CN102922164A - Sn-Zn solder for soft-soldering tin wires and preparation method thereof - Google Patents
Sn-Zn solder for soft-soldering tin wires and preparation method thereof Download PDFInfo
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- CN102922164A CN102922164A CN2012104309871A CN201210430987A CN102922164A CN 102922164 A CN102922164 A CN 102922164A CN 2012104309871 A CN2012104309871 A CN 2012104309871A CN 201210430987 A CN201210430987 A CN 201210430987A CN 102922164 A CN102922164 A CN 102922164A
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Abstract
The invention relates to a Sn-Zn solder for soft-soldering tin wires and a preparation method thereof. The preparation method comprises the steps of weighing 86% to 92% of Sn, 6% to 12% of Zn, 0.2% to 2% of In, and 0.08% to 0.8% of P respectively according to weight percentages for spare; staggering and placing the weighed Sn and Zn in a smelting furnace to be heated and melted; heating the mixture to a temperature in a range of 250 DEG C to 280 DEG C, and stirring the mixture for 8 minutes to 12 minutes; adding In and P, and stirring the mixture for 3 minutes to 7 minutes; and cooling solder naturally to the room temperature to obtain the Sn-Zn solder for soft-soldering tin wires. According to the Sn-Zn solder for soft-soldering tin wires, not only solder joint shrinkage defects are small, no apparent shrinkage holes or apparent corrosion phenomenon exists, solder joints are attractive, and commercialized production requirements are met completely; but also the alloy soldering expansion rate of the solder is improved by about 10%.
Description
Technical field
The present invention relates to a kind of no-lead soft soldering, particularly a kind of Sn-Zn scolder for the solder solder stick and preparation method thereof.
Background technology
Solder commonly used is leypewter in the electron trade at present, because leypewter has good wetability and electric conductivity, welding performance is fine and cost is low, therefore is used widely.But lead and compound environmental pollution thereof are very large, can harm humans and organism health.From the beginning of this century, countries in the world are to the increasingly stringent that requires of environmental protection.In the electronic welding field, a lot of developed countries are the U.S. and Japan particularly, early the research of oneself beginning lead-free solder aspect.A lot of international businesses also all adopt the lead-free solder welding when common consumer products are produced, such as the motherboard of personal computer, notebook computer, mobile phone, TV, videocorder etc.As seen the market potential of lead-free solder is huge, along with the continuous progress of society, must replace the main flow that has kupper solder to become scolder.
In order to satisfy the requirement of all kinds of unleaded environmental protection processing procedures, the electronics industry welding field need to find suitable scolder to substitute the tin-lead solder that tradition is used.At present main alternative solders has SAC class and tin copper class lead-free solder.This two classes scolder major defect is that the argentiferous cost is higher, and welding temperature is more than 210 degrees centigrade, and the plumbous low-temperature production process production equipment of tin originally need to be changed and step up its investment.Thereby and having brought highly energy-consuming because welding temperature is higher, maximum discharge has caused not environmental protection from another aspect, has run counter to unleaded original intention.In the face of these deficiencies, people have the excessively multiple alternative solders scheme of research, and wherein to have possessed welding temperature low for the Sn-Zn series lead-free solder, the advantage that cost is low and being favored by Many researchers.But present commercial tin zinc solder stick and few, and attractive in appearance at solder joint, the rate of spread, the aspect Shortcomings such as postwelding is corrosion-resistant.The Sn-Zn scolder subject matter that is applied at present the leadless soft soldering field is
First: the solder joint shrink defects is too large, and the surface is not attractive in appearance.
Second: the postwelding decay resistance is not up to standard.
The 3rd: the solder joint rate of spread is low.
Summary of the invention
The invention provides a kind of Sn-Zn scolder for the solder solder stick and preparation method thereof, the solder joint shrink defects that has solved the Sn-Zn scolder that is applied at present the leadless soft soldering field is too large, the problems such as the surface is not attractive in appearance, and the postwelding decay resistance is not up to standard, and the solder joint rate of spread is low
Technical scheme of the present invention is achieved in that a kind of Sn-Zn scolder for the solder solder stick, according to the weight percent meter, comprises Sn 86-92%, Zn6-12%, In 0.2-2%, P 0.08-0.8%.
As preferred technical scheme, according to the weight percent meter, comprise Sn90%, Zn9.5%, In0.2%, P0.3%.
The present invention also proposes a kind of method of the Sn-Zn scolder for the preparation of the solder solder stick, may further comprise the steps:
1) according to the weight percent meter, take by weighing respectively Sn 86-92%, Zn6-12%, In 0.2-2%, P 0.08-0.8%, for subsequent use;
2) load weighted Sn and the staggered stack of Zn are put in smelting furnace heating and melting;
3) heat to 250-280 ℃, stirred 8-12 minute;
4) add In and P, stirred 3-7 minute;
5) scolder is naturally cooled to room temperature, namely get the Sn-Zn scolder for the solder solder stick.
