US6259265B1 - Unified test system and method for testing printed circuit boards - Google Patents

Unified test system and method for testing printed circuit boards Download PDF

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Publication number
US6259265B1
US6259265B1 US09/417,060 US41706099A US6259265B1 US 6259265 B1 US6259265 B1 US 6259265B1 US 41706099 A US41706099 A US 41706099A US 6259265 B1 US6259265 B1 US 6259265B1
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United States
Prior art keywords
printed circuit
circuit board
frame
board assembly
pins
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Expired - Lifetime
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US09/417,060
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English (en)
Inventor
Jong-Hyung Han
Yong-Taek Sim
Tae-Young Kwak
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Samsung Electronics Co Ltd
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Samsung Electronics Co Ltd
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Assigned to SAMSUNG ELECTRONICS CO., LTD., A CORP. ORGANIZED UNDER THE LAWS OF THE REPUBLIC OF KOREA reassignment SAMSUNG ELECTRONICS CO., LTD., A CORP. ORGANIZED UNDER THE LAWS OF THE REPUBLIC OF KOREA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HAN, JONG-HYUNG, KWAK, TAE-YOUNG, SIM, YONG-TAEK
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    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
    • G11B33/12—Disposition of constructional parts in the apparatus, e.g. of power supply, of modules
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support

