johnson Manufacturing Company | Lead-free solder |
US6139979A (en) * | 1999-01-28 | 2000-10-31 | Murata Manufacturing Co., Ltd. | Lead-free solder and soldered article |
JP2001071173A (en) * | 1999-09-06 | 2001-03-21 | Ishikawa Kinzoku Kk | Non-leaded solder |
EP1088615A2 (en) * | 1999-09-29 | 2001-04-04 | Nec Corporation | Sn-Ag-Cu solder and surface treatment and parts mounting methods using the same |
US6231691B1 (en) * | 1997-02-10 | 2001-05-15 | Iowa State University Research Foundation, Inc. | Lead-free solder |
US20020051728A1 (en) * | 2000-03-14 | 2002-05-02 | Koji Sato | Solder ball and method for producing same |
EP1213089A1 (en) * | 2000-12-11 | 2002-06-12 | Nec Corporation | Solder, method for processing surface of printed wiring board, and method for mounting electronic part |
EP1231015A1 (en) * | 2001-02-09 | 2002-08-14 | Taiho Kogyo Co., Ltd. | Lead-free solder and solder joint |
JP2002239780A (en) * | 2001-02-09 | 2002-08-28 | Nippon Steel Corp | Solder alloy, solder ball and electronic member having solder bump |
EP1245328A1 (en) * | 2001-03-01 | 2002-10-02 | Senju Metal Industry Co., Ltd. | Lead-free solder paste |
EP1273384A1 (en) * | 2001-06-28 | 2003-01-08 | Senju Metal Industry Co., Ltd. | Lead-free solder alloy |
US6554180B1 (en) * | 1999-08-20 | 2003-04-29 | Senju Metal Industry Co., Ltd. | Lead-free solder paste |
JP2003230980A (en) * | 2002-02-14 | 2003-08-19 | Nippon Steel Corp | Leadless solder alloy, solder ball and electronic member having solder bump |
EP1410871A1 (en) * | 2002-10-17 | 2004-04-21 | Senju Metal Industry Co., Ltd. | Lead-free solder ball |
JP2004261863A (en) * | 2003-01-07 | 2004-09-24 | Senju Metal Ind Co Ltd | Lead-free solder |
WO2005048303A2 (en) * | 2003-11-06 | 2005-05-26 | Indium Corporation Of America | Anti-tombstoning lead free alloys for surface mount reflow soldering |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW516984B (en) * | 1999-12-28 | 2003-01-11 | Toshiba Corp | Solder material, device using the same and manufacturing process thereof |
JP2001267730A (en) * | 2000-03-14 | 2001-09-28 | Hitachi Metals Ltd | Solder ball |
-
2006
- 2006-08-24 JP JP2008527511A patent/JP2009506203A/en active Pending
- 2006-08-24 WO PCT/GB2006/003167 patent/WO2007023288A2/en active Application Filing
- 2006-08-24 EP EP06779198A patent/EP1924394A2/en not_active Withdrawn
- 2006-08-24 KR KR1020087007074A patent/KR101339025B1/en active IP Right Grant
Patent Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5837191A (en) * | 1996-10-22 | 1998-11-17 | Johnson Manufacturing Company | Lead-free solder |
US6231691B1 (en) * | 1997-02-10 | 2001-05-15 | Iowa State University Research Foundation, Inc. | Lead-free solder |
US6139979A (en) * | 1999-01-28 | 2000-10-31 | Murata Manufacturing Co., Ltd. | Lead-free solder and soldered article |
US6554180B1 (en) * | 1999-08-20 | 2003-04-29 | Senju Metal Industry Co., Ltd. | Lead-free solder paste |
JP2001071173A (en) * | 1999-09-06 | 2001-03-21 | Ishikawa Kinzoku Kk | Non-leaded solder |
EP1088615A2 (en) * | 1999-09-29 | 2001-04-04 | Nec Corporation | Sn-Ag-Cu solder and surface treatment and parts mounting methods using the same |
US20020051728A1 (en) * | 2000-03-14 | 2002-05-02 | Koji Sato | Solder ball and method for producing same |
EP1213089A1 (en) * | 2000-12-11 | 2002-06-12 | Nec Corporation | Solder, method for processing surface of printed wiring board, and method for mounting electronic part |
JP2002239780A (en) * | 2001-02-09 | 2002-08-28 | Nippon Steel Corp | Solder alloy, solder ball and electronic member having solder bump |
EP1231015A1 (en) * | 2001-02-09 | 2002-08-14 | Taiho Kogyo Co., Ltd. | Lead-free solder and solder joint |
EP1245328A1 (en) * | 2001-03-01 | 2002-10-02 | Senju Metal Industry Co., Ltd. | Lead-free solder paste |
EP1273384A1 (en) * | 2001-06-28 | 2003-01-08 | Senju Metal Industry Co., Ltd. | Lead-free solder alloy |
JP2003230980A (en) * | 2002-02-14 | 2003-08-19 | Nippon Steel Corp | Leadless solder alloy, solder ball and electronic member having solder bump |
EP1410871A1 (en) * | 2002-10-17 | 2004-04-21 | Senju Metal Industry Co., Ltd. | Lead-free solder ball |
JP2004261863A (en) * | 2003-01-07 | 2004-09-24 | Senju Metal Ind Co Ltd | Lead-free solder |
WO2005048303A2 (en) * | 2003-11-06 | 2005-05-26 | Indium Corporation Of America | Anti-tombstoning lead free alloys for surface mount reflow soldering |
Non-Patent Citations (3)
Title |
---|
K.S. KIM ET AL: "Effects of fourth alloying additive on microstructures and tensile properties of Sn-Ag-Cu alloy and joints with Cu", MICROELECTRONICS RELIABILITY, vol. 43, no. 2, 2003, Elsevier Science, pages 259 - 267, XP008067189 * |
PATENT ABSTRACTS OF JAPAN vol. 2002, no. 12 12 December 2002 (2002-12-12) * |
PATENT ABSTRACTS OF JAPAN vol. 2003, no. 12 5 December 2003 (2003-12-05) * |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102554504A (en) * | 2011-12-28 | 2012-07-11 | 常熟市华银焊料有限公司 | Self-soldering silver solder containing praseodymium, zirconium and gallium |
CN102513727B (en) * | 2011-12-28 | 2013-07-24 | 南京航空航天大学 | Self-fluxing silver solder containing neodymium, zirconium and gallium |
CN102554504B (en) * | 2011-12-28 | 2013-11-06 | 常熟市华银焊料有限公司 | Self-soldering silver solder containing praseodymium, zirconium and gallium |
US12017306B2 (en) * | 2018-04-13 | 2024-06-25 | Senju Metal Industry Co., Ltd. | Solder paste |
Also Published As
Publication number | Publication date |
---|---|
WO2007023288A2 (en) | 2007-03-01 |
EP1924394A2 (en) | 2008-05-28 |
JP2009506203A (en) | 2009-02-12 |
KR20080106887A (en) | 2008-12-09 |
KR101339025B1 (en) | 2013-12-09 |
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