As preferred technical scheme, described according to the weight percent meter, take by weighing respectively Sn 90%, Zn 9.5%, and In 0.2%, and P 0.3%, and is for subsequent use.
Owing to having adopted technique scheme, a kind of Sn-Zn scolder for the solder solder stick and preparation method thereof may further comprise the steps: according to the weight percent meter, take by weighing respectively Sn 86-92%, and Zn6-12%, In 0.2-2%, P 0.08-0.8%, for subsequent use; Load weighted Sn and the staggered stack of Zn are put in smelting furnace heating and melting; Heat to 250-280 ℃, stirred 8-12 minute; Add In and P, stirred 3-7 minute; Scolder is naturally cooled to room temperature, namely get the Sn-Zn scolder for the solder solder stick, it has the following advantages:
One, improved the solder joint surface quality:
Common Sn-Zn series lead-free solder generally adopts eutectic composition Sn-9Zn, and the solder joint shrink defects of eutectic composition is larger in the welding of reality, causes solder joint uneven, and obvious shrinkage hole is arranged.Sn-Zn scolder for the solder solder stick of the present invention is little at the solder joint shrink defects at the welding eutectic composition of reality, does not have obvious shrinkage hole, and solder joint is attractive in appearance.
Two, improved decay resistance:
It is higher that the Sn-Zn series lead-free solder contains the Zn amount, and Zn is than the metal that is easier to oxidation.After welding is finished, be more prone to cause the solder joint corrosion with respect to now widely used lead-free solder.The present invention has improved the decay resistance of solder joint very significantly by add various trace elements in Sn-Zn series lead-free solder base material.In the high heat of high temperature (80 ℃ temperature, 80% humidity) test, do not have obvious corrosion phenomenon in 1000 hours, satisfied the requirement of commercially producing fully.
Three, the alloy of the Sn-Zn scolder for the solder solder stick of the present invention welding rate of spread has improved about 10%.
Description of drawings
Fig. 1 is preparation technology's flow chart of the Sn-Zn scolder for the solder solder stick of the present invention.
The specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the invention, the technical scheme in the embodiment of the invention is clearly and completely described, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills belong to the scope of protection of the invention not making the every other embodiment that obtains under the creative work prerequisite.
As described in Figure 1, a kind of Sn-Zn scolder for the solder solder stick according to the weight percent meter, comprises Sn 86-92%, Zn6-12%, In 0.2-2%, P 0.08-0.8%.
A kind of method of the Sn-Zn scolder for the preparation of the solder solder stick may further comprise the steps:
1) according to the weight percent meter, take by weighing respectively Sn 86-92%, Zn6-12%, In 0.2-2%, P 0.08-0.8%, for subsequent use;
2) load weighted Sn and the staggered stack of Zn are put in smelting furnace heating and melting;
3) heat to 250-280 ℃, stirred 8-12 minute;
4) add In and P, stirred 3-7 minute;
5) scolder is naturally cooled to room temperature, namely get the Sn-Zn scolder for the solder solder stick.
Embodiment 1
A kind of preparation method of the Sn-Zn scolder for the solder solder stick may further comprise the steps:
1) according to the weight percent meter, take by weighing respectively Sn90%, Zn9.5%, In 0.2%, and P 0.3%, and is for subsequent use;
2) load weighted Sn and the staggered stack of Zn are put in smelting furnace heating and melting;
3) heat to 280 ℃, stirred 8-12 minute;
4) add In and P, stirred 3-7 minute;
5) scolder is naturally cooled to room temperature, namely get the Sn-Zn scolder for the solder solder stick.
Embodiment 2
A kind of preparation method of the Sn-Zn scolder for the solder solder stick may further comprise the steps:
1) according to the weight percent meter, take by weighing respectively Sn86%, Zn12%, In 1.2%, and P 0.8%, and is for subsequent use;
2) load weighted Sn and the staggered stack of Zn are put in smelting furnace heating and melting;
3) heat to 270 ℃, stirred 8-12 minute;
4) add In and P, stirred 3-7 minute;
5) scolder is naturally cooled to room temperature, namely get the Sn-Zn scolder for the solder solder stick.
Embodiment 3
A kind of preparation method of the Sn-Zn scolder for the solder solder stick, it may further comprise the steps:
1) according to the weight percent meter, take by weighing respectively Sn92%, Zn6%, In 1.92%, and P 0.08%, and is for subsequent use;
2) load weighted Sn and the staggered stack of Zn are put in smelting furnace heating and melting;
3) heat to 250 ℃, stirred 8-12 minute;
4) add In and P, stirred 3-7 minute;
5) scolder is naturally cooled to room temperature, namely get the Sn-Zn scolder for the solder solder stick.