Definitions

  • an in-circuit testing (ICT) process and a function circuit testing (FCT) process are used to test the performance of a printed circuit board assembly (PCBA).
  • the soldering quality of a printed circuit board assembly produced through a surface mounting device (SMD) process and the quality of each circuit element are tested in a unit of parts to detect defects, for example, whether any parts are shorted or wrongly inserted.
  • the printed circuit board assembly is connected, after the in-circuit testing process, to a head disk assembly (HDA) to test functions between the printed circuit board assembly and the head disk assembly and a read/write capability.
  • HDA head disk assembly
  • Exemplars of recent efforts in the art include U.S. Pat. No. 5,777,480 for DEVICE FOR TESTING CONNECTOR HAVING MULTIPLE TERMINALS THEREIN issued to Hatagishi et al.; U.S. Pat. No. 5,831,438 for DEVICE FOR TESTING A CONNECTOR HAVING MULTIPLE TERMINALS THEREIN issued to Okura; U.S. Pat. No. 5,748,007 for UNIVERSAL TEST AND BURN-IN SOCKET ADAPTABLE TO VARYING IC MODULE THICKNESS issued to Gaschke; U.S. Pat. No.
  • a unified test system for testing the performance of a printed circuit board assembly including a pin board from which test process connection pins having different height project, wherein the pin board is mounted on a main frame; a masking board at which holes are formed so that the connection pins can be connected with the printed circuit board assembly loaded thereon by passing through the holes upon loading onto the pin board; a first frame which is supported by first guide rods installed upright at the main frame and has a first cylinder installed at its upper part and driven up and down; a second frame having a power input connector and a signal interface connector installed at its lower part, wherein the second frame moves along the first guide rods when the first cylinder is driven to connect the ii connection pins with the printed circuit board assembly by pressing the printed circuit board assembly downward; a second cylinder installed at the upper part of the second frame and driven back and forth; and a third frame having at its upper part a head disk assembly connected by pins with the printed circuit board assembly when the second frame has moved downward
  • a unified test process for testing the performance of a printed circuit board assembly includes the steps of loading a masking board and the printed circuit board assembly onto a pin board from which test process connection pins having different height project; connecting the test process connection pins, a power input connector and a signal interface connector with the printed circuit board assembly and pins installed on the printed circuit board assembly; generating in-circuit-test signals to test the printed circuit board assembly; connecting only function-circuit-test connection pins among the test process connection pins with the printed circuit board assembly, and testing functions between the printed circuit board assembly and a head disk assembly; and displaying results of testing the printed circuit board assembly and the functions.
  • the present invention provides an apparatus testing performance of a printed circuit board, said apparatus comprising: a base being located at a lower surface of said apparatus; a test unit having a head disk assembly and being operationally coupled to said apparatus; a first plate being supported by first guide rods installed at said base, being movable along a first path of conveyance toward and away from said base, and having a plurality of disk connector pins operationally coupled with the head disk assembly; a pin board being installed at said base, being disposed between said base and said first plate, having a first plurality of connection pins projecting a first distance toward said first plate, and having a second plurality of connection pins projecting a second distance toward said first plate, said first distance being different from said second distance; a masking board being movably coupled to said pin board, being movable toward and away from said pin board, and being disposed between said pin board and said first plate, said masking board receiving a printed
  • the present invention provides an apparatus testing a printed circuit board, said apparatus comprising: a pin board having a first plurality of test process connection pins projecting to a first height above said pin board, and having a second plurality of test process connection pins projecting to a second height taller than said first height above said pin board, said pin board being mounted to an upper surface of a base of said apparatus; a masking board having an upper surface receiving a printed circuit board assembly for tests, and having a lower surface disposed toward said pin board, said masking board forming a plurality of apertures, said masking board being movably coupled to said pin board, said first and second plurality of test process connection pins selectively connecting to the printed circuit board assembly through the plurality of apertures formed in said masking board when said masking board is pressed down toward said pin board, the printed circuit board assembly having power input pins receiving power and signal interface pins receiving and outputting signals; a first frame being
  • the present invention provides an apparatus for testing performance of a printed circuit board, said apparatus comprising: a pin board having a first plurality of test process connection pins projecting to a first height above said pin board, and having a second plurality of test process connection pins projecting to a second height taller than said first height above said pin board, said pin board being mounted to an upper surface of a base of said apparatus; a masking board having an upper surface receiving a printed circuit board assembly for tests, and having a lower surface disposed toward said pin board, said masking board forming a plurality of apertures, said masking board being movably coupled to said pin board, said first and second plurality of test process connection pins selectively connecting to the printed circuit board assembly through the plurality of apertures formed in said masking board when said masking board is pressed down toward said pin board, the printed circuit board assembly having power input pins receiving power and signal interface pins receiving and outputting signals; a pin board having a first plurality of test process connection pins projecting to a first height above said pin
  • the present invention provides an apparatus testing a printed circuit board, said apparatus comprising: a pin board having a first plurality of test process connection pins projecting to a first height above said pin board, and having a second plurality of test process connection pins projecting to a second height taller than said first height above said pin board, said pin board being mounted to an upper surface of a base of said apparatus; a masking board having an upper surface receiving a printed circuit board assembly for tests, and having a lower surface disposed toward said pin board, said masking board forming a plurality of apertures, said masking board being movably coupled to said pin board, said first and second plurality of test process connection pins selectively connecting to the printed circuit board assembly through the plurality of apertures formed in said masking board when said masking board is pressed down toward said pin board; and springs supporting said lower surface of said masking board and absorbing shock generated when said masking board is pressed down to connect
  • FIG. 1 illustrates the concept of a unified test process, according to the principles of the present invention
  • FIG. 2 is a perspective view of the unified test system, according to the principles of the present invention.
  • FIG. 3 is a front view of the unified test system, according to the principles of the present invention.
  • FIG. 4 is a side view of the unified test system, according to the principles of the present invention.
  • FIG. 5 is rear view of the unified test system, according to the principles of the present invention.
  • FIG. 6 is a perspective view of a masking board loaded onto a pin board of the unified test system, according to the principles of the present invention
  • FIG. 7 is a perspective view illustrating a printed circuit board assembly loaded onto the masking board shown in FIG. 6, according to the principles of the present invention
  • FIG. 8 is a block diagram of a peripheral circuit of the unified test system, according to the principles of the present invention.
  • FIG. 9 is a flow chart illustrating a unified test process, according to the principles of the present invention.
  • FIGS. 10A, 10 B, 10 C and 10 D are exemplary diagrams illustrating the driving states of the unified test system during the execution of the unified test process, according to the principles of the present invention.
  • an in-circuit testing (ICT) process and a function circuit testing (FCT) process which have separately been implemented by hard disk drive manufacturers are unified as a unified test (UT) process using a unified test system (UTS) according to the present invention.
  • a first 8 air cylinder 20 is positioned at the center of the upper part of a first plate-type frame 10 supported by first guide rods g 1 .
  • a second air cylinder 22 is positioned at the center of the upper part of a second plate-type frame 12 which moves up and down as indicated by an arrow (1) along the first guide rods g 1 by the driving of the first air cylinder 20 .
  • a third plate-type frame 14 moves up and down along the first guide rods g 1 by the driving of the second air cylinder 22 .
  • the first frame 10 is supported by the first guide rods g 1 installed upright at the four corners of a pin board 4 mounted on a main frame 2 .
  • the main frame 2 can also be referred to as a base 2 .
  • the second, third and fourth frames 12 , 14 and 16 move up and down by driving of the first and second air cylinders 20 and 22
  • the fifth frame 18 moves back and forth along the second guide rods g 2 by driving of the third air cylinder 24 . That is, the first, second and third air cylinders 20 , 22 and 24 shift the second, third, fourth and fifth frames 12 , 14 , 16 and 18 by the air pressure of their air hoses.
  • the air pressure is manually controlled by air valves 20 a and 22 a fixed to each air cylinder.
  • a pair of solenoid valves 21 for controlling the amount of air flowing into the cylinder or flowing therefrom is installed at one side of the first air cylinder 20 by a number corresponding to the number of the air cylinders. That is, the pair of solenoid valves designates an air inflow solenoid value and an air outflow solenoid value necessary for the driving of each air cylinder.
  • the solenoid valves 21 are turned ON or OFF by a controller ( 44 shown in FIG. 8) which will be described later on.
  • a masking board 6 is loaded onto the pin board 4 .
  • printed circuit board assemblies are loaded onto the upper part of the masking board 6 as shown in FIG. 7.
  • a plurality of connection pins 4 a and 4 b are situated at the center of the upper part of the pin board 4 as illustrated in FIGS. 3, 4 and 5 .
  • cylinders 16 b are installed at the right and left sides of the masking board 6 .
  • a plurality of holes are formed on the masking board 6 so that the connection pins 4 a and 4 b positioned on the pin board 4 can pass through holes formed on the printed circuit board assemblies through them.
  • connection pins 4 a and 4 b are different in height as illustrated in FIGS. 3, 4 and 5 , to perform both the in-circuit testing process and the function circuit testing process using the unified test system.
  • the connection pins having lower height will be referred to as the in-circuit testing process connection pin 4 a
  • the other connection pins the function circuit testing process connection pin 4 b Compression coil springs S are installed on the pin board 4 as indicated in FIG. 4 to absorb shock generated when connection pins 17 and 34 a formed at the lower part of the fourth frame 16 are connected with pin connectors or the cylinders 16 b installed on the pin board 4 while the fourth frame 16 moves downward.
  • the compression coil springs S differ in diameters of their both ends. As illustrated in FIG.
  • the upper short pins 34 a are installed at the lower part of the fourth frame 16 .
  • Lower short pins 34 b (not shown) are installed at a position connected with the upper short pins 34 a when the fourth frame 16 moves downward.
  • the upper and lower short pins 34 a and 34 b are connected with each other when the connection pins 4 a and 4 b installed on the pin board 4 pass through the holes formed on the masking board 6 and the printed circuit board assembly while the fourth frame 16 moves downward.
  • the controller 44 shown in FIG. 8 senses that the fourth frame 16 moves downward by a prescribed height when the upper and lower short pins 34 a and 34 b are connected with each other.
  • the first air cylinder 20 with the air valves 20 a is installed at the center of the upper part of the first frame 10 .
  • Three pairs of solenoid valves 21 are installed at one side of the first air cylinder 20 .
  • the known air valves 20 a and 22 a are used for manually controlling the air pressure supplied to the first and second air cylinders 20 and 22 , respectively.
  • the solenoid valves 21 are turned ON or OFF by the controller 44 for controlling the overall operation of the unified test system. Therefore, the second frame 12 moves downward by the first air cylinder 20 driven by the air pressure, and the third and fourth frames 14 and 16 also move downward by the driving of the second air cylinder 22 .
  • the pins 17 and 34 a formed at its lower part can be connected with pin connectors of the printed circuit board assemblies loaded onto the masking board 6 and the pins 34 b formed on the pin board 4 .
  • the fifth frame 18 installed between the third and fourth frames 14 and 16 moves back and forth as indicated by the arrow (2) along the second guide rods g 2 by the driving of the third air cylinder 24 .
  • Two head disk assemblies (HDAs) are mounted on the fifth frame 18 as illustrated in FIG. 3 .