Embodiment 4
A kind of preparation method of the Sn-Zn scolder for the solder solder stick, it may further comprise the steps:
1) according to the weight percent meter, take by weighing respectively Sn88%, Zn9.4%, In2%, P 0.6%, and is for subsequent use;
2) load weighted Sn and the staggered stack of Zn are put in smelting furnace heating and melting;
3) heat to 260 ℃, stirred 8-12 minute;
4) add In and P, stirred 3-7 minute;
5) scolder is naturally cooled to room temperature, namely get the Sn-Zn scolder for the solder solder stick.
The prepared scolder of embodiments of the invention in the high heat of high temperature (80 ℃ of temperature 80% humidity) test 1000 hours, not only the solder joint shrink defects is little, does not have obvious shrinkage hole, and solder joint is attractive in appearance, does not have obvious corrosion phenomenon, has satisfied the requirement of commercially producing fully; And the alloy of the scolder of the present invention welding rate of spread has improved about 10%.
The above only is preferred embodiment of the present invention, and is in order to limit the present invention, within the spirit and principles in the present invention not all, any modification of doing, is equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (4)
1. a Sn-Zn scolder that is used for the solder solder stick is characterized in that: according to the weight percent meter, comprise Sn 86-92%, Zn6-12%, In 0.2-2%, P 0.08-0.8%.
2. a kind of Sn-Zn scolder for the solder solder stick as claimed in claim 1 is characterized in that: according to the weight percent meter, comprise Sn90%, Zn9.5%, In0.2%, P0.3%.
3. method for preparing the Sn-Zn scolder for the solder solder stick as claimed in claim 2 may further comprise the steps:
1) according to the weight percent meter, take by weighing respectively Sn 86-92%, Zn 6-12%, In 0.2-2%, P 0.08-0.8%, for subsequent use;
2) with load weighted Sn and Zn heating and melting;
3) heat to 250-280 ℃, stirred 8-12 minute;
4) add In and P, stirred 3-7 minute;
5) solder cools is arrived room temperature, namely get described Sn-Zn scolder for the solder solder stick.
4. the method for a kind of Sn-Zn scolder for the preparation of the solder solder stick as claimed in claim 3, it is characterized in that: according to the weight percent meter, take by weighing respectively Sn 90%, Zn 9.5%, and In 0.2%, and P 0.3%, and is for subsequent use.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2012104309871A CN102922164A (en) | 2012-11-01 | 2012-11-01 | Sn-Zn solder for soft-soldering tin wires and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2012104309871A CN102922164A (en) | 2012-11-01 | 2012-11-01 | Sn-Zn solder for soft-soldering tin wires and preparation method thereof |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53124148A (en) * | 1977-03-17 | 1978-10-30 | Seiko Epson Corp | Metal solder |
| CN1139607A (en) * | 1995-06-30 | 1997-01-08 | 三星电机株式会社 | Non-lead solder with fine mechanical property |
| CN1390672A (en) * | 2002-05-10 | 2003-01-15 | 大连理工大学 | Leadfree SnZn-base alloy solder containing rare-earth elements |
| CN1718796A (en) * | 2005-08-02 | 2006-01-11 | 马莒生 | Low melting point leadless welding flux alloy |
| WO2007023288A2 (en) * | 2005-08-24 | 2007-03-01 | Fry's Metals Inc. | Solder alloy |
| CN101804527A (en) * | 2010-04-06 | 2010-08-18 | 山东大学 | Sn-Zn based unleaded brazing material with low Zn |
-
2012
- 2012-11-01 CN CN2012104309871A patent/CN102922164A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53124148A (en) * | 1977-03-17 | 1978-10-30 | Seiko Epson Corp | Metal solder |
| CN1139607A (en) * | 1995-06-30 | 1997-01-08 | 三星电机株式会社 | Non-lead solder with fine mechanical property |
| CN1390672A (en) * | 2002-05-10 | 2003-01-15 | 大连理工大学 | Leadfree SnZn-base alloy solder containing rare-earth elements |
| CN1718796A (en) * | 2005-08-02 | 2006-01-11 | 马莒生 | Low melting point leadless welding flux alloy |
| WO2007023288A2 (en) * | 2005-08-24 | 2007-03-01 | Fry's Metals Inc. | Solder alloy |
| CN101804527A (en) * | 2010-04-06 | 2010-08-18 | 山东大学 | Sn-Zn based unleaded brazing material with low Zn |
Non-Patent Citations (2)
| Title |
|---|
| 肖盈盈 等: ""Sn-Zn系无铅焊料研究和亟待解决的问题"", 《电子与封装》 * |
| 黄惠珍 等: ""Sn-9Zn-xP无铅焊料合金性能研究"", 《材料工程》 * |
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Application publication date: 20130213 |