  • Flexible printed circuit boards (PCBs) 35 connected with spindle motors of the head disk assemblies are electrically connected with spindle motor driving pins 17 as shown in FIG. 5 .
  • a 4 -pin connector 30 which is a power input connector and a 40 -pin connector 32 which is a signal interface connector are situated at the both sides of the lower part of the fourth frame 16 as shown in FIG. 2 .
  • the connectors 30 and 32 move together with the fifth frame 18 . If the third air cylinder 24 is driven after the second, third and fourth frames 12 , 14 and 16 have moved downward by the driving of the first and second air cylinders 20 and 22 , the 4 -pin connector 30 and the 40 -pin connector 32 can respectively be connected with 4 pins and 40 pins of the printed circuit board assembly loaded onto the masking board 6 since the fifth frame move backward.
  • holes 6 a keep the position of the masking board 6
  • holes 6 b cause the connection pins 4 a and 4 b to pass through holes 6 b
  • Guides 6 c are fixed to the both sides of the holes 6 b to accurately load the printed circuit board assembly onto the masking board 6 . Hence, the worker can insert the printed circuit board assembly into the slits of the guides 6 c.
  • FIG. 8 A block diagram of a peripheral circuit of the unified test system is illustrated in FIG. 8 .
  • An air supply source 40 supplies air of given pressure through an air hose 42 .
  • the air hose 42 is connected with an air cylinder 20 through a solenoid valve 21 .
  • the air cylinder 20 designates all the first, second and third air cylinders described previously.
  • the solenoid valve 21 is turned ON or OFF by an ON/OFF control signal given from the controller 44 . Therefore, the air cylinder 20 is driven up and down or back and forth by the air pressure flowing thereinto or flowing therefrom when the solenoid valve 21 is turned ON or OFF.
  • the controller 44 includes a memory consisting of a read only memory (ROM) in which a control program for controlling the operation of the unified test system is stored and a random access memory (RAM) for temporarily storing data generated during control operation.
  • the controller 44 generates test signals for testing the performance of the printed circuit board assembly 50 on the basis of the control program stored in the memory and receives response signals for the test signals.
  • a monitor 46 displays data for the response signals given from the controller 44 . Then the worker can decide whether the printed circuit board assembly 50 is passed or not by the result values displayed on the monitor 46 .
  • the controller 44 checks at step 64 whether the short pins 34 a and 34 b have been connected with each other by examining a logic level value of a short pin connection signal received when they are connected with each other.
  • the controller 44 stops driving the first and second air cylinders 20 and 22 and turns ON a third air inflow solenoid valve at step 66 . Then s air flows into the third air cylinder 24 and the fifth frame 18 moves in the direction of an arrow (3) along the second guide rods g 2 as illustrated in FIG. 10 B. If the fifth frame 18 is shifted, the 4 pins and 40 pins of the printed circuit board assembly 50 are respectively connected with the 4-pin connector 30 and the 40-pin connector 32 mounted at the lower part of the fifth frame 18 .
  • the connector 30 is used for providing power.
  • the controller 44 checks at step 68 whether the 4-pin connector 30 and the 40-pin connector 32 have been connected by checking response signals for signals inputted through the connectors 30 and 32 . If they have been connected, the controller 44 turns OFF the third air inflow solenoid valve to stop driving the third air cylinder 24 .
  • the controller 44 turns ON a second air outflow solenoid valve at step 74 . Then the third and fourth frames 14 and 16 move upward by the driving of the second air cylinder 22 , and the in-circuit testing process connection pins 4 a are separated from the masking board 6 as shown in FIG. 10 C. Namely, only the function circuit testing process connection pins 4 b are connected with the printed circuit board assembly 50 .
  • the controller 44 turns ON a third air outflow solenoid valve at step 82 . Then the third air cylinder 24 is driven and the fifth frame 18 moves backward along the second guide rods g 2 . As a result, the 40 pins are disconnected from the 40-pin connector 32 .
  • the controller 44 turns ON a first air outflow solenoid valve at step 84 to drive the first air cylinder 20 .
  • the second, third and fourth frames 12 , 14 and 16 move upward, that is, they are shifted to the original position.
  • the results of the tests are displayed on monitor 46 (shown in FIG. 8 ).
  • the worker can know the result of testing the performance of the printed circuit board assembly 50 by checking the results of the in-circuit testing process and the function circuit testing process through the monitor 46 . It is judged whether each printed circuit board assembly is passed or not according to the test result. The worker loads the printed circuit board assembly which is in standby onto the masking board 6 and again operates the unified test system. Consequently, the in-circuit testing process and the function circuit testing process can rapidly be performed by one unified process.
  • the monitor 46 shown in FIG. 8 can be a cathode ray tube, a liquid crystal display, a gas-plasma display, a light emitting diode display, an electro-luminescent display, a field emission display, or other type of display device.
  • the frames 12 , 14 , 16 , and 18 may be shifted by using one or more oil pressure cylinders instead of using air cylinders 20 , 22 , and 24 .
  • the frames 12 , 14 , 16 , and 18 may be shifted by using one or more electric motors with gears instead of using air cylinders 20 , 22 , and 24 .
  • the two air cylinders 20 and 22 for shifting the frames up and down may use one driving cylinder instead of using two cylinders. All of the aforementioned air cylinders, oil pressure cylinders, and electric motors can be considered transportation control units.
US09/417,060 1998-10-13 1999-10-13 Unified test system and method for testing printed circuit boards Expired - Lifetime US6259265B1 (en)

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KR1019980042751A KR100295228B1 (ko) 1998-10-13 1998-10-13 통합테스트시스템과그를이용한통합테스트공정수행방법
KR98-42751 1998-10-13

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US (1) US6259265B1 (ko)
JP (1) JP3182412B2 (ko)
KR (1) KR100295228B1 (ko)
CN (1) CN1138152C (ko)
DE (1) DE19941110B4 (ko)
GB (1) GB2342793B (ko)

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US10914791B2 (en) 2016-08-01 2021-02-09 Endress+Hauser Flowtec Ag Test system for testing electrical connections between components and a printed circuit board
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CN1251425A (zh) 2000-04-26
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KR100295228B1 (ko) 2001-07-12
GB9924193D0 (en) 1999-12-15
GB2342793B (en) 2001-01-03
DE19941110A1 (de) 2000-05-04
DE19941110B4 (de) 2006-07-06
JP3182412B2 (ja) 2001-07-03